CN110719693A - PCB processing tool and processing method - Google Patents
PCB processing tool and processing method Download PDFInfo
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- CN110719693A CN110719693A CN201810760632.6A CN201810760632A CN110719693A CN 110719693 A CN110719693 A CN 110719693A CN 201810760632 A CN201810760632 A CN 201810760632A CN 110719693 A CN110719693 A CN 110719693A
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- 238000012545 processing Methods 0.000 title claims abstract description 165
- 238000003672 processing method Methods 0.000 title claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 81
- 230000005540 biological transmission Effects 0.000 claims abstract description 30
- 229920001342 Bakelite® Polymers 0.000 claims abstract description 27
- 239000004637 bakelite Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims description 43
- 239000013013 elastic material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 15
- 230000003139 buffering effect Effects 0.000 description 14
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 9
- 238000003754 machining Methods 0.000 description 8
- 238000003801 milling Methods 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a PCB circuit board processing tool and a processing method, wherein the PCB circuit board processing tool is provided with a rack, a processing main shaft and a pressing plate assembly, wherein the processing main shaft is vertically arranged on the rack and can float up and down relative to the rack so as to process a PCB circuit board placed on a workbench; the pressing plate assembly comprises a pressing plate and a driving transmission device, the pressing plate is arranged at the bottom of the rack, and the driving transmission device can drive the pressing plate to downwards press the workbench or upwards move away from the workbench; the fixing step is that the bakelite plate is fixed on a workbench, the PCB large plate is arranged on the bakelite plate, a pin is fixed on the bakelite plate along the edge of the PCB large plate, and the pin sequentially penetrates through the edge of the PCB large plate and the bakelite plate so as to fix the PCB large plate on the bakelite plate; in the processing step, the PCB large board is processed into a plurality of PCB unit boards. The fixing device has the advantages of good fixing effect, high productivity, low processing cost and the like.
Description
Technical Field
The invention relates to a PCB processing tool and a PCB processing method.
Background
When the PCB board factory internally performs the forming processing of the PCB circuit board, the pin hole position is generally designed by selecting a proper hole without copper plating in the small PCB board of each unit, the pin corresponding to the position is planted on the bakelite board of the forming machine table board, the PCB unit board is fixed through the pin, namely, the single small PCB board ensures that the single small PCB board is stable and cannot be loosened, and the forming processing precision is not influenced.
However, with the development of the electronic industry, at present, due to the design requirements of some PCBs, no positioning hole is formed in the PCB unit board, and the above method for inserting the pin into the PCB unit board for positioning cannot be used for molding.
Currently, two methods are used to perform the forming operation for the PCB unit boards without holes in the boards. One is a mechanical structure forming machine designed by a vacuum adsorption platform, air of a PCB unit board and a machine table board is exhausted, and the PCB unit board is fixed by the atmospheric pressure of the board surface to carry out forming processing operation; the other is to use the sticking tape to fix the PCB unit board for processing operation.
However, in a PCB factory, many PCB circuit boards are produced in large quantities, and in the above two methods, because the vacuuming table can only absorb one board in contact with the table, the forming machine of the vacuum absorption table structure can only stack one board at a time; the other adhesive tape fixing operation method has the advantages that the fixing effect depends on the adhesive tape, the fixing effect is not good, the precision in molding and processing is poor, and in order to improve the fixing effect of the adhesive tape on the PCB, the adhesive tape can be processed and produced one by one.
Disclosure of Invention
The present invention is made in view of the above problems, and an object of the present invention is to provide a PCB processing tool and a processing method.
The invention has the advantages of good fixing effect, high productivity, low processing cost and the like.
The following technical scheme is adopted to achieve the purpose of the invention.
The invention of the first technical scheme is a PCB processing tool, which is used in cooperation with a workbench and comprises a rack, a processing main shaft and a pressing plate assembly.
