CN110741622A - Electronic device including light emitting and light receiving modules adjacent to a display and method of operation - Google Patents
Electronic device including light emitting and light receiving modules adjacent to a display and method of operation Download PDFInfo
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- CN110741622A CN110741622A CN201880039729.6A CN201880039729A CN110741622A CN 110741622 A CN110741622 A CN 110741622A CN 201880039729 A CN201880039729 A CN 201880039729A CN 110741622 A CN110741622 A CN 110741622A
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- H—ELECTRICITY
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- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04101—2.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
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- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
There are electronic devices including a display panel, a light emitting module disposed adjacent to the display panel and configured to output light, and a light receiving module disposed in a portion of the display panel or under or below the display panel and configured to detect light of the output light reflected by an external object.
Description
Technical Field
The present disclosure relates to an electronic device including a light emitting module and a light receiving module arranged adjacent to a display and a method of operating the same.
Background
With the development of digital technology, electronic devices are being provided in various forms such as smart phones, tablet Personal Computers (PCs), Personal Digital Assistants (PDAs), and the like. Electronic devices are being developed in a form that is wearable by a user to enhance portability and accessibility of the user.
The electronic device may include a display to display an image through the display. The display may be a touch sensitive display and the electronic device may detect user input through the display. The electronic device may include various sensors to detect physical quantities, changes in environment, and the like. For example, the sensor may be a light sensor, such as a proximity sensor. The electronic device may perform various functions based on the signals output from the sensors.
The light sensor may include: a light emitting unit for outputting light; and a light receiving unit for receiving light scattered or reflected from the object and generating an electrical signal. The light sensor may be installed in a space (hereinafter, side space) formed outside of a side of the display (or display panel). However, when an electronic device is designed to expand a display while maintaining its size according to a trend toward a large-sized screen, a side space may be reduced, which may make it difficult to mount a light sensor.
The above information is presented merely as background information to aid in understanding the present disclosure. No assertion, nor assertion, is made as to whether any of the above can be used as prior art with respect to the present disclosure.
Disclosure of Invention
Accordingly, an aspect of the present disclosure is to provide a light detecting device of kinds of electronic devices, which can mount at least light emitting units and at least light receiving units without being affected by a reduction in lateral space caused by expansion of a display.
Another aspect of the present disclosure is to provide a light detecting device among kinds of electronic devices, which can install at least light emitting units and at least light receiving units in a limited space of a display while enhancing an influence (influence) between the display and the light detecting device.
Another aspect of the present disclosure is to provide a light detection method in kinds of electronic devices for detecting light associated with a corresponding function (e.g., a function of determining proximity of an object) by selectively using light-emitting units when the light-emitting units having different attributes are mounted in a lateral space.
Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.
According to an aspect of the present disclosure, there are provided electronic devices including a display panel, a th light emitting module disposed adjacent to the display panel and configured to output light, and a light receiving module disposed in a portion of the display panel or under or below the display panel and configured to detect light of the output light reflected by an external object.
According to another aspect of the present disclosure, there is provided a electronic device including a housing, a cover at least partially housed in the housing and having surfaces exposed, a display panel disposed under or below a th area of the cover, a th light emitting module disposed under or below a second area of the cover and configured to output light, and a light receiving module disposed in at least part of the display panel or under or below the display panel and configured to detect light of the output light reflected by an external object.
According to another aspect of the present disclosure, there is provided electronic devices including a display panel, a th light emitting module disposed adjacent to the display panel, a light receiving module disposed in a portion of the display panel or below or beneath the display panel, and a processor configured to output light by using the light emitting module, detect at least portion of the light of at least portion of the light that collides with and is reflected from an external object by using the light receiving module, and determine a distance between the external object and the electronic device based at least on the detection.
Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.
Drawings
The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a block diagram illustrating a network environment system according to an embodiment of the present disclosure;
FIG. 2 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure;
FIG. 3 is a block diagram illustrating program modules according to various embodiments of the present disclosure;
fig. 4A and 4B are views illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display, according to an embodiment of the present disclosure;
fig. 5 is a cross-sectional view illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display, according to an embodiment of the present disclosure;
fig. 6A is a view illustrating a light sensor according to an embodiment of the present disclosure;
fig. 6B is an exploded perspective view illustrating a light sensor according to an embodiment of the present disclosure;
fig. 7 is a cross-sectional view illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display, according to an embodiment of the present disclosure;
fig. 8 is a cross-sectional view illustrating an electronic device including a light-emitting unit and a light-receiving unit of at least light sensors arranged adjacent to a display, in accordance with various embodiments of the present disclosure;
fig. 9 is a cross-sectional view illustrating an electronic device including a light-emitting unit and a light-receiving unit of at least light sensors arranged adjacent to a display, in accordance with various embodiments of the present disclosure;
FIG. 10 is a schematic cross-sectional view illustrating an electronic device including light emitters and light receivers of at least light sensors arranged adjacent to a display in accordance with an embodiment of the present disclosure;
fig. 11A, 11B, 11C, 11D, 12A, 12B, 12C, 12D, 12E, and 12F are sectional views illustrating a manufacturing flow of a printed circuit board of a photosensor according to an embodiment of the present disclosure;
FIG. 13 is a schematic cross-sectional view illustrating a light sensor according to various embodiments of the present disclosure;
FIG. 14 is a schematic cross-sectional view illustrating an electronic device including at least light emitters and at least light receivers arranged adjacent to a display in accordance with an embodiment of the present disclosure;
FIG. 15 is a schematic cross-sectional view illustrating an electronic device including at least light emitters and at least light receivers arranged adjacent to a display in accordance with an embodiment of the present disclosure;
FIG. 16 is a schematic cross-sectional view illustrating an electronic device including at least light emitters and at least light receivers arranged adjacent to a display in accordance with an embodiment of the present disclosure;
fig. 17A is a view of an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, as viewed from the front, in accordance with an embodiment of the present disclosure;
FIG. 17B is a cross-sectional view of an electronic device corresponding to A-A of FIG. 17A, in accordance with an embodiment of the present disclosure;
fig. 18A is a view of an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, as viewed from the front, in accordance with an embodiment of the present disclosure;
FIG. 18B is a cross-sectional view of an electronic device corresponding to B-B of FIG. 18A, in accordance with embodiments of the present invention;
fig. 19A is a view of an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, as viewed from the front, in accordance with an embodiment of the present disclosure;
FIG. 19B is a cross-sectional view of an electronic device corresponding to C-C of FIG. 19A, in accordance with embodiments of the present invention;
fig. 20 is a cross-sectional view showing portions of an electronic device including at least phototransmitters and at least photoreceivers of at least photosensors arranged adjacent to a display, in accordance with an embodiment of the present disclosure;
21A, 21B, 21C, and 21D are cross-sectional views illustrating electrical connection structures between layers according to various embodiments of the present disclosure;
fig. 22 is a block diagram illustrating an electronic device including a light-emitting unit and a light-receiving unit of at least light sensors arranged adjacent to a display, in accordance with an embodiment of the present disclosure;
fig. 23 is a view showing an operation flow of an electronic apparatus including a display providing a proximity recognition function according to an embodiment of the present disclosure; and
fig. 24 and 25 are views illustrating the operational flow of fig. 23 according to various embodiments of the present disclosure.
Throughout the drawings, like reference numerals will be understood to refer to like parts, components and structures.
Detailed Description
The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these specific details are to be considered exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.
Thus, it will be apparent to those skilled in the art that the following description of the various embodiments of the present disclosure is provided for illustration only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.
Thus, for example, reference to "a component surface" includes reference to or more such surfaces.
The term "substantially" means that the recited characteristic, parameter or value need not be achieved exactly, but that deviations or variations including, for example, tolerances, measurement error, measurement accuracy limitations and other factors known to those skilled in the art may occur within a range that does not preclude the amount of effect that the characteristic is intended to provide.
Depending on the circumstances, at a hardware or software level, the term "configured (or set.)" as used in this disclosure may be used interchangeably with the terms "adapted to … …", "having … … capabilities", "adapted to … …", "enabling … …", "… …", or "designed to" in some cases, the term "device configured.. may refer to a" device capable.. having other devices or components ", e.g.," a processor configured (set) to perform A, B and C "may refer, for example and without limitation, to a dedicated processor (e.g., an embedded processor) or a general-purpose processor (e.g., a Central Processing Unit (CPU) or Application Processor (AP)), or the like, for performing respective operations by executing or more software programs stored in a memory device.
Electronic devices according to various embodiments of the present disclosure may include at least of a smart phone, a tablet Personal Computer (PC), a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), a moving Picture experts group phase 1 or phase 2(MPEG-1 or MPEG-2) Audio layer 3 (MP3) player, a medical device, a camera, or a wearable device, among others, but are not limited theretoTM、Apple TVTMOr Google TVTM) Game machine (e.g. Xbox)TMAnd PlayStationTM) An electronic dictionary, an electronic key, a camcorder, an electronic photo frame, etc., but not limited thereto.
According to embodiments of the present disclosure, the electronic device may include at least medical devices (e.g., various portable medical measurement devices (e.g., blood glucose monitoring devices, heartbeat measurement devices, blood pressure measurement devices, body temperature measurement devices, etc.), Magnetic Resonance Angiography (MRA), Magnetic Resonance Imaging (MRI), Computed Tomography (CT), scanners and ultrasound devices), navigation devices, Global Navigation Satellite Systems (GNSS), Event Data Recorders (EDR), Flight Data Recorders (FDR), vehicle information entertainment devices, marine electronics (e.g., navigation systems and gyrocompass), avionics, security devices, vehicle head units, industrial or domestic robots, drones, financial institution Automated Teller Machines (ATM), point of sale (POS) or points of sale (e.g., light bulbs, various sensors, sprinkler devices, fire fighting devices, water heaters, street lights, toasters, appliances, hot water tanks, heaters, boilers, etc.), among other various embodiments, such as but not limited to the use of the electronic meter, etc.).
Fig. 1 is a block diagram illustrating a network environment system according to an embodiment of the present disclosure.
Referring to FIG. 1, an electronic device 101 in a network environment 100 is shown according to various example embodiments, the electronic device 101 may include a bus 110, a processor 120, a memory 130, an input/output interface 150, a display 160, and a communication interface 170. according to embodiments of the present disclosure, the electronic device 101 may not include at least of the above-described elements, or may also include other elements.
According to embodiments of the present disclosure, memory 130 may include volatile memory and/or non-volatile memory, memory 130 may store commands or data associated with at least other elements of electronic device 101 according to embodiments of the present disclosure, memory 130 may store software and/or programs 140, programs 140 may include, for example, kernel 141, middleware 143, Application Programming Interface (API)145, and/or application programs (or applications) 147. at least portion of kernel 141, middleware 143, or API 145 may be referred to as an "Operating System (OS)", kernel 141 may control or manage system resources (e.g., bus 110, processor 120, memory 130, etc.) for performing operations or functions of other programs (e.g., middleware 143, API 145, or application programs 147). further, kernel 141 may provide an interface that allows middleware 143, API 145, or application programs to access discrete elements 147 of electronic device 101 in order to control or manage system resources.
In accordance with embodiments of the present disclosure, the application programs 147 may include a proximity recognition application for recognizing a proximity distance of an object (or an external object) by using a light detection device (or a light sensor) (not shown). According to various embodiments of the present disclosure, the applications 147 may include an object analysis application for analyzing an object by using a light detection device (or light sensor) (e.g., a spectral sensor). For example, an object analysis application may obtain information about skin moisture, skin melanin, or erythema on the user's skin by using a light detection device.
According to embodiments of the present disclosure, the wireless communication may include at least of Wi-Fi, optical fidelity (Li-Fi), Bluetooth Low Energy (BLE), Zigbee, Near Field Communication (NFC), magnetically secure transmission, Radio Frequency (RF), or Body Area Network (BAN), as indicated by reference numeral 164 in FIG. 1, according to embodiments of the present disclosure, the wireless communication may include, for example, Global navigation satellite System (GPS), Global navigation satellite System (Glonass), Beidou navigation satellite System (hereinafter "Beidou") or Galileo, i.e., European Global navigation satellite System ("GNSS"), according to embodiments of the present disclosure, "GPS" and "GNSS" may include, for example, Global Positioning System (GPS), Global navigation satellite System (Glonass), Beidou navigation satellite System (hereinafter "Beidou") or Galileo, i.e., European Global navigation System, GPS-based navigation System, hereinafter, "GPS" and "GNSS" may be used in embodiments of the present disclosure, include, at least, for example, plain world Wide area network communications (Internet) 232), or general Internet communications may include, such as, at least 36232, 232, or 36, e.g., USB, 35, or USB, and/USB, or USB, communication, or USB, or the like, communication may include, for example, communication in an example, a wireless communication network, according to the like.
According to various embodiments of the present disclosure, when the electronic device 101 should perform any function or service automatically or in response to a request, the electronic device 101 may not perform that function or service internally, but instead or additionally, it may request at least portion of the functionality associated with the electronic device 101 at other devices (e.g., the external electronic device 102, the second external electronic device 104, or the server 106), another electronic device (e.g., the second external electronic device 102, the second external electronic device 104, or the server 106) may perform the requested function or additional functionality, and may send the results of the execution to the electronic device 101, or may provide the results to the computing device 101 using the distributed computing service, or may provide the results to a computing point , for example, to receive a computing request using a computing point.
Fig. 2 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure.
Referring to fig. 2, the electronic device 201 may include, for example, all or portions of the electronic device 101 shown in fig. 1 the electronic device 201 may include or more processors 210 (e.g., APs), a communication module 220, a subscriber identification module 224, a memory 230, a sensor module 240, an input device 250, a display 260, an interface 270, an audio module 280, a camera module 291, a power management module 295, a battery 296, an indicator 297, and a motor 298.
According to embodiments of the present disclosure, processor 210 may also include a Graphics Processing Unit (GPU) and/or an Image Signal Processor (ISP). processor 210 may include at least portions of the elements shown in fig. 2 (e.g., cellular module 221). processor 210 may load and process commands or data received from at least of the other elements at volatile memory (e.g., non-volatile memory) and may store the resulting data in non-volatile memory.
The communication module 220 may be configured the same as or similar to the communication interface 170. the communication module 220 may include, for example, a cellular module 221, a Wi-Fi module 223, a bluetooth module 225, a GNSS module 227, an NFC module 228, and an RF module 229. the cellular module 221 may provide, for example, voice communication, video communication, messaging services, internet services, etc. over a communication network according to embodiments of the present disclosure, the cellular module 221 may perform, for example, using a subscriber identification module 224 (e.g., a SIM card) to perform discrimination and authentication of electronic devices 201 within the communication network. according to embodiments of the present disclosure, the cellular module 221 may perform at least a portion of the functions provided by the processor 210. according to embodiments of the present disclosure, the cellular module 221 may include a cp. according to embodiments of the present disclosure, the cellular module 221, the Wi-Fi module 223, the bluetooth module 225, the bluetooth module 227, and at least a portion (e.g., two or more) of the NFC module 228 may be contained in integrated chips (ICs ) or IC packages.
The memory 230 (e.g., memory 130) may include internal memory 232 or external memory 234, for example, the internal memory 232 may include at least of volatile memory (e.g., Dynamic Random Access Memory (DRAM), static ram (sram), or synchronous DRAM (sdram)), and non-volatile memory (e.g., time programmable read only memory (OTPROM), programmable ROM (prom), erasable programmable ROM (eprom), electrically erasable programmable ROM (eeprom), mask ROM, flash memory, hard disk drive, or Solid State Drive (SSD)), the external memory 234 may include a flash memory drive, e.g., Compact Flash (CF), Secure Digital (SD), micro SD, mini SD, extreme digital (xD), multimedia card (MMC), memory stick, etc. the external memory 234 may be functionally or physically connected to the electronic device 201 by various interfaces.
The sensor module 240 may measure, for example, a physical quantity or may detect an operational state of the electronic device 201 and may convert the measured or detected information into an electrical signal, the sensor module 240 may include, for example, at least of the gesture sensor 240A, the gyroscope sensor 240B, the barometer sensor 240C, the magnetic sensor 240D, the acceleration sensor 240E, the grip sensor 240F, the proximity sensor 240G, the color sensor 240H (e.g., a red, green, blue (RGB) sensor), the biosensor 240I, the temperature/humidity sensor 240J, the illuminance sensor 240K, or the Ultraviolet (UV) sensor 240M. additionally or alternatively, the sensor module 240 may include, for example, an E-nose sensor, an electromyogram sensor (EMG) sensor, an electroencephalogram (EEG) sensor, an Electrocardiogram (ECG) sensor, an Infrared (IR) sensor, an iris sensor, and/or a fingerprint sensor 240M. the sensor module 240 may also include control circuitry for controlling at least sensors included therein.
According to various embodiments of the present disclosure, a light receiving unit of at least light sensors may be disposed below or under a display area, or inside the display area or on a layer forming the display area, a light receiving unit of at least light sensors may be disposed on at least portions of a rear surface of the display 260, at least portions of the display 260 may be designed to allow light to penetrate, a light emitting unit (or a light source) of at least light sensors may be disposed in a side space of the display 260 or below or under the side space, light (or a light signal) scattered or reflected from an object may pass through the display 260 and enter the light receiving unit, and the light receiving unit may generate an electrical signal (or a digital value) based on the received light, light output from the light emitting unit may pass through a portion vertically aligned with the light emitting unit (e.g., a housing having a light transmittance higher than that of the display 260), and may be released to the outside.
According to an embodiment of the present disclosure, the electronic device 201 may include a light blocking element (not shown) to reduce an electrical impact of the light output from the light emitting unit on the display 260. According to an embodiment of the present disclosure, the light blocking element may be disposed inside the display 260. Since the light blocking member prevents light (or light energy) output from the light emitting unit of the light sensor from entering the display 260, malfunction (e.g., spots) of the display 260 due to the light output from the light emitting unit of the light sensor can be prevented.
According to an embodiment of the present disclosure, in a proximity detection mode using the proximity sensor 240G, the processor 210 may enhance power consumption of the electronic device 201 by adjusting light output power levels of at least light sources of the proximity sensor 240G, for example, the light blocking element may prevent light output from the light emitting cells from entering a portion (e.g., a Thin Film Transistor (TFT)) of the display 260, when the electronic device 201 is designed to have the light blocking element, the light output power value of the light emitting cells may be set to a relatively high fixed value as compared to a case where the electronic device 201 is designed not to have the light blocking element.
The input device 250 may include a touch panel 252, a (digital) pen sensor 254, keys 256, or an ultrasonic input device 258 the touch panel 252 may use at least of capacitive, resistive, infrared, or ultrasonic detection methods additionally, the touch panel 252 may also include control circuitry the touch panel 252 may also include a tactile layer to provide a tactile response to a user the (digital) pen sensor 254 may be, for example, the portion of the touch panel, or may include additional sheets for identification the keys 256 may include, for example, physical buttons, optical keys, or a keypad the ultrasonic input device 258 may detect ultrasonic waves generated from the input tool through a microphone (e.g., microphone 288) and may identify data corresponding to the detected ultrasonic waves.
Display 260 (e.g., display 160) may include a panel 262 (or display panel), a holographic device 264, a projector 266, and/or control circuitry for controlling the aforementioned elements panel 262 may be implemented as flexible, transparent, or wearable panel 262 and touch panel 252 may be integrated into or more modules according to embodiments of the present disclosure panel 262 may include a pressure sensor (or force sensor) for measuring the pressure intensity of a user's touch, pressure sensors may be integrated into touch panel 252, or may be implemented with or more sensors separate from touch panel 252 hologram device 264 may display a stereoscopic image in space using optical interference phenomena projector 266 may project light onto a screen to display an image, the screen may be disposed internal or external to electronic device 201, interface 270 may include HDMI 272, USB274, optical interface, or D-sub 278. interface 270 may include, for example, in communication interface 170 shown in fig. 1 interface 270, interface 270 may additionally or alternatively include, high definition interface 270 may include, such as mobile high definition (MHL) link data association (MMC) or infrared (D-sub) interfaces 276.
Audio module 280 may convert sound and electrical signals in both directions, at least portions of audio module 280 may be included in input/output interface 150, such as shown in fig. 1, audio module 280 may process sound information input or output, such as through speaker 282, receiver 284, headset 286, or microphone 288, camera module 291 may be a device, such as for capturing still images or video, and according to embodiments of the present disclosure, camera module 291 may include, for example, or more image sensors (e.g., front or rear sensors), a lens, an ISP, or a flash (e.g., LED or xenon lamp), power management module 295 may manage, for example, a power supply of electronic device 201, according to embodiments of the present disclosure, power management module 295 may include a Power Management Integrated Circuit (PMIC), a charger IC, or a battery or electricity meter (fuel gauge), PMIC may have a wired charging method and/or a wireless charging method.
The indicator 297 may display a particular state of the electronic device 201 or portions thereof (e.g., the processor 210), such as a boot state, a message state, a charge state, etc. the motor 298 may convert the electrical signalFor example, the electronic device 201 may include a processor for playing in accordance with digital multimedia (DMB), digital video (DVB), MediaFloTMEtc. each of the elements described in various embodiments of the present disclosure may be configured with or more components, and the names of the elements may vary depending on the type of electronic device, elements of an electronic device (e.g., electronic device 201) may be omitted, or other additional elements may be added, according to various embodiments of the present disclosure, elements may be combined with each other to form entities, and the functions of the elements may be performed in the same manner as before the combination.
Fig. 3 is a block diagram illustrating program modules according to various embodiments of the present disclosure.
Referring to fig. 3, program modules 310 (e.g., program 140) may include an OS to control resources of an electronic device (e.g., electronic device 101) and/or various applications (e.g., application program 147) executable in the OS according to an embodiment of the present disclosure. The OS may include, for example, AndroidTM、iOSTM、WindowsTM、SymbianTM、TizenTMOr BadaTM。
Referring to fig. 3, program modules 310 may include a kernel 320 (e.g., kernel 141), middleware 330 (e.g., middleware 143 of fig. 1), an API 360 (e.g., API 145 of fig. 1), and/or an application 370 (e.g., application 147 of fig. 1). at least portion of program modules 310 may be preloaded on an electronic device or may be downloaded from an external electronic device (e.g., external electronic device 102, second external electronic device 104, or server 106 of fig. 1).
