CN110764310B

CN110764310B - Curved surface backlight unit and curved surface display device

Info

Publication number: CN110764310B
Application number: CN201911056166.4A
Authority: CN
Inventors: 王小萍
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2022-03-08
Anticipated expiration: 2039-10-31
Also published as: CN110764310A

Abstract

The invention discloses a curved surface backlight module and a curved surface display device, wherein the curved surface backlight module comprises a lamp panel, the lamp panel comprises a circuit board and a plurality of light emitting diodes welded on the circuit board, each light emitting diode comprises a bracket and two welding feet fixed on one side of the bracket, which faces the circuit board, namely the welding feet are positioned between the bracket and the circuit board, and the orthographic projection of the two welding feet, which faces the circuit board, is positioned in the orthographic projection of the bracket, which faces the circuit board. The circuit board is arranged in a bending mode, the larger the curvature of the circuit board area fixed by the light-emitting diode is, the smaller the distance between the two welding feet of the corresponding light-emitting diode is. The intensity of the lamp panel of the curved surface backlight module is improved, the condition that the curved surface backlight module is shaded is reduced, the condition that the light emitting diode inclines along with the bending of the lamp panel can be reduced, and the problem that the brightness of the curved surface backlight module is uneven is solved.

Description

Curved surface backlight unit and curved surface display device

Technical Field

The invention relates to the technical field of display, in particular to a curved surface backlight module and a curved surface display device.

Background

Along with the development of vehicle-mounted display technology year by year, people are more and more demanding on display equipment in the car, wherein, have higher requirements for the visual effect of display equipment, in order to reach better visual effect with structures such as well accuse, handrail, side door in the car combination, curved surface display panel is more and more used in the vehicle-mounted display field to make vehicle-mounted display equipment's scientific and technological sense be sufficient, give other people and bring better visual experience.

At present, for a liquid crystal curved display panel, the liquid crystal display panel is generally bent directly through stress, so that the curved effect is achieved. However, when the lcd panel is bent, the backlight module is also in a bent state, the stress at the position where the bending curvature of the backlight module is larger, and the lamp panel is easily deformed due to the overlarge stress, so that the light emitting diode of the lamp panel is separated from the circuit board, and the problem of displaying shadows is caused. In addition, when the lamp plate takes place to warp, still can lead to emitting diode's relative position to change, the uneven problem of luminance appears easily.

Disclosure of Invention

The embodiment of the invention aims to provide a surface backlight module and a curved surface display device, which are used for improving the strength of a lamp panel of the curved surface backlight module, reducing the condition that the curved surface backlight module has dark shadows, reducing the condition that a light-emitting diode inclines along with the bending of the lamp panel and improving the problem of uneven brightness of the curved surface backlight module.

In a first aspect, the backlight module provided in the embodiments of the present invention includes a lamp panel, where the lamp panel includes a circuit board and a plurality of light emitting diodes soldered to the circuit board, each light emitting diode includes a bracket and two solder legs fixed to one side of the bracket facing the circuit board, and an orthogonal projection of the two solder legs facing the circuit board is located in an orthogonal projection of the bracket facing the circuit board;

the circuit board is arranged in a bending mode, the larger the curvature of a circuit board area fixed by the light-emitting diode is, the smaller the distance between two welding feet of the light-emitting diode is.

In a specific technical scheme, the two solder feet of the light emitting diode, which are arranged in the region with the same curvature of the circuit board, have the same distance.

In a specific technical scheme, the light emitting diode matrix is arranged on the circuit board, the curvature of the curved lamp panel is gradually changed along the row direction of the light emitting diodes, and the column direction of the light emitting diodes is unchanged.

In a specific technical solution, a distance W between the two solder legs of the light emitting diode and a width L of the same light emitting diode satisfy: w is less than or equal to 1/2L, wherein the width L is the width of the LED along the direction from one of the two welding feet to the other welding foot.

