CN110752314B - Display panel, preparation method thereof and display device - Google Patents

Display panel, preparation method thereof and display device Download PDF

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Publication number
CN110752314B
CN110752314B CN201911052608.8A CN201911052608A CN110752314B CN 110752314 B CN110752314 B CN 110752314B CN 201911052608 A CN201911052608 A CN 201911052608A CN 110752314 B CN110752314 B CN 110752314B
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Prior art keywords
substrate
support
encapsulation
support substrate
display panel
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CN110752314A (en
Inventor
王晓欣
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel includes: the display device comprises a first supporting substrate, a flexible substrate, a display device layer, a first packaging part and a packaging layer. The arrangement of the encapsulation layer and the first encapsulation portion can prevent water and oxygen from entering each structural layer of the display device layer from the side. In the display panel, the first packaging part is arranged on the side wall of the display panel provided with the through hole, so that the peripheral reliability can be improved, and the invasion of water and oxygen can be prevented.

Description

Display panel, preparation method thereof and display device
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
With the rapid development of vehicle-mounted electronic technology in recent years, the functions of vehicle-mounted multimedia become more and more abundant and intelligent. Meanwhile, the resolution ratio of the vehicle-mounted display screen is higher and higher, and the screen is larger and larger, so that better and better visual effects are achieved. However, the vehicle-mounted display screen needs to be installed in a punched mode, and the service life of the vehicle-mounted display screen is long, so that the requirement for packaging the punched area is higher.
Disclosure of Invention
Therefore, it is necessary to provide a display panel, a manufacturing method thereof and a display device for solving the problem of poor packaging effect of a punching area of a vehicle-mounted display screen.
A display panel includes a flexible substrate having a through hole. The display panel further includes:
the first support substrate is used for bearing the flexible substrate and is provided with a first support position which is not covered by the flexible substrate;
a display device layer formed on the flexible substrate;
the first packaging part is partially formed at the first supporting position and is respectively in direct contact with the flexible substrate and the side surface of the display device layer; and
and the packaging layer is formed on the surface of the display device layer, which is far away from the flexible substrate, and partially covers the first packaging part.
As a preferred implementation manner, on the basis of the above embodiment, the first supporting position includes:
the first supporting part is formed in the edge area of the flexible substrate outside the projection of the first supporting substrate; and
and the second supporting part is formed in the projection area of the flexible substrate on the first supporting substrate.
As a preferable implementation manner, on the basis of the above embodiment, the first supporting part bears the first package part or bears the package layer of the side face;
the second supporting part bears the first packaging part.
As a preferred implementation manner, on the basis of the above embodiment, the display panel further includes:
a second support substrate formed on a surface of the first support substrate remote from the flexible substrate, wherein an outer edge of the second support substrate is aligned with an outer edge of the first support substrate, the second support substrate having a second support site that is not covered by the first support substrate;
and the second packaging part is formed at the second supporting position and is respectively in direct contact with the side surfaces of the first supporting substrate, the first packaging part and the packaging layer.
As a preferred implementation manner, on the basis of the above embodiment, the display panel further includes:
the second support substrate is formed on the surface of the first support substrate far away from the flexible substrate, and the second support substrate is provided with a second support position which is not covered by the first support substrate;
wherein the second support location comprises:
the third supporting part is formed in the edge area of the first supporting substrate outside the projection of the second supporting substrate; and
a fourth supporting part formed on the first supporting substrate in the projection area of the second supporting substrate;
the second packaging part is formed on the fourth supporting part and is respectively in direct contact with the first supporting substrate, the first packaging part and the side surface of the packaging layer, and the third supporting part bears the second packaging part or bears the packaging layer on the side surface;
or the second encapsulation part is formed on the third support part and the fourth support part and is in direct contact with the side surfaces of the first support substrate, the first encapsulation part and the encapsulation layer respectively.
As a preferred implementation manner, on the basis of the above embodiment, the display panel further includes:
and the third support substrate is formed on the surface of the second support substrate far away from the first support substrate, and is provided with a third support position which is not covered by the second support substrate and is used for bearing the packaging layer.
A display device comprising the display panel of any one of the above.