The kernel 320 may include, for example, a system resource manager 321 and/or a device driver 323 the system resource manager 321 may control, allocate, or collect system resources according to embodiments of the present disclosure, the system resource manager 321 may include a process manager, a memory manager, or a file system manager the device driver 323 may include, for example, a display driver, a camera driver, a Bluetooth driver, a shared memory driver, a USB driver, a keypad driver, a Wi-Fi driver, an audio driver, or an inter-process communication (IPC) driver the middleware 330 may provide functionality that is commonly required by the application 370, or may provide various functionality to the application 370 through an API 360 such that the application 370 may use limited system resources in an electronic device according to embodiments of the present disclosure, the middleware 330 may include at least of a runtime library 335, an application manager 341, a window manager 342, a multimedia manager 343, a resource manager 344, a power manager 345, a database manager 346, a package manager 347, a connectivity manager 348, a notification manager 349, a location manager 350, a graphics manager 351, or a security manager 352.
For example, runtime library 335 may include a library module that the compiler uses to add new functionality through the programming language when executing application program 370. Runtime library 335 may perform input/output management, memory management, or arithmetic functions. For example, the application manager 341 may manage a lifecycle of the application 370. The window manager 342 may manage GUI resources used on the screen. The multimedia manager 343 may, for example, recognize a format to be used for playing a media file, and may encode or decode the media file using a codec suitable for the corresponding format. Resource manager 344 may manage the storage space of the source code or memory of application 370. The power manager 345 may, for example, manage the capacity, temperature, or power of the battery and determine or provide power information to be used for operation of the electronic device based on corresponding information of the capacity, temperature, or power of the battery. According to embodiments of the present disclosure, the power manager 345 may interwork with a basic input/output system (BIOS). The database manager 346 may generate, search, or change a database to be used by the application 370. The package manager 347 may manage installation or update of an application distributed in the form of a package file.
The connectivity manager 348 may manage wireless connections, for example. The notification manager 349 may provide events, such as received messages, appointments, or notifications of proximity, for example, to a user. Location manager 350 may, for example, manage location information on an electronic deviceMiddleware 330 may include a telephony manager to manage voice or video telephony functions of an electronic device, or a middleware module to form a combination of various functions of the above elements, according to embodiments of the present disclosure middleware 330 may provide modules customized according to the kind of OS, middleware 330 may dynamically delete portions of existing elements or may add new elements, API 360 may be, for example, sets of API programming functions, and may be provided in different configurations according to the OSTMIn this case, two or more API sets may be provided for each platform.
The applications 370 may include, for example, a home application 371, a dialer application 372, a Short Message Service (SMS)/Multimedia Messaging Service (MMS) application 373, an Instant Messaging (IM) application 374, a browser application 375, a camera application 376, an alert application 377, a contacts application 378, a voice dialing application 379, an email application 380, a calendar application 381, a media player application 382, an album application 383, a watch application 384, a healthcare (e.g., for measuring exercise levels or blood glucose) or environmental information (e.g., for measuring barometric pressure, humidity, or temperature information) application, according to embodiments of the present disclosure, the applications 370 may also include an information exchange application capable of supporting information exchange between the electronic device and an external electronic device, the information exchange application may include, for example, a notification relay application adapted to transmit specified information to the external electronic device or a device management application adapted to manage the external electronic device, the notification relay application may transmit notification information occurring at another application of the electronic device to the external electronic device, additionally or alternatively, the relay application may receive notification information from the external electronic device and provide the notification to the external device (e.g., a display application) or a display application, or a display application, which may be implemented according to an electronic device, a plurality of an electronic device, and which may include, a display module, a display application, a display module, e.g., an electronic device, a mobile device, a display application, a mobile device, a mobile.
As used herein, the term "module" may include units comprising hardware, software, or firmware, and may be used interchangeably with the terms "logic," "logic block," "component," or "circuitry," for example, "module" may be an integrally configured component or minimal unit for performing or more functions or portions thereof, "module" may be implemented mechanically or electronically, for example, "module" may include a known or yet to be developed application specific ic (asic) chip, a field programmable array (FPGA), and a programmable logic device for performing operations.
Fig. 4A and 4B are views illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display according to an embodiment of the present disclosure.
According to various embodiments of the disclosure, electronic device 400 may include at least portions of electronic device 101 of fig. 1 or electronic device 201 of fig. 2.
Referring to fig. 4A and 4B, in embodiments of the present disclosure, electronic device 400 may include a housing 410 that forms an entirety of, or at least an portion of, an exterior of electronic device 400.
According to embodiments of the present disclosure, the housing 410 may form an exterior including an th surface 4001, a second surface 4002, and a third surface 4003. the th surface 4001 may substantially face the th direction 40011. the second surface 4002 may substantially face a second direction 40021 opposite the th direction 40011. the third surface 4003 may be a surface (e.g., a side surface) surrounding between the th surface 4001 and the second surface 4002.
According to an embodiment of the present disclosure, the case 410 may include a th cover (or th plate) 410-1 forming the th surface 4001 and a second cover (or second plate) 410-2 forming the second surface the case 410 may include a side member 410-3 surrounding a space between the th cover 410-1 and the second cover 410-2 the side member 410-3 may form the third surface 4003.
According to embodiments of the present disclosure, the th cover 410-1 may be substantially rectangular including a th edge 415-1, a second edge 415-2, a third edge 415-3, and a fourth edge 415-4. for example, the th edge 415-1 and the second edge 415-2 may face each other and may be parallel to each other. the third edge 415-3 and the fourth edge 415-4 may face each other and may be parallel to each other. according to various embodiments of the present disclosure, the distance between the th edge 415-1 and the second edge 415-2 may be longer than the distance between the third edge 415-3 and the fourth edge 415-4. according to various embodiments of the present disclosure, although not shown, the connection portion between the th edge 415-1 and the third edge 415-3, the connection portion between the th edge 415-1 and the fourth edge 415-4, the connection portion between the second edge 415-2 and the third edge 415-3, or the connection portion between the second edge 415-2 and the fourth edge 415-4 may be circular.
According to various embodiments of the present disclosure, an area (or edge area) (not shown) of the lid 410-1 adjacent (e.g., about 10mm or less) to the edge 415-1, the second edge 415-2, the third edge 415-3, or the fourth edge 415-4 can be designed to have a curved shape.
According to embodiments of the present disclosure, the second cover 410-2 may be disposed opposite the th cover 410-1, according to embodiments of the present disclosure, the second cover 410-2 may be substantially symmetrical to the th cover 410-1 the second cover 410-2 may be substantially rectangular, including a fifth edge 415-5 corresponding to the th edge 415-1, a sixth edge 415-6 corresponding to the second edge 415-2, a seventh edge 415-7 corresponding to the third edge 415-3, and an eighth edge 415-8 corresponding to the fourth edge 415-4.
According to embodiments of the present disclosure, the side member 410-3 may include a frame 410-31 coupled between the th edge 415-1 and the fifth edge 415-5, a second frame 410-32 coupled between the second edge 415-2 and the sixth edge 415-6, a third frame 410-33 coupled between the third edge 415-3 and the seventh edge 415-7, and a fourth frame 410-34 coupled between the fourth edge 415-4 and the eighth edge 415-8. according to various embodiments of the present disclosure, a connection portion between the th frame 410-31 and the third frame 410-33, a connection portion between the th frame 410-31 and the fourth frame 410-34, a connection portion between the second frame 410-32 and the third frame 410-33, or a connection portion between the second frame 410-32 and the fourth frame 410-34 may be circular.
According to various embodiments of the present disclosure, the side member 410-3 may include an extension portion (e.g., a middle plate) extending from at least of the th frame 410-31, the second frame 410-32, the third frame 410-33, and the fourth frame 410-34 toward a space (not shown) formed between the th cover 410-1 and the second cover 410-2.
According to various embodiments of the present disclosure, at least portion of the side member 410-3 may comprise a conductive material, according to various embodiments of the present disclosure, at least of the th, second, third, or fourth frames 410-31, 410-32, 410-33, 410-34 of the side member 410-3 may comprise a plurality of metal portions that are physically separated from one another.
The electronic device 400 may include various elements disposed, for example, between the th cover 410-1 and the second cover 410-2 according to an embodiment of the present disclosure, the electronic device 400 may include a display (not shown) (e.g., the panel 262 of fig. 2) disposed between the th cover 410-1 and the second cover 410-2, the display may include a light emitting unit (e.g., OLED) including a plurality of pixels, and may be exposed to the outside through the th cover 410-1.
According to an embodiment of the present disclosure, a display may be disposed along at least portion of the th cover 410-1 the th cover 410-1 may include a th region 460 that is a region covering the display and a second region 470 (e.g., a bezel region) that is a region not covering the display the th region 460 may be a region through which light generated from the display passes.
According to an embodiment of the present disclosure, the th region 460 may be substantially rectangular including an a-edge 460-1 (e.g., about 10mm or less) adjacent to the th edge 415-1, a b-edge 460-2 adjacent to the second edge 415-2, a c-edge 460-3 adjacent to the third edge 415-3, and a d-edge 460-4 adjacent to the fourth edge 415-4. the second region 470 (hereinafter, a bezel region) may have a rectangular ring shape surrounding the th region 460. the bezel region 470 may include a th bezel region 470-1 disposed between the th edge 415-1 and the a-edge 460-1, a second bezel region 470-2 disposed between the second edge 415-2 and the b-edge 460-2, a third bezel region 470-3 disposed between the third edge 415-3 and the c-edge 460-3, and a fourth bezel region 470-4 disposed between the fourth edge 415-4 and the d-edge 460-4.
The bezel area 470 may be designed to have a different color than the area 460, for example, the bezel area 470 may have a dark color, such as black, or may have a color similar or the same as the color of the side member 430-3.
The th region 460 of the th cover 410-1 and the display may be defined as a "display region" according to embodiments of the present disclosure the display region may be designed to also include various components (e.g., layers) (not shown) coupled to the th cover 410-1 or the display.
According to an embodiment of the present disclosure, the light receiving unit (or light receiving module) of at least light sensors may be disposed under or under the display area, or inside the display area or on a layer forming the display.
In the present disclosure, at least sensors may be an illuminance sensor 240K, RGB sensor 240H, UV sensor 240M, a proximity sensor 240G, or a posture sensor 240A of the sensor module 240 of fig. 2.
According to embodiments of the present disclosure, light (or optical signal) scattered or reflected from an object (or external object) may pass through the display region and enter the light receiving units of at least photosensors.
In an embodiment of the present disclosure, at least light emitting units of the light sensors may be arranged in a space other than the display area (e.g., a lateral space of the display area) or below the space.
In an example of the present disclosure, at least portions of light output from light emitting units of at least photo sensors may pass through a display region and may be discharged to the outside, in an assumption of an example that the light emitting units of the at least photo sensors are designed to be disposed below or under the display region (although not shown), when light transmittance of the display region is low (e.g., about 20% or less), light output from the light emitting units of at least photo sensors may pass through the display region but may not be discharged to the outside more than a designed amount of light.
In an assumption of an example in which the light receiving units and the light emitting units of at least light sensors are each disposed in a space other than the display area (for example, a side space of the display area) or below or under the space (although not shown), the side space of the display area should be designed to have a width for the light receiving units and the light emitting units.
According to an embodiment of the present disclosure, the th bezel region 470-1 or the second bezel region 470-2 may be designed to be wider than the width of the third bezel region 470-3 or the fourth bezel region 470-4 according to an embodiment of the present disclosure, a light emitting unit of at least light sensors may be mounted at a position aligned with the th bezel region 470-1 or the second bezel region 470-2 of the bezel region 470.
According to various embodiments of the present disclosure, the th cover 410-1 may include at least light penetration regions or penetration holes 493 formed in positions aligned with the light emitting cells of at least photosensors light output from the light emitting cells of at least photosensors may be released to the outside through the light penetration regions or penetration holes 493.
According to various embodiments of the present disclosure, the th cover 410-1 may further include an additional light penetration region or hole formed at a position aligned with the light emitting cell of the other light sensor, although not shown.
According to various embodiments of the present disclosure, the touch panel can be a digitizer panel (e.g., pen sensor 254 of FIG. 2) that supports touch or hover input using a stylus.
According to various embodiments of the present disclosure, the electronic device 400 may include various other electronic components (hereinafter referred to as " side components") mounted in a position aligned with the th bezel region 470-1.
According to various embodiments of the present disclosure, the th side assembly may include light emitting elements (not shown) (e.g., LEDs) that indicate various states of the electronic device 400, e.g., when the remaining capacity of the battery is low, the electronic device 400 may display respective colors through the light emitting elements, e.g., when the screen is closed, the electronic device 400 may display respective colors through the light emitting elements, e.g., when the electronic device 400 is connected to a wired charger or a wireless charger, the electronic device 400 may display respective colors through the light emitting elements, according to embodiments of the present disclosure, the th cover 410-1 may include light penetrating regions or holes 492 formed in positions aligned with the light emitting elements, according to various embodiments of the present disclosure, the light emitting elements or light penetrating regions or holes 492 thereof may be omitted from the electronic device 400 when the electronic device 400 is designed to display various states of the electronic device 400 through the display.
According to various embodiments of the present disclosure, the th side assembly may include a receiver 481 to output a voice signal received from another device as sound during communication, the th cover 410-1 may include a penetration hole 491 formed in a position aligned with the receiver 481, the receiver 481 may be coupled to the penetration hole 491.
According to various embodiments of the present disclosure, the th side assembly may include at least cameras (e.g., front facing cameras) (e.g., camera module 291 of fig. 2.) the th cover 410-1 may include light penetration regions or holes 495 formed in locations aligned with at least cameras.
According to various embodiments of the present disclosure, the penetration holes 491 for the receiver 481 may be disposed between the light penetration regions 493 for at least light sensors and the light penetration regions or penetration holes 495 for the camera when viewed from the second direction 40021 according to various embodiments of the present disclosure, the light penetration regions 493 for at least sensors may be disposed between the light penetration regions 492 for the light emitting elements and the penetration holes 491 for the receiver 481 when viewed from the second direction 40021.
According to various embodiments of the present disclosure, the electronic device 400 may display a software home button 471 through the display, a control circuit (e.g., the processor 120 of FIG. 1 or the processor 210 of FIG. 2) may display the software home button 471 in the vicinity of the second bezel area 470-2 (e.g., within about 20mm from the second bezel area 470-2), the software home button 471 may be displayed in the middle of the th area 460 between the c-edge 460-3 and the d-edge 460-4, although not shown, the control circuit may display the software home button 471 in various other locations, according to various embodiments of the present disclosure, the control circuit may determine the display location of the software home button 471 according to user environment settings (user preferences), executed applications (or modes), and the like.
When the software home button 471 is selected by a touch input or a hover input, the control circuitry (e.g., the processor 120 of FIG. 1 or the processor 210 of FIG. 2) may display a main home screen through the display, the main home screen may be an th screen displayed on the display when power to the electronic device 400 is turned on, the main home screen may include icons for executing applications, time, weather, etc. when multiple home screens are provided in the form of switchable pages, the home screen may display a state of the electronic device 400, such as a battery charge state, a strength of a received signal, or a current time, according to various embodiments of the present disclosure.
According to various embodiments of the present disclosure, when the electronic device is designed to have the extended second bezel region 470-2, the electronic device 400 may include various electronic components (hereinafter referred to as "second side components") mounted in a position aligned with the second bezel region 470-2. According to embodiments of the present disclosure, the second side component may include a hardware home button (not shown). The hardware home button may replace the software home button.
According to various embodiments of the present disclosure, the side member 410-3 may include through holes for various electronic components. According to embodiments of the present disclosure, the side member 410-3 may include a through hole 481 aligned with the speaker, a through hole 482 aligned with the microphone, a through hole aligned with the connector (e.g., through hole 483 for a USB connector, through hole 484 for a plug), a through hole 485 for inserting a stylus, or through holes 486, 487 for mounting buttons 4861, 4871.
According to various embodiments of the present disclosure, the second cover 410-2 may include penetration holes for various electronic components. According to embodiments of the present disclosure, the second cover 410-2 may include a through hole 488 to which a camera (or rear camera) 4881 is coupled, or a flash 4891 or light sensor (e.g., a through hole 489 to which a heart rate measurement sensor 4892 is coupled).
According to various embodiments of the present disclosure, the electronic device 400 may further include various elements (or modules) according to its form of provision. Such elements may change their form in various ways according to the convergence tendency of the digital device, and the device may further include elements having the same levels as the above-described elements (e.g., various elements of fig. 2), although not all of them are listed here. According to various embodiments of the present disclosure, the electronic device 400 may omit certain elements of the above-described elements or replace them with other elements according to its providing form.
Fig. 5 is a cross-sectional view illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display, according to an embodiment of the present disclosure.
Referring to fig. 5, electronic device 500 of fig. 5 may include at least portion of electronic device 101 of fig. 1, electronic device 201 of fig. 2, or electronic device 400 of fig. 4A, in accordance with various embodiments of the present disclosure.
Referring to FIG. 5, in embodiments of the present disclosure, an electronic device 500 may include a housing 510 forming an entirety or at least portion of an exterior of the electronic device 500. according to various embodiments of the present disclosure, the housing 510 may include non-metallic materials and/or metallic materials. for example, the housing 510 may be formed from materials such as plastic, metal, carbon fiber and other fiber composite materials, ceramic, glass, wood, or combinations of these materials.
According to embodiments of the present disclosure, housing 510 (e.g., 410 of FIG. 4A or 4B) may form an exterior including th surface 5001 (e.g., 4001 of FIG. 4A), second surface 5002 (e.g., 4002 of FIG. 4B) and third surface 5003 according to embodiments of the present disclosure, housing 510 may include th cover 510-1 forming th surface 5001 and second cover 510-2 forming second surface 5002 housing 510 may include side members 510-3 surrounding a space between th cover 510-1 and second cover 510-2 and forming third surface 5003 th cover 510-1, second cover 510-2 and side members 510-3 may be similar to or identical to th cover 410-1, second cover 410-2 and side members 410-3 of FIG. 4A, respectively.
According to embodiments of the present disclosure, the end 510-31 of the side member 510-3 may be coupled to the edge 515 of the th cover 510-1 (e.g., the edge 415-1, 415-2, 415-3, or 415-4 of the th cover 410-1 of fig. 4A.) the other end 510-32 of the side member 510-3 may be coupled to the edge 516 of the second cover 510-2 (e.g., the edge 415-5, 415-6, 415-7, or 415-8 of the second cover 410-2 of fig. 4B.) for example, the electronic device 500 may include an adhesive material disposed between the end 510-31 of the side member 510-3 and the edge 515 of the th cover 510-1 or between the other end 510-32 of the side member 510-3 and the edge 516 of the second cover 510-2.
For example, the thickness of the -th cap 510-1 or the second cap 510-2 may be uniform, and the -th cap 510-1 or the second cap 510-2 may be a plate extending in a third direction (e.g., 40031 of fig. 4B) perpendicular to the -th direction 50011 (e.g., 40011 of fig. 4B) or the second direction 50021 (e.g., 40021 of fig. 4A).
For example, when an A element, a B element, and a C element are arranged sequentially in second direction 50021, it can be defined as "the A element is arranged above the B element, and the C element is arranged below or below the B element"
According to embodiments of the present disclosure, the electronic device 500 may include a display 530 (e.g., the display 160 of fig. 1 or the display 260 of fig. 2) disposed between the th cover 510-1 and the second cover 510-2 the display 530 may include a panel (e.g., the panel 262 of fig. 2) extending along at least a portion of the th cover 510-1, e.g., the display 530 may include a display th surface 5301 facing the th direction 50011, a display second surface 5032 facing the second direction 50021, and a display third surface (or side) 5303 facing the third direction 50031.
According to embodiments of the present disclosure, the display 530 may be coupled to the th cover 510-1. for example, the electronic device 500 may include various adhesive materials 540 disposed between the display 530 and the th cover 510-1. for example, the adhesive materials 540 may be designed to cover at least portions of the th surface 5301. according to various embodiments of the present disclosure, the adhesive materials 540 may include a light transmissive material (e.g., an Optically Clear Adhesive (OCA)).
According to an embodiment of the present disclosure, the th cover 510-1 may include a th region 510-11 (e.g., 460 of fig. 4A) covering the display 530. light output from the display 530 may pass through the th region 510-11 and may be released to the outside the th cover 510-1 may include a second region 510-12 (e.g., 470 of fig. 4A) in addition to the th region 510-11. the second region 510-12 may be disposed over a space 5009 between the display 530 and the side member 510-3.
According to an embodiment of the present disclosure, the display 530 may include a plurality of layers. Display 530 may include a display panel (e.g., panel 262 of fig. 2) having a light emitting unit including a plurality of pixels, and layers of various materials coupled to the display panel. According to an embodiment of the present disclosure, the display panel may be an Active Matrix Organic Light Emitting Diode (AMOLED) display panel. According to various embodiments of the present disclosure, the display panel may be various other types of display panels, such as a Passive Matrix Organic Light Emitting Diode (PMOLED).
According to various embodiments of the present disclosure, display 530 may include or more various optical layers (not shown) related to image quality or more optical layers may be polarizing layers, phase difference layers, birefringence compensation layers, anti-glare layers, brightness enhancement layers, vision compensation layers, anti-reflection layers, etc. according to various embodiments of the present disclosure, or more optical layers may be disposed at various locations, such as on, below, or within a display panel.
According to various embodiments of the present disclosure, the display 530 may include th conductive patterns (not shown). th conductive patterns may be used to detect touch inputs or hover inputs according to various embodiments of the present disclosure, th conductive patterns may include, for example, but not limited to, aluminum (Al), copper (Cu), silver (Ag), graphene, Indium Tin Oxide (ITO), indium tin zinc oxide (IZO), and the like.
