CN110634919B

CN110634919B - Manufacturing method of display panel

Info

Publication number: CN110634919B
Application number: CN201910798121.8A
Authority: CN
Inventors: 黄振
Original assignee: Yungu Guan Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd
Priority date: 2019-08-27
Filing date: 2019-08-27
Publication date: 2022-03-08
Anticipated expiration: 2039-08-27
Also published as: CN110634919A

Abstract

The embodiment of the invention relates to the technical field of display and discloses a manufacturing method of a display panel. In some embodiments of the present application, a method for manufacturing a display panel includes: after a driving assembly and a light emitting assembly of the display panel are formed, punching holes from the driving assembly to the direction close to the light emitting assembly to form a first hole; adhering a support film on one side of the driving assembly, which is far away from the light-emitting assembly; a second opening is formed through the support film, the first opening communicating with the second opening. In this realization, can form the trompil on display panel, obtain the screen that punches, further improved display panel's screen and accounted for the ratio.

Description

Manufacturing method of display panel

Technical Field

The embodiment of the invention relates to the field of display, in particular to a manufacturing method of a display panel.

Background

In order to improve the user experience, research and development personnel are always studying how to improve the screen occupation ratio. In order to improve the screen ratio, mobile phone developers successively release the Liuhai screen and the water drop screen.

However, the inventors found that at least the following problems exist in the prior art: the screen occupation ratio of the Liuhai screen and the water drop screen still has an improvement space, and how to further improve the screen occupation ratio of the display panel is a problem to be solved urgently.

Disclosure of Invention

The invention aims to provide a manufacturing method of a display panel, which can form holes on the display panel to obtain a perforated screen and further improve the screen occupation ratio.

In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a display panel, including: after a driving assembly and a light emitting assembly of the display panel are formed, punching holes from the driving assembly to the direction close to the light emitting assembly to form a first hole; adhering a support film on one side of the driving assembly, which is far away from the light-emitting assembly; a second opening is formed through the support film, the first opening communicating with the second opening.

The embodiment of the invention also provides a display panel, and the display panel is prepared by the manufacturing method of the display panel mentioned in the embodiment.

Compared with the prior art, the display panel with the holes is obtained by punching the supporting film and the driving assembly, so that devices such as a camera and the like can be arranged in the punched hole area, and the screen occupation ratio is improved. In the punching process, because the thickness of supporting the membrane is thicker, punch drive assembly earlier, punch to supporting the membrane again, can avoid because the too thick problem that leads to punching failure or panel damage of punching material thickness.

In addition, punch to the direction that is close to light emitting component from the drive assembly, form first trompil, specifically include: etching from the driving assembly to the direction close to the light-emitting assembly sequentially through a photoetching process and an etching process to form a first opening; alternatively, the first opening is formed by cutting from the driving assembly to a direction close to the light emitting assembly by a pulsed laser cutting technique.

In addition, through the pulsed laser cutting technique, cut to the direction that is close to light emitting component from the drive assembly, form first trompil, specifically include: cutting the light-emitting component from the driving component to a direction close to the light-emitting component by using pulse laser with energy larger than a first preset value to form an initial opening; cutting the material around the initial open pore by using pulse laser with energy less than a second preset value to form a first open pore; the second preset value is smaller than the first preset value. In this realization, speed and the precision of punching have been improved.

In addition, the first preset value is greater than or equal to 2500 microjoules, and the second preset value is greater than or equal to 1000 microjoules.

In addition, through the pulsed laser cutting technique, cut from the drive assembly to the direction that is close to the light emitting component, form the first trompil, specifically include: cutting from the driving assembly to a direction close to the light emitting assembly by using a pulse laser; and corroding a cutting interface formed by the pulse laser cutting by using a corrosive chemical reagent to form a first open pore.

In addition, after the initial opening is formed by cutting the driving assembly in a direction close to the light emitting assembly by using the pulsed laser with the energy greater than the first preset value, the manufacturing method of the display panel further comprises the following steps: corroding a cutting interface formed by cutting with pulse laser with energy larger than a first preset value by using a corrosive chemical reagent; after the material around the initial opening is cut by using the pulsed laser with the energy less than the second preset value to form the first opening, the manufacturing method of the display panel further comprises the following steps: and corroding a cutting interface formed by cutting with the pulse laser with energy smaller than a second preset value by using a corrosive chemical reagent. In this implementation, the roughness of the cutting interface is reduced.