A method of manufacturing a display panel, comprising:
providing a glass substrate;
forming a flexible substrate on the surface of the glass substrate;
forming a display device layer on the surface of the flexible substrate;
peeling the glass substrate from the flexible substrate;
punching the flexible substrate and the display device layer for the first time at a first diameter, and penetrating the display device layer and the flexible substrate to form a non-display area;
forming a first supporting substrate on one side of the flexible substrate far away from the display device layer;
perforating the first support substrate for a second time at a second diameter, wherein the second diameter is smaller than the first diameter, so that the first support substrate has leaked first support positions;
forming a first encapsulation part at the first support position, wherein the first encapsulation part is used for preventing water and oxygen from invading the display device layer;
and forming an encapsulation layer on the surface of the display device layer far away from the flexible substrate.
As a preferred implementation manner, on the basis of the above embodiment, the method for manufacturing a display panel further includes:
forming a second support substrate on a surface of the first support substrate remote from the flexible substrate, wherein an outer edge of the second support substrate is aligned with an outer edge of the first support substrate, the second support substrate having a second support site that is not covered by the first support substrate;
and forming a second packaging part at the second supporting position, wherein the second packaging part is respectively in direct contact with the first supporting substrate, the first packaging part and the side surface of the packaging layer.
As a preferable implementation manner, on the basis of the above embodiment, a third supporting substrate is formed on the surface of the second supporting substrate away from the first supporting substrate, wherein the third supporting substrate has a third supporting position that is not covered by the second supporting substrate;
and forming the packaging layer at the third supporting position, wherein the packaging layer is respectively in direct contact with the third supporting substrate, the second packaging part, the first packaging part and the display device layer.
The application provides a display panel, a preparation method thereof and a display device. The display panel includes: the display device comprises a first supporting substrate, a flexible substrate, a display device layer, a first packaging part and a packaging layer. The arrangement of the encapsulation layer and the first encapsulation portion can prevent water and oxygen from entering each structural layer of the display device layer from the side. In the display panel, the first packaging part is arranged on the side wall of the display panel provided with the through hole, so that the peripheral reliability can be improved, and the invasion of water and oxygen can be prevented.
Drawings
Fig. 1 is a schematic view of an interface structure of a display panel provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of an interface structure of a display panel provided in an embodiment of the present application;
FIG. 3 is a top view of a portion of a display panel provided in an embodiment of the present application;
FIG. 4 is a schematic diagram of an interface structure of a display panel provided in an embodiment of the present application;
FIG. 5 is a schematic diagram of an interface structure of a display panel provided in an embodiment of the present application;
FIG. 6 is a schematic diagram of an interface structure of a display panel provided in an embodiment of the present application;
FIG. 7 is a top view of a portion of a display panel provided in an embodiment of the present application;
FIG. 8 is a schematic diagram of an interface structure of a display panel provided in an embodiment of the present application;
FIG. 9 is a top view of a portion of a display panel provided in an embodiment of the present application;
fig. 10 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. The reference numbers illustrate:
display panel 10
Flexible substrate 110
First support substrate 111
Second support substrate 112
Third support substrate 113
Display device layer 120
First encapsulation 140
Second encapsulation portion 150
Encapsulation layer 130
First support position 210
First support part 211
The second supporting portion 212
Second support position 220
Third supporting part 221
Fourth supporting part 222
Third support position 230
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1, fig. 2 and fig. 3, the present application provides a display panel 10 including: the first support substrate 111, the flexible substrate 110, the display device layer 120, the first encapsulation part 140, and the encapsulation layer 130.
The first support substrate 111 is used to support the flexible substrate 110 and some package structures. The first supporting substrate 111 may be an ultra-thin glass substrate or other substrates capable of supporting a certain amount.
The flexible substrate 110 is formed on the first support substrate 111. The first supporting substrate 111 has a first supporting position 210 (see fig. 3) uncovered by the flexible substrate 110. The flexible substrate 110 may be a PI substrate layer (PI is an abbreviation for polyimide, PI is a polymer having an imido group in a main chain), a PDMS substrate layer (PDMS is polydimethylsiloxane), or a PET substrate layer (PET is an abbreviation for polyethylene terephthalate). Specifically, the first support substrate 111 may have a position not covered by the flexible substrate 110 at an outer edge of the first support substrate 111 or at an intermediate position of the first support substrate 111. It can also be said that the area of the first support substrate 111 is larger than the area of the flexible substrate 110.
