CN110640919A - Monocrystalline silicon slicing device capable of freely adjusting size of cut wafer - Google Patents
Monocrystalline silicon slicing device capable of freely adjusting size of cut wafer Download PDFInfo
- Publication number
- CN110640919A CN110640919A CN201810674629.2A CN201810674629A CN110640919A CN 110640919 A CN110640919 A CN 110640919A CN 201810674629 A CN201810674629 A CN 201810674629A CN 110640919 A CN110640919 A CN 110640919A
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- monocrystalline silicon
- wall
- working platform
- freely adjusting
- size
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a monocrystalline silicon slicing device capable of freely adjusting the size of a cut wafer, which belongs to the technical field of monocrystalline silicon, and comprises a working platform, two groups of guide rollers are driven by a conveyor belt, a scrap collecting box is arranged in the center of an inner cavity of the working platform, one end of a support rod, which is far away from a fixed block, is connected with a clamping device, an electric telescopic rod is arranged in the center of the bottom of a rack, the bottom of the electric telescopic rod is connected with a fixed rod, sleeves are uniformly sleeved on the outer wall of the fixed rod, a cutting blade is arranged in the center of the bottom of the sleeve, the device can cut monocrystalline silicon into different sizes by adjusting the distance between the sleeves, the monocrystalline silicon is fixed by the clamping device, the cutting error caused by the movement of the monocrystalline silicon is prevented, meanwhile, the cutting blade rotates, a stop block, preventing the waste chips from splashing on the monocrystalline silicon to damage the surface of the monocrystalline silicon.
Description
Technical Field
The invention relates to the technical field of monocrystalline silicon, in particular to a monocrystalline silicon slicing device capable of freely adjusting the size of a cut wafer.
Background
The single crystal silicon has basically complete lattice structure crystal, different directions have different properties, and the single crystal silicon is a good semiconductor material and is used for manufacturing semiconductor devices, solar cells and the like.
Disclosure of Invention
The present invention is directed to a monocrystalline silicon slicing apparatus capable of freely adjusting the size of a sliced wafer, so as to solve the above problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a monocrystalline silicon slicing device capable of freely adjusting the size of a cut wafer comprises a working platform, wherein the working platform is a square hollow working platform, two groups of guide rollers are arranged between the inner walls of the left side and the right side of the working platform and are driven by a conveyor belt, holes are uniformly formed in the surface of the conveyor belt, a scrap-consuming collecting box is arranged in the center of the inner cavity of the working platform and is positioned in the inner cavity of the conveyor belt, fixed blocks are uniformly arranged on the outer walls of the left side and the right side of the conveyor belt, supporting rods are arranged on the adjacent sides of the two groups of fixed blocks, one ends of the supporting rods, far away from the fixed blocks, are connected with a clamping device, a rack is arranged at the top of the working platform, an electric telescopic rod is arranged in the center of the bottom of the rack, the screw joint of sleeve pipe top has the bolt, sleeve pipe bottom central authorities are provided with cutting blade, the sleeve pipe bottom left and right sides all is provided with the curb plate.
Preferably, clamping device includes the fixed plate of being connected with the bracing piece, the fixed plate is kept away from one side outer wall of bracing piece and is evenly provided with adjusting spring, adjusting spring keeps away from the one end of fixed plate and is connected with the stripper plate, the stripper plate is kept away from one side outer wall of adjusting spring and is evenly provided with the extrusion piece.
Preferably, both ends all are provided with the dog about the cutting blade left and right sides outer wall, the curb plate is close to cutting blade's a lopsidedness and sets up to the frame inner wall.
Preferably, the inner cavity of the sleeve is provided with a supporting sliding strip, and the outer wall of the fixed rod is uniformly provided with sliding grooves matched with the supporting sliding strip.
Preferably, the top of the outer wall of the front side of the fixed rod is provided with scale marks, and the scale marks are in centimeters.
Preferably, the outer wall of the bottom of the side plate is uniformly provided with semicircular lugs which are arranged in a rectangular array and are rubber lugs.
