CN110760247A - Anti-stripping heat dissipation insulating composite coating for electronic components - Google Patents

Anti-stripping heat dissipation insulating composite coating for electronic components Download PDF

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CN110760247A
CN110760247A CN201911028081.5A CN201911028081A CN110760247A CN 110760247 A CN110760247 A CN 110760247A CN 201911028081 A CN201911028081 A CN 201911028081A CN 110760247 A CN110760247 A CN 110760247A
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nitride
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陈永福
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Wood Science & Technology (AREA)
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Abstract

The invention provides an anti-stripping heat dissipation insulation composite coating for electronic components, which is prepared from the following components in parts by mass: 60-80 parts of novolac epoxy resin, 20-35 parts of alkyd resin, 5-20 parts of fluorosilicone rubber, 5-10 parts of polyurethane, 3-6 parts of thiosemicarbazide, 40-60 parts of nitride, 4-5 parts of tetrabutyl titanate, 2-5 parts of titanate coupling agent, 5-7 parts of polysiloxane, 2-5 parts of curing agent and a proper amount of solvent.

Description

Anti-stripping heat dissipation insulating composite coating for electronic components
Technical Field
The invention relates to the technical field of paint preparation, in particular to an anti-stripping heat dissipation insulation composite paint for electronic components.
Background
Powder coatings are becoming more and more widely used due to their outstanding environmental protection and practical utilization up to 95%. The powder coating may be of epoxy type, polyester type, epoxy polyester (hybrid) type, polyurethane type, acrylic resin type, or the like. The acrylic resin type powder coating is a high-decoration and high-weather-resistance coating, has good ageing resistance, corrosion resistance, wear resistance, outdoor durability, light and color retention and high mechanical performance, and can be widely applied to the fields of automobiles, refrigerators, washing machines and the like. With the rapid development of microelectronic integration technology and assembly technology, the volumes of electronic components and logic circuits are smaller and smaller, the working frequency is increased rapidly, and the thermal environment of semiconductors is changed rapidly towards high temperature. At the moment, heat generated by the electronic equipment is rapidly accumulated and increased, and under the temperature of the use environment, in order to ensure that the electronic components normally work for a long time with high reliability, the timely heat dissipation capability becomes an important limiting factor influencing the service life of the electronic components. The existing method for effectively improving the heat dissipation effect of the powder coating is mainly to fill metal or graphite powder into the powder coating, so that the requirement of the product on the insulating property cannot be met in the use process, and therefore, the preparation of the coating with better heat dissipation performance and better insulating property is necessary.
Disclosure of Invention
Aiming at the problems, the invention provides the anti-stripping heat dissipation insulating composite coating for the electronic components, which has the advantages of reasonable formula composition, safe and easily obtained raw materials, good raw material dispersibility, uniform and flat prepared coating, good heat conduction and heat dissipation performance by modifying inorganic filler, good insulativity, strong adhesive force, excellent heat resistance, fire resistance, wear resistance, weather resistance and the like, and obviously improves the use safety and service life of the capacitor.
In order to achieve the above object, the present invention adopts the following technical solutions:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 60-80 parts of novolac epoxy resin, 20-35 parts of alkyd resin, 5-20 parts of fluorosilicone rubber, 5-10 parts of polyurethane, 3-6 parts of thiosemicarbazide, 40-60 parts of nitride, 4-5 parts of tetrabutyl titanate, 2-5 parts of titanate coupling agent, 5-7 parts of polysiloxane, 2-5 parts of curing agent and a proper amount of solvent.
The anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following components in parts by mass: 70-80 parts of phenolic epoxy resin, 30-35 parts of alkyd resin, 10-20 parts of fluorosilicone rubber, 7-10 parts of polyurethane, 8-10 parts of thiosemicarbazide, 50-60 parts of nitride, 4.5-5 parts of tetrabutyl titanate, 4-5 parts of titanate coupling agent, 6-7 parts of polysiloxane, 4-5 parts of curing agent and a proper amount of solvent.
The titanate coupling agent adopts isopropyl triisostearoyl titanate, and the polysiloxane adopts polydimethylsiloxane.
The nitride is a mixture of boron nitride, silicon nitride and magnesium nitride in a mass ratio of 1:1-1.5: 0.5-1.5.
The curing agent is one or a combination of ethylene diamine, low molecular polyamide, 1, 2-dimethyl imidazole and boron trifluoride complex.
