CN110762893A - Magnetic refrigeration and semiconductor refrigeration combined refrigeration system and air conditioner - Google Patents
Magnetic refrigeration and semiconductor refrigeration combined refrigeration system and air conditioner Download PDFInfo
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- CN110762893A CN110762893A CN201910975794.6A CN201910975794A CN110762893A CN 110762893 A CN110762893 A CN 110762893A CN 201910975794 A CN201910975794 A CN 201910975794A CN 110762893 A CN110762893 A CN 110762893A
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- heat exchanger
- semiconductor
- refrigeration
- end heat
- semiconductor refrigerating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
The invention discloses a combined refrigerating system of magnetic refrigeration and semiconductor refrigeration, which comprises a hydraulic cylinder, a hot end heat exchanger, a cold accumulator and a cold end heat exchanger, wherein the hot end heat exchanger comprises a first hot end heat exchanger and a second hot end heat exchanger, the cold accumulator comprises a first cold accumulator and a second cold accumulator, one end of the hydraulic cylinder is connected with the first hot end heat exchanger, the other end of the hydraulic cylinder is connected with the second hot end heat exchanger, the first hot end heat exchanger is connected with the first cold accumulator, the second hot end heat exchanger is connected with the second cold accumulator, the first cold accumulator and the second cold accumulator are both connected with the cold end heat exchanger, a first semiconductor refrigerating device is arranged between the first cold accumulator and the cold end heat exchanger, a second semiconductor refrigerating device is arranged between the second cold accumulator and the cold end heat exchanger, and a second semiconductor refrigerating device is arranged between the second semiconductor refrigerating device and the first hot end heat exchanger, And heat exchange loops are arranged between the first semiconductor refrigerating device and the second hot end for heat exchange.
Description
Technical Field
The invention relates to the technical field of magnetic refrigeration, in particular to a combined refrigeration system of magnetic refrigeration and semiconductor refrigeration and an air conditioner.
Background
The magnetic refrigeration technology is a solid state refrigeration mode based on the magnetocaloric effect, adopts environment-friendly media such as water and the like as heat transfer fluid, has the characteristics of zero GWP, zero ODP, intrinsic high efficiency, low noise, low vibration and the like, and has wider application prospect in the room temperature range compared with the low-temperature refrigeration field, such as the application in the fields of household refrigerators, air conditioners, medical health and public health care and the like. Therefore, in recent ten years, the research and development of the room temperature magnetic refrigeration technology are generally regarded by all countries in the world, and some achievements for raising the world's advice are obtained.
The existing refrigeration cycle comprises two processes that (1) a piston pushes liquid in a hydraulic cylinder to flow leftwards, fluid flows into a demagnetizing bed after flowing through a hot-end heat exchanger, the fluid flowing out of the demagnetizing bed flows into a cold-end heat exchanger and then flows into a magnetizing bed, and the fluid flows into the hot-end heat exchanger after being heated by the magnetizing bed and releases heat and then flows back to the piston; (2) the piston pushes the liquid in the hydraulic cylinder to flow rightwards, the fluid flows into the demagnetizing bed after flowing through the hot-end heat exchanger, the fluid flowing out of the demagnetizing bed flows into the cold-end heat exchanger, the fluid absorbs the heat of the cold-end heat exchanger and then flows into the magnetizing bed, and the fluid flows into the hot-end heat exchanger after being heated by the magnetizing bed and then flows back to the piston after releasing heat.
The heat exchange of the existing magnetic refrigeration prototype has two problems:
1) the heat of a hot end heat exchanger in the existing magnetic refrigeration prototype is generally discharged into the air, and is not fully utilized, so that the energy waste is caused;
2) the fluid at the inlet of the cold-end radiator has higher temperature, and the temperature difference between the fluid and the cold-end radiator is smaller, so that the refrigerating capacity is smaller.
