CN110676364A - Four-side light-emitting blue light waveguide surface light-emitting structure - Google Patents
Four-side light-emitting blue light waveguide surface light-emitting structure Download PDFInfo
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Abstract
The invention relates to a four-side light-emitting blue light waveguide surface light-emitting structure which comprises a substrate, a plurality of LED light sources in a four-side light-emitting packaging mode, a high-refractive-index blue light waveguide layer, a diffusion film layer and a fluorescent powder layer, wherein the substrate is provided with the plurality of LED light sources in the four-side light-emitting packaging mode, the substrate is also provided with the high-refractive-index blue light waveguide layer covering the LED light sources in the four-side light-emitting packaging mode, the height of the high-refractive-index blue light waveguide layer is higher than that of the LED light sources in the four-side light-emitting packaging mode, and the diffusion film. The invention has the advantages that: the four-side light-emitting blue light waveguide surface light-emitting structure can reduce the attenuation of light in the medium transmission process, improve the light mixing effect and ensure the uniform light-emitting brightness.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a four-side light-emitting blue light waveguide surface light-emitting structure.
Background
In recent years, in surface light sources used in the backlight display and lighting industry, surface light emitting modules (HLU) are classified into direct type and side type. The lateral entrance type light source device has the advantages that the overall thickness of the lateral entrance type scheme is small, the number of light sources is small, the lateral entrance type structure is adopted by the current most number of surface light sources, the lateral entrance type structure needs a light guide plate, the cost is high, the light conversion efficiency is lower than that of a direct type, regional extinction (Local Dimming) cannot be realized in the display field, High Dynamic Range (HDR) cannot be realized, and the HDR is generally 3000: 1, the application is greatly limited.
In the direct type surface light source, the LED array is arranged at the bottom of the surface light emitting module, light emitted from the LED is reflected through the bottom surface and the side surface, and then is uniformly emitted through the diffusion plate on the surface and the optical module. The direct type surface light source has simple process, reduces light guide plates, has high light conversion efficiency and low cost, and occupies certain middle and low end markets in the fields of illumination and display; at this stage, in order to obtain a more colorful display effect, a High Dynamic Range (HDR), which is a ratio of luminance differences actually existing (i.e., a ratio of brightest object luminance to darkest object luminance), is required, and since the HDR can reach 20000: 1, therefore, the area light source application in the backlight display and illumination industry is gradually gaining attention.
At present, the straight following formula face light-emitting module of tradition mainly has 3 kinds of modes:
(1) the LED light source array is characterized in that a light source array composed of conventional LED light sources is adopted, a diffusion plate is arranged above the LED light source array at a certain distance, and a point light source is changed into a surface light source by the diffusion plate;
(2) the LED lamp comprises a light source array consisting of conventional LED light sources, wherein lenses are closely mounted on the LED light sources, so that light emitted by LED lamp beads is transmitted through an air layer between the lenses and a diffusion plate after passing through the lenses, and the light is superposed to a certain extent and then irradiated onto the diffusion plate, and then the point light sources are changed into surface light sources;
(3) the LED light source is characterized in that an LED chip array is adopted, and the surface of the LED chip array is directly coated with silica gel and fluorescent powder to form a light guide medium layer, so that a point light source is changed to a surface light source.
The above methods all have certain disadvantages or limitations:
(1) for the first approach: as shown in fig. 1 and 2, the light-emitting angle of the conventional LED light source reaches about 120 ° at most, a large distance must be provided between the LED light source 91 and the diffusion plate 92 to achieve a uniform light-mixing effect, and the whole surface light-emitting module is usually very thick and can only be applied to the lighting industry, such as a panel lamp, and the application is very limited.
(2) For the second approach: as shown in fig. 3 and 4, the light-emitting angle of the LED light source 91 after the lens 3 is stacked can reach 135 °, although the light-emitting angle is increased, and the top light-emitting angle is greatly reduced, the uniform light-mixing effect can be achieved within a relatively shorter distance.