The display device layer 120 is formed on the flexible substrate 110. The display device layer 120 may include a thin film transistor array layer, an organic light emitting diode display layer, or a touch layer. The display device layer 120 may further include other display devices or display control layers, which are not specifically limited herein.
The first encapsulation part 140 is partially formed on the first support site 210 and directly contacts the flexible substrate 110 and the side surface of the display device layer 120, respectively. The material of the first packaging part 140 is selected to have a water vapor transmission rate of less than 10-6g/m2And/day. Specifically, the first sealing member 140 may be glass frit, polyvinylidene chloride (PVDC), ethylene-ethanol copolymer (EVOH), Polyamide (PA), polyester (PET, PEN), or Polyimide (PI).
The encapsulation layer 130 is formed on the surface of the display device layer 120 away from the flexible substrate 110, and the encapsulation layer 130 partially covers the first encapsulation part 140. The encapsulation layer 130 may be a multilayer thin film encapsulation composed of inorganic, organic and inorganic materials, a flexible encapsulation material, or an ultra-thin glass encapsulation material.
In this embodiment, the display panel 10 includes: the first support substrate 111, the flexible substrate 110, the display device layer 120, the first encapsulation part 140, and the encapsulation layer 130. The provision of the encapsulation layer 130 and the first encapsulation part 140 can prevent water oxygen from laterally intruding into each structural layer of the display device layer 120. In the display panel 10, the first sealing portion 140 is disposed on the sidewall of the display panel 10 with the through hole, so as to improve the reliability of the periphery and prevent water and oxygen from invading.
Referring to fig. 3, a top view of a portion of the display panel 10 is provided. Only a partial structure including the flexible substrate 110 and the first support substrate 111 is shown in fig. 3. As a preferred implementation manner, on the basis of the above embodiment, the first supporting location 210 includes: a first support portion 211 and a second support portion 212.
The first support part 211 is formed at an edge region of the flexible substrate 110 outside the projection of the first support substrate 111. As shown in fig. 3, the first support part 211 is an area of the flexible substrate 110 outside a projection on the first support substrate 111.
The second supporting portion 212 is formed on the flexible substrate 110 in a projection region of the first supporting substrate 111. As shown in fig. 3, the second supporting portion 212 is a region of the first supporting substrate 111 within the opening region of the flexible substrate 110 after the opening. Specifically, the diameter of the opening of the first support substrate 111 may be smaller than the diameter of the opening of the flexible substrate 110.
In this embodiment, the first supporting portion 210 is divided into the first supporting portion 211 and the second supporting portion 212, and different water and oxygen barrier layers or encapsulation layers with different encapsulation effects may be disposed on different supporting portions. As shown in fig. 1 and 2, both the first encapsulation part 140 and the encapsulation layer 130 may improve the effect of the display panel 10 on preventing the invasion of water and oxygen, thereby improving the stability of the display panel 10.
As a preferable implementation manner, on the basis of the above embodiment, the first supporting portion 211 bears the first encapsulating portion 140 or the side-bearing encapsulating layer 130. The second supporting portion 212 carries the first encapsulation portion 140.
In this embodiment, as shown in fig. 1, the first supporting portion 211 supports the side surface of the encapsulation layer 130, and the second supporting portion 212 supports the first encapsulation portion 140. As shown in fig. 2, the first supporting part 211 carries the first encapsulation part 140, and the second supporting part 212 carries the first encapsulation part 140. In this embodiment, the first encapsulation portion 140 and the encapsulation layer 130 can both improve the effect of the display panel 10 on preventing the invasion of water and oxygen, so as to improve the stability of the display panel 10.
Referring to fig. 4, as a preferred implementation, on the basis of the foregoing embodiment, the display panel 10 further includes: a second support substrate 112 and a second encapsulation part 150.
The second support substrate 112 is formed on a surface of the first support substrate 111 away from the flexible substrate 110. Wherein an outer edge of the second support substrate 112 is aligned with an outer edge of the first support substrate 111. The second support substrate 112 has a second support site 220 that is not covered by the first support substrate 111. The second support substrate 112 is used for supporting the flexible substrate 110 and some package structures. The second support substrate 112 may be an ultra-thin glass substrate or other substrate capable of supporting a certain amount.
The second encapsulation part 150 is formed on the second support site 220 and directly contacts with the first support substrate 111, the first encapsulation part 140, and the side surfaces of the encapsulation layer 130, respectively.
