CN110676202A - Pick-and-place alignment device and method thereof - Google Patents
Pick-and-place alignment device and method thereof Download PDFInfo
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- CN110676202A CN110676202A CN201910799370.9A CN201910799370A CN110676202A CN 110676202 A CN110676202 A CN 110676202A CN 201910799370 A CN201910799370 A CN 201910799370A CN 110676202 A CN110676202 A CN 110676202A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Abstract
A pick-and-place alignment device comprises: a visual image capturing module; the picking and placing unit is arranged below the visual image acquisition module; a carrier arranged below the pick-and-place unit; the light source module is arranged below the carrier; the light source module irradiates the carrier from bottom to top, and the visual image capturing module penetrates through the picking and placing unit to capture the image information of the carrier. The light source unit irradiates a bright light to the carrier from bottom to top, and the visual image capturing module penetrates through the picking and placing unit to capture the image information of the carrier, so that the effect of accurate alignment is achieved, and the subsequent processing is facilitated.
Description
Technical Field
The invention relates to a vehicle which can irradiate the light from bottom to top and is positioned above the vehicle, so that an image acquisition module can clearly acquire the image information of the vehicle, and the accurate alignment effect is achieved.
Background
In the conventional implementation of grain absorption, a light source module is disposed adjacent to or below a visual image capturing module; the light source module irradiates a bright light to a crystal grain bearing disc so as to enable crystal grains positioned on the crystal grain bearing disc to generate reflected light, and the visual image acquisition module acquires image information of the reflected light or the crystal grains; the image information is transmitted to a pick-and-place device, so that the pick-and-place device can pick a crystal grain from the crystal grain bearing disc, and then place the crystal grain at another position for the next process.
Although the above-mentioned die picking and placing method is used by various manufacturers, there are still several problems. First, if the pick-and-place module moves above the die to be sucked, the pick-and-place module blocks the view of the visual image capturing module, so that the visual image capturing module cannot effectively capture the image information of the die, which may cause the pick-and-place module to fail to precisely align the position of the die, thereby causing the process defect caused by alignment defect in the subsequent process. Second, the existing light source module projects the bright light from the top to the die located at the bottom, so the image information captured by the visual image capturing module may be blurred, and the pick-and-place module cannot effectively align the position of the die.
In addition to the above-mentioned die, the die further includes a flip chip substrate, an IC substrate, an LED heat dissipation substrate, an LED sapphire substrate, a glass substrate, a ceramic substrate, a copper foil substrate or a Wafer (Wafer), and the aforementioned components are generally referred to as substrates in the industry at present. Therefore, the existing substrate has the possibility of being taken and placed by the module.
As mentioned above, since the position of the pick-and-place module and the light source module provide the bright light, the alignment of the substrate may be affected, and the subsequent process may be inaccurate, so how to improve the alignment accuracy of the substrate becomes a subject of research by various manufacturers.
Therefore, how to solve the above-mentioned deficiencies of the prior art is a problem to be solved by the present invention.
Disclosure of Invention
The invention aims to provide a pick-and-place alignment device and a method thereof.
In order to achieve the purpose, the invention adopts the technical scheme that:
a pick-and-place alignment device comprises:
a visual image capturing module;
the picking and placing unit is arranged below the visual image capturing module;
the carrier is arranged below the taking and placing unit; and
the light source module is arranged below the carrier;
the light source module irradiates the carrier from bottom to top, and the visual image capturing module penetrates through the picking and placing unit to capture image information of the carrier.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the pick-and-place unit further comprises a transparent body arranged at the top end of the pick-and-place unit.
2. In the above solution, the visual image capturing module is a charge coupled device; the transparent body is a glass or a lens.
3. In the above scheme, the pick-and-place unit is coupled to a positive and negative pressure module.
4. In the above scheme, the positive and negative pressure modules comprise an air suction motor and an air supply motor.
5. In the above scheme, the device further comprises a carrier displacement unit, the carrier displacement unit is arranged below the pick-and-place unit, and the light source unit is arranged below the carrier displacement unit.
6. In the above solution, the carrier displacement unit includes a roller device, a mechanical holder, a linear slide rail, a track structure or a track structure.
