CN110657746A - Split type precision measurement device - Google Patents

Split type precision measurement device Download PDF

Info

Publication number
CN110657746A
CN110657746A CN201810698742.4A CN201810698742A CN110657746A CN 110657746 A CN110657746 A CN 110657746A CN 201810698742 A CN201810698742 A CN 201810698742A CN 110657746 A CN110657746 A CN 110657746A
Authority
CN
China
Prior art keywords
unit
detection
measuring
displacement
mounting frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810698742.4A
Other languages
Chinese (zh)
Inventor
李新振
廖飞红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN201810698742.4A priority Critical patent/CN110657746A/en
Publication of CN110657746A publication Critical patent/CN110657746A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques

Abstract

The invention discloses a split type precision measurement device which comprises a measured object bearing unit, a detection unit and a detection bearing unit. The detection bearing unit is used for bearing the detection unit, and the detection unit can move on the detection bearing unit along the X direction; the tested object bearing unit and the detection bearing unit can move relatively along the Y direction; the displacement measuring unit is used for measuring the relative displacement of the measured object bearing unit and the detecting unit in the X direction and the relative displacement of the measured object bearing unit and the detecting bearing unit in the Y direction; the measured object bearing unit, the detection bearing unit and the displacement measuring unit are respectively arranged on the first installation frame, the second installation frame and the third installation frame. According to the invention, the measured object bearing unit, the detection bearing unit and the displacement measurement unit are respectively arranged on the first installation frame, the second installation frame and the third installation frame which are separated, so that the influence of the movement of the measured object bearing unit or the detection bearing unit on the measurement precision of the displacement measurement unit is avoided.