In addition, successively pass through photoetching technology and etching process, from drive assembly to the direction etching of being close to light emitting component, form first trompil, specifically include: forming an opening pattern on the driving component through a photoetching process; and etching from the driving assembly to the direction close to the light-emitting assembly through an etching process according to the opening pattern on the driving assembly to form a first opening.

In addition, forming a second opening penetrating through the support film specifically includes: and punching from the support film to the light-emitting assembly by mechanical punching or pulse laser cutting to form a second hole.

In addition, the bottom of the first opening is positioned in the driving assembly, and the first opening penetrates through the pixel limiting layer of the driving assembly; alternatively, the first opening penetrates through the driving assembly and the light emitting assembly.

In addition, the bottom of the first opening is located in the driving assembly, and when the first opening penetrates through the pixel defining layer of the driving assembly, the first opening is punched from the driving assembly to a direction close to the light emitting assembly, and after the first opening is formed, the manufacturing method of the display panel further comprises the following steps: a transparent material is deposited at the bottom of the first opening. In this implementation, the light transmittance of the apertured region is enhanced.

In addition, the method for manufacturing the display panel includes the steps of forming the driving assembly and the light emitting assembly on the first substrate, and forming a first opening by punching the hole from the driving assembly to a direction close to the light emitting assembly, wherein the method further includes: adhering a second substrate on the side of the light-emitting assembly, which is far away from the driving assembly; stripping the first substrate; before the side of the driving assembly, which is far away from the light-emitting assembly, is pasted with the supporting film, the manufacturing method of the display panel further comprises the following steps: and stripping the second substrate. In this realization, avoid light emitting component to be damaged in the punching process.

In addition, after the second substrate is peeled off, the manufacturing method of the display panel further comprises the following steps: and a protective film is adhered to one side of the light-emitting assembly, which is far away from the driving assembly. In this implementation, the light emitting assembly is prevented from being damaged during use.

In addition, after the first substrate is peeled off, the manufacturing method of the display panel further comprises the following steps: and cleaning the driving assembly. In this realization, the residual material of having avoided first base plate and the problem of the result of use in other impurity influences punching effect and display panel later stage.

In addition, the driving assembly comprises a driving circuit layer, the light emitting assembly comprises a light emitting layer, a thin film packaging layer and a touch layer, and the light emitting layer is adjacent to the driving circuit layer.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a flowchart of a method of manufacturing a display panel according to a first embodiment of the present invention;

fig. 2 is a flowchart of a method for manufacturing a display panel according to a second embodiment of the present invention;

fig. 3a to 3h are schematic structural diagrams of a display panel obtained after steps in a method for manufacturing a display panel according to a third embodiment of the present invention are performed;

fig. 4a to 4g are schematic structural diagrams of a display panel obtained after steps in a manufacturing method of a display panel according to a fourth embodiment of the present invention are performed.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

The first embodiment of the present invention relates to a method for manufacturing a display panel, and the method for manufacturing a display panel according to the present embodiment can be used for manufacturing a flexible display panel with holes or a rigid display panel with holes. In this embodiment, a flexible display panel is taken as an example to illustrate a manufacturing method, and a person skilled in the art can refer to relevant contents of this embodiment to prepare a rigid display panel with holes. As shown in fig. 1, the manufacturing apparatus applied to the display panel includes the following steps:

step 101: after a driving assembly and a light emitting assembly of the display panel are formed, a hole is punched from the driving assembly to a direction close to the light emitting assembly to form a first hole.

Specifically, the direction of the hole may be perpendicular to the surface of the light emitting element, or may form a predetermined angle with the surface of the light emitting element. The preset angle may be set as required, and may be any angle within an interval (80 degrees, 100 degrees), such as 89 degrees, for example.

It should be noted that, as will be understood by those skilled in the art, the first opening may be a bottom of the first opening located in the driving component, and the first opening may penetrate through a Pixel Definition Layer (PDL) of the driving component, or may penetrate through the driving component and the light emitting component, that is, the first opening is punched to a side of the light emitting component facing away from the driving component, and the bottom of the first opening is not limited in this embodiment.

In one embodiment, the bottom of the first opening is located in the driving component, and the first opening penetrates through the pixel defining layer of the driving component. The first opening is used for placing devices such as a camera. In the manufacturing process, a hole is punched downwards from one side, away from the light emitting component, of the driving component until the PDL layer is punched, and a first hole is formed. Because the camera needs to be placed in first trompil department, the colour in the PDL layer in the drive assembly can influence camera daylighting, so first trompil runs through the PDL layer. Optionally, after forming the first opening, a transparent material is deposited at the bottom of the first opening. The deposited transparent material may be a highly transparent material, for example, a transparent material such as graphene having a refractive index greater than 1.3.