Compared with the prior art, the invention has the beneficial effects that:
1. the distance between the cutting blades is changed by adjusting the distance between the sleeves in the device, so that the device can cut monocrystalline silicon into different sizes, the practicability of the device is improved, cutting devices of other specifications are not required to be added, unnecessary waste is reduced, and the space occupation is reduced;
2. through the fixed monocrystalline silicon of clamping device, prevent that monocrystalline silicon from removing to cause the cutting to produce the error, the production quality of monocrystalline silicon has been guaranteed, and the curb plate is from the fixed monocrystalline silicon in top, further improvement monocrystalline silicon's stability, prevent that monocrystalline silicon from taking place to remove, the resource of production has been practiced thrift, cutting blade is rotatory simultaneously, the dog that makes cutting blade side rotates like the fan leaf and produces wind-force, blow the expense bits that the cutting produced on work platform to in the expense bits collecting box, prevent that expense bits from splashing and falling to monocrystalline silicon and damage monocrystalline silicon surface, the production quality of monocrystalline silicon has been guaranteed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of the sleeve and cutting blade attachment of the present invention;
fig. 4 is a schematic structural view of the clamping device of the present invention.
In the figure: 1 work platform, 2 guide rolls, 3 conveyer belts, 4 fixed blocks, 5 bracing pieces, 6 clamping devices, 61 extrusion plates, 62 extrusion blocks, 63 adjusting springs, 64 fixed plates, 7 racks, 8 electric telescopic rods, 9 fixed rods, 10 sleeves, 11 bolts, 12 side plates, 13 scrap collecting boxes, 14 cutting blades and 141 stops.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a monocrystalline silicon slicing device capable of freely adjusting the size of a cut wafer comprises a working platform 1, wherein the working platform 1 is a square hollow working platform, two groups of guide rollers 2 are arranged between the inner walls of the left side and the right side of the working platform 1, the two groups of guide rollers 2 are driven by a conveyor belt 3, holes are uniformly formed in the surface of the conveyor belt 3, waste scrap impurities generated by cutting conveniently fall into a waste scrap collecting box 13 for centralized treatment, the waste scraps are prevented from splashing on the surface of monocrystalline silicon and damaging the processing quality, the waste scrap collecting box 13 is arranged in the center of the inner cavity of the working platform 1, the waste scrap collecting box 13 is positioned in the inner cavity of the conveyor belt 3, fixed blocks 4 are uniformly arranged on the outer walls of the left side and the right side of the conveyor belt 3, supporting rods 5 are arranged on adjacent sides of the two groups of fixed blocks 4, one, practice thrift production resources, 1 top of work platform is provided with frame 7, frame 7 bottom central authorities are provided with electric telescopic handle 8, 8 bottoms of electric telescopic handle are connected with dead lever 9, and dead lever 9 is located conveyer belt 3 directly over, sleeve pipe 10 has evenly been cup jointed to dead lever 9 outer wall, sleeve pipe 10 top spiro union has bolt 11, through changing the interval between the sleeve pipe 10, make the interval between cutting blade 14 change, thereby make the device can be as required monocrystalline silicon cut into equidimension not, the practicality of device has been increased, sleeve pipe 10 bottom central authorities are provided with cutting blade 14, the sleeve pipe 10 bottom left and right sides all is provided with curb plate 12, guide roll 2 all passes through wire and external power source switch electric connection with conveyer belt 3.