Description

Split type precision measurement device
Technical Field
The embodiment of the invention relates to an optical detection technology, in particular to a split type precision measurement device.
Background
Precision optical measurement devices are commonly used for precision measurement in the semiconductor field, for example, for measuring Total Pitch (TP) variation, line width (CD), Overlay accuracy (OL), and the like of an exposure pattern on a TFT substrate. Fig. 1 is a top view of a precision measuring apparatus in the prior art, and as shown in fig. 1, the precision measuring apparatus mainly includes the following parts: a mounting frame 10 for carrying the entire measuring device; an object-to-be-tested carrying unit 20 for carrying an object to be tested (TFT substrate); a detection carrying unit 30 for carrying the detection unit 40, the detection unit 40 being movable in the X direction; two architectures that the object bearing unit 20 does not move in the Y direction, the detection bearing unit 30 moves in the Y direction, or the object bearing unit 20 moves in the Y direction, and the detection bearing unit 30 does not move in the Y direction are provided, and fig. 1 illustrates an architecture that the object bearing unit 20 moves in the Y direction and the detection bearing unit 30 does not move in the Y direction as an example; and an interferometer measuring unit 50 for measuring the horizontal (including X and Y directions) movement positions of the measured object carrying unit 20 and the detecting unit 40. The detection unit 40 captures the detection mark on the object to be detected and sends the detection mark to the image processing sensor, the image processing sensor performs image processing algorithm processing such as calibration, template matching and the like on the collected detection mark and image information to obtain the pixel position coordinate of the collected detection mark, and the physical coordinate of the detection mark on the object to be detected is finally obtained by combining the position information measured by the interferometer measurement unit 50, so that the distance between any two detection marks on the object to be detected can be obtained. Further, the total pitch deviation, line width and overlay accuracy of the exposure pattern on the TFT substrate can be obtained.
The measurement accuracy of the precision measurement platform is mainly affected by the following aspects:
1. the movement of the object carrying unit 20 or the detection carrying unit 30 causes the mounting frame 10 to be deformed, and the amount of deformation of the mounting frame 10 is different at different positions, and the references (such as the interferometer and the light guide element) of the interferometer measuring unit 50 are mounted on the mounting frame 10, and the deformation of the mounting frame 10 affects the measurement reference of the interferometer measuring unit 50, thereby introducing measurement errors.
2. For the framework of the movement of the object bearing unit, since the detecting bearing unit 30 and the object bearing unit 20 are mounted on the same mounting frame 10, the deformation of the mounting frame 10 caused by the movement of the object bearing unit 20 may affect the detecting bearing unit 30, and further affect the position accuracy of the detecting unit 40, thereby introducing a measurement error.
3. For the framework of detecting the movement of the bearing unit 30, since the detecting bearing unit 30 and the object bearing unit 20 are mounted on the same mounting frame 10, the deformation of the mounting frame 10 caused by the movement of the detecting bearing unit 30 may affect the object bearing unit 20, and further affect the position accuracy of the object to be measured on the object bearing unit 20 or the measurement mirror of the interferometer measurement unit 50 mounted on the object bearing unit 20, thereby introducing a measurement error.
Disclosure of Invention
The invention provides a split type precision measuring device, which aims to reduce or even eliminate the influence of the movement of a measured object bearing unit or a detection bearing unit on the measurement precision of a displacement measuring unit, improve the measurement precision of the displacement measuring unit and further improve the detection accuracy of the detection unit.
The embodiment of the invention provides a split type precision measurement device, which is characterized by comprising the following components:
the measured object bearing unit is used for bearing the measured object;
the detection unit is used for detecting a detected object;
the detection bearing unit is used for bearing the detection unit, and the detection unit can move on the detection bearing unit along the X direction;
the tested object bearing unit and the detection bearing unit can move relatively along the Y direction; the X direction and the Y direction are horizontally orthogonal;
the displacement measuring unit comprises a first displacement measuring unit and a second displacement measuring unit, the first displacement measuring unit is used for measuring the relative displacement of the measured object bearing unit and the detecting unit in the X direction, and the second displacement measuring unit is used for measuring the relative displacement of the measured object bearing unit and the detecting bearing unit in the Y direction;
the measured object bearing unit, the detection bearing unit and the displacement measuring unit are respectively arranged on the first installation frame, the second installation frame and the third installation frame, and the first installation frame, the second installation frame and the third installation frame are mutually independently arranged.
Optionally, the third mounting frame comprises an L-shaped structure consisting of a first part and a second part, the first part being parallel to the Y-direction and the second part being parallel to the X-direction, the first mounting frame and the second mounting frame being located inside the L-shaped structure.
Optionally, a plurality of first guide rails distributed along the Y direction are arranged on the first mounting frame, the object to be tested can move along the Y direction of the first guide rails, and the detection bearing unit is fixedly mounted on the second mounting frame.