In one embodiment, the first opening is used for placing a camera, in order to avoid the influence of the material of the light emitting component on the capture of an external image by the camera, in the direction of the vertical driving component and the light emitting component where the first opening is located, the driving component and the light emitting component are not partially provided with structures which influence the capture of the image by the camera, such as wiring, and the like, and the material arranged in the direction of the vertical driving component and the light emitting component where the first opening is located is transparent.

It is worth mentioning that the transparent material is deposited at the first opening hole, which can enhance the light transmittance at the opening hole.

In one embodiment, the process of depositing the transparent material at the bottom of the first opening is: and depositing a transparent material on the side of the driving assembly, which is far away from the light-emitting assembly, and removing the transparent material at the rest positions except the first opening hole by a method such as dry etching.

The manner of punching the first hole will be described below.

Mode 1: and etching from the driving assembly to the direction close to the light-emitting assembly through a photoetching process and an etching process in sequence to form a first opening. Specifically, an opening pattern is formed on the driving component through a photoetching process; and etching from the driving assembly to the direction close to the light-emitting assembly by an etching process according to the opening pattern on the driving assembly to form a first opening.

The following exemplifies a process of forming an opening pattern by a photolithography process. Firstly, a layer of photoresist is coated on the side of the driving component, which is far away from the light-emitting component. Then, a mask plate (mask) is placed on the driving assembly, and exposure operation is carried out, so that the photoresist which is not shielded on the driving assembly is subjected to chemical reaction. And finally, carrying out development operation, and forming a pattern of the mask plate, namely a hole pattern on the driving assembly in a mode of dissolving part of the photoresist. The opening pattern is a cross-sectional shape of an opening, and may be a circle, a square, or the like.

Mode 2: and cutting from the driving assembly to the direction close to the light emitting assembly by a pulse laser cutting technology to form a first opening.

In one embodiment, the cutting process of the pulsed laser is as follows: cutting the light-emitting component from the driving component to a direction close to the light-emitting component by using pulse laser with energy larger than a first preset value to form an initial opening; and cutting the material around the initial open hole by using a pulse laser with energy less than a second preset value to form a first open hole. The second preset value is smaller than the first preset value. The first preset value may be a value greater than or equal to 2500 microjoules, for example, the first preset value may be any value in the interval [2500 microjoules, 5000 microjoules ], the second preset value may be a value less than or equal to 1000 microjoules, for example, the second preset value may be any value in the interval [500 microjoules, 1000 microjoules ].

It should be noted that, as can be understood by those skilled in the art, in practical applications, the first preset value and the second preset value may be set according to a material of the driving assembly, and the embodiment is not limited.

It is worth mentioning that the larger the energy of the pulse laser is, the faster the cutting speed is, the faster the pulse laser with higher energy is used for rapid cutting, so that the punching operation can be completed faster, the cutting plane is refined by the pulse laser with lower energy, and the punching precision of the first hole can be improved.

In one embodiment, when the material around the initial opening is cut using the pulsed laser having an energy less than the second preset value, data of Automatic Optical Inspection (AOI) may be monitored, a roughness of a cutting plane may be detected, and the energy of the pulsed laser may be adjusted according to the roughness of the cutting plane.

In another embodiment, the cutting process of the pulsed laser is as follows: and cutting the light-emitting component from the driving component to the direction close to the light-emitting component by using a pulse laser to form a first opening. The energy of the pulse laser may be set according to the thickness of a driving member or the like to be cut.

It should be noted that, in practical applications, when the pulse laser cutting technology is used for cutting, the first opening may be formed by one-time cutting, or may be formed by multiple times of cutting, and the number of times of cutting is not limited in this embodiment.

In one embodiment, the manufacturing apparatus uses a pulsed laser to cut from the driving assembly to a direction close to the light emitting assembly, and uses a corrosive chemical reagent to corrode a cutting interface formed by the pulsed laser cutting, so as to form the first opening.