The solvent is deionized water and organic solvent, wherein the organic solvent is toluene or a mixture of xylene and ethanol, and the ethanol accounts for 20-45% of the total volume of the organic solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the weight parts, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 75-85 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding polyurethane, fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass of 1-2 times that of the novolac epoxy resin into the mixture, stirring the mixture uniformly, continuing to heat the mixture to 95-100 ℃, and stirring the mixture at the speed of 60-70r/min for reaction for 1-1.5 hours to obtain a mixed material I for later use;
3) placing the nitride in a ball mill for ball milling for 5-6h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then placing the mixture in an ultrasonic condition for dispersion treatment for 20-30min, and standing the mixture for 2-3h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 3-4h, then drying in vacuum at 40-50 ℃ until the water content is 18-22%, taking out and grinding into powder.
The solvent in the step 2) is specifically an organic solvent and deionized water in a mass ratio of 1:2, and the solvent in the step 3) is deionized water.
Step 3), the mass ratio of the grinding balls to the materials and the water in the ball mill is 5: 2: 1.
due to the adoption of the technical scheme, the invention has the beneficial effects that: the invention has reasonable formula composition, safe and easily obtained raw materials, good raw material dispersibility, uniform and flat prepared coating, good insulativity, strong adhesive force of the coating, excellent heat-conducting and heat-dissipating performances, wear resistance, weather resistance and other performances, and obviously improves the use safety and service life of the capacitor.
The invention takes the novolac epoxy resin and the alkyd resin as the base materials, ensures the performances of wear resistance, insulation, weather resistance and the like of the coating, has certain adhesive strength, promotes the crosslinking reaction among macromolecules by matching with the added fluorosilicone rubber, thiosemicarbazide and tetrabutyl titanate, further improves the leveling property, the caking property, the insulativity and other physical properties of the coating, and improves the ablation resistance and the radiation resistance of the coating by the fluorosilicone rubber. In addition, firstly, the nitride filler is subjected to ball milling treatment, so that the particle size of the nitride is reduced, the dispersion effect is improved, the surface structure of the nitride is changed, the later-stage modification is promoted, and then the thermal conductivity and heat dissipation performance after the nitride filler is filled are greatly improved by adopting a phthalate coupling agent for modification treatment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.
Example 1:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 65 parts of phenolic epoxy resin, 30 parts of alkyd resin, 10 parts of fluorosilicone rubber, 7 parts of polyurethane, 6 parts of thiosemicarbazide, 45 parts of nitride, 4 parts of tetrabutyl titanate, 3 parts of titanate coupling agent, 6 parts of polysiloxane, 4 parts of ethylenediamine and a proper amount of solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the parts by weight, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 75 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass 1.4 times that of the novolac epoxy resin into the mixture, uniformly stirring, continuing heating to 95 ℃, stirring at the speed of 65r/min for reaction for 1.2 hours, and obtaining a mixed material I for later use;
3) placing the nitride in a ball mill for ball milling for 5.5h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then placing the mixture in an ultrasonic condition for dispersion treatment for 25min, and standing the mixture for 2.5h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 3h, then drying in vacuum at 45 ℃ until the water content is 18-22%, taking out and grinding into powder.
Example 2:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 75 parts of phenolic epoxy resin, 35 parts of alkyd resin, 15 parts of fluorosilicone rubber, 6 parts of polyurethane, 10 parts of thiosemicarbazide, 50 parts of nitride, 4.5 parts of tetrabutyl titanate, 2 parts of titanate coupling agent, 5.5 parts of polysiloxane, 4 parts of boron trifluoride complex and a proper amount of solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the parts by weight, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 80 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass of 1 time that of the novolac epoxy resin into the mixture, uniformly stirring the mixture, continuing heating the mixture to 98 ℃, and stirring the mixture at the speed of 70r/min for reaction for 1.5 hours to obtain a mixed material I for later use;
3) putting the nitride into a ball mill for ball milling for 6h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then putting the mixture into an ultrasonic condition for dispersion treatment for 20min, and standing the mixture for 3h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 3.5h, then drying in vacuum at 40 ℃ until the water content is 18-22%, taking out and grinding into powder.
