CN110718510A

CN110718510A - Vacuum packaging method for super-large TO photoelectric shell

Info

Publication number: CN110718510A
Application number: CN201911071149.8A
Authority: CN
Inventors: 陈于伟; 陈雯静; 冯晨; 黄雪
Original assignee: CETC 44 Research Institute
Current assignee: CETC 44 Research Institute
Priority date: 2019-11-05
Filing date: 2019-11-05
Publication date: 2020-01-21
Anticipated expiration: 2039-11-05
Also published as: CN110718510B

Abstract

The invention discloses a vacuum packaging method for an oversized TO photoelectric shell, which comprises the following steps: firstly, mounting a vacuum pipeline on a pipe cap of a photoelectric shell, then packaging a detector in the photoelectric shell, welding the pipe cap and a pipe seat by using energy storage welding equipment, then connecting the vacuum pipeline with a vacuum pump, and vacuumizing the photoelectric shell; and when the vacuum degree is less than or equal to the preset value, closing the vacuum pump, and shearing the vacuum pipeline by using a sealing clamp to form the airtight packaging structure. According TO the invention, the vacuum pipeline is arranged on the TO photoelectric shell, the limitation of the energy storage welding equipment on the size of the TO photoelectric shell is eliminated, the vacuum packaging of the oversized TO photoelectric shell can be realized, meanwhile, the mutual influence of the TO photoelectric shell, the vacuum pipeline and the vacuum pump interface structure is also accurately considered, the design precision is high, the vacuum packaging effect is good, and the practicability is strong.

Description

Vacuum packaging method for super-large TO photoelectric shell

Technical Field

The invention relates TO the field of vacuum packaging of image sensors, in particular TO a vacuum packaging method of an oversized TO photoelectric shell.

Background

In the vacuum packaging process of the conventional TO photoelectric shell, a closed structure device is additionally arranged outside an upper electrode and a lower electrode of the energy storage welding equipment, and a vacuum processing pipeline is arranged at the bottom of the device and connected with a vacuum pump.

In the vacuum packaging process, the TO pipe cap pipe seat is placed on the upper clamp and the lower clamp of the energy storage welding equipment respectively, then the sealing structure device is closed, the vacuum pump is started, after the specified vacuum degree is reached, the energy storage welding power supply is started, the sealing area of the TO pipe cap pipe seat reaches interatomic bonding, and the airtight sealing between the TO pipe cap and the pipe seat is realized.

Limited by the hardware of the energy storage welding equipment, the operation mode can realize the vacuum packaging of the TO photoelectric shell with the TO pipe cap diameter within 15.30 mm. If the diameter size is exceeded, no suitable energy storage welding equipment is available, so that vacuum packaging of the photoelectric shell cannot be realized.

In the development process of a Silicon Drift chamber Detector (SDD), the interior of a package must be vacuum to meet application requirements in the aspects of space X-ray detection, X-ray fluorescence analysis, radiation protection detection and the like. The TO pipe cap designed according TO the size of the ultra-large area silicon drift chamber detector has the diameter of 47.00mm, and the original energy storage welding equipment cannot be subjected TO vacuum packaging.

Disclosure of Invention

The technical problem TO be solved by the invention is TO provide a method for vacuum packaging a TO photoelectric shell with a tube cap diameter exceeding 15.30 mm.

The technical scheme of the invention is as follows:

a vacuum packaging method for an ultra-large TO photoelectric shell comprises the following steps:

step S1, installing a vacuum pipeline on the pipe cap of the photoelectric shell;

step S2, installing a detector on a tube seat of the photoelectric shell;

step S3, welding a pipe cap and a pipe seat by using energy storage welding equipment;

step S4, connecting the vacuum pipeline with a vacuum pump, and vacuumizing the photoelectric shell;

and step S5, when the vacuum degree is less than or equal to the preset value, closing the vacuum pump, and shearing the vacuum pipeline by using a sealing clamp to form the airtight packaging structure.