(3) For the third way, as shown in fig. 6, a phosphor layer 94 is coated on the surface of a light source array composed of a plurality of LED chips 91', which slightly increases the lateral propagation and light mixing of white light; however, from optical theory, it can be found that when blue light is transmitted in a waveguide containing a phosphor, the intensity of the blue light as excitation light is rapidly reduced due to absorption and irregular scattering of the phosphor. As shown in fig. 7, taking a point light source as an example, when the light intensity is transmitted in a waveguide containing phosphor, the intensity is inversely proportional to the cube of the distance in terms of value; as shown in fig. 8, the intensity of a linear light source is inversely proportional to the square of the distance in value when the light intensity is transmitted in a waveguide containing phosphor; as shown in fig. 9, in the surface light source, when the light intensity is transmitted in the waveguide containing the phosphor, the intensity is inversely proportional to the distance in terms of value.
In summary, in the area light source adopting the first and second modes, due to the limitation of the light emitting angle of the LED light source, not only a dark area is easily formed and the uniformity of mixed light is poor, but also the entire direct-type area light emitting module is thicker, and if the thickness of the entire light emitting module is to be reduced, the reduction can be achieved only by reducing the distance between adjacent LED light sources (see fig. 5), but the required LED light sources are multiplied, and the cost is greatly increased.
By adopting the area light source of the third mode, although the problem of the thickness of the module is solved, the blue light which is obtained by mixing the blue light excitation fluorescent powder is seriously attenuated in the transmission process of the light guide medium, and the blue light which excites the fluorescent powder is attenuated, so that the intensity of the blue light is reduced, and the transverse transmission intensity along the waveguide direction is reduced; the brightness of the chip is uneven, the light mixing effect is poor, and the brightness of the whole surface in the surface light source is not even.
Disclosure of Invention
The invention aims to provide a four-side light-emitting blue light waveguide surface light-emitting structure which can reduce the thickness of a direct type surface light-emitting module, has uniform brightness and good light mixing effect.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a four sides light-emitting blue light waveguide face light emitting structure which characterized in that: the LED light source comprises a substrate, an LED light source in a four-side light emitting packaging mode and a high-refractive-index blue light waveguide layer;
the LED light source is a chip with a reflecting layer on the top surface to form four-side light emitting, and the substrate is provided with a high-refractive-index blue light waveguide layer which covers all the LED light sources, wherein the height of the high-refractive-index blue light waveguide layer is equal to or higher than that of the top surface of the LED light source;
the blue light waveguide layer with high refractive index simultaneously meets the following conditions:
(1) the high-refractive-index blue light waveguide layer is a single medium and is a medium layer which is uniformly distributed;
(2) defining one surface of the high-refractive-index blue light waveguide layer far from the substrate as an upper waveguide interface, and defining one medium at two sides of the upper waveguide interface far from the substrate as an external medium layer, wherein the refractive index of the high-refractive-index blue light waveguide layer is recorded as n2The refractive index of the external medium layer is denoted n3，n2＞n3；
(3) And the other surface of the high-refractive-index blue light waveguide layer close to the substrate is defined as a lower waveguide interface, and a waveguide reflection layer is arranged between the lower waveguide interface and the substrate.
Furthermore, a diffusion film layer and a fluorescent powder layer are sequentially arranged above an upper waveguide interface of the high-refractive-index blue light waveguide layer from bottom to top, an air layer or an air gap exists between the diffusion film layer and the high-refractive-index blue light waveguide layer, and the air layer or the air gap serves as an outer medium layer.
Further, when an air gap exists between the diffusion film and the high-refractive-index blue light waveguide layer, the lower surface of the diffusion film layer is provided with an uneven microstructure, and the microstructure accounts for 10-100% of the total area of the diffusion film layer; the microstructure on the lower surface of the diffusion film layer is tightly attached to the waveguide interface on the blue light waveguide layer with high refractive index to form an air gap.
Furthermore, an upper diffusion film layer is also arranged on the fluorescent powder layer.
Further, the LED light source in the four-side light emitting package form comprises an LED chip body and a reflecting layer covering the top surface of the LED chip body.
Furthermore, the LED light source in the four-side light emitting packaging mode comprises an LED chip body, transparent layers are arranged on the top surface and the side surfaces of the LED chip body, and a reflecting layer is arranged on the top surface of each transparent layer.