Disclosure of Invention
The invention provides a combined refrigerating system of magnetic refrigeration and semiconductor refrigeration and an air conditioner aiming at the defects in the prior art, and solves the problem of energy waste caused by direct discharge of heat of a hot end heat exchanger in the existing magnetic refrigeration prototype to the air by arranging a semiconductor refrigerating device and arranging a heat exchange loop between the hot end heat exchanger and a semiconductor refrigerating sheet; the hot end of the semiconductor refrigerating device is cooled by water, so that heat released by the semiconductor refrigerating device can be transferred to the hot end heat exchanger, heat energy is fully utilized, and waste heat is utilized.
In order to realize the purpose, the invention provides the following technical scheme:
a combined refrigerating system of magnetic refrigeration and semiconductor refrigeration comprises a hydraulic cylinder, a hot end heat exchanger, a cold accumulator and a cold end heat exchanger, the hot end heat exchanger comprises a first hot end heat exchanger and a second hot end heat exchanger, the cold accumulator comprises a first cold accumulator and a second cold accumulator, one end of the hydraulic cylinder is connected with the first hot end heat exchanger, the other end of the hydraulic cylinder is connected with the second hot end heat exchanger, the first hot end heat exchanger is connected with the first cold accumulator, the second hot end heat exchanger is connected with the second cold accumulator, the first cold accumulator and the second cold accumulator are both connected with the cold end heat exchanger, a first semiconductor refrigerating device is arranged between the first cold accumulator and the cold end heat exchanger, and a second semiconductor refrigerating device is arranged between the second cold accumulator and the cold end heat exchanger, and heat exchange loops are arranged between the second semiconductor refrigerating device and the first hot end heat exchanger and between the first semiconductor refrigerating device and the second hot end heat exchanger.
Preferably, the first hot end heat exchanger and the second hot end heat exchanger are both electrically connected with a storage battery, and the storage battery is respectively and electrically connected with the first semiconductor refrigerating device and the second semiconductor refrigerating device.
Preferably, the heat exchange loop comprises a first loop and a second loop, the first loop is connected with the second semiconductor refrigeration device and the first hot end heat exchanger, and the second loop is connected with the first semiconductor refrigeration device and the second hot end heat exchanger.
Preferably, the first loop comprises a first water pumping pipe, a first water pump and a first water return pipe, a circulation loop is formed between the second semiconductor refrigeration device and the first heat exchanger through the first water pumping pipe and the first water return pipe respectively, and the first water pump is connected with the first water pumping pipe.
Preferably, the second loop comprises a second water pumping pipe, a second water pump and a second water return pipe, a circulation loop is formed between the first semiconductor refrigerating device and the second heat exchanger through the second water pumping pipe and the second water return pipe respectively, and the second water pump is connected with the second water pumping pipe.
Preferably, the first semiconductor refrigerating device comprises a first water tank, a first semiconductor refrigerating sheet and a second water tank, the first water tank is connected with the second water tank through the first semiconductor refrigerating sheet, and the first semiconductor refrigerating sheet is electrically connected with the storage battery.
Preferably, the second semiconductor refrigerating device comprises a third water tank, a second semiconductor refrigerating piece and a fourth water tank, the third water tank and the fourth water tank are connected through the second semiconductor refrigerating piece, and the second semiconductor refrigerating piece is electrically connected with the storage battery.
Preferably, the first semiconductor refrigerating device is connected with a first semiconductor thermoelectric generation piece, and the second semiconductor refrigerating device is connected with a second semiconductor thermoelectric generation piece.
Preferably, a first switch is arranged between the storage battery and the first semiconductor refrigeration device.
Preferably, a second switch is arranged between the storage battery and the second semiconductor refrigerating device.
Compared with the prior art, the invention has the beneficial effects that:
1. the semiconductor refrigerating device is arranged, and the heat exchange loop is arranged between the hot end heat exchanger and the semiconductor refrigerating sheet, so that the problem of energy waste caused by direct discharge of heat of the hot end heat exchanger in the conventional magnetic refrigerating prototype into the air is solved; the hot end of the semiconductor refrigerating device is cooled by water, so that heat released by the semiconductor refrigerating device can be transferred to the hot end heat exchanger, heat energy is fully utilized, and waste heat is utilized.