Further, the step S1 includes the following sub-steps:

step S101, arranging a mounting hole in the middle of the side wall of the photoelectric shell pipe cap, wherein the inner diameter of the mounting hole is matched with the outer diameter of the vacuum pipeline;

a substep S102 of inserting one end of the vacuum pipe into the mounting hole;

and a substep S103 of forming the pipe cap and the vacuum pipe into a whole by seamless welding.

Further, the inner diameter of the mounting hole is 0.1mm larger than the outer diameter of the vacuum pipeline.

Furthermore, the end face of the insertion end of the vacuum pipeline is flush with the inner wall of the pipe cap.

Furthermore, the pipe cap is made of pure nickel materials, and the vacuum pipeline is made of an oxygen-free copper pipe; in an inert gas environment, the tube cap and the oxygen-free copper tube are brazed into a whole at the high temperature of 850 ℃ by using silver-copper solder, so that the requirement of air tightness is met.

Furthermore, the outer wall of the non-connecting end of the vacuum pipeline is provided with a section of thread, and the vacuum pipeline is in threaded connection with the vacuum pump during vacuum pumping.

Further, the step S2 includes the following sub-steps:

step S201, mounting and fixing the detector on a tube seat;

and a substep S202, connecting the pin and the pin of the detector by adopting a wire bonding mode.

Has the advantages that: according TO the invention, the vacuum pipeline is arranged on the TO photoelectric shell, the limitation of the energy storage welding equipment on the size of the TO photoelectric shell is eliminated, the vacuum packaging of the oversized TO photoelectric shell can be realized, meanwhile, the mutual influence of the TO photoelectric shell, the vacuum pipeline and the vacuum pump interface structure is also accurately considered, the design precision is high, the vacuum packaging effect is good, and the practicability is strong.

Drawings

FIG. 1a is a front view of a pin and socket configuration of a TO optoelectronic package;

FIG. 1b is a top view of a pin and socket structure of a TO optoelectronic package;

FIG. 2 is a flow chart of the present invention;

fig. 3 is a flowchart of step S1;

fig. 4 is a flowchart of step S2;

FIG. 5 is a schematic structural view of a cap and an oxygen-free copper tube of a TO photovoltaic can;

FIG. 6a is a front view of a cuboid photovoltaic housing and an oxygen-free copper tube structure;

fig. 6b is a top view of a cuboid photovoltaic envelope and oxygen-free copper tube structure.

In the figure: 1-pipe cap, 2-oxygen-free copper pipe, 3-pipe seat, 4-pipe pin and 5-glass insulator.

Detailed Description

The invention will be further explained with reference to the drawings.

In the description of the present invention, unless otherwise specified and limited, it is to be noted that the term "connected" is to be interpreted broadly, and may be, for example, a mechanical connection or an electrical connection, or a communication between two elements, or may be a direct connection or an indirect connection through an intermediate medium, and a specific meaning of the term may be understood by those skilled in the art according to specific situations.

The following examples are provided to explain the present invention in detail.

The diameter of a tube cap 1 of the ultra-large TO photoelectric shell used in the embodiment is 47.00mm so as TO accommodate the ultra-large area silicon drift chamber detector, an optical window is made of beryllium window material, and the tube cap 1 is made of pure nickel material so as TO facilitate the airtight sealing of the beryllium window; as shown in fig. 1a and 1b, the socket 3 is mainly composed of kovar, and the pins 4 and the socket 3 are sintered at a high temperature through the glass insulator 5 to form a hermetic structure. As shown in fig. 2, the method for vacuum packaging of the oversized TO optoelectronic package comprises the following steps:

step S1, installing a vacuum pipeline on the pipe cap of the photoelectric shell; as shown in fig. 3, step S1 includes the following sub-steps:

in the substep S101, a mounting hole with the diameter of 4.1mm is formed in the middle of the side wall of the TO photoelectric shell pipe cap 1, and the stability of the whole structure of the pipe cap 1 cannot be influenced because the hole is formed in the center of the side wall of the pipe cap 1;

the substep S102, adopting an oxygen-free copper pipe 2 with the diameter of 4.0mm and the length of 50.0mm as a vacuum pipeline, arranging a section of screw thread on the outer wall of one end of the oxygen-free copper pipe 2, inserting the non-screw thread end of the oxygen-free copper pipe 2 into the mounting hole, and enabling the end surface of the non-screw thread end to be flush with the inner wall of the pipe cap 1;

and a substep S103, in an inert gas environment, brazing the tube cap 1 and the oxygen-free copper tube 2 by using silver-copper solder at a high temperature of 850 ℃ to form a whole, so as to meet the requirement of air tightness, wherein the structure of the tube cap and the oxygen-free copper tube 2 after brazing is shown in figure 5.