Further, the thickness of the transparent layer side is denoted as a, the height of the transparent layer is denoted as h, and the refractive index of the transparent layer is denoted as n1The refractive index of the high-refractive-index blue light waveguide layer is denoted as n2The refractive index of the external medium layer is n3To achieve total reflection of light, it is necessary to satisfy
Furthermore, the LED light source in the four-side light emitting packaging mode comprises an LED chip body, a transparent layer is arranged on the top surface of the LED chip body, and a reflecting layer is arranged on the top surface of the transparent layer.
Furthermore, a middle reflecting layer is arranged between the top surface of the LED chip body and the transparent layer, and the middle reflecting layer is a total reflecting layer or a partial reflecting layer.
Further, the medium refractive index of the transparent layer is higher than or equal to the refractive index of the high-refractive-index blue light waveguide layer.
Furthermore, a microstructure optical scattering layer is arranged on the upper surface of the substrate or the lower surface of the high-refractive-index blue light waveguide layer, or a microstructure optical scattering layer is arranged on the upper surface of the high-refractive-index blue light waveguide layer.
Furthermore, the high-refractive-index blue light waveguide layer is manufactured by adopting a mode of mould pressing, dispensing, spraying or material growth.
Further, the phosphor layer is formed on the diffusion film layer by coating, molding or growing and is integrated with the diffusion film layer, or is a separate sheet-shaped phosphor layer, or is a phosphor layer formed by using a transparent film as a supporting substrate.
The invention has the advantages that:
compared with the traditional side-in light guide technology, the LED light source is in a four-side light emitting packaging mode, and meanwhile, the LED light sources are uniformly distributed in the high-refractive-index blue light guide layer in an array mode, so that the light distribution is more uniform;
because the LED light sources are directly arranged in the blue light waveguide layer with high refractive index, each LED light source emits light in the blue light waveguide layer with high refractive index to form light transmission and coupling, the traditional side-entry light guide technology is that light enters from two sides of the light guide plate and then transversely propagates, and the light sources are completely separated from the light guide plate;
from the application point of view, for example, in the process of manufacturing a lamp, the traditional lateral type light source needs to be additionally attached to the side face of the light guide plate, and a light source manufacturer is separated from a lamp manufacturer; by adopting the structure of the invention, the mounting and combination of the light guide layer and the light source can be directly completed in the production process, and a lamp manufacturer does not need secondary mounting, thereby greatly simplifying the production process of the lamp.
The chip can realize local light emitting and local extinction smoothly by carrying out independent control on external electrical connection compared with a side-in type light guide technology, and display with a High Dynamic Range (HDR) is achieved.
In addition, a diffusion film layer is arranged above the high-refractive-index blue light waveguide layer, a gap is formed on a microstructure on the surface of the diffusion film layer, namely an air gap occupying most of the area of the diffusion film layer is used as a low-refractive-index layer, or an air layer is directly formed between the diffusion film layer and the high-refractive-index blue light waveguide layer, and a fluorescent powder layer is arranged above the diffusion film layer. Blue light that the LED light source sent forms the waveguide in the blue light wave guide layer of high refractive index, blue light waveguide through the high refractive index, reduce refraction and scattering of phosphor powder granule in the conventional structure to light, simultaneously in single medium, can greatly reduce the decay of blue light, the waveguide effect of light simultaneously, can be so that the pointolite changes to the area source, the lateral propagation of blue light has been increased, can obtain even light distribution in the low refractive index layer simultaneously, form the white light-emitting of final process fluorescence excitation formation behind the area source.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a test chart of the light-emitting angle of a conventional LED light source.
Fig. 2 is a schematic diagram of a light intensity superposition in a first manner of a conventional direct-type surface light-emitting module.
Fig. 3 is a test chart of the light-emitting angle of the conventional LED light source with a lens added.
Fig. 4 is a schematic diagram of light intensity superposition in a conventional direct-type surface light-emitting module by using an LED light source and a lens.
Fig. 5 is another schematic diagram of the light intensity superposition of a conventional direct-type surface light-emitting module using a manner of closely arranging LED light sources and lenses.
Fig. 6 is a schematic diagram of a conventional direct type surface light emitting module using an LED light source array and phosphor powder.