7. In the above-mentioned scheme, a displacement module is further provided, and the displacement module is coupled to the visual image capturing module.
8. In the above solution, the displacement module includes a track structure, a linear slide rail or a rail structure.
9. In the above scheme, the light source module includes a visible light source, an invisible light source, an infrared light source, an ultraviolet light source, a special light source, a halogen light source, a light emitting diode light source or a conventional lighting light source.
10. In the above scheme, the light source module is arranged at the bottom end of the interior of the carrier.
11. In the above scheme, the carrier is a tray or a continuous film body; or the carrier is a transparent body, and the top end of the carrier is provided with a mark; or the carrier is provided with a plurality of containing parts and a plurality of through holes, and each through hole is communicated with the containing part.
12. In the above-mentioned scheme, a first visual image capturing unit is further provided, the first visual image capturing unit is located above the carrier displacement unit, and the first visual image capturing unit captures image information of a mark located on the carrier.
In order to achieve the purpose, the invention adopts the technical scheme that:
a pick-and-place alignment method comprises the following steps:
providing a light to a carrier, wherein the light irradiates the carrier from bottom to top;
a visual image capturing module penetrates through a picking and placing unit to capture the image information of the carrier; and
a pick-and-place unit moves to a default position according to the image information, and places a substrate on the carrier; or the taking and placing unit moves to the default position according to the image information and places the sucked substrate on the carrier.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the carrier moves on the top of a carrier displacement unit, a light source unit is arranged below the carrier displacement unit, and the light source unit irradiates the bright light to the carrier from bottom to top.
2. In the above scheme, a light source unit is arranged at the bottom end inside the carrier, and the light source unit irradiates the bright light to the carrier from bottom to top.
3. In the above scheme, a transparent body is arranged at the top end of the pick-and-place unit, and the visual image capturing module penetrates through the transparent body to see the pick-and-place unit, so as to capture the image information of the substrate.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for pick-and-place alignment comprises the following steps:
providing a light to a carrier, wherein the light irradiates the mark on the carrier from bottom to top; and
a first visual image capturing module is positioned above the carrier so as to capture the image information of the mark.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the carrier moves on the top end of a carrier displacement unit, a light source unit is arranged below the carrier displacement unit, and the light source unit irradiates the bright light to the mark from bottom to top.
2. In the above scheme, a light source unit is arranged at the bottom end inside the carrier, and the light source unit irradiates the bright light to the mark from bottom to top.
The working principle and the advantages of the invention are as follows:
the invention relates to a pick-and-place contraposition device, which comprises: a visual image capturing module; the picking and placing unit is arranged below the visual image acquisition module; a carrier arranged below the pick-and-place unit; the light source module is arranged below the carrier; the light source module irradiates the carrier from bottom to top, and the visual image capturing module penetrates through the picking and placing unit to capture the image information of the carrier. The light source unit irradiates a bright light to the carrier from bottom to top, and the visual image capturing module penetrates through the picking and placing unit to capture the image information of the carrier, so that the effect of accurate alignment is achieved, and the subsequent processing is facilitated.
Drawings
FIG. 1 is a schematic view of a first embodiment of a pick and place alignment apparatus;
FIG. 2 is a schematic cross-sectional view of a visual image capturing module and a pick-and-place unit;
FIG. 3 is a schematic diagram of the operation of a carrier and a carrier displacement unit;
FIG. 4 is another schematic diagram of the carrier and the carrier displacement unit;
FIG. 5 is a schematic view of a second embodiment of a carrier;
fig. 6 is a schematic view of a second embodiment of the pick-and-place aligning device according to the present invention.
In the above drawings: 10. a visual image capturing module; 10A, a visual image acquisition module; 11. a transparent body; 12. a pick-and-place unit; 12A, a taking and placing unit; 13. a positive and negative pressure module; 14A, a first visual image capturing module; 2. a light source module; 2A, a light source module; 2B, a light source module; 3. a carrier; 3A, a carrier; 3B, a carrier; 30. a substrate; 30A, a substrate; 31. a receptacle portion; 32. through holes; 4. a carrier displacement unit; 4A, a carrier displacement unit; 5. a displacement module; 5A, a displacement module; 33B, symbol.