The processing main shaft is vertically arranged on the rack and can float up and down relative to the rack so as to process the PCB placed on the workbench; the pressing plate assembly comprises a pressing plate and a driving transmission device, the pressing plate is arranged at the bottom of the rack, and the driving transmission device can drive the pressing plate assembly to move in the up-and-down direction, so that the pressing plate presses the workbench downwards or keeps away from the workbench upwards.
In addition, the PCB circuit board processing frock of second technical scheme, in the PCB circuit board processing frock of first technical scheme drive transmission include vertical being fixed in cylinder in the frame and arranging in the inside piston rod of cylinder, the opening of cylinder is down, the piston rod can be followed the cylinder up-and-down motion.
In addition, the PCB circuit board processing frock of third technical scheme, in the PCB circuit board processing frock of second technical scheme, the clamp plate subassembly still includes connecting plate and buffer, the connecting plate buffer with the clamp plate connects gradually from top to bottom, the lower extreme of piston rod with the last face of connecting plate is connected.
In addition, in the PCB processing tool according to the fourth aspect, in the PCB processing tool according to the third aspect, the buffer device includes an elastic member made of an elastic material, and the elastic member is fixed to the bottom surface of the connecting plate.
In addition, the PCB processing tool according to the fifth technical solution, in the PCB processing tool according to the fourth technical solution, the buffering device further includes a return spring fixed between the elastic member and the pressing plate.
The elastic component is fixed on the bottom surface of the connecting plate; one end of the return spring is connected with the elastic component, the other end of the return spring is connected with the pressing plate, the return spring is arranged in an inclined mode, and the return spring is in an extending state under the working condition that the piston rod extends out of the air cylinder.
In addition, in the PCB processing tool according to the sixth technical scheme, in the PCB processing tool according to the first technical scheme, the pressing plate is of a whole plate structure, and a pressing plate through hole through which the processing spindle can pass is formed in a central portion of the pressing plate.
In addition, in the PCB processing tool according to the seventh technical scheme, in the PCB processing tool according to the fourth technical scheme, the connecting plate is of a whole plate structure, and a connecting plate through hole through which the processing spindle can pass is formed in the connecting plate.
In addition, the PCB circuit board processing tool of the eighth technical scheme, in the PCB circuit board processing tool of the second technical scheme, the number of the cylinders is two, and the two cylinders are symmetrically distributed with the processing main shaft as a symmetry axis.
In addition, in the PCB processing tool according to the ninth technical scheme, in the PCB processing tool according to the fourth technical scheme, the four buffer devices are provided, and each buffer device includes an elastic member and a return spring, and the four buffer devices are symmetrically arranged in pairs with the processing main shaft as a symmetry axis.
The invention of the tenth technical scheme is a PCB circuit board processing method, which is applied to the PCB circuit board processing tool described in any one of the technical schemes, and the PCB circuit board processing method comprises a fixing step and a processing step.
Wherein, in the fixing step: fixing an bakelite plate on a workbench, arranging a PCB (printed circuit board) large plate on the bakelite plate, and fixing a plurality of pins on the bakelite plate along the edge of the PCB large plate, so that the pins sequentially penetrate through the edge of the PCB large plate and the bakelite plate to fix the PCB large plate on the bakelite plate; in the processing step: and processing the PCB large board into a plurality of formed PCB unit boards.
The processing step includes a determination step of a cutting point position, a main body processing step, and a cutting point processing step.
Specifically, in the determination step of the cut-off point position: selecting one end of the long edge of each PCB unit board as the position of the cutting point of each PCB unit board; in the main body processing step: cutting from the position of the cutting point of each PCB unit board by using the PCB circuit board processing tool so as to perform cutting and milling processing on the main body part of each PCB unit board; in the cutting point processing step: when the PCB processing tool is processed to the cutting points of the PCB unit boards, the driving transmission device drives the pressing plate to downwards press the cutting points of the PCB unit boards so as to perform cutting and milling processing on the cutting points of the PCB unit boards.