Example 3:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 70 parts of phenolic epoxy resin, 20 parts of alkyd resin, 20 parts of fluorosilicone rubber, 10 parts of polyurethane, 3 parts of thiosemicarbazide, 40 parts of nitride, 5 parts of tetrabutyl titanate, 5 parts of titanate coupling agent, 7 parts of polysiloxane, 2 parts of 1, 2-dimethyl imidazole and a proper amount of solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the parts by weight, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 80 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass 1.2 times that of the novolac epoxy resin into the mixture, uniformly stirring, continuing heating to 95 ℃, stirring at the speed of 65r/min for reaction for 1h, and obtaining a mixed material I for later use;
3) putting the nitride into a ball mill for ball milling for 6h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then putting the mixture into an ultrasonic condition for dispersion treatment for 20min, and standing the mixture for 3h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 4 hours, then drying in vacuum at 40 ℃ until the water content is 18-22%, taking out and grinding into powder.
Example 4:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 80 parts of phenolic epoxy resin, 25 parts of alkyd resin, 8 parts of fluorosilicone rubber, 6 parts of polyurethane, 5 parts of thiosemicarbazide, 60 parts of nitride, 4.2 parts of tetrabutyl titanate, 4 parts of titanate coupling agent, 6 parts of polysiloxane, 5 parts of ethylenediamine, 5 parts of low-molecular polyamide and a proper amount of solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the parts by weight, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 85 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass 2 times that of the novolac epoxy resin into the mixture, uniformly stirring the mixture, continuing heating the mixture to 95 ℃, and stirring the mixture at the speed of 60r/min for reaction for 1 hour to obtain a first mixed material for later use;
3) placing the nitride in a ball mill for ball milling for 5.5h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then placing the mixture in an ultrasonic condition for dispersion treatment for 30min, and standing the mixture for 2.8h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 3.5h, then drying in vacuum at 50 ℃ until the water content is 18-22%, taking out and grinding into powder.
Example 5:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 60 parts of phenolic epoxy resin, 28 parts of alkyd resin, 5 parts of fluorosilicone rubber, 8 parts of polyurethane, 8 parts of thiosemicarbazide, 55 parts of nitride, 4.8 parts of tetrabutyl titanate, 2 parts of titanate coupling agent, 5 parts of polysiloxane, 3 parts of low-molecular polyamide and a proper amount of solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the parts by weight, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 85 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass 1.5 times that of the novolac epoxy resin into the mixture, uniformly stirring, continuing heating to 100 ℃, stirring at the speed of 60r/min for reaction for 1.5 hours, and obtaining a mixed material I for later use;
3) placing the nitride in a ball mill for ball milling for 5h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then placing the mixture in an ultrasonic condition for dispersion treatment for 25min, and standing the mixture for 2.2h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 3h, then drying in vacuum at 50 ℃ until the water content is 18-22%, taking out and grinding into powder.
Example 6:
an anti-stripping heat dissipation insulating composite coating for electronic components is prepared from the following components in parts by mass: 70 parts of phenolic epoxy resin, 30 parts of alkyd resin, 18 parts of fluorosilicone rubber, 5 parts of polyurethane, 10 parts of thiosemicarbazide, 50 parts of nitride, 4.5 parts of tetrabutyl titanate, 3 parts of titanate coupling agent, 6.5 parts of polysiloxane, 2.5 parts of ethylenediamine, boron trifluoride complex and a proper amount of solvent.
The preparation method of the anti-stripping heat dissipation insulating composite coating for the electronic component comprises the following steps:
1) weighing the raw materials according to the parts by weight, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 80 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
2) then adding fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass 1.6 times that of the novolac epoxy resin into the mixture, uniformly stirring, continuing heating to 100 ℃, stirring at the speed of 65r/min for reaction for 1.2 hours, and obtaining a mixed material I for later use;
3) placing the nitride in a ball mill for ball milling for 5.5h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then placing the mixture in an ultrasonic condition for dispersion treatment for 20min, and standing the mixture for 2h to obtain a second mixed material;
4) putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 4 hours, then drying in vacuum at 45 ℃ until the water content is 18-22%, taking out and grinding into powder.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (9)

