CN110735165A - gold plating device capable of ensuring uniformity for processing circuit boards - Google Patents

gold plating device capable of ensuring uniformity for processing circuit boards Download PDF

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Publication number
CN110735165A
CN110735165A CN201911194122.8A CN201911194122A CN110735165A CN 110735165 A CN110735165 A CN 110735165A CN 201911194122 A CN201911194122 A CN 201911194122A CN 110735165 A CN110735165 A CN 110735165A
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CN
China
Prior art keywords
fixedly connected
plate
gold plating
limiting
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911194122.8A
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Chinese (zh)
Inventor
龙佳志
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Hengyang Jinhong Fine Chemical Co Ltd
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Hengyang Jinhong Fine Chemical Co Ltd
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Application filed by Hengyang Jinhong Fine Chemical Co Ltd filed Critical Hengyang Jinhong Fine Chemical Co Ltd
Priority to CN201911194122.8A priority Critical patent/CN110735165A/en
Publication of CN110735165A publication Critical patent/CN110735165A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to the technical field of circuit boards, in particular to a gold plating device capable of ensuring uniformity for processing circuit boards, which comprises gold plating equipment and a board, wherein the bottom end of the gold plating equipment is fixedly connected with a bottom board, the inner side of the bottom board is fixedly connected with a servo motor, the outer side of a rotating shaft at the top end of the servo motor is fixedly connected with a positioning block, the outer side of the positioning block is fixedly connected with a slide rod, the outer side of the positioning block is fixedly connected with a second spring, the other end of the second spring is fixedly connected with a connecting board, the inner side of the bottom end of the connecting board is rotatably connected with a th threaded rod, the front end face of the th threaded rod is fixedly connected with a rotating rod, the inner side of the left end face of the gold plating equipment is rotatably connected with a rotating shaft, and the servo motor, the positioning board and the limiting board are arranged, so.