FIG. 7 is a graph showing the loss of light intensity from a point source with a phosphor-containing waveguide.
FIG. 8 is a graph showing the loss of light intensity from a linear light source with a phosphor-containing waveguide.
Fig. 9 is a graph showing the loss of light intensity from a surface light source by a waveguide containing phosphor.
Fig. 10 is a schematic diagram of a first embodiment of a four-out-light blue-light waveguide surface light emitting structure according to the present invention.
Fig. 11 is a schematic structural diagram of an LED light source according to a first embodiment of the invention.
Fig. 12 is a schematic diagram of a second embodiment of the four-out-side blue light waveguide surface light emitting structure of the present invention.
Fig. 13 is a schematic view of an LED light source according to a second embodiment of the invention.
Fig. 14 is a test chart of the light-emitting angle of the LED light source according to the second embodiment of the invention.
Fig. 15 to 17 are schematic views of another three structures of an LED light source according to a second embodiment of the invention.
Fig. 18 is a partial view of fig. 12.
Fig. 19 is a schematic diagram of a third embodiment of the four-out-side blue light waveguide surface light emitting structure of the present invention.
Detailed Description
The following examples are presented to enable one of ordinary skill in the art to more fully understand the present invention and are not intended to limit the scope of the embodiments described herein.
Example 1
The four-side light-emitting blue light waveguide surface light emitting structure of the present embodiment, as shown in fig. 10, includes a substrate 1, an LED light source 2 in a four-side light-emitting package form, a high refractive index blue light waveguide layer 3, a diffusion film layer 4, and a phosphor layer 5.
The LED light source 2 in a four-side light emitting packaging mode is arranged on the substrate 1, the LED light source 2 is a blue light chip with a reflecting layer forming four-side light emitting for the top surface, a high-refractive-index blue light waveguide layer 3 covering all the LED light sources 2 is arranged on the substrate 1, the height of the high-refractive-index blue light waveguide layer 3 is equal to or higher than the height of the top surface of the LED light sources 2, and a diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the high-refractive-index blue light waveguide layer 3 from bottom to. An upper diffusion film layer 6 is also provided on the phosphor layer 5. Of course, the blue light chip may be a violet light chip, and the violet light is used to excite the phosphor in the phosphor layer 5 to form white light.
The high-refractive-index blue light waveguide layer 3 is a transparent layer which is a single medium without fluorescent powder and is uniformly distributed in the medium, and one surface, far away from the substrate 1, of the high-refractive-index blue light waveguide layer 3 is defined as an upper waveguide interface, in the embodiment, the upper waveguide interface is the upper surface of the high-refractive-index blue light waveguide layer 3; the medium on one side of the two sides of the upper waveguide interface far away from the substrate is an external medium layer, namely the medium above the upper surface of the high-refractive-index blue light waveguide layer 3 is the external medium layer;
the refractive index of the high refractive index blue waveguide layer is denoted as n2The refractive index of the external medium layer is denoted n3，n2＞n3；
In this embodiment, the lower surface of the diffusion film layer 4 has an uneven microstructure, the microstructure accounts for 10-100% of the total area of the diffusion film layer 4, and the uneven surface is formed by coating organic matter diffusion particles and an adhesive on the diffusion film layer 4, or the surface of the diffusion film layer 4 is changed into an irregular surface structure by rolling or the like. The cavities are formed by the minute gaps of these rugged or irregular surfaces. When the microstructure on the lower surface of the diffusion film layer 4 is attached to the upper surface of the waveguide interface on the blue light waveguide layer 3 with high refractive index, an air gap is formed, and the air gap is used as an external medium layer.
In addition, the other surface of the high-refractive-index blue light waveguide layer 3 close to the substrate 1 is defined as a lower waveguide interface, which is the lower surface of the high-refractive-index blue light waveguide layer 3 in this embodiment; a waveguide reflective layer 7 is provided between the lower waveguide interface and the substrate 1.
In this embodiment, as shown in fig. 11, the LED light source 2 in the four-side light-emitting package form includes an LED chip body 21 and a reflective layer 22 covering the top surface of the chip body 21, and the area of the reflective layer 22 is equal to the area of the top surface of the LED chip body 21. The reflective layer 22 may employ a DBR distributed bragg mirror or a metal reflective layer.