2. According to the invention, two independent heat exchange loops are added in the system, so that the refrigerating capacity of the semiconductor refrigerating device is increased, the heat absorbed by the hot-end heat exchanger is increased, the temperature difference is increased, and the electric energy output by the power generation sheet is also increased.
3. The hot end of the semiconductor refrigerating device adopts water cooling, which can greatly improve the refrigerating performance of the semiconductor refrigerating sheet and lower the temperature of fluid flowing into the cold end heat exchanger. In addition, the heat of the water tank in the semiconductor refrigerating device is transferred to the hot end heat exchange device, so that the heat absorption capacity of the hot end heat exchange device is increased, the electric energy generated by the semiconductor thermoelectric generation sheet is increased, and the electric energy stored in the storage battery is increased.
Drawings
FIG. 1 is a schematic view of the overall structure of the second embodiment;
FIG. 2 is a schematic structural diagram of a first semiconductor refrigeration device;
FIG. 3 is a schematic structural view of a second semiconductor refrigeration unit;
fig. 4 is a schematic overall structure diagram of the first embodiment.
In the figure: 1-a hydraulic cylinder; 2-a first hot side heat exchanger; 3-a first regenerator; 4-a first semiconductor refrigeration device; 401-a first water tank; 402-a first semiconductor chilling plate; 403-a second water tank; 5-cold end heat exchanger; 6-a second semiconductor refrigeration device; 601-a third water tank; 602-a second semiconductor chilling plate; 603-a fourth water tank; 7-a second regenerator; 8-a second hot side heat exchanger; 9-a storage battery; 10-a first switch; 11-a second switch; 12-a first suction pipe; 13-a first water pump; 14-a first return pipe; 15-a second water return pipe; 16-a second pumping pipe; 17-second water pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the first embodiment, the first step is,
as shown in fig. 2-4, a combined refrigeration system of magnetic refrigeration and semiconductor refrigeration comprises a hydraulic cylinder 1, a hot end heat exchanger, a cold accumulator and a cold end heat exchanger 5, wherein the hot end heat exchanger comprises a first hot end heat exchanger 2 and a second hot end heat exchanger 8, the cold accumulator comprises a first cold accumulator 3 and a second cold accumulator 7, one end of the hydraulic cylinder 1 is connected with the first hot end heat exchanger 2, the other end of the hydraulic cylinder 1 is connected with the second hot end heat exchanger 8, the first hot end heat exchanger 2 is connected with the first cold accumulator 3, the second hot end heat exchanger 8 is connected with the second cold accumulator 7, the first cold accumulator 3 and the second cold accumulator 7 are both connected with the cold end heat exchanger 5, a first semiconductor refrigeration device 4 is arranged between the first cold accumulator 3 and the cold end heat exchanger 5, a second semiconductor refrigeration device 6 is arranged between the second cold accumulator 7 and the cold end heat exchanger 5, heat exchange loops are arranged between the second semiconductor refrigerating device 6 and the first hot end heat exchanger 2 and between the first semiconductor refrigerating device 4 and the second hot end heat exchanger 8, the first hot end heat exchanger 2 and the second hot end heat exchanger 8 are electrically connected with a storage battery 9, the storage battery 9 is electrically connected with the first semiconductor refrigerating device 4 and the second semiconductor refrigerating device 6 respectively, a first switch 10 is arranged between the storage battery 9 and the first semiconductor refrigerating device 4, and a second switch 11 is arranged between the storage battery 9 and the second semiconductor refrigerating device 6.