The clamping device 6 comprises a fixing plate 64 connected with the supporting rod 5, adjusting springs 63 are uniformly arranged on the outer wall of one side, away from the supporting rod 5, of the fixing plate 64, one ends, away from the fixing plate 64, of the adjusting springs 63 are connected with the extrusion plates 61, extrusion blocks 62 are uniformly arranged on the outer wall of one side, away from the adjusting springs 63, of the extrusion plates 61, the two groups of extrusion plates 61 are expanded inwards due to expansion of the adjusting springs 63, and therefore monocrystalline silicon is fixed, cutting errors caused by movement of the monocrystalline silicon are prevented, production quality of the monocrystalline silicon is guaranteed, meanwhile, the contact area between the extrusion plates 61 and the monocrystalline silicon is increased through the extrusion blocks 62, the monocrystalline silicon is fixed more thoroughly, damage;
the upper end and the lower end of the outer walls of the left side and the right side of the cutting blade 14 are respectively provided with a stop block 141, one side of the side plate 12 close to the cutting blade 14 is obliquely arranged towards the inner wall of the rack 7, the cutting blade 14 rotates to enable the stop blocks 141 to rotate like a fan to generate wind power, and the wind direction is changed due to the oblique arrangement of the side plate 12, so that the wind is blown to the conveyor belt 3, the waste scraps generated during cutting can quickly enter the waste scrap collecting box 13, the problem that the waste scraps splash on the surface of the monocrystalline silicon to cause damage of the monocrystalline silicon is;
a supporting sliding strip is arranged in the inner cavity of the sleeve 10, sliding grooves matched with the supporting sliding strip are uniformly formed in the outer wall of the fixing rod 9, and the sleeve 10 is prevented from shaking on the fixing rod 9 to cause cutting errors, so that production resources are wasted;
the top of the outer wall of the front side of the fixed rod 9 is provided with scale marks which take centimeters as units, so that the distance between the cutting blades 14 can be conveniently adjusted, the cut product is more accurate, and the production quality of the monocrystalline silicon is improved;
the outer wall of the bottom of the side plate 12 is evenly provided with semicircular convex blocks, the convex blocks are arranged in a rectangular array mode, the convex blocks are rubber convex blocks, the contact area of the side plate 12 and monocrystalline silicon is increased, the monocrystalline silicon is prevented from moving, cutting errors are avoided, and production resources are saved.
The working principle is as follows: when the device works, a monocrystalline silicon plate is firstly placed on a conveyor belt 3, two groups of clamping devices 6 are used for fixing monocrystalline silicon by expanding an adjusting spring 63 to prevent the monocrystalline silicon from moving to cause cutting errors to influence the production quality of the monocrystalline silicon, then a bolt 11 is unscrewed to enable a sleeve to be in an active state, then the distance between the sleeves 10 is adjusted to change the distance between cutting blades 14, when the required width is reached, the bolt 11 is screwed down to fix the sleeves 10 to enable the device to cut the monocrystalline silicon into different sizes as required, the practicability of the device is increased, a guide roller 2 works to drive the conveyor belt 3 to transmit, the monocrystalline silicon moves towards the rear side of a working platform 1, meanwhile, an electric telescopic rod 8 works to drive a fixing rod 9 to move downwards, when the monocrystalline silicon moves to the position under the fixing rod 9, a side plate 12 is in contact with the top of the monocrystalline silicon to fix the monocrystalline silicon, further fixation is prevented from moving, then the cutting blade 14 works to cut the monocrystalline silicon, when the cutting is finished, the finished monocrystalline silicon is driven by the conveyor belt 3 to move backwards, meanwhile, the cutting blade 14 rotates, the stop block 141 on the cutting blade 14 rotates like a fan to generate wind power, the side plate 12 is arranged outwards in an inclined mode, the wind direction is changed by the side plate 12, the wind power is blown to the conveyor belt 3, the cost scraps generated by cutting are accelerated to penetrate through the hole of the conveyor belt 3 to enter the cost scrap collecting box 14, the problem that the cost scraps splash to the monocrystalline silicon to damage the surface of the monocrystalline silicon is solved, the production quality is guaranteed, the monocrystalline silicon is cut by repeated operation, and when the cutting.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A monocrystalline silicon slicing device capable of freely adjusting the size of a cut wafer comprises a working platform (1), and is characterized in that: the working platform (1) is a square hollow working platform, two groups of guide rollers (2) are arranged between the inner walls of the left side and the right side of the working platform (1), the two groups of guide rollers (2) are driven by a conveyor belt (3), holes are uniformly formed in the surface of the conveyor belt (3), a scrap-taking collecting box (13) is installed in the center of the inner cavity of the working platform (1), the scrap-taking collecting box (13) is located in the inner cavity of the conveyor belt (3), fixed blocks (4) are uniformly arranged on the outer walls of the left side and the right side of the conveyor belt (3), supporting rods (5) are arranged on adjacent sides of the two groups of fixed blocks (4), one ends, far away from the fixed blocks (4), of the supporting rods (5) are connected with a clamping device (6), a rack (7) is arranged at the top of the working, electric telescopic handle (8) bottom is connected with dead lever (9), and dead lever (9) are located conveyer belt (3) directly over, sleeve pipe (10) have evenly been cup jointed to dead lever (9) outer wall, sleeve pipe (10) top spiro union has bolt (11), sleeve pipe (10) bottom central authorities are provided with cutting blade (14), sleeve pipe (10) bottom left and right sides all is provided with curb plate (12).