1. An anti-stripping heat dissipation insulating composite coating for electronic components is characterized by comprising the following components in parts by mass: 60-80 parts of novolac epoxy resin, 40-60 parts of nitride, 5-20 parts of fluorosilicone rubber, 5-10 parts of polyurethane, 20-35 parts of alkyd resin, 3-6 parts of thiosemicarbazide, 4-5 parts of tetrabutyl titanate, 2-5 parts of titanate coupling agent, 5-7 parts of polysiloxane, 2-5 parts of curing agent and a proper amount of solvent.
2. The peeling-resistant heat dissipation insulation composite coating for the electronic component as claimed in claim 1, which is prepared from the following components in parts by mass: 70-80 parts of phenolic epoxy resin, 50-60 parts of nitride, 10-20 parts of fluorosilicone rubber, 7-10 parts of polyurethane, 30-35 parts of alkyd resin, 8-10 parts of thiosemicarbazide, 4.5-5 parts of tetrabutyl titanate, 4-5 parts of titanate coupling agent, 6-7 parts of polysiloxane, 4-5 parts of curing agent and a proper amount of solvent.
3. The peeling-resistant heat-dissipating insulating composite coating for electronic components according to claim 1 or 2, characterized in that: the titanate coupling agent is isopropyl triisostearoyl titanate, and the polysiloxane is polydimethylsiloxane.
4. The peeling-resistant heat-dissipating insulating composite coating for electronic components according to claim 1 or 2, characterized in that: the nitride is a mixture of boron nitride, silicon nitride and magnesium nitride in a mass ratio of 1:1-1.5: 0.5-1.5.
5. The peeling-resistant heat-dissipating insulating composite coating for electronic components according to claim 1 or 2, characterized in that: the curing agent is one or a combination of ethylene diamine, low molecular polyamide, 1, 2-dimethyl imidazole and boron trifluoride complex.
6. The peeling-resistant heat-dissipating insulating composite coating for electronic components according to claim 1 or 2, characterized in that: the solvent is deionized water and an organic solvent, wherein the organic solvent is toluene or a mixture of xylene and ethanol, and the ethanol accounts for 20-45% of the total volume of the organic solvent.
7. The preparation method of the peeling-resistant heat dissipation insulating composite coating for electronic components according to claim 1 or 2, characterized by comprising the steps of:
weighing the raw materials according to the weight parts, blending the novolac epoxy resin, the alkyd resin and the thiosemicarbazide, heating to 75-85 ℃, and stirring at the speed of 45r/min for reaction for 1 h;
then adding polyurethane, fluorosilicone rubber, tetrabutyl titanate and a solvent with the mass of 1-2 times that of the novolac epoxy resin into the mixture, stirring the mixture uniformly, continuing to heat the mixture to 95-100 ℃, and stirring the mixture at the speed of 60-70r/min for reaction for 1-1.5 hours to obtain a mixed material I for later use;
placing the nitride in a ball mill for ball milling for 5-6h, taking out the nitride, blending the nitride with a titanate coupling agent and a solvent with the mass 2 times that of the nitride, heating and stirring the mixture for 1h at 70 ℃, then placing the mixture in an ultrasonic condition for dispersion treatment for 20-30min, and standing the mixture for 2-3h to obtain a second mixed material;
putting the first mixed material, the second mixed material, polysiloxane and a curing agent into a sand mill, grinding for 3-4h, then drying in vacuum at 40-50 ℃ until the water content is 18-22%, taking out and grinding into powder.
8. The method for preparing the peeling-resistant heat dissipation insulating composite coating for electronic components as claimed in claim 7, characterized in that: the solvent in the step 2) is specifically an organic solvent and deionized water in a mass ratio of 1:2, and the solvent in the step 3) is deionized water.
9. The method for preparing the peeling-resistant heat dissipation insulating composite coating for electronic components as claimed in claim 7, characterized in that: step 3), the mass ratio of the grinding balls to the materials and the water in the ball mill is 5: 2: 1.
CN201911028081.5A 2019-10-28 2019-10-28 Anti-stripping heat dissipation insulating composite coating for electronic components Withdrawn CN110760247A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116004115A (en) * 2022-12-13 2023-04-25 苏州鸿钜金属制品有限公司 Heat-conducting insulating coating for power battery and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116004115A (en) * 2022-12-13 2023-04-25 苏州鸿钜金属制品有限公司 Heat-conducting insulating coating for power battery and preparation method thereof

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Application publication date: 20200207