CN110726427A - Dustproof structure and manufacturing method thereof - Google Patents
Dustproof structure and manufacturing method thereof Download PDFInfo
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- CN110726427A CN110726427A CN201911034115.1A CN201911034115A CN110726427A CN 110726427 A CN110726427 A CN 110726427A CN 201911034115 A CN201911034115 A CN 201911034115A CN 110726427 A CN110726427 A CN 110726427A
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- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
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Abstract
The invention discloses a dustproof structure and a manufacturing method thereof, wherein the dustproof structure is used for preventing dust of a sensor, the sensor comprises a shell and a sensing unit arranged in the shell, the shell is provided with a communication hole, the communication hole is communicated with the sensing unit and the external environment, a dustproof part of the dustproof structure covers the communication hole, and the manufacturing method of the dustproof structure comprises the following steps: providing a substrate, and arranging a release film on one surface of the substrate; depositing a metal layer on the surface of the release film; forming a plurality of dustproof meshes on the metal layer through a photoetching process, wherein the plurality of dustproof meshes together form a dustproof part; and separating the metal layer forming the dustproof part from the release film. The technical scheme of the invention aims to enable the dustproof structure to have a better dustproof function, and enable the dustproof sensor to be communicated with the external environment, so that the detection sensitivity and the measurement accuracy of the sensor are ensured.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a dustproof structure and a manufacturing method thereof.
Background
The sensor core of an open sensor (e.g., a microphone sensor, a thermo-hygrometer, etc.) needs to be in communication with the outside environment to sense the change in the surrounding environment. In order to facilitate communication between the core of the sensor and the external environment, communication holes are generally provided. When the core of the sensor is communicated with the external environment, foreign matters (such as solid pollutants like dust and dirt, and liquid pollutants like water mist) in the environment easily enter the sensor through the communication hole, and the detection sensitivity and the measurement accuracy of the sensor are interfered.
In an exemplary technique, a dustproof structure is provided in the communication hole to prevent the entry of foreign objects from the outside. However, since the sensor needs to be communicated with the external environment, a general dustproof structure only has a dustproof function and cannot give consideration to the communication between the dustproof component and the external environment, so that the detection sensitivity and the measurement accuracy of the sensor are reduced.
The above description is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission of prior art.
Disclosure of Invention
The invention mainly aims to provide a dustproof structure and a manufacturing method thereof, and aims to enable the dustproof structure to have a better dustproof function, enable a dustproof sensor to be communicated with an external environment and ensure the detection sensitivity and the measurement accuracy of the sensor.
In order to achieve the above object, the present invention provides a method for manufacturing a dust-proof structure, the dust-proof structure is used for preventing dust of a sensor, the sensor includes a housing and a sensing unit disposed in the housing, the housing is provided with a communication hole, the communication hole communicates the sensing unit with an external environment, a dust-proof portion of the dust-proof structure covers the communication hole, and the method for manufacturing the dust-proof structure includes the following steps:
providing a substrate, and arranging a release film on one surface of the substrate;
depositing a metal layer on the surface of the release film;
forming a plurality of dustproof meshes on the metal layer through a photoetching process, wherein the plurality of dustproof meshes together form a dustproof part;
and separating the metal layer forming the dustproof part from the release film.
In some embodiments of the present invention, the step of forming a plurality of dust-proof meshes in the metal layer by a photolithography process includes:
coating a photoresist on the surface of the metal layer;
exposing and developing the photoresist to obtain the photoresist with the preset size of the dustproof mesh;
and etching the metal layer attached with the photoresist, and removing the photoresist to obtain a plurality of dustproof meshes arranged on the metal layer.
In some embodiments of the present invention, the step of coating the photoresist on the surface of the metal layer includes:
coating a photoresist on the metal layer by a spin coating method;
vacuum drying the photoresist, and removing the photoresist on the edge of the metal layer;
baking the photoresist;
and cooling the baked photoresist.
In some embodiments of the present invention, the forming a plurality of dust-proof mesh holes in the metal layer by a photolithography process, wherein after the step of forming the dust-proof portion by the plurality of dust-proof mesh holes together, the step of separating the metal layer on which the dust-proof portion is formed and the release film from each other further comprises:
forming a first kerf surrounding the dustproof part on the metal layer;
arranging a support material layer on the metal layer, and processing to form a support part;
and a mounting plate is arranged on one side of the supporting part, which is far away from the metal layer.