In order to improve the condition of uneven light intensity and improve the light mixing effect, a microstructure optical scattering layer can be arranged on the upper surface of the substrate 1 or the lower surface of the high-refractive-index blue light waveguide layer 3 according to the condition, or the microstructure optical scattering layer is arranged on the upper surface of the high-refractive-index blue light waveguide layer 3. The microstructured optical scattering layer is typically arranged as a dark area of the LED light sources 2 in an array.
The high-refractive-index blue light waveguide layer 3 is manufactured by adopting a mode of mould pressing, glue dispensing, spraying or material growth. In this embodiment, the material is a transparent high refractive index material such as silica gel, acrylic material, PC, PS, and the like.
The phosphor layer 5 is formed on the diffusion film layer 4 by coating, molding or growing and integrated with the diffusion film, or is a separate sheet-shaped phosphor layer, or a phosphor layer formed by using a specific transparent film as a supporting substrate.
In the invention, the blue light waveguide layer 3 with high refractive index does not contain fluorescent powder, the white light emitted by the backlight module is formed by mixing the blue light excitation fluorescent powder layer emitted by the blue light chip, and the white light is formed by the fluorescent powder in the blue light excitation fluorescent powder layer 5.
The product of the embodiment can be applied to ultrathin displays, panel lamps (with frames and without frames), bulb lamps, filament lamps, fluorescent lamps and street lamps.
Example 2
The structure of the present embodiment is substantially the same as that of embodiment 1, and as shown in fig. 12, the present embodiment includes a substrate 1, an LED light source 2 in a four-side light emitting package form, and a high refractive index LEDBlue light waveguide layer 3, diffusion film layer 4, phosphor layer 5 and upper diffusion film layer 6. The substrate 1 is provided with a plurality of LED light sources 2, and the substrate 1 is provided with a high-refractive-index blue light waveguide layer 3 which covers all the LED light sources 2 and the upper reflecting layer thereof. The blue light waveguide layer with high refractive index simultaneously meets the following conditions: the high-refractive-index blue light waveguide layer 3 is a single medium and is a medium layer which is uniformly distributed; defining one surface of the high-refractive-index blue light waveguide layer 3 far away from the substrate 1 as an upper waveguide interface, and defining one medium at two sides of the upper waveguide interface far away from the substrate 1 as an external medium layer, wherein the refractive index of the high-refractive-index blue light waveguide layer 3 is denoted as n2The refractive index of the external medium layer is denoted n3，n2＞n3(ii) a The other surface of the high-refractive-index blue light waveguide layer 3 close to the substrate 1 is defined as a lower waveguide interface, and a waveguide reflection layer 7 is provided between the lower waveguide interface and the substrate 1.
The high-refractive-index blue light waveguide layer 3 is sequentially provided with a diffusion film layer 4 and a fluorescent powder layer 5 from bottom to top. An upper diffusion film layer 6 may optionally be provided on the phosphor layer 5. Similarly, an air gap exists between the diffusion film layer 4 and the high-refractive-index blue waveguide layer 3, and the air gap serves as an external medium layer.
The difference lies in that: as shown in fig. 13 and 18, the LED light source includes an LED chip body 21, transparent layers 23 provided on the top and side surfaces of the LED chip body 21, and a reflective layer 22 provided on the top surface of the transparent layer 23. The medium refractive index of the transparent layer 23 is higher than or equal to the refractive index of the high-refractive-index blue waveguide layer 3.
Let a denote the thickness of the side surface of the transparent layer 23, h denote the height of the transparent layer 23, and n denote the refractive index of the transparent layer 231The refractive index of the high-refractive-index blue light waveguide layer 3 is denoted as n2The refractive index of the external medium layer is denoted as n3To achieve total reflection of light, it is necessary to satisfy
Taking a four-side light-emitting packaged LED light source with a semi-transparent and semi-reflective top-surface reflection structure as an example, as shown in fig. 14, the structure successfully converts the main energy angle of the main light-emitting direction of the LED light source with a normal lambertian light type structure from 0 ° right above to plus or minus 60 ° around. Secondly, the luminous intensity is also successfully homogenized in the whole luminous angle from the light intensity distribution, and the luminous intensity is still about 73 percent of the peak value even under the large angle range of plus or minus 85 degrees. In the LED light source of the normal lambertian light type structure, the light intensity is only half of the peak value if the light emitting angle is 120 °, that is, when the light emitting angle is plus or minus 60 ° (see fig. 1). In the LED light source structure adopting the semi-transparent semi-reflective top surface reflection structure, even if the light intensity is in a large angle range of plus or minus 85 degrees, the light intensity is still 73 percent of the peak value of the light intensity.