In one embodiment, after the initial opening is formed by cutting from the driving assembly in a direction close to the light emitting assembly using the pulsed laser having the energy greater than the first preset value, the cut interface formed by cutting using the pulsed laser having the energy greater than the first preset value is etched using an etching chemical. And after the material around the initial open pore is cut by using the pulse laser with the energy smaller than the second preset value to form the first open pore, a cutting interface formed by cutting by using the pulse laser with the energy smaller than the second preset value is corroded by using a corrosive chemical reagent. Specifically, when the pulse laser with the energy greater than the first preset value is used for cutting, the local uneven heating of the cutting interface is serious, so that the roughness of the cutting interface is high, and a high-concentration corrosive chemical reagent can be used for corroding the cutting interface formed by cutting the pulse laser with the energy greater than the first preset value. When the pulse laser with the energy smaller than the second preset value is used for cutting, the problem that the local part of the cutting interface is heated unevenly is not obvious, the roughness of the cutting plane is low, and a low-concentration corrosive chemical reagent can be used for corroding the cutting interface formed by cutting the pulse laser with the energy smaller than the second preset value.

It should be noted that, as will be understood by those skilled in the art, the corrosive chemical agent may be a hydrofluoric acid or the like, or may be another agent, and the present embodiment is not limited thereto.

It is to be understood by those skilled in the art that the concentration range of the high concentration of the corrosive chemical agent and the concentration range of the low concentration of the corrosive chemical agent may be determined according to the composition of the corrosive chemical agent. For example, when the corrosive chemical is hydrofluoric acid, a high concentration of the corrosive chemical means hydrofluoric acid having a concentration of not less than 0.5%, and a low concentration of the corrosive chemical means hydrofluoric acid having a concentration of less than 0.5%. The present embodiment does not limit the concentration range of the high-concentration corrosive chemical agent and the concentration range of the low-concentration corrosive chemical agent.

In one embodiment, the high concentration of the corrosive chemical may select hydrofluoric acid at a concentration in the interval of [ 0.5%, 1.0% ], and the low concentration of the corrosive chemical may select hydrofluoric acid at a concentration in the interval of [ 0.2%, 0.4% ].

It is worth mentioning that the cutting interface is corroded by corrosive chemical agents, so that the roughness of the cutting interface is reduced.

Step 102: and a support film is adhered to the side of the driving assembly, which is far away from the light-emitting assembly.

In particular, the support membrane may be made of various materials. For example, the support film may be an organic material film layer made of an organic material.

It should be noted that, as will be understood by those skilled in the art, in practical applications, the support film may be attached to the driving assembly by lamination, or may be attached to the driving assembly by other methods, and the present embodiment is not limited thereto.

Step 103: a second opening is formed through the support film.

Specifically, the first opening communicates with the second opening.

In one embodiment, when the driving assembly and the supporting film are punched, the hole positions and the hole patterns are locked through the same mask plate, so that the first hole and the second hole are consistent in position and the patterns are the same (namely, the hole sizes are consistent), and the effect of penetrating between the first hole and the second hole is achieved.

In one embodiment, the second opening can be formed by punching from the support film in the direction of the light emitting element by means of pulsed laser cutting or mechanical punching.

It should be noted that, as will be understood by those skilled in the art, in practical applications, holes may be formed in the support film by other hole forming methods, which are not listed here, and the hole forming method of the support film is not limited in this embodiment.

It should be noted that, as can be understood by those skilled in the art, the opening patterns of the first opening and the second opening may be circular holes or square holes, or may have other shapes, and the shape of the first opening and the second opening is not limited in this embodiment.

It should be noted that, in practical applications, the apparatus for manufacturing the display panel may include a plurality of devices, and the types of the devices are determined according to the processes used in manufacturing the display panel. For example, when the hole is punched by using a photolithography process and an etching process, the manufacturing apparatus includes a photolithography apparatus and an etching apparatus. The present embodiment does not limit the number and types of devices in the display panel manufacturing apparatus.

The above description is only for illustrative purposes and does not limit the technical aspects of the present invention.

Compared with the prior art, in the manufacturing method of the display panel provided by the embodiment, the display panel with the holes is obtained by punching the supporting film and the driving assembly, so that devices such as a camera and the like can be arranged in the punched hole area, and the screen occupation ratio is improved. During the punching process, the thickness of the supporting film is relatively thick, generally about 400 micrometers to 500 micrometers, while the thickness of the driving component and the light emitting component is relatively thin, and the total thickness is generally about 60 micrometers to 95 micrometers. The inventor finds that the current punching process cannot punch the support film and the driving assembly at the same time. For example, for the etching process, the etching thickness of the etching process is limited, and the supporting film cannot be etched by using the etching process to form the opening; for the pulse laser cutting process, if the supporting film and the protective film are simultaneously punched by using laser, the display panel may be burnt due to excessive heat; for the mechanical punching process, if the supporting film and the protective film are punched simultaneously, the inorganic film layer in the display panel may be damaged due to the uneven stress release in the punching process. Therefore, in the embodiment, the driving assembly is punched firstly, and then the supporting film is punched, so that the problem of punching failure or panel damage caused by over-thick punching material can be solved.