The electronic device 400 may include touch/hover input detection circuitry (not shown) electrically connected to the th conductive pattern, the touch/hover input detection circuitry may activate at least portion of the th conductive pattern based on a signal from control circuitry (e.g., the processor 120 of FIG. 1 or the processor 210 of FIG. 2). The touch/hover input detection circuitry may detect a signal related to a touch input or hover input through the th conductive pattern and may provide the signal to the control circuitry.
According to various embodiments of the present disclosure, the th conductive pattern may include the touch pad 252 or the pen sensor 254 of fig. 2.
According to various embodiments of the present disclosure, the display 530 may be a touch screen panel on cell (TSP) amoled (octa) panel including an th conductive pattern.
According to various embodiments of the present disclosure, the electronic device 500 may include a second conductive pattern (not shown) disposed along at least portions of the th surface 5001, the second surface 5002, and the third surface 5003 the second conductive pattern may be disposed along at least portions of the display 530 according to various embodiments of the present disclosure, the second conductive pattern may be designed to be disposed at various locations between layers included in the display 530.
According to various embodiments of the present disclosure, the electronic device 500 may include a pressure detection circuit (not shown) electrically connected to the second conductive pattern, according to embodiments of the present disclosure, the pressure detection circuit may activate at least portions of the second conductive pattern based on a signal from a control circuit (e.g., the processor 120 of fig. 1 or the processor 210 of fig. 2), the pressure detection circuit may detect a signal related to pressure through the second conductive pattern and may provide the signal to the control circuit (e.g., the processor 120 of fig. 1 or the processor 210 of fig. 2), for example, the second conductive pattern may include a plurality of electrodes and a plurality of second electrodes, the plurality of electrodes may be disposed on layers and the plurality of second electrodes may be disposed on another layers.
According to various embodiments of the present disclosure, the electronic device 500 may include a third conductive pattern (not shown) disposed along at least portions of the -th surface 5001, the second surface 5002, and the third surface 5003. according to embodiments of the present disclosure, the third conductive pattern may be disposed between the light transmissive substrate (e.g., the -th cover 510-1) and the -th conductive pattern in another example, the third conductive pattern may be disposed between the -th conductive pattern and the display 530 (e.g., the panel 262 of fig. 2).
According to various embodiments of the present disclosure, the third conductive pattern may include a mesh-structured electrode pattern. The electrode pattern of the mesh structure may be defined as a "metal mesh pattern". The metal mesh pattern may include openings. Light generated at the display 530 may be discharged to the outside through the openings of the metal mesh pattern. According to various embodiments of the present disclosure, the metal mesh pattern may have various mesh shapes. The grid shape may be, for example, rectangular, hexagonal, etc. According to various embodiments of the present disclosure, the mesh shape of the metal mesh pattern may be designed to be completely uniform or partially different. According to various embodiments of the present disclosure, the mesh size of the metal mesh pattern may be designed to be completely uniform or partially different. According to various embodiments of the present disclosure, the thickness of the metal mesh pattern may be designed to be completely uniform or partially different.
The electronic device 500 may include, for example, a wireless communication circuit (e.g., the communication module 220 of FIG. 2) electrically connected to the third conductive pattern, the wireless communication circuit may activate at least portions of the third conductive pattern based on a signal from the control circuit (e.g., the processor 120 of FIG. 1 or the processor 210 of FIG. 2).
According to embodiments of the present disclosure, the electronic device 500 may include a light receiving unit 550 (or light receiving module) of at least photosensors disposed between the display 530 and the second surface 5002 according to embodiments of the present disclosure, the light receiving unit 550 may be disposed below or beneath (e.g., within about 10mm of the display 530) the display 530.
According to embodiments of the present disclosure, the electronic device 500 may include a light emitting unit (or light emitting module) 560 of at least photosensors disposed at a position vertically aligned with at least portion of the second region (or bezel region) 510-12 of the cover 510-1. according to embodiments of the present disclosure, the light emitting unit 560 may be disposed under or under a space 5009 (hereinafter, referred to as "side space") between the side surface 5303 of the display 530 and the side member 510-3. according to various embodiments of the present disclosure, although not shown, the light emitting unit 560 of at least photosensors may be designed such that portion thereof is inserted into the side space 5009.
For example, light output from the light emitting unit 560 may pass through the th cover 510-1 (e.g., the second region 510-12) and may be released to the outside (571.) according to embodiments of the present disclosure, at least portion of the display 530 may include a light transmissive material light (or optical signals) scattered or reflected from the object 580 (or an external object) may pass through the th cover 510-1 (e.g., the th region 510-11), the adhesive material 540, and the display 530, and may enter the light receiving unit 550 (572). the light receiving unit 550 may generate an electrical signal (or digital value) based on the received light (or digital value). according to various embodiments of the present disclosure, the electronic device 500 may include an analog-to-digital converter (ADC) (not shown) electrically connected with the light receiving unit 550. the ADC may generate a detection value (or digital value) (or "ADC value" according to various embodiments of the present disclosure, the light receiving unit 550 may be designed to include an ADC).
The th cover 510-1 or the th area 510-11 of the adhesive material 540 may be designed to have a light transmittance of about 50% or more, or a light reflectance of about 10% or less according to various embodiments of the present disclosure the display 530 may be designed to have a light transmittance of about 20% or more, or a light reflectance of about 10% or less according to various embodiments of the present disclosure.
According to various embodiments of the present disclosure, the second region 510-12 of the th cover 510-1 may include a colored region 510-12a and a transparent region 510-12b the colored region 510-12a may have a different color than the th region 510-11.
According to various embodiments of the present disclosure, at least wavelength bands of light output from the light emitting unit 560 may pass through the transparent regions 501-12b and may be released to the outside the colored regions 510-12a may be designed to block at least wavelength bands of light output from the light emitting unit 560.
According to various embodiments of the present disclosure, the entire second region 510-12 of the th cover 510-1 may be designed as a colored region, and may be designed to allow light of at least wavelength bands output from the light emitting unit 560 to pass therethrough (although not shown).
In accordance with an embodiment of the present disclosure, light-emitting unit 560 may be disposed in lateral space 5009 or below lateral space 5009, which may reduce light output from light-emitting unit 560 from entering display 430, and may prevent light (or light energy) output from light-emitting unit 560 from electrically affecting display 530 (e.g., such as a malfunction of a light spot).
In an example (although not shown) in which the light emitting unit 530 is designed to be disposed under or below the display 530, at least portions of light output from the light emitting unit may pass through the display 530 and may be discharged to the outside when the light transmittance of the display 530 is low (e.g., about 20% or less), the light output from the light emitting unit may pass through the display 530 and may be discharged to the outside without exceeding a designed amount of light.
Assuming an example (although not shown) in which both the light-receiving unit and the light-emitting unit are arranged in the side space 5009 or below the side space 5009, the side space 5009 should be designed to have a width of the light-receiving unit and the light-emitting unit, which may make it difficult to expand the display 530 while maintaining the size of the electronic apparatus 500. In an embodiment of the present disclosure, the light receiving unit 550 may be disposed below or under the display 530, and the light emitting unit 560 may be disposed in the lateral space 5009 or below or under the lateral space 5009. Accordingly, the display 530 may be easily expanded while maintaining the size of the electronic device 500.
In various embodiments of the present disclosure, the electronic device 500 may further include a light blocking element to prevent light output from the light emitting unit 560 from entering at least portions of the display 530 according to embodiments of the present disclosure, the light blocking element may include a th light blocking material (not shown) covering at least portions of the side surface 5303 of the display 530. the th light blocking material may reduce light output from the light emitting unit 560 from entering the display 530 through the side surface 5303 of the display 530 or prevent light from entering the display 530.
According to embodiments of the present disclosure, the light blocking element may include a second light blocking material (not shown) covering at least portions of the area 5302-2 other than the light receiving light transmitting area 5302-1 of the display second surface 5302, the second light blocking material may reduce light output from the light emitting unit 560 from entering the display 530 through the display second surface 5302, or may prevent light from entering the display 530, which may reduce electrical impact of light output from the light emitting unit 560 on the display 530.
According to various embodiments of the present disclosure, the electronic device 500 may include a light blocking member 593 disposed between the light receiving unit 550 and the light emitting unit 560 the light blocking member 593 may prevent light output from the light emitting unit 560 from being transmitted to the light receiving unit 550 or the display 530 according to various embodiments of the present disclosure, the light blocking member 593 may be an portion of various members installed in the electronic device 500.
According to various embodiments of the present disclosure, the light receiving unit 550 and the light emitting unit 560 may be arranged on a plane substantially parallel to the th surface 5001 for example, the light receiving unit 550 and the light emitting unit 560 may be mounted on a plate-shaped substrate extending in the third direction 50031.
According to various embodiments of the present disclosure, the light receiving unit 550 may be an element of an th light sensor (e.g., a proximity sensor), and the light emitting unit 560 may be an element of a second light sensor (e.g., a biosensor) different from the th light sensor.
Fig. 6A is a view illustrating a light sensor according to an embodiment of the present disclosure.
Fig. 6B is an exploded perspective view of a light sensor according to an embodiment of the present disclosure.
Referring to fig. 6A and 6B, the light sensor 600 may be provided as a single module in the form of a package, for example, a package System (SIP). The light sensor 600 may include a substrate (hereinafter, a light sensor substrate) 601, a light receiving unit 603, and a light emitting unit 604. According to various embodiments of the present disclosure, the light receiving unit 603 may be the light receiving unit 550 of fig. 5, and the light emitting unit 604 may be the light emitting unit 560 of fig. 5.
The photosensor substrate 601 may be a plate extending in a 13 th direction 60031 and may include a circuit according to an embodiment of the present disclosure the photosensor substrate 601 may include a substrate surface 6011 facing a tenth direction 60011 perpendicular to the thirteenth direction 60031 and a substrate second surface (not shown) facing a twelfth direction 60021 opposite to the tenth direction 60011 according to an embodiment of the present disclosure, the light receiving cell 603 and the light emitting cell 604 may be mounted on the substrate surface 6011.
According to an embodiment of the present disclosure, the light emitting unit 604 may include a light source (e.g., LED)6043 and a second molding compound (hereinafter, light emitting unit cover) 6041. The light source 6043 may be mounted on the photosensor substrate 601 by soldering (e.g., Surface Mount Technology (SMT)). The light emitting unit cover 6041 may have a container shape protruding in the 11 th direction 60011. When the light emitting unit cover 6041 is coupled to the photosensor substrate 601, a space may be formed to accommodate the light source 6043. The light-emitting unit cover 6041 may include a light-transmissive material, and light output from the light source 6043 may pass through the light-emitting unit cover 6041 and may be released to the outside of the optical sensor 600.
According to embodiments of the present disclosure, the light receiving unit 603 may include a light receiving sensor (or photodetector) (e.g., photodiode) 6033 and an th molding compound (hereinafter, light receiving unit cover) 6031 the light receiving sensor 6033 may be mounted on the photosensor substrate 601 by soldering the light receiving unit cover 6031 may have a container shape protruding in the 11 th direction 60011. the light receiving unit cover 6031 may have a container shape of a rectangle, but is not limited thereto, and may be designed to have various sectional shapes such as a trapezoid or an arc.
According to various embodiments of the present disclosure, an portion (e.g., the light blocking member 493 of fig. 4A) of the light-receiving unit cover 6031 may be arranged between the light-receiving sensor 6033 and the light-emitting unit 604, and light output from the light source 6043 of the light-emitting unit 604 may be prevented from entering the light-receiving sensor 6033.
According to embodiments of the present disclosure, the light sensor 600 may include a flexible conductive member 602 electrically connected to the light sensor substrate 601. an end 6021 of the flexible conductive member (e.g., a Flexible Printed Circuit Board (FPCB))602 may be connected to the light sensor substrate 601. another end 6022 of the flexible conductive member 602 may be electrically connected to a PCB (not shown) mounted in an electronic device (e.g., 500 of fig. 5.) according to embodiments of the present disclosure, the other end 6022 of the flexible conductive member 602 may include a connector 6023 electrically connected to the Printed Circuit Board (PCB).
According to various embodiments of the present disclosure, a light emitting unit and a light receiving unit of a light sensor may be respectively mounted on an electronic device (e.g., 500 of fig. 5), unlike a structure in which the light emitting unit and the light receiving unit are mounted on a single light sensor substrate 891 (see fig. 6A or 6B). in an embodiment of the present disclosure, the light emitting unit may be electrically connected to a PCB (not shown) mounted in the electronic device (e.g., 500 of fig. 5) by using an th flexible conductive member (e.g., FPCB), and the light receiving unit may be electrically connected to the PCB of the electronic device by using a second flexible conductive member (e.g., second FPCB).
Fig. 7 is a cross-sectional view illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display, according to an embodiment of the present disclosure.
Referring to fig. 7, electronic device 700 may include at least part of electronic device 101 of fig. 1, external electronic device 102 of fig. 2, electronic device 400 of fig. 4A, or electronic device 500 of fig. 5, in accordance with various embodiments of the present disclosure.
Referring to fig. 7, an electronic device 700 may include a board 710, a display 730, a support member 740, and a light sensor 750, according to an embodiment of the present disclosure.
According to various embodiments of the present disclosure, the plate 710 may be similar to or the same as the th cover 510-1 of fig. 5, for example, the plate 710 may include a th region 710-11 (e.g., the th region 510-11 of fig. 5) covering the display 730 and a second region 710-12 (e.g., the second region 510-12 of fig. 5) adjacent to the th region 710-11, light output from the display 730 may pass through the th region 710-11 and may be released to the outside.
For example, display 730 may include a display th surface 7301 facing in th direction 70011 (e.g., th direction 50011 of fig. 5), a display second surface 7302 facing in a second direction 70021 (e.g., second direction 50021 of fig. 5), and a display third surface 7303 facing in a third direction 70031 (e.g., third direction 50031 of fig. 5.) display 730 may have light transmitting properties according to various embodiments of the present disclosure.
Light sensor 750 may be similar to or the same as light sensor 600 of fig. 6A and 6B, according to various embodiments of the present disclosure. For example, the light sensor 750 may include a substrate 751 (e.g., the light sensor substrate 601 of fig. 6A), and a light receiving unit 753 (e.g., 603 of fig. 6A) and a light emitting unit 754 (e.g., 604 of fig. 6A) mounted on the substrate 751.
According to embodiments of the present disclosure, the support member 740 may be designed to cover at least portions of the display second surface 7302 the support member 740 may include a support member third surface 7401 facing the th direction 70011 and coupled to the display second surface 7302, a support member second surface 7402 facing the second direction 70021, and a support member third surface 7403 facing the third direction 70031, for example.
According to an embodiment of the present disclosure, the support member third surface 7403 may be designed to avoid protruding toward the third direction 70031 with respect to the display third surface 7303, for example, the support member third surface 7403 and the display third surface 7303 may be connected to be substantially flush with each other, according to an embodiment of the present disclosure, the second region 710-12 of the cover 710 may be disposed above the display 730 and a side portion space (hereinafter referred to as a side space) 7009 (e.g., 5009 of fig. 5) of the support member 740.
According to an embodiment of the present disclosure, the support member 740 may include a space (hereinafter, light-receiving unit receiving portion 742) recessed from the support member second surface 7402 in the th direction 70011 when the substrate 751 of the light sensor 750 is coupled to the support member second surface 7402, the light-receiving unit 753 of the light sensor 750 may be inserted into the light-receiving unit receiving portion 742 and the light-emitting unit 754 of the light sensor 750 may be disposed in the side space 7009.
According to an embodiment of the present disclosure, a distance 741 between the light receiving unit receiving portion 742 and the display third surface 7303 in the third direction 70031 may be about 20mm or less. According to various embodiments of the present disclosure, the light receiving unit receiving portion 742 may be disposed at a distance greater than 20mm from the display third surface 7303 in the third direction 70031.
Although not shown, light receiving unit receiving portion 742 may be designed to have various other cross-sections with indentations in direction 70011, for example, although not shown, light receiving unit receiving portion 742 may be designed to have various cross-sections, such as trapezoidal, arcuate, etc., when viewed in cross-section according to various embodiments of the present disclosure, light receiving unit receiving portion 742 may be designed to have various planar shapes when viewed from second direction 70021, although not shown.
According to various embodiments of the present disclosure, the support member 740 may include a portion (hereinafter, receiving portion side portion) 745 disposed between the light receiving unit receiving portion 742 and the side space 7009. According to various embodiments of the present disclosure, the support member 740 may be designed to omit the receiving portion side portion 745.
According to an embodiment of the present disclosure, the support member 740 may include a portion 746 (hereinafter, a receiving portion upper portion) disposed between the light receiving unit receiving portion 742 and the display 730. According to various embodiments of the present disclosure, although not shown, the support member 740 may be designed to omit the receiving portion upper 746. According to various embodiments of the present disclosure, although not shown, the light receiving unit receiving portion 742 may be designed in the form of an opening.
According to various embodiments of the present disclosure, the light receiving unit receiving portion 742 may be designed to have various widths 743 or depths 744 according to the provision form or structure of the light receiving unit 753. According to an embodiment of the present disclosure, the width 743 or the depth 744 of the light receiving unit receiving portion 742 may be about 5mm or less.
Although not shown, at least portion of the support member 740 may be designed to include a light-transmissive material according to an embodiment of the present disclosure, external light passing through the th region 710-11 of the board 710 and the display 730 may pass through the support member 740 and may enter the light receiving unit 753.
Support member 740 may include or more layers according to various embodiments of the present disclosure, at least portion of support member 740 may include a flexible material, for example, support member 740 may include a layer (e.g., an embossed layer or a sponge layer) including various materials, such as polymers, etc.
According to embodiments of the present disclosure, at least portion of the support member second surface 7402 may be designed to include an electrically conductive material, for example, the support member 740 may include an electrically conductive layer (e.g., FPCB)7404 forming the support member second surface 7402.
According to embodiments of the present disclosure, when substrate 751 of light sensor 750 is coupled to support member second surface 7402, or more contacts (not shown) of substrate 751 and or more contacts (not shown) formed on conductive layer 7404 of support member 740 may be electrically connected to each other according to various embodiments of the present disclosure, or more contacts of substrate 751 and or more contacts of conductive layer 7404 may be soldered to each other according to various embodiments of the present disclosure, electronic device 700 may include a flexible conductive member (e.g., C-clip 1110, pogo-pin, spring, conductive phorone and rubber, conductive tape, copper connector, etc.) disposed between or more contacts of substrate 751 and or more contacts of conductive layer 7404.
Fig. 8 is a cross-sectional view illustrating an electronic device including a light emitting unit and a light receiving unit of at least sensors arranged adjacent to a display, according to various embodiments of the present disclosure.
Referring to fig. 8, electronic device 800 may include at least portion of electronic device 101 of fig. 1, external electronic device 102 of fig. 2, electronic device 400 of fig. 4A, electronic device 500 of fig. 5, or electronic device 700 of fig. 7, in accordance with various embodiments of the present disclosure.
According to an embodiment of the present disclosure, electronic device 800 may include a board 810, a display 830, a support member 840, and a light sensor 850. According to various embodiments of the present disclosure, the board 810, the display 830, the support member 840, and the light sensor 850 may be similar to or the same as the board 710, the display 730, the support member 740, and the light sensor 750 of fig. 7, respectively.
According to various embodiments of the present disclosure, the electronic device 800 may include various types of lenses (or lens modules) 870 arranged to be at least vertically aligned with the light emitting units 854 (e.g., 754 of fig. 7). The lens 870 may be vertically aligned with the second region 810-12 (e.g., 710-12 of fig. 7) of the plate 810 and the light emitting unit 854. According to various embodiments of the present disclosure, lens 870 may be designed to be coupled to plate 810 or included in plate 810. The lens 870 may provide a function (e.g., a function of enhancing directivity, or guiding or changing a light direction) of allowing the light output from the light emitting unit 854 to substantially pass through the second region 810-12 of the plate 810 and be released to the outside.
According to various embodiments of the present disclosure, the electronic device 800 may further include a light blocking element to prevent light output from the light emitting unit 854 from entering at least portions of the display 830 according to embodiments of the present disclosure, the electronic device 800 may include a light blocking material 881 covering at least portions of a side surface 8303 (e.g., 7303 of fig. 7) of the display 830 and a side surface 8403 (e.g., 7403 of fig. 7) of the support member 840.
Fig. 9 is a cross-sectional view illustrating an electronic device including a light emitting unit and a light receiving unit of at least sensors arranged adjacent to a display, according to various embodiments of the present disclosure.
Referring to fig. 9, electronic device 900 may include at least portion of electronic device 101 of fig. 1, electronic device 201 of fig. 2, electronic device 400 of fig. 4A, or electronic device 500 of fig. 5, in accordance with various embodiments of the present disclosure.
According to embodiments of the present disclosure, electronic device 900 may include side member 910-3 forming side surface 9003 according to various embodiments of the present disclosure, side member 910-3 may be similar to or the same as side member 510-3 of FIG. 5, and may surround space 9008 between an -th cover (not shown) (e.g., 510-1 of FIG. 5) and a second cover (not shown) (e.g., 510-2 of FIG. 5. electronic device 900 may include various elements arranged in space 9008. according to embodiments of the present disclosure, electronic device 900 may include display 930, middle plate 910-4, PCB960, and light sensor 990.
According to various embodiments of the disclosure, display 930 may be display 530 of fig. 5. The display 930 can include a panel (e.g., the panel 262 of fig. 2) in the form of an extension in a third direction 90031 (e.g., the third direction 50031 of fig. 5). The display 930 may include a display rear surface 9302 (e.g., the display second surface 5302 of fig. 5) facing the second direction 90021 (e.g., the second direction 50021 of fig. 5), and a display side surface 9303 (e.g., the display third surface 5303 of fig. 5) facing the third direction 90031.
According to embodiments of the present disclosure, middle plate 910-4 may be a plate extending from side member 910-3 toward interior space 9008 (e.g., fourth direction 90041) or coupled to side member 910-3 middle plate 910-4 may include a -th mounting surface 910-41 facing in a -th direction 90011 and a second mounting surface 910-42 facing in a second direction 90021.