Of course, as shown in fig. 15, the transparent layer 23 in this embodiment may be disposed only on the top surface of the LED chip body 22, and the reflective layer 22 may be disposed on the transparent layer 23.
As an example, a more specific embodiment is that, as shown in fig. 16 and 17, an intermediate reflection layer 24 is further provided between the top surface of the LED chip body 21 and the transparent layer 23, and the intermediate reflection layer 24 is a total reflection layer or a partial reflection layer.
The four-side light-emitting blue light waveguide surface light-emitting structure is prepared by the following steps:
firstly, manufacturing an LED light source in a four-side light emitting packaging form:
s1, selecting a qualified LED chip body 21, wherein the LED chip body 21 is provided with a lower reflecting layer, a P-GaN layer, a light emitting layer, an N-GaN layer and a substrate in sequence from bottom to top;
step S2, arranging a plurality of LED chip bodies 21 at equal intervals to form a fillable gap between adjacent LED chip bodies 21, and arranging transparent layers 23 on the upper surface of the whole LED chip body 21 and in the fillable gap;
step S3, baking and semi-curing the semi-finished product obtained in the step S2, and then arranging a reflecting layer 22 on the top surface of the transparent layer 23;
step S4: baking and curing the whole wafer subjected to the step S3, then cutting and splitting, and carrying out chip testing, sorting and rearrangement after splitting to obtain the LED light source 2 with the transparent layer 23 and the reflecting layer 22, so as to form the LED light source 2 in a four-side light emitting packaging form;
then, manufacturing a four-side light-emitting blue light waveguide surface light-emitting structure:
step S5: selecting an integral substrate 1, and selecting whether to plate a lower reflecting layer on the surface of one side of the substrate 1 for die bonding according to actual requirements, and integrally die bonding on the substrate, namely mounting an LED light source 2 in a four-side light-emitting packaging mode on the substrate 1;
step S6: arranging the continuous substrate 1 in the step S5 on a reusable mold or a backlight plate, coating a high-refraction transparent material such as a silica gel or an acrylic material on the whole backlight plate to enable the high-refraction transparent material to cover the surface of the whole continuous substrate 1, and finally performing integral compression molding to form a high-refraction blue light waveguide layer 3 covering the LED light source 2 in a four-side light emitting package manner;
step S7: the diffusion film layer 4 and the fluorescent powder layer 5 are sequentially arranged on the upper surface of the high-refractive-index blue light waveguide layer 3, so that a four-side light-emitting blue light waveguide surface light-emitting structure is formed, and finally the four-side light-emitting blue light waveguide surface light-emitting structure is peeled from the backlight plate.
The substrate 1 employed in the four-side outgoing blue waveguide surface light emitting structure of the above embodiments 1-2 may be a flexible or rigid, transparent or non-transparent substrate. The substrate 1 may be an integral plate or a discontinuous substrate, that is, the substrate 1 is composed of a plurality of strip-shaped substrates arranged at intervals, and one end or two ends of the strip-shaped substrates are connected by an electrode plate.
