CN110718458A - Semiconductor precision cutting equipment - Google Patents
Semiconductor precision cutting equipment Download PDFInfo
- Publication number
- CN110718458A CN110718458A CN201911024989.9A CN201911024989A CN110718458A CN 110718458 A CN110718458 A CN 110718458A CN 201911024989 A CN201911024989 A CN 201911024989A CN 110718458 A CN110718458 A CN 110718458A
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- Prior art keywords
- strip
- shaped
- motor
- slag
- precision cutting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
Abstract
The invention discloses semiconductor precision cutting equipment which comprises a U-shaped carrier, a laser cutting head, a first motor, a filter, a suction fan, a discharge pipe, a second motor, a strip-shaped frame, a strip-shaped steel sheet, a rectangular groove, a strip-shaped groove, a long screw, a polishing wheel, a rotating shaft, a traction block, a screw hole, a sliding plate, a cylinder, a three-blade plate, a round rod, a strip-shaped brush, a strip-shaped opening and a third motor. The strip-shaped frame is reasonable in design, the slag adhered to the strip-shaped steel sheet can be ground, the strip-shaped steel sheet is convenient to use subsequently, the problem of inconvenience in cleaning is solved, the strip-shaped frame connected with the traction block is moved leftwards or rightwards under the action of force by starting the first motor to drive the long screw to rotate, so that the strip-shaped frame can move in a reciprocating mode, the effect of comprehensively and quickly cleaning the slag is achieved, the cleaned slag can be discharged into the containing structure placed at the bottom of the outlet, the function of quickly and intensively cleaning and discharging the slag is achieved, and the effect of intensively treating the slag is improved.
Description
Technical Field
The invention relates to cutting equipment, in particular to semiconductor precision cutting equipment, and belongs to the technical field of semiconductor processing application.
Background
The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, has wide application in radio, television and temperature measurement, for example, a diode is a device made of the semiconductor, and the semiconductor is a material with controllable electric conductivity ranging from the insulator to the conductor.
Laser cutting semiconductor material's equipment has melting slag cooling to glue and is placing the problem that structural difficult clearance is gone up in the in-process of cutting, places structural design simultaneously and remains perfect, the quick comprehensive clearance of not being convenient for, the slag charge that the clearance dropped moreover scatters everywhere, brings very big inconvenience for the cleanup crew, lacks the structure that can carry the row and send the slag charge that drops. Therefore, a semiconductor precision cutting apparatus is proposed to address the above problems.
Disclosure of Invention
The invention aims to solve the problems and provide a semiconductor precision cutting device.
The invention realizes the aim through the following technical scheme, and the semiconductor precision cutting equipment comprises a U-shaped carrier, a traction mechanism, a slag scraping mechanism and a slag discharging mechanism, wherein a laser cutting head is installed at the joint of a moving mechanism of the inner top wall of the U-shaped carrier, a rectangular groove is formed in the inner bottom wall of the U-shaped carrier, a plurality of strip-shaped steel sheets are equidistantly installed in the rectangular groove, and a placing surface is formed by the strip-shaped steel sheets;
the traction mechanism comprises a long screw, the long screw is rotatably arranged in the corresponding strip-shaped groove, one end of the long screw is arranged at one end of the corresponding first motor shaft lever, the long screw is in threaded connection with a corresponding traction block, the traction block is slidably arranged in the corresponding strip-shaped groove, and a screw hole is formed in the traction block;
the slag scraping mechanism comprises a strip-shaped frame, two sides of a port at the bottom of the strip-shaped frame are fixedly connected with the top end of the traction block on the same side, a rotating shaft is rotated in the strip-shaped frame, a plurality of grinding wheels are equidistantly assembled on the rotating shaft, one end of the rotating shaft is installed at one end of a shaft rod of a second motor, and the grinding wheels are in rolling contact with the top surfaces and the two side wall surfaces of the corresponding strip-shaped steel sheets;
the slag discharging mechanism comprises a sliding plate, the sliding plate is obliquely arranged at the bottom in the rectangular groove, one side of the sliding plate is arranged at the bottom of a port of the strip-shaped opening, the strip-shaped opening is transversely arranged on the annular surface of the cylinder, a three-blade plate is arranged in the port of one end of the cylinder, a round rod is rotatably arranged between the three-blade plate and the inner circular wall of the cylinder, a strip-shaped brush is spirally wound on the annular surface of the round rod, and one end of the round rod is arranged at one end of a shaft rod of a third motor.