The second encapsulation part 150 may be sealant. The frame glue is UV glue. And irradiating the sealing material by using ultraviolet light to cure the sealing material. The desiccant filler is a liquid desiccant. In particular UV is the abbreviation for Ultraviolet Rays, the Ultraviolet ray. The Ultraviolet (UV) is invisible to naked eyes, is a section of electromagnetic radiation except visible light, and has a wavelength of 10-400 nm. The second encapsulant 150 may be cured using a shadowless adhesive. The specific shadowless adhesive curing principle is that a photoinitiator (or photosensitizer) in a UV curing material generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet rays, and the polymerization and crosslinking chemical reaction of monomers are initiated, so that the adhesive is converted from a liquid state to a solid state within several seconds.
In this embodiment, the first sealing portion 140 and the second sealing portion 150 are disposed on the sidewall of the through hole in the opening region of the display panel 10, and the two sealing portions can doubly protect each layer structure of the display device layer 120 and prevent water and oxygen from penetrating into any layer structure of the display device layer 120. The first and second sealing portions 140 and 150 may be disposed to substantially prevent water and oxygen from entering the structure layers of the display device layer 120 from the side, thereby improving the reliability of the periphery of the opening region and preventing water and oxygen from entering the opening region.
Referring to fig. 5, fig. 6 and fig. 7, as a preferred implementation, on the basis of the foregoing embodiment, the display panel 10 further includes: a second support substrate 112 and a second encapsulation part 150.
The second support substrate 112 is formed on a surface of the first support substrate 111 away from the flexible substrate 110. The second supporting substrate 112 has a second supporting position 220 uncovered by the first supporting substrate 111.
Wherein the second supporting position 220 comprises: a third support part 221 and a fourth support part 222. The third supporting portion 221 is formed at an edge region of the first supporting substrate 111 outside the projection of the second supporting substrate 112. The fourth supporting portion 222 is formed on the first supporting substrate 111 in the projection area of the second supporting substrate 112.
As shown in fig. 5, the second encapsulation part 150 is formed on the fourth support part 222 and directly contacts the first support substrate 111, the first encapsulation part 140, and the side surface of the encapsulation layer 130, respectively. The third supporting portion 221 carries the encapsulation layer 130 on the side.
Alternatively, as shown in fig. 6, the second encapsulation part 150 is formed on the third support part 221 and the fourth support part 222 and directly contacts with the side surfaces of the first support substrate 111, the first encapsulation part 140, and the encapsulation layer 130, respectively.
In this embodiment, two encapsulation layers are disposed on the outer frame of the display panel 10 to block water and oxygen from entering the display device layer 120. In this embodiment, the opening region and the frame region of the display panel 10 are protected doubly, so that the display panel 10 has a stronger water and oxygen blocking effect.
As a preferable implementation manner, on the basis of the above embodiment, the shapes of the second supporting portion 212 and the fourth supporting portion 222 are circular, triangular, rectangular or rounded rectangle.
In this embodiment, the second supporting portion 212 and the fourth supporting portion 222 may also be other polygonal shapes or irregular shapes, and are not limited in this respect.
Referring to fig. 8 and fig. 9, as a preferred implementation, on the basis of the foregoing embodiment, the display panel 10 further includes: a third support substrate 113.
The third support substrate 113 is formed on a surface of the second support substrate 112 away from the first support substrate 111. Wherein the third support substrate 113 has a third support position 230 not covered by the second support substrate 112. The third supporting site 230 is used for carrying the encapsulation layer 130. The second support substrate 112 is used for supporting the flexible substrate 110 and some package structures. The second support substrate 112 may be an ultra-thin glass substrate or other substrate capable of supporting a certain amount.
In this embodiment, the third supporting substrate 113 is disposed to further improve the water and oxygen blocking effect of the display panel 10. The third supporting substrate 113 has the third supporting position 230, and the third supporting position 230 can be used for carrying the encapsulation layer 130. Of course, the third supporting portion 230 may be further provided with a third package portion. The first sealing part 140, the second sealing part 150, and the third sealing part provided at the third supporting position 230 may be three waterproof layers having progressive waterproof effects. The three waterproof layers are arranged, so that water and oxygen can be fully prevented from invading from the side surfaces of each structural layer of the display device layer, the reliability of the periphery of the perforated area can be improved, and the invasion of water and oxygen can be prevented.
