CN110673011A - Semiconductor testing device - Google Patents
Semiconductor testing device Download PDFInfo
- Publication number
- CN110673011A CN110673011A CN201911054866.XA CN201911054866A CN110673011A CN 110673011 A CN110673011 A CN 110673011A CN 201911054866 A CN201911054866 A CN 201911054866A CN 110673011 A CN110673011 A CN 110673011A
- Authority
- CN
- China
- Prior art keywords
- test head
- semiconductor test
- inlet pipe
- isolation
- cover
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application discloses a semiconductor testing device, when a semiconductor product is tested at a low temperature, the temperature of a testing head is lower, condensed water is formed on the surface and the periphery of the testing head due to the humidity in testing ambient air, and short circuit of electrical elements in equipment can be caused by the condensed water; according to the invention, the gas inlet pipe, the test head protection cover communicated with the gas inlet pipe and the isolation cover are arranged, and the dehumidified compressed air is input into the gas inlet pipe, so that the gas flows into the test head protection cover through the gas inlet pipe, and a stable gas protection layer is defined around the test head through the isolation cover, thereby preventing the formation of condensed water; the invention has simple structure and reasonable design, and can effectively solve the problem of formation of condensed water in the equipment.
Description
Technical Field
The invention relates to the field of semiconductor testing, in particular to a semiconductor testing device.
Background
In the field of semiconductor testing, when a low-temperature product is tested, the temperature of a testing head in direct contact with a product is low due to the low temperature of the product, so that the temperature in a certain range around the testing head is low, when the temperature is lower than the dew point temperature, condensed water can be formed around the testing head and on the surface of the testing head, the condensed water can cause short circuit of an electrical element of equipment, the equipment is damaged, and great potential safety hazards of the equipment exist.
Disclosure of Invention
In view of the above-described drawbacks or deficiencies in the prior art, it is desirable to provide a semiconductor test apparatus capable of preventing the generation of condensed water in the device.
In a first aspect, the present invention comprises: an air inlet pipe;
the test head protective cover is provided with an air outlet, and the air inlet pipe is communicated with the air outlet;
and the isolation cover is arranged around the test head protection cover and used for blocking outside gas from entering the test head protection cover.
Dry air is input through the air inlet pipe, a dry gas protection layer is formed around the test head, the wet air is prevented from contacting the low-temperature test head, the test head is separated from the surrounding environment through the isolation cover, a heat transfer path is isolated, the temperature of the surrounding environment is not influenced by the low-temperature test head, the environment temperature inside the equipment is higher than the dew point temperature, and the effect of preventing condensate water from being generated inside the equipment is achieved; furthermore, the isolation hood has a blocking effect on airflow blown in by the cooling fan, and dry gas input by the air inlet pipe is limited around the test head, so that the periphery of the test head is not interfered by external air humidity, the purity of the gas around the test head is ensured, the temperature of a dew point around the probe is reduced, and the generation of condensed water is prevented.
Further, the gas pressure sensor is arranged in the gas inlet pipe and is a gas flow sensor or a gas pressure sensor.
Furthermore, a gas flow sensor or a gas pressure sensor is arranged at the gas inlet end, the amount of air entering the testing head is monitored, and when the amount of air entering is smaller than a certain value and reaches a risk value formed by condensed water, early warning is carried out on a user in advance.
Furthermore, the bottom of the side wall of the isolation cover is horizontally and inwardly or outwardly provided with at least one fixing device, and the isolation cover can be fixed around the test head protection cover by arranging the fixing device.
Furthermore, the horizontal section of the isolation hood is of a rectangular structure, four fixing devices are formed inwards at the bottom of the side wall of the isolation hood, and the fixing devices are respectively located at the four corners of the isolation hood.
With fixing device all with set up on the inside wall of cage, make fixed power evenly exert on the cage, can make the lateral wall bottom surface and the infrabasal plate of every side of cage effectively contact, can play gaseous effect of blockking better
Preferably, the fixing device is a strip-shaped structure, the long side of the fixing device corresponds to the long side of the isolation cover, and the short side of the fixing device corresponds to the short side of the isolation cover.
Further, a groove vertically extending upwards from the bottom surface of the side wall to the top surface of the side wall is formed on the inner surface of the side wall of the isolation cover; the groove is arranged to avoid relevant parts in the equipment, and the existing mechanism is not interfered.
Furthermore, steps are formed at the bottoms of the side walls of the isolation cover horizontally and outwards, and the lower bottom surfaces of the steps and the lower bottom surface of the isolation cover are located on the same horizontal plane.