In some embodiments of the present invention, the step of providing a support material layer on the metal layer and processing to form the support portion includes:
coating a photosensitive material on the surface of the metal layer;
and developing and etching the photosensitive material to enable the photosensitive material to form an opening exposing the dustproof part and a second cutting seam exposing the first cutting seam, so as to obtain the supporting part.
In some embodiments of the present invention, the step of disposing a placement plate on a side of the support portion facing away from the metal layer includes:
providing a placing plate, and coating glue on one surface of the placing plate;
the surface of the placing plate for controlling the coating of the glue is attached to the surface of the supporting part, which is deviated from the metal layer.
In some embodiments of the present invention, the step of separating the metal layer forming the dust-proof portion and the release film from each other includes:
removing the viscosity of the surface of the release film, which is attached to the metal layer;
and controlling the metal layer forming the dustproof part to be separated from the release film losing the viscosity.
In some embodiments of the present invention, after the step of controlling the separation of the metal layer forming the dust-proof portion and the release film losing adhesion, the method further includes:
when the metal layer is provided with the first cutting seam, the supporting part is provided with the second cutting seam, and the dustproof structure is provided with the mounting plate, the cutting device is controlled to cut the mounting plate along the extending paths of the first cutting seam and the second cutting seam.
In some embodiments of the invention, the metal layer is less than 2um thick;
and/or the aperture of the dustproof mesh is smaller than 3 um.
The invention also provides a dustproof structure, which is manufactured by the manufacturing method of the dustproof structure, the dustproof structure is used for preventing dust of a sensor, the sensor comprises a shell and a sensing unit arranged in the shell, the shell is provided with a communication hole, the communication hole is communicated with the sensing unit and the external environment, a dustproof part of the dustproof structure covers the communication hole, and the manufacturing method of the dustproof structure comprises the following steps:
providing a substrate, and arranging a release film on one surface of the substrate;
depositing a metal layer on the surface of the release film;
forming a plurality of dustproof meshes on the metal layer through a photoetching process, wherein the plurality of dustproof meshes together form a dustproof part;
and separating the metal layer forming the dustproof part from the release film.
According to the technical scheme, the release film is arranged on one surface of the substrate, the metal layer is deposited and formed on the surface, away from the substrate, of the release film, then the plurality of dustproof meshes are formed on the metal layer through a photoetching process, the dustproof portions are formed by the plurality of dustproof meshes together, then the metal layer forming the dustproof portions is separated from the release film, and therefore the dustproof structure with the dustproof portions is formed. Therefore, the technical scheme of the invention can enable the dustproof structure to have a better dustproof function, and enable the dustproof sensor to be communicated with the external environment, thereby ensuring the detection sensitivity and the measurement accuracy of the sensor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of a substrate, a release film, a metal layer, a supporting portion, and a mounting plate in a non-separated state according to a method for manufacturing a dustproof structure of the present invention;
FIG. 2 is a schematic view of the substrate, the release film, the metal layer, the supporting portion and the mounting plate rotated 180 degrees and in a separated state according to the manufacturing method of the dustproof structure of the present invention;
FIG. 3 is a top view of an embodiment of a dust-proof structure of the present invention;
FIG. 4 is a top view of one embodiment of the dust-proof structure mounted on the sensor according to the present invention;
FIG. 5 is a flowchart illustrating a manufacturing method of a dustproof structure according to an embodiment of the present invention;
FIG. 6 is a flowchart illustrating a method of fabricating a dustproof structure according to another embodiment of the present invention;
FIG. 7 is a flowchart illustrating a method of fabricating a dustproof structure according to another embodiment of the present invention;
FIG. 8 is a flowchart illustrating a method of fabricating a dustproof structure according to another embodiment of the present invention;
FIG. 9 is a flowchart illustrating a method of fabricating a dustproof structure according to another embodiment of the present invention;
FIG. 10 is a flowchart illustrating a method of fabricating a dustproof structure according to another embodiment of the present invention;
fig. 11 is a flowchart illustrating a manufacturing method of a dustproof structure according to another embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1000 | Sensor with a |
1031 | |
| 100 | |
104 | |
| 10 | Dust- |
1041 | |
| 11 | |
1042 | |
| 20 | |
105 | |
| 101 | |
200 | |
| 102 | |
210 | Communicating hole |
| 103 | |
300 | Sensing unit |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, 2, 4, and 5, the present invention provides a method for manufacturing a dust-proof structure 100, where the dust-proof structure 100 is used for preventing dust of a sensor 1000, the sensor 1000 includes a housing 200 and a sensing unit 300 disposed in the housing 200, the housing 200 is provided with a communication hole 210, the communication hole 210 communicates the sensing unit 300 with an external environment, a dust-proof portion 10 of the dust-proof structure 100 covers the communication hole 210, and the method for manufacturing the dust-proof structure 100 includes the following steps:
step S10, providing a substrate 101, and disposing a release film 102 on one surface of the substrate 101; in some embodiments of the present invention, the shape of the substrate 101 may be determined according to actual production conditions, and the material of the substrate 101 may include a substrate formed by one or more of various materials such as glass material, metal material or plastic material (e.g., polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyimide (PI)), as long as the substrate can support the components for making the dustproof structure 100 and facilitate light transmission and/or heat transmission. The release film 102 is an auxiliary film material for thermal transfer printing, the substrate is generally made of PET, the conventional thickness is 12um-100um, in an embodiment, the release film 102 can be hot-and-cold-tear, and the release film 102 is attached to the surface of the substrate 101 when needed.