In a specific technical solution, a distance W between the two solder feet of the light emitting diode satisfies: w is more than or equal to 0.66mm and less than or equal to 0.86 mm.

In a specific technical solution, the cross section of the bracket of the light emitting diode parallel to the light emitting surface is gradually reduced from the light emitting surface toward the solder tail.

In a specific technical scheme, the support comprises a frustum support, a circular truncated cone support or a boat-shaped support.

In a specific technical scheme, a solder is arranged between the support and the circuit board, the support is provided with a top wall provided with a light-emitting surface, a bottom wall provided with solder feet and a side wall connecting the top wall and the bottom wall, and the solder extends from the bottom wall to the side wall.

In a specific technical scheme, the curved surface backlight module further comprises a curved surface light guide plate superposed with the curved surface lamp plate, and the light emergent surface of the light guide plate is parallel to the light emergent surface of the lamp plate.

In a second aspect, an embodiment of the present application further provides a curved surface display device, where the curved surface display device includes a curved surface backlight module in any one of the above technical solutions.

In this scheme, the size that emitting diode and circuit board are connected is less, span between two fillets of emitting diode is less, then the stress difference between two fillets is less, be difficult for breaking away from between the fillet that makes emitting diode and the circuit board, can reduce the influence that the lamp plate warp to emitting diode's position, reduce the probability of emitting diode and circuit board separation, with the condition that the shadow appears in reduction curved surface backlight unit, can also reduce the condition that emitting diode inclines along with the lamp plate is crooked, improve the uneven problem of luminance.

Drawings

Fig. 1 is a schematic structural diagram of a curved backlight module according to an embodiment of the invention;

FIG. 2 is a schematic cross-sectional view of a curved backlight module according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view of a curved backlight module according to another embodiment of the present invention;

FIG. 4 is a schematic side view of a curved backlight module according to another embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of a lamp panel according to an embodiment of the invention;

fig. 6 is a schematic top view of the lamp panel according to an embodiment of the invention;

fig. 7 is a schematic structural diagram of an organic light emitting diode according to an embodiment of the invention;

FIG. 8 is a schematic structural diagram of an OLED according to another embodiment of the present invention;

fig. 9 is a schematic structural diagram of an organic light emitting diode according to another embodiment of the invention;

FIG. 10 is a schematic view of a bonding structure of an OLED according to an embodiment of the present invention;

fig. 11 is a curved display device according to an embodiment of the present application.

Reference numerals:

1-a back plate;

2-a lamp panel;

21-a circuit board;

22-a light emitting diode;

221-a scaffold;

2211-first outer wall;

2212-a second outer wall;

2213-bottom wall;

2214-top wall;

2215-sidewalls;

222-a solder tail;

2221-first solder tail;

2222-second solder tail;

3-a light guide plate;

4-solder.

Detailed Description

The curved surface backlight module has the advantages that the intensity of the lamp panel of the curved surface backlight module is improved, the condition that the curved surface backlight module has dark shadows is reduced, the condition that the light emitting diodes incline along with the bending of the lamp panel can be reduced, and the problem that the brightness of the curved surface backlight module is uneven is solved. The embodiment of the invention provides a curved surface backlight module and a curved surface display device. In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail by referring to the following examples.

The curved surface backlight module that this application embodiment provided can be applied to various curved surface display device that need carry out the curved surface and show, for example, on-vehicle display device's display screen. At present, the bending radius of a display screen of a vehicle-mounted curved display device is approximately between 700mm and 1000mm, the curved display device may include a touch panel, and the touch panel may be bent in a hot-pressing manner to meet the requirements of the display device; the backlight module is molded by adopting a model and manufactured into a curved backlight module so as to form the curved surface display device, so that the viewing angle of a user in use is enlarged, and the convenience of the user in using the curved surface display device is improved. In the prior art, when a curved-surface display device is assembled, bending stress may exist between layers, and the stress increases with the increase of the bending curvature of the curved-surface display device, and due to the existence of the stress, many problems are caused, for example, peeling occurs between each structural layer, typically between a lamp panel and a back panel, and on one hand, a mixed light distance between organic light emitting diodes of the lamp panel changes, and a problem of uneven display brightness (mura) occurs; in addition, the organic light emitting diode is easily separated from the circuit board, so that the light emitting diode cannot normally display. In order to solve the problem, the application provides a curved surface backlight module and a curved surface display device.