Preferably, the cylinder is arranged on one side of the bottom in the rectangular groove, and the cylinder is positioned at the position of the sliding bottom of the sliding plate.
Preferably, the sliding plate is flush with the inner bottom of the strip-shaped opening on the cylinder, and the sliding plate is positioned at the bottoms of the strip-shaped steel sheets.
Preferably, the strip-shaped grooves are two in number and are arranged on the edge surfaces of two sides of the notch of the rectangular groove.
Preferably, the cross section of the polishing wheel is of an I-shaped structure, and the number of the polishing wheels is consistent with that of the strip-shaped steel sheets.
Preferably, the number of the first motors is two, and the two first motors are symmetrically arranged at the bottom of a U-shaped surface on one side of the U-shaped carrier.
Preferably, the port at one end of the cylinder is communicated with the outside of the U-shaped carrier through a discharge pipe, and a suction fan is arranged on one side of the discharge pipe.
Preferably, the air suction port of the suction fan is communicated with the inside of the rectangular groove, and the filter is installed at the air outlet port of the suction fan.
Preferably, the filter consists of a round tube and an activated carbon filter column, and the activated carbon filter column is arranged in the round tube.
Preferably, the first motor, the second motor and the third motor are electrically connected with the built-in control equipment of the laser cutting machine through conducting wires, and the first motor, the second motor and the third motor are motors of different models.
The invention has the beneficial effects that:
1. this kind of semiconductor precision cutting equipment reasonable in design drives through the operation of starting the second motor and grinds a plurality of wheel of polishing that connect and the contact of the bar steel sheet top surface and both sides that correspond simultaneously of polishing to be favorable to polishing away the cementated slag on the bar steel sheet, the inconvenient problem of clearance is solved in the follow-up use of being convenient for.
2. This kind of semiconductor precision cutting equipment compact structure drives the rotatory bar frame that will connect through the tractive piece and moves left or right under the effect of power through starting first motor operation to the long screw rod to can have slag cleaning structure reciprocating motion, reach the effect that can clear up the slag comprehensively fast.
3. This kind of semiconductor precision cutting equipment operation is stable, can arrange the slag charge that the clearance falls to the splendid attire structure that the export bottom was placed in, realizes concentrating fast and clearly arranges the function of slag charge, has improved the effect of centralized processing slag charge.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is a partial cross-sectional view of a strip frame of the present invention;
FIG. 3 is a schematic view of the connection between the landing plate and the cylinder of the present invention;
fig. 4 is a cross-sectional view of the cylindrical structure of the present invention.