Detailed Description
The invention is further described with reference to the following figures and examples:
example (b): the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure may be shown and described, and which, when modified and varied by the techniques taught herein, can be made by those skilled in the art without departing from the spirit and scope of the disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms "a", "an", "the" and "the", as used herein, also include the plural forms.
The terms "first," "second," and the like, as used herein, do not denote any order or importance, nor do they denote any order or importance, but rather are used to distinguish one element from another element or operation described in such technical terms.
As used herein, "connected" or "positioned" refers to two or more elements or devices being in direct physical contact with each other or in indirect physical contact with each other, and may also refer to two or more elements or devices being in operation or acting on each other.
As used herein, the terms "comprising," "including," "having," and the like are open-ended terms that mean including, but not limited to.
As used herein, the term (terms), unless otherwise indicated, shall generally have the ordinary meaning as commonly understood by one of ordinary skill in the art, in this written description and in the claims. Certain words used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the disclosure.
The terms "front", "rear", "upper", "lower", "left" and "right" used herein are directional terms, and are used only for describing the positional relationship between the structures, and are not intended to limit the specific direction of the protective reaction and the practical implementation of the present invention.
Please refer to fig. 1 and fig. 2, which show a pick-and-place alignment apparatus according to a first embodiment of the present invention, comprising a visual image capturing module 10, a transparent body 11, a pick-and-place unit 12, a positive/negative pressure module 13, a light source module 2, a carrier 3, a carrier displacement unit 4, and a displacement module 5.
The visual image capturing module 10 is a Charge-coupled Device (CCD).
The pick-and-place unit 12 is located below the vision capturing module 10. The pick-and-place unit 12 is coupled to the positive and negative pressure module 13, and the positive and negative pressure module 13 includes an air suction motor and an air supply motor. The positive and negative pressure module 13 provides a positive pressure gas or a negative pressure gas to the pick-and-place unit 12.
The transparent body 11 is disposed above the suction unit 120. The transparent body 11 is a glass or a lens.
Referring to fig. 1, the carrier displacement unit 4 is disposed below the pick-and-place unit 12. The carrier displacement unit 4 includes a roller device, a mechanical holder, a linear rail, a track structure or a track structure.
The displacement module 5 is disposed above the carrier displacement unit 4 and coupled to the visual image capturing module 10, so that the visual image capturing module 10 can be lifted and laterally displaced relative to the carrier displacement unit 4. The displacement module 5 includes a caterpillar structure, a linear slide rail or a rail structure.
In the present embodiment, the light source module 2 is disposed below the carrier displacement unit 4. The light source module 2 includes a visible light source, an invisible light source, an infrared light source, an ultraviolet light source, a special light source, a halogen light source, a light emitting diode light source or a conventional lighting light source.
The carrier 3 can move above the carrier displacement unit 4. The carrier 3 is a transparent body, and the top of the carrier 3 has at least one substrate 30. The carrier 3 is a tray or a continuous film body.
Referring to fig. 5, a second embodiment of the pick-and-place aligning device according to the present invention is shown, in which the light source module 2A is disposed at the bottom end of the interior of the carrier 3A.
The invention relates to a pick-and-place alignment method, which comprises the following steps:
a carrier 3 has at least one substrate 30 at its top end, and the carrier 3 moves above the carrier displacement unit 4.
Such as the carrier displacement unit 4 and the carrier 3. If the carrier 3 is a continuous film body, the carrier displacement unit 4 includes a feeding roller and a film collecting roller. The carrier 3 is disposed on the feeding roller, and the film collecting roller receives the film body with the substrate 30 removed.
If the carrier 3 is a tray, the carrier displacement unit 4 includes a roller device, a mechanical holder, a linear slide rail, a track structure or a rail structure, so that the carrier 3 can move above the carrier displacement unit 4.
Referring to fig. 1, 3 and 4, if the carrier 3 moves above the light source module 2, the carrier 3 stops moving, and the light source module 2 provides a light to the carrier 3, and the light shines through the carrier 3 from bottom to top, as shown in the first embodiment.