2. A single crystal silicon slicing apparatus capable of freely adjusting the size of a sliced wafer as set forth in claim 1, wherein: clamping device (6) include fixed plate (64) be connected with bracing piece (5), one side outer wall that bracing piece (5) were kept away from in fixed plate (64) evenly is provided with adjusting spring (63), the one end that fixed plate (64) were kept away from in adjusting spring (63) is connected with stripper plate (61), one side outer wall that adjusting spring (63) were kept away from in stripper plate (61) evenly is provided with extrusion piece (62).
3. A single crystal silicon slicing apparatus capable of freely adjusting the size of a sliced wafer as set forth in claim 1, wherein: both ends all are provided with dog (141) about cutting blade (14) left and right sides outer wall, curb plate (12) are close to the lopsidedness of cutting blade (14) and set up to frame (7) inner wall.
4. A single crystal silicon slicing apparatus capable of freely adjusting the size of a sliced wafer as set forth in claim 1, wherein: the inner cavity of the sleeve (10) is provided with a supporting sliding strip, and the outer wall of the fixing rod (9) is uniformly provided with sliding grooves matched with the supporting sliding strip.
5. A single crystal silicon slicing apparatus capable of freely adjusting the size of a sliced wafer as set forth in claim 1, wherein: the top of the outer wall of the front side of the fixed rod (9) is provided with scale marks, and the scale marks take centimeters as units.
6. A single crystal silicon slicing apparatus capable of freely adjusting the size of a sliced wafer as set forth in claim 1, wherein: the outer wall of the bottom of the side plate (12) is uniformly provided with semicircular lugs which are arranged in a rectangular array and are rubber lugs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810674629.2A CN110640919A (en) | 2018-06-27 | 2018-06-27 | Monocrystalline silicon slicing device capable of freely adjusting size of cut wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810674629.2A CN110640919A (en) | 2018-06-27 | 2018-06-27 | Monocrystalline silicon slicing device capable of freely adjusting size of cut wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110640919A true CN110640919A (en) | 2020-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810674629.2A Pending CN110640919A (en) | 2018-06-27 | 2018-06-27 | Monocrystalline silicon slicing device capable of freely adjusting size of cut wafer |
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| CN (1) | CN110640919A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111823651A (en) * | 2020-06-30 | 2020-10-27 | 浙江博莱特纸容器有限公司 | Corrugated paper low-temperature production line based on energy-saving steam system |
| CN113644011A (en) * | 2021-08-09 | 2021-11-12 | 江苏富联通讯技术有限公司 | Chip cutting equipment for SIP packaging of 5G communication storage chip and use method thereof |
-
2018
- 2018-06-27 CN CN201810674629.2A patent/CN110640919A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111823651A (en) * | 2020-06-30 | 2020-10-27 | 浙江博莱特纸容器有限公司 | Corrugated paper low-temperature production line based on energy-saving steam system |
| CN113644011A (en) * | 2021-08-09 | 2021-11-12 | 江苏富联通讯技术有限公司 | Chip cutting equipment for SIP packaging of 5G communication storage chip and use method thereof |
| CN113644011B (en) * | 2021-08-09 | 2024-01-16 | 江苏富联通讯技术股份有限公司 | Chip cutting equipment for packaging 5G communication memory chip SIP and using method thereof |
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Application publication date: 20200103 |