A display device comprising the display panel 10 of any one of the above.
The display device may be an in-vehicle display device, and a specific display device may include the display panel 10 described in any one of fig. 1, fig. 2, fig. 4, fig. 5, fig. 6, or fig. 8. When the display device is an on-vehicle instrument panel, the opening area as shown in fig. 3, 7 and 9 can be provided with a pointer in the middle of the instrument panel of the automobile.
In this embodiment, the display device provided may be an in-vehicle display device. For example, the in-vehicle display device having the through hole may be provided as an instrument panel of an automobile. And a pointer is arranged at the through hole in the middle of the instrument panel. The application provides display device can improve on-vehicle display device's (like the instrument dish) waterproof performance for on-vehicle display device's test security is higher, and the encapsulation effect can be long-term the maintenance.
Referring to fig. 10, the present application provides a method for manufacturing a display panel, including:
s100, providing a glass substrate. The glass substrate serves as an intermediate structure in the preparation of the display panel 10, and provides an early-stage substrate support.
And S200, forming the flexible substrate 110 on the surface of the glass substrate. The flexible substrate 110 may be a PI substrate layer (PI is an abbreviation for polyimide, PI is a polymer having an imido group in a main chain), a PDMS substrate layer (PDMS is polydimethylsiloxane), or a PET substrate layer (PET is an abbreviation for polyethylene terephthalate).
And S300, forming a display device layer 120 on the surface of the flexible substrate 110. Specifically, the display device layer 120 may include a thin film transistor array layer, an organic light emitting diode display layer, or a touch layer. The display device layer 120 may further include other display devices or display control layers, which are not specifically limited herein.
S400, peeling the glass substrate from the flexible substrate 110. The specific stripping process may adopt laser irradiation, and laser with a suitable frequency is selected to irradiate the contact interface between the glass substrate and the display panel 10.
S500, performing a first hole punching on the flexible substrate 110 and the display device layer 120 with a first diameter, and penetrating through the display device layer 120 and the flexible substrate 110 to form a non-display area. The first perforation may be a drilling, laser, or chemical etching on the display device layer 120 and the flexible substrate 110. Specifically, the non-display region may be an open region as shown in fig. 3, 7 and 9. Further, the non-display area may be larger than the area of the opening area in the drawing.
S600, forming a first supporting substrate 111 on a side of the flexible substrate 110 away from the display device layer 120. The first support substrate 111 is used to support the flexible substrate 110 and some package structures. The first supporting substrate 111 may be an ultra-thin glass substrate or other substrates capable of supporting a certain amount.
S700, performing a second hole punching on the first supporting substrate 111 with a second diameter, where the second diameter is smaller than the first diameter, so that the first supporting substrate 111 has the leaked first supporting position 210. In the present method, only the first perforation of the display device layer 120 and the flexible substrate 110 at the first diameter is mentioned. The first support substrate 111 is perforated a second time with a second diameter. And defines a relationship of the first diameter to the second diameter. It will be appreciated that the open area may also be rectangular or other shapes. The first diameter and the second diameter may become a first distance and a second distance when the shape of the open area is changed. The difference between the first distance and the second distance is between 80 microns and 160 microns. The second supporting substrate 112 is spaced apart from the first supporting substrate 111 by an additional distance of 80 to 160 micrometers. Of course, the distance between the second supporting substrate 112 and the first supporting substrate 111 may be adjusted according to the size of the display panel 10.
S800, forming a first encapsulation portion 140 at the first supporting position 210. For the first package part 140To prevent ingress of aqueous oxygen into the display device layer 120. The material of the first packaging part 140 is selected to have a water vapor transmission rate of less than 10-6g/m2And/day. Specifically, the first sealing member 140 may be polyvinylidene chloride (PVDC), ethylene-ethanol copolymer (EVOH), Polyamide (PA), polyester (PET, PEN), or Polyimide (PI).
And S900, forming an encapsulation layer 130 on the surface of the display device layer 120 far away from the flexible substrate 110. The encapsulation layer 130 may be a multilayer thin film encapsulation composed of inorganic, organic and inorganic materials, a flexible encapsulation material, or an ultra-thin glass encapsulation material.