A second embodiment of the present invention relates to a method for manufacturing a display panel, and is an improvement of the first embodiment in a case where a driving element and a light emitting element are formed on a first substrate, the improvement being: other related steps are added before the punching operation of the first and second openings.

Specifically, as shown in fig. 2, the present embodiment includes steps 201 to 209, wherein step 205, step 206, and step 209 are substantially the same as steps 101 to 103 in the first embodiment, respectively, and are not repeated here.

The following mainly introduces the differences:

step 201: a driving assembly and a light emitting assembly of a display panel are sequentially formed on a first substrate.

In one embodiment, the driving assembly includes a driving circuit layer, and the light emitting assembly includes a light emitting layer adjacent to the driving circuit layer, a thin film encapsulation layer, and a touch layer. That is, when the display panel is manufactured, a driving circuit layer, a light emitting layer, a Thin Film Encapsulation (TFE) layer, and a touch layer are sequentially formed. The driving circuit layer may be a driving circuit layer of a Thin Film Transistor (TFT), and the Light Emitting layer may be a Light Emitting layer formed of an Organic Light-Emitting Diode (OLED).

In one embodiment, the driver circuit layer has a thickness of about 15 microns to about 20 microns, the light emitting layer has a thickness of about 30 microns to about 50 microns, the thin film encapsulation layer has a thickness of about 10 microns to about 15 microns, and the touch layer has a thickness of about 5 microns to about 10 microns.

Step 202: a second substrate is adhered to a side of the light emitting assembly facing away from the driving assembly.

In particular, the second substrate may be a glass substrate for supporting the display panel, which may reduce the probability of breakage of the touch layer of the display panel during the punching process.

In one embodiment, a high temperature resistant glue is deposited on the side of the light emitting assembly facing away from the driving assembly, and the second substrate and the light emitting assembly are adhered by the glue.

It is worth mentioning that the second substrate is adhered to the light emitting assembly, so that the side of the light emitting assembly, which is away from the driving assembly, can be prevented from being scratched or broken due to the punching operation.

Step 203: and stripping the first substrate.

Specifically, in order to punch the driving unit, the driving unit needs to be exposed, and thus, the first substrate to which the driving unit is fixed needs to be peeled off.

In one embodiment, the first substrate may be peeled by a Laser Lift Off (LLO) technique.

Step 204: and cleaning the driving assembly.

Specifically, after the first substrate is peeled off and before the punching operation is performed, the residual substances and other impurities of the first substrate on the surface of the driving assembly are cleaned, so that the adverse effect of the residual substances and other impurities of the first substrate on the punching effect can be reduced.

Step 205: a hole is punched from the driving component to the direction close to the light-emitting component to form a first hole.

In one embodiment, the display panel is flipped over after peeling the first substrate. For example, when the display panel drives the component and the light-emitting component on the first substrate, the display panel sequentially comprises the first substrate, the driving circuit layer, the light-emitting layer, the thin film encapsulation layer and the touch layer from bottom to top. After pasting the second base plate, peeling off first base plate, upset display panel, display panel is from supreme down to be in proper order promptly: the touch screen comprises a second substrate, a touch layer, a thin film packaging layer, a light emitting layer and a driving circuit layer.

Step 206: and a support film is adhered to the side of the driving assembly, which is far away from the light-emitting assembly.

Step 207: and stripping the second substrate.

Specifically, if the second substrate is attached to the light emitting element through the organic gel, the organic gel and the second substrate are removed.

Step 208: and a protective film is adhered to one side of the light-emitting assembly, which is far away from the driving assembly.

Specifically, the materials of the support film and the protective film may be the same or different. In one example, the support film and the protective film may be made of organic materials.

It is worth mentioning that the protective film is adhered to the side of the light emitting assembly away from the driving assembly, so that damage to the surface of the light emitting assembly from the outside can be reduced.

In one embodiment, the thickness of the support film and the protective film is 400 micrometers to 500 micrometers.

Step 209: a second opening is formed through the support film. The first opening communicates with the second opening.