Step S20, depositing a metal layer 103 on the surface of the release film 102; in some embodiments of the present invention, a sputtering (Sputter) process may be further adopted to deposit the metal layer 103 or a pulse laser deposition method is adopted to deposit the metal layer 103, specifically, an alloy target may be selected and argon gas may be introduced to Sputter the metal layer 103, the thickness of the metal layer 103 may be smaller than 2um, when the thickness of the metal layer 103 is greater than 2um, the thickness of the dust-proof structure 100 may be thicker, which may occupy an installation space inside the sensor 1000 and is not favorable for miniaturization design of the sensor 1000, on the other hand, when the thickness of the metal layer 103 is larger, the amount of production materials required for processing may be increased, so as to increase production cost and processing cost, and, after the dust-proof mesh 11 is subsequently formed, the depth of the dust-proof mesh 11 may also be deeper, so as to increase noise transmitted from external environment changes to the sensing unit 300 of the sensor 1000, reducing the detection sensitivity and accuracy of the measurement of the sensing components of the sensor 1000. When the thickness of metal level 103 is less than 2um, on the one hand can not occupy the inside more installation space of sensor 1000, do benefit to the miniaturized design of sensor 1000, and can guarantee the better dustproof function of dustproof construction 100, on the other hand, when the thickness degree of metal level 103 is less than 2um, the quantity of the production material that processing needs is not too much, manufacturing cost and processing cost have been reduced, and, the thickness of metal level 103 is less behind subsequent formation dustproof mesh 11, the degree of depth of dustproof mesh 11 also can be shallower, the noise of external environment change transmission to the sensing unit 300 of sensor 1000 has been reduced like this, the detection sensitivity and the measuring degree of accuracy of the sensing subassembly of sensor 1000 have been improved. It can be understood that the thickness of the metal layer 103 may be 50nm, 80nm, 100nm, 300nm, 500nm, 700nm, 1000nm, 1200nm, 1500nm, 1800nm, or any value therebetween, so as to ensure a better dust-proof function of the dust-proof structure 100 and improve the detection sensitivity and the measurement accuracy of the sensing component of the sensor 1000.
Step S30, forming a plurality of dust-proof meshes 11 in the metal layer 103 by a photolithography process, wherein the plurality of dust-proof meshes 11 collectively form the dust-proof portion 10; the photolithography technique is a technique using an optical-chemical reaction principle and chemical and physical etching methods, and the photolithography technique can form the dust-proof meshes 11 on the metal layer 103, and form the dust-proof portions 10 on the plurality of dust-proof meshes 11, so that the communicating holes 210 are covered by the dust-proof portions 10, and the communicating holes 210 have a dust-proof function to prevent foreign matters from entering. It can be understood that the outer contour of the dust-proof part 10 is substantially the same as the outer contour of the cross section of the communication hole 210, thereby ensuring the utilization rate of the dust-proof part 10 and reducing the processing cost.
In step S40, the metal layer 103 and the release film 102 forming the dust-proof part 10 are separated from each other. In this embodiment, different operations may be performed according to different types of release films 102 to remove the adhesion between the metal layer 103 and the release film 102, so as to separate the release film 102 originally used for bearing the metal layer 103 from the processed metal layer 103 having the dust-proof portion 10.
