CN110680390A - Ultrasonic transducer and preparation method thereof - Google Patents
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- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
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Abstract
The application relates to an ultrasonic transducer and a manufacturing method thereof, belonging to the technical field of transducers, wherein the ultrasonic transducer comprises a backing, an active element layer, a matching layer and a lens layer which are sequentially stacked; the matching layer comprises n layers, the impedance values of different matching layers are different, the impedance values of the matching layers are reduced layer by layer, and the impedance value of the active element layer is larger than the impedance value of each matching layer; n is an integer greater than 1: the problem that the design mode of a matching layer is not disclosed in the existing ultrasonic transducer design scheme can be solved; a design scheme of a matching layer is provided, and when an ultrasonic wave generated by an active element layer is transmitted to an object to be detected through the matching layer having a small acoustic impedance change, the sensitivity and bandwidth of an ultrasonic transducer are increased.
Description
Technical Field
The application relates to an ultrasonic transducer and a preparation method thereof, belonging to the technical field of transducers.
Background
After the ultrasonic wave emitted by the ultrasonic transducer enters the human tissue, a reflected echo is formed at the boundary of different acoustic characteristic impedances of the human body, so that the internal tissue and organ of the human body can be imaged, which is the principle applied by the medical ultrasonic transducer.
The application number of 201320296526.X discloses a phased array transducer, which comprises a sound absorption material layer, a piezoelectric element layer, a matching layer and a sound head mirror which are sequentially stacked, wherein a shell is arranged outside the sound head mirror, the piezoelectric element layer is made of piezoelectric single crystal materials, and the matching layer is formed by compounding three layers; and a substrate layer is arranged between the sound absorption material layer and the piezoelectric element layer.
However, the above phased array transducer does not disclose the setting of the acoustic impedance of the matching layer, and the matching layers with different acoustic impedances have different capabilities of matching the acoustic impedance difference between the piezoelectric material and the tissue to be measured, so that a design scheme of the matching layer needs to be provided to better match the acoustic impedance difference between the piezoelectric material and the tissue to be measured.
Disclosure of Invention
The application provides an ultrasonic transducer and a preparation method of the ultrasonic transducer, which can solve the problem that the design mode of a matching layer is not disclosed in the existing ultrasonic transducer design scheme. The application provides the following technical scheme:
in a first aspect, an ultrasonic transducer is provided, including a backing, an active element layer, a matching layer, and a lens layer, which are sequentially stacked;
the matching layers comprise n layers, the impedance values of different matching layers are different, the impedance values of the matching layers are reduced layer by layer, and the impedance value of the active element layer is larger than the impedance value of each matching layer; and n is an integer greater than 1.
Optionally, the ultrasound transducer is formed by bonding the active element layer to the backing and m matching layers; and cutting the bonded layer material, bonding the cut layer material with an n-m matching layer, and filling gaps to obtain the product, wherein m is a natural number smaller than n.
Optionally, the value of n is 3, and the impedance value of the 3-layer matching layer satisfies the following formula:
wherein Z ism1Is the impedance value of the first matching layer; zm2The impedance value of the second layer matching layer; zm3The impedance value of the third matching layer; zpIs the resistance value of the active element layer; zLIs the impedance value of the load.
Optionally, the impedance value of the active element layer is lower than a first threshold.
Optionally, the active element layer has an impedance value of 20 mrayl; the n is 3, the impedance value of the first matching layer is 9.56 Mrayls, the impedance value of the second matching layer is 4.7 Mrayls, and the impedance value of the third matching layer is 2.16 Mrayls.
Optionally, the backing is a sound absorbing material with an acoustic impedance below a second threshold.
Optionally, the sound absorbing material comprises epoxy resin, glass beads and tungsten powder.
Optionally, the backing has an acoustic impedance of 2.5 mrayls.
In a second aspect, a method for manufacturing an ultrasonic transducer is provided, for manufacturing the ultrasonic transducer provided in the first aspect, the method including:
obtaining the material of the backing and the matching layer;
bonding the active element layer to the backing and an m-layer matching layer, m being a natural number less than n;
cutting the bonded layer material by using a cutting machine, bonding the cut layer material with the n-m matching layers, and filling gaps;
and adhering the lens layer to the joint-filled layer material to obtain the ultrasonic transducer.
Optionally, the value of m is determined according to the exposure amount of the cutter blade.