The embodiments of the present application will be described in detail below with reference to the accompanying drawings. The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of this application and the appended claims, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, such as "one or more", unless the context clearly indicates otherwise.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

As shown in fig. 1 and fig. 2, fig. 1 shows a schematic structural diagram of a curved backlight module in the embodiment of the present application, and fig. 2 shows a schematic cross-sectional diagram of the curved backlight module in the embodiment of the present application, which may be specifically a schematic cross-sectional diagram at M in fig. 1; the curved backlight module provided by the embodiment of the invention comprises a lamp panel 2, wherein the lamp panel 2 comprises a circuit board 21 and a plurality of light emitting diodes 22 welded on the circuit board 21, each light emitting diode 22 comprises a bracket 221 and two welding pins 222 fixed on one side of the bracket 221 facing the circuit board 21, namely the welding pins 222 are positioned between the bracket 221 and the circuit board 21, and the orthographic projections of the two welding pins 222 facing the circuit board 21 are positioned in the orthographic projections of the bracket 221 facing the circuit board 21; as shown in fig. 1 and 2, the circuit board 21 is curved, and the larger the curvature of the area of the circuit board 21 where the light emitting diode 22 is fixed, the smaller the pitch between the two solder tails 222 of the light emitting diode 22. Specifically, the curvature of the region of the circuit board 21 to which the light emitting diode 22 is fixed refers to the inverse of the bending radius of the region of the circuit board 21 corresponding to the region to which the light emitting diode 22 is mounted, and the larger the curvature of the region, the smaller the bending radius and the higher the degree of bending.

The curved backlight module illustrated in fig. 1 includes: two curved first edges L1, two second edges L2 extending in a straight direction, and a center line L3 located between the two second edges L2. The two first edges L1 may be disposed opposite to each other, and may be parallel or non-parallel to each other, and the two edges L2 may be disposed opposite to each other, and may be parallel or non-parallel to each other. In this embodiment, it can be considered that the degree of curvature of the curved backlight module is symmetrical about the center line L3, and the curvature of the curved backlight module gradually increases in a direction away from the center line L3. Fig. 2 is a schematic cross-sectional view illustrating the curved backlight module in the embodiment of fig. 1, where the curved backlight module is curved around a curved axis T, where the curved axis T is understood as a curved axis that is formed by bending the structures such as the back plate 1, the lamp panel 2, or the light guide plate 3 toward the curved axis in an actual process, and a circular black dot T in fig. 2 represents the curved axis T extending in a direction perpendicular to the paper surface. It should be noted that the bending axis T is used to describe the bending direction of the curved backlight module, and it cannot be said that the curved backlight module is located on the cylindrical surface with the bending axis as the axis.

In the embodiment shown in fig. 1, the curvature of the circuit board 21 gradually increases from the center line L3 in the direction S1 (e.g., the center line L3 points to the second edge L2 in fig. 1), and the bending degree thereof also gradually increases, and the distance between the two solder tails 222 of the bracket 221 of the led 22 at the corresponding position gradually decreases to adapt to the bending of the circuit board 21. Similarly, when the circuit board 21 has a gradually increasing curvature from the center line L3 in the direction S2 (opposite to the direction S1), and the bending degree thereof is gradually increased, the distance W between the two solder tails 222 of the bracket 221 of the led 22 at the corresponding position is gradually decreased to adapt to the bending of the circuit board 21. In this scheme, when the curved display device is assembled, there may be bending stress between each layer, and this stress increases with the increase of the bending curvature of the curved display device, and due to the existence of the above stress, many problems are caused, for example, peeling occurs between each structural layer, and typically peeling occurs between the lamp panel 2 and the back panel 1. The size of the connection between the light emitting diode 22 and the circuit board 21 is small, the span between the two solder legs 222 of the light emitting diode 22 is small, the stress difference between the two solder legs 222 is small, the solder legs 222 of the light emitting diode 22 are not easy to separate from the circuit board 21, the influence of the deformation of the lamp panel 2 on the position of the light emitting diode 22 can be reduced, the probability of the separation of the light emitting diode 22 and the circuit board 21 is reduced, the condition that the curved surface backlight module has dark shadows is reduced, the condition that the light emitting diode 22 inclines along with the bending of the lamp panel 2 can be reduced, and the problem of uneven brightness is solved.