The refrigerating system comprises magnetic refrigeration and semiconductor refrigeration, wherein heat exchange fluid is cooled by a cold accumulator and then further refrigerated by a semiconductor refrigerating device and flows to a refrigerating space to refrigerate the refrigerating space; the hot end of the semiconductor refrigerator is cooled by water, and the water transfers the heat of the hot end of the semiconductor refrigerator to the hot end heat exchanger. When the system is used for refrigeration, the hot end heat exchanger transfers heat to the temperature difference power generation sheet, and the temperature difference converts heat energy into electric energy which is transferred to the semiconductor refrigeration device through the storage battery 9.
The specific connection structure is as follows:
the heat exchange loop comprises a first loop and a second loop, the first loop is connected with the second semiconductor refrigerating device 6 and the first hot end heat exchanger 2, and the second loop is connected with the first semiconductor refrigerating device 4 and the second hot end heat exchanger 8.
The first loop comprises a first water pumping pipe 12, a first water pump 13 and a first water return pipe 14, a circulation loop is formed between the second semiconductor refrigerating device 6 and the first heat exchanger through the first water pumping pipe 12 and the first water return pipe 14 respectively, and the first water pump 13 is connected with the first water pumping pipe 12.
The second loop comprises a second water pumping pipe 16, a second water pump 17 and a second water return pipe 15, a circulation loop is formed between the first semiconductor refrigerating device 4 and the second heat exchanger through the second water pumping pipe 16 and the second water return pipe 15 respectively, and the second water pump 17 is connected with the second water pumping pipe 16.
The first semiconductor refrigerating device 4 and the second semiconductor refrigerating device 6 have the same structure, and are specifically as follows:
the first semiconductor refrigerating device 4 comprises a first water tank 401, a first semiconductor refrigerating sheet 402 and a second water tank 403, the first water tank 401 is connected with the second water tank 403 through the first semiconductor refrigerating sheet 402, the first semiconductor refrigerating sheet 402 is electrically connected with the storage battery 9, the first semiconductor refrigerating device is connected with a first semiconductor thermoelectric generation sheet, and specifically, the second hot-end heat exchanger 8 is connected with the first semiconductor thermoelectric generation sheet.
The second semiconductor refrigerating device 6 comprises a third water tank 601, a second semiconductor refrigerating piece 602 and a fourth water tank 603, the third water tank 601 is connected with the fourth water tank 603 through the second semiconductor refrigerating piece 602, the second semiconductor refrigerating piece 602 is electrically connected with the storage battery 9, the second semiconductor refrigerating device is connected with a second semiconductor thermoelectric generation piece, and particularly, the first hot end heat exchanger 2 is connected with the second semiconductor thermoelectric generation piece.
A complete cycle of the system comprises a process 1 and a process 2.
Process 1: there are two flow paths in the system, flow path 1: the piston pushes the fluid in the hydraulic cylinder 1 to flow leftwards, the fluid flows into the first cold accumulator 3 through the first hot end heat exchanger 2, the fluid cooled by the first cold accumulator 3 flows into the first water tank 401, the fluid is cooled by the first semiconductor refrigeration sheet 402, then the fluid flows into the third water tank 601 through the cold end heat exchanger 5, the fluid flowing out of the third water tank 601 is heated by the second cold accumulator 7, then flows into the second hot end heat exchanger 8, and finally flows back to the hydraulic cylinder 1. Flow path 2: the second water pump 17 drives the water in the second water tank 403 to flow into the second hot-end heat exchanger and then to flow back to the second water tank 403.
In the process 1, the first semiconductor refrigeration piece 402 cools the fluid flowing into the first water tank 401, the temperature of the fluid is reduced after the fluid passes through the first water tank 401, the cooled fluid flows into the cold-end heat exchanger 5, the cold-end heat exchanger 5 is refrigerated, and the temperature difference between the cold-end heat exchanger 5 and the fluid in the first water tank 401 is increased because the hot end of the first semiconductor refrigeration piece 402 is cooled by the water of the second water tank 403. The heat released by the hot end of the first semiconductor refrigeration piece 402 is transferred to the fluid in the second water tank 403, the high-temperature fluid flowing out of the second water tank 403 transfers the heat to the second hot-end heat exchanger 8, and the first semiconductor thermoelectric generation piece converts the heat of the second hot-end heat exchanger 8 into electric energy which is transferred to the first semiconductor refrigeration piece 402 through the storage battery 9.