For example, the display 930 may be disposed on the -th mounting surface 910-41 of the midplane 910-4, and the PCB960 may be disposed on the second mounting surface 910-42 of the midplane 910-4.
According to various embodiments of the present disclosure, the light emitting unit cover 9941 (e.g., 6041 of fig. 6B) may include an th cover portion 99411 and a second cover portion 99412 the th cover portion 99411 may be vertically aligned with a partial region having a light transmissive substrate (e.g., the second region 510-12 of the th cover 510-1 of fig. 5) the th cover portion 99411 may be designed to have a light transmittance of about 50% or more, or a light reflectance of about 10% or less, according to various embodiments of the present disclosure.
According to an embodiment of the present disclosure, the cover portion 99411 may be designed to have a function of allowing light output from the light source 9943 (e.g., 6043 of fig. 6B) to substantially pass through a specific region (e.g., the second region 510-12 of fig. 5) of the light-transmitting substrate and be released to the outside (e.g., a function of enhancing directivity, or guiding or changing a light direction) — according to an embodiment of the present disclosure, the cover portion 99411 may include a lens, or may be designed to be formed of various materials or various forms having the same or the same function as the lens.
According to various embodiments of the present disclosure, the electronic device 900 may include various forms of lenses (or lens modules) (not shown) arranged in at least vertical alignment with the light sources 9943 the lenses may be arranged between a partial area of the transparent substrate (e.g., the second area 510-12 of the th cover 510-1 of FIG. 5) and the light sources 9943 (e.g., in the side space 9009) and may be vertically aligned with the light sources 9943 the lenses may be designed to be coupled to or included in the transparent substrate (e.g., the th cover 510-1 of FIG. 5) according to various embodiments of the present disclosure the lenses may provide functionality that allows light output from the light sources 9943 to substantially pass through a particular area of the transparent substrate (e.g., the second area 510-12 of FIG. 5) and be released to the outside (e.g., functionality that increases directionality or directs or alters light direction).
According to various embodiments of the present disclosure, when the electronic device is designed to output at least wavelength bands of light from the light emitting unit 994, the cover portion 99411 may include a filter to allow at least wavelengths of light to selectively pass through.
According to various embodiments of the present disclosure, although not shown, the th cover portion 99411 of the light emitting unit cover 9941 may be designed to be replaced with a penetration hole, light output from the light source 9943 may pass through the penetration hole of the light emitting unit cover 9941 and may be released to the outside of the light sensor 990.
The second cover portion 99412 of the light emitting unit cover 9941 may be a side wall, for example, extending from the cover portion 99411 according to various embodiments of the present disclosure, the second cover portion 99412 may be designed to include a light blocking material the second cover portion 99412 may prevent light from the light source 9943 from being transmitted to peripheral elements such as the display 930.
According to embodiments of the present disclosure, a light receiving unit 993 (e.g., 603 of fig. 6A) may include a light receiving sensor 9933 (or a photodetector) (e.g., a photodiode) (e.g., 6033 of fig. 6B) and an th molding compound 9931 (hereinafter referred to as a light receiving unit cover) (e.g., 6031 of fig. 6B), the light receiving sensor 9933 may be mounted on a light sensor substrate 991 by soldering, the light receiving unit cover 9931 may include a through hole 9932 (e.g., 6032 of fig. 6B) vertically aligned with the light receiving sensor 9933, external light may pass through the through holes 9932 of the display and the light receiving unit cover 9931 and may enter the light receiving sensor 9933, according to various embodiments of the present disclosure, the through hole 9932 may be replaced with a light transmitting region, and the light transmitting region may be designed to have a light transmittance of about 50% or more or a light reflectance equal to 10% or less, according to various embodiments of the present disclosure, when the through hole 9932 is replaced with a light transmitting region, the light transmitting region may be designed to have a light transmitting function of receiving the same as that of a lens 9933, or may be formed of a lens, and may include various lens, and may be formed of various forms of a lens.
According to various embodiments of the present disclosure, the portion 9931a (e.g., the light blocking member 593 of fig. 5) of the light receiving unit cover 9931 may be disposed between the light receiving sensor 9933 and the light emitting unit 994, and light output from the light source 9943 of the light emitting unit 994 may be prevented from entering the light receiving sensor 9933.
According to various embodiments of the present disclosure, a portion 910-4a (e.g., the light shielding member 593 of fig. 5) of the middle plate 910-4 may be disposed between the light receiving unit 993 and the light emitting unit 994, and may prevent light output from the light source 9943 of the light emitting unit 994 from entering the light receiving unit 993.
According to embodiments of the present disclosure, the light receiving unit 993 may be designed to selectively receive light of at least wavelength bands according to embodiments of the present disclosure, the light receiving unit 993 may include a filter 9934 disposed between the light receiving sensor 9933 and the penetration hole 9932 the filter 9934 may selectively allow light of at least wavelength bands of light from light of a plurality of wavelength bands to pass through the penetration hole 9932 of the light receiving unit cover 9931 according to various embodiments of the present disclosure, the light receiving sensor 9933 may be designed to include the filter 9934 or have a function of the filter 9934.
According to an embodiment of the present disclosure, the penetration hole 9932 of the light receiving unit cover 993 may be circular when viewed from the second direction 90021. According to various embodiments of the present disclosure, although not shown, the penetration hole 9932 of the light receiving unit cover 993 may be designed to have various other shapes (e.g., rectangular, etc.). The penetration hole 9932 of the light receiving unit cover 993 may be designed to have various widths 99321 depending on the range of the light receiving sensor 9933 that receives light.
According to various embodiments of the present disclosure, the light sensor substrate 991 may include wires (not shown) or other electronic components related to the light receiving unit 993 and the light emitting unit 994. The light receiving unit 993 and the light emitting unit 994 may be disposed adjacent to each other (e.g., within about 20 mm), and the light sensor substrate 991 may be designed to have a sufficient size to allow the disposition of the light receiving unit 993 and the light emitting unit 994. For example, the light sensor substrate 991 (e.g., 601 of fig. 6A) may have a rectangular shape, and the light receiving unit 992 and the light emitting unit 994 may be arranged along a longer side of the light sensor substrate 991.
According to embodiments of the present disclosure, a light sensor 990 may be coupled to the middle plate 910-4 according to embodiments of the present disclosure, the middle plate 910-4 may include an th penetration hole 910-43, a light receiving unit 993 of the light sensor 990 may be disposed in the th penetration hole 910-43 (e.g., press-fit), and may be disposed adjacent to the rear surface 9302 of the display 930 (e.g., about 5mm or less), external light may pass through the display 930 and the th penetration hole 9932 of the light receiving unit cover 9931, and may enter the light receiving sensor 9933, the middle plate 910-4 may include a second penetration hole 910-44 according to various embodiments of the present disclosure, the second penetration hole 910-44 may be a recess recessed toward the fourth direction 90041 (e.g., a direction opposite to the third direction 90031), a light emitting unit 994 of the light sensor 990 may be disposed in the second penetration hole 91044 (e.g., press-fit), and may be displayed under a side face between a side surface 353 of the display 930 and a bezel 9009 (e.g., under 5005).
According to an embodiment of the present disclosure, light (e.g., light of various wavelength bands such as ultraviolet, visible, or infrared light) output from the light emitting unit 994 may pass through the lateral space 9009 and portions (e.g., the second regions 510-12 of fig. 5) of the housing disposed above the lateral space 9009, and may be released to the outside, light scattered or reflected from an object located outside the electronic device 900 may pass through portions (e.g., the th regions 510-11 of fig. 5) of the housing, the display 930, etc., and may enter the light receiving unit 993, the light receiving sensor 9933 may generate an electrical signal (or a digital value) based on the received light.
In an example (although not shown) in which the light emitting unit is disposed under or below the display 930, at least portions of light output from the light emitting unit may pass through the display 930 and may be discharged to the outside, the display 930 may be electrically affected by light (or light energy) output from the light emitting unit, for example, a semiconductor layer (not shown) included in the display 930 may be excited (or electrically excited) by the light output from the light emitting unit, and thus, current may leak to at least portions (not shown) of the switch, and for this reason, light (e.g., a malfunction (light spot) of the display) may be generated.
According to various embodiments of the present disclosure, the electronic device 900 may further include a light blocking element to prevent light output from the light emitting unit 994 from entering at least portions of the display 930 according to embodiments of the present disclosure, the light blocking element may include a light blocking material 981 covering at least portions of a side surface 9303 of the display 930 the light blocking material 981 may reduce light output from the light emitting unit 994 from entering the display 930 through the side surface 9303 of the display 930 or may prevent light from entering the display 930.
The portion of middle plate 910-4 may extend into the side space 9009 according to various embodiments of the present disclosure the portion 910-4a of middle plate 910-may replace the light blocking material 981 according to various embodiments of the present disclosure.
In an example (although not shown) in which the light emitting unit is designed to be disposed under or below the display 930, at least portions of light output from the light emitting unit may pass through the display 930 and may be discharged to the outside when the light transmittance of the display 930 is low (e.g., about 30% or less), the light output from the light emitting unit may pass through the display 930 but may not discharge an amount of light exceeding the design.
Assuming an example (although not shown) in which both the light receiving unit and the light emitting unit are disposed in the side space 9009 or below the side space 9009, the side space 9009 should be designed to have a width for the light receiving unit and the light emitting unit. This may make it difficult to expand the display 930 while maintaining the size of the electronic device 900. In an embodiment of the present disclosure, the light receiving unit 993 may be disposed below or under the display 930, and the light emitting unit 994 may be disposed in the lateral space 9009 or under the lateral space 9009, so that the display 930 may be easily expanded while maintaining the size of the electronic device 900.
According to an embodiment of the present disclosure, the light sensor 990 may include an extension portion 992 extending from the light sensor substrate 991, an end 9921 of the extension portion 992 may be electrically connected to the light sensor substrate 991, and an other end 9922 of the extension portion 992 may be electrically connected to the PCBs 960 according to an embodiment of the present disclosure, the other end 9922 of the extension portion 992 may include a connector (e.g., a plug connector) 9923, and the PCB960 may include a second connector (e.g., a receptacle connector) 96021 disposed on a rear surface 9602 of the PCB960, the connector 9923 and the second connection 96021 may be coupled to each other to electrically connect the extension portion 992 and the PCB960 according to an embodiment of the present disclosure, the extension portion 992 may be an FPCB.
According to embodiments of the present disclosure, the PCB960 may be designed to avoid overlapping with the middle plate 910-4 or the through holes 910-43, 910-44 of the light sensor substrate 991.
Although not shown, the light sensor 990 may be mounted on the PCB960 according to various embodiments of the present disclosure. For example, although not shown, the PCB960 may be formed to have a size to cover the light sensor substrate 991, and the light sensor 990 may be mounted on the PCB 960. According to various embodiments of the present disclosure, in examples where the light sensor 990 is mounted on the PCB960, the light sensor substrate 991 may be mounted on the PCB960 through a medium (not shown) of an additional substrate (hereinafter, an interposer) disposed between the light sensor substrate 991 and the PCB960 (the interposer may access the middle of the wiring).
Fig. 10 is a schematic cross-sectional view illustrating an electronic device including an optical emitter and an optical receiver of at least optical sensors arranged adjacent to a display, in accordance with an embodiment of the present disclosure.
Referring to fig. 10, in an embodiment of the disclosure, electronic device 1000 may include at least portions of electronic device 101 of fig. 1, 102 of fig. 2, electronic device 400 of fig. 4A, or electronic device 500 of fig. 5.
According to embodiments of the present disclosure, electronic device 1000 may include a board 1010, a display 1030, and a light sensor 1050.
According to an embodiment of the present disclosure, the board 1010 may be similar to or the same as the th cover 510-1 of fig. 5, for example, the board 1010 may include a th region 1011 (e.g., the th region 510-11 of fig. 5) covering the display 1030 and a second region 1012 (e.g., the second region 510-12 of fig. 5) disposed on the periphery of the th region 1011, light output from the display 1030 may be released to the outside through the th region 1011.
For example, display 1030 may include a -th surface 10301 (e.g., a -th surface 5301 of fig. 5) facing a -th direction 100011 (e.g., a -th direction 50011 of fig. 5), a second surface 10302 (e.g., a display second surface 5302 of fig. 5) facing a second direction 100021 (e.g., a second direction 50021 of fig. 5) opposite the -th direction 100011, and a third surface 5303 (e.g., a display third surface 5303 of fig. 5) facing a third direction 100301 (e.g., a third direction 50031 of fig. 5) perpendicular to the -th direction 100011-display 1030 may have light transmissive properties according to various embodiments of the present disclosure.
In accordance with an embodiment of the present disclosure, light sensor 1050 may include a printed circuit board 1051, a light receiver 1053 and a light emitter 1054 mounted on printed circuit board 1051.
According to an embodiment of the present disclosure, the printed circuit board 1051 may include a th portion 1051a of th thickness and a second portion 1051b of a second thickness greater than th thickness when the light sensor 1050 is installed in the electronic device 1000, the th portion 1051a may be disposed below or beneath the display 1030 and the second portion 1051b may be disposed below or beneath the second region 1012 of the board 1010. the portion of the second portion 1051b protruding with respect to the th portion 1051a may be disposed in the lateral space 1058 of the third surface 10303 according to an embodiment of the present disclosure, the second region 1012 of the board 1010 may be formed to have a width of about 1mm or less in the third direction 100031 according to an embodiment of the present disclosure, the second portion 1051b of the printed circuit board 1051 may be formed to have a width of about 1mm or less in the third direction 100031.
According to embodiments of the present disclosure, the printed circuit board 1051 may include fourth surfaces 1050, 1050b facing the direction 100011 of the , and a fifth surface 1050c facing the second direction 100021 according to embodiments of the present disclosure, the fourth surfaces 1050a, 1050b may include a sixth surface 1050a on which a light receiver 1053 (e.g., a light receiving element such as a photodiode) is disposed, and a seventh surface 1050b on which a light emitter 1054 (e.g., a light emitting element such as an LED) is disposed, and the seventh surface 1050b may be disposed farther from the fifth surface 1050c than the sixth surface 1050a may face the display 1030, and the seventh surface 1012 b may face the second region 1050c of the board 1010, a structure in which the seventh surface 1050b is disposed farther from the fifth surface 1050c than the sixth surface 1050a may reduce a gap or distance 1059 between the second region 1012 of the board 1010 and the light emitter 1054 or a distance 1059 of the board 1012, the structure may reduce a thickness of the light emitter 1054, a light layer 1054 passes through the second region 1054 of the board 1054, and a light attenuation gap or a light emitter gap or a light layer 1050b may be reduced by about 0mm according to various embodiments, and a light attenuation of the present disclosure may be reduced by about 0, or about 0.
According to an embodiment of the present disclosure, although not shown, the printed circuit board 1051 of the light sensor 1050 may be electrically connected with another printed circuit board on which a process or the like is mounted, for example, the printed circuit board 1051 may be electrically connected with another printed circuit board through a medium of a Flexible Printed Circuit Board (FPCB). in another example, the printed circuit board 1051 may be arranged to at least overlap with another printed circuit board, and or more terminals formed on the fifth surface 1050c of the printed circuit board 1051 may be electrically connected to or more terminals formed on another printed circuit board through a medium of a conductive material such as solder.
According to various embodiments of the present disclosure, electronic device 1000 can also include a light blocking element to prevent light output from light emitter 1054 from entering at least portions of display 1030 for example, electronic device 1000 can include a light blocking material (e.g., light blocking material 981 of FIG. 9) that covers at least portions of a side surface (i.e., third surface 10303) of display 1030.
For example, although not shown, the printed circuit board 1051 includes a structure including an inner layer on which a circuit is formed by using a Copper Clad Laminate (CCL), and th and second outer layers (not shown) arranged on both sides of the inner layer and having a circuit formed thereon, and prepreg bonding and insulation between the layers, and the circuit between the layers may be electrically connected through a through hole formed in the printed circuit board 1051.
Fig. 11A, 11B, 11C, 11D, 12A, 12B, 12C, 12D, 12E, and 12F are sectional views illustrating a manufacturing flow of a printed circuit board of a photosensor according to an embodiment of the present disclosure.
Referring to FIG. 11A, in an embodiment of the present disclosure, CCL1110 may be formed. The CCL1110 is a laminate for a printed circuit, and may include a structure in which copper foils 1112, 1113 are attached to both side surfaces of an insulating layer (or an insulating plate) 1111 formed of various insulating base materials (e.g., resin) and adhesives.
According to an embodiment of the present disclosure, in order to enhance adhesion with the resin of the insulating layer 1111, the copper foils 1112, 1113 may be formed to chemically react with the resin and cut into portions of the resin (about 5 μm (micrometers)). the thickness of the electrolytic copper foil may be about 18 to 70 μm, but the copper foils 1112, 1113 may be formed in various ways, for example, to have a thinner thickness such as 5 μm, 7 μm, 15 μm according to wiring density or miniaturization.
Insulating layer 1111 of CCL1110 may include a resin, such as a phenol or epoxy resin. The CCL1110 may also include a reinforcing matrix (not shown), such as paper, fiberglass, glass nonwovens, and the like. The reinforcing base material may increase the rigidity (for example, the rigidity in the vertical and horizontal directions) of the insulating layer 1111 that is not satisfied only by the resin, or may decrease the dimensional change rate of the insulating layer with respect to temperature.
The CCL1110 may be, for example, a glass epoxy CCL including a substrate having glass fibers impregnated (or infiltrated) with an epoxy resin, and copper foils 1112, 1113 bonded to the substrate, according to embodiments of the present disclosure, National Electrical Manufacturers Association (NEMA) classifies the CCL into Flame Retardants (FR) -1, FR-2, FR-3, FR-4, FR-5, or FR-6 according to the substrate and flame retardancy (flammability), and the glass epoxy CCL may be of FR-4 and FR-5, according to embodiments of the present disclosure, FR-4 or FR-5 may include a substrate in which woven glass fibers impregnated with an epoxy resin are multilayered, and a copper foil bonded to the substrate.
The CCL1110 may be a paphenol CCL that includes a substrate having paper impregnated with phenolic resin and copper foils 1112, 1113 coupled thereto, according to embodiments of the disclosure, the paphenol CCL may be of FR-1, FR-2, or FR-3, classified by NEMA.
CCL1110 may be, for example, a composite CCL formed from a composite of two or more types of reinforcement materials. According to embodiments of the present disclosure, the composite CCL may comprise a composite type laminate in combination with a flame retardant epoxy resin (CEM) -1 or CEM-3 as defined by NEMA. CEM-1 comprises: a core base material (or core) in which a core paper is impregnated with an epoxy resin; an outer substrate having woven glass fibers impregnated with an epoxy resin; and a copper foil bonded to the outer substrate. CEM-3 may include: a core substrate having non-woven glass fibers (e.g., glass non-woven fabric) impregnated with an epoxy resin; an outer substrate having woven glass fibers impregnated with an epoxy resin; and a copper foil bonded to the outer substrate. Glass fibers or paper may enhance machinability, heat resistance or dimensional stability. According to an embodiment of the present disclosure, the CCL may be FR-6, which includes a core substrate having non-woven glass fibers (e.g., glass non-woven fabric) impregnated with a polyester resin; an outer substrate having glass fibers impregnated with a resin; and a copper foil bonded to the outer substrate.
According to various embodiments of the present disclosure, CCL1110 may be a CCL for high frequencies, which is made of a material corresponding to high-speed signal transmission. For example, the propagation speed of a signal in a printed circuit board is inversely proportional to the dielectric constant of the material. Therefore, the propagation speed of a signal can be increased by using a material having a low dielectric constant.
According to an embodiment of the present disclosure, CCL1110 may be formed by placing a film prepreg of an insulating material on a board formed of a metal such as aluminum or iron, and then bonding a copper foil to the film prepreg.
According to an embodiment of the present disclosure, CCL1110 may comprise a flexible CCL for an FPCB. The flexible CCL may have a polyester film or a polyimide film having flexibility and bonded to a copper foil by an adhesive.
According to various embodiments of the present disclosure, CCL1110 may be formed from a structure comprising insulating layers 1111 of various other materials or structures.
A printed circuit board (e.g., the printed circuit board 1051 of FIG. 10) of a photosensor (e.g., the photosensor 1050 of FIG. 10) may be formed by forming a plurality of boards (hereinafter, inner layers or inner layer substrates), each of which has a circuit formed thereon by processing the CCL1110, and stacking the plurality of inner layers on one another. the printed circuit board (e.g., the printed circuit board 1051 of FIG. 10) of the photosensor may be formed through -series flow including, for example, an inner layer circuit printing process, an inner layer etching and resist stripping process, a lamination process, a stacking process, a hole machining process, a plating process, an outer layer circuit printing process, an outer layer etching and resist stripping process, a solder resist printing process, and an external machining process.
Referring to fig. 11A and 11B, according to an embodiment, a structure 1120 having circuit patterns 1121, 1122 printed on surfaces 1114, 1115 of a CCL1110 may be formed by inner layer circuit printing for an inner layer according to an embodiment, according to an embodiment of the present disclosure, the circuit patterns 1121, 1122 (e.g., left portions on a dry film) may be printed on the surfaces 1114, 1115 by coating the surfaces 1114, 1115 of the CCL1110 for an inner layer with a dry film having photosensitivity of heat and pressure, projecting light by using an original film having a pattern, and then developing by a photolithography method (e.g., a screen printing method), according to another embodiment of the present disclosure, a circuit pattern corresponding to a circuit may be printed on the surfaces 1114, 1115 by a method using a screen having a circuit pattern instead of a dry film (e.g., a screen printing method).
According to an embodiment, referring to fig. 11B and 11C, structure 1130 may be formed by: portions 1131, 1132 of the copper foils 1112, 1113 corresponding to the printed circuit patterns 1121, 1122 are left by an inner layer etching process using a caustic material, and the other portions are removed. Portions 1131, 1132 which are covered by the circuit patterns 1121, 1122 and left without being etched may be defined as circuits.