As shown in fig. 3, a partial schematic view of the lamp panel 2 of the curved backlight module is shown extending from the center line L3 of fig. 3 along the S2 direction, wherein the radius R of the circuit board 21 in the area where the light emitting diode 22 is located is R1, R2, and R3 … … Rn from the center line L3 along the S2 direction, and R1 > R2 > R3 > … … > Rn, that is, the radius R of the circuit board 21 in the area where the light emitting diode 22 is located gradually decreases from the center line L3 along the S2 direction, and the corresponding curvature gradually increases. The distances W between the two solder tails 222 of the bracket 221 of the led 22 are W1, W2, and W3 … … Wn respectively from the center line L3 in the S2 direction, and W1 > W2 > W3 > … … > Wn.

In the above embodiment, the curved backlight module is bent around a bending axis, and in practical applications, any form of curved backlight module can use the technical solution of the present application, as shown in fig. 4, the curved backlight module is a wave-shaped curved backlight module, and the distance between the two solder legs 222 of the bracket 221 of the led 22 is set according to the bending curvature of each region. Alternatively, in other embodiments, the curved backlight module may be an irregularly curved backlight module.

Different regions of the circuit board 21 have corresponding curvatures, some regions having the same curvature. When the light emitting diode 22 is specifically arranged, the two solder tails 222 of the light emitting diode 22 arranged in the area of the circuit board 21 with the same curvature have the same pitch, thereby facilitating the design and installation of the light emitting diode 22.

Taking the embodiment shown in fig. 1 and 2 as an example, it can be considered that the degree of curvature of the curved backlight module in this embodiment is symmetrical about the center line L3, and then, along the extending direction of the first edge L1, the curvature of the circuit board 21 of the lamp panel 2 is symmetrical about the center line L3, and then the pitches of the two solder feet 222 of the bracket 221 of the led 22 located at symmetrical positions are the same, as shown in fig. 5, the distances W between the two solder feet 222 of the bracket 221 of the led 22 are W1, W2, W3 … … Wn respectively from the center line L3 along the S2 direction, and W1 > W2 > W3 > … … > Wn; starting from a center line L3, W1 ', W2 ', W3 ' … … Wn ' are respectively arranged along the S1 direction, and W1 ' > W2 ' > W3 ' > … … > Wn ', wherein W1 is equal to W1 ', W2 is equal to W2 ' … … Wn is equal to Wn ', and the design concept of the light emitting diode 22 of the lamp panel 2 and the installation process of the light emitting diode 22 can be simplified.

Referring to fig. 6, a schematic structural diagram of a curved backlight module in an embodiment of the present application is shown, where the curved backlight module is a direct-type backlight module, and fig. 6 shows the distribution of the light emitting diodes 22 in the scheme; in this embodiment, the light emitting diodes 22 are arranged on the circuit board 21 in a matrix manner, and the curvature of the lamp panel 2 gradually changes along the row direction of the light emitting diodes 22 and does not change along the column direction of the light emitting diodes 22. The row direction of the leds 22 of the lamp panel 2 is parallel to the first edge L1 of the curved backlight module, and the column direction is parallel to the second edge L2 of the curved backlight module. In this scheme, lamp plate 2 is along the camber of row direction unchangeable, then can make on the lamp plate 2 along the interval the same of two fillets 222 of the emitting diode 22 that the row set up, be convenient for set up emitting diode 22.