Optionally, a second guide rail distributed along the Y direction is arranged on the second mounting frame, the detection bearing unit can move along the Y direction of the second guide rail, and the detected object bearing unit is fixedly mounted on the first mounting frame.
Optionally, the object to be detected is a substrate table, the detecting and bearing unit is a gantry frame, and the detecting unit is connected with a cross beam of the gantry frame through an air bearing and can move in the X direction along the cross beam.
Optionally, the detection unit is a CCD camera for capturing image information of the object to be detected.
Optionally, the first displacement measuring unit includes a plurality of first interferometer measuring assemblies, and is configured to measure relative displacement between the object-to-be-measured carrying unit and the detecting unit in the X direction, and relative position offset in Rx, Ry, and Rz directions; the second displacement measurement unit comprises a plurality of second interferometer measurement assemblies for measuring the relative displacement of the object bearing unit and the detection bearing unit in the Y direction and the relative position offset in the Rx direction, the Ry direction and the Rz direction.
Optionally, the first interferometers of the first interferometer measuring assemblies are mounted on the third mounting frame, and the first mirrors of the first interferometer measuring assemblies are correspondingly mounted on the detecting unit; or the first interferometers of the first interferometer measuring assemblies are arranged on the detection unit, and the first reflectors of the first interferometer measuring assemblies are correspondingly arranged on the third mounting frame.
Optionally, the second interferometers of the second interferometer measuring assemblies are mounted on the third mounting frame, and the second reflectors of the second interferometer measuring assemblies are correspondingly mounted on the measured object carrying unit or/and the detection carrying unit.
Optionally, the displacement measuring unit further includes a third displacement measuring unit, and the third displacement measuring unit is configured to measure a relative offset between the measured object carrying unit and the third mounting frame in the X direction.
Optionally, the bottom of the first mounting frame and the bottom of the third mounting frame are respectively provided with a first damping unit and a second damping unit.
Optionally, the split type precision measurement device further comprises six sets of displacement sensors, which are used for measuring the relative displacement of the first mounting frame and the third mounting frame in the X, Y, Z, Rx, Ry and Rz directions; wherein the Z direction is a vertical direction perpendicular to the X and Y directions.
Optionally, the bottom of the second mounting frame and the bottom of the third mounting frame are respectively provided with a third damping unit and a fourth damping unit.
Optionally, the split type precision measurement device further comprises six sets of displacement sensors, which are used for measuring the relative displacement of the first mounting frame and the third mounting frame in the X, Y, Z, Rx, Ry and Rz directions; wherein the Z direction is a vertical direction perpendicular to the X and Y directions.
According to the split type precision measurement device provided by the embodiment of the invention, the measured object bearing unit, the detection bearing unit and the displacement measurement unit are respectively arranged on the first installation frame, the second installation frame and the third installation frame which are independently arranged, so that the influence of the movement of the measured object bearing unit or the detection bearing unit on the measurement precision of the displacement measurement unit is reduced or even eliminated, and the measurement precision of the displacement measurement unit and the detection accuracy of the detection unit are improved.
Drawings
FIG. 1 is a top view of a prior art precision measurement apparatus;
fig. 2 is a top view of a split type precision measurement apparatus according to an embodiment of the present invention;
fig. 3 is a layout view of the displacement sensors on the first mounting frame and the third mounting frame in the first embodiment of the present invention;
fig. 4 is a top view of a split type precision measurement apparatus according to a second embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Fig. 2 is a top view of the split type precision measuring apparatus according to the first embodiment of the present invention, and referring to fig. 2, the split type precision measuring apparatus includes an object to be measured carrying unit 100, a detecting unit 110, a detecting carrying unit 120, a displacement measuring unit, a first mounting frame 140, a second mounting frame 150, and a third mounting frame 160.
The measured object bearing unit 100 is mounted on the first mounting frame 140 and is used for bearing the measured object; the detecting and carrying unit 120 is fixedly installed on the second installation frame 150 for carrying the detecting unit 110; the detecting unit 110 can move on the detecting and carrying unit 120 along the X direction, and is used for detecting the object to be detected on the object to be detected carrying unit 100; the object bearing unit 100 can move on the first mounting frame 140 along the Y direction, and the X direction and the Y direction are horizontally orthogonal; the displacement measuring unit includes a first displacement measuring unit and a second displacement measuring unit, both of which are mounted on the third mounting frame 160, the first displacement measuring unit being configured to measure the displacement of the detecting unit 110 in the X direction, and the second displacement measuring unit being configured to measure the displacement of the measured object carrying unit 100 in the Y direction.
The measured object bearing unit 100, the detection bearing unit 120 and the displacement measuring unit are installed separately and respectively installed on the first installation frame 140, the second installation frame 150 and the third installation frame 160, and the first installation frame 140, the second installation frame 150 and the third installation frame 160 are arranged independently. The movement of the object bearing unit 100 does not affect the measurement accuracy of the detecting unit 110 or the displacement measuring unit.