Compared with the prior art, the invention has the following beneficial effects by adopting the technical scheme.
The invention provides a PCB processing tool and a PCB processing method.
The PCB processing tool is matched with a workbench for use and is provided with a rack, a processing main shaft and a pressing plate assembly.
The processing main shaft is vertically arranged on the rack and can float up and down relative to the rack so as to process the PCB placed on the workbench; the pressing plate assembly comprises a pressing plate and a driving transmission device, the pressing plate is arranged at the bottom of the rack, and the driving transmission device can drive the pressing plate assembly to move along the up-and-down direction, so that the pressing plate can press the workbench downwards or keep away from the workbench upwards.
The PCB processing method is applied to the PCB processing tool and comprises a fixing step and a processing step.
The fixing steps are as follows: fixing the bakelite plate on a workbench, arranging the PCB large plate on the bakelite plate, and fixing a plurality of pins on the bakelite plate along the edge of the PCB large plate, so that each pin sequentially penetrates through the edge of the PCB large plate and the bakelite plate to fix the PCB large plate on the bakelite plate; the processing steps are as follows: and processing the PCB large board into a plurality of molded PCB unit boards.
Specifically, the machining step includes a determination step of a cut point position, a main body machining step, and a cut point machining step.
In the step of determining the position of the cutting point, one end of the long edge of each PCB unit board is selected as the position of the cutting point of each PCB unit board; in the main body processing step, a PCB processing tool is used for cutting from the position of the cutting point of each PCB unit board so as to carry out cutting and milling processing on the main body part of each PCB unit board; in the step of processing the cutting points, when the PCB processing tool is processed to the cutting points of each PCB unit board, the driving transmission device drives the pressing plate to downwards press the cutting points of the PCB unit boards so as to perform cutting and milling processing on the cutting points of the PCB unit boards.
Compared with the prior art, the processing operation method can only be used for producing the PCBs one by one, the PCB can be processed by the processing method, the number of stacked PCBs with no holes positioned in the PCBs can be increased, the forming processing capacity is improved, after the capacity is improved, the PCBs which are produced and processed in the same time are increased, and the forming processing cost including manpower, auxiliary materials and the like can be reduced; the PCB is processed and produced by using the processing operation method, the fixing effect of the PCB is good, the PCB cannot be loosened in the processing process, and the processing precision is high.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a front view showing a specific embodiment of the PCB processing tool provided by the present invention.
Fig. 2 is a front cross-sectional view showing a specific embodiment of the PCB processing tool provided by the present invention.
Fig. 3 is a side view showing a specific embodiment of the PCB processing tool provided by the present invention.
Fig. 4 is an enlarged view showing a part a of fig. 3.
Fig. 5 is a plan view showing a table used in conjunction with a specific embodiment of the PCB board processing tool provided by the present invention.
FIG. 6 is a flow chart diagram showing a PCB circuit board processing method provided by the invention.
Reference numerals: 1-a workbench; 11-bakelite board; 12-PCB large board; 13-a pin; 14-PCB unit board; 141-cut point; 2-a frame; 3-processing the main shaft; 41-a pressing plate; 42-a drive transmission; 421-air cylinder; 422-a piston rod; 43-a connecting plate; 44-a buffer device; 441-an elastic member; 442-a return spring; s1-fixing step; s2-processing step; s21-determining the cutting point position; s22-main body processing step; s23-cutting point processing step.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The following describes a specific embodiment of the overall structure of the PCB processing tool according to the present invention.
Fig. 1 is a front view showing a specific embodiment of the PCB processing tool provided by the present invention. Fig. 2 is a front cross-sectional view showing a specific embodiment of the PCB processing tool provided by the present invention. Fig. 3 is a side view showing a specific embodiment of the PCB processing tool provided by the present invention. Fig. 4 is an enlarged view showing a part a of fig. 3. Fig. 5 is a plan view showing a table used in conjunction with a specific embodiment of the PCB board processing tool provided by the present invention.