Referring to fig. 7, which shows a schematic structural diagram of an led 22 in an embodiment of the present application, when the solder leg 222 of the led 22 is specifically disposed, the led 22 includes a support 221 and two solder legs 222, and a width L of the support 221 of the led 22 along a direction from one solder leg 222 to the other solder leg 222 of the two solder legs 222 of the led 22 may make a distance W between the two solder legs 222 of the led 22 and the width L of the support 221 of the led 22 satisfy: w ≦ 1/2L, for example, the distance W between the two solder tails 222 of the LED 22 may be: 1/3L, 1/4L, 2/5L, 1/6L and the like, which are not specifically listed here. It should be noted that the distance W between the two solder tails 222 of the led 22 refers to the distance between the centers of the two solder tails 222, please refer to fig. 7. In this embodiment, the distance W between the two solder tails 222 is smaller than half of the width of the bracket 221, and the distance between the two solder tails 222 is smaller, so that when the circuit board 21 in the corresponding region is bent, the difference between the curvatures of the two solder tails 222 is smaller, the led 22 is not easily separated from the circuit board 21, and the orientation of the light emitting surface of the led 22 can be reduced.

With continued reference to fig. 7, in a specific technical solution, two solder legs 222 are located in the middle of the led 22 support 221, the two solder legs 222 include a first solder leg 2221 and a second solder leg 2222, and the outer sidewall of the led 22 support 221 includes two opposite outer walls arranged along the direction from the first solder leg 2221 to the second solder leg 2222, namely a first outer wall 2211 and a second outer wall 2212. The distance between first leg 2221 and first outer wall 2211 is the same as the distance between second leg 2222 and second outer wall 2212. In this embodiment, the middle of the led 22 is connected to the circuit board 21 to improve the stability of the led 22 fixed on the circuit board 21, and the two sides are symmetrically disposed, and the led 22 is not easy to deflect.

In the prior art, the distance W between two solder tails 222 of the led 22 is usually set to be 1.0mm or more and 1.6mm or less, the distance between two solder tails 222 is relatively large, and the curvature difference between two solder tails 222 may be relatively large, so that the led 22 is easily warped and separated from the circuit board 21 or the light-emitting surface is inclined. When the technical scheme of the application is implemented, the distance W between the two welding feet 222 of the light-emitting diode 22 can be satisfied, and W is more than or equal to 0.66mm and less than or equal to 0.86 mm. In this embodiment, the spacing W between the two solder tails 222 of the led 22 may be 0.68mm, 0.70mm, 0.73mm, 0.75mm, 0.78mm, 0.80mm, 0.82mm, or 0.85 mm. When the technical scheme of the application is implemented, when the distance between the two welding pins 222 of the light emitting diode 22 is smaller than 0.66mm, the difficulty of the manufacturing process of the light emitting diode is increased, and the short circuit risk is easy to occur when the light emitting diode 22 is welded with the circuit board 21; when the distance between the two solder tails 222 of the led 22 is greater than 0.86mm, the solder structure between the led 22 and the circuit board 21 is easily affected by stress, which results in disconnection between the led 22 and the circuit board 21 or changes in the light mixing distance of the led 22. In general, when the distance between the two solder tails 222 of the led 22 satisfies the above requirement, the distance between the two solder tails 222 is small, which not only reduces the influence of the bending of the circuit board 21 on the led 22, but also ensures that the led 22 is reliably connected to the circuit board 21.