In the figure: 1. u type carrier, 2, laser cutting head, 3, first motor, 4, filter, 5, suction fan, 6, calandria, 7, second motor, 8, bar frame, 9, bar steel sheet, 10, rectangle recess, 11, bar groove, 12, long screw, 13, the wheel of polishing, 14, pivot, 15, tractive piece, 16, screw, 17, landing plate, 18, drum, 19, trilobed plate, 20, round bar, 21, bar brush, 22, bar mouth, 23, third motor.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-4, a semiconductor precision cutting device comprises a U-shaped carrier 1, a driving mechanism, a slag scraping mechanism and a slag discharging mechanism, wherein a laser cutting head 2 is installed at the connection position of a moving mechanism on the inner top wall of the U-shaped carrier 1, a rectangular groove 10 is formed in the inner bottom wall of the U-shaped carrier 1, a plurality of strip-shaped steel sheets 9 are installed in the notch of the rectangular groove 10 at equal intervals, and the strip-shaped steel sheets 9 form a placing surface;
the traction mechanism comprises a long screw 12, the long screw 12 is rotatably installed in the corresponding strip-shaped groove 11, one end of the long screw 12 is installed at one end of the shaft rod of the corresponding first motor 3, the long screw 12 is in threaded connection with a corresponding traction block 15, the traction block 15 is slidably installed in the corresponding strip-shaped groove 11, and a screw hole 16 is formed in the traction block 15;
the slag scraping mechanism comprises a strip-shaped frame 8, two sides of a bottom port of the strip-shaped frame 8 are fixedly connected with the top end of a traction block 15 on the same side, a rotating shaft 14 is rotated in the strip-shaped frame 8, a plurality of polishing wheels 13 are equidistantly assembled on the rotating shaft 14, one end of the rotating shaft 14 is installed at one end of a shaft rod of a second motor 7, and the polishing wheels 13 are in rolling contact with the top surface and the two side wall surfaces of a corresponding strip-shaped steel sheet 9;
the slag discharging mechanism comprises a sliding plate 17, the sliding plate 17 is obliquely arranged at the bottom in the rectangular groove 10, one side of the sliding plate 17 is arranged at the bottom of a port of a strip-shaped opening 22, the strip-shaped opening 22 is transversely arranged on the annular surface of the cylinder 18, a three-blade plate 19 is arranged in the port of one end of the cylinder 18, a round rod 20 is rotatably arranged between the three-blade plate 19 and the inner circular wall of the cylinder 18, a strip-shaped brush 21 is spirally wound on the annular surface of the round rod 20, and one end of the round rod 20 is arranged at one end of a shaft rod of a third motor 23.
The cylinder 18 is arranged on one side of the bottom in the rectangular groove 10, and the cylinder 18 is positioned at the position where the sliding plate 17 slides down to the bottom, so that the installation position of the cylinder 18 is determined; the sliding plate 17 is flush with the bottom in the strip-shaped opening 22 on the cylinder 18, and the sliding plate 17 is positioned at the bottom of the strip-shaped steel sheets 9, so that the substances on the sliding plate 17 can enter the cylinder 18; the two strip-shaped grooves 11 are formed in the edge surfaces of the two sides of the notch of the rectangular groove 10, so that the two corresponding long screws 12 can be conveniently installed; the cross section of the polishing wheel 13 is of an I-shaped structure, the number of the polishing wheels 13 is the same as that of the strip-shaped steel sheets 9, and the polishing wheels 13 can be in contact with the top surfaces and two side surfaces of the strip-shaped steel sheets 9 through I-shaped structure pairs; the two first motors 3 are symmetrically arranged at the bottom of the U-shaped surface on one side of the U-shaped carrier 1, so that the connected long screw 12 can be driven to rotate conveniently; the port at one end of the cylinder 18 is communicated with the outside of the U-shaped carrier 1 through a discharge pipe 6, a suction fan 5 is arranged on one side of the discharge pipe 6 and is communicated with the outside of the U-shaped carrier 1 through the cylinder 18, and therefore slag and scraps can be discharged to the outside; an air suction port of the suction fan 5 is communicated with the interior of the rectangular groove 10, and an air outlet port of the suction fan 5 is provided with the filter 4, so that air in the rectangular groove 10 can be sucked out; the filter 4 consists of a circular tube and an active carbon filter column, and the active carbon filter column is arranged in the circular tube, so that the smoke generated during laser cutting can be adsorbed and filtered conveniently; the first motor 3, the second motor 7 and the third motor 23 are electrically connected with the built-in control equipment of the laser cutting machine through conducting wires, the first motor 3, the second motor 7 and the third motor 23 are motors of different models, and the effect of controlling the operation of the corresponding motors is achieved.