As shown in fig. 1 to 5, the PCB board processing tool is used in cooperation with a table 1, and includes a frame 2, a processing spindle 3, and a platen assembly.
The processing main shaft 3 is vertically arranged on the frame 2 and can float up and down relative to the frame 2 so as to process the PCB arranged on the workbench 1; the pressing plate assembly comprises a pressing plate 41 and a driving transmission device 42, the pressing plate 41 is arranged at the bottom of the rack 2, and the driving transmission device 42 can drive the pressing plate assembly to move in the up-and-down direction, so that the pressing plate 41 presses the workbench 1 downwards or is away from the workbench 1 upwards.
Further, the driving transmission device 42 includes a cylinder 421 vertically fixed on the frame 2 and a piston rod 422 disposed inside the cylinder 421, an opening of the cylinder 421 faces downward, and the piston rod 422 can move up and down along the cylinder 421.
Still further, the platen assembly further includes a connecting plate 43 and a cushioning device 44. The connecting plate 43, the buffer device 44 and the pressing plate 41 are sequentially connected from top to bottom, and the lower end of the piston rod 422 is connected with the upper plate surface of the connecting plate 43.
Further, the buffer 44 includes an elastic member 441 made of an elastic material, and the elastic member 441 is fixed to the bottom surface of the connection plate 43.
Further, the buffer device 44 further includes a return spring 442 fixed between the elastic member 441 and the pressure plate 41. The elastic member 441 is fixed to the bottom surface of the connection plate 43; one end of the return spring 442 is connected to the elastic member 441, the other end of the return spring 442 is connected to the pressing plate 41, the return spring 442 is disposed obliquely, and the return spring 442 is in an extended state under a condition that the piston rod 422 is extended out of the cylinder 421.
The platen 41 has a full-plate structure, and a platen through hole through which the machining spindle 3 can pass is provided in a central portion of the platen 41.
The connecting plate 43 has a full-plate structure, and a connecting plate through hole through which the machining spindle 3 can pass is provided in the connecting plate 43.
The number of the cylinders 421 is two, and the two cylinders 421 are symmetrically arranged with the machining spindle 3 as an axis of symmetry.
In addition, the buffer devices 44 have four sets, each set of buffer devices 44 includes a respective elastic member 441 and a respective return spring 442, and the four sets of buffer devices 44 are distributed two by two symmetrically with the machining spindle 3 as a symmetry axis.
In addition, the invention also provides a PCB processing method which is applied to the PCB processing tool.
FIG. 6 is a flow chart diagram showing a PCB circuit board processing method provided by the invention.
As shown in fig. 6, the PCB panel processing method includes a fixing step S1 and a processing step S2.
Wherein, the fixing step S1 is: fixing the bakelite plate 11 on the workbench 1, arranging the PCB large plate 12 on the bakelite plate 11, fixing a plurality of pins 13 on the bakelite plate 11 along the edge of the PCB large plate 12, and enabling the pins 13 to sequentially penetrate through the edge of the PCB large plate 12 and the bakelite plate 11 so as to fix the PCB large plate 12 on the bakelite plate 11; the processing step S2 is: the PCB large panel 12 is processed into a plurality of molded PCB unit panels 14.
Specifically, the processing step S2 includes a determination step S21 of a cut point position, a body processing step S22, and a cut point processing step S23.
In the determination step S21 of the cutting point position, one end of the long side of each PCB unit board 14 is selected as the position of the cutting point 141 of each PCB unit board 14; in the main body processing step S22, a PCB board processing tool is used to lower a tool from the position of the cutting point 141 of each PCB unit board 14 to further perform a cutting and milling process on the main body part of each PCB unit board 14; in the cutting point processing step S23, when the PCB board processing tool is processed to the cutting point 141 of each PCB unit board 14, the driving transmission device 42 drives the pressing plate 41 to press the cutting point 141 of the PCB unit board 14 downward so as to perform the cutting and milling processing on the cutting point 141 of the PCB unit board 14.