Description

gold plating device capable of ensuring uniformity for processing circuit boards
Technical Field
The invention relates to the technical field of circuit boards, in particular to a gold plating device capable of ensuring uniformity for processing circuit boards.
Background
The gold plating of the circuit board is to protect the joint from being oxidized, and the chemical property of gold is relatively inactive and is not easy to corrode, so if gold is plated on the surface of metal, the metal cannot be removed from air, the metal cannot be oxidized, and the service life of the circuit board can be effectively prolonged, therefore, the demand for gold plating devices for processing circuit boards, which can ensure uniformity, is increasing.
The circuit board gilding device that exists in the existing market, the in-process of gilding is carrying out, can not guarantee that the circuit board carries out even gilding, has reduced the practicality of device to at the in-process of carrying out the gilding, can't carry out good fixed to the position of circuit board, be not convenient for carry out good gilding to the circuit board, consequently, propose kinds of circuit board processing with the gilding device that can guarantee the homogeneity to above-mentioned problem.
Disclosure of Invention
The invention aims to provide gold plating devices for processing circuit boards, which can ensure uniformity and solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
kinds of gold-plating device that homogeneity can be guaranteed for circuit board processing, including gilding equipment and board, the bottom fixedly connected with bottom plate of gilding equipment, the inboard fixedly connected with servo motor of bottom plate, the outside fixedly connected with locating piece of servo motor's top pivot, the outside fixedly connected with litter of locating piece, the outside fixedly connected with second spring of locating piece, another fixedly connected with connecting plate of second spring, the bottom inboard rotation of connecting plate is connected with the threaded rod, the preceding terminal surface fixedly connected with bull stick of threaded rod, the inboard rotation of left end face of gilding equipment is connected with the pivot, the outside rotation of pivot is connected with board, the left end face fixedly connected with limiting plate of board, the right-hand member face fixedly connected with locating plate of gilding equipment.
Preferably, the inner side of the gold plating device is fixedly connected with a limiting shaft, the inner side of the limiting shaft is fixedly connected with an th spring, the other end of the th spring is fixedly connected with an extrusion block, the outer side of the limiting shaft is in threaded connection with a nut, and the inner side of the limiting shaft is provided with a gold rod.
Preferably, the inboard threaded connection of locating plate has the second threaded rod, the rear end face fixedly connected with carousel of second threaded rod, the preceding terminal surface of second threaded rod rotates and is connected with the regulating block, the equal fixedly connected with gag lever post in both ends about the rear end face of regulating block, the inboard of regulating block is equipped with the cardboard, the rear end face left side fixedly connected with fixture block of cardboard.
Preferably, the number of the limiting shafts is 2, the two limiting shafts are respectively located at the symmetrical positions of the left end and the right end of the inner side of the gold plating equipment, the number of the extrusion blocks located on the inner side of the limiting shafts is 4, and the four extrusion blocks are respectively located at the circumferential positions of the inner sides of the limiting shafts.
Preferably, the longitudinal section area of the extrusion block is in a right trapezoid shape, the extrusion block is in sliding connection with the limiting shaft through a nut, and the gold rod is fixed in position through the extrusion block and the limiting shaft.
Preferably, the number of the limiting rods is 2, the two limiting rods are respectively located at the symmetrical positions of the upper end and the lower end of the rear end face of the adjusting block, the limiting rods are located on the inner side of the positioning plate, and the limiting rods are connected with the positioning plate in a sliding mode through the adjusting block.
Preferably, the board is connected with the gold plating equipment through the pivot, the board is the same with the vertical cross-sectional area of gold plating equipment, the height of limiting plate is the same with the height of locating plate.
Preferably, the connecting plate is located on the outer side of the sliding rod, the connecting plate is connected with the sliding rod in a sliding mode through a second spring, a threaded groove is formed in the inner side of the positioning block, and the th threaded rod is connected with the positioning block in a threaded mode.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the th threaded rod, the connecting plate and the second spring, when the circuit board needs to be plated with gold, the position of the circuit board needs to be limited, the circuit board can be placed on the outer side of the positioning block, then the th threaded rod can pass through the inner side of the hole formed in the circuit board through the design of the second spring, then the rotating rod can be rotated, the th threaded rod can be driven to rotate, the position of the circuit board can be limited through the threaded connection between the th threaded rod and the positioning block, and the circuit board can be plated with gold well;
2. according to the gold bar extruding device, due to the arrangement of the limiting shaft, the extruding block and the nut, when the gold bar is required to be used, the position of the gold bar needs to be fixed, the gold bar can be placed on the inner side of the limiting shaft, then the nut can be rotated, the extruding block can be pushed to move through threaded connection between the nut and the limiting shaft, the gold bar can be extruded through the extruding block, the position of the gold bar can be fixed through the design of the extruding block, and the gold bar can be well used;
3. according to the invention, through the servo motor, the positioning plate and the limiting plate, after the gold bar and the circuit board are fixed in position, the gold bar and the circuit board can be connected through the limiting plate and the positioning plate, board and gold-plating equipment can be connected, the integrity of the device can be ensured, then the positioning block can be driven to rotate through the work of the servo motor, meanwhile, through the design of the controller, the gold-plating equipment is controlled to work, so that the circuit board can be plated with gold uniformly, each circuit board can be plated with gold well, the condition of uneven gold-plating is avoided, and the device can be used well.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the mounting structure of the nut of the present invention;