It should be noted that, under the condition that the structural strength of the housing 200 of the sensor 1000 is ensured, a plurality of communication holes 210 may be provided, the plurality of communication holes 210 are disposed at intervals (may be arranged in an annular array, or may be arranged in a linear direction, as long as the sensing of the sensor 1000 is facilitated), the contact area between the sensing unit 300 of the sensor 1000 and the external environment may be increased by providing the plurality of communication holes 210, the sensing unit 300 of the sensor 1000 may be better enabled to sense the condition of the external environment, and the detection sensitivity and the measurement accuracy of the sensing unit 300 of the sensor 1000 may be improved. When the housing 200 has a plurality of communication holes 210, the number of the dust-proof structure 100 may be multiple, in this case, the dust-proof portion 10 of one dust-proof structure 100 may cover the plurality of communication holes 210, and/or one dust-proof structure 100 may cover one communication hole 210, as long as it is convenient to prevent external foreign objects from entering the sensor 1000 from the communication holes 210, and ensure the normal operation of the sensor 1000.
The technical scheme of the invention is that a release film 102 is arranged on one surface of a substrate 101, a metal layer 103 is formed on the surface of the release film 102 departing from the substrate 101 in a deposition manner, a plurality of dustproof meshes 11 are formed on the metal layer 103 through a photoetching process, wherein, the plurality of dustproof meshes 11 together form the dustproof part 10, and then the metal layer 103 forming the dustproof part 10 and the release film 102 are separated from each other, thereby forming the dustproof structure 100 with the dustproof part 10, when it is required to be used, the dust-proof structure 100 is disposed in the communication hole 210 of the sensor 1000, and the dust-proof portion 10 of the dust-proof structure 100 is covered on the communication hole 210, so that the solid foreign matter or the liquid foreign matter in the external environment cannot enter the sensor 1000 from the communication hole 210, and the sensing unit 300 in the housing 200 of the sensor 1000 can sense the change of the external environment through the hollow part of the dustproof mesh 11, thereby ensuring the detection sensitivity and the measurement accuracy of the sensor 1000. Thus, the technical scheme of the invention can enable the dustproof structure 100 to have a better dustproof function, and enable the dustproof sensor 1000 to be communicated with the external environment, thereby ensuring the detection sensitivity and the measurement accuracy of the sensor 1000.
Referring to fig. 6, in some embodiments of the present invention, the step of forming a plurality of dust-proof mesh holes 11 in the metal layer 103 by a photolithography process includes:
step S31, coating a photoresist on the surface of the metal layer 103; in this embodiment, a positive photoresist or a negative photoresist may be coated on the surface of the metal layer 103, where the light irradiated portion of the positive photoresist is dissolved in the photoresist developer, and the non-light irradiated portion is not dissolved in the photoresist developer; negative photoresist portions that are exposed to light are not dissolved in the photoresist developer, while portions that are not exposed to light are dissolved in the photoresist developer. The selection of the specific photoresist type can be performed according to the actual production.
Step S32, exposing and developing the photoresist to obtain a photoresist with a preset size of the dust-proof mesh 11; in one embodiment, the photoresist is exposed by the light emitted from the ultraviolet light source through a mask having a predetermined size of the dust-proof mesh 11, and the exposed photoresist is washed by a developing solution to obtain the photoresist having the predetermined size. It should be noted that the preset size of the dust-proof mesh 11 includes the outer contour of the section of the dust-proof mesh 11 (the part including the aperture of the dust-proof mesh 11), and the number and position distribution of the dust-proof mesh 11, thereby facilitating the subsequent work. It should be further noted that the aperture of the dust-proof mesh 11 is smaller than 3um, when the aperture of the dust-proof mesh 11 is larger than 3um, the solid pollutant and the liquid pollutant with the diameter larger than 3um can enter the sensor 1000 from the dust-proof mesh 11, the distance between two electrodes of the adjacent capacitor of the sensor 1000 is generally 3um, and after the foreign matter with the diameter larger than 3um enters, the two electrodes of the capacitor can be communicated, so that the capacitor can be disabled. When the aperture of dustproof mesh 11 is less than 3um, inside solid pollutant, the liquid pollutant that the diameter is greater than 3um just can not get into sensor 1000 from dustproof mesh 11, and the distance between two electrodes of the adjacent electric capacity of sensor 1000 generally is 3um, and the foreign matter that the diameter is less than 3um gets into the back, can not make two electrodes of electric capacity communicate, so, can guarantee the normal work of electric capacity. It can be understood that the aperture of the dust-proof mesh 11 may also be 50nm, 80nm, 100nm, 300nm, 500nm, 700nm, 1000nm, 1200nm, 1500nm, 1800nm, 2000nm, 2200nm, 12500nm, 2800nm, or any value therebetween, so that it is possible to prevent solid contaminants and liquid contaminants having a diameter greater than 3um from entering the sensor 1000 through the dust-proof mesh 11, and ensure the normal operation of the capacitor.