Specifically, if the bottom of the first opening is located in the driving assembly, the first opening penetrates through the pixel limiting layer of the driving assembly, and the second opening penetrates through the support film, so that the display panel with the blind hole is obtained; and if the first opening penetrates through the light-emitting assembly and the driving assembly, the second opening penetrates through the protective film and the supporting film to form a through hole together with the first opening, so that the display panel with the through hole is obtained.

It should be noted that, in this embodiment, for clarity of description, step 208 is set as a step subsequent to step 207. However, it can be understood by those skilled in the art that in practical applications, if the bottom of the first opening is located in the driving element and the first opening penetrates through the pixel defining layer of the driving element, the step 208 can be set as a previous step to the step 207 as required, and this embodiment is not limited thereto.

Compared with the prior art, in the manufacturing method of the display panel provided by the embodiment, the display panel with the holes is obtained by punching the supporting film and the driving assembly, so that devices such as a camera and the like can be arranged in the punched hole area, and the screen occupation ratio is improved. In the punching process, because the thickness of supporting the membrane is thicker, punch drive assembly earlier, punch to supporting the membrane again, can avoid because the too thick problem that leads to punching failure or panel damage of punching material thickness. In addition, before the punching operation of the first hole, the second substrate is adhered to the surface of the light-emitting component, so that the problem that the surface of the light-emitting component is damaged to influence the display effect of the display panel is solved.

A third embodiment of the present invention relates to a method for manufacturing a display panel, and this embodiment exemplifies the first embodiment, and illustrates a process of forming a display panel with a blind via (i.e., a bottom of a first opening is located in a driving component, and the first opening penetrates through a pixel defining layer of the driving component) by using the method for manufacturing a display panel mentioned in the first embodiment.

Referring to fig. 3a, the driving assembly includes a driving circuit layer 301, the light emitting assembly includes a light emitting layer 302, a thin film encapsulation layer 303 and a touch layer 304, and after the driving assembly and the light emitting assembly are formed on a first substrate 305, before a protective film is attached, high temperature resistant organic glue deposition is performed on a side of the driving assembly away from the light emitting assembly to form an organic glue 306. The organic colloid 306 is used for adhering the second substrate and the driving circuit layer 301. Alternatively, the deposition thickness of the colloid may be 15 to 20 μm. The first substrate and the second substrate may be glass substrates, or substrates made of other materials and capable of preventing the film layer from being broken. Optionally, the second substrate may be attached with an organic glue having a thickness of 0.5 μm.

Referring to fig. 3b, after the organic colloid 306 is deposited, the second substrate 307 is adhered by the organic colloid 306. The second substrate 307 may be attached with 0.5 μm organic paste. The second substrate 307 is disposed on a side of the touch layer 304 away from the driving circuit layer 301, so that the display panel can be supported during the punching process, the touch layer 304 is prevented from being broken during the punching process, and an external device is prevented from scratching the touch layer 304 during the punching process.

Referring to fig. 3c, after the second substrate 307 is attached, an LLO process is performed to peel off the first substrate 305. Because need punch at drive circuit layer 301, for reducing the resistance of punching, avoid other impurity to influence the use of drive circuit layer 301, can first base plate 305 of glass to reduce the later stage resistance of punching, improve the speed of punching.

Referring to fig. 3d, the display panel after the first substrate 305 is removed is cleaned, and a photolithography process and an etching process are performed to etch the driving components until the PDL of the driving circuit layer 307 is etched, so as to form a first opening. Since there is a possibility that the residual substances of the first substrate may be adsorbed on the driving circuit layer 301 during the removing of the first substrate 305 by the LLO process, the display panel after the removing of the first substrate 305 may be cleaned before the hole drilling. The driving assembly is etched through a photoetching process and an etching process, and an opening can be formed in the driving assembly and used for placing devices such as a camera and the like.

In another embodiment, the first opening may be formed by: high-energy high-speed cutting processing is carried out on the film layer of the driving assembly through pulse laser, the film layer is cut to the PDL position, then high-concentration chemical reagents are used for carrying out chemical corrosion, and a cutting interface is repaired. According to the AOI monitoring data, a low-energy and low-speed secondary cutting is performed by a pulse laser, and then etching is performed by using a low-concentration chemical agent. Wherein the high concentration chemistry may actually be 0.5% hydrofluoric acid and the low concentration chemistry may be 0.2% hydrofluoric acid.

Referring to fig. 3e, a transparent material is deposited on a side of the driving member facing away from the light emitting member, the transparent material at the first opening is remained, and the transparent material at the rest positions except the first opening is removed. The transparent material is deposited on the opening area of the driving assembly, so that the light transmittance of the opening area can be improved. The transparent material may be graphene or the like, and the thickness of the transparent material may be 100 nm.