FIG. 3 is a schematic view of the mounting structure of the connecting plate of the present invention;
FIG. 4 is a schematic view of the mounting structure of the card of the present invention.
In the drawing, 1-bottom plate, 2-servo motor, 3-nut, 4-gold rod, 5-clamping plate, 6-positioning plate, 7-gold plating equipment, 8-connecting plate, 9-positioning block, 10-controller, 11-rotating shaft, 12- plate, 13-limiting plate, 14-limiting shaft, 15- spring, 16-extrusion block, 17-rotating rod, 18- threaded rod, 19-second spring, 20-sliding rod, 21-rotating disk, 22-limiting rod, 23-adjusting block, 24-clamping block and 25-second threaded rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only partial embodiments of of the present invention, rather than all embodiments.
Referring to fig. 1-4, the present invention provides technical solutions:
gold plating apparatus for processing circuit board with guaranteed uniformity, which comprises gold plating device 7 and board 12, bottom end of the gold plating device 7 is fixedly connected with bottom board 1, inner side of the bottom board 1 is fixedly connected with servo motor 2, positioning block 9 can be driven to rotate by the design of servo motor 2, circuit board on the surface of positioning block 9 can be driven to rotate, and it can be plated with gold uniformly, outer side of top rotating shaft of servo motor 2 is fixedly connected with positioning block 9, the position of circuit board can be limited by the design of positioning block 9, it is convenient to plate gold on circuit board, outer side of positioning block 9 is fixedly connected with slide rod 20, the position of connecting board 8 can be adjusted by the design of slide rod 20, it is convenient to adjust the position of threaded rod , it can fix the position of circuit board and positioning block 9, outer side of positioning block 9 is fixedly connected with second spring 19, the position of connecting board 8 can be limited by the design of second spring 19, it is convenient to use the position of connecting board 368, the end of connecting board 19 is fixedly connected with connecting board , the inner side of connecting board 355636, the rotating shaft is connected with rotating shaft 3518, the rotating shaft 3518 is connected with rotating shaft 12, the rotating shaft 12 is connected with rotating shaft of the connecting board 367, it is convenient to rotate the rotating shaft 12, it can drive the rotating shaft 12, it is connected with rotating shaft 12, it is convenient to rotate the rotating shaft of rotating shaft 12, it is connected with locating block 11, it is convenient to rotate the rotating shaft to rotate the.
The inner side of the gold plating device 7 is fixedly connected with a limiting shaft 14, the inner side of the limiting shaft 14 is fixedly connected with a spring 15, another end of a spring 15 is fixedly connected with an extrusion block 16, the outer side of the limiting shaft 14 is in threaded connection with a nut 3, the inner side of the limiting shaft 14 is provided with a gold rod 4, the arrangement is favorable for limiting the position of the gold rod 4, the use of the gold rod 4 is facilitated, the inner side of the positioning plate 6 is in threaded connection with a second threaded rod 25, the rear end face of the second threaded rod 25 is fixedly connected with a turntable 21, the front end face of the second threaded rod 25 is rotatably connected with an adjusting block 23, the upper end face and the lower end face of the adjusting block 23 are fixedly connected with limiting rods 22, the inner side of the adjusting block 23 is provided with clamping plates 5, the left side of the rear end face of the clamping plate 5 is fixedly connected with a clamping block 24, the position of the adjusting block 23 is favorable for adjusting the position of the clamping plate 5, the position of the clamping plate 5 is favorable for adjusting the clamping plate 12 and the device 7, the device 7 is connected with the clamping plate 14 through a sliding rod 16, the clamping rod 16, the adjusting rod 16, the clamping rod 16 is capable of adjusting a sliding rod 14, the clamping rod 16 is arranged on the inner side of a sliding rod 14, the clamping plate 6, the clamping plate 14, the clamping plate 16 is arranged on the clamping plate, the clamping rod 14, the clamping plate 16, the clamping plate 14, the clamping plate 16 is arranged on the clamping plate, the clamping plate 16 is arranged on the clamping plate 14, the clamping plate 6, the clamping plate 14, the clamping plate 16, the clamping plate 16 is arranged on the clamping plate, the clamping plate 16 is arranged on the clamping plate, the clamping plate 16 is arranged on the clamping plate.
The type of the servo motor 2 is EDSMT-2T 110-.
Working process, all electrical apparatus of the device are external power supply, when needing to gild the circuit board, at first need fix the position of circuit board, can be connected through the rotation between connecting plate 8 and litter 20, can rotate connecting plate 8 to opposite face, then alright place the circuit board on the surface of locating piece 9, later alright with stop rotating connecting plate 8, then connecting plate 8 can carry out the antiport through the elasticity of second spring 19, then can rotate connecting plate 8 to the preceding terminal surface of circuit board, simultaneously through the elasticity of second spring 19, can move threaded rod 18 inboard of connecting plate 8 to the hole inboard that the circuit board was seted up, then alright rotate rotating rod 17 through rotating rod 17, alright rotate threaded rod 18 through rotating rod 17, alright through the threaded connection between threaded rod 6718 and gild locating piece 9, can rotate the rear end face of locating piece 9 to the inboard of locating piece, thereby can extrude the circuit board through connecting plate 8, can inject the position of circuit board, when carrying out the circuit board, can avoid the condition that the circuit board rocks, then need carry out the position of gold rod 4 to the fixed, can carry out the condition that the gold rod 4, can be through the gold rod 7 can be connected to the rotary rod of gold plating, can be carried out the rotary rod after the rotary rod 14 and the rotary rod of the rotary rod 14, can be carried out the rotary rod and the rotary rod of the rotary rod 14, can be carried out the rotary rod 7 can be carried out the rotary table 13, then the rotary table 13, the rotary table 13 can be carried out the rotary table 13 to the rotary table after the rotary table 14, the rotary table 14 can be connected to the rotary table 14, the rotary table 14 can be carried out the rotary table 14, the rotary table 20 can be carried out the rotary table 20 can be connected to the rotary table 20, the rotary table 2 of the rotary table 14, the rotary table 20, the rotary table 2 of the rotary table 20 can be connected to the rotary table 20, the rotary table after the rotary table 20 can be connected to the rotary table 20, the rotary table 4, the rotary table.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