Referring to fig. 11C and 11D, according to an embodiment, an inner layer 1140 having circuits 1131, 1132 bonded to an insulating layer 111 may be formed by removing circuit patterns (or etch resists) 1121, 1122 through a resist stripping process, the inner layer 1140 may include th and second circuits 1131, 1132 disposed on both side surfaces of the insulating layer 1111, although the th or second circuit 1131, 1132 is shown as a plurality of cross-sectional areas in cross-section, the th or second circuit 1131, 1132 may be formed as an integrated conductive pattern, according to an embodiment of the present disclosure, the th or second circuit 1132 may include a plurality of patterns physically separated from each other.
An inner layer including a circuit may be formed by processing a CCL having a structure of side surfaces attaching copper foils to an insulating layer according to an embodiment of the present disclosure, the inner layer formed by processing such a CCL may be a structure having a circuit arranged on a side surface thereof.
With reference to fig. 12A and 12B, according to an embodiment, an inner layer 1210, 1220, 1230, 1240 having circuitry formed thereon may be disposed between a th outer layer 1261 and a second outer layer 1263, 1264 by a layup process, which is formed in sequence from copper foil by a layered structure of each layer design, according to an embodiment of the present disclosure, the second outer layer 1263, 1264 may include a third outer layer 1263 aligned with a 0 portion of the th outer layer 1261 and a fourth outer layer 1264 aligned with another portion of the 3526 th outer layer 1261, for example, the th inner layer 1210 and the second inner layer 1220 may be formed to have a width corresponding to the 3523 th outer layer 1261, and the third inner layer 1230 and the fourth inner layer 1230 may be disposed between the second inner layer 1264 and the fourth outer layer 1264, and may be formed to have a width corresponding to the fourth outer layer 1264, the inner layer 1210, 1220, 1213, 1240, 2, and a heat-resistant adhesive arrangement on a prepreg layer 1262, 1263, which may be disposed on a prepreg structure 1210, 1264 by a prepreg, 1262, 1264, which may be disposed in accordance with a process, a heat-resistant adhesive process, while the inner layer 1210, 1263, 1264 may be disposed on a prepreg, 1262, 1264, a prepreg, 1264, 1262, 1264, which may be disposed on a prepreg, a tape, 1210, which may be disposed in a tape, 1210, 1264, 1210, 1263, or a tape, 1210, 1264, which may be disposed on a tape, which may be disposed in a tape, or a tape, 1210, which may be disposed in accordance with a tape, 1210, or a tape, 1210, 1264, which may be formed by a tape, or a tape, which may be disposed in a tape, or a tape, 1210, or a tape, 1210, may be disposed in a tape, 1210, or a tape, 1210.
Referring to fig. 12B and 12C, in an embodiment of the present disclosure, a second structure 1202 including vias (or vias 1271, 1272) may be formed by hole machining (e.g., drilling) the th structure 1201. vias may be defined as holes drilled in a substrate (e.g., structure 1201) formed by outer layers (e.g., layers 1261, 1263, 1264), prepreg (e.g., prepreg 1250) and inner layers (e.g., layers 1210, 1220, 1230, 1240) for the purpose of arranging connecting leads to electrically connect conductor layers disposed on different layers.
Referring to fig. 12C and 12D, in an embodiment of the present disclosure, a third structure 1203 may be formed by plating the second structure 1202, the third structure 1203 having through holes 1271, 1272 coated with a conductive material 1273 such as copper, the th plating process may be performed by electroless copper (cu) plating without electricity by chemical agents because the surfaces 12711, 12721 of the through holes 1271, 1272 do not have electrical properties, and then the second plating process may be performed by electrolytic copper plating, the plated conductive material 1273 may be electrically connected between conductive portions (e.g., the outer layer 1261, the second outer layers 1263, 1264, or the circuitry of the inner layers 1210, 1220, 1230, 1240) which are layered, according to an embodiment of the present disclosure, holes may be formed by partially digging holes in a direction from the outer layer 1261 to the second outer layer 1263 or 1264, or by digging holes in a direction from the second outer layer 1263 or 1264 to the third outer layer , and the conductive material surface of the holes may be dug 12684.
Referring to fig. 12D and 12E, in an embodiment of the present disclosure, outer layer circuit printing may be performed by applying the same method as the inner layer circuit printing process to print a circuit pattern on surfaces of the th outer layer 1261 and the second outer layers 1263, 1264 of the third structure 1203, and an outer layer etching and resist stripping process may be performed by applying the same method as the inner layer etching and resist stripping process to remove a portion of the th outer layer 1261 and to remove a portion of the second outer layers 1263, 1264 in the fourth structure 1204 formed therethrough, a th outer layer circuit 1281 may be left by removing a portion from the th outer layer 1261, and a second outer layer circuit 1283, 1284 may be left by removing a portion from the second outer layers 1263, 1284 the second outer layer circuit 1283, 1284 may include a third outer layer circuit 1283 left on the third outer layer 1263 and a fourth outer layer circuit 1284 left on the fourth outer layer 1264. the second outer layer circuit 1283, 1284 may include a third outer layer circuit conductor layer 1263 electrically connected to each other by a conductive material (e.g., a via hole, a via 12626 or a via).
Referring to fig. 12E and 12F, in an embodiment of the present disclosure, a fifth structure 1205 may be formed by printing a solder resist on the fourth structure 1204 and coating at least portion of the outer layer circuit 1281 or at least portion of the second outer layer circuit 1283, 1284 with an insulating material 1291, 1293, 1294 such as a solder resist insulating ink having an epoxy component the portion of the outer layer circuit 1281 covered by the insulating material 1291, 1293, 1294 is not exposed to the outside and thus is prevented from being oxidized, the insulating material 1291, 1293, and 1294 may function to prevent solder bridges from being generated when mounting the component, according to an embodiment of the present disclosure, a solder resist printing process may be performed by uniformly coating a corresponding surface with a light-sensitive ink (e.g., photo S/R) according to a screen printing method or a spraying method, removing unnecessary portions by scanning and developing, and then curing the remaining portions, according to an embodiment of the present disclosure, a solder resist printing process may be performed by directly coating a corresponding region with a thermosetting ink, a solder resist printing process may be used as a solder pad of a circuit board with various other different forms (1283) that may be exposed to the circuit board 1284 or other circuit boards that may not have been exposed to the printed.
According to an embodiment of the present disclosure, although not shown, a light receiver (or a light receiving element) (e.g., light receiver 1053 of fig. 10) may be electrically connected with at least terminals formed of third outer layer circuit 1283 through a medium of a conductive material such as solder, and a light emitter (or a light emitting element) (e.g., light emitter 1054 of fig. 10) may be electrically connected with at least terminals formed of fourth outer layer circuit 1284 through a medium of a conductive material such as solder, printed circuit board 1205 of fig. 12F may have relatively protruding portions 1205a, and when a light sensor mounting the light receiver and the light emitter on printed circuit board 1205 is installed in an electronic apparatus (e.g., electronic apparatus 1000 of fig. 10), as in the case of light sensor 1050, the light emitter may be arranged closer to the outer board (e.g., board 1010 of fig. 10) due to the protruding portions 1205 a.
According to various embodiments of the present disclosure, the FPCB for electrically connecting to another printed circuit board may be electrically connected with at least terminals formed by the third outer layer circuit 1283 or at least terminals formed by the fourth outer layer circuit 1284.
According to an embodiment of the present disclosure, although not shown, at least terminals formed by the th outer layer circuit 1281 may be used to electrically connect with another printed circuit board through a medium of conductive material such as solder.
According to an embodiment of the present disclosure, a printed circuit board formed based on a CCL may be a single-sided printed circuit board having circuits formed only on sides, or may be a double-sided printed circuit board having circuits formed on both sides.
For example, a single-sided printed circuit board may be formed through series processes including a circuit printing process, a copper foil etching process, a resist stripping process, a solder resist printing process, a hole machining process, and an external processing process based on the CCL.
According to an embodiment of the present disclosure, a single-sided printed circuit board may be formed based on the CCL through a series flow including a hole processing process, a plating process, a circuit printing process, a copper foil etching and resist stripping process, a solder resist printing process, and an external processing process.
Fig. 13 is a schematic perspective view illustrating a light sensor according to various embodiments of the present disclosure.
Referring to fig. 13, a light sensor 1300 (e.g., light sensor 1050 of fig. 10) may include front surfaces 1350a, 1350b (e.g., fourth surfaces 1050a, 1050b of fig. 10) facing a th direction 130011, and a rear surface 1350c (e.g., fifth surface 1050c of fig. 10) facing a second direction 130021 opposite to th direction 130011, according to embodiments of the present disclosure, the front surfaces 1350a, 1350b may include a th front surface 1350a (e.g., sixth surface 1050a of fig. 10) on which a light receiver 1353 (e.g., light receiver 1053 of fig. 10) is disposed, and a second front surface 1350b (e.g., seventh surface 1050b of fig. 10) on which a light emitter 1354 (e.g., light emitter 1054 of fig. 10) is disposed, and the second front surface 1350b may be disposed farther from the rear surface 1350c than the front surface 1350 a.
According to an embodiment of the present disclosure, the light sensor 1300 may include a plate 1311 forming a front surface 1350a and a rear surface 1350c of the , and a second plate 1312 stacked on the plate 1311 and forming a second front surface 1350 b.
According to an embodiment of the present disclosure, the second board 1312 may include a housing 1340 of an insulating material including a second front surface 1350b, a second rear surface 1350d facing the second front surface 1350b, and or more side surfaces surrounding between the second front surface 1350b and the second rear surface 1350d, according to an embodiment of the present disclosure, the second board 1312 may include or more conductors 1351, 1352 electrically connected between the second front surface 1350b and the second rear surface 1350d, or more conductors 1351, 1352 may be coupled with the housing 1340 such that a portion thereof is disposed inside the housing 1340, and may include terminals 1351a, 1352a disposed on the second front surface 1350b and terminals 1351b, 1352b disposed on the second rear surface 1350 d. a board formed of a printed circuit board may face the second rear surface 1350d and may be electrically connected with the terminals 1351b, 1352b disposed on the second rear surface 1350d, such as a solder material of the LED, 1351a, 1352a, for example, arranged on the front surface of the LED.
According to various embodiments of the present disclosure, the first plate 1311 or the second plate 1312 may further include a metal plate (not shown) disposed on an outer surface or inside thereof, the metal plate may be physically separated from other conductive materials of the photo sensor 1300, the metal plate may reduce interference of electromagnetic noise in signal transmission and reception when a signal is transmitted through a wire of the photo sensor 1300, the metal plate may reduce loss of a signal received or transmitted via the photo sensor 1300, according to various embodiments of the present disclosure, at least a portion of the metal plate may be disposed in the th plate 1311 or the second plate 1312, according to various embodiments of the present disclosure, the metal plate may be defined as an electromagnetic shielding element, according to various embodiments of the present disclosure, the metal plate may be physically separated from a conductive element of the st plate 1311 or the second plate (e.g., a circuit such as or a plurality of conductors 1351, 1352), according to various embodiments of the present disclosure, the metal plate may be electrically connected to another conductive element , on the other board , a conductive element such as a coaxial cable mounted on the PCB such as a PCB 461, a conductive element, such as a PCB 632, and may be electrically connected to another conductive element such as a PCB 24, according to various embodiments of the present disclosure, such as an electrical connector such as a PCB , such as a PCB may be electrically connected to a PCB assembly, such as a PCB 120, such as a PCB 24, such as a PCB assembly of the present PCB , and may be electrically connected to a PCB 23, such as an electrical connector such as an.
According to an embodiment of the present disclosure, the second board 1312 may include a printed circuit board including at least inner layers formed through the manufacturing process described above with reference to fig. 11A, 11B, 11C, and 11D, for example, the th board 1311 may include a th printed circuit board, and the second board 1312 may include a second printed circuit board, and the th printed circuit board and the second printed circuit board may be electrically connected to each other through a medium of a conductive material such as solder.
According to various embodiments of the present disclosure, the second plate 1312 may be defined as an interposer.
According to an embodiment of the present disclosure, when light sensor 1300 of fig. 13 is installed in an electronic device (e.g., electronic device 1000 of fig. 10), a gap between light emitter 1354 and an external board (e.g., board 1010 of fig. 10) may be reduced due to second board 1312 protruding relatively.
Fig. 14 is a schematic cross-sectional view illustrating an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, in accordance with an embodiment of the present disclosure.
Referring to fig. 14, in an embodiment of the present disclosure, the electronic device 1400 may include at least the portion of the electronic device 101 of fig. 1, the -th external electronic device 102 of fig. 2, the electronic device 400 of fig. 4A, or the electronic device 500 of fig. 5.
According to embodiments of the present disclosure, the electronic device 1400 may include a sheet 1410, a display 1430, and a light sensor 1450.
According to embodiments of the present disclosure, the plate 1410 may be similar or identical to the th cover 510-1 of FIG. 5. for example, the plate 1410 may include a th region 1411 (e.g., the th region 510-11 of FIG. 5) covering the display 1430 and a second region 1412 (e.g., the second region 510-12 of FIG. 5) disposed at a periphery of the th region 1411.
For example, display 1430 may include a surface 14301 (e.g., display surface 5301 of fig. 5) facing in a -th direction 140011 (e.g., -th direction 50011 of fig. 5), a surface 14302 (e.g., display second surface 5302 of fig. 5) facing in a second direction 140021 (e.g., second direction 50021 of fig. 5) opposite to a -th direction 140011, and a third surface 14303 (e.g., display third surface 5303 of fig. 5) facing in a third direction 140031 (e.g., third direction 50031 of fig. 5) perpendicular to a -th direction 140011.
The light sensor 1450 may include a printed circuit board 1451, an interposer 1452, a light receiving element 1453, and a light emitting element 1454 according to an embodiment of the present disclosure.
According to an embodiment of the present disclosure, the printed circuit board 1451 may include a fourth surface 1451a facing the -th direction 140011, and a fifth surface 1451b facing the second direction 140021 a light receiving element (or light receiving sensor) 1453 may be mounted on the fourth surface 1451a, and may be disposed under or below the display 1430.
According to an embodiment of the present disclosure, the light sensor 1450 may include a cover 1455 coupled to the fourth surface 1451a of the printed circuit board 1451, and the cover 1455 may be disposed between the printed circuit board 1451 and the display 1430. The cover 1455 may have a space formed therein to accommodate the light receiving element 1453, and the cover 1455 may include a penetrating hole 1455a vertically aligned with the light receiving element 1453. External light may enter the light receiving element 1453 through the sheet 1410, the display 1430, and the through hole 1455 a. The cover 1455 may include a light blocking material according to an embodiment of the present disclosure.
According to an embodiment of the present disclosure, the interposer 1452 is an element for disposing the light emitting elements 1454 closer to the board 1410, and may include a sixth surface 1452a facing the -th direction 140011, and a seventh surface 1452b facing the second direction 140021 and coupled to the printed circuit board 1451 the interposer 1452 may be inserted into a space 1458 formed under or below the second region 1412 of the board 1410 and beside the third surface 14303 of the display 1430, the light emitting elements 1454 may be mounted on the sixth surface 1452a, and may be disposed under or below the second region 1412 of the board 1410.
Although not shown, the interposer 1452 may include a housing of insulating material (e.g., the housing 1340 of fig. 13), and or more conductors (e.g., 1351, 1352) electrically connected between the sixth and seventh surfaces 1452a, 1452b of the housing (such as the second board 1312 of fig. 13), according to embodiments of the present disclosure.
In accordance with embodiments of the present disclosure, the interposer 1452 may include a printed circuit board including at least internal layers formed in accordance with the fabrication flow described above with reference to fig. 11A, 11B, 11C, and 11D.
According to various embodiments of the disclosure, a sixth surface 1452a of the interposer 1452 on which the light-emitting elements 1454 are mounted is farther from a fourth surface 1451a of the printed circuit board 1451 than the second surface 14302 of the display 1430. However, this should not be seen as limiting.
For example, although not shown, a sixth surface 1452a of the interposer 1452, on which the light emitting elements 1454 are mounted, may be disposed at a smaller distance from a fourth surface 1451a of the printed circuit board 1451 than the second surface 14302 of the display 1430. According to an embodiment of the disclosure, a distance between a sixth surface 1452a of the interposer 1452 on which the light emitting elements 1454 are mounted and a fourth surface 1451a of the printed circuit board 1451 may be the same as a distance between the second surface 14302 of the display 1430 and the fourth surface 1451a of the printed circuit board 1451.
The light emitting elements 1454 may include various light sources such as IR LEDs, laser diodes (e.g., vertical cavity surface emitting lasers (VSELs)), according to embodiments of the present disclosure.
According to various embodiments of the present disclosure, the electronic device 1400 may further include a light blocking element to prevent light output from the light emitting unit 1454 from entering at least portions of the display 1430 for example, the electronic device 1400 may include a light blocking material (e.g., the light blocking material 981 of FIG. 9) covering at least portions of the side surface 14303 of the display 1430.
Fig. 15 is a schematic cross-sectional view illustrating an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, in accordance with an embodiment of the present disclosure.
Referring to fig. 15, in an embodiment of the present disclosure, electronic device 1500 may include at least portion of electronic device 101 of fig. 1, external electronic device 102 of fig. 2, electronic device 400 of fig. 4, or electronic device 500 of fig. 5.
According to embodiments of the present disclosure, electronic device 1500 may include a board 1510, a display 1530, and a light sensor 1550.
According to embodiments of the present disclosure, the plate 1510 may be similar to or the same as the th cover 510-1 of FIG. 5. for example, the plate 1510 may include a th region 1511 (e.g., the th region 510-11 of FIG. 5) covering the display 1530 and a second region 1512 (e.g., the second region 510-12 of FIG. 5) disposed at the periphery of the th region 1511.
According to embodiments of the present disclosure, the light sensor 1550 may include an th cover 1555 (e.g., the cover 1455 of fig. 14) coupled to the printed circuit board 1551, and a th cover 1555 may be disposed between the printed circuit board 1551 and the display 1530 external light may enter the light receiving element 1553 through a th penetration hole 1555a (e.g., the penetration hole 1455a of fig. 14) of the board 1510, the display 1530, and the th cover 1555 the elements including the th cover 1555 and the light receiving element 1553 are defined as a light receiving unit or a light receiving module according to various embodiments of the present disclosure.
According to an embodiment of the present disclosure, the light sensor 1550 may include a second cover 1556 coupled to the printed circuit board 1551, and the second cover 1556 may be disposed between the printed circuit board 1551 and the second region 1512 of the plate 1510. The light emitting elements 1554 may be disposed in a space formed by the second cover 1556, and the second cover 1556 may include second penetration holes 1556a vertically aligned with the light emitting elements 1554. Light output from the light emitting element 1554 may be discharged to the outside through the second penetration hole 1556 a. According to an embodiment of the disclosure, the second cover 1556 may include a light blocking material. According to various embodiments of the present disclosure, the elements including the second cover 1556 and the light emitting element 1554 are defined as a light emitting unit or a light emitting module.
According to an embodiment of the present disclosure, the second penetration holes 1556a of the second cover 1556 may provide a function (e.g., a function of enhancing directivity, or a function of guiding or changing a light direction) of releasing light output from the light emitting elements 1554 (e.g., laser diodes) to the outside substantially through the second region 1512 of the plate 1510.
According to an embodiment of the present disclosure, a distance 1559 of the second penetration hole 1556a of the second cover 1556 to the plate 1510 may be shorter than a distance (not shown) of the second surface 15302 of the display 1530 to the plate 1510. The distance 1559 of the second penetration hole 1556a of the second cover 1556 and the plate 1510 may be differently formed according to various embodiments of the present disclosure.
The th cover 1555 and the second cover 1556 may be formed of body structures according to various embodiments of the disclosure.
Fig. 16 is a schematic cross-sectional view illustrating an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, in accordance with an embodiment of the present disclosure.
Referring to fig. 16, in an embodiment of the present disclosure, the electronic device 1600 may include the electronic device 101 of fig. 1, the -th external electronic device 102 of fig. 2, the electronic device 400 of fig. 4A, or the electronic device 500 of fig. 5.
According to embodiments of the present disclosure, electronic device 1600 may include a board 1610, a display 1630, and a light sensor 1650.
For example, the panel 1610 may include a th region 1611 (e.g., th region 510-11 of FIG. 5) covering the display 1630 and a second region 1612 (e.g., second region 510-12 of FIG. 5) disposed at a periphery of the th region 1611.
The light sensor 1650 may include a mounting plate 1651, and a light receiving element (or light receiving unit) 1653 and a light emitting element (or light emitting unit) 1654 that are mounted on the mounting plate 1651, respectively, according to an embodiment of the present disclosure. Light receiving element 1653 may be aligned with display 1630, and external light may enter light receiving element 1653 through panel 1610 and display 1630. The light emitting element 1654 may be aligned with the second region 1612 of the board 1610, and light output from the light emitting element 1654 may be discharged to the outside through a space 1658 formed beside the display 1630 and the board 1610.
The mounting plate 1651 may include a front surface 1651a facing the plate 1610 and a rear surface 1651b facing the front surface 1651a, according to embodiments of the disclosure. According to an embodiment of the present disclosure, a recess 1651c may be formed on the front surface 1651a of the mounting plate 1651, and the light receiving element 1653 may be disposed in the recess 1651 c.
According to embodiments of the present disclosure, the mounting board 1651 may comprise a printed circuit board comprising at least internal layers formed according to the manufacturing flow described above with reference to fig. 11A, 11B, 11C, and 11D.
According to various embodiments of the present disclosure, the electronic device 1600 may further include a light blocking element to prevent light output from the light emitting unit 1654 from entering at least portions of the display 1630 for example, the electronic device 1600 may include a light blocking material (e.g., the light blocking material 981 of FIG. 9) covering at least portions of a side surface (e.g., the third surface 10303 of FIG. 10).
FIG. 17A is a view from the front of an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, in accordance with an embodiment of the disclosure FIG. 17B is a cross-sectional view of the electronic device corresponding to A-A of FIG. 17A, in accordance with an embodiment of the disclosure.