According to the split type precision measurement device provided by the embodiment of the invention, the measured object bearing unit, the detection bearing unit and the displacement measurement unit are respectively arranged on the first mounting frame, the second mounting frame and the third mounting frame which are independently arranged, so that the influence of the movement of the measured object bearing unit or the detection bearing unit on the measurement precision of the displacement measurement unit is reduced or even eliminated; meanwhile, the influence of the movement of the bearing unit of the measured object on the detection unit on the bearing unit of the measured object is avoided, or the influence of the movement of the bearing unit of the detected object on the bearing unit of the measured object is avoided, and the measurement precision of the displacement measurement unit and the detection accuracy of the detection unit are improved.
With continued reference to fig. 2, optionally, the third mounting frame 160 comprises an L-shaped structure consisting of a first portion 161 and a second portion 162, the first portion 161 being parallel to the Y-direction and the second portion 162 being parallel to the X-direction, the first mounting frame 140 and the second mounting frame 150 being located inside the L-shaped structure.
With continued reference to fig. 2, optionally, in the split type precision measuring apparatus shown in fig. 2, the displacement measuring unit includes a first displacement measuring unit and a second displacement measuring unit. Optionally, the first displacement measuring unit includes a plurality of first interferometer measuring assemblies, and the first interferometer measuring assemblies include a first interferometer 131 and a first reflecting mirror 111 disposed opposite to the first interferometer; the second displacement measuring unit comprises a number of second interferometer measurement assemblies comprising a second interferometer 132 and an oppositely arranged second mirror 101.
Alternatively, the first interferometers 131 of the first interferometer measurement assemblies are mounted on the first portion 161 of the third mounting frame 160, and the first mirrors 111 are correspondingly mounted on the detection unit 110. In other embodiments, the plurality of first interferometers 131 are mounted on the detection unit 110, and the plurality of first mirrors 111 are correspondingly mounted on the first portion 161 of the third mounting frame 160.
A plurality of second interferometers 132 are mounted on the second portion 162 of the third mounting frame 160 and a plurality of second mirrors 101 are correspondingly mounted on the object-carrying unit 100.
With reference to fig. 2, optionally, a plurality of first guide rails 141 distributed along the Y direction are disposed on the first mounting frame 140, the object-to-be-detected carrying unit 100 can move along the first guide rails 141 in the Y direction, and the detection carrying unit 120 is fixedly mounted on the second mounting frame.
Illustratively, in one embodiment, the split-type precision measuring device is used for detecting the overlay accuracy of the exposure pattern on the TFT substrate. In a semiconductor process, photolithography is a crucial step, and a process of transferring a mask pattern onto a substrate can be realized through a series of steps such as alignment, exposure, and the like of photolithography. Generally, in the process of forming a semiconductor chip, a multi-layer photolithography process is required to complete the entire manufacturing process. Therefore, the alignment of the position of the lithography patterns of adjacent layers becomes particularly important. The overlay accuracy refers to the position alignment error of the adjacent layer of the photoetching pattern on the substrate. In each layer of photoetching process engineering, besides a required exposure pattern, an overlay mark corresponding to the exposure pattern of the layer is also formed, and the relative offset of the overlay marks of adjacent layers is detected through a microscope, a camera, an image processing device and the like, so that the overlay accuracy is obtained.
In this embodiment, the mounting frame is a marble base, and the object-to-be-tested carrying unit 100 is a substrate table for carrying a TFT substrate to be tested; the detection bearing unit 120 is a gantry frame; the detection unit 110 is a CCD camera, is connected to the beam of the gantry frame through an air bearing, can move along the beam in the X direction, and is used to capture image information of the TFT substrate. The CCD camera captures the overlay mark on the TFT substrate, pixel coordinates of the overlay mark are obtained after processing, the position information is measured by combining the displacement measuring unit, the physical coordinates of the overlay mark are obtained, and then the relative offset of the overlay mark of the exposure graph of the adjacent layer can be obtained, so that the overlay precision is obtained. It should be noted that the split type precision measurement apparatus of the embodiment of the present invention may also be used for other precision measurements in the semiconductor field, such as measuring the total pitch deviation, line width, film thickness, and the like of an exposure pattern on a TFT substrate, and the detailed measurement principle of the present invention is not described herein again.
At present, on a measuring table of 6 generations or below, in order to improve the measuring accuracy, the main solutions are to improve the rigidity of a marble base (increase the thickness), improve the rigidity of a cross beam in a gantry assembly (adopt a ceramic cross beam), and improve the rigidity of a support of a displacement measuring unit.
However, with the increase of the generation, the weight of the substrate table and the gantry assembly is increased correspondingly, the measurement accuracy is more easily affected by the movement of the substrate table or the gantry assembly, but the requirement of the measurement accuracy is not reduced, which increases the design difficulty of the measurement table. Therefore, the solution for the measuring table of 6 generations and below is more laborious on the measuring table of 6 generations and above.