In this embodiment, the prepared display panel 10 may be the display panel shown in fig. 1 to 2. In particular, the structures of the display panel 10 and the relationship between the structures can be referred to the description of the display panel 10. In this embodiment, in the preparation method, the structure for preventing water and oxygen intrusion of the first packaging part 140 is arranged in the opening region, so that the difficulty in process implementation is low, and the market demand is quickly responded. The display panel 10 or the display device prepared by the preparation method in the embodiment can improve the waterproof performance of the display panel or the display device, so that the test safety of the display panel or the display device is higher, and the packaging effect can be maintained for a long time.
As a preferred implementation manner, on the basis of the above embodiment, the method for manufacturing a display panel further includes:
on the surface of the first support substrate 111 away from the flexible substrate 110, a second support substrate 112 is formed. Wherein an outer edge of the second support substrate 112 is aligned with an outer edge of the first support substrate 111. The second support substrate 112 has a second support site 220 that is not covered by the first support substrate 111.
A second encapsulation portion 150 is formed at the second support site 220, and the second encapsulation portion 150 is in direct contact with the side surfaces of the first support substrate 111, the first encapsulation portion 140, and the encapsulation layer 130, respectively.
The second encapsulation part 150 may be sealant. The frame glue is UV glue. And irradiating the sealing material by using ultraviolet light to cure the sealing material. The desiccant filler is a liquid desiccant. In particular UV is the abbreviation for Ultraviolet Rays, the Ultraviolet ray. The Ultraviolet (UV) is invisible to naked eyes, is a section of electromagnetic radiation except visible light, and has a wavelength of 10-400 nm. The second encapsulant 150 may be cured using a shadowless adhesive. The specific shadowless adhesive curing principle is that a photoinitiator (or photosensitizer) in a UV curing material generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet rays, and the polymerization and crosslinking chemical reaction of monomers are initiated, so that the adhesive is converted from a liquid state to a solid state within several seconds.
In this embodiment, the display panel 10 obtained by the preparation may be the display panel shown in fig. 4 to 6. In particular, the structures of the display panel 10 and the relationship between the structures can be referred to the description of the display panel 10. In this embodiment, in the preparation method, the first packaging part 140 and the second packaging part 150 are arranged in the opening region to protect against water and oxygen intrusion, so that the difficulty in process implementation is low, and the market demand can be quickly responded. The display panel 10 or the display device prepared by the preparation method in the embodiment can improve the waterproof performance of the display panel or the display device, so that the test safety of the display panel or the display device is higher, and the packaging effect can be maintained for a long time.
As a preferred implementation, on the basis of the above embodiment, the method further includes:
a third support substrate 113 is formed on a surface of the second support substrate 112 away from the first support substrate 111. The third support substrate 113 has a third support site 230 that is not covered by the second support substrate 112, as shown in fig. 9. The material of the third support substrate 113 may be the same as the material of the first support substrate 111 and the second support substrate 112. The size and shape of the third supporting position 230 can be set according to actual requirements.
The encapsulation layer 130 is formed at the third support site 230. As shown in fig. 8, the encapsulation layer 130 is in direct contact with the third support substrate 113, the second encapsulation part 150, the first encapsulation part 140, and the display device layer 120, respectively.
In this embodiment, the display panel 10 prepared may be the display panel shown in fig. 8 and 9. In particular, the structures of the display panel 10 and the relationship between the structures can be referred to the description of the display panel 10. In this embodiment, the preparation method sets three structures of the first encapsulation portion 140, the second encapsulation portion 150, and the encapsulation layer 130 for preventing water and oxygen from invading in the opening region, so that the difficulty in process implementation is low, and the market demand is quickly responded. The display panel 10 or the display device prepared by the preparation method in the embodiment can improve the waterproof performance of the display panel or the display device, so that the test safety of the display panel or the display device is higher, and the packaging effect can be maintained for a long time.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (11)

1. A display panel, the display panel (10) comprising a flexible substrate (110) having a through hole, characterized in that the display panel (10) further comprises:
a first support substrate (111) for carrying the flexible substrate (110), the first support substrate (111) having a first support location (210) not covered by the flexible substrate (110);
a display device layer (120) formed on the flexible substrate (110);
a first encapsulation part (140) partially formed at the first support site (210) and directly contacting the flexible substrate (110) and the side surface of the display device layer (120), respectively; and
and the packaging layer (130) is formed on the surface of the display device layer (120) far away from the flexible substrate (110), and the packaging layer (130) partially covers the first packaging part (140).