When the structure of the bracket 221 of the led 22 is specifically disposed, the shape of the bracket 221 is not particularly limited, for example, as shown in fig. 7, the bracket 221 of the led 22 may be a more traditional cubic structure, or may be other structures, as shown in fig. 8, the dimension of the bracket 221 of the led 22 near the solder 222 is smaller than the dimension of the bracket 221 near the light-emitting surface, and specifically, the cross section of the bracket 221 of the led 22 parallel to the light-emitting surface may be gradually reduced from the light-emitting surface toward the solder 222. In this embodiment, the size of the led 22 bracket 221 near the circuit board 21 is smaller, and when the circuit board 21 is bent, the bent circuit board 21 has less influence on the led 22 bracket 221, and the adjacent led 22 brackets 221 are not easily interfered with each other.

Referring to fig. 8, the support 221 of the led 22 is shown as a frustum of a prism support 221, and a cross section of the frustum of a prism support 221 parallel to the light exit surface may be a polygon; alternatively, the support 221 of the led 22 may be a circular truncated cone support 221, and a cross section of the circular truncated cone support 221 parallel to the light exit surface may be circular or elliptical; referring to fig. 9, a cross-section of the boat-shaped support 221 parallel to the light emitting surface may be a quadrilateral, but the outer sidewall of the boat-shaped support 221 may include an outer sidewall connected between a top wall 2214 and a bottom wall 2213, the outer sidewall includes two first sets of sidewalls oppositely disposed, the first set of sidewalls is a planar structure, the outer sidewall further includes two second sets of sidewalls connected between the first sets of sidewalls, the second sets of sidewalls is an arc-shaped structure, and the arc-shaped structure extends and bends along the bending direction of the circuit board 21. So that the dimension of the boat-shaped bracket 221 in the bending direction of the circuit board 21 gradually increases from the solder tails 222 to the light-emitting surface side. In this embodiment, among the dimensions of the led 22 holders 221 in the bending direction of the circuit board 21, the dimension of the side close to the circuit board 21 is smaller, and when the circuit board 21 is bent, the bent circuit board 21 has a smaller influence on the led 22 holders 221, and the adjacent led 22 holders 221 are less likely to have structural interference.

When the bracket 221 and the circuit board 21 are soldered, solder 4 is disposed between the bracket 221 and the circuit board 21, the bracket 221 has a top wall 2214 with a light exit surface and a bottom wall 2213 with solder tails 222, and a side wall 2215 connecting the top wall 2214 and the bottom wall 2213, so that the solder 4 extends from the bottom wall 2213 to the side wall 2215. In the prior art, the solder 4 between the bracket 221 of the led 22 and the circuit board 21 is located between the bottom wall 2213 of the bracket 221 and the circuit board 21, and the soldering strength is limited due to the limited thickness of the solder 4. Referring to fig. 10, a schematic diagram of a soldering structure of the light emitting diode 22 in the present application is shown, in the present application, the solder 4 between the light emitting diode 22 and the circuit board 21 extends from the bottom wall 2213 to the side wall 2215 of the bracket 221, the thickness is larger, and the amount of the solder 4 is larger, so that the soldering strength is larger, the strength of fixing the light emitting diode 22 to the circuit board 21 can be improved, and the light emitting diode 22 is not easily separated from the circuit board 21.

Referring to fig. 2, when the curved backlight module is specifically disposed, the curved backlight module is a direct-type backlight module, the curved backlight module further includes a light guide plate 3 stacked on the lamp panel 2, the light guide plate 3 is also of a curved structure, and the light-emitting surface of the light guide plate 3 is parallel to the light-emitting surface of the lamp panel 2. Specifically set up this application embodiment, can make crooked light guide plate 3 to and crooked backplate 1, set up lamp plate 2 between light guide plate 3 and backplate 1, receive pressure between them to form into crooked lamp plate 2. Or, the circuit board 21 of the lamp panel 2 can be made into a curved circuit board 21 to make the curved lamp panel 2, and the back plate 1, the lamp panel 2 and the light guide plate 3 are directly mounted in an overlapping manner to make the curved backlight module.