The split type precision measurement device provided by the embodiment of the invention is used for detecting the alignment precision of an exposure pattern on a TFT substrate, and the substrate table, the gantry assembly and the displacement measurement unit are respectively arranged on the first marble base, the second marble base and the third marble base which are independently arranged, so that the influence of the movement of the substrate table or the gantry assembly on the measurement precision of the displacement measurement unit is reduced or even eliminated; meanwhile, the influence of the movement of the substrate table on the position precision of the CCD camera on the gantry assembly is avoided, the measurement precision of the displacement measurement unit is improved, and the detection precision is further improved.
With continued reference to fig. 2, optionally, the first displacement measurement unit includes a number of first interferometer measurement assemblies for measuring displacements of the detection unit 110 in the X-direction, and positional offsets in the Rx, Ry, and Rz directions; the positional deviations in the Rx, Ry, and Rz directions are the positional deviations generated by the rotation of the measurement detection unit 110 around the X direction, the Y direction, and the Z direction, respectively. The second displacement measurement unit includes a plurality of second interferometer measurement assemblies for measuring the displacement of the object carrying unit 100 in the Y direction and the positional deviation in the Rx, Ry, and Rz directions. It should be noted that fig. 2 is a top view of a split type precision measurement apparatus provided in an embodiment of the present invention, in which all the interferometer measurement assemblies cannot be shown, and only 2 first interferometer measurement assemblies of the first displacement measurement unit are shown, which are used for measuring the displacement of the detection unit 110 in the X direction and the position offset in the Rz direction. Similarly, the second displacement measuring unit shows only 2 first interferometer measurement assemblies for measuring the displacement of the measured object carrying unit 100 in the Y direction and the positional deviation in the Rz direction.
With continued reference to fig. 2, optionally, the displacement measuring unit further comprises a third displacement measuring unit comprising a third interferometer 133 and an oppositely disposed third mirror 102. The third interferometer 133 is mounted on the first portion 161 of the third mounting frame 160, the third mirror 102 is relatively mounted on the measured object carrying unit 100, and the third displacement measuring unit is used for measuring the relative offset of the measured object carrying unit 100 and the third mounting frame 160 in the X direction.
With continued reference to fig. 2, optionally, the bottom of the first and third mounting frames 140 and 160 are respectively provided with a first and second shock absorption units, and the first and second shock absorption units respectively comprise a plurality of shock absorbers 170, which are respectively and uniformly distributed at the bottom of the first and third mounting frames 140 and 160, for isolating foundation vibration. Therefore, although the first mounting frame 140 and the third mounting frame 160 are separately mounted on the independent first mounting frame 140 and third mounting frame 160 in order to isolate the influence of the measured object carrying unit 100 on the displacement measuring unit, there is a problem that the first mounting frame 140 and the third mounting frame 160 are each supported by the independent damper 170, and the damper 170 is floating-supported, which inevitably causes positional fluctuation therebetween, but the fluctuation of the damper 170 is much smaller than the influence of the movement of the measured object carrying unit 100 on the displacement measuring unit, and in order to further improve the measurement accuracy, it is necessary to solve the influence of the positional fluctuation of the first mounting frame 140 and the third mounting frame 160 on the measurement accuracy. Fig. 3 is a layout diagram of displacement sensors on the first mounting frame and the third mounting frame in the first embodiment of the present invention, and referring to fig. 3, six sets of displacement sensors, respectively the sensors A, B, C, D, E, F, are disposed on the first mounting frame 140 or the third mounting frame 160 for measuring the relative displacement of the first mounting frame 140 and the third mounting frame 160 in the X, Y, Z, Rx, Ry and Rz directions. The sensor A is used for measuring relative displacement in the X direction, the sensors B and C are used for measuring relative displacement in the Y direction and the Rz direction, the sensors D and E are used for measuring relative displacement in the Z direction and the Rx direction, and the sensors E and F are used for measuring displacement in the Z direction and the Ry direction.
The displacement measuring unit is also used for receiving data measured by the third displacement measuring unit and the displacement sensor, and compensating the measured value measured by the displacement measuring unit according to the data, so that the measurement precision of the displacement measuring unit is further improved.
Example two
Fig. 4 is a top view of the split type precision measurement apparatus according to the second embodiment of the present invention, and referring to fig. 4, the split type precision measurement apparatus includes an object to be measured carrying unit 200, a detection unit 210, a detection carrying unit 220, a displacement measurement unit, a first mounting frame 240, a second mounting frame 250, and a third mounting frame 260. The third mounting frame 260 comprises an L-shaped structure consisting of a first part 261 and a second part 262, the first part 261 being parallel to the Y-direction and the second part 262 being parallel to the X-direction, the first mounting frame 240 and the second mounting frame 250 being located inside the L-shaped structure.