  1. The gold plating device capable of guaranteeing uniformity for processing the circuit boards comprises gold plating equipment (7) and a plate (12), and is characterized in that a bottom plate (1) is fixedly connected to the bottom end of the gold plating equipment (7), a servo motor (2) is fixedly connected to the inner side of the bottom plate (1), a positioning block (9) is fixedly connected to the outer side of a top rotating shaft of the servo motor (2), a sliding rod (20) is fixedly connected to the outer side of the positioning block (9), a second spring (19) is fixedly connected to the outer side of the positioning block (9), a connecting plate (8) is fixedly connected to the other end of the second spring (19), a threaded rod (18) is rotatably connected to the inner side of the bottom end of the connecting plate (8), a rotating rod (17) is fixedly connected to the front end face of the threaded rod (18), a rotating shaft (11) is rotatably connected to the inner side of the left end face of the gold plating equipment (7), a plate (12) is rotatably connected to the outer side of the rotating shaft (11), a limiting plate (13) is fixedly connected to the left end face.
  2. 2. The gold plating device capable of ensuring uniformity for processing circuit boards according to claim 1, wherein a limiting shaft (14) is fixedly connected to the inner side of the gold plating device (7), a th spring (15) is fixedly connected to the inner side of the limiting shaft (14), the other end of the th spring (15) is fixedly connected to a pressing block (16), a nut (3) is in threaded connection with the outer side of the limiting shaft (14), and a gold rod (4) is arranged on the inner side of the limiting shaft (14).
  3. 3. The gilding device capable of ensuring uniformity for processing circuit boards according to claim 1, wherein a second threaded rod (25) is connected to the inner side of the positioning plate (6) in a threaded manner, a rotary table (21) is fixedly connected to the rear end face of the second threaded rod (25), an adjusting block (23) is rotatably connected to the front end face of the second threaded rod (25), limiting rods (22) are fixedly connected to the upper end and the lower end of the rear end face of the adjusting block (23), a clamping plate (5) is arranged on the inner side of the adjusting block (23), and a clamping block (24) is fixedly connected to the left side of the rear end face of the clamping plate (5).
  4. 4. The gold plating device capable of ensuring uniformity for processing circuit boards according to claim 2, wherein the number of the limiting shafts (14) is 2, two limiting shafts (14) are respectively located at the symmetrical positions of the left and right ends of the inner side of the gold plating device (7), the number of the extrusion blocks (16) located at the inner side of the limiting shafts (14) is 4, and four extrusion blocks (16) are respectively located at the circumferential positions of the inner side of the limiting shafts (14).
  5. 5. The gold plating device capable of ensuring uniformity for processing circuit boards according to claim 2, wherein the longitudinal cross-sectional area of the extrusion block (16) is right trapezoid, the extrusion block (16) is slidably connected with the limiting shaft (14) through a nut (3), and the gold rod (4) is fixed in position with the limiting shaft (14) through the extrusion block (16).
  6. 6. The gilding device capable of ensuring uniformity for processing circuit boards according to claim 3, wherein the number of the limiting rods (22) is 2, the two limiting rods (22) are respectively located at symmetrical positions of the upper and lower ends of the rear end surface of the adjusting block (23), the limiting rods (22) are located on the inner side of the positioning plate (6), and the limiting rods (22) are slidably connected with the positioning plate (6) through the adjusting block (23).
  7. 7. The gold plating device capable of ensuring the uniformity for processing the circuit board as claimed in claim 1, wherein the plate (12) is rotatably connected with the gold plating equipment (7) through a rotating shaft (11), the plate (12) has the same longitudinal cross-sectional area as the gold plating equipment (7), and the height of the spacing plate (13) is the same as the height of the positioning plate (6).
  8. 8. The gilding device capable of ensuring uniformity for processing circuit boards according to claim 1, wherein the connection plate (8) is located outside the slide rod (20), the connection plate (8) is slidably connected with the slide rod (20) through a second spring (19), the inner side of the positioning block (9) is provided with a threaded groove, and the threaded rod (18) is in threaded connection with the positioning block (9).
CN201911194122.8A 2019-11-28 2019-11-28 gold plating device capable of ensuring uniformity for processing circuit boards Pending CN110735165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911194122.8A CN110735165A (en) 2019-11-28 2019-11-28 gold plating device capable of ensuring uniformity for processing circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911194122.8A CN110735165A (en) 2019-11-28 2019-11-28 gold plating device capable of ensuring uniformity for processing circuit boards