Compared with the prior art, the processing operation method can only be used for producing the PCBs one by one, the PCB can be processed by the processing method, the number of stacked PCBs with no holes positioned in the PCBs can be increased, the forming processing capacity is improved, after the capacity is improved, the PCBs which are produced and processed in the same time are increased, and the forming processing cost including manpower, auxiliary materials and the like can be reduced; the PCB is processed and produced by using the processing operation method, the fixing effect of the PCB is good, the PCB cannot be loosened in the processing process, and the processing precision is high.
In addition, in the above-mentioned specific implementation mode of the PCB processing tool, the driving transmission device includes an air cylinder vertically fixed on the frame and a piston rod disposed inside the air cylinder, an opening of the air cylinder is downward, and the piston rod can move up and down along the air cylinder.
Through such structure, usable external air pump is controlled the cylinder to the up-and-down motion to the clamp plate subassembly is controlled, compares in electromechanical formula structure, and pneumatic control has safety, stable advantage.
In addition, in the specific embodiment of the above PCB processing tool, the pressing plate assembly further includes a connecting plate and a buffering device, the connecting plate, the buffering device and the pressing plate are sequentially connected from top to bottom, and the lower end of the piston rod is connected with the upper plate surface of the connecting plate. And further, the buffer means is provided to include an elastic member made of an elastic material, the elastic member being fixed to the bottom surface of the connection plate.
Through setting up buffer, can push down the clamp plate and play the cushioning effect, avoid taking place the rigidity collision between clamp plate and the workstation, cause the clamp plate to damage.
In addition, in the specific embodiment of the PCB processing tool, the buffering device further comprises a return spring fixed between the elastic member and the pressing plate, and the elastic member is fixed on the bottom surface of the connecting plate; one end of the return spring is connected with the elastic component, the other end of the return spring is connected with the pressing plate, the return spring is arranged in an inclined mode, and under the working condition that the piston rod extends out of the air cylinder, the return spring is in an extending state.
From this, provide a structural style of above-mentioned buffer, through return spring's resilience force, make under the operating mode that does not carry out processing to the cutting point, the clamp plate keeps having one section distance with the workstation before to, ensure that this PCB circuit board processing frock can be along with the smooth and easy removal of direction of processing.
In addition, in the specific embodiment of the above PCB processing tool, the pressing plate is of a whole plate structure, and a pressing plate through hole through which the processing spindle can pass is formed in a central portion of the pressing plate.
Therefore, the pressing plate can have a larger pressing area, and the workbench cannot move back and forth under the condition of pressing down.
In addition, in the specific embodiment of the above PCB processing tool, the connecting plate is of a whole plate structure, and a connecting plate through hole through which the processing spindle can pass is formed in the connecting plate.
Therefore, the connecting plate and the pressing plate can be well linked.
In addition, in the specific embodiment of the above PCB processing tool, two cylinders are provided, and the two cylinders are symmetrically distributed with the processing spindle as a symmetry axis.
Therefore, compared with the arrangement of one air cylinder, the action reliability of driving the pressing plate assembly by the driving transmission device can be ensured.
In addition, in the specific embodiment of the above PCB processing tool, the four buffering devices are provided, each of the four buffering devices includes an elastic member and a return spring, and the four buffering devices are symmetrically arranged in pairs with the processing main shaft as a symmetry axis.
Through above structure, can guarantee that buffer's overall structure is applicable to the structure of connecting plate, clamp plate and processing main shaft more, make buffer more even to the cushioning effect between connecting plate and the clamp plate, ensure that the clamp plate is in the horizontal plane all the time, avoid the cushioning effect inhomogeneous, the clamp plate unevenness to influence the removal of PCB circuit board processing frock and compress tightly the effect.