The step is formed outwards at the bottom of the side wall of the isolation cover, the step can increase the contact area between the bottom surface of the isolation cover and the lower substrate, the better sealing effect is achieved, the strength of the isolation cover is guaranteed, and then the isolation effect of the isolation cover is guaranteed.
Further, the isolation cover, the extension part and the step are integrally arranged.
Further, the isolation cover, the extension part and the step part are all made of an anti-static material, and the anti-static material is any one of polymethyl methacrylate, polyvinyl chloride, poly terephthalic acid diacetic acid and carbonic ester.
Advantageous effects
According to the invention, through arranging the air inlet pipe, the test head protection cover and the isolation cover which are communicated with the air inlet pipe, dehumidified compressed air is input into the air inlet pipe, gas flows into the test head protection cover through the air inlet pipe, and a stable gas protection layer is defined around the test head through the isolation cover, so that the surrounding humid gas cannot directly contact with the relatively cold test head, and the formation of condensed water is prevented;
in addition, a sensor is arranged on the air inlet pipe, the quantity of gas entering the air inlet pipe is monitored in real time through the sensor, and a user is reminded in time when the quantity of gas entering the air inlet pipe is too low, so that a protective gas layer cannot be effectively formed around the test head; the technical problem that condensed water is generated inside the equipment due to the fact that the testing temperature is too low can be effectively solved by arranging the isolation cover and the sensor, potential safety hazards of the equipment are eliminated, and the working safety of the semiconductor testing device is effectively guaranteed.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is an overall block diagram of an embodiment of the present invention;
FIG. 2 is a block diagram of an air inlet tube and test head protective cover of an embodiment of the present invention;
FIG. 3 is a perspective view of an embodiment of the invention;
FIG. 4 is a top view of a cage according to an embodiment of the present invention;
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 and 2, the present invention includes an intake pipe 1;
the test head protection cover 2 is provided with an air outlet 21, and the air inlet pipe 1 is communicated with the air outlet 21;
and the isolation cover 5 is arranged around the test head protection cover 2 and used for blocking outside air from entering the test head protection cover 2.
The test head protective cover 2 is fixed on the test head 3 through screws, and the air inlet pipe 1 is communicated with an air outlet 21 on the test head protective cover 2; when the low-temperature test of the product is carried out, the temperature of the product 7 is lower, the test head 3 can be in direct contact with the product 7 in the test process, the temperature of the test head 3 is further lower, the temperature of air around the test head 3 is also lower through heat transfer, when the temperature of the test head 3 and the temperature of air around the test head 3 are lower than the dew point temperature, condensed water can be formed in the test head 3, the product 7 and the cold air around the test head, and the condensed water can generate potential safety hazards to electrical elements of equipment.
According to the invention, the dehumidified compressed gas is input into the gas inlet pipe 1 and flows out from the gas outlet 21, so that a dry gas protection layer is formed around the test head 3 and the product 7, and the lower the content of water vapor in the gas is, the lower the dew point temperature is, so that the dry gas protection layer reduces the dew point temperature around the test head 3 and the product 7 to a very low value, so that the temperature of the test head 3 is higher than the dew point temperature, and the formation of condensed water is prevented.
But in actual working process, the airflow that blows in to the radiating radiator fan of storage strip in the equipment blows to test head 3, blows off dry gas protection layer, can make moist air blow in test head safety cover 2 in, makes test head 3 and moist air contact, still can have the comdenstion water to produce on making test head 3: as shown in fig. 1, the isolation cover 5 is arranged below the test head protection cover, the product 7 is also located inside the isolation cover 5, the isolation cover 5 is located around the test head protection cover 2 when a semiconductor test device performs a semiconductor test, the isolation cover 5 can block the gas blown by the cooling fan to the test head protection cover 2, the dry gas is limited within a certain range, a stable gas protection layer is formed, the test head 3 and the product 7 can be separated from the peripheral air by the isolation cover 5, the test head 3 is blocked, the product 7 and the peripheral air are subjected to heat transfer, the peripheral air temperature is prevented from being lower than the dew point temperature, and condensed water is prevented from being formed.
As shown in fig. 1 and 2, the present invention further includes a sensor 6 disposed on the intake pipe 1, the sensor 6 may be a pressure sensor or a flow sensor, when the amount of the dry compressed air inputted into the inlet pipe 1 is less than a certain value during the operation of the semiconductor test apparatus, the inability to form an effective dry gas blanket around the test head 3, risks condensate formation, by arranging the sensor 6 on the air inlet pipe 1, the air inlet quantity of the dry compressed air entering the air inlet pipe 1 is monitored in real time, when the amount of intake air of the dry compressed air entering the intake pipe 1 is below a certain value with a risk of generating condensed water, the alarm reminding device can timely alarm and remind a user, the user can timely check according to the alarm information, the fault is eliminated, the air input of the dry air is guaranteed, and therefore the effect of preventing condensation is achieved.