Referring to fig. 17A, an electronic device 1700 may include a case 1705 (e.g., case 410 of fig. 4A or 4B), the case 1705 including a front surface 1701 (e.g., th surface 4001 of fig. 4), a back surface (e.g., second surface 4002 of fig. 4B), and side surfaces 1703 (e.g., third surface 4003 of fig. 4A or 4B) surrounding a space between the front surface 1701 and the back surface, according to another embodiment of the present disclosure (not shown), the case may indicate a structure forming part of the front surface 1701, the back surface, and the sides 1703. referring to fig. 17B, the front surface 1701 may be formed of a front surface plate 1710 having at least portions substantially transparent (e.g., a glass plate or a polymer plate including various coatings).
In embodiments of the present disclosure, referring to FIG. 17B, the display 1730 may be exposed through the front surface board 1710 and may include through holes 1734. according to embodiments of the present disclosure, the light sensor 1750 may include a light receiver 1753 disposed adjacent to the back surface 1732 of the display 1730, and a light emitter 1754 disposed in the through hole 1734 of the display 1730. for example, the light sensor 1750 may be similar to or the same as the light sensor 1050 of FIG. 10, the light sensor utilizing a printed circuit board of FIG. 12F, the light sensor 1300 of FIG. 13, the light sensor 1450 of FIG. 14, or the light sensor of FIG. 15. As shown, the light sensor 1750 may include a protruding structure to allow insertion of a portion in which the light emitter 1754 is mounted into the through hole 1734, and the protruding structure may reduce a gap between the light emitter 1754 and the front surface board 1710.
According to an embodiment of the present disclosure, the photosensor 1750 may be replaced with the photosensor 550, 560 of fig. 5, the photosensor 600 of fig. 6, the photosensor 750 of fig. 7, the photosensor 850 of fig. 8, the photosensor 900 of fig. 9, the photosensor 1500 of fig. 15, or the photosensor 1650 of fig. 16, and the mounting structure of the alternative photosensor may also be changed.
In an embodiment of the present disclosure, referring to fig. 17A and 17B, the front surface plate 1710 may include an -th region 1710a aligned with the light receiver 1753, and a second region 1710B aligned with the penetration hole 1734 of the display 1730 external light may enter the light receiver 1753 through the -th region 1710a and the display 1730 light output from the light emitter 1754 may be released to the outside through the second region 1710B.
Although not shown, the display 1730 may also include additional through vias utilized by various other optical devices, such as a camera module (or image sensor), according to various embodiments of the present disclosure. For example, referring to fig. 17A, external light may enter the camera module through the third region 1710c of the front surface board 1710 aligned with the penetration hole.
Referring to fig. 17A, side-face bounding frame structure 1740 may include a -th side-face member 1741 (e.g., -frame 410-31 of fig. 4A), a second side-face member 1742 (e.g., second frame 410-32 of fig. 4A), a third side-face member 1743 (e.g., third frame 410-33 of fig. 4A), and a fourth side-face member 1744 (e.g., fourth frame 410-34 of fig. 4A.) third side-face member 17482 may be parallel to second side-face member 1742 and may be spaced parallel to second side-face member 1742 in the y-axis direction-third side-face member 1743 may be parallel to fourth side-face member 1744 and may be spaced parallel to fourth side-face member 1744 in the x-axis direction-according to embodiments of the present disclosure, third region 1710a, second region 1710b, or third region 1710c of front plate 1710 may be disposed closer to third side-face member 1744 in third region 1710 461, fourth side-face member 1744, fourth side-face region 1710 461, or fourth side-face member 1744 in embodiments of the present disclosure.
FIG. 18A is a front view of an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, in accordance with an embodiment of the disclosure FIG. 18B is a cross-sectional view of the electronic device corresponding to B-B of FIG. 18A, in accordance with an embodiment of the disclosure.
Referring to fig. 18A, electronic device 1800 may include a housing 1805 (e.g., housing 410 of fig. 4A or 4B), the housing 1805 including a front surface 1801 (e.g., surface 4001 of fig. 4), a rear surface (e.g., second surface 4002 of fig. 4B), and side surfaces 1803 (e.g., third surface 4003 of fig. 4A or 4B) surrounding a space between front surface 1801 and the rear surface, housing 1805 may include a side surface bezel structure 1840 forming side surfaces 1803, and side surface bezel structure 1840 may include a -th side surface member 1841 (e.g., -th side surface member 1741 of fig. 17A), a second side surface member 1842 (e.g., second side surface member 1742 of fig. 17A), a third side surface member 1843 (e.g., third side surface member 1743 of fig. 17A), and a fourth side surface member 1844 (e.g., fourth side surface member 1744 of fig. 17A).
In an embodiment of the present disclosure, referring to fig. 18A and 18B, the display 1830 may be exposed through a front surface plate 1810 forming a front surface 1801 and may include a notch 1834 recessed in a direction from a -side surface member 1841 to a second side surface member 1842, for example, the notch 1834 may have an edge formed in a "U" shape and may be defined as a "U-shaped cutout". according to an embodiment of the present disclosure, the photosensor 1850 may include a photo receiver 1853 disposed adjacent to a rear surface 1832 of the display 1830 and a photo emitter 1854 disposed in the notch 1834 of the display 1830, for example, the photosensor 1850 may be similar or identical to the photo sensor 1050 of fig. 10, the photo sensor using a printed circuit board of fig. 12F, the photo sensor 1300 of fig. 13, the photo sensor 1450 of fig. 14, or of the photo sensor 1550 of fig. 15, a portion on which the photo emitter 1854 is mounted may be inserted into the notch 1834, and the structure may reduce a gap between the photo emitter 1854 and the front surface plate.
According to embodiments of the present disclosure, light sensor 1850 may be replaced with light sensor 550, 560 of fig. 5, light sensor 600 of fig. 6A or 6B, light sensor 750 of fig. 7, light sensor 850 of fig. 8, light sensor 900 of fig. 9, light sensor 1500 of fig. 15, or light sensor 1650 of fig. 16, and the mounting structure of the alternative light sensor may also be changed.
According to embodiments of the present disclosure, an optical device such as a camera module 1860 (e.g., or an image sensor) may be aligned with the recess 1834 according to embodiments of the present disclosure, the camera module 1860 may be inserted into the recess 1834 according to embodiments of the present disclosure, a distance d1 between the camera module 1860 and the third side surface member 1843, and a distance d2 between the camera module 1860 and the fourth side surface member 1844 may be the same as each other according to embodiments of the present disclosure, the th distance d1 and the second distance d2 may be different from each other, the light emitter 1854 may be disposed between the light receiver 1853 and the camera module 1860 when viewed from the front surface 1801.
Although not shown, the divider that divides light sensor 1850 and camera module 1860 may extend to notch 1834 according to various embodiments of the present disclosure, the divider may be an portion of a support member (e.g., a middle plate or bracket) that extends from or is coupled to side surface border structure 1840.
FIG. 19A is a front view of an electronic device including at least light emitters and at least light receivers arranged adjacent to a display, in accordance with an embodiment of the disclosure FIG. 19B is a cross-sectional view of the electronic device corresponding to C-C of FIG. 19A, in accordance with an embodiment of the disclosure.
Referring to fig. 19A, electronic device 1900 may include a housing 1905 (e.g., housing 410 of fig. 4A or 4B), the housing 1905 including a front surface 1901 (e.g., -th surface 4001 of fig. 4), a rear surface (e.g., second surface 4002 of fig. 4B), and a side surface 1903 (e.g., third surface 4003 of fig. 4A or 4B) surrounding a space between front surface 1901 and the rear surface, housing 1905 may include a side surface bezel structure 1940 forming side surface 1903, and side surface bezel structure 1940 may include a -th side surface member 1941 (e.g., -th side surface member 1741 of fig. 17A), a second side surface member 1942 (e.g., -th side surface member 1742 of fig. 17A), a third side surface member 1943 (e.g., fourth side surface member 1743 of fig. 17A), and a fourth side surface member 1944 (e.g., fourth side surface member 1744 of fig. 17A).
In an embodiment of the present disclosure, referring to fig. 19A and 19B, the display 1930 may be exposed through a front surface plate 1910 forming the front surface 1901, and may include a notch 1934, the notch 1934 being recessed near a coupling portion 1945 coupling the -th and fourth side surface members 1941 and 1944 to each other, for example, the notch 1934 may have an edge formed in an "L" shape, and may be defined as an "L-shaped cutout". according to an embodiment of the present disclosure, the photosensor 1950 may include a photo receiver 1953 arranged adjacent to a rear surface 1932 of the display 1930, and a photo emitter 1954 arranged in the notch 1934 of the display 1930. for example, the photosensor 1950 may be similar or identical to the photosensor 1050 of fig. 10, the photosensor using a printed circuit board of fig. 12F, the photosensor 1300 of fig. 13, the photosensor 1450 of fig. 14, or of the photosensor 1550 of fig. 15.
According to an embodiment of the present disclosure, the photosensor 1950 may be replaced with the photosensors 550, 560 of fig. 5, the photosensor 600 of fig. 6A or 6B, the photosensor 750 of fig. 7, the photosensor 850 of fig. 8, the photosensor 900 of fig. 9, the photosensor 1500 of fig. 15, or the photosensor 1650 of fig. 16, and the mounting structure of the alternative photosensors may also be changed.
According to embodiments of the present disclosure, a plurality of optical devices 1960, 1970, such as camera modules (or image sensors) and LEDs may be aligned with the notch 1934. According to embodiments of the present disclosure, a plurality of optical devices 1960, 1970 may be inserted into notch 1934.
Although not shown, the divider that divides light sensor 1950 and the plurality of optical devices 1960, 1970 may extend to notch 1934 according to various embodiments of the present disclosure, the divider may be a portion of a support member (e.g., a middle plate or a bracket) that extends from side surface bezel structure 1940 or is coupled to side surface bezel structure 1940.
Fig. 20 is a cross-sectional view of a portion of an electronic device showing a light-receiving unit including at least light sensors arranged adjacent to a display, in accordance with an embodiment of the present disclosure.
Fig. 21A, 21B, 21C, and 21D are cross-sectional views illustrating an electrical connection structure between layers according to various embodiments of the present disclosure.
According to various embodiments of the disclosure, the electronic device 1000 may be of the electronic device 101 of fig. 1, the electronic device 201 of fig. 2, the electronic device 400 of fig. 4A, the electronic device 500 of fig. 5, the electronic device 700 of fig. 7, the electronic device 800 of fig. 8, the electronic device 1000 of fig. 10, the electronic device 1300 of fig. 13, the electronic device 1400 of fig. 14, the electronic device 1500 of fig. 15, the electronic device 1600 of fig. 16, the electronic device 1700 of fig. 17A or 17B, the electronic device 1800 of fig. 18A or 18B, or the electronic device of fig. 19A or 19B.
Referring to fig. 20, an electronic device 2000 may include a light transmissive substrate 2010, a th panel 2020, a second panel 2030, a light sensor 2090, and a PCB2060 according to an embodiment of the present disclosure.
According to an embodiment of the present disclosure, the light-transmitting substrate 2010 may be similar to or the same as the th cover 510-1 of fig. 5, and thus a detailed description thereof is omitted.
According to an embodiment of the present disclosure, the th panel 2020 may be disposed under or below the light-transmitting substrate 2010 the th panel 2020 may be designed to have a display function the th panel 2020 may include a th backplane 2021 and a pixel layer 2022 disposed on the th backplane 2021 according to an embodiment of the present disclosure the th backplane 2021 may include a substrate (not shown) formed of various materials such as Polyimide (PI), polymer, and the like, a plurality of gate lines and a plurality of data lines mounted on the substrate, and a plurality of switches.
According to various embodiments of the present disclosure, th panel 2020 may include a conductive pattern 2023 disposed between a light transmissive substrate 2010 and a pixel layer 2022. the conductive pattern 2023 may be used to detect touch or hover inputs according to various embodiments of the present disclosure, the conductive pattern 2020 may include aluminum (Al), copper (Cu), silver (Ag), graphene, Indium Tin Oxide (ITO), or Indium Zinc Oxide (IZO), etc. electronic device 2000 may include a touch/hover input detection circuit (not shown) electrically connected to the conductive pattern 2023. the touch/hover input detection circuit may activate at least portions of the conductive pattern 2023 based on signals from a control circuit, e.g., processor 120 of fig. 1 or processor 210 of fig. 2. the touch/hover input detection circuit may detect signals related to touch or hover inputs through the conductive pattern 2023 and may provide the signals to the control circuit.
According to various embodiments of the present disclosure, the th panel 2020 may further include or more layers (not shown) disposed between the light-transmissive substrate 2010 and the conductive pattern 2023, or between the conductive pattern 2023 and the pixel layer 2022. for example, or more layers may include an adhesive material (e.g., OCA) for coupling between the layers. for example, or more layers may include at least of a polarizing layer, a phase difference layer, a birefringence compensation layer, an anti-glare layer, a brightness enhancement layer, a visual compensation layer, or an anti-reflection layer, which are related to image quality.
According to various embodiments of the present disclosure, at least a portion of the th panel 2020 may be designed to be flexible according to embodiments of the present disclosure, the th panel 2020 may be disposed along at least a portion of the translucent substrate 2010.
According to embodiments of the present disclosure, the second panel 2030 may be disposed below or beneath the panel 2020 according to embodiments of the present disclosure, the second panel 2030 may include a second base 2031 the second base 2031 may include a substrate (not shown) formed of various materials such as Polyimide (PI) or polymers and a plurality of wires mounted thereon according to embodiments of the present disclosure the second panel 2030 may include or a plurality of layers 2032 disposed between the panel 2020 and the second base 2031.
According to embodiments of the present disclosure, the second panel 2030 may include recesses 2033 that are recessed toward a direction 200011 (e.g., direction 50011 of fig. 5. or more layers 2032 of the second panel 2030 may include at least 3874-th layers 2032a disposed above the spaces 20331 (e.g., 742 of fig. 7) of the recesses 2033 and at least second layers 2032b disposed below or below at least -th layers 2032a and forming the spaces 20331 of the recesses 2033. according to various embodiments of the present disclosure, at least of the first layers 2034 a or the second layers 2032b may be designed to be flexible.
According to various embodiments of the present disclosure, a display (e.g., 530 of fig. 5) may be designed to include the th panel 2020 and at least a portion of the second panel 2030.
According to various embodiments of the present disclosure, the optical sensor 2090 may include the optical sensor 600 of fig. 6A, the optical sensor 750 of fig. 67, the optical sensor 850 of fig. 8, the optical sensor 990 of fig. 9, the optical sensor 1050 of fig. 10, the optical sensor 1205 using a printed circuit board of fig. 12F, the optical sensor 1300 of fig. 13, the optical sensor 1450 of fig. 14, the optical sensor 1550 of fig. 15, the optical sensor 1650 of fig. 16, the optical sensor 1750 of fig. 17B, the optical sensor 1850 of fig. 18B, or the of the optical sensor 1950 of fig. 19B the optical sensor 2090 may include, for example, an optical sensor substrate 2091 (e.g., 601 of fig. 6A) and an optical receiving unit (or optical receiving module) 2092 (e.g., 603 of fig. 6A) the optical sensor substrate 2091 may include a substrate second surface 20311 facing the direction of the second direction 209 200011 of the substrate and a substrate second surface 20912 facing the second direction 20957 the optical receiving unit 2092 may be disposed on the substrate 20311, the optical receiving unit 2092 may be disposed under the optical sensor substrate 2030, the optical receiving unit 2030 may be disposed under the optical sensor substrate 2030, the optical sensor substrate 2030 may be disposed under the optical sensor substrate 2030.
According to various embodiments of the present disclosure, at least portions of the th panel 2020 and the second panel 2030 may be designed to have a light transmitting property (e.g., light transmittance of about 30% or more). external light may pass through the light transmitting substrate 2010, the th panel 2020, and portions (e.g., layer 2032a) of the second panel 2030 and may enter the light receiving unit 2092.
According to an embodiment of the present disclosure, the electronic device 2000 may include connection portions 2081, 2082 disposed between the second base 2031 of the second panel 2030 and the light sensor substrate 2091 of the light sensor 2090. The connection portions 2081, 2082 may be electrically connected between the second base 2031 of the second panel 2030 and the light sensor substrate 2091 of the light sensor 2090.
According to embodiments of the present disclosure, the connection portions 2081, 2082 may include or more contacts (not shown) disposed on the second base plate 2031 and or more second contacts disposed on the photosensor substrate 2091 according to embodiments of the present disclosure, the contact of the second base plate 2031 and the second contact of the photosensor substrate 2091 may be coupled to each other by thermal bonding, according to various embodiments of the present disclosure, when the photosensor substrate 2091 of the photosensor 2090 is disposed between the second base plate 2031 and the middle plate 2070 and designed to be supported by the middle plate 2070, the or second contact may include a flexible conductive member, for example, the flexible conductive member may include a C-clip 2110, a spring, conductive phorone, and rubber, a conductive tape, or a copper connector.
PCB2060 may be disposed below or beneath midplane 2070 PCB2060 may include PCB surface 20601 facing in -direction 200011 and PCB second surface 20602 facing in second direction 200021 (e.g., second direction 50021 of fig. 5) PCB2060 may include a substrate including a plurality of components related to various operations of electronic device 2000 and signal lines (e.g., conductive traces) or pads for electrically connecting the components at least portions of the various elements of fig. 2 (e.g., or more processors 210 (e.g., APs), communication module 220, subscriber identification module 224, memory 230, sensor module 240, input device 250, display 260, interface 270, audio module 280, camera module 291, power management module 295, battery 296, indicator 297, or motor 298) may be mounted on PCB2060 or may be electrically connected to PCB2060 in accordance with various embodiments of the present disclosure.
The second base plate 2031 of the second panel 2030 may be electrically connected with the PCB 2060. according to an embodiment of the present disclosure, the second base plate 2031 of the second panel 2030 may include an extension portion 20312 extending from an side thereof, the extension portion 20312 may include a connector 20314 disposed at an end 20313 thereof , the connector 20314 of the extension portion 20312 may be coupled to a connector 10614 formed on the PCB 1060. the connector 20614 of the PCB2060 may be disposed on the PCB second surface 20602.
According to an embodiment of the present disclosure, the extension portion 20312 of the second bottom plate 2031 may have flexibility. According to an embodiment of the present disclosure, the extension portion 20312 of the second base plate 2031 may be mounted in the electronic device 2000 in a bent form toward the PCB second surface 20602 of the PCB 2060. According to embodiments of the present disclosure, the extension portion 20312 may be designed to pass through a space 20704 (or a penetration portion) between the middle plate 2070 and the side members 2080 (e.g., 510-3 of fig. 5) and be coupled to the PCB 2060.
According to various embodiments of the present disclosure, a flexible conductive member (e.g., FPCB) may be provided instead of the extension portion 20312 of the second base plate 2031, although not shown, and the second base plate 2031 and the PCB2060 may be connected to each other by using the FPCB.
The th backplane 2021 of the panel 2020 may be electrically connected to the second backplane 2031 of the second panel 2030 according to embodiments of the present disclosure, the electronic device 2000 may include a flexible conductive member 2040 (e.g., a FPCB) that electrically connects the th backplane 2021 and the second backplane 2031 the flexible conductive member 2040 may be arranged in a curved formation, and a end 2041 of the flexible conductive member 2040 may be connected to the th backplane 2021, and another end 2042 of the flexible conductive member 2040 may be connected to the second backplane 2031.
According to embodiments of the present disclosure, the backplane 2021 may include a backplane first surface 20211 facing the -th direction 200011, and a backplane second surface 20212 facing the second direction 200021 according to embodiments of the present disclosure, a portion 20211a of the backplane first surface 20211 of the backplane 2021 may be designed to be exposed according to embodiments of the present disclosure, an end 2041 of the flexible conductive member 2040 may be connected to the portion 20211a of the backplane first surface 20211, for example, for a connection portion 2083 between the end 2041 of the flexible conductive member 2040 and the portion 20211a of the backplane first surface 20211, although not shown, various connection structures such as thermal bonding between contacts, coupling between connectors, and the like may be applied.
Although not shown, portions of the backplane second surface 20212 may be designed to be exposed and may be used as portions to be connected to the end 2041 of the flexible conductive member 2040, according to various embodiments of the present disclosure.
Referring to fig. 21A, according to various embodiments of the present disclosure, the th panel 2120a may be designed to protrude from an adjacent portion of the second panel 2130a in a fourth direction 210041 (e.g., 200041 of fig. 20), and the exposed portion 2121aa of the bottom plate second surface 2140a may be connected with the end 2140aa of the flexible conductive member 2140 a.
Referring to fig. 20, according to an embodiment of the present disclosure, the second base plate 2031 may include a base plate third surface 20311 facing a -th direction 210011 (e.g., the -th direction 200011 of fig. 20) and a base plate fourth surface 20312 facing a second direction 200021 according to an embodiment of the present disclosure, the other end 2042 of the flexible conductive member 2040 may be connected to the base plate fourth surface 20312 of the second base plate 2031, for example, for a connection portion 2084 between the other end 2042 of the flexible conductive member 2040 and the backplane fourth surface 20312, although not shown, various connection structures may be employed, such as thermal bonding between contacts, coupling between connectors, and the like.
In various embodiments of the present disclosure, the portion of the bottom plate third surface 20311 can be designed to be exposed, and the portion of the bottom plate third surface 20311 can be used as part of the other end 2042 to be connected to the flexible conductive member 2140. in various embodiments of the present disclosure, referring to fig. 21B, the second bottom plate 2131B of the second panel 2130B can be designed to protrude toward the fourth direction 210041 (e.g., 200041 of fig. 20), and the exposed portion 2131bb of the bottom plate third surface can be connected with the end 2140bb of the flexible conductive member 2140B. in various embodiments of the present disclosure, referring to fig. 21C, the second bottom plate 2131C of the second panel 2130C can be designed to protrude toward the fourth direction 210041 (e.g., 200041 of fig. 20), and the exposed portion 2131cc of the bottom plate fourth surface can be connected with the end 0cc of the flexible conductive member 2140C.