In the above embodiments, the specific structure of the PCB processing tool according to the present invention is described, but the present invention is not limited thereto.
For example, in the above embodiment, in the above specific embodiment of the PCB processing tool, the driving transmission device includes a cylinder vertically fixed on the frame and a piston rod disposed inside the cylinder, an opening of the cylinder faces downward, and the piston rod can move up and down along the cylinder.
But not limited to this, drive transmission can also be spiral lead screw lift structure, including motor, turbine, worm and lead screw, and the turbine shell is fixed in on the frame, and the lead screw sets up vertically. Utilize electric drive motor to rotate, the motor drives the worm and rotates, utilizes the transmission of turbine worm to make the turbine rotate, and the turbine center is the internal thread structure, is equivalent to the nut of lead screw to the lead screw phase-match, with the lead screw cooperation, thereby the turbine worm drives the lead screw and is upwards or decurrent axial motion reaches and drives the clamp plate subassembly and move along upper and lower direction, thereby make the clamp plate sticis the workstation downwards or upwards keep away from the drive transmission function of workstation etc..
However, according to the structure in the specific implementation mode, the air cylinder can be controlled by the external air pump, so that the vertical movement of the pressing plate assembly is controlled, and compared with an electromechanical structure, the pneumatic control has the advantages of safety and stability.
In addition, in the specific embodiment of the above PCB processing tool, the pressing plate assembly further includes a connecting plate and a buffering device, the connecting plate, the buffering device and the pressing plate are sequentially connected from top to bottom, and the lower end of the piston rod is connected with the upper plate surface of the connecting plate. And further, the buffer means is provided to include an elastic member made of an elastic material, the elastic member being fixed to the bottom surface of the connection plate.
However, the present invention is not limited to this, and the lower end of the piston rod may be directly connected to the pressing plate without providing the connecting plate and the buffer device, and the PCB of the table may be pressed by the pressing plate at the cutting point.
However, according to the structure of the specific embodiment, the connecting plate and the buffer device are arranged, so that the buffer device can be arranged to press down the pressing plate to play a buffer role, and the pressing plate is prevented from being damaged due to rigid collision between the pressing plate and the workbench.
In addition, in the specific embodiment of the PCB processing tool, the buffering device further comprises a return spring fixed between the elastic member and the pressing plate, and the elastic member is fixed on the bottom surface of the connecting plate; one end of the return spring is connected with the elastic component, the other end of the return spring is connected with the pressing plate, the return spring is arranged in an inclined mode, and under the working condition that the piston rod extends out of the air cylinder, the return spring is in an extending state.
However, according to the structure of the specific embodiment, the buffering device further comprises the return spring fixed between the elastic member and the pressing plate, so that a distance is kept between the pressing plate and the workbench under the working condition that the cutting point is not processed by the resilience force of the return spring, and the PCB processing tool can be ensured to move smoothly along with the processing direction.
In addition, in the specific embodiment of the above PCB processing tool, the pressing plate is of a whole plate structure, and a pressing plate through hole through which the processing spindle can pass is formed in a central portion of the pressing plate. But not limited to this, also can set up the clamp plate and have two, two clamp plates use processing main shaft as symmetry axisymmetric distribution, and each clamp plate is connected with drive transmission respectively, can realize through drive transmission control clamp plate downward sticis the workstation or upwards keeping away from the workstation thereby fix the PCB circuit board again.
However, compared with the above-mentioned alternative structure, the structure according to the specific embodiment can make the pressing plate have a larger pressing area, and the problem that the two plates cannot be lifted simultaneously is not generated, so that the workbench is not moved back and forth under the condition that the pressing plate is pressed downwards.