As shown in fig. 3 and 4, at least one fixing device 51 is further disposed horizontally inward or outward from the bottom of the sidewall of the isolation cover 5, and the isolation cover 5 is fixed through a through hole 52 disposed on the fixing device 51.
The fixing device 51 and the through hole 52 are arranged according to the position of an original structural hole in the equipment, and the isolation cover 5 is fixed by using the original structural hole in the equipment, so that the installation can be simplified, additional fixing hole positions do not need to be added in the equipment, the installation is convenient, and the existing structure in the equipment is not interfered; further, the through-hole 52 may be a circular hole, a bar-shaped hole, or the like.
Preferably, the through hole 52 is a countersunk through hole, and the head of the bolt for fixing the isolation cover 5 is embedded into the countersunk through hole, so that the end of the bolt does not influence the existing mechanism in the equipment and the work of the equipment.
As shown in fig. 3 and 4, the isolation cover 5 is further configured to be rectangular in cross section according to the shape of the test head 3, and the fixing device 51 is arranged on the inner side of the isolation cover 5 according to the internal structure of the device; the lateral wall bottom of cage 5 inwards is formed with four fixing device 51, and fixing device 51 is located respectively the four corners position of cage evenly sets up fixing device 51 on cage 5, sets up like this and makes when fixing cage 5 through fixing device 51, and the force that makes cage 5 receive is more even, makes each lateral wall of cage 5 and infrabasal plate can effective contact, prevents that the air current from getting into in the cage from the gap between cage 5 and the base plate, can play gaseous effect of blockking better.
As shown in fig. 3 and 4, it is preferable that the fixing means 51 is formed in a strip-shaped structure without interfering with the mechanism and operation in the apparatus, the long side of the fixing means 51 corresponds to the long side of the shield case 5, and the short side of the fixing means 51 corresponds to the short side of the shield case 1.
As shown in fig. 3 and 4, the inner surface of the sidewall of the isolation cover 5 is formed with a groove 53 extending vertically upward from the bottom surface of the sidewall to the top surface of the sidewall. Through setting up recess 53 can dodge the inside structural component of equipment, does not influence the normal work of equipment.
Further, steps 54 can be arranged on the side wall of the isolation cover 5, the bottom surface of each step 54 is located at the same horizontal plane with the bottom surface of the isolation cover 5, and the steps 54 can enlarge the contact surface between the isolation cover 5 and the lower substrate 4, so that the effect of blocking air flow can be better achieved, and a better isolation effect can be achieved.
As shown in fig. 3 and 4, as a preferred embodiment, according to the internal structure of the apparatus, steps 54 are provided only on the bottom portions of the two side walls corresponding to the two short sides of the shield 5 horizontally and outwardly without interfering with the internal mechanism of the apparatus, and the lower surfaces of the steps 54 and the bottom surface of the shield 5 are located on the same horizontal plane.
Further, the shielding case 5, the fixing device 51 and the step 54 are integrally provided.
The isolation hood 5, the fixing device 51 and the step 54 are made of an antistatic material, and the antistatic material can be any one of polymethyl methacrylate, polyvinyl chloride, poly terephthalic acid diacetic acid and carbonic ester.
The isolation cover 5, the fixing device 51 and the step 54 are integrally formed, can be prepared by injection molding, extrusion, 3D printing or other processes of a grinding tool, can simplify the production process and reduce the production cost by integral arrangement; because the semiconductor device is damaged due to the discharge of static electricity generated in the semiconductor testing process, and the static electricity can also make the semiconductor device adsorb floating dust in a workshop to influence the testing of the semiconductor testing device, the isolation cover 5, the fixing device 51 and the step 54 are all made of anti-static materials, and the anti-static materials can be any one of polymethyl methacrylate, polyvinyl chloride, poly terephthalic acid diacetic acid and carbonic ester.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (9)
1. A semiconductor test apparatus, comprising:
an air inlet pipe;
the test head protective cover is provided with an air outlet, and the air inlet pipe is communicated with the air outlet;
the isolation cover is arranged around the test head protection cover and used for blocking outside air from entering the test head protection cover.
2. The semiconductor test apparatus of claim 1, further comprising a sensor disposed at the inlet duct, the sensor being a gas flow sensor or a gas pressure sensor.
3. The semiconductor test apparatus of claim 1, wherein the bottom of the sidewall of the cage is formed horizontally inward or outward with at least one fixture.