The object-to-be-measured carrying unit 200 is fixedly mounted on the first mounting frame 240, and is used for carrying an object to be measured. The sensing carrying unit 220 is mounted on the second mounting frame 250 for carrying the sensing unit 210. The second mounting frame 250 is provided with a second guide rail 251 distributed along the Y direction, and the detection carrying unit 220 can move along the second guide rail 251 in the Y direction to drive the detection unit 210 to move in the Y direction. The detecting unit 210 is movable on the detecting and carrying unit 220 along the X direction for detecting the object to be detected on the object to be detected carrying unit 200. The displacement measuring unit includes a first displacement measuring unit including a plurality of first interferometer measuring assemblies each including a first interferometer 231 and a first mirror 263 disposed opposite to each other, and a second displacement measuring unit. The first displacement measuring unit is used for measuring the displacement of the detecting unit 210 in the X direction, but since the detecting unit 210 and the detecting carrying unit 220 move together in the Y direction, if the first interferometer 231 of the first displacement measuring unit is fixedly mounted on the third mounting frame 260, the displacement of the detecting unit 210 in the X direction cannot be measured. Accordingly, the first interferometer 231 of the first displacement measuring unit is fixedly installed on the sensing unit 210, and the first reflecting mirror 263 having a long bar shape is installed on the first portion 261 of the third mounting frame 260. The second displacement measuring unit includes a plurality of second interferometer measurement assemblies, each of which includes a second interferometer 232 and an oppositely disposed second mirror 221, the second interferometer 232 being mounted on the second portion 262 of the third mounting frame 260, the second displacement measuring unit being for measuring a displacement of the inspection carrying unit 220 in the Y direction.
Continuing to refer to fig. 4, exemplarily, in one embodiment, the object-to-be-tested carrying unit 200 is a substrate stage for carrying a TFT substrate to be tested; the detection bearing unit 220 is a gantry frame; the detection unit 210 is a CCD camera, is connected to the beam of the gantry frame through an air bearing, can move along the beam in the X direction, and is used for capturing image information of the TFT substrate. The CCD camera captures the overlay mark on the TFT substrate, pixel coordinates of the overlay mark are obtained after processing, the physical coordinates of the overlay mark are obtained by combining position information measured by the displacement measuring unit, and then the relative offset of the overlay mark of the exposure pattern of the adjacent layer can be obtained, so that the overlay precision is obtained. It should be noted that, in this embodiment, the split type precision measurement apparatus of the present invention is exemplarily illustrated to be used for detecting the overlay accuracy of the exposure pattern of the TFT substrate, and in fact, the split type precision measurement apparatus of the present invention may also be used for other detection items, and the present invention is not limited herein.
With continued reference to fig. 4, the first displacement measurement unit includes a number of first interferometer measurement assemblies for measuring displacements of the detection unit 210 in the X direction, and positional offsets in the Rx, Ry, and Rz directions; the second displacement measurement unit includes a plurality of second interferometer measurement assemblies for measuring the displacement of the detection carrying unit 220 in the Y direction and the positional deviation in the Rx, Ry, and Rz directions. It should be noted that fig. 4 is a top view of a split type precision measurement apparatus according to the second embodiment of the present invention, in which all interferometers cannot be shown, and only 2 first interferometers 231 of the first displacement measurement unit are shown for measuring the displacement of the detection unit 210 in the X direction and the positional deviation in the Rz direction. Similarly, the second displacement measuring unit shows only 2 second interferometers 232 for measuring the displacement of the detection carrying unit 220 in the Y direction and the positional deviation in the Rz direction.
With continued reference to fig. 4, the split precision measuring apparatus further includes a third displacement measuring unit including a third interferometer 233 and an oppositely disposed third mirror 264. The third interferometer 233 is mounted on the measured object carrying unit 200, and the third mirror 264 is mounted on the first portion 261 of the third mounting frame 260, and the third displacement measuring unit is used for measuring the relative offset amount in the X direction of the measured object carrying unit 200 and the third mounting frame 260. Since the movement of the detection carrying unit 220 will block the optical path, the beam splitter 280 is used to deflect the optical path, so that the optical path avoids the limit boundary of the movement of the detection carrying unit 220.
With continued reference to fig. 4, the bottom of the second and third mounting frames 250 and 260 are respectively provided with a first and second shock absorption units, and the first and second shock absorption units respectively comprise a plurality of shock absorbers 270 respectively and uniformly distributed at the bottom of the second and third mounting frames 250 and 260 for isolating foundation vibration. The problem thus introduced is that the second mounting frame 250 and the third mounting frame 260 are each supported by a separate damper 270, and the damper 270 is floating support, which inevitably causes positional fluctuation therebetween, but the fluctuation of the damper 270 is much smaller than the influence of the movement of the detection carrying unit 220 on the displacement measuring unit, and in order to further improve the measurement accuracy, it is necessary to solve the influence of the positional fluctuation of the second mounting frame 250 and the third mounting frame 260 on the measurement accuracy. Specifically, the second mounting frame 250 or the third mounting frame 260 is provided with six sets of displacement sensors for measuring the relative displacement of the second mounting frame 250 and the third mounting frame 260 in the X, Y, Z, Rx, Ry and Rz directions.
The displacement measuring unit is also used for receiving data measured by the third displacement measuring unit and the displacement sensor, and compensating the measured value measured by the displacement measuring unit according to the data, so that the measuring precision of the displacement measuring unit is further improved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (14)

