CN110634906A - Light-emitting diode display - Google Patents
Light-emitting diode display Download PDFInfo
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- CN110634906A CN110634906A CN201911046591.5A CN201911046591A CN110634906A CN 110634906 A CN110634906 A CN 110634906A CN 201911046591 A CN201911046591 A CN 201911046591A CN 110634906 A CN110634906 A CN 110634906A
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- 239000010409 thin film Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The invention discloses a light emitting diode display, comprising: the LED comprises a plurality of LEDs, wherein each LED comprises an LED chip and a patterned first magnetic electrode layer, and the first magnetic electrode layer is the anode and/or the cathode of the LED chip; the circuit substrate is used for driving a plurality of light emitting diodes and comprises a plurality of patterned second magnetic electrode layers which are arranged in a matrix mode, and the second magnetic electrode layers are used for being connected with the light emitting diodes in an adsorption mode. The invention solves the problem of mass transfer on the basis of not influencing the original device structure, achieves higher matching accuracy and improves the assembly efficiency.
Description
Technical Field
The embodiment of the invention relates to an LED assembly technology, in particular to a light-emitting diode display.
Background
Micro-LEDs are a new generation of display technology. Compared with the existing liquid crystal display, the flexible display panel has higher photoelectric efficiency, higher brightness, higher contrast ratio and lower power consumption, and can be combined with a flexible panel to realize flexible display. Compared with the traditional LED, the LED has the same light-emitting principle, but the size of a single LED is less than 20 mu m, so that the preparation difficulty is greatly improved. In the preparation process, a mass transfer technology is a key.
To accommodate large area displays, a large number of LEDs need to be transferred from a sapphire substrate to a glass plate. The traditional 'grabbing and releasing' method has low efficiency, cannot transfer large area in short time, and has low efficiency.
Disclosure of Invention
The invention provides a light emitting diode display to realize a display screen with diodes of at least two colors assembled at the same time, which can improve the mass transfer rate of the existing fluid assembly by at least three times and simultaneously achieve higher matching accuracy.
In a first aspect, an embodiment of the present invention provides a light emitting diode display, including:
the LED comprises a plurality of LEDs, wherein each LED comprises an LED chip and a patterned first magnetic electrode layer, and the first magnetic electrode layer is the anode and/or the cathode of the LED chip;
the circuit substrate is used for driving a plurality of light emitting diodes and comprises a plurality of patterned second magnetic electrode layers which are arranged in a matrix mode, and the second magnetic electrode layers are used for being connected with the light emitting diodes in an adsorption mode.
Further, the electrode patterns of the first magnetic electrode layer and the second magnetic electrode layer are the same, and the first magnetic electrode layer and the second magnetic electrode layer include at least two different electrode patterns.
Further, the area of the first magnetic electrode layer and the second magnetic electrode layer is between 1 square micrometer and 1 square millimeter.
Further, the electrode pattern includes: at least two of a solid circle, a solid rectangle, and a solid triangle.
Further, the electrode pattern includes: at least two of a rectangular ring shape, a circular ring shape, a triangular ring shape and a cross shape.
Further, the rectangular ring shape includes: a rectangular ring shape with continuous side length and/or a rectangular ring shape with side length broken from the middle point.
Further, the triangular ring shape includes: a triangular ring with continuous sides and/or a triangular ring with sides broken from the midpoint.
Further, the circular ring shape includes: the side length is continuous and/or the fracture circular ring shape is centrosymmetric by taking the circle center of the circular ring as the center.
Further, the ring shape also includes:
any position of the circular ring is provided with a convex random pattern; and/or any pattern is arranged at the four corners of the square on the surfaces of the first magnetic electrode layer and the second magnetic electrode layer.
Further, the cross shape includes: the cross is formed by intersecting two line segments with certain width; and/or four crosses which are formed by inward right angles and parallel right-angle sides of the L-shaped pattern with a certain width.
According to the invention, through designing various electrode patterns, at least two LED diodes can be assembled at the same time, the problem of mass transfer is solved on the basis of not influencing the original device structure, higher matching accuracy is achieved, and the assembly efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a color led display according to a first embodiment of the invention.
Fig. 2 is a schematic structural diagram of a monochromatic light emitting diode display according to a second embodiment of the present invention.
Fig. 3 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 4 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 5 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 6 is a schematic diagram of the superposition of two rectangular rings with different side lengths in the third embodiment of the present invention.
Fig. 7 is a schematic diagram of a combination of circular ring-shaped electrode patterns with the same outer ring diameter and different ring widths according to a third embodiment of the present invention.
Fig. 8 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 9 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 10 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 11 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Fig. 12 is a schematic combination diagram of an electrode pattern in the third embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the terms "first," "second," and the like may be used herein to describe various orientations, actions, steps, elements, or the like, but the orientations, actions, steps, or elements are not limited by these terms. These terms are only used to distinguish one direction, action, step or element from another direction, action, step or element. For example, the first magnetic electrode layer may be referred to as the second magnetic electrode layer, and similarly, the second magnetic electrode layer may be referred to as the first magnetic electrode layer, without departing from the scope of the present invention. The first magnetic electrode layer and the second magnetic electrode layer are not both the same magnetic electrode layer. The terms "first", "second", etc. are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. It should be noted that when a portion is referred to as being "secured to" another portion, it can be directly on the other portion or there can be an intervening portion. When a portion is said to be "connected" to another portion, it may be directly connected to the other portion or intervening portions may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
The following examples refer to LEDs with the following meanings:
an LED, a Light Emitting Diode, is a semiconductor Diode that can convert electrical energy into Light energy, has the characteristics of small volume, high brightness, low energy consumption, and the like, can emit Light of different colors through different material combinations and production modes, and is widely applied in the fields of display screens, backlight sources, and illumination. With the development of micro LEDs applied to high-resolution displays, micro LED technology has attracted much attention, and compared to conventional LEDs, when the micro LEDs are transferred to different transfer substrates after the chips are manufactured, the conventional LED transfer technology is not suitable for the micro LEDs because the number of the micro LEDs to be transferred is large.
Example one
The Micro process technology and the mass transfer technology are core processes of the Micro-LED transfer process, wherein the Micro process technology is to carry out Micro, array and thin film on the traditional LED crystal thin film. The mass transfer technology is to transfer the micro-scale and arrayed LED crystal thin films to a circuit board in batch. The micro light-emitting diode chips with the diameter less than 100 microns are arranged in a matrix mode, and then the micro light-emitting diode chips are transferred to a circuit board in batches by using a huge transfer technology to be packaged to form a whole LED panel.
As shown in fig. 1, a light emitting diode display 1 is provided in the present embodiment, and the light emitting diode display 1 of the present embodiment is a color display.
The light emitting diode display 1 of the present embodiment includes a circuit substrate 2 and a plurality of light emitting diodes. The plurality of light emitting diodes of the present embodiment includes a first light emitting diode 3, a second light emitting diode 4, and a third light emitting diode 5. Each light emitting diode comprises a light emitting diode chip and a patterned first magnetic electrode layer, wherein the first magnetic electrode layer is an anode and/or a cathode of the light emitting diode chip.
Specifically, the first light emitting diode 3 includes a red light emitting diode chip 31 and a first electrode pattern 32, the second light emitting diode 4 includes a green light emitting diode chip 41 and a second electrode pattern 42, and the third light emitting diode 5 includes a blue light emitting diode chip 51 and a third electrode pattern 52. Alternatively, the light emitting diode may be: the first light emitting diode comprises a green light emitting diode chip, the second light emitting diode comprises a red light emitting diode chip, and the third light emitting diode comprises a blue light emitting diode chip; or the first light emitting diode comprises a green light emitting diode chip, the second light emitting diode comprises a blue light emitting diode chip, and the third light emitting diode comprises a red light emitting diode chip; or the first light emitting diode comprises a red light emitting diode chip, the second light emitting diode comprises a blue light emitting diode chip, and the third light emitting diode comprises a green light emitting diode chip; or the first light emitting diode comprises a blue light emitting diode chip, the second light emitting diode comprises a green light emitting diode chip, and the third light emitting diode comprises a red light emitting diode chip; or the first light emitting diode comprises a blue light emitting diode chip, the second light emitting diode comprises a red light emitting diode chip, and the third light emitting diode comprises a green light emitting diode chip.
Alternatively, in the present embodiment, the first electrode patterns 32 are square, the second electrode patterns 42 are cross-shaped, and the third electrode patterns 52 are circular.
The circuit substrate 2 includes a plurality of patterned second magnetic electrode layers arranged in a matrix, and the second magnetic electrode layers are used for being connected with a plurality of light emitting diodes in an adsorption manner.
Specifically, for attaching the first light emitting diode 3, there are fourth electrode patterns 21, for attaching the fifth electrode patterns 22 of the second light emitting diode 4, and for attaching the sixth electrode patterns 23 of the third light emitting diode 5. In the present embodiment, the fourth electrode pattern 21 is square, the fifth electrode pattern 22 is cross-shaped, and the sixth electrode pattern 23 is circular.
The first magnetic electrode layer is disposed at the bottom of the led chip, and is attracted to the second magnetic electrode layer on the circuit substrate 2 during mass transfer. In the present embodiment, the first electrode patterns 32 and the fourth electrode patterns 21 of the first light emitting diode 3 are both square, and have similar shapes, so that the magnetic attraction is larger, and the first light emitting diode 3 can be adsorbed on the fourth electrode patterns 21; similarly, the second electrode pattern 42 and the fifth electrode pattern 22 of the second light emitting diode 4 are both cross-shaped, so that the second light emitting diode 4 is adsorbed on the fifth electrode pattern 22, and the third electrode pattern 123 and the sixth electrode pattern 23 of the third light emitting diode 5 are both circular ring-shaped, so that the third light emitting diode 5 is adsorbed on the sixth electrode pattern 23.
The step can distinguish the red light diode chip, the blue light diode chip and the green light diode chip in the adsorption process, a lift-off process is used in cooperation with metal sputtering, so that the first magnetic electrode layer has a specific electrode pattern, and the same magnetic pattern is deposited on the second magnetic electrode layer of the circuit substrate. In the equipment concatenation in-process, put a large amount of emitting diode chips in the liquid environment and obtain suspension, be provided with the second magnetism electrode layer on the circuit substrate, go up the electricity back, the absorption through the magnetism electrode makes first magnetism electrode layer and second magnetism electrode layer adsorb each other, because the magnetism electrode layer includes three kinds of different electrode patterns, because the contact ratio is less between the different patterns, the adsorption affinity each other is also little, when the mismatch appears, can make the emitting diode of mismatch break away from the base plate and adsorb again through the vibration, reach the effect that improves the yield.
The size of the light emitting diode chip is generally in millimeter and micron level, and the sizes of the first magnetic electrode layer, the second magnetic electrode layer and the electrode pattern on the surface are smaller than that of the light emitting diode chip.
With the led display of this embodiment, the step of the bulk transfer process can be optionally implemented by the following processes:
1. the method comprises the steps of placing a circuit substrate in a solution tank containing buffer solution, wherein the buffer solution submerges the circuit substrate, the circuit substrate comprises a plurality of patterned second magnetic electrode layers which are arranged in a matrix shape, the second magnetic electrode layers are used for being connected with light-emitting diodes in an adsorption mode, and the first magnetic electrode layers and the second magnetic electrode layers comprise three different electrode patterns which are respectively a first pattern, a second pattern and a third pattern so as to distinguish red light diode chips, blue light diode chips and green light diode chips in an adsorption process. Wherein the buffer solution is non-conductive deionized water or acetone. The circuit substrate is placed in a solution tank containing buffer solution, and the second magnetic electrode layer arranged on the circuit substrate is completely immersed in the buffer solution.
2. The light emitting diode was immersed in the buffer solution.
3. Driving the buffer solution to flow so as to align the first electrode pattern of the first magnetic electrode layer to the fourth electrode pattern of the second magnetic electrode layer on the substrate, align the second electrode pattern of the first magnetic electrode layer to the fifth electrode pattern of the second magnetic electrode layer on the substrate, and align the third electrode pattern of the first magnetic electrode layer to the sixth electrode pattern of the second magnetic electrode layer on the substrate; the first electrode pattern of the first magnetic electrode layer and the fourth electrode pattern of the second magnetic electrode layer on the substrate, the second electrode pattern of the first magnetic electrode layer and the fifth electrode pattern of the second magnetic electrode layer on the substrate, and the third electrode pattern of the first magnetic electrode layer and the sixth electrode pattern of the second magnetic electrode layer on the substrate are mutually attracted through magnetic force.
In this step, the method for driving the flow of the buffer solution includes: the liquid is subjected to ultrasonic oscillation or is stirred by means of external force. The liquid flow can generate micro mechanical force to push the light emitting diode and the circuit substrate to align.
For example, as shown in fig. 1, after the buffer solution is driven to flow, the red light emitting diode, the green light emitting diode and the blue light emitting diode move under the driving of the micro mechanical force of the buffer solution, for example, when the first electrode pattern is aligned with the second magnetic electrode layer pattern of the circuit substrate under the driving of the micro mechanical force, the second magnetic electrode layer pattern of the circuit substrate attracts the first magnetic electrode layer of the first light emitting diode through the magnetic force to transfer the first light emitting diode onto the circuit substrate. The absorption process of the second light emitting diode and the third light emitting diode is the same as that of the first light emitting diode.
In this embodiment, the size of the electrode pattern is in direct proportion to the yield of transfer assembly, and in the assembly process, as the area of the electrode pattern increases, the strength of the magnetic force absorbed between the electrode layers also increases, so that the error absorption is more likely to occur, and the error absorption cannot be vibrated and fall off, thereby reducing the yield. The assembling process of the millimeter-scale light-emitting diode chip can use a traditional splicing method, and also can use the light-emitting diode display of the embodiment, and the micron-scale light-emitting diode display of the embodiment has higher yield. Preferably, in the present embodