CN110648947A - Quartz tube opening method for closed tube heat treatment and laser tube opening machine - Google Patents
Quartz tube opening method for closed tube heat treatment and laser tube opening machine Download PDFInfo
- Publication number
- CN110648947A CN110648947A CN201910806362.2A CN201910806362A CN110648947A CN 110648947 A CN110648947 A CN 110648947A CN 201910806362 A CN201910806362 A CN 201910806362A CN 110648947 A CN110648947 A CN 110648947A
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- Prior art keywords
- quartz tube
- tube
- vacuum chamber
- laser
- quartz
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
Abstract
The invention discloses a quartz tube opening method for closed tube heat treatment and a laser tube opening machine, wherein the method comprises the following steps: placing the annealed quartz tube into a vacuum chamber of a laser tube opener, and vacuumizing the vacuum chamber to be lower than the pressure intensity in the quartz tube; a small hole is punched on the quartz tube through a laser of the laser tube opening machine, so that the pressure intensity of the quartz tube and the pressure intensity in the vacuum chamber are balanced; deflating the vacuum chamber to the same atmospheric pressure; after taking out the quartz tube from the vacuum chamber, cutting a circular notch along the wall of the quartz tube at the position of the opening by a grinding wheel cutting machine; after the water near the circular incision was dried, the quartz tube was pried open at the circular incision by a file.
Description
Technical Field
The invention relates to the field of heat treatment of closed tubes of infrared detector devices, in particular to a quartz tube opening method and a laser tube opening machine for heat treatment of closed tubes.
Background
With the development of the mercury cadmium telluride infrared technology, the requirements on the defects and the surface state of the mercury cadmium telluride chip are higher and higher, and the most important method for reducing the defect density of the material is heat treatment, namely annealing treatment is carried out on the material under the protection of mercury vapor.
In the heat treatment of the mercury cadmium telluride material, a closed tube heat treatment process is used mostly, and the process has the advantages of easy control of mercury pressure and simple equipment. When the chip needs to be taken out of the quartz tube after the annealing is finished, the quartz tube needs to be opened, and the currently used method is as follows: the quartz tube is directly cut at the top end of the quartz tube by a grinding wheel cutting machine, but because the pressure inside the quartz tube is lower and is about 1E-5Pa, a large pressure difference exists inside and outside the quartz tube, quartz slag generated at a cut is easily absorbed into the quartz tube, so that a chip in the quartz tube is scratched and contaminated, in addition, when the quartz tube is cut by the cutting machine, large vibration can be generated, the chip is easily cracked, and when the quartz tube is cut, water enters the quartz tube at the cut, and a watermark is formed on the surface of the chip, so that the performance of the chip is influenced. In order to reduce the damage generated in the tube opening process of the quartz tube, the tube opening mode of the quartz tube after annealing needs to be improved.
Disclosure of Invention
The embodiment of the invention provides a quartz tube opening method for closed tube heat treatment and a laser tube opening machine, which are used for solving the problems in the prior art.
The embodiment of the invention provides a quartz tube opening method for closed tube heat treatment, which comprises the following steps:
placing the annealed quartz tube into a vacuum chamber of a laser tube opener, and vacuumizing the vacuum chamber to be lower than the pressure intensity in the quartz tube;
a small hole is punched on the quartz tube through a laser of the laser tube opening machine, so that the pressure intensity of the quartz tube and the pressure intensity in the vacuum chamber are balanced;
deflating the vacuum chamber to the same atmospheric pressure;
after taking out the quartz tube from the vacuum chamber, cutting a circular notch along the wall of the quartz tube at the position of the opening by a grinding wheel cutting machine;
after the water near the circular incision was dried, the quartz tube was pried open at the circular incision by a file.
The embodiment of the invention also provides a laser tube opener, which is used for opening an annealed quartz tube, and specifically comprises the following steps: the vacuum chamber is used for placing the annealed quartz tube; and the laser is arranged at one end of the vacuum chamber and used for punching a small hole on the quartz tube through laser so as to balance the pressure in the quartz tube and the vacuum chamber.
By adopting the embodiment of the invention, scratches and various contaminations of the mercury cadmium telluride chip in the tube opening process can be reduced, the yield of the chip is improved, and the quality of the chip is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic view of a quartz tube opening method for closed tube heat treatment according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a quartz tube used in a thermal processing process of a mercury cadmium telluride chip according to an embodiment of the present invention;
FIG. 3 is a schematic illustration of a hole being punched using a laser pipe opener in accordance with an embodiment of the present invention;
FIG. 4 is a schematic view of a quartz tube with a chip placed therein according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a laser pipe opener of an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Method embodiment
According to an embodiment of the present invention, there is provided a quartz tube opening method for closed tube heat treatment, fig. 1 is a schematic diagram of the quartz tube opening method for closed tube heat treatment according to the embodiment of the present invention, and as shown in fig. 1, the quartz tube opening method for closed tube heat treatment according to the embodiment of the present invention specifically includes:
101, placing the annealed quartz tube into a vacuum chamber of a laser tube opener, and vacuumizing the vacuum chamber to a pressure lower than that in the quartz tube;
102, punching a small hole on a quartz tube by a laser of a laser tube opening machine to balance the pressure of the quartz tube and the pressure in a vacuum chamber; in the embodiment of the invention, the position of the small hole is far away from the tellurium-cadmium-mercury chip in the quartz tube.
Step 103, deflating the vacuum chamber to the same pressure as the atmospheric pressure;
104, cutting a circular notch along the wall of the quartz tube at the position of the opening by a grinding wheel cutting machine after taking out the quartz tube from the vacuum chamber; the circular cut is adjacent to the small hole punched in step 102.
Step 105, after the water near the circular incision is dried, prying the quartz tube at the circular incision by a file.
In order to solve the problems of scratches, contamination and the like introduced in the tube opening process during the tube closing heat treatment of the mercury cadmium telluride chip, obtain an infrared detector chip with better quality and improve the yield of the detector, the embodiment of the invention provides a tube opening method of a low-damage quartz tube, and the embodiment of the invention is further described in detail below by combining the attached drawings and a plurality of embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
FIG. 2 is a schematic diagram of a quartz tube used in a thermal treatment process of a HgCdTe chip in an embodiment of the invention, FIG. 3 is a schematic diagram of drilling with a laser tube opener in an embodiment of the invention, in FIG. 3, 31 is the quartz tube, 32 is a vacuum chamber of the laser tube opener, 33 is a laser, FIG. 4 is a schematic diagram of the quartz tube after the chip is placed in the embodiment of the invention, in which 41 the HgCdTe chip is placed at position, 42 the laser hole is drilled at position, and 43 the position is a place cut by a grinding wheel during tube opening, in order to reduce the risk of cracking and the possibility of scratching and contamination of the chip, the tube opening method in an embodiment of the invention has the following steps:
1. placing the annealed quartz tube into the vacuum chamber 32 of the laser tube opener in fig. 3, and vacuumizing to a pressure lower than that in the quartz tube;
2. a small hole is punched on the quartz tube 31 by a laser 33, so that the pressure of the quartz tube and the pressure in the vacuum chamber are balanced;
3. deflating the vacuum chamber to the same atmosphere;
4. taking out the quartz tube, and cutting a circular cut along the wall of the quartz tube at the position of the opening by using a grinding wheel cutting machine, but not completely cutting;
5. after the water near the incision is wiped dry by dust-free cloth, the quartz tube is pried open at the incision by a file.
Through the treatment, the pressure outside the quartz tube is lower than that inside the quartz tube when the quartz tube is opened, so that quartz slag generated at the opening position cannot be sucked into the tube to scratch the chip, and the influence of water at the notch on the chip is greatly reduced.
Device embodiment
According to an embodiment of the present invention, there is provided a laser pipe opener for opening an annealed quartz pipe, fig. 5 is a schematic view of the laser pipe opener according to an embodiment of the present invention, and as shown in fig. 5, the laser pipe opener according to an embodiment of the present invention includes:
a vacuum chamber 51 for placing the annealed quartz tube;
and the laser 52 is arranged at one end of the vacuum chamber and is used for punching a small hole on the quartz tube through laser so as to balance the pressure in the quartz tube and the pressure in the vacuum chamber.
It will be apparent to those skilled in the art that the modules or steps of the present invention described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and alternatively, they may be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present invention is not limited to any specific combination of hardware and software.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A quartz tube opening method for closed tube heat treatment is characterized by comprising the following steps:
placing the annealed quartz tube into a vacuum chamber of a laser tube opener, and vacuumizing the vacuum chamber to be lower than the pressure intensity in the quartz tube;
a small hole is punched on the quartz tube through a laser of the laser tube opening machine, so that the pressure intensity of the quartz tube and the pressure intensity in the vacuum chamber are balanced;
deflating the vacuum chamber to the same atmospheric pressure;
after taking out the quartz tube from the vacuum chamber, cutting a circular notch along the wall of the quartz tube at the position of the opening by a grinding wheel cutting machine;
after the water near the circular incision was dried, the quartz tube was pried open at the circular incision by a file.
2. The method of claim 1, wherein the orifice is located away from a mercury cadmium telluride chip within the quartz tube.
3. The method of claim 1, wherein the circular cut is proximate to the aperture.
4. The utility model provides a laser pipe opener which characterized in that for opening a tub to the quartz capsule after annealing, specifically includes:
the vacuum chamber is used for placing the annealed quartz tube;
and the laser is arranged at one end of the vacuum chamber and used for punching a small hole on the quartz tube through laser so as to balance the pressure in the quartz tube and the vacuum chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910806362.2A CN110648947B (en) | 2019-08-29 | 2019-08-29 | Quartz tube opening method for closed tube heat treatment and laser tube opening machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910806362.2A CN110648947B (en) | 2019-08-29 | 2019-08-29 | Quartz tube opening method for closed tube heat treatment and laser tube opening machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110648947A true CN110648947A (en) | 2020-01-03 |
| CN110648947B CN110648947B (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910806362.2A Active CN110648947B (en) | 2019-08-29 | 2019-08-29 | Quartz tube opening method for closed tube heat treatment and laser tube opening machine |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH098065A (en) * | 1995-06-15 | 1997-01-10 | Nec Corp | Thermal treatment method of sealed tube |
| CN1152635A (en) * | 1996-04-26 | 1997-06-25 | 中国科学院上海技术物理研究所 | Hole conduction tellurium-cadimium-mercury epitaxy material heat treatment process and device thereof |
| CN1178391A (en) * | 1997-09-17 | 1998-04-08 | 中国科学院上海技术物理研究所 | Heat treating apparatus for mercury self sealed mercury-cadmium tellurid for switching transistors |
| JP2006137169A (en) * | 2004-11-12 | 2006-06-01 | Lemi Ltd | Method and apparatus for breaking and cutting fragile material |
| US20180001418A1 (en) * | 2016-06-30 | 2018-01-04 | The Boeing Company | Laser wire processing device |
-
2019
- 2019-08-29 CN CN201910806362.2A patent/CN110648947B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH098065A (en) * | 1995-06-15 | 1997-01-10 | Nec Corp | Thermal treatment method of sealed tube |
| CN1152635A (en) * | 1996-04-26 | 1997-06-25 | 中国科学院上海技术物理研究所 | Hole conduction tellurium-cadimium-mercury epitaxy material heat treatment process and device thereof |
| CN1178391A (en) * | 1997-09-17 | 1998-04-08 | 中国科学院上海技术物理研究所 | Heat treating apparatus for mercury self sealed mercury-cadmium tellurid for switching transistors |
| JP2006137169A (en) * | 2004-11-12 | 2006-06-01 | Lemi Ltd | Method and apparatus for breaking and cutting fragile material |
| US20180001418A1 (en) * | 2016-06-30 | 2018-01-04 | The Boeing Company | Laser wire processing device |
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| Publication number | Publication date |
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| CN110648947B (en) | 2022-03-11 |
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