The beneficial effect of this application lies in: the ultrasonic transducer comprises a backing, an active element layer, a matching layer and a lens layer which are sequentially stacked; the matching layer comprises n layers, the impedance values of different matching layers are different, the impedance values of the matching layers are reduced layer by layer, and the impedance value of the active element layer is larger than the impedance value of each matching layer; the problem that the design mode of a matching layer is not disclosed in the existing ultrasonic transducer design scheme can be solved; a design scheme of a matching layer is provided, and when an ultrasonic wave generated by an active element layer is transmitted to an object to be detected through the matching layer having a small acoustic impedance change, the sensitivity and bandwidth of an ultrasonic transducer are increased.
In addition, the active element layer is bonded with the back lining and the m-layer matching layer by selecting the cutting depth according to the actual situation; the bonded layer material is cut, bonded with the n-m matching layers and joint filled to obtain the ultrasonic transducer, and the flexibility of a cutting mode in the manufacturing process of the ultrasonic transducer can be improved.
The foregoing description is only an overview of the technical solutions of the present application, and in order to make the technical solutions of the present application more clear and clear, and to implement the technical solutions according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present application and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of an ultrasonic transducer provided in an embodiment of the present application;
fig. 2 is a flowchart of a method for manufacturing an ultrasonic transducer according to an embodiment of the present application.
Detailed Description
The following detailed description of embodiments of the present application will be described in conjunction with the accompanying drawings and examples. The following examples are intended to illustrate the present application but are not intended to limit the scope of the present application.
Fig. 1 is a schematic structural diagram of an ultrasound transducer provided in an embodiment of the present application, and as shown in fig. 1, the ultrasound transducer includes at least: a backing 1, an active element layer 2, a matching layer 3, and a lens layer 4 are laminated in this order.
The backing 1 serves to absorb acoustic waves transmitted in the direction of the back of the ultrasonic transducer or reflected waves of acoustic/echo waves of the active element layer 2, in order to prevent interference with the result.
In ultrasound imaging, echo signals from the front are useful, and signals from the back direction are interference waves that need to be cancelled. Therefore, the backing 1 needs to be designed as an acoustic absorbing medium so that the acoustic energy radiated backward is almost completely consumed. The backing 1 is selected according to the specifications of the ultrasonic transducer, and the acoustic impedance and the acoustic absorption performance of the backing directly influence the technical specifications of the ultrasonic transducer, such as frequency bandwidth, sensitivity and the like.
Optionally, in this embodiment, the backing 1 is a sound absorbing material with an acoustic impedance below a second threshold. In this way, it is ensured that the backing 1 has a low acoustic impedance and thus a high sound absorption capacity with a low sound attenuation. The sound absorption material comprises epoxy resin, glass beads and tungsten powder, and can also comprise other components which are obtained by proportioning according to a preset proportion. Such as: the acoustic impedance of the backing is 2.5 megarayls (Mrayl), corresponding to an acoustic attenuation of 14.6 decibels (dB) per millimeter at a frequency of 3MHz of the acoustic signal.
The second threshold is determined according to a sound absorption index of the ultrasonic transducer, and the second threshold may be 3Mrayl, 2.8Mrayl, or the like, and a value of the second threshold is not limited in this embodiment.
The active element layer 2 is an ultrasonic transducer core component, and the functions of the active element layer at least comprise the following functions: 1. obtaining large spatial gain or improving spatial resolution; 2. increase the emitted acoustic power, frequency band, or improve transient characteristics; 3. the signal to noise ratio is improved; 4. realizing multi-beam, beam scanning, variable focal length or dynamic focusing, adaptive beam forming and the like, namely forming the required directivity.
The impedance value of the active element layer 2 is lower than the first threshold value. The value of the first threshold is set according to the index of the ultrasonic transducer, the first threshold may be 25Mrayl, 28Mrayl, etc., and the value of the first threshold is not limited in this embodiment. The value of the first threshold is such that the impedance value of the active element layer 2 is low. Schematically, the impedance value of the active element layer is 20 Mrayl.
Optionally, the active element layer 2 is a piezoelectric composite. The piezoelectric composite material has the characteristics of low characteristic impedance, large electromechanical coupling coefficient and the like. Illustratively, piezoelectric composites include, but are not limited to: 2-2 type, 1-3 type and so on. Of course, the active element layer 2 may be a single crystal material, a single crystal composite material, or a piezoelectric thin film material, and the present embodiment does not limit the type of the material of the active element layer 2.
The matching layer 3 is used to match the difference in acoustic resistance between the active element layer 2 and the material to be measured. In the application, the matching layer 3 comprises n layers, the impedance values of different matching layers are different, the impedance values of the matching layers are reduced layer by layer, and the impedance value of the active element layer 2 is larger than the impedance value of each matching layer; n is an integer greater than 1. In fig. 1, the value of n is taken as 3 for illustration, and in actual implementation, the value of n may be larger or smaller, which is not limited in this embodiment.