2. The display panel according to claim 1, wherein the first support location (210) comprises:
a first support part (211) formed at an edge region of the flexible substrate (110) outside a projection of the first support substrate (111); and
and a second support part (212) formed in the projection region of the flexible substrate (110) on the first support substrate (111).
3. The display panel according to claim 2, wherein the first support part (211) carries the first encapsulation part (140) or carries the encapsulation layer (130) of a side;
the second support portion (212) carries the first encapsulation portion (140).
4. The display panel according to claim 3, further comprising:
a second support substrate (112) formed on a surface of the first support substrate (111) remote from the flexible substrate (110), wherein an outer edge of the second support substrate (112) is aligned with an outer edge of the first support substrate (111), the second support substrate (112) having a second support site (220) that is not covered by the first support substrate (111);
and a second encapsulation part (150) formed at the second support position (220) and directly contacting the first support substrate (111), the first encapsulation part (140) and the side surface of the encapsulation layer (130), respectively.
5. The display panel according to claim 3, further comprising:
a second support substrate (112) formed on a surface of the first support substrate (111) away from the flexible substrate (110), wherein the second support substrate (112) has a second support location (220) that is not covered by the first support substrate (111);
wherein the second support location (220) comprises:
a third support part (221) formed at an edge region of the first support substrate (111) outside a projection of the second support substrate (112); and
a fourth support part (222) formed on the first support substrate (111) within a projection area of the second support substrate (112);
and a second encapsulation part (150) formed on the fourth support part (222) and directly contacting the first support substrate (111), the first encapsulation part (140) and the side surface of the encapsulation layer (130), respectively, wherein the third support part (221) bears the second encapsulation part (150) or bears the side surface of the encapsulation layer (130).
6. The display panel according to claim 5, wherein the second encapsulation portion (150) is formed on the third support portion (221) and the fourth support portion (222) and is in direct contact with the side surfaces of the first support substrate (111), the first encapsulation portion (140), and the encapsulation layer (130), respectively.
7. The display panel according to any one of claims 4 to 6, further comprising:
a third supporting substrate (113) formed on a surface of the second supporting substrate (112) far away from the first supporting substrate (111), wherein the third supporting substrate (113) has a third supporting position (230) uncovered by the second supporting substrate (112), and the third supporting position (230) is used for bearing the packaging layer (130).
8. A display device, characterized by comprising a display panel (10) according to any one of claims 1 to 7.
9. A method for manufacturing a display panel is characterized in that,
providing a glass substrate;
forming a flexible substrate (110) on a surface of the glass substrate;
forming a display device layer (120) on a surface of the flexible substrate (110);
peeling the glass substrate from the flexible substrate (110);
punching the flexible substrate (110) and the display device layer (120) for the first time at a first diameter, and penetrating the display device layer (120) and the flexible substrate (110) to form a non-display area;
forming a first support substrate (111) on a side of the flexible substrate (110) remote from the display device layer (120);
perforating the first support substrate (111) a second time with a second diameter, the second diameter being smaller than the first diameter, so that the first support substrate (111) has a leaked first support site (210);
forming a first encapsulation part (140) at the first support site (210), the first encapsulation part (140) for preventing water and oxygen from invading the display device layer (120);
and forming an encapsulation layer (130) on the surface of the display device layer (120) far away from the flexible substrate (110).
10. The method for manufacturing a display panel according to claim 9, further comprising:
forming a second support substrate (112) on a surface of the first support substrate (111) remote from the flexible substrate (110), wherein an outer edge of the second support substrate (112) is aligned with an outer edge of the first support substrate (111), the second support substrate (112) having a second support site (220) that is not covered by the first support substrate (111);
and forming a second packaging part (150) at the second supporting position (220), wherein the second packaging part (150) is respectively in direct contact with the side surfaces of the first supporting substrate (111), the first packaging part (140) and the packaging layer (130).
11. The method for manufacturing a display panel according to claim 10, further comprising:
forming a third support substrate (113) on a surface of the second support substrate (112) remote from the first support substrate (111), wherein the third support substrate (113) has a third support location (230) that is not covered by the second support substrate (112);
forming the encapsulation layer (130) at the third support location (230), wherein the encapsulation layer (130) is in direct contact with the third support substrate (113), the second encapsulation part (150), the first encapsulation part (140) and the display device layer (120), respectively.
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