Although not shown, the th base plate 2021 may be designed to include extensions in place of the flexible conductive members 2040 according to various embodiments of the present disclosure.
Referring to fig. 21D, the bottom plate 2121D of the th panel 2120D may include an extension 2121D-1 extending from a side thereof the end 2121dd of the extension 2121D-1 may employ a connection structure between the flexible conductive member 2040 and the second bottom plate 2031 shown in fig. 20, a connection structure between the flexible conductive member 2140B and the second bottom plate 2031B shown in fig. 21B, or a connection structure between the flexible conductive member 2140C and the second bottom plate 2031C shown in fig. 21C.
Referring to fig. 20, the flexible conductive member 2040 may be mounted in a bent form in the electronic device 2000, according to an embodiment of the present disclosure. The curved portion 2043 of the flexible conductive member 2040 may be designed to have various radii of curvature R1 (e.g., about 10mm or less). According to various embodiments of the present disclosure, the electronic device 2000 may include a support member (not shown) to maintain the curved form of the curved portion 2043 of the flexible conductive member 2040. According to various embodiments of the present disclosure, the inner surface of the housing (e.g., bezel) may be designed to include a curved surface, and the curved portion 2043 of the flexible conductive member 2040 may remain in a curved form due to the inner surface of the housing.
According to various embodiments of the present disclosure, the panel 2020 may be electrically connected with the PCB2060 through the flexible conductive member 2040 and the second backplane 2031 of the second panel 2030, the control circuit 20605 (e.g., the processor 120 of FIG. 1 or the processor 210 of FIG. 2) mounted on the PCB2060 may control the display through the display panel (e.g., the back plate 2021 and the pixel layer 2022) of the panel 2020, the control circuit 20605 mounted on the PCB2060 may detect a touch input or a hover input by using the conductive pattern 2023 of the panel 2020.
The electronic device 2000 may include, for example, at least electronic components 2045 mounted on the flexible conductive member 2040 according to an embodiment of the present disclosure, the flexible conductive member 2040 may be formed in a film shape and may include side surfaces 20401, 20402 at least electronic components 2045 may be mounted on surfaces 20401 of the flexible conductive member 2040 so as to be arranged in a space formed in a curved form.
According to an embodiment of the present disclosure, at least electronic components 2045 may include a display driving driver (e.g., a Display Driver IC (DDI)). DDI may be a component in the form of a chip for driving a plurality of pixels included in panel 2020. for example, DDI may control switches (e.g., transistors) connected to the pixels under the control of a control circuit 20605 (e.g., processor 120 of fig. 1 or processor 210 of fig. 2) mounted on PCB 2060. according to an embodiment of the present disclosure, DDI may include a gate Integrated Circuit (IC) or a source IC (not shown).
According to an embodiment of the present disclosure, a structure for connecting at least electronic components 2045 (e.g., DDIs) to the th panel 2020 may be a Chip On Film (COF) structure for connecting flexible conductive members (e.g., FPCBs), wherein at least electronic components 2045 are mounted to the th backplane 2021 of the th panel 2020, as shown in fig. 20.
According to an embodiment of the present disclosure, although not shown, a structure for connecting at least electronic components 2045 (e.g., DDIs) to the th panel 2020 may be a chip on board (COP) structure for directly mounting at least components 2045 on the extension 2121D-1 of the th back plate 2121D of fig. 21D.
Referring to fig. 20, according to various embodiments of the present disclosure, at least electronic components 2045 may be disposed on the portion of the flexible conductive member 2040 other than the curved portion 2043 according to embodiments of the present disclosure, at least electronic components 2045 may be disposed between the th base plate 2021 and the middle plate 2070 according to embodiments of the present disclosure, the second panel 2030 may include a space 2034 for accommodating at least electronic components 2045 so as to mount the flexible conductive member 2040 in a curved form and have at least electronic components 2045 disposed between the th base plate 851 and the middle plate 2070. the space 2034 may be a recess recessed in the direction 200011 or the fourth direction 200041, for example.
According to an embodiment of the present disclosure, the electronic device 2000 may include a middle plate 2070 disposed between the second panel 2030 and the PCB2060, the middle plate 2070 may include a mounting surface 20701 facing the th direction, and a second mounting surface 20702 facing the second direction 200021, a space may be formed between the mounting surface 20701 and the transparent substrate 2010 where components such as the th member 2020, the second panel 2030, the light sensor 2090, and the flexible conductive member 2040 are coupled to each other, the PCB2060 may be coupled to the second mounting surface 20702.
According to various embodiments of the present disclosure, the electronic device 2000 may include light sources (or lighting units) arranged on regions that avoid overlapping with the display (e.g., th panel 2020). according to various embodiments of the present disclosure, lighting units or lighting units may be included in the light sensor 2090 (e.g., a proximity sensor) or may be included in other light sensors (e.g., a biometric sensor) than the light sensor 2090 (e.g., an iris recognition sensor).
Fig. 22 is a block diagram illustrating an electronic device including a light emitting unit and a light receiving unit of at least light sensors arranged adjacent to a display, according to an embodiment of the present disclosure.
Referring to fig. 12, electronic device 2200 may include of electronic device 101 of fig. 1, electronic device 201 of fig. 2, electronic device 400 of fig. 4A, electronic device 500 of fig. 5, electronic device 700 of fig. 7, electronic device 800 of fig. 8, electronic device 900 of fig. 9, electronic device 1000 of fig. 10, electronic device 1400 of fig. 14, electronic device 1500 of fig. 15, electronic device 1600 of fig. 16, electronic device 1700 of fig. 17A or 17B, electronic device 1800 of fig. 18A or 18B, or electronic device of fig. 19A or 19B, in accordance with various embodiments of the present disclosure.
According to embodiments of the present disclosure, the electronic device 2200 may include a light detection device 2240, a display 2230, and a processor 2210 the light detection device 2240 (or light sensor module) may include at least light receiving units (or light receiving modules) 2241 and at least light emitting units (or light emitting modules) 2242 according to various embodiments of the present disclosure, the light detection device 2240 may be mounted as a common structure with the display 2230, as shown in fig. 4A, 4B, 5, 7, 8, 9, 10, 14, 15, 16, 17A, 17B, 18A, 18B, 19A, or 19B, according to embodiments of the present disclosure, at least light receiving units 2241 may be disposed on at least portions of the rear surface of the display 2230, and at least light emitting units 2242 may be disposed in or under or in a lateral space of the display 2230.
According to an embodiment of the present disclosure, the display 2230 may include a light transmissive material, and external light may pass through the display 2230 and enter the light receiving unit 2241. The light receiving unit 2241 may receive light (or a light signal) scattered or reflected from a subject, and may generate an electrical signal (or a digital value) based on the received light.
According to an embodiment of the present disclosure, light output from the light emitting unit 2242 may pass through a portion vertically aligned with the light emitting unit 2242, for example, a light-transmitting substrate (for example, th cover 510-1 of fig. 1) having a light transmittance higher than that of the display 2230, and may be released to the outside.
According to embodiments of the present disclosure, the light receiving unit 2241 may include or more light detectors (or sensors) (e.g., photodiodes) (not shown) to detect or more wavelength bands of light the light receiving unit 2241 may further include cover 1555 of fig. 15, according to various embodiments of the present disclosure.
According to various embodiments of the present disclosure, the light receiving unit 2241 may include a plurality of light detectors, and the plurality of light detectors may detect light of at least different wavelength bands, for example, light detectors may detect light of wavelength band, and another light detectors may detect light of a second wavelength band different from wavelength band.
According to various embodiments of the present disclosure, the light receiving unit 2241 may include a plurality of photodetectors, and the plurality of photodetectors may detect light in at least wavelength bands that are similar or identical.for example, photodetectors may detect light in a 0 wavelength band.another 1 photodetector may detect not only light in a second wavelength band different from a wavelength band but also light in a wavelength band.a further photodetector may detect not only light in a third wavelength band different from the and the second wavelength band but also light in a wavelength band.a further photodetector may detect not only light in a fourth wavelength band different from the , the second and the third wavelength bands but also light in a wavelength band.
According to an embodiment of the present disclosure, the light receiving unit 2241 may detect light of a proximity detection wavelength band (e.g., a maximum sensitivity wavelength of about 940nm or about 950 nm.) for example, in a proximity detection mode, when an object (e.g., a user's face) moves close to the light detecting device 2240 (e.g., about 10cm or less) toward an th surface (e.g., the th surface 5001 of fig. 5) of the electronic device 2200, light of the proximity detection wavelength band output from the light emitting unit 2242 may be scattered or reflected by the object, the scattered or reflected light of the proximity detection wavelength band may enter the light receiving unit 2241, and the light receiving unit 2241 may generate an electrical signal related to the proximity of the object or the proximity of the object based on the incident scattered or reflected light.
According to an embodiment of the present disclosure, the light receiving unit 2241 may detect light of a gesture detection wavelength band (e.g., a maximum sensitivity wavelength of about 940 nm.) for example, when a hand of a user moves close (e.g., within about 10cm) to an th surface (e.g., the th surface 5001 of fig. 5) of the electronic device 2200, the light of the gesture detection wavelength band output from the light emitting unit 2242 may be scattered or reflected by the hand of the user in a gesture detection mode.
For example, in a biometric detection mode, when a user's body moves closer to the light detection device 2240 (e.g., about 10cm or less) toward the th surface (e.g., the th surface 5001 of fig. 5) of the mobile device 2200, light of a biometric detection wavelength band output from the light emission unit 2242 may be reflected by the user's body, scattered or reflected light of the biometric detection wavelength band may enter the light reception unit 2241, and the light reception unit 2241 may generate an electrical signal related to biometric information (e.g., skin moisture, skin melanin, skin temperature, heart rate, iris, etc.) of the user's body based on the entering scattered or reflected light.
According to various embodiments of the present disclosure, the light receiving unit 2241 may detect light of an external environment measurement wavelength band. For example, in the illuminance detection mode, the light receiving unit 2241 may receive external light, and may generate an electrical signal related to illuminance based on the received external light.
According to various embodiments of the present disclosure, the electronic device 2200 may provide various detection modes. For example, the detection mode may include various detection modes, such as a proximity detection mode, a gesture detection mode, a biometric detection mode, an illumination detection mode, and so forth. The detection mode may include various dependent detection modes. For example, the biometric detection mode may include a skin moisture detection mode, a skin melanin detection mode, a skin temperature detection mode, and the like.
According to various embodiments of the present disclosure, the electronic device 2200 may provide various multiple detection modes. The multiple detection modes may be defined by selecting multiple detection modes. For example, the multiple detection mode may include a selection of a proximity detection mode and a biometric detection mode. The multiple detection mode may include selection of an illumination detection mode and a biometric detection mode. The multiple detection modes may include selecting a plurality of slave detection modes among the detection modes.
According to an embodiment of the present disclosure, electronic device 2200 may selectively activate at least portions of light receiving unit 2241 according to a selected detection mode, for example, in a proximity detection mode, processor 2210 (e.g., processor 120 of fig. 1 or processor 210 of fig. 2) may select and activate at least light detectors for detecting proximity from a plurality of light detectors.
According to embodiments of the present disclosure, the light emitting unit 2242 may include at least light emitters (or light sources) capable of generating or more wavelength bands of light the light emitting unit 2242 may further include the second cover 1556 of fig. 15 according to various embodiments of the present disclosure.
According to an embodiment of the present disclosure, the light emitting unit 2242 may include a light emitter capable of generating light of all wavelength bands that can be detected by the light receiving unit 2241. For example, the light emitting unit 2242 may be designed with a single light emitter. The single light emitter may be a light emitting element that may generate light of a broad wavelength band.
According to various embodiments of the present disclosure, the light emitting unit 2242 may be designed to selectively generate light of a corresponding wavelength band under the control of the processor 2210. For example, in the proximity detection mode, processor 2210 may control light source 2224 to generate light of a proximity detection wavelength band. For example, in the biometric detection mode, the control circuit may control the light emitting unit 2242 to generate light of a biometric detection wavelength band.
For example, in a proximity detection mode, processor 2210 may select and activate at least light emitters from the plurality of light emitters of light emitting unit 2242.
The light emitting unit 2242 may include various types of light emitting elements according to various embodiments of the present disclosure. For example, the light emitting unit 2242 may include an LED.
According to various embodiments of the present disclosure, the light detecting device 2240 may be provided as a single module in a package form (e.g., the light sensor 600 of fig. 6A, the light sensor 750 of fig. 7, the light sensor 850 of fig. 8, the light sensor 990 of fig. 9, the light sensor 1050 of fig. 10, the light sensor 1300 of fig. 13, the light sensor 1450 of fig. 14, the light sensor 1550 of fig. 15, the light sensor 1650 of fig. 16, the light sensor 1750 of fig. 17B, the light sensor 1850 of fig. 18B, or the light sensor 1950 of fig. 19B).
According to various embodiments of the present disclosure, the light receiving unit 2241 and/or the light emitting unit 2242 may be mounted on a PCB (e.g., 2060 of fig. 20) of the electronic device 2200, the end of the light receiving unit 2241 may be electrically connected to a ground member (e.g., a ground of the PCB) of the electronic device 2200, and the other end of the light receiving unit 2241 may be electrically connected to the processor 2210, the light receiving unit 2241 may detect light, may generate (or convert) an electrical signal based on the detected light, and may transmit the generated electrical signal to the control circuit.
According to various embodiments of the present disclosure, the electronic device 2200 may include a memory 2220. The memory 2220 (e.g., the memory 130 of fig. 1 or the memory 230 of fig. 2) may store various basic OSs necessary for operating the electronic device 2200, and data or application programs and algorithms corresponding to various user functions. According to an embodiment of the present disclosure, the processor 2210 may be electrically connected to the memory 2220, and may perform various operations of the electronic device 2200 by using instructions, information, and the like included in the memory 2220.
According to an embodiment of the present disclosure, the memory 2220 may store display drive instructions 2221. Display driver instructions 2221 may include instructions that cause processor 2210 to control display 2230 while displaying the screen.
According to various embodiments of the present disclosure, the display drive instructions 2221 may include an activation routine for selectively activating at least of the plurality of pixels of the display 2230. for example, the display 2230 may be an AMOLED display having switches (e.g., transistors) mounted for each pixel.
According to various embodiments of the present disclosure, the display drive instructions 2221 may include a pixel activation/deactivation routine that causes pixels to be turned off (or deactivated) in portions of a frame (or image frame). for example, the display drive instructions 2221 may include a pixel drive routine that causes pixels to be turned off in a frame at defined time ratios.according to embodiments of the present disclosure, the display 2230 may be an AMOLED display having switches installed for each pixel.a display drive instruction 2221 may include a pixel drive routine that turns on (active) pixels only for a predetermined time within a frame and turns off (deactivate) pixels at another time . for example, when pixels included in the display 2230 are turned off in portions of a frame, the image may be displayed in black, as if a black image is inserted into the frame . according to various embodiments of the present disclosure, although the light emitting unit 2242 is disposed in or under side spaces of the display 2230 or a light emitting element, and provides at least one pixel output (e.g., a light emitting element) that may be adjusted from a light emitting element in a light emitting element 6747, a light emitting element, which may be adjusted in a light emitting element, which may be adjusted from a light emitting element, which may be adjusted in a light emitting element 6747, even though the light emitting element, which may be adjusted in a light emitting element, e.g., a light emitting element, which may be adjusted in a light emitting pixel 2230, which may be adjusted in a frame, e.g., a light emitting pixel display 2230, which may be adjusted in a light emitting pixel, which may be adjusted in a light emitting element, which is at least as a light emitting element, which may be adjusted in a frame, which may be.
According to various embodiments of the present disclosure, the display driver instructions 2221 may include a Frames Per Second (FPS) setting routine for setting a speed (e.g., FPS) for displaying data for screens-for example, the display driver instructions 2221 may include an FPS setting routine that adjusts the FPS according to various elements such as hardware performance, complexity of displayed graphics, user environment settings (e.g., user perceived reaction time), and so forth.
The memory 2220 may store light detection device driver instructions 2222 the light detection device driver instructions 2222 may include instructions that cause the processor 2210 to adjust at least elements of the light detection device 2240, in accordance with an embodiment of the present disclosure.
According to embodiments of the present disclosure, light detection device driver instructions 2222 may include an activation routine that selects and activates at least portions of light receiving unit 2241 of light detection device 2240. for example, light detection device driver instructions 2222 may include an activation routine that selects and activates at least portions of light receiving unit 2241 of light detection device 2240 based on a selected (or executed) detection mode.
According to embodiments of the present disclosure, light detection device drive instructions 2222 may include an activation routine that selects and activates at least portions of light emitting unit 2242 of light detection device 2240 for example, light detection device drive instructions 2222 may include an activation routine that selects and activates at least portions of light emitting unit 2242 of light detection device 2240 based on a selected (or executed) detection mode, according to embodiments of the present disclosure, light emitting unit 2242 may include a plurality of light emitters to output or multiple wavelength bands of light, according to light detection device drive instructions 2222, processor 2210 may select and activate at least light emitters from the plurality of light emitters that correspond to the detection mode.
According to display drive instructions 2221, processor 2210 may set, in a frame, a portion that outputs light through pixels and a portion that does not output light through pixels according to embodiments of the present disclosure, light detection device drive instructions 2222 may include an activation routine that adjusts to activate light emitting units 2242 of light detection devices 2240 in a pixel off portion in the frame, for example, when a pixel included in display 2230 is turned off during a portion time within the frame, an image may be displayed substantially in black as if a black image is inserted into the frame, since an emitted light penetration region is displayed in black due to the pixel being turned off during periods within the frame, visibility of the pixel may be reduced even if the pixel emits light due to light output from light emitting units 2242.
According to various embodiments of the present disclosure, memory 2220 may store instructions related to various detection modes using light detection device 2240. for example, memory 2220 may include instructions that cause processor 2210 to select a detection mode based on execution of an application and/or user input.memory 2220 may include instructions that cause processor 2210 to determine an output wavelength band of light emitting unit 2242 based on the selected detection mode.memory 2220 may store instructions that cause processor 2210 to output light of the determined output wavelength band through light emitting unit 2242.memory 2220 may store instructions that cause processor 2210 to perform a series of operations of detecting portions of light scattered or reflected from an object by light receiving unit 2241 and obtaining information related to the detection mode based on the detected values.
For example, the electronic device 2200 may display a plurality of icons through the display 2230, the plurality of icons may represent applications stored in the electronic device 2200, when it is detected that an icon representing an object analysis application is selected from the plurality of icons input (e.g., touch input) by a user, the processor 2210 may execute the object analysis application, according to the executed object analysis application, the processor 2210 may display a screen providing a list (hereinafter, referred to as a "list of check functions") related to various check functions (check applications or check application programs), the list of check functions may be displayed together with various types of GUI elements , when it is detected that at least list entries are selected from the list of check functions by the user input, the processor 2210 may execute a check function (or check mode) corresponding to the selected at least list entries.
According to an embodiment of the present disclosure, the processor 2210 may select at least detection modes corresponding to an executed application, for example, the processor 2210 may select a proximity detection mode, etc. while executing a call application, for example, when the call application is being executed, the electronic device 2200 may be used to make a call near the head of a user, when a call to a phone number of an external electronic device (e.g., 102 or 104 of fig. 1) is requested by a user input, the processor 2210 may execute an application related to the transmitted call (hereinafter, referred to as a transmitted call application), the electronic device 2200 may receive a call from the external electronic device (e.g., 102 or 104 of fig. 1), and the processor 2210 may execute an application related to the received call (hereinafter, referred to as a received call application).
For example, processor 2210 may determine an output wavelength band of light-emitting unit (or light source) 2242 based on the selected detection mode. According to an embodiment of the present disclosure, when the proximity detection mode is selected, the processor 2210 may determine a wavelength band including a maximum sensitivity wavelength of about 950nm as an output wavelength band of the light emitting unit 2242 according to the proximity detection mode.
For example, the processor 2210 may control the light emitting unit 2242 to output the determined light of the output wavelength band. The light emitting unit 2242 may be designed to selectively generate light of a corresponding wavelength band under the control of the processor 2210.
For example, the processor 2210 may detect at least parts of light scattered or reflected from the object by the light receiving unit 2241 according to an embodiment of the present disclosure, in an object analysis mode (e.g., an iris recognition mode, a fingerprint recognition mode, or the like), light of a corresponding wavelength band emitted from the light emitting unit 2242 may be transmitted to a user body existing near the electronic device 2200 (e.g., within about 10cm), and the light may be absorbed, scattered, or reflected by the user body, light (or light energy or light signal) scattered or reflected from the user body may enter the light receiving unit 2241, and the light receiving unit 2241 may generate an electrical signal (or detection value) related to biometric information (e.g., skin moisture, skin melanin, or skin erythema) based on the entered scattered or reflected light, and may transmit the electrical signal to the processor 2210.
For example, the processor 2210 may obtain information on the detection mode based on the value detected by the light receiving unit 2241. According to an embodiment of the present disclosure, in the proximity detection mode, the processor 2210 may receive an electrical signal (or a detection value) from the light receiving unit 2241, and may analyze the electrical signal by using various programs, and may obtain information on proximity of an object. According to an embodiment of the present disclosure, in the object analysis mode, the processor 2210 may receive the detection value from the light receiving unit 2210, and may analyze the detection value by using various programs, and may obtain information on the object.
For example, processor 2210 may obtain information related to the detection mode and may output the information via display 2230 for example, processor 2230 may obtain information related to the detection mode and may send the information to another electronic device (e.g., external electronic device 102 or 104 or server 106 of FIG. 1).
According to an embodiment of the present disclosure, memory 2220 may store proximity detection instructions 2223 and proximity identification threshold information 2224.
In an example of the present disclosure, the proximity detection instructions 2223 may include an activation routine that selects and activates at least portions of the light detection device for obtaining values related to the proximity of the object.