In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a curved surface display apparatus, including: the display device of the curved backlight module can be applied to any product or component with a display function, for example, a curved television, as shown in fig. 11, a display panel of the curved television can adopt the curved display panel provided by the embodiment of the present invention, and in addition, the display device can also be applied to products or devices such as a tablet computer, a display, a notebook computer, a digital photo frame, a navigator, and the like. Because the principle of solving the problems of the display device is similar to that of the curved surface backlight module, the implementation of the curved surface display device can refer to the implementation of the curved surface backlight module, and repeated parts are not described again.

In the technical scheme of the application, when the curved surface display device is assembled, bending stress possibly exists between layers, the stress is increased along with the increase of the bending curvature of the curved surface display device, and due to the existence of the stress, a plurality of problems are caused, such as stripping between each structural layer, and the stripping between the lamp panel and the backboard is typical. The distance between the two welding feet 222 of the light emitting diode 22 of the curved surface display device is related to the bending curvature of the curved surface backlight module, the distance between the two welding feet 222 of the light emitting diode 22 installed on the curved surface backlight module at the position with larger curvature is smaller, so that the span between the two welding feet 222 of the light emitting diode 22 is smaller, the stress difference between the two welding feet 222 is smaller, the separation between the welding feet 222 of the light emitting diode 22 and the circuit board 21 is not easy to cause, the influence of the deformation of the lamp panel 2 on the position of the light emitting diode 22 can be reduced, the probability of the separation of the light emitting diode 22 and the circuit board 21 is reduced, the condition that the curved surface backlight module has dark shadows is reduced, the condition that the light emitting diode 22 inclines along with the bending of the lamp panel 2 can be reduced, and the problem of uneven brightness is solved. The curved surface display device in the application has better display effect and service life.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. The curved surface backlight module is characterized by comprising a lamp panel, wherein the lamp panel comprises a circuit board and a plurality of light emitting diodes welded on the circuit board, each light emitting diode comprises a support and two welding feet fixed on one side of the support, facing the circuit board, and the orthographic projection of the two welding feet facing the circuit board is positioned in the orthographic projection of the support, facing the circuit board;

the circuit board is arranged in a bending mode, the welding pins are arranged along the curvature change direction of the circuit board, the larger the curvature of the circuit board area fixed by the light-emitting diode is, and the smaller the distance between the projections of the two welding pins of the light-emitting diode on the curved surface of the circuit board is.

2. The curved backlight module of claim 1, wherein the two solder tails of the leds disposed in the area of the circuit board with the same curvature have the same pitch.

3. The curved backlight module of claim 1, wherein the led matrix is disposed on the circuit board, and the curvature of the lamp panel gradually changes along the row direction of the leds and does not change along the column direction of the leds.

4. The curved backlight module as claimed in claim 1, wherein the distance W between the two solder tails of the led and the width L of the same led satisfy: w is less than or equal to 1/2L, wherein the width L is the width of the LED along the direction from one of the two welding feet to the other welding foot.

5. The curved backlight module of claim 1, wherein the spacing W between the two solder tails of the led satisfies: w is more than or equal to 0.66mm and less than or equal to 0.86 mm.

6. The curved backlight module as claimed in claim 1, wherein the LED holder is gradually reduced from the light-emitting surface toward the solder fillet in a cross section parallel to the light-emitting surface.

7. The curved backlight module of claim 6, wherein the support comprises a prism support, a circular truncated cone support or a boat support.

8. The curved backlight module as claimed in claim 1, wherein a solder is disposed between the frame and the circuit board, the frame has a top wall with a light emitting surface and a bottom wall with solder tails, and a side wall connecting the top wall and the bottom wall, and the solder extends from the bottom wall to the side wall.

9. The curved backlight module of claim 1, further comprising a curved light guide plate stacked with the lamp panel, wherein the light exit surface of the light guide plate is parallel to the light exit surface of the lamp panel.

10. A curved-surface display device, comprising the curved-surface backlight module according to any one of claims 1 to 9.