The carrier 3 has a plurality of accommodating portions 31 and a plurality of through holes 32, and the through holes 32 communicate with the accommodating portions 31. The bright light illuminates the carrier 3 through the through hole 32 and the accommodating portion 31. Alternatively, the carrier 3 is a transparent body, so that the bright light can illuminate the substrate 30.
The pick-and-place unit 12 moves to a position below the visual image capturing module 10, the visual image capturing module 10 penetrates through the transparent body 11 to penetrate through the pick-and-place unit 12, and then captures the image information of the accommodating portion 31 where the substrate 30 is to be placed, because the visual image capturing module 10 is located above the pick-and-place unit 12 and the above-mentioned light is irradiated from bottom to top, the visual image capturing module 10 can clearly capture the image information of the accommodating portion 31.
The pick-and-place unit 10 is lowered toward the position of the accommodating portion 31 where the substrate 30 is to be placed. The positive and negative pressure module 13 provides a positive pressure to the pick-and-place unit 12, so that the pick-and-place unit 12 generates a releasing force to place the substrate 30 in the desired accommodating portion 31. When the substrate 30 is placed, the pick-and-place unit 13 starts to ascend, and a process for placing the substrate 30 next is performed.
In the second embodiment, as shown in fig. 5, since the light source module 2A is disposed in the carrier 3A, when the carrier 3A moves to a default position in the carrier displacement unit, the light source module 2A provides a light to the substrate 30A, the light irradiates the carrier 3A from bottom to top, the carrier 3A is transparent, so that the light can penetrate through the carrier 3A, and the vision pick-and-place unit performs the placing operation of the substrate 30A.
As shown in fig. 2, the visual image capturing module 10, the taking and placing unit 12 and the transparent body 11 are combined, so that the visual image capturing module 10 can see through the taking and placing unit 12.
Similarly, referring to fig. 1, when the pick-and-place unit 12 is about to pick up the substrate 30 placed on the carrier 3, and the carrier 3 moves to the upper side of the light source module 2, the carrier 3 stops moving, and the light source module 2 provides a light to the carrier 3, and the light shines through the carrier 3 from bottom to top.
The displacement module 5 moves the visual image capturing module 10 above the substrate 30 to be sucked. The bright light is irradiated through the through hole 32 to the substrate 30, and the bright light is irradiated upward from the periphery of the substrate 30.
The pick-and-place unit 12 moves to the lower part of the visual image capturing module 10, the visual image capturing module 10 penetrates through the transparent body 11 to penetrate through the pick-and-place unit 12, and then captures the image information of the substrate 30 to be captured, and because the visual image capturing module 10 is located above the pick-and-place unit 12 and the above-mentioned bright light is irradiated from bottom to top, the visual image capturing module 10 can clearly capture the image information of the substrate 30.
The pick-and-place unit 10 is lowered toward the position of the substrate 30 to be sucked. The positive and negative pressure module 13 provides a negative pressure to the pick-and-place unit 12, so that the pick-and-place unit 12 generates a vacuum suction force to absorb the substrate 30. If the substrate 30 is adsorbed, the pick-and-place unit 13 starts to ascend and moves to another position where the substrate 30 is placed. After the pick-and-place unit 12 reaches the position, the positive and negative pressure modules 13 provide a positive pressure to the pick-and-place unit 12, so that the pick-and-place unit 12 generates a blowing force to place the substrate 30 at the position.
When the visual image capturing module 10 is to capture the image information of the carrier 3 or the substrate 30, the visual field of the visual image capturing module 10 can penetrate through the transparent body 11 and the pick-and-place unit 12, so that the visual image capturing module 10 is not blocked by the suction head 12 when the image capturing module 10 captures the image information of the carrier 3 or the substrate 30.
Referring to fig. 6, a pick-and-place alignment apparatus according to a second embodiment of the present invention is shown, in which a carrier 3B has a mark 33B. The carrier 3B is a transparent body.
A light source module 2B is disposed below the carrier displacement unit 4. Alternatively, as in the second embodiment of the above carrier, the bottom of the carrier 3B has a light source module.