The impedance of each matching layer 3 is designed based on the quarter-wave impedance matching principle.
The first matching layer is a matching layer close to the active element layer 2, and the nth matching layer is a matching layer close to the lens layer 4 (i.e., a matching layer far from the active element layer 2).
Illustratively, n has a value of 3, and the impedance value of the 3-layer matching layer satisfies the following equation:
wherein Z ism1Is the impedance value of the first matching layer; zm2The impedance value of the second layer matching layer; zm3The impedance value of the third matching layer; zpIs the resistance value of the active element layer; zLIs the impedance value of the load.
Such as: the first matching layer is made of a first material having a first impedance value (e.g., 9.56Mrayl), and the first matching layer makes a transition between the impedance value of the active element layer 2 and the impedance value of the second matching layer; the second matching layer is made of a second material with a second impedance value (such as 4.7Mrayl), and the transition between the impedance value of the first matching layer and the impedance value of the third matching layer is realized; the third matching layer is made of a third material having a third impedance value, e.g. 2.16Mrayl, which provides a transition between the impedance value of the second matching layer and the impedance value of the lens layer.
The lens layer 4 is used to focus the sound field.
Alternatively, in the present application, the ultrasonic transducer is formed by bonding the active element layer 2 to the backing 1 and the m-layer matching layer 3; cutting the bonded layer material, bonding with the n-m matching layer 3, and filling the gaps to obtain the product, wherein m is a natural number less than n.
Optionally, the value of m is determined according to the exposure of the cutter blade. The value of m is in positive correlation with the exposure leakage. According to the difference of the exposure amount, m can take the values of 0, 1, 2 and the like.
Alternatively, the ultrasonic transducers in the present application include, but are not limited to, the following planar transducers: linear array transducers, phased array transducers, single element transducers, and the like.
In summary, the ultrasound transducer provided by the present application includes a backing, an active element layer, a matching layer, and a lens layer, which are sequentially stacked; the matching layer comprises n layers, the impedance values of different matching layers are different, the impedance values of the matching layers are reduced layer by layer, and the impedance value of the active element layer is larger than the impedance value of each matching layer; the problem that the design mode of a matching layer is not disclosed in the existing ultrasonic transducer design scheme can be solved; a design scheme of a matching layer is provided, and when an ultrasonic wave generated by an active element layer is transmitted to an object to be detected through the matching layer having a small acoustic impedance change, the sensitivity and bandwidth of an ultrasonic transducer are increased.
In addition, the active element layer is bonded with the back lining and the m-layer matching layer by selecting the cutting depth according to the actual situation; the bonded layer material is cut, bonded with the n-m matching layers and joint filled to obtain the ultrasonic transducer, and the flexibility of a cutting mode in the manufacturing process of the ultrasonic transducer can be improved.
Fig. 2 is a flowchart of a method for manufacturing an ultrasonic transducer according to an embodiment of the present application, and this embodiment illustrates an example in which the method is used for manufacturing the ultrasonic transducer. The method at least comprises the following steps:
Optionally, the value of m is determined according to the exposure of the cutter blade.
And step 203, cutting the bonded layer material by using a cutting machine, bonding the cut layer material with the n-m matching layers, and filling the gaps.
Such as: when the exposure amount of a blade of the cutting machine is larger than or equal to the thickness of the active element layer and the back lining after being superposed and is smaller than the superposed thickness of the active element layer, the back lining and the first matching layer, the active element layer and the back lining are bonded, and then the bonded layer materials are cut by using the cutting machine; and then, sequentially adhering the cut layer material and the n matching layers and filling the gaps.
For another example: when the exposure amount of a cutter blade is larger than or equal to the thickness of the active element layer, the backing and the first matching layer after being superposed and is smaller than the superposed thickness of the active element layer, the backing, the first matching layer and the second matching layer, the active element layer, the backing and the first matching layer are bonded, and then a cutter is used for cutting the bonded layer materials; and then, sequentially adhering the cut layer material and the n-1 matching layer and filling the gaps.
For another example: when the exposure amount of a blade of the cutting machine is larger than or equal to the thickness of the active element layer, the backing, the first matching layer and the second matching layer after being superposed and is smaller than the superposed thickness of the active element layer, the backing, the first matching layer, the second matching layer and the third matching layer, the active element layer is bonded with the backing, the first matching layer and the second matching layer, and then a cutting machine is used for cutting the bonded layer materials; and then, sequentially adhering the cut layer material and the n-2 matching layers and filling the gaps.