Referring to fig. 3f, a support film 308 is attached to the side of the driving assembly of fig. 3e facing away from the light emitting assembly. The support film 308 can isolate the drive assembly from contact with external devices, reducing damage to the drive assembly from external devices.

Referring to fig. 3g, the high temperature resistant organic colloid 306 and the second substrate 307 in fig. 3f are removed, and a protective film 309 is attached. The protective film 309 may isolate the touch layer 304 from direct contact with the outside, reducing damage to the touch layer 304 from the outside.

Referring to fig. 3h, holes are punched in the support film 308, resulting in second holes penetrating the support film 308. The second opening is communicated with the first opening, so that the display panel with the blind hole is obtained. The means of perforating the support film 308 may be pulsed laser cutting or mechanical perforation. After the first opening and the second opening are formed to communicate with each other, other processes may be selectively performed.

A fourth embodiment of the present invention relates to a method for manufacturing a display panel, and this embodiment exemplifies the first embodiment, and illustrates a process of forming a display panel with a through hole by the method for manufacturing a display panel according to the first embodiment.

Referring to fig. 4a, the driving assembly includes a driving circuit layer 401, the light emitting assembly includes a light emitting layer 402, a thin film encapsulation layer 403 and a touch layer 404, and after the driving assembly and the light emitting assembly are formed on a first substrate 405, before a protective film is attached, high temperature resistant organic glue deposition is performed on a side of the driving assembly away from the light emitting assembly to form an organic glue 406. The organic colloid 406 is used for adhering the second substrate and the driving circuit layer 401. Alternatively, the deposition thickness of the colloid may be 15 to 20 μm. The first substrate and the second substrate may be glass substrates, or substrates made of other materials and capable of preventing the film layer from being broken.

Referring to fig. 4b, after the organic colloid 406 is deposited, the second substrate 407 is adhered by the organic colloid 406. The second substrate 407 may be attached with 0.5 μm organic paste. The second substrate 407 is disposed on a side of the touch layer 404 away from the driving circuit layer 401, so that the display panel can be supported in a punching process, the touch layer 404 is prevented from being broken in the punching process, and external devices are prevented from scratching the touch layer 404 in the punching process.

Referring to fig. 4c, after the second substrate 407 is attached, an LLO process is performed to peel off the first substrate 405. Because need punch at drive circuit layer 401, for reducing the resistance of punching, avoid other impurity to influence the use of drive circuit layer 401, can first glass 405 to reduce the later stage resistance of punching, improve the speed of punching.

Referring to fig. 4d, after the first substrate 405 is peeled off, the display panel after the first substrate 405 is removed is cleaned, and a photolithography process and an etching process are performed to etch the driving assembly and the light emitting assembly until the touch layer 404 of the light emitting assembly is etched, so as to form a first opening penetrating through the driving assembly and the light emitting assembly.

In another embodiment, the first opening may be formed by: high-energy high-speed cutting processing is carried out on the film layer of the driving assembly through pulse laser, the film layer is cut to the PDL position, then high-concentration chemical reagents are used for carrying out chemical corrosion, and a cutting interface is repaired. According to the AOI monitoring data, a low-energy and low-speed secondary cutting is performed by a pulse laser, and then etching is performed by using a low-concentration chemical agent. The high concentration chemical may use hydrofluoric acid with a concentration of 0.05%, and the low concentration chemical may be 0.02% hydrofluoric acid.

Referring to fig. 4e, a support film 408 is attached to the side of the driving member facing away from the light emitting member. The support film 408 can isolate the drive assembly from contact with external devices, reducing damage to the drive assembly from external devices.

Referring to fig. 4f, the high temperature resistant organic colloid 406 and the second substrate 407 are removed, and the protective film 409 is attached. The protective film 409 may isolate the touch layer 404 from direct contact with the outside, reducing damage to the touch layer 304 from the outside.

Referring to fig. 4g, a hole is formed in the support film 408 and the protection film 409 to form a second opening, the second opening penetrates through the support film 408 and the protection film 409, and the second opening is communicated with the first opening. The manner of punching the support film 408 and the protection film 409 may be pulsed laser cutting or mechanical punching.

The steps of the above methods are divided for clarity, and the implementation may be combined into one step or split some steps, and the steps are divided into multiple steps, so long as the same logical relationship is included, which are all within the protection scope of the present patent; it is within the scope of the patent to add insignificant modifications to the algorithms or processes or to introduce insignificant design changes to the core design without changing the algorithms or processes.