The displacement module 5A is disposed above the carrier displacement unit 4. The bottom of the displacement module 5A is coupled to the visual image capturing module 10A. A pick-and-place unit 12A is disposed below the visual image capturing module 10A. The pick-and-place unit 12A is coupled with a positive and negative pressure module. A first visual image capturing module 14A is located above the carrier displacement unit 4.
The invention is another embodiment of the pick-and-place alignment method, which comprises the following steps:
as shown in fig. 6, a light is provided to a carrier 3B, and the light irradiates the mark 33B from bottom to top. The bright light can be provided by the light source module 2B located below the carrier displacement unit 4, or the bright light can be provided by the light source module located at the bottom end of the carrier.
The first visual image capturing module 14A is located above the carrier 3B to capture the image information of the mark 33B.
The displacement module 5A moves the pick-and-place unit 12A to the upper side of the carrier 3B according to the image information. After the pick-and-place unit 12A moves above the carrier 3B, the pick-and-place unit 12A moves longitudinally relative to the carrier 3B to place the adsorbed substrate on the top of the carrier 3B or to suck the substrate on the carrier 3B. If the above sucking or placing operation is completed, the pick-and-place unit 12A returns to the original position again. As in the first embodiment, the visual image capturing module 10A passes through the pick-and-place unit 12A to capture the image information of the substrate.
In addition, the light source unit is arranged at the bottom end in the carrier or below the carrier displacement unit, so that the bright light generated by the light source unit is irradiated from bottom to top, the visual image acquisition module can clearly acquire the image information of the substrate or the mark, and the purpose of accurate positioning is achieved, and the subsequent processing is facilitated.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (20)
1. The utility model provides a get and put aligning device which characterized in that:
comprising:
a visual image capturing module;
the picking and placing unit is arranged below the visual image capturing module;
the carrier is arranged below the taking and placing unit; and
the light source module is arranged below the carrier;
the light source module irradiates the carrier from bottom to top, and the visual image capturing module penetrates through the picking and placing unit to capture image information of the carrier.
2. The pick-and-place alignment device of claim 1, wherein: and a transparent body arranged at the top end of the pick-and-place unit.
3. The pick-and-place aligning device of claim 2, wherein: the visual image capturing module is a charge coupled device; the transparent body is a glass or a lens.
4. The pick-and-place aligning device of claim 2, wherein: the taking and placing unit is coupled with a positive and negative pressure module.
5. The pick-and-place alignment device of claim 4, wherein: the positive and negative pressure modules comprise an air suction motor and an air supply motor.
6. The pick-and-place alignment device of claim 1, wherein: the light source unit is arranged below the carrier displacement unit.
7. The pick-and-place alignment device of claim 6, wherein: the carrier displacement unit comprises a roller device, a mechanical clamping seat, a linear slide rail, a crawler structure or a track structure.
8. The pick-and-place alignment device of claim 1, wherein: and a displacement module coupled to the visual image capturing module.
9. The pick-and-place alignment device of claim 8, wherein: the displacement module comprises a track structure, a linear slide rail or a rail structure.
10. The pick-and-place alignment device of claim 1, wherein: the light source module comprises a visible light source, an invisible light source, an infrared light source, an ultraviolet light source, a special light source, a halogen light source, a light emitting diode light source or a conventional lighting light source.
11. The pick-and-place alignment device of claim 1, wherein: the light source module is arranged at the bottom end of the interior of the carrier.
12. The pick-and-place alignment device of claim 1, wherein: the carrier is a tray or a continuous film body; or the carrier is a transparent body, and the top end of the carrier is provided with a mark; or the carrier is provided with a plurality of containing parts and a plurality of through holes, and each through hole is communicated with the containing part.
13. The pick-and-place alignment device of claim 6, wherein: the first visual image capturing unit is positioned above the carrier displacement unit and captures image information of a mark positioned on the carrier.
14. A picking and placing alignment method is characterized in that: the method comprises the following steps:
providing a light to a carrier, wherein the light irradiates the carrier from bottom to top;
a visual image capturing module penetrates through a picking and placing unit to capture the image information of the carrier; and
a pick-and-place unit moves to a default position according to the image information, and places a substrate on the carrier; or the taking and placing unit moves to the default position according to the image information and places the sucked substrate on the carrier.