1. A split type precision measuring device, comprising:
the measured object bearing unit is used for bearing the measured object;
the detection unit is used for detecting a detected object;
the detection bearing unit is used for bearing the detection unit, and the detection unit can move on the detection bearing unit along the X direction;
the bearing unit of the object to be detected and the detection bearing unit can move relatively along the Y direction; the X direction and the Y direction are horizontally orthogonal;
the displacement measuring unit comprises a first displacement measuring unit and a second displacement measuring unit, the first displacement measuring unit is used for measuring the relative displacement of the measured object bearing unit and the detecting unit in the X direction, and the second displacement measuring unit is used for measuring the relative displacement of the measured object bearing unit and the detecting bearing unit in the Y direction;
the measured object bearing unit, the detection bearing unit and the displacement measurement unit are respectively installed on the first installation frame, the second installation frame and the third installation frame, and the first installation frame, the second installation frame and the third installation frame are mutually independently arranged.
2. The split type precision measuring device according to claim 1, wherein the third mounting frame comprises an L-shaped structure composed of a first portion and a second portion, the first portion is parallel to the Y direction, the second portion is parallel to the X direction, and the first mounting frame and the second mounting frame are located inside the L-shaped structure.
3. The split type precision measurement device according to claim 1, wherein the first mounting frame is provided with a plurality of first guide rails distributed along a Y direction, the object to be measured carrying unit can move along the Y direction of the first guide rails, and the detection carrying unit is fixedly mounted on the second mounting frame.
4. The split type precision measurement device according to claim 1, wherein the second mounting frame is provided with second guide rails distributed along the Y direction, the detection carrying unit is movable along the Y direction of the second guide rails, and the measured object carrying unit is fixedly mounted on the first mounting frame.
5. The split type precision measurement device according to claim 3 or 4, wherein the object to be measured is a substrate table, the detection bearing unit is a gantry frame, and the detection unit is connected to a cross beam of the gantry frame through an air bearing and can move in the X direction along the cross beam.
6. The split type precision measuring device according to claim 5, wherein the detecting unit is a CCD camera for capturing image information of the object to be detected.
7. The split type precision measurement device according to claim 1, wherein the first displacement measurement unit includes a plurality of first interferometer measurement assemblies for measuring relative displacements of the measured object carrying unit and the detection unit in an X direction and relative positional offsets in Rx, Ry, and Rz directions; the second displacement measurement unit comprises a plurality of second interferometer measurement assemblies and is used for measuring the relative displacement of the measured object bearing unit and the detection bearing unit in the Y direction and the relative position offset in the Rx direction, the Ry direction and the Rz direction.
8. The split type precision measurement device according to claim 7, wherein the first interferometer of the plurality of first interferometer measurement assemblies is mounted on the third mounting frame, and the first reflection mirror of the plurality of first interferometer measurement assemblies is correspondingly mounted on the detection unit; or the first interferometers of the first interferometer measuring assemblies are arranged on the detection unit, and the first reflectors of the first interferometer measuring assemblies are correspondingly arranged on the third mounting frame.
9. The split-type precision measurement device according to claim 8, wherein the second interferometers of the second interferometer measurement assemblies are mounted on the third mounting frame, and the second reflectors of the second interferometer measurement assemblies are correspondingly mounted on the object-to-be-measured carrying unit or/and the detection carrying unit.
10. The split type precision measuring device according to claim 1, wherein the displacement measuring unit further includes a third displacement measuring unit for measuring a relative displacement amount of the measured object carrying unit and the third mounting frame in the X direction.
11. The split type precision measuring device of claim 3, wherein the first and third mounting frames are provided at the bottom thereof with a first and second damping unit, respectively.
12. The split type precision measurement device according to claim 3, further comprising six sets of displacement sensors for measuring relative displacements of the first and third mounting frames in the X, Y, Z, Rx, Ry, and Rz directions; wherein the Z direction is a vertical direction perpendicular to the X and Y directions.
13. The split type precision measuring device of claim 4, wherein the bottom parts of the second and third mounting frames are respectively provided with a third and a fourth damping unit.
14. The split type precision measurement device according to claim 4, further comprising six sets of displacement sensors for measuring relative displacements of the first and third mounting frames in X, Y, Z, Rx, Ry, and Rz directions; wherein the Z direction is a vertical direction perpendicular to the X and Y directions.
CN201810698742.4A 2018-06-29 2018-06-29 Split type precision measurement device Pending CN110657746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810698742.4A CN110657746A (en) 2018-06-29 2018-06-29 Split type precision measurement device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810698742.4A CN110657746A (en) 2018-06-29 2018-06-29 Split type precision measurement device

Publications (1)

Publication Number Publication Date
CN110657746A true CN110657746A (en) 2020-01-07

Family

ID=69026773

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810698742.4A Pending CN110657746A (en) 2018-06-29 2018-06-29 Split type precision measurement device

Country Status (1)

Country Link
CN (1) CN110657746A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005045529A2 (en) * 2003-11-04 2005-05-19 Zygo Corporation Characterization and compensation of errors in multi-axis interferometry system
CN102022990A (en) * 2010-11-16 2011-04-20 陕西秦川机械发展股份有限公司 Large gear measuring instrument
CN102564303A (en) * 2010-12-30 2012-07-11 上海微电子装备有限公司 Measuring apparatus and measuring method
CN103969957A (en) * 2013-01-25 2014-08-06 上海微电子装备有限公司 Measurement apparatus and measurement method for photolithography machine vertical distance
CN205981108U (en) * 2016-08-31 2017-02-22 昆山泰丰自动化技术有限公司 Split type three -dimensional measurement appearance
CN107250717A (en) * 2015-02-23 2017-10-13 株式会社尼康 Measurement apparatus, etching system and exposure device and assembly manufacture method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005045529A2 (en) * 2003-11-04 2005-05-19 Zygo Corporation Characterization and compensation of errors in multi-axis interferometry system
CN102022990A (en) * 2010-11-16 2011-04-20 陕西秦川机械发展股份有限公司 Large gear measuring instrument
CN102564303A (en) * 2010-12-30 2012-07-11 上海微电子装备有限公司 Measuring apparatus and measuring method
CN103969957A (en) * 2013-01-25 2014-08-06 上海微电子装备有限公司 Measurement apparatus and measurement method for photolithography machine vertical distance
CN107250717A (en) * 2015-02-23 2017-10-13 株式会社尼康 Measurement apparatus, etching system and exposure device and assembly manufacture method
CN205981108U (en) * 2016-08-31 2017-02-22 昆山泰丰自动化技术有限公司 Split type three -dimensional measurement appearance

Similar Documents

Publication Publication Date Title
KR101969267B1 (en) Exposure method, exposure apparatus, and device manufacturing method
JP5126917B1 (en) Defect coordinate measuring apparatus, defect coordinate measuring method, mask manufacturing method, and reference mask
CN111965948B (en) Exposure apparatus, exposure method, method for manufacturing flat panel display, and method for manufacturing device
US8174671B2 (en) Lithographic projection apparatus and method for controlling a support structure
JP6535103B2 (en) Lithographic apparatus and lithographic projection method
JP7140219B2 (en) Exposure apparatus and flat panel display manufacturing method
US20210072651A1 (en) Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method, and device manufacturing method
CN108139677A (en) Exposure device, the manufacturing method of flat-panel screens and manufacturing method
KR102633248B1 (en) Exposure apparatus and exposure method, and flat panel display manufacturing method
US20100261106A1 (en) Measurement apparatus, exposure apparatus, and device fabrication method
CN110657746A (en) Split type precision measurement device
US8928882B2 (en) Measurement apparatus, exposure apparatus, and device fabrication method
JP2015043390A (en) Lithographic apparatus and method of manufacturing article
KR102472753B1 (en) Movable body device, displacement method, exposure device, exposure method, flat-panel display manufacturing method, and device manufacturing method
KR102478705B1 (en) Movable body device, displacement method, exposure device, exposure method, flat-panel display manufacturing method, and device manufacturing method
JP2005345298A (en) Position detection device and its method, and exposure device and its method
TW201727378A (en) Exposure apparatus, manufacturing method of flat panel display and device menufacturing method, and exposure method
JP2010251532A (en) Exposure method, exposure device, reticle, and device manufacturing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200107