Step S33, etching the metal layer 103 with the photoresist and removing the photoresist to obtain a plurality of dust-proof meshes 11 disposed on the metal layer 103. The etching technology can be divided into wet etching (wet etching) and dry etching (dry etching), and a part to be etched is contacted with a chemical solution during etching to achieve the effect of dissolving and corroding and form the concave-convex or hollow-out molding effect.
By forming the dust-proof mesh 11 on the metal layer 103 by using a photolithography process, foreign matter (foreign matter affecting normal operation of the sensor 1000) outside a blocking portion of the dust-proof mesh 11 can enter the sensor 1000, and the sensing unit 300 of the sensor 1000 can sense changes in external environment through a hollow portion of the dust-proof mesh 11, thereby ensuring normal operation of the sensor 1000. And the production cost of the photoetching technology is low, the production efficiency and the yield are high, and the dustproof structure 100 is convenient to produce in batches.
Referring to fig. 7, in some embodiments of the present invention, the step of coating the photoresist on the surface of the metal layer 103 includes:
step S311, applying a photoresist to the metal layer 103 by a spin coating method; in this embodiment, the photoresist is spin-coated by a spin coater, the spin coating method including: the method comprises three steps of material proportioning, high-speed rotation and film volatilization, and the thickness of a formed film is controlled by controlling the glue homogenizing time, the rotating speed, the dropping liquid amount, the concentration and the viscosity of a used solution. The spin coating method can form the photoresist on the surface of the metal layer 103 uniformly.
Step S312, performing vacuum drying on the photoresist, and removing the photoresist on the edge of the metal layer 103; the volatilized photoresist is placed in a vacuum chamber for vacuum drying, and the range of spin coating is slightly larger than that of the metal layer 103 during spin coating, so that the metal layer 103 is fully covered by the photoresist, the edge of the metal may be covered by the photoresist, and redundant photoresist can be removed at the moment, so that the subsequent processing steps are facilitated.
Step S313, baking the photoresistor; baking the photoresist can shape the photoresist, which is convenient for subsequent work.
Step S314, cooling the baked photoresist. The photoresist is cooled, so that the property of the photoresist is stable during subsequent processing, and the state of other materials to be processed forming the dustproof structure 100 is not affected.
The photoresist is coated by a spin-coating method, and is subjected to vacuum drying, baking and cooling, so that the photoresist layer is stably attached to the metal layer 103, and the subsequent processing procedure is facilitated.
Referring to fig. 8, in some embodiments of the present invention, the forming a plurality of dust-proof mesh holes 11 in the metal layer 103 by a photolithography process, wherein after the step of forming the dust-proof part 10 by the plurality of dust-proof mesh holes 11 together, the step of separating the metal layer 103 forming the dust-proof part 10 and the release film 102 from each other further includes:
step S301, forming a first slit 1031 surrounding the dust-proof portion 10 in the metal layer 103; in an embodiment, after the step of coating the photoresist on the surface of the metal layer 103, the photoresist is exposed and developed to obtain the photoresist with the predetermined size of the dust-proof mesh 11, and at the same time, the photoresist also has the predetermined size of the first slit 1031, only the light-transmitting region of the mask needs to be adjusted during the exposure process, so that the photoresist with the first slit 1031 can be formed after the photoresist is developed, and then the metal layer 103 is etched to obtain the first slit 1031. Alternatively, the first kerf 1031 is formed by cutting the metal layer 103 by laser by means of laser cutting. The first slits 1031 are provided to enable mass production of the dust-proof structure 100, and the metal layer 103 is separated by the first slits 1031, thereby improving production efficiency.