And step 204, bonding the lens layer to the joint-filled layer material to obtain the ultrasonic transducer.
In summary, in the method for manufacturing an ultrasonic transducer provided by this embodiment, the materials of the backing and the matching layer are obtained; bonding the active element layer with the backing and the m matching layers, wherein m is a natural number less than n; cutting the bonded layer material by using a cutting machine, bonding the cut layer material with the n-m matching layers, and filling gaps; bonding the lens layer to the joint-filled layer material to obtain the ultrasonic transducer; the problem that when the active element layer, the back lining and the m-layer matching layer are sequentially bonded and cut, complete cutting cannot be performed due to limited exposure of a cutting knife can be solved; because the value of m can be adjusted as required in the manufacturing process of the ultrasonic transducer, only partial layered materials can be cut under the condition that the exposure of the cutting knife is limited, the problem of incomplete cutting can be avoided, and the cutting flexibility is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An ultrasonic transducer comprising a backing, an active element layer, a matching layer and a lens layer laminated in this order;
the matching layers comprise n layers, the impedance values of different matching layers are different, the impedance values of the matching layers are reduced layer by layer, and the impedance value of the active element layer is larger than the impedance value of each matching layer; and n is an integer greater than 1.
2. The ultrasonic transducer of claim 1, wherein the ultrasonic transducer is fabricated by bonding the active element layer to the backing and m-layer matching layer; and cutting the bonded layer material, bonding the cut layer material with an n-m matching layer, and filling gaps to obtain the product, wherein m is a natural number smaller than n.
3. The ultrasonic transducer of claim 1, wherein the value of n is 3, and the impedance value of the 3-layer matching layer satisfies the following equation:
wherein Z ism1Is the impedance value of the first matching layer; zm2The impedance value of the second layer matching layer; zm3The impedance value of the third matching layer; zpIs the resistance value of the active element layer; zLIs the impedance value of the load.
4. The ultrasonic transducer of claim 1, wherein the impedance value of the active element layer is below a first threshold.
5. The ultrasonic transducer of claim 4, wherein the impedance value of the active element layer is 20 mrayl; the n is 3, the impedance value of the first matching layer is 9.56 Mrayls, the impedance value of the second matching layer is 4.7 Mrayls, and the impedance value of the third matching layer is 2.16 Mrayls.
6. The ultrasonic transducer of any one of claims 1 to 5, wherein the backing is a sound absorbing material having an acoustic impedance below a second threshold.
7. The ultrasonic transducer of claim 6, wherein the sound absorbing material comprises epoxy, glass beads, and tungsten powder.
8. The ultrasonic transducer of claim 6, wherein the backing has an acoustic impedance of 2.5 mrayls.
9. A method for manufacturing an ultrasonic transducer, the method being used for manufacturing the ultrasonic transducer according to any one of claims 1 to 8, the method comprising:
obtaining the material of the backing and the matching layer;
bonding the active element layer to the backing and an m-layer matching layer, m being a natural number less than n;
cutting the bonded layer material by using a cutting machine, bonding the cut layer material with the n-m matching layers, and filling gaps;
and adhering the lens layer to the joint-filled layer material to obtain the ultrasonic transducer.
10. The method of claim 9 wherein the value of m is determined based on the exposure of the cutter blades.
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| CN201911020505.3A CN110680390A (en) | 2019-10-25 | 2019-10-25 | Ultrasonic transducer and preparation method thereof |
| PCT/CN2020/123477 WO2021078291A1 (en) | 2019-10-25 | 2020-10-24 | Ultrasonic transducer and method for manufacturing ultrasonic transducer |
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| CN201911020505.3A CN110680390A (en) | 2019-10-25 | 2019-10-25 | Ultrasonic transducer and preparation method thereof |
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Cited By (3)
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| CN111687025A (en) * | 2020-06-17 | 2020-09-22 | 飞依诺科技(苏州)有限公司 | Double-backing ultrasonic transducer and preparation method thereof |
| CN112168201A (en) * | 2020-09-22 | 2021-01-05 | 飞依诺科技(苏州)有限公司 | Preparation method of matching layer, matching layer and ultrasonic probe |
| WO2021078291A1 (en) * | 2019-10-25 | 2021-04-29 | 飞依诺科技(苏州)有限公司 | Ultrasonic transducer and method for manufacturing ultrasonic transducer |
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