Step S2, mounting a super-large-area silicon drift chamber detector on a tube seat 3 of the photoelectric shell; as shown in fig. 4, step S2 includes the following sub-steps:

step S201, mounting and fixing the ultra-large area silicon drift chamber detector on the tube seat 3;

and a substep S202 of connecting the pin 4 and a pin of the ultra-large area silicon drift chamber detector by adopting a bonding wire mode.

And step S3, welding the pipe cap 1 and the pipe seat 3 by using an energy storage welding device.

Step S4, connecting the thread end of the oxygen-free copper pipe 2 with the vacuum pump through threads, starting the vacuum pump, and vacuumizing the photoelectric shell; because the diameter of the oxygen-free copper pipe 2 is matched with the diameter of the vacuum pump interface and is screwed up by the screw thread of the threaded hole, the vacuum exhaust treatment can be realized.

Step S5, when the vacuum degree in the photoelectric shell is less than or equal to 5.0x10^-3When Pa, stop the evacuation, use the sealing pliers TO cut anaerobic copper pipe 2, anaerobic copper pipe 2 becomes soft through the material behind the 850 ℃ high temperature, is favorable TO cuting, has ductility after anaerobic copper pipe 2 anneals moreover, and the shearing department gas tightness is good, can make the photoelectricity shell form whole gas tightness packaging structure TO accomplish the vacuum packaging of super large TO photoelectricity shell.

The invention can also be applied to the vacuum packaging of the cuboid photoelectric shell, and the structure of the cuboid photoelectric shell after the oxygen-free copper tube 2 is installed is shown in fig. 6a and 6 b.

The invention accurately considers the mutual influence of the TO photoelectric shell, the vacuum pipeline and the vacuum pump interface structure, and has the advantages of high design precision, good vacuum packaging effect and strong practicability.

The undescribed parts of the present invention are consistent with the prior art, and are not described herein.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the present specification and the drawings can be directly or indirectly applied to other related technical fields, and are within the scope of the present invention.

Claims

1. A vacuum packaging method for an ultra-large TO photoelectric shell is characterized by comprising the following steps:

step S2, installing a detector on a tube seat of the photoelectric shell;

2. The vacuum packaging method of the oversized TO optoelectronic package of claim 1, wherein the step S1 includes the following substeps:

a substep S102 of inserting one end of the vacuum pipe into the mounting hole;

3. The vacuum packaging method of the oversized TO optoelectronic package of claim 2, wherein the inner diameter of the mounting hole is 0.1mm larger than the outer diameter of the vacuum tube.

4. The vacuum packaging method of the oversized TO optoelectronic package of claim 2, wherein the end face of the inserted end of the vacuum pipe is flush with the inner wall of the pipe cap.

5. The vacuum packaging method of the oversized TO photoelectric shell according TO claim 2, wherein the tube cap is made of pure nickel materials, and the vacuum pipeline is made of oxygen-free copper tubes; in an inert gas environment, the tube cap and the oxygen-free copper tube are brazed into a whole at the high temperature of 850 ℃ by using silver-copper solder, so that the requirement of air tightness is met.

6. The vacuum packaging method of the oversized TO optoelectronic package as recited in claim 1, wherein a section of thread is arranged on the outer wall of the non-connection end of the vacuum pipeline, and the vacuum pipeline is in threaded connection with a vacuum pump during vacuum pumping.

7. The vacuum packaging method of the oversized TO optoelectronic package of claim 1, wherein the step S2 includes the following substeps:

step S201, mounting and fixing the detector on a tube seat;