Step S302, arranging a support material layer on the metal layer 103, and processing to form a support part 104; the support portion 104 is arranged so that the dust-proof portion 10 of the metal layer 103 may not be directly connected to the housing 200 but connected to the housing 200 through the support portion 104 when covering the communication hole 210, and since the texture of the metal layer 103 may be different from that of the housing 200, the support portion 104 is arranged to connect to the housing 200, thereby ensuring the stability of the dust-proof portion 10 of the metal layer 103 covering the communication hole 210. This supporting part 104's thickness can be less than 50um, owing to still need adsorb dust-proof structure 100 after finishing in production and transport etc. sets up the thickness of supporting part 104 to be less than 50um, and the suction nozzle that can be convenient for on the one hand adsorbs, and on the other hand also can not make dust-proof structure 100's thickness great, reduces dust-proof structure 100's installation space. It can be understood that the thickness of the supporting portion 104 can also be 25um, 30um, 35um, 40um, 45um, etc., or any value between the two, which can facilitate the suction nozzle to suck on one hand, and on the other hand, the thickness of the dust-proof structure 100 is not large, so as to reduce the installation space of the dust-proof structure 100. And, it can be understood that, when the supporting material layer is laid on the metal layer 103, the dust-proof part 10 (and/or the first cut 1031) is already formed on the metal layer 103, and when the supporting material layer is laid, the supporting material layer fills the gaps between the dust-proof mesh 11 of the dust-proof part 10 and the first cut 1031, so that each part of the metal layer 103 is provided with the supporting material layer, thereby facilitating the subsequent molding step.
In step S303, a placing plate 105 is disposed on a side of the supporting portion 104 away from the metal layer 103. When the dustproof structures 100 are produced in batches, the arrangement plate 105 is arranged to facilitate simultaneous transfer of a plurality of dustproof structures 100, the arrangement plate 105 can be made of blue films or other supporting film materials, and when the dustproof structures 100 need to be used, the arrangement plate 105 can be disconnected from the supporting portion 104, so that the supporting portion 104 is independent of the arrangement plate 105.
By providing the first slits 1031, a plurality of dust-proof meshes 11 (i.e., a plurality of dust-proof portions 10) formed in the metal layer 103 can be separated from each other in mass production, thereby improving production efficiency. The supporting part 104 and the placing plate 105 are arranged, so that the dustproof structure 100 can be conveniently transferred, and the production efficiency is further improved.
Referring to fig. 9, in some embodiments of the present invention, the step of providing a supporting material layer on the metal layer 103 and processing to form the supporting portion 104 includes:
step S3021, coating a photosensitive material on the surface of the metal layer 103; in this embodiment, the spin coater may also be controlled to coat the photosensitive material on the surface of the metal layer 103 according to a spin coating method, and the spin coating method includes: the method comprises three steps of material proportioning, high-speed rotation and film volatilization, and the thickness of a formed film is controlled by controlling the glue homogenizing time, the rotating speed, the dropping liquid amount, the concentration and the viscosity of a used solution. The spin coating method can uniformly form the photosensitive material on the surface of the metal layer 103.
Step S3021, developing and etching the photosensitive material to form an opening 1041 exposing the dust-proof portion 10 and a second slit 1042 exposing the first slit 1031 on the photosensitive material, so as to obtain the supporting portion 104. In the developing process, the developing area is adjusted, and the photosensitive material is etched, so as to obtain the opening 1041 and/or the second slit 1042 exposing the dust-proof portion 10. Or the metal layer 103 is cut by laser to form the second cut 1042 by means of laser cutting. The provision of the second slits 1042 enables mass production of the dust-proof structure 100, and improves production efficiency by separating the supporting portions 104 through the second slits 1042. The remaining portion of the support portion 104 after etching is connected to the portion of the metal layer 103 where the dust-proof mesh 11 is not formed (or may be connected to the portion of the dust-proof mesh 11 on the outer edge of the dust-proof portion 10), so as to ensure that the dust-proof mesh 11 located in the middle portion faces the communication hole 210, and to block the entry of foreign matter.
The photosensitive material may be preferably formed into the support 104 through the processing steps of development and etching to facilitate installation and transportation of the dust-proof structure 100.
Referring to fig. 10, in some embodiments of the present invention, the step of providing the disposing plate 105 on the side of the supporting portion 104 facing away from the metal layer 103 includes:
step 3031, providing a setting plate 105, and coating glue on one surface of the setting plate 105; in one embodiment, the installation plate 105 may use a UV film, which is low in cost and can better transport the mass-produced dustproof structure 100.
Step S3032, controlling the surface of the placement plate 105 coated with the glue to adhere to the surface of the support portion 104 departing from the metal layer 103. By gluing, a stable connection of the setter plates 105 to the support structure can be ensured.
When the dustproof structure 100 needs to be used, the connection between the installation plate 105 and the supporting portion 104 can be released, so that the supporting portion 104 is independent of the installation plate 105, and the production efficiency is improved.
