CN110636737A - Heat radiator for communication equipment - Google Patents

Heat radiator for communication equipment Download PDF

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Publication number
CN110636737A
CN110636737A CN201810658005.1A CN201810658005A CN110636737A CN 110636737 A CN110636737 A CN 110636737A CN 201810658005 A CN201810658005 A CN 201810658005A CN 110636737 A CN110636737 A CN 110636737A
Authority
CN
China
Prior art keywords
fans
frame
fan
communication equipment
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810658005.1A
Other languages
Chinese (zh)
Inventor
陈国强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN201810658005.1A priority Critical patent/CN110636737A/en
Priority to PCT/CN2019/091547 priority patent/WO2020001310A1/en
Publication of CN110636737A publication Critical patent/CN110636737A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat sink of communication equipment, comprising: the fan-type air conditioner comprises a plurality of fans arranged in the same frame, wherein the wires of the fans are arranged in the frame; and a first connector which is arranged on the outer edge of the frame body and is electrically connected with the communication equipment. The invention solves the technical problem of poor waterproof performance of the fan of the communication equipment in the related technology.

Description

Heat radiator for communication equipment
Technical Field
The invention relates to the field of communication, in particular to a heat dissipation device of communication equipment.
Background
In the related art, when the fan is used for heat dissipation of outdoor communication equipment, the waterproof reliability of the fan is greatly tested, and a waterproof fan subjected to waterproof reinforcement treatment must be used. When the fan is subjected to waterproof treatment, more cables of the fan are arranged, and the joints of the cables and the motor and the joints of the cables and the equipment are risk points which are easy to leak water. When the communication equipment works with N fans, the risk of water leakage is increased by N times. Once the fan water is failed, the temperature of the communication equipment is rapidly increased, and the operation is failed, so that the waterproof reliability of the fan becomes a bottleneck for restricting the reliable operation of the outdoor communication equipment.
In the related art, the heat dissipation fans used by the communication equipment are connected with the communication equipment independently, and each fan is provided with an external cable, so that water leakage, electric leakage and the like are easily caused.
In view of the above problems in the related art, no effective solution has been found at present.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation device of communication equipment.
According to an embodiment of the present invention, there is provided a heat dissipating device of a communication apparatus, including: the fan-type air conditioner comprises a plurality of fans arranged in the same frame, wherein the wires of the fans are arranged in the frame; and a first connector which is arranged on the outer edge of the frame body and is electrically connected with the communication equipment.
According to the invention, the plurality of fans are arranged in the same frame, so that water leakage risk points of the fans can be reduced, and the technical problem of poor waterproof performance of the fans of the communication equipment in the related technology is solved. Meanwhile, through the integrated design of a plurality of fans, the total volume of the fans is reduced, no external cable is arranged, the installation of the fans is simple and reliable, and the maintenance is simple.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
fig. 1 is a block diagram of a heat dissipating device of a communication apparatus according to an embodiment of the present invention;
FIG. 2 is an exploded view of a heat sink in accordance with an embodiment of the present invention;
FIG. 3 is a schematic view of an inner fan assembly of a frame according to an embodiment of the invention;
FIG. 4 is a first fan arrangement diagram according to an embodiment of the present invention;
fig. 5 is a second fan arrangement diagram according to an embodiment of the invention.
Detailed Description
The invention will be described in detail hereinafter with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Example 1
The embodiment also provides a heat dissipation device of the communication equipment. Fig. 1 is a block diagram of a heat dissipation apparatus of a communication device according to an embodiment of the present invention, and as shown in fig. 1, the apparatus includes:
a plurality of fans 12 disposed in the same frame 10, wherein the wires of the plurality of fans are disposed in the frame;
the first connector 14 is provided on the housing outer edge 100 and electrically connected to the communication device 16.
Through the heat abstractor of this embodiment, set up a plurality of fans in same frame, can reduce the risk point of leaking of fan, solved communication equipment's among the correlation technique fan waterproof performance poor technical problem. Meanwhile, through the integrated design of a plurality of fans, the total volume of the fans is reduced, no external cable is arranged, the installation of the fans is simple and reliable, and the maintenance is simple.
The embodiment provides a heat dissipation fan structure for communication equipment (communication equipment), which can be formed by combining a plurality of axial flow fans or centrifugal fans, wherein the fans are integrated into a frame, cables are all arranged in the fan frame body, no external cable is arranged, and the connector with the communication equipment is also arranged on the fan frame body. Therefore, the water leakage risk points of the fan are greatly reduced, and the waterproof performance is improved. In addition, the fan is simple and convenient to mount, the fan is only required to be fixed on the main equipment, the fan is fixed, the electric interconnection between the fan and the main equipment is also completed, and when the fan is fixed on the main equipment, the fan and the nut can be combined and fixedly connected through the pressing force of the screw of the fan, so that the waterproof sealing effect of the connector and the main equipment is guaranteed.
Fig. 2 is an exploded view of a heat dissipating device according to an embodiment of the present invention, and fig. 3 is a schematic view of a combination of fans inside a housing according to an embodiment of the present invention, in which 4 (an example) fan slots are built in the housing, the fans are installed in the slots, cables of the fans are routed inside the housing, and a connector is connected to a connector at the middle of the connection, and the connector can be connected to a connector on the outer edge of the housing.
Optionally, the fan structure of this embodiment is composed of a plurality of axial fans or centrifugal fans side by side, and the plurality of fans are combined into a whole and use the same metal or injection molding frame.
Alternatively, the cables from each fan motor to the connectors are all built into the fan frame.
Optionally, the power supply lines and the signal control lines inside the fan assembly are all connected to one connector, that is, the fan has only one electrical connector, and the connector can be located at any position on the fan frame body.
Optionally, the control circuit board of the fan may also be sealed inside the fan frame, and the position is not limited.
Fig. 4 is a first fan arrangement diagram of the embodiment of the invention, in which fans are arranged at two ends of a frame body and a connector is arranged in the middle, and fig. 5 is a second fan arrangement diagram of the embodiment of the invention, in which fans are arranged at one end of the frame body and a connector is arranged at the other end of the frame body.
It will be apparent to those skilled in the art that the modules or steps of the present invention described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and alternatively, they may be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present invention is not limited to any specific combination of hardware and software.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A heat sink for a communication device, comprising:
the fan-type air conditioner comprises a plurality of fans arranged in the same frame, wherein the wires of the fans are arranged in the frame;
and a first connector which is arranged on the outer edge of the frame body and is electrically connected with the communication equipment.
2. The apparatus of claim 1, wherein the plurality of fans are a plurality of axial fans.
3. The apparatus of claim 1, wherein the plurality of fans is a plurality of centrifugal fans.
4. The apparatus of claim 1, wherein the plurality of fans are connected side-by-side within the frame.
5. The device of claim 1, wherein the frame is a metal frame.
6. The device of claim 1, wherein the frame is an injection molded frame.
7. The apparatus of claim 1, wherein the frame is fixedly connected to the communication device by a connector.
8. The apparatus of claim 7, wherein the connector is a screw and nut combination.
9. The device of claim 1, wherein the plurality of fans are each connected to a second connector within the housing via a power supply line within the housing.
10. The apparatus of claim 1, wherein the plurality of fans are each connected to a control circuit board within the housing via a control wire within the housing.
CN201810658005.1A 2018-06-25 2018-06-25 Heat radiator for communication equipment Pending CN110636737A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201810658005.1A CN110636737A (en) 2018-06-25 2018-06-25 Heat radiator for communication equipment
PCT/CN2019/091547 WO2020001310A1 (en) 2018-06-25 2019-06-17 Heat dissipation apparatus of communication device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810658005.1A CN110636737A (en) 2018-06-25 2018-06-25 Heat radiator for communication equipment