In addition, in the specific embodiment of the above PCB processing tool, the connecting plate is of a whole plate structure, and a connecting plate through hole through which the processing spindle can pass is formed in the connecting plate. But not limited to this, also can set up the connecting plate and have two, two connecting plates use processing main shaft as symmetry axis symmetry distribution, and each connecting plate is connected with drive transmission respectively, can realize drive transmission and press the connecting plate equally, and pressure transmission is pressed the workstation downwards to the clamp plate or drive device control clamp plate upwards keeps away from the workstation thereby fixes the PCB circuit board.
However, compared with the above-mentioned alternative structure, the structure according to the specific embodiment can fully ensure good linkage between the connecting plates and the pressing plate, and avoid the problem that the pressing or lifting actions of the two connecting plates are not synchronous.
In addition, in the specific embodiment of the above PCB processing tool, two cylinders are provided, and the two cylinders are symmetrically distributed with the processing spindle as a symmetry axis.
However, according to the configuration of the embodiment, the two cylinders are provided and the two cylinders are symmetrically distributed with the processing main shaft as a symmetry axis, so that the operation reliability of driving the platen assembly by the driving transmission device can be ensured compared with the case where one cylinder is provided.
In addition, in the specific embodiment of the above PCB processing tool, the four buffering devices are provided, each of the four buffering devices includes an elastic member and a return spring, and the four buffering devices are symmetrically arranged in pairs with the processing main shaft as a symmetry axis.
However, the present invention is not limited to this, and in the case where only one set of the buffer device is provided, the buffer device may be located on either side of the machining spindle, however, according to the configuration in the embodiment, the buffer means is provided with four sets, and each group of buffer devices respectively comprises an elastic component and a return spring, the four groups of buffer devices are distributed pairwise symmetrically by taking the processing main shaft as a symmetrical shaft, therefore, the overall structure of the buffer device can be ensured to be more suitable for the structures of the connecting plate, the pressing plate and the processing main shaft, the buffer effect of the buffer device between the connecting plate and the pressing plate is more uniform, the pressing plate is ensured to be always in the horizontal plane, the uneven buffer effect is avoided, and the unevenness of the pressing plate is avoided, so that the moving and pressing effect of the PCB circuit board processing tool is influenced.
In addition, the PCB processing tool of the present invention can be combined by various structures of the above embodiments, and can also exhibit the above effects.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A PCB processing tool is used by matching with a workbench and is characterized by comprising a frame, a processing main shaft and a pressing plate component,
the processing main shaft is vertically arranged on the rack and can float up and down relative to the rack so as to process the PCB placed on the workbench;
the pressure plate component comprises a pressure plate and a driving transmission device,
the pressing plate is arranged at the bottom of the frame,
the driving transmission device can drive the pressing plate assembly to move in the up-and-down direction, so that the pressing plate presses the workbench downwards or is away from the workbench upwards.
2. A PCB circuit board processing tool according to claim 1, wherein the driving transmission device comprises a cylinder vertically fixed on the rack and a piston rod arranged inside the cylinder, the opening of the cylinder is downward, and the piston rod can move up and down along the cylinder.
3. The PCB processing tool of claim 2, wherein the pressure plate assembly further comprises a connecting plate and a buffer device,
the connecting plate, the buffer device and the pressing plate are sequentially connected from top to bottom,
the lower end of the piston rod is connected with the upper plate surface of the connecting plate.
4. A PCB processing tool according to claim 3, wherein the buffer device comprises an elastic member made of elastic material, and the elastic member is fixed on the bottom surface of the connecting plate.
5. The PCB circuit board processing tool according to claim 4, wherein the buffer device further comprises a return spring fixed between the elastic member and the pressing plate,
the elastic component is fixed on the bottom surface of the connecting plate;
one end of the return spring is connected with the elastic component, the other end of the return spring is connected with the pressing plate,
the return spring is obliquely arranged, and under the working condition that the piston rod extends out of the air cylinder, the return spring is in an extending state.
6. The PCB circuit board processing tool according to claim 1, wherein the pressing plate is of a whole plate structure, and a pressing plate through hole through which the processing spindle can pass is formed in the center of the pressing plate.