4. The semiconductor test device according to claim 3, wherein the horizontal cross section of the isolation hood is rectangular, and four fixing devices are horizontally formed in the bottom of the side wall of the isolation hood, and are respectively located at four corners of the isolation hood.
5. The semiconductor test device of claim 4, wherein the fixture is an elongated structure, a short side of the fixture is connected with a short side of the cage, and a long side of the fixture is connected with a long side of the cage.
6. The semiconductor test apparatus of claim 1, wherein the inner surface of the sidewall of the cage is formed with a groove extending vertically upward from the bottom surface of the sidewall to the top surface of the sidewall.
7. The semiconductor test device according to any one of claims 1 to 6, wherein the bottom of the sidewall of the isolation hood is horizontally and outwardly stepped, and the lower surface of the step is located at the same level as the bottom surface of the isolation hood.
8. The semiconductor test apparatus of any one of claims 3 to 6, wherein the shield, the fixture and the step are integrally provided.
9. The semiconductor test device of claim 8, wherein the isolation cover, the fixture and the step are made of an antistatic material, and the antistatic material is any one of polymethyl methacrylate, polyvinyl chloride, poly terephthalic diacetic acid and carbonate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911054866.XA CN110673011A (en) | 2019-10-31 | 2019-10-31 | Semiconductor testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911054866.XA CN110673011A (en) | 2019-10-31 | 2019-10-31 | Semiconductor testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110673011A true CN110673011A (en) | 2020-01-10 |
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ID=69085456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911054866.XA Pending CN110673011A (en) | 2019-10-31 | 2019-10-31 | Semiconductor testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110673011A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113791327A (en) * | 2021-09-16 | 2021-12-14 | 王华江 | Semiconductor device test equipment |
| CN114347677A (en) * | 2021-12-24 | 2022-04-15 | 深圳弘美数码纺织技术有限公司 | Method and device for controlling temperature of spray head of printing trolley and printer |
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| CN106322965A (en) * | 2016-09-22 | 2017-01-11 | 山东大学 | Solar brown coal drying system capable of intelligently adjusting power of fan according to air inlet temperature |
| CN205976912U (en) * | 2016-06-24 | 2017-02-22 | 中建海峡建设发展有限公司 | Aluminum alloy window family fixing device |
| CN108037321A (en) * | 2016-10-25 | 2018-05-15 | 致茂电子股份有限公司 | Anti-dewing module of test socket and electronic element detection device with same |
| CN207556562U (en) * | 2017-07-31 | 2018-06-29 | 摩瑞尔电器（昆山）有限公司 | Environmental detection set with high leakproofness integral sensor protective cover |
| CN207834992U (en) * | 2017-12-25 | 2018-09-07 | 中建八局第一建设有限公司 | A kind of terminal box antiseep protection face board device |
| CN209264789U (en) * | 2018-12-07 | 2019-08-16 | 苏州苏纳光电有限公司 | It is capable of the test probe station of Cryogenic Temperature Swing test |
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2019
- 2019-10-31 CN CN201911054866.XA patent/CN110673011A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2355015Y (en) * | 1998-12-31 | 1999-12-22 | 昆明重工(集团)股份有限公司 | Sealed cover |
| JP4384006B2 (en) * | 2004-10-28 | 2009-12-16 | 株式会社リガク | X-ray detector |
| CN103901359A (en) * | 2012-12-31 | 2014-07-02 | 致茂电子(苏州)有限公司 | Test platform with dry environment |
| CN105005224A (en) * | 2015-06-24 | 2015-10-28 | 江苏德厚机电有限公司 | Dryer control unit maintaining constant regeneration air consumption rate |
| CN205670185U (en) * | 2016-06-08 | 2016-11-02 | 中芯国际集成电路制造（天津）有限公司 | Quasiconductor device for testing functions |
| CN205976912U (en) * | 2016-06-24 | 2017-02-22 | 中建海峡建设发展有限公司 | Aluminum alloy window family fixing device |
| CN106322965A (en) * | 2016-09-22 | 2017-01-11 | 山东大学 | Solar brown coal drying system capable of intelligently adjusting power of fan according to air inlet temperature |
| CN108037321A (en) * | 2016-10-25 | 2018-05-15 | 致茂电子股份有限公司 | Anti-dewing module of test socket and electronic element detection device with same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113791327A (en) * | 2021-09-16 | 2021-12-14 | 王华江 | Semiconductor device test equipment |
| CN114347677A (en) * | 2021-12-24 | 2022-04-15 | 深圳弘美数码纺织技术有限公司 | Method and device for controlling temperature of spray head of printing trolley and printer |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200110 |
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| RJ01 | Rejection of invention patent application after publication |