A fifth embodiment of the present invention relates to a display panel produced by the method for producing a display panel according to any one of the first to fourth embodiments.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.

Claims

1. A method for manufacturing a display panel is characterized by comprising the following steps:

after a driving assembly and a light emitting assembly of a display panel are formed, punching holes from the driving assembly to the direction close to the light emitting assembly to form a first hole;

adhering a support film to one side of the driving assembly, which is far away from the light-emitting assembly;

and forming a second opening penetrating through the support film, wherein the first opening is communicated with the second opening.

2. The method for manufacturing a display panel according to claim 1, wherein the punching a hole from the driving element to a direction close to the light emitting element to form a first opening specifically comprises:

etching from the driving assembly to a direction close to the light emitting assembly sequentially through a photoetching process and an etching process to form the first opening; alternatively, the first and second electrodes may be,

and cutting from the driving assembly to the direction close to the light emitting assembly by a pulse laser cutting technology to form the first opening.

3. The method for manufacturing a display panel according to claim 2, wherein the forming the first opening by cutting from the driving component to a direction close to the light emitting component by a pulsed laser cutting technique specifically comprises:

cutting the light-emitting component from the driving component to a direction close to the light-emitting component by using pulse laser with energy larger than a first preset value to form an initial opening;

cutting the material around the initial open hole by using a pulse laser with energy smaller than a second preset value to form a first open hole; the second preset value is smaller than the first preset value.

4. The method for manufacturing a display panel according to claim 3,

the first preset value is greater than or equal to 2500 micro-joules, and the second preset value is greater than or equal to 1000 micro-joules.

5. The method for manufacturing a display panel according to claim 2, wherein the forming the first opening by cutting from the driving component to a direction close to the light emitting component by a pulsed laser cutting technique specifically comprises:

cutting from the driving assembly to a direction close to the light emitting assembly by using a pulse laser;

and corroding a cutting interface formed by the pulsed laser cutting by using a corrosive chemical reagent to form the first open pore.

6. The method for manufacturing the display panel according to claim 2, wherein the etching is performed from the driving assembly to a direction close to the light emitting assembly to form the first opening sequentially through a photolithography process and an etching process, and specifically includes:

forming an opening pattern on the driving component through a photoetching process;

and etching from the driving assembly to the direction close to the light-emitting assembly through an etching process according to the opening pattern on the driving assembly to form the first opening.

7. The method for manufacturing a display panel according to claim 6,

the opening patterns are circular or square.

8. The method for manufacturing a display panel according to any one of claims 1 to 7, wherein the forming of the second opening penetrating through the support film specifically includes:

and punching from the support film to the direction of the light-emitting component by means of mechanical punching or pulsed laser cutting to form the second opening.

9. The method according to any one of claims 1 to 7, wherein a bottom of the first opening is located in the driving element, and the first opening penetrates through a pixel defining layer of the driving element; alternatively, the first and second electrodes may be,

the first opening penetrates through the driving assembly and the light emitting assembly.

10. The method of claim 9, wherein a bottom of the first opening is located in the driving element, and when the first opening penetrates through the pixel defining layer of the driving element, after the hole is punched from the driving element to a direction close to the light emitting element to form the first opening, the method further comprises:

and depositing a transparent material at the bottom of the first opening.

11. The method for manufacturing a display panel according to any one of claims 1 to 7, wherein the driving element and the light emitting element are formed on a first substrate, and before the hole is punched from the driving element to a direction close to the light emitting element to form the first opening, the method for manufacturing a display panel further comprises:

adhering a second substrate to the side of the light emitting assembly facing away from the driving assembly;

peeling the first substrate;

before a support film is pasted on one side of the driving assembly, which is far away from the light-emitting assembly, the manufacturing method of the display panel further comprises the following steps:

and stripping the second substrate.

12. The method for manufacturing a display panel according to claim 11,

after the peeling of the second substrate, the manufacturing method of the display panel further includes: and a protective film is adhered to one side of the light-emitting assembly, which is far away from the driving assembly.

13. The method for manufacturing a display panel according to claim 11,

after the peeling of the first substrate, the manufacturing method of the display panel further includes: and cleaning the driving assembly.

14. The method for manufacturing a display panel according to claim 11,

the driving assembly comprises a driving circuit layer, the light emitting assembly comprises a light emitting layer, a thin film packaging layer and a touch layer, and the light emitting layer is adjacent to the driving circuit layer.