7. A PCB circuit board processing tool according to claim 4, wherein the connecting plate is of a whole plate structure, and a connecting plate through hole through which the processing spindle can pass is arranged on the connecting plate.
8. The PCB circuit board processing tool according to claim 2, wherein the number of the cylinders is two, and the two cylinders are symmetrically distributed by taking the processing main shaft as a symmetry axis.
9. The PCB processing tool of claim 4, wherein,
the buffer device has four groups, each group of buffer device comprises an elastic component and a return spring,
the four groups of buffer devices are distributed pairwise symmetrically by taking the processing main shaft as a symmetry axis.
10. A PCB processing method is applied to the PCB processing tool of any one of claims 1 to 9, and is characterized by comprising the following steps:
fixing, namely fixing an bakelite plate on a workbench, arranging a large PCB plate on the bakelite plate, and fixing a plurality of pins on the bakelite plate along the edge of the large PCB plate so that the pins sequentially penetrate through the edge of the large PCB plate and the bakelite plate to fix the large PCB plate on the bakelite plate; and
processing, namely processing the PCB large board into a plurality of formed PCB unit boards;
the processing steps include:
determining the position of a cutting point, namely selecting one end of the long edge of each PCB unit board as the position of the cutting point of each PCB unit board;
a main body processing step, namely cutting the PCB circuit board processing tool from the position of the cutting point of each PCB unit board so as to cut and mill the main body part of each PCB unit board; and
and a cutting point processing step, wherein when the PCB processing tool is processed to the cutting point of each PCB unit board, the driving transmission device drives the pressing plate to downwards press the cutting point of the PCB unit board so as to cut and mill the cutting point of the PCB unit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810760632.6A CN110719693A (en) | 2018-07-11 | 2018-07-11 | PCB processing tool and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810760632.6A CN110719693A (en) | 2018-07-11 | 2018-07-11 | PCB processing tool and processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110719693A true CN110719693A (en) | 2020-01-21 |
Family
ID=69208275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810760632.6A Pending CN110719693A (en) | 2018-07-11 | 2018-07-11 | PCB processing tool and processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110719693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113927349A (en) * | 2021-10-22 | 2022-01-14 | 深圳市众博信发展有限公司 | Positioning system for manufacturing PCB |
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| CN106573351A (en) * | 2014-05-20 | 2017-04-19 | 倍珞蒂股份公司 | Working machine with clamping device. |
| CN206356876U (en) * | 2016-12-27 | 2017-07-28 | 苏州艾风机械有限公司 | A kind of automatic Tao Huang mechanisms |
| CN208540258U (en) * | 2018-07-11 | 2019-02-22 | 维嘉数控科技（苏州）有限公司 | PCB circuit board processing tool |
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| JPH01193109A (en) * | 1988-01-29 | 1989-08-03 | Hitachi Chem Co Ltd | Drilling method of printed circuit board |
| CN106573351A (en) * | 2014-05-20 | 2017-04-19 | 倍珞蒂股份公司 | Working machine with clamping device. |
| CN104493645A (en) * | 2014-12-25 | 2015-04-08 | 济南第一机床有限公司 | Special purpose machine tool machining axial holes of main shaft |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113927349A (en) * | 2021-10-22 | 2022-01-14 | 深圳市众博信发展有限公司 | Positioning system for manufacturing PCB |
| CN113927349B (en) * | 2021-10-22 | 2023-08-25 | 深圳市众博信发展有限公司 | Positioning system for manufacturing PCB |
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Address after: No.188 Chuangyuan Road, industrial park, Suzhou, Jiangsu Province, 215000 Applicant after: Suzhou Weijia Technology Co.,Ltd. Address before: 215000 188 Xincheng Road, Suzhou Industrial Park, Jiangsu Province Applicant before: VEGA CNC TECHNOLOGY (SUZHOU) Co.,Ltd. |
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