Publications (1)

Publication Number Publication Date
CN110735165A true CN110735165A (en) 2020-01-31

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Application Number Title Priority Date Filing Date
CN201911194122.8A Pending CN110735165A (en) 2019-11-28 2019-11-28 gold plating device capable of ensuring uniformity for processing circuit boards

Country Status (1)

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CN (1) CN110735165A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204455325U (en) * 2015-02-13 2015-07-08 遂宁豪尔思电子科技有限公司 The pcb board surface gold-plating system that a kind of level of automation is high
CN207738873U (en) * 2018-01-03 2018-08-17 苏州市王氏电路板有限公司 A kind of pcb board surface gold-plating equipment
CN208104575U (en) * 2018-04-04 2018-11-16 信丰祥达丰电子有限公司 A kind of plating apparatus for multilayer circuit board production

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204455325U (en) * 2015-02-13 2015-07-08 遂宁豪尔思电子科技有限公司 The pcb board surface gold-plating system that a kind of level of automation is high
CN207738873U (en) * 2018-01-03 2018-08-17 苏州市王氏电路板有限公司 A kind of pcb board surface gold-plating equipment
CN208104575U (en) * 2018-04-04 2018-11-16 信丰祥达丰电子有限公司 A kind of plating apparatus for multilayer circuit board production

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
陈易 等: ""印制线路板上硫氰酸亚金钾体系化学镀金"", 《电镀与涂饰》 *
韩海亚 等: ""PCB用垂直连续电镀镍金设备的优势"", 《印制电路信息》 *

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Application publication date: 20200131