According to embodiments of the present disclosure, the proximity detection instructions 2223 may include an acquisition routine that acquires a detection value generated from the light detection device 2240 activated in accordance with the light detection device drive instructions 2222, for example, the processor 2210 may detect at least portions of the light scattered or reflected from the object by the light receiving unit 2241.
According to an embodiment of the present disclosure, the proximity detection instruction 2223 may include a proximity determination routine that compares the detection value detected by the light-receiving unit 2241 with a selected proximity recognition threshold value, and determines whether the object is within or outside the proximity recognition distance from the electronic device 2200 according to the comparison result.
For example, the light emitting unit 2242 may include th light emitting unit outputting light of th intensity and a second light emitting unit outputting light of second intensity greater than 0 th intensity according to an embodiment of the present disclosure, the processor 2210 may first select the 1 th light emitting unit and may activate the th light emitting unit when the proximity detection mode starts, the processor 2210 may select the th proximity recognition threshold corresponding to the selected th light emitting unit from among the proximity recognition threshold information 2224, the processor 2210 may compare a detection value detected by the light receiving unit 2241 with the th proximity recognition threshold value 2200 when the th light emitting unit is activated, the processor 2210 may determine that the object is within the proximity recognition distance (e.g., about 10cm) from the electronic device 2200 when the detection value detected by the light receiving unit 2241 is greater than or equal to the th proximity recognition threshold value, the processor 2210 may cancel the proximity of the second light emitting unit when the detection value detected by the light receiving unit 2241 is less than the proximity recognition threshold value, the proximity recognition threshold value may be equal to the second proximity recognition threshold 2244, the proximity recognition threshold information may be activated when the proximity recognition unit is greater than the proximity recognition threshold information 2221, the proximity recognition threshold value is selected by the proximity recognition unit 2241.
According to various embodiments of the present disclosure, memory 2220 may store functional processing instructions 2225. The function processing instructions 2225 may include proximity recognition processing routines for processing various functions of the electronic device 2200 based on the proximity of the recognized object. For example, functional processing instructions 2225 may deactivate display 2230 based on the proximity of the identified object.
Although not shown, the electronic device 2200 may include an input unit according to various embodiments of the present disclosure. An input unit (e.g., input device 250 of fig. 2) may be configured to generate various input signals required to operate electronic device 2200. The input unit may include various input devices such as a keyboard, a keypad, key buttons, touch buttons, and the like according to whether the electronic apparatus 2200 is compatible. According to an embodiment of the present disclosure, the input unit may cause various types of user inputs for executing instructions of the memory 2220.
According to various embodiments of the present disclosure, although not shown, the electronic device 2200 may include a communication unit (e.g., the communication module 220 of fig. 2) that may be configured to support a communication function of the electronic device 2200, the communication unit may be provided in the form of a mobile communication module to support a communication function (e.g., a mobile communication function) of the electronic device 2200, the communication unit may establish a communication channel with a mobile communication system, and may support exchange of signals to perform the mobile communication function of the electronic device 2200, for example, the communication unit may establish at least of a voice service channel, an image service channel, or a data service channel with the mobile communication system, and may support exchange of specific signals according to the corresponding service channels, according to embodiments of the present disclosure, the communication unit may perform an operation regarding the detection function under the control of the processor 2210 based on the function processing instructions 2225, for example, information obtained through the light detection device 2240 may be designed to be transmitted to an external device (e.g., the server 106 of fig. 1) through the communication unit.
According to various embodiments of the present disclosure, the electronic device 2200 may further include various elements (or modules) according to the provision form thereof, such elements may variously change their forms according to the convergence tendency of the digital device, and the device may further include elements having the same level as that of the above-described elements (for example, various elements of fig. 2), although they are not all listed herein.
Fig. 23 is a view illustrating an operation flow of an electronic device including a display providing a proximity recognition function according to an embodiment of the present disclosure.
Fig. 24 and 25 are diagrams illustrating the operational procedure of fig. 13 according to various embodiments of the present disclosure.
According to various embodiments of the disclosure, the electronic device may include the electronic device 101 of fig. 1, the electronic device 201 of fig. 2, the electronic device 400 of fig. 4A, the electronic device 500 of fig. 5, the electronic device 700 of fig. 7, the electronic device 800 of fig. 8, the electronic device 900 of fig. 9, the electronic device 1000 of fig. 10, the electronic device 1300 of fig. 13, the electronic device 1400 of fig. 14, the electronic device 1500 of fig. 15, the electronic device 1700 of fig. 17A or 17B, the electronic device 1800 of fig. 18A or 18B, or the electronic device of fig. 19A or 19B.
Referring to fig. 23, in operation 2301, a processor (e.g., 2210 of fig. 22) may enter a mode for detecting proximity of an external object (hereinafter, a proximity detection mode). According to an embodiment of the disclosure, processor 2210 may execute a proximity detection mode based at least in part on an execution of an application or a user input. For example, processor 2210 may execute a proximity detection mode when executing a calling application.
In operation 2303, processor 2210 may obtain detection values by using a light receiving unit and a -th light emitting unit in an embodiment of the present disclosure, referring to fig. 24, an electronic device 2400 may include a display area 2430 and a bezel area 2440. the display area 2430 (or an active area) may include a display (e.g., 260 of fig. 2) and an area covering the display (hereinafter referred to as an -th area) (e.g., -th area 510-11 of fig. 5) a bezel area (or an inactive area) 2440 may not cover the display and may include an area surrounding a -th area (hereinafter referred to as a second area) (e.g., 510-12 of fig. 5) according to an embodiment of the present disclosure, -th area and the second area may be areas distinguished from each other by a cover disposed over the display (e.g., -1 of fig. 5) according to an embodiment of the present disclosure, a light receiving unit and a -th light emitting unit may be light receiving unit included in proximity to the light sensor (e.g., 24) and may be disposed under a 2410, 2412, and may be disposed under a light receiving unit, 2412, a light receiving unit, 2412, which may be disposed under a light receiving unit, 2412, a light receiving unit, a light sensor, a light receiving unit, a light.
In operation 2305, processor 2210 may compare a detection value obtained by a light receiving unit (e.g., light receiving unit 2411 of proximity sensor 2410 of fig. 24) with a reference value, in an embodiment of the present disclosure, referring to fig. 24, the reference value may be a criterion for determining that external object 2431 moves from space 2481 (hereinafter, a closed space) of proximity electronic device 2400 or the light receiving unit (e.g., light receiving unit 2411 of proximity sensor 2410) to another locations (hereinafter, a -th state) or that external object 2431 moves from far space 2482 to another locations (hereinafter, a second state) by using light receiving unit 2411 and -th light emitting unit 2412, when the detection value is greater than or equal to the reference value, processor 2210 may determine that external object 2431 is in an -th state, when it is determined that external object 2431 is in an -th state, in operation 7, processor 2210 may determine that the detection value from light receiving unit (e.g., 2411 of fig. 24) is greater than a threshold value, e.g., a proximity recognition threshold value (hereinafter, e.g., a distance from proximity recognition unit 2414) for identifying the proximity recognition device as proximity recognition information (e.g., 24124, 2414) within an approximate recognition threshold value of proximity recognition graph, 2414).
Although not shown, processor 2210 may perform various functions corresponding to the identified proximity, according to various embodiments of the present disclosure. According to an embodiment of the disclosure, processor 2210 may deactivate a display (e.g., 2230 of fig. 22) according to the identified proximity. According to various embodiments of the present disclosure, processor 2210 may enter a biometric detection mode (e.g., a detection mode with respect to skin moisture, skin melanin, or skin erythema) according to the identified proximity.
When the detection value obtained by the light receiving unit (e.g., 2411 of fig. 24) is less than the th reference value in operation 2305, the processor 2210 may determine that the external object 2431 is in the second state, and may perform operation 2309 in operation 2309, the processor 2210 may obtain the detection value by using the light receiving unit (e.g., 2411 of fig. 24) and the second light emitting unit in an embodiment of the present disclosure, referring to fig. 24, the second light emitting unit 2420 may be disposed under or below the bezel area 2440 or in a lateral space (e.g., 5009) of the display area 2430 the second light emitting unit 2420 may be located at a th distance from the light receiving unit 2411 and the second light emitting unit 2420 may be located at a second distance from the light receiving unit 2411 according to an embodiment of the present disclosure the second distance may be longer than the third distance according to an embodiment of the present disclosure the second light emitting unit 24134 may output a light intensity of at least one wavelength band of the light emitting unit and the second light emitting unit 2412 may be equal to the embodiment of the present disclosure, the light emitting unit 2412 may be equal to the light output intensity of 24125.
In various embodiments of the present disclosure, referring to fig. 25, an electronic device 2500 may include a light receiving unit 2511 of a proximity sensor (e.g., 600 of fig. 6A) disposed below or under a display region 2530, or inside the display region 2530, or on a layer forming the display region 2530. the electronic device 2500 may include an th light emitting unit 2512 (e.g., a light emitting unit aligned with a penetration hole 493 of fig. 4A) and a third light emitting unit 2522 disposed below or under a bezel region 2540, or in a lateral space of the display region 2530 (e.g., 5009 of fig. 5). according to embodiments of the present disclosure, the third light emitting unit 2522 may be a light source for identifying an iris (e.g., a light source of an iris sensor). in embodiments of the present disclosure, the electronic device 2500 may include a camera 2521 (e.g., 495 of fig. 4A) for identifying an iris. in embodiments of the present disclosure, the light emitting units 2512, 2210 2 and camera 2521 for identifying an iris may be disposed on both sides of a receiver 2581, 2524A, 2521 may be used as a light emitting unit for processing according to the second embodiment of the present disclosure.
In an embodiment of the present disclosure, in operation 2309, the processor 2210 may deactivate the th light-emitting unit (e.g., the light-emitting unit 2412 of the proximity sensor 2410 of fig. 24).
In operation 2311, the processor 2210 may compare a detection value obtained through a light receiving unit (e.g., the light receiving unit 2411 of the proximity sensor 2410 of fig. 24) with a reference value, when the detection value is greater than or equal to the reference value, the processor 2210 may determine that the external object is in the th state, when the external object is determined to be in the th state, the processor 2210 may resume operation 2303 to determine proximity based on the detection value obtained through the use of the light receiving unit (e.g., the light receiving unit 2411 of the proximity sensor 2410 of fig. 24) and the th light emitting unit (e.g., the light emitting unit 2412 of the proximity sensor 2410).
According to an embodiment of the present disclosure, the reference value in operation 2311 may be the same as or different from the reference value in operation 2305. According to an embodiment of the present disclosure, the reference value in operation 2311 may be differently set according to a light output intensity, a light amount, and the like of the second light emitting unit (e.g., 2420 of fig. 24 or the third light emitting unit 2522 of fig. 25). According to an embodiment of the present disclosure, when the second light emitting unit is used, light received by the light receiving unit (e.g., the light receiving unit 2411 of the proximity sensor 2410 of fig. 24) is converted into a digital value by using the ADC, and the reference value in operation 2311 may be calibrated according to intensity information of the second light emitting unit.
According to various embodiments of the present disclosure, although not shown, the reference value may be stored in the memory 2220 of fig. 22, and the processor 2210 may selectively use the reference value according to the light emitting unit to be used to determine the proximity distance.
In operation 2311, when it is determined that the detection value obtained by the th light-receiving unit (e.g., the light-receiving unit 2411 of the proximity sensor 2410 of fig. 24) is less than the reference value, the processor 2210 may determine that the external object 2431 is in the second state, and may perform operation 2313.
In operation 2313, the processor 2210 may determine a proximity distance based on a detection value obtained by using a light receiving unit (e.g., the light receiving unit 2411 of the proximity sensor 2410 of fig. 24) and a second light emitting unit (e.g., 2420 of fig. 24 or the third light emitting unit 2522 of fig. 25). According to an embodiment of the present disclosure, processor 2210 may compare the detection value obtained in operation 2313 with a second threshold value (e.g., proximity recognition threshold information 2224 of fig. 22). When the detection value is greater than or equal to the second threshold value, the processor 2210 may recognize that the external object 2431 is within the proximity recognition distance from the electronic device (recognition of proximity). Determining that the external object 2431 is within the proximity recognition distance in operation 2313 may mean that the external object 2431 moves from the far space 2482 to the near space 2481 and reaches the proximity recognition distance.
According to an embodiment of the present disclosure, the second threshold may be equal to or different from the th threshold the second threshold may be greater than the th threshold.
According to an embodiment of the present disclosure, electronic devices may include a display panel, a th light emitting module disposed adjacent to the display panel and configured to output light, and a light receiving module disposed in a portion of the display panel or under or below the display panel and configured to detect light of the output light reflected by an external object.
The light receiving module may be disposed in a recess or opening formed on the portion of the support member.
According to an embodiment of the present disclosure, the light receiving module may be disposed under or below the display panel, and the light receiving module and the th light emitting module may form at least a portion of a sensor formed to be encapsulated with .
According to an embodiment of the present disclosure, the electronic device may further include a light shielding member disposed between the light receiving module and the light emitting module.
According to an embodiment of the present disclosure, the electronic device may further include a light shielding member disposed between the display panel and the light emitting module.
According to an embodiment of the present disclosure, a lens may be disposed above the light emitting module to change the direction of the output light.
According to an embodiment of the present disclosure, the electronic device may further include another light emitting module, another light emitting module being disposed adjacent to the display panel, the light emitting module may be spaced apart from the light receiving module by a distance, and another light emitting module may be spaced apart from the light receiving module by a second distance.
According to an embodiment of the present disclosure, the further light emitting module may be configured to output a further light when the detected reflected light satisfies a specified condition the light receiving module may be configured to detect a further reflected light of the outputted further light reflected by the external object.
According to an embodiment of the present disclosure, the electronic device may further include a processor. The processor may be configured to identify proximity of an external object based at least on the reflected light.
According to various embodiments of the present disclosure, electronic devices may include a housing, and a cover at least partially housed in the housing and having surfaces exposed, a display panel disposed under or below a th area of the cover, a light emitting module disposed under or below a second area of the cover and configured to output light, and a light receiving module disposed in at least portions of the display panel or under or below the display panel and configured to detect light of the output light reflected by an external object.
According to various embodiments of the present disclosure, the light receiving module may be disposed under or below the display panel, and the light receiving module and the light emitting module may form at least portion of a sensor module formed as a package with .
According to various embodiments of the present disclosure, the electronic device may further include a light shielding member disposed between the light receiving module and the light emitting module.
According to various embodiments of the present disclosure, the electronic device may further include a light shielding member disposed between the display panel and the light emitting module.
According to various embodiments of the present disclosure, a lens module may be formed over the light emitting module to change the direction of the output light.
According to various embodiments of the present disclosure, the electronic device may further include another light emitting module disposed adjacent to the display panel, the light emitting module may be spaced apart from the light receiving module by a th distance, and another light emitting module may be spaced apart from the light receiving module by a second distance.
According to various embodiments of the present disclosure, the further light emitting module may be configured to output a further light when the detected reflected light satisfies a specified condition the light receiving module may be configured to detect a further reflected light of the outputted further light reflected by an external object.
According to various embodiments of the present disclosure, the electronic device may further include a processor. The processor may be configured to identify proximity of an external object based at least on the reflected light.
According to various embodiments of the present disclosure, an electronic device may include a display panel, a light emitting module disposed adjacent to the display panel, a light receiving module disposed in portion of the display panel or below or beneath the display panel, and a processor may be configured to output light by using the light emitting module, detect at least portion of light in at least portion of the light that collides with and reflects from an external object by using the light receiving unit, and determine a distance between the external object and the electronic device based at least on the detection.
According to various embodiments of the present disclosure, a light emitting module may include an th light emitting module spaced apart from a light receiving module by a th distance, and a second light emitting module disposed adjacent to a display panel and spaced apart from the light receiving module by a second distance, as at least part of the operation of outputting light, a processor may be configured to output another light by using the second light emitting module when light output by using the th light emitting module and reflected by an external object satisfies a specified condition, the processor may be configured to determine proximity based on at least light of another light that collides with and is reflected from the external object.
According to various embodiments of the present disclosure, since the light emitting unit is disposed within the lateral space, an electrical influence of light (or light energy) output from the light emitting unit on the display (or a failure of the display) (e.g., a light spot occurring on the display due to light from the light emitting unit) may be enhanced because the light emitting unit is disposed within the lateral space, light output from the light emitting unit may pass through a light transmitting member having a relatively high light transmittance compared to the light transmittance of the display (e.g., a light transmitting substrate forming surfaces of the housing), and may be released to the outside, and thus the light receiving performance may be improved, and thus the light detecting performance may be determined according to various embodiments of the present disclosure, and the light receiving performance may be improved according to various embodiments, such that the light receiving unit may be disposed under or under the light detecting function of the present disclosure, and the light emitting unit may be disposed under or on the lateral space, such that the light emitting unit may be used in a light detecting function of the present disclosure.
The above-described embodiments of the present disclosure may be prepared by a program that can be executed in a computer, and can be implemented in a general-purpose digital computer that operates the program using a computer-readable recording medium. In addition, the structure of data used in the above-described embodiments of the present disclosure may be recorded on a computer-readable recording medium in various ways. The computer-readable recording medium may include storage media such as magnetic storage media (e.g., ROM, floppy disks, hard disks, etc.) and optical reading media (e.g., CD-ROMs, DVDs, etc.).
Certain aspects of the present disclosure may also be embodied as computer readable code on a non-transitory computer readable recording medium. The non-transitory computer readable recording medium is any data storage device that can store data which can be thereafter read by a computer system. Examples of the non-transitory computer readable recording medium include read-only memory (ROM), random-access memory (RAM), compact disc ROM (CD-ROM), magnetic tapes, floppy discs, and optical data storage devices. The non-transitory computer-readable recording medium may also be distributed over network-coupled computer systems so that the computer-readable code is stored and executed in a distributed fashion. In addition, functional programs, codes, and code segments for accomplishing the present disclosure can be easily constructed by programmers skilled in the art to which the present disclosure pertains.
At this point , it is noted that various embodiments of the present disclosure as described above are generally directed to the processing of input data and the generation of output data, which may be implemented in hardware or software in conjunction with hardware.
While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.
Claims (15)
- An electronic device of the kind , comprising:a display panel;an th light emitting module arranged adjacent to the display panel and configured to output a th light, anda light receiving module disposed in portion of the display panel or below or beneath the display panel and configured to detect th reflected light, the th reflected light including th light reflected by an external object.
- 2. The electronic device of claim 1, further comprising a light transmissive support member disposed on a rear surface of the display panel,wherein the light receiving module is disposed in a recess or opening formed on the portion of the support member.
- 3. The electronic device of claim 1, wherein the electronic device,wherein the light receiving module is disposed below or beneath the display panel, anWherein the light receiving module and the th light emitting module form at least part of a sensor formed in a package.
- 4. The electronic device according to claim 1, further comprising a light-shielding member disposed between the light-receiving module and the th light-emitting module.
- 5. The electronic device according to claim 1, further comprising a light-shielding member arranged between the display panel and the th light-emitting module.
- 6. The electronic device of claim 1, wherein a lens is disposed above the th light emitting module to change the direction of the output light.
- 7. The electronic device of claim 1, further comprising a second light emitting module disposed adjacent to the display panel and configured to output a second light,wherein the th light emitting module is spaced apart from the light receiving module by a th distance, and the second light emitting module is spaced apart from the light receiving module by a second distance.
- 8. The electronic device of claim 7, wherein the electronic device,wherein the second light emitting module is configured to output the second light when the detected th reflected light satisfies a specified condition, andwherein the light receiving module is configured to detect second reflected light including second light reflected by the external object.
- 9. The electronic device of claim 1, further comprising a processor,wherein the processor is configured to identify the proximity of the external object based at least on the th reflected light.
- 10. The electronic device of claim 1, further comprising a processor,wherein the processor is configured to:by outputting th light using the th light emitting module,detecting th reflected light of at least part of th light colliding with an external object, the th reflected light including th light reflected therefrom, by using a light receiving module, anddetermining a distance between the external object and the electronic device based at least on the detecting.
- 11. The electronic device of claim 1, further comprising a processor,wherein the processor is configured to obtain biometric information corresponding to the external object based at least on the th reflected light.
- 12. The electronic device of claim 1, wherein the light emitting module is disposed in a lateral space of the display panel or below or beneath the lateral space.
- 13. The electronic device of claim 1, further comprising:a housing; anda cover at least partially received in the housing and having exposed surfaces,wherein the display panel is disposed below or beneath an th region of the cover, anWherein the th light emitting module is disposed below or beneath the second region of the cover.
- 14. The electronic device of claim 13, wherein a distance between the th light emitting module and the cover is smaller than a distance between the light receiving module and the cover.
- 15. The electronic device of claim 14, further comprising:th light emitting module and light receiving module mounted on the printed circuit board,wherein the printed circuit board includes relatively protruded portions mounted with th light emitting modules.
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| PCT/KR2018/006698 WO2018230959A1 (en) | 2017-06-14 | 2018-06-14 | Electronic device including light emitting module and light receiving module adjacent to display, and operating method thereof |
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- 2018-06-08 KR KR1020180066237A patent/KR102488578B1/en active IP Right Grant
- 2018-06-14 CN CN201880039729.6A patent/CN110741622A/en active Pending
- 2018-06-14 EP EP18817234.0A patent/EP3607735A4/en active Pending
- 2018-06-14 AU AU2018286376A patent/AU2018286376B2/en active Active
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| CN101815964A (en) * | 2007-10-19 | 2010-08-25 | 柯达公司 | Display device with capture capabilities |
| CN101853109A (en) * | 2009-03-31 | 2010-10-06 | 硅谷实验室公司 | Be used for optical proximity sensing and touch equipment and the method that input is controlled |
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Also Published As
| Publication number | Publication date |
|---|---|
| AU2018286376B2 (en) | 2022-09-15 |
| AU2018286376A1 (en) | 2019-11-28 |
| KR102488578B1 (en) | 2023-01-16 |
| KR20180136386A (en) | 2018-12-24 |
| EP3607735A4 (en) | 2020-03-25 |
| EP3607735A1 (en) | 2020-02-12 |
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