Publications (1)

Publication Number Publication Date
CN110636737A true CN110636737A (en) 2019-12-31

Family

ID=68967802

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810658005.1A Pending CN110636737A (en) 2018-06-25 2018-06-25 Heat radiator for communication equipment

Country Status (2)

Country Link
CN (1) CN110636737A (en)
WO (1) WO2020001310A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010024358A1 (en) * 1999-05-24 2001-09-27 Bonet Sandra E. Multiple-fan modular cooling component
CN2630544Y (en) * 2003-05-13 2004-08-04 华为技术有限公司 Fan frame
CN1735330A (en) * 2004-08-09 2006-02-15 欧姆龙株式会社 Heat radiating structure for electronic equipment
CN1852647A (en) * 2006-05-29 2006-10-25 迈普(四川)通信技术有限公司 Communication apparatus radiating device
US20080075579A1 (en) * 2006-09-22 2008-03-27 Inventec Corporation Fan device
CN201198843Y (en) * 2008-01-28 2009-02-25 杭州华三通信技术有限公司 Fan frame module and communication apparatus having the same
US20110116233A1 (en) * 2009-11-17 2011-05-19 Beaudoin Denis J F Fan Tray that is Installable and Removable from the Front and Back of a Network Element Chassis
CN206118285U (en) * 2016-10-19 2017-04-19 海能达通信股份有限公司 BBU equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3084355U (en) * 2001-03-27 2002-03-22 台達電子工業股▲ふん▼有限公司 Heat dissipation module
CN2565239Y (en) * 2002-07-10 2003-08-06 台达电子工业股份有限公司 Radiating system with display circuit board
CN2796314Y (en) * 2005-05-12 2006-07-12 勤诚兴业股份有限公司 Radiation module
CN101470497A (en) * 2007-12-26 2009-07-01 英业达股份有限公司 Electric connection structure and method for heat radiating device and switching circuit board
CN102378556A (en) * 2010-08-26 2012-03-14 俞恒庆 Radiating device of circuit board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010024358A1 (en) * 1999-05-24 2001-09-27 Bonet Sandra E. Multiple-fan modular cooling component
CN2630544Y (en) * 2003-05-13 2004-08-04 华为技术有限公司 Fan frame
CN1735330A (en) * 2004-08-09 2006-02-15 欧姆龙株式会社 Heat radiating structure for electronic equipment
CN1852647A (en) * 2006-05-29 2006-10-25 迈普(四川)通信技术有限公司 Communication apparatus radiating device
US20080075579A1 (en) * 2006-09-22 2008-03-27 Inventec Corporation Fan device
CN201198843Y (en) * 2008-01-28 2009-02-25 杭州华三通信技术有限公司 Fan frame module and communication apparatus having the same
US20110116233A1 (en) * 2009-11-17 2011-05-19 Beaudoin Denis J F Fan Tray that is Installable and Removable from the Front and Back of a Network Element Chassis
CN206118285U (en) * 2016-10-19 2017-04-19 海能达通信股份有限公司 BBU equipment

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Publication number Publication date
WO2020001310A1 (en) 2020-01-02

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20191231

WD01 Invention patent application deemed withdrawn after publication