A strip-shaped substrate is adopted to manufacture a four-side light-emitting blue light waveguide surface light-emitting structure, and the method comprises the following specific steps:
step S5: selecting an integral substrate 1, selecting whether to plate a lower reflecting layer on the surface of one side of the substrate 1 for die bonding according to actual requirements, and integrally die bonding on the substrate, namely mounting an LED light source 2 in a four-side light emitting packaging form on the substrate 1, then cutting to form strip-shaped substrates with the width of 0.2-3mm, wherein one end or two ends of each strip-shaped substrate are connected through an electrode plate or an electrode device to form an integral structure;
step S6: placing the integral structure in the step S5 on a reusable mold or a backlight plate, coating a high-refractive transparent material such as a silica gel or an acrylic material on the whole backlight plate to make the high-refractive transparent material cover the whole strip-shaped substrate surface and the area between adjacent strip-shaped substrates, and finally performing integral compression molding to form a high-refractive-index blue light waveguide layer 3 covering the LED light source 2 in a four-side light emitting package form;
step S7: the diffusion film layer 4 and the fluorescent powder layer 5 are sequentially arranged on the upper surface of the high-refractive-index blue light waveguide layer 3, so that a four-side light-emitting blue light waveguide surface light-emitting structure is formed, and finally the four-side light-emitting blue light waveguide surface light-emitting structure is peeled from the backlight plate.
The comparison of various parameters of the backlight module manufactured by the method in the embodiment 2 and the direct type backlight module in the traditional mode is as follows:
6-inch mobile phone backlight application case
And (4) conclusion: from the above table, under the prerequisite that the luminous zone area is the same, backlight unit thickness is the same, in this embodiment, owing to adopted wide-angle four sides light-emitting light source with main luminous energy direction skew to the side directly over, simultaneously, luminous angle is up to more than 170, under the prerequisite of guaranteeing the same mixed light effect, the effectual interval that has improved adjacent light source, reduces light source particle number by a wide margin.
Example 3
The structure of this embodiment is substantially the same as that of embodiment 1, and as shown in fig. 19, the LED package includes a substrate 1, an LED light source 2 in a four-side light-emitting package form, a high-refractive-index blue light waveguide layer 3, a diffusion film layer 4, a phosphor layer 5, and an upper diffusion film layer 6. The LED fluorescent lamp is characterized in that a plurality of LED light sources 2 are arranged on the substrate 1, a high-refractive-index blue light waveguide layer 3 covering all the LED light sources 2 and an upper reflecting layer is arranged on the substrate 1, and a diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the high-refractive-index blue light waveguide layer 3 from bottom to top. An upper diffusion film layer 6 is also provided on the phosphor layer 5.
In this embodiment, the blue light waveguide layer 3 with high refractive index is also a single dielectric transparent layer without phosphor, and the difference is that: in the waveguide layer 3 for confining blue light with high refractive indexOne surface far away from the substrate 1 is an upper waveguide interface, an air layer 8 is arranged between the upper waveguide interface and the diffusion film layer 4, the air layer 8 is used as an external medium layer, and the refractive index of the external medium layer is recorded as n3The refractive index of the high-refractive-index blue light waveguide layer 3 is denoted by n2And n is2＞n3(ii) a The other surface of the high-refractive-index blue light waveguide layer 3 close to the substrate 1 is defined as a lower waveguide interface, and a waveguide reflection layer 7 is provided between the lower waveguide interface and the substrate 1.
In this embodiment, as shown in fig. 11, the LED light source 2 in the four-side light-emitting package form includes an LED chip body 21 and a reflective layer 22 covering the top surface of the chip body 21, and the area of the reflective layer 22 is equal to the area of the top surface of the LED chip body 21. The reflective layer 22 may be a DHR distributed bragg mirror or a metal reflective layer.
The LED light source in the form of a four-side light-emitting package may also be in the form as shown in fig. 13, and includes an LED chip body 21, transparent layers 23 disposed on the top surface and the side surfaces of the LED chip body 21, and a reflective layer 22 disposed on the top surface of the transparent layer 23. The medium refractive index of the transparent layer 23 is higher than or equal to the refractive index of the high-refractive-index blue waveguide layer 3.