In the process 1, the second switch 11 is turned off, the second semiconductor refrigerating device 6 is not operated, and the first water pump 13 is not operated.
And (2) a process: in this case, the flow paths 3 and 4 are in operation, and the flow path 3: the piston pushes the heat exchange fluid in the hydraulic cylinder 1 to flow rightwards, the heat exchange fluid flows into the second cold accumulation bed through the second hot end heat exchanger 8, then flows into the third water tank 601, then flows into the first water tank 401 through the cold end heat exchanger 5, the fluid flowing out of the first water tank 401 is heated through the first cold accumulator 3, then flows into the first hot end heat exchanger 2, and finally flows back to the hydraulic cylinder 1. Flow path 4: the first water pump 13 drives the water in the fourth water tank 603 to flow into the first hot-end heat exchanger, and finally flows back to the fourth water tank 603.
In the process 2, the second semiconductor chilling plate 602 cools the fluid flowing into the third water tank 601, the temperature of the fluid is reduced after the fluid passes through the third water tank 601, the cooled fluid flows into the cold-side heat exchanger 5, and the cold-side heat exchanger 5 is chilled. The heat released by the hot end of the second semiconductor chilling plate 602 is transferred to the fluid in the fourth water tank 603, the high-temperature fluid flowing out of the fourth water tank 603 transfers the heat to the first hot-end heat exchanger 2, and the second semiconductor thermoelectric generation plate converts the heat of the first hot-end heat exchanger 2 into electric energy which is transferred to the second semiconductor chilling plate 602 through the storage battery 9.
In the process 2, the first switch 10 is turned off, the first semiconductor cooling device 4 is not operated, and the second water pump 17 is not operated.
The hot end of the semiconductor refrigerating device is cooled by water, so that the refrigerating performance of the semiconductor refrigerating sheet is greatly improved, and the temperature of the fluid flowing into the cold end heat exchanger 5 is lower. In addition, the heat of the water tank in the semiconductor refrigerating device is transferred to the hot end heat exchange device, so that the heat absorption capacity of the hot end heat exchange device is increased, the electric energy generated by the semiconductor thermoelectric generation sheet is increased, and the electric energy stored in the storage battery 9 is increased.
In the second embodiment, the first embodiment of the method,
as shown in fig. 1, in this embodiment, the storage battery and the semiconductor thermoelectric power generation sheet are not provided, the first water pump and the second water pump both use the heat pump, and the heat absorbed by the hot-end heat exchanger is all used for heating, so that the heating capacity of the magnetic heat pump is increased, and COP is improved.
In the third embodiment, the first step is that,
an air conditioner comprises a refrigerating system, wherein the refrigerating system is the combined refrigerating system of magnetic refrigeration and semiconductor refrigeration.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A combined refrigerating system of magnetic refrigeration and semiconductor refrigeration is characterized in that: comprises a hydraulic cylinder, a hot end heat exchanger, a cold accumulator and a cold end heat exchanger, wherein the hot end heat exchanger comprises a first hot end heat exchanger and a second hot end heat exchanger, the cold accumulator comprises a first cold accumulator and a second cold accumulator, one end of the hydraulic cylinder is connected with the first hot end heat exchanger, the other end of the hydraulic cylinder is connected with the second hot end heat exchanger, the first hot end heat exchanger is connected with the first cold accumulator, the second hot end heat exchanger is connected with the second cold accumulator, the first cold accumulator and the second cold accumulator are both connected with the cold end heat exchanger, a first semiconductor refrigerating device is arranged between the first cold accumulator and the cold end heat exchanger, and a second semiconductor refrigerating device is arranged between the second cold accumulator and the cold end heat exchanger, and heat exchange loops are arranged between the second semiconductor refrigerating device and the first hot end heat exchanger and between the first semiconductor refrigerating device and the second hot end heat exchanger.
2. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 1, wherein: the first hot end heat exchanger and the second hot end heat exchanger are both electrically connected with a storage battery, and the storage battery is respectively and electrically connected with the first semiconductor refrigerating device and the second semiconductor refrigerating device.
3. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 1, wherein: the heat exchange loop comprises a first loop and a second loop, the first loop is connected with the second semiconductor refrigerating device and the first hot end heat exchanger, and the second loop is connected with the first semiconductor refrigerating device and the second hot end heat exchanger.
4. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 3, wherein: the first loop comprises a first water pumping pipe, a first water pump and a first water return pipe, a circulation loop is formed between the second semiconductor refrigerating device and the first heat exchanger through the first water pumping pipe and the first water return pipe respectively, and the first water pump is connected with the first water pumping pipe.
5. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 4, wherein: the second loop comprises a second water suction pipe, a second water pump and a second water return pipe, a circulation loop is formed between the first semiconductor refrigerating device and the second heat exchanger through the second water suction pipe and the second water return pipe respectively, and the second water pump is connected with the second water suction pipe.
6. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 1, wherein: the first semiconductor refrigerating device comprises a first water tank, a first semiconductor refrigerating piece and a second water tank, the first water tank is connected with the second water tank through the first semiconductor refrigerating piece, and the first semiconductor refrigerating piece is electrically connected with the storage battery.
7. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 1, wherein: the second semiconductor refrigerating device comprises a third water tank, a second semiconductor refrigerating piece and a fourth water tank, the third water tank is connected with the fourth water tank through the second semiconductor refrigerating piece, and the second semiconductor refrigerating piece is electrically connected with the storage battery.
8. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as claimed in claim 6 or 7, wherein: the first semiconductor refrigerating device is connected with a first semiconductor thermoelectric generation piece, and the second semiconductor refrigerating device is connected with a second semiconductor thermoelectric generation piece.
9. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 1, wherein: a first switch is arranged between the storage battery and the first semiconductor refrigerating device.
10. A combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as recited in claim 1, wherein: and a second switch is arranged between the storage battery and the second semiconductor refrigerating device.
11. An air conditioner, including refrigerating system, its characterized in that: the refrigeration system is a combined refrigeration system of magnetic refrigeration and semiconductor refrigeration as claimed in any one of claims 1 to 10.
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| CN201910975794.6A CN110762893A (en) | 2019-10-15 | 2019-10-15 | Magnetic refrigeration and semiconductor refrigeration combined refrigeration system and air conditioner |
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| CN201910975794.6A CN110762893A (en) | 2019-10-15 | 2019-10-15 | Magnetic refrigeration and semiconductor refrigeration combined refrigeration system and air conditioner |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112594968A (en) * | 2020-12-25 | 2021-04-02 | 珠海格力电器股份有限公司 | Composite refrigeration system and control method thereof |
| CN113587288A (en) * | 2021-08-06 | 2021-11-02 | 奇瑞商用车（安徽）有限公司 | Cold and hot double-purpose semiconductor air conditioning system based on thermoelectric effect |
| CN112594968B (en) * | 2020-12-25 | 2024-05-03 | 珠海格力电器股份有限公司 | Composite refrigeration system and control method thereof |
-
2019
- 2019-10-15 CN CN201910975794.6A patent/CN110762893A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112594968A (en) * | 2020-12-25 | 2021-04-02 | 珠海格力电器股份有限公司 | Composite refrigeration system and control method thereof |
| CN112594968B (en) * | 2020-12-25 | 2024-05-03 | 珠海格力电器股份有限公司 | Composite refrigeration system and control method thereof |
| CN113587288A (en) * | 2021-08-06 | 2021-11-02 | 奇瑞商用车（安徽）有限公司 | Cold and hot double-purpose semiconductor air conditioning system based on thermoelectric effect |
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