Referring to fig. 2 and 11, in some embodiments of the present invention, the step of separating the metal layer 103 forming the dust-proof part 10 and the release film 102 from each other includes:
step S41, performing a tack removing process on the surface of the release film 102 and the metal layer 103; usually, the metal layer 103 and the substrate 101 are adhered to each other after being processed, and are not easily separated from each other, by providing the release film 102 between the substrate 101 and the metal layer 103, the processed metal layer 103 and the substrate 101 can be separated as needed, the release film 102 usually has slight adhesiveness, and the release film 102 loses adhesiveness when being heated or irradiated by light (UV light or laser with a specific wavelength), so that the metal layer 103, the release film 102 and the substrate 101 can be separated from each other. It should be noted that, in the process of forming the dust-proof portion 10 on the metal layer 103, the substrate 101, the release film 102, and the metal layer 103 are stacked in the vertical direction from bottom to top, so as to facilitate deposition and formation of the metal layer 103. In-process to getting rid of the stickness between release film 102 and the metal level 103, can be with whole treating that the machined part overturns 180 to form metal level 103, from release film 102 and base plate 101 in upper and lower direction, from supreme setting of piling up in proper order down, thereby be convenient for getting rid of the stickness, can understand that, the surface of getting rid of after the stickness from release film 102 all does not have the stickness, so can transport away base plate 101 through conveyor, and then remain dust keeper in the production line and continue the transportation.
In step S42, the metal layer 103 forming the dust-proof part 10 is controlled to be separated from the release film 102 without adhesion. In this embodiment, the vacuum suction device (specifically, a vacuum suction nozzle, or a suction nozzle of a Die Bonder chip mounter) may be controlled to suck the dust-proof device, and then the dust-proof device is transported to a suitable place. After the installation plate 105 is removed, the dust-proof structure 100 can be jacked up by the thimble, and then the dust-proof structure 100 is transported by the suction nozzle.
The release film 102 and the metal layer 103 can be separated from each other by removing the adhesion therebetween, so that the production yield of the dustproof portion 10 is ensured, and the production efficiency is high.
In some embodiments of the present invention, after the step of controlling the separation of the metal layer 103 forming the dust-proof part 10 and the release film 102 with the lost adhesion, the method further includes:
when the metal layer 103 is provided with the first slits 1031 and the support portion 104 is provided with the second slits 1042, and the dustproof structure 100 is provided with the installation plate 105, the cutting device is controlled to cut the installation plate 105 along the extending paths of the first slits 1031 and the second slits 1042.
The arrangement of the mounting plate 105 can enable the dustproof structure 100 produced in mass production to be relatively transported, and when a part of the dustproof structure 100 distributed on the mounting plate 105 needs to be obtained, the mounting plate 105 can be cut along the paths of the first slits 1031 and the second slits 1042, so that a certain number of parts of the dustproof structure 100 can be obtained, and the transportation and the use of a user are facilitated. It will be appreciated that the cutting device may be a wire cutting device or a laser cutting device, as long as cutting is facilitated.
Referring to fig. 1 to 4, the present invention further provides a dustproof structure 100, wherein the dustproof structure 100 is prepared by the above-mentioned manufacturing method of the dustproof structure 100. The dustproof structure 100 prepared by the invention has a better dustproof function, and can enable the dustproof sensor 1000 to be communicated with the external environment, thereby ensuring the detection sensitivity and the measurement accuracy of the sensor 1000. In some embodiments, the dust-proof structure 100 further includes a fixing portion 20, where the fixing portion 20 is a portion where the dust-proof mesh 11 is not formed in the manufacturing process, and when the supporting portion 104 is provided, the fixing portion 20 is mainly connected to the supporting portion 104 to improve the fixing effect of the supporting portion 104, and when the supporting portion 104 is not provided, the fixing portion 20 may be directly fixed to the sensor 1000 and enable the dust-proof portion 10 to cover the communication hole 210. The outer contour of the combination of the dust-proof part 10 and the fixing part 20 of the dust-proof structure 100 is substantially a quadrangular sheet-shaped configuration, the outer contour can be changed according to the configuration of the first slits 1031 and the second slits 1042, and the outer contour of the dust-proof part 10 can be configured according to the cross-sectional contour of the communication hole 210, thereby ensuring the covering efficiency of the communication hole 210, preventing the entry of foreign objects, and facilitating the sensing of the external environment by the internal sensing unit 300. The supporting portion 104 of the dust-proof structure 100 is formed with an opening for exposing the dust-proof portion 10, and one side of the supporting portion 104 is connected to the fixing portion 20. The other side of the supporting portion 104 may also be provided with anti-slip bumps, so as to improve the fixing effect with the sensor 1000 and ensure the dust-proof stability of the dust-proof structure 100.