Claims (13)
1. The utility model provides a four sides light-emitting blue light waveguide face light emitting structure which characterized in that: the LED light source comprises a substrate, an LED light source in a four-side light emitting packaging mode and a high-refractive-index blue light waveguide layer;
the LED light source is a chip with a reflecting layer on the top surface to form four-side light emitting, and the substrate is provided with a high-refractive-index blue light waveguide layer which covers all the LED light sources, wherein the height of the high-refractive-index blue light waveguide layer is equal to or higher than that of the top surface of the LED light source;
the blue light waveguide layer with high refractive index simultaneously meets the following conditions:
(1) the high-refractive-index blue light waveguide layer is a single medium and is a medium layer which is uniformly distributed;
(2) defining one surface of the high-refractive-index blue light waveguide layer far away from the substrate as an upper waveguide interface, and locating at the middle and far sides of the upper waveguide interfaceThe medium at one side of the substrate is an external medium layer, and the refractive index of the high-refractive-index blue light waveguide layer is recorded as n2The refractive index of the external medium layer is denoted n3，n2＞n3；
(3) And the other surface of the high-refractive-index blue light waveguide layer close to the substrate is defined as a lower waveguide interface, and a waveguide reflection layer is arranged between the lower waveguide interface and the substrate.
2. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 1, characterized in that: a diffusion film layer and a fluorescent powder layer are sequentially arranged above an upper waveguide interface of the high-refractive-index blue light waveguide layer from bottom to top, an air layer or an air gap exists between the diffusion film layer and the high-refractive-index blue light waveguide layer, and the air layer or the air gap serves as an outer medium layer.
3. The four-sided light-emitting blue-light waveguide surface light emitting structure of claim 2, wherein: when an air gap exists between the diffusion film and the high-refractive-index blue light waveguide layer, the lower surface of the diffusion film layer is provided with an uneven microstructure, and the microstructure accounts for 10-100% of the total area of the diffusion film layer; the microstructure on the lower surface of the diffusion film layer is tightly attached to the waveguide interface on the blue light waveguide layer with high refractive index to form an air gap.
4. The four-sided light-emitting blue-light waveguide surface light emitting structure of claim 2, wherein: an upper diffusion film layer is also arranged on the fluorescent powder layer.
5. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 1, characterized in that: the LED light source in the four-side light emitting packaging mode comprises an LED chip body and a reflecting layer covering the top surface of the LED chip body.
6. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 1, characterized in that: the LED light source in the four-side light emitting packaging mode comprises an LED chip body, transparent layers are arranged on the top surface and the side surfaces of the LED chip body, and a reflecting layer is arranged on the top surface of each transparent layer.
7. The four-sided light-emitting blue-light waveguide surface light emitting structure of claim 6, wherein: the thickness of the side of the transparent layer is recorded as a, the height of the transparent layer is recorded as h, and the refractive index of the transparent layer is recorded as n1The refractive index of the high-refractive-index blue light waveguide layer is denoted as n2The refractive index of the external medium layer is n3To achieve total reflection of light, it is necessary to satisfy
8. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 1, characterized in that: the LED light source in the four-side light emitting packaging mode comprises an LED chip body, wherein a transparent layer is arranged on the top surface of the LED chip body, and a reflecting layer is arranged on the top surface of the transparent layer.
9. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 6 or 8, characterized in that: and a middle reflecting layer is arranged between the top surface of the LED chip body and the transparent layer and is a total reflecting layer or a partial reflecting layer.
10. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 6 or 8, characterized in that: the medium refractive index of the transparent layer is higher than or equal to the refractive index of the high-refractive-index blue light waveguide layer.
11. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 1, characterized in that: the upper surface of the substrate or the lower surface of the high-refractive-index blue light waveguide layer is provided with a microstructure optical scattering layer, or the upper surface of the high-refractive-index blue light waveguide layer is provided with a microstructure optical scattering layer.
12. The four-sided light-emitting blue waveguide surface light emitting structure of claim 1, 2 or 3, wherein: the high-refractive-index blue light waveguide layer is manufactured by adopting a mode of mould pressing, dispensing, spraying or material growth.
13. The four-sided light-emitting blue-light waveguide surface light emitting structure according to claim 2 or 4, wherein: the fluorescent powder layer is formed on the diffusion film layer in a coating, mould pressing or growing mode and is integrated with the diffusion film layer, or is an independent sheet-shaped fluorescent powder layer, or is formed by taking a transparent film as a supporting substrate.
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| CN2018212449636 | 2018-08-03 | ||
| CN201821244963 | 2018-08-03 | ||
| CN2018110760343 | 2018-09-14 | ||
| CN201811076034 | 2018-09-14 | ||
| CN201811330817 | 2018-11-09 | ||
| CN201811330817X | 2018-11-09 |
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