15. The pick-and-place alignment method of claim 14, wherein: the carrier moves at the top end of a carrier displacement unit, a light source unit is arranged below the carrier displacement unit, and the light source unit irradiates the bright light to the carrier from bottom to top.
16. The pick-and-place alignment method of claim 14, wherein: and a light source unit is arranged at the bottom end inside the carrier and irradiates the bright light to the carrier from bottom to top.
17. The pick-and-place alignment method of claim 14, wherein: the top end of the taking and placing unit is provided with a transparent body, and the visual image capturing module penetrates through the transparent body to see the taking and placing unit so as to capture the image information of the substrate.
18. A method for picking and placing alignment is characterized in that: the method comprises the following steps:
providing a light to a carrier, wherein the light irradiates the mark on the carrier from bottom to top; and
a first visual image capturing module is positioned above the carrier so as to capture the image information of the mark.
19. The method of claim 18, wherein: the carrier moves at the top end of a carrier displacement unit, a light source unit is arranged below the carrier displacement unit, and the light source unit irradiates the bright light to the mark from bottom to top.
20. The method of claim 18, wherein: and a light source unit is arranged at the bottom end inside the carrier and irradiates the bright light to the mark from bottom to top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910799370.9A CN110676202A (en) | 2019-08-28 | 2019-08-28 | Pick-and-place alignment device and method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910799370.9A CN110676202A (en) | 2019-08-28 | 2019-08-28 | Pick-and-place alignment device and method thereof |
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| CN110676202A true CN110676202A (en) | 2020-01-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281345A (en) * | 2020-02-19 | 2021-08-20 | 均华精密工业股份有限公司 | Three-dimensional surface detection method and semiconductor detection equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100375132C (en) * | 2005-01-17 | 2008-03-12 | 友达光电股份有限公司 | Aligning machine |
| CN101609786A (en) * | 2008-06-17 | 2009-12-23 | 旺硅科技股份有限公司 | Crystal grain clamping and placing system and thimble device |
| CN204287068U (en) * | 2014-11-25 | 2015-04-22 | 香港商微觉视检测技术股份有限公司 | For detecting the substrate imperfection pick-up unit of light-permeable base material |
| CN106952853A (en) * | 2015-10-15 | 2017-07-14 | 株式会社吉帝伟士 | Engaging head and utilize its semiconductor- fabricating device |
| CN107764834A (en) * | 2017-12-07 | 2018-03-06 | 南京波长光电科技股份有限公司 | A kind of device and its detection method of automatic detection transparent parts surface defect |
| CN105632989B (en) * | 2015-10-08 | 2018-08-14 | 苏州均华精密机械有限公司 | Precise crystalline grain picking and placing device and method thereof and used suction module |
-
2019
- 2019-08-28 CN CN201910799370.9A patent/CN110676202A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100375132C (en) * | 2005-01-17 | 2008-03-12 | 友达光电股份有限公司 | Aligning machine |
| CN101609786A (en) * | 2008-06-17 | 2009-12-23 | 旺硅科技股份有限公司 | Crystal grain clamping and placing system and thimble device |
| CN204287068U (en) * | 2014-11-25 | 2015-04-22 | 香港商微觉视检测技术股份有限公司 | For detecting the substrate imperfection pick-up unit of light-permeable base material |
| CN105632989B (en) * | 2015-10-08 | 2018-08-14 | 苏州均华精密机械有限公司 | Precise crystalline grain picking and placing device and method thereof and used suction module |
| CN106952853A (en) * | 2015-10-15 | 2017-07-14 | 株式会社吉帝伟士 | Engaging head and utilize its semiconductor- fabricating device |
| CN107764834A (en) * | 2017-12-07 | 2018-03-06 | 南京波长光电科技股份有限公司 | A kind of device and its detection method of automatic detection transparent parts surface defect |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281345A (en) * | 2020-02-19 | 2021-08-20 | 均华精密工业股份有限公司 | Three-dimensional surface detection method and semiconductor detection equipment |
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