Since the present dustproof structure 100 adopts all technical solutions of all the embodiments described above, at least all the beneficial effects brought by the technical solutions of the embodiments described above are achieved, and are not described in detail herein.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the dustproof structure is used for preventing dust of a sensor, the sensor comprises a shell and a sensing unit arranged in the shell, the shell is provided with a communication hole, the communication hole is communicated with the sensing unit and the external environment, and a dustproof portion of the dustproof structure covers the communication hole, and the manufacturing method of the dustproof structure is characterized by comprising the following steps of:
providing a substrate, and arranging a release film on one surface of the substrate;
depositing a metal layer on the surface of the release film;
forming a plurality of dustproof meshes on the metal layer through a photoetching process, wherein the plurality of dustproof meshes together form a dustproof part;
and separating the metal layer forming the dustproof part from the release film.
2. The method of manufacturing a dustproof structure according to claim 1, wherein the step of forming a plurality of dustproof mesh holes in the metal layer by a photolithography process comprises:
coating a photoresist on the surface of the metal layer;
exposing and developing the photoresist to obtain the photoresist with the preset size of the dustproof mesh;
and etching the metal layer attached with the photoresist, and removing the photoresist to obtain a plurality of dustproof meshes arranged on the metal layer.
3. The method of claim 2, wherein the step of coating the photoresist on the surface of the metal layer comprises:
coating a photoresist on the metal layer by a spin coating method;
vacuum drying the photoresist, and removing the photoresist on the edge of the metal layer;
baking the photoresist;
and cooling the baked photoresist.
4. The method of claim 1, wherein the step of forming a plurality of dust-proof meshes in the metal layer by a photolithography process, and wherein the step of separating the metal layer and the release film from each other to form the dust-proof portion further comprises, after the step of forming the dust-proof portion by the plurality of dust-proof meshes together:
forming a first kerf surrounding the dustproof part on the metal layer;
arranging a support material layer on the metal layer, and processing to form a support part;
and a mounting plate is arranged on one side of the supporting part, which is far away from the metal layer.
5. The method of claim 4, wherein the step of providing a support material layer on the metal layer and forming the support portion comprises:
coating a photosensitive material on the surface of the metal layer;
and developing and etching the photosensitive material to enable the photosensitive material to form an opening exposing the dustproof part and a second cutting seam exposing the first cutting seam, so as to obtain the supporting part.
6. The method for manufacturing a dustproof structure according to claim 5, wherein the step of providing a mounting plate on a side of the support portion facing away from the metal layer comprises:
providing a placing plate, and coating glue on one surface of the placing plate;
the surface of the placing plate for controlling the coating of the glue is attached to the surface of the supporting part, which is deviated from the metal layer.
7. The method of manufacturing a dust-proof structure according to any one of claims 1 to 6, wherein the step of separating the metal layer forming the dust-proof portion and the release film from each other includes:
removing the viscosity of the surface of the release film, which is attached to the metal layer;
and controlling the metal layer forming the dustproof part to be separated from the release film losing the viscosity.
8. The method for manufacturing a dustproof structure according to claim 7, wherein after the step of controlling the separation of the metal layer forming the dustproof portion and the release film without adhesion, the method further comprises:
when the metal layer is provided with the first cutting seam, the supporting part is provided with the second cutting seam, and the dustproof structure is provided with the mounting plate, the cutting device is controlled to cut the mounting plate along the extending paths of the first cutting seam and the second cutting seam.
9. The method of claim 8, wherein the metal layer is less than 2um thick;
and/or the aperture of the dustproof mesh is smaller than 3 um.
10. A dust-proof structure characterized by being manufactured by the manufacturing method of the dust-proof structure according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911034115.1A CN110726427A (en) | 2019-10-28 | 2019-10-28 | Dustproof structure and manufacturing method thereof |
| PCT/CN2019/123542 WO2021082184A1 (en) | 2019-10-28 | 2019-12-06 | Dustproof structure and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911034115.1A CN110726427A (en) | 2019-10-28 | 2019-10-28 | Dustproof structure and manufacturing method thereof |
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| CN110726427A true CN110726427A (en) | 2020-01-24 |
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| CN201911034115.1A Pending CN110726427A (en) | 2019-10-28 | 2019-10-28 | Dustproof structure and manufacturing method thereof |
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| WO (1) | WO2021082184A1 (en) |
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