When the semiconductor material cutting device is used, firstly, a semiconductor material to be cut is horizontally placed on a plane formed by a plurality of strip-shaped steel sheets 9 with small intervals, and then the semiconductor material to be cut is cut by moving the laser cutting head 2 connected with the moving mechanism;
because slag generated by cutting the semiconductor material by laser can be adhered to the top surface of the strip-shaped steel sheet 9 on the placing platform, the second motor 8 is started to operate to drive the plurality of polishing wheels 13 connected by the rotation 14 to rotate simultaneously, and the polishing wheels 13 are contacted with the top surface and two sides of the corresponding strip-shaped steel sheet 9, so that the adhered slag on the strip-shaped steel sheet 9 can be polished, the subsequent use is convenient, and the problem of inconvenient cleaning is solved;
the first motor 3 is started to operate to drive the long screw 12 to rotate, and the strip-shaped frame 8 connected through the traction block 15 moves leftwards or rightwards under the action of force, so that the slag cleaning structure can move back and forth, and the effect of comprehensively and quickly cleaning slag is achieved;
the slag that drops during cutting or clearance falls on landing board 17 and in getting into drum 18, starts the round bar 20 that the third motor operation drove the spiral winding and install bar brush 21 simultaneously to can arrange the slag that clears up to export in the bottom placed splendid attire structure, realize concentrating fast and clear function of arranging the slag, improve the efficiency of centralized processing slag.
It is well within the skill of those in the art to implement and protect the present invention without undue experimentation and without undue experimentation that the present invention is directed to software and process improvements.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A semiconductor precision cutting equipment is characterized in that: the device comprises a U-shaped carrier (1), a traction mechanism, a slag scraping mechanism and a slag discharging mechanism, wherein a laser cutting head (2) is installed at the connection position of a moving mechanism of the inner top wall of the U-shaped carrier (1), a rectangular groove (10) is formed in the inner bottom wall of the U-shaped carrier (1), a plurality of strip-shaped steel sheets (9) are installed in the notch of the rectangular groove (10) at equal intervals, and the strip-shaped steel sheets (9) form a placing surface;
the traction mechanism comprises a long screw rod (12), the long screw rod (12) is rotatably installed in the corresponding strip-shaped groove (11), one end of the long screw rod (12) is installed at one end of a shaft rod of the corresponding first motor (3), the long screw rod (12) is in threaded connection with a corresponding traction block (15), the traction block (15) is slidably installed in the corresponding strip-shaped groove (11), and a screw hole (16) is formed in the traction block (15);
the slag scraping mechanism comprises a strip-shaped frame (8), two sides of a port at the bottom of the strip-shaped frame (8) are fixedly connected with the top end of a traction block (15) on the same side, a rotating shaft (14) rotates in the strip-shaped frame (8), a plurality of polishing wheels (13) are equidistantly assembled on the rotating shaft (14), one end of the rotating shaft (14) is installed at one end of a shaft rod of a second motor (7), and the polishing wheels (13) are attached to the surfaces of the top and two side walls of a corresponding strip-shaped steel sheet (9) in a rolling mode;
the slag discharging mechanism comprises a sliding plate (17), the sliding plate (17) is obliquely arranged at the bottom in a rectangular groove (10), one side of the sliding plate (17) is arranged at the bottom of a port of a bar-shaped opening (22), the bar-shaped opening (22) is transversely arranged on the annular surface of a cylinder (18), a three-blade plate (19) is arranged in the port of one end of the cylinder (18), a round rod (20) is rotatably arranged between the three-blade plate (19) and the inner circular wall of the cylinder (18), the annular surface of the round rod (20) is spirally wound and provided with a bar-shaped brush (21), and one end of the round rod (20) is arranged at one end of a shaft rod of a third motor (23).
2. The precision cutting apparatus for semiconductors according to claim 1, wherein: the cylinder (18) is arranged on one side of the bottom in the rectangular groove (10), and the cylinder (18) is positioned at the position of the sliding bottom of the sliding plate (17).
3. The precision cutting apparatus for semiconductors according to claim 1, wherein: the sliding plate (17) is flush with the bottom in the strip-shaped opening (22) on the cylinder (18), and the sliding plate (17) is positioned at the bottom of the strip-shaped steel sheets (9).
4. The precision cutting apparatus for semiconductors according to claim 1, wherein: the strip-shaped grooves (11) are arranged in two and two positions, wherein the strip-shaped grooves (11) are formed in the edge surfaces of two sides of the notch of the rectangular groove (10).
5. The precision cutting apparatus for semiconductors according to claim 1, wherein: the cross section of the polishing wheel (13) is of an I-shaped structure, and the number of the polishing wheels (13) is consistent with that of the strip steel sheets (9).
6. The precision cutting apparatus for semiconductors according to claim 1, wherein: the two first motors (3) are symmetrically arranged at the bottom of a U-shaped surface on one side of the U-shaped carrier (1).
7. The precision cutting apparatus for semiconductors according to claim 1, wherein: and the port at one end of the cylinder (18) is communicated with the outside of the U-shaped carrier (1) through a discharge pipe (6), and a suction fan (5) is arranged on one side of the discharge pipe (6).
8. The precision cutting apparatus for semiconductors according to claim 7, wherein: the air suction port of the suction fan (5) is communicated with the inside of the rectangular groove (10), and the filter (4) is installed at the air outlet port of the suction fan (5).
9. The precision cutting apparatus for semiconductors according to claim 8, wherein: the filter (4) consists of a circular tube and an active carbon filter column, and the active carbon filter column is arranged in the circular tube.
10. The precision cutting apparatus for semiconductors according to claim 1, wherein: the laser cutting machine is characterized in that the first motor (3), the second motor (7) and the third motor (23) are electrically connected with a built-in control device of the laser cutting machine through conducting wires, and the first motor (3), the second motor (7) and the third motor (23) are motors of different models.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911024989.9A CN110718458B (en) | 2019-10-25 | 2019-10-25 | Semiconductor precision cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911024989.9A CN110718458B (en) | 2019-10-25 | 2019-10-25 | Semiconductor precision cutting equipment |
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| Publication Number | Publication Date |
|---|---|
| CN110718458A true CN110718458A (en) | 2020-01-21 |
| CN110718458B CN110718458B (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911024989.9A Active CN110718458B (en) | 2019-10-25 | 2019-10-25 | Semiconductor precision cutting equipment |
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| Country | Link |
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| CN (1) | CN110718458B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113843528A (en) * | 2021-10-09 | 2021-12-28 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Convenient clear laser cutting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005028304A1 (en) * | 2004-06-21 | 2005-12-29 | Raimund Rerucha | Machine tool particle emission limiter has cylindrical conduit with spring-operated closure operating in response to high pressure |
| CN209081729U (en) * | 2018-09-01 | 2019-07-09 | 江苏宇天港玻新材料有限公司 | It is a kind of can it is convenient cleaning disintegrating slag glass cutting device |
| CN209407669U (en) * | 2019-01-12 | 2019-09-20 | 东莞市银班匠装饰设计工程有限公司 | A kind of cleaning waste slag device of laser cutting machine |
-
2019
- 2019-10-25 CN CN201911024989.9A patent/CN110718458B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005028304A1 (en) * | 2004-06-21 | 2005-12-29 | Raimund Rerucha | Machine tool particle emission limiter has cylindrical conduit with spring-operated closure operating in response to high pressure |
| CN209081729U (en) * | 2018-09-01 | 2019-07-09 | 江苏宇天港玻新材料有限公司 | It is a kind of can it is convenient cleaning disintegrating slag glass cutting device |
| CN209407669U (en) * | 2019-01-12 | 2019-09-20 | 东莞市银班匠装饰设计工程有限公司 | A kind of cleaning waste slag device of laser cutting machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113843528A (en) * | 2021-10-09 | 2021-12-28 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Convenient clear laser cutting equipment |
| CN113843528B (en) * | 2021-10-09 | 2023-10-27 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Laser cutting equipment convenient to clean |
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| CN110718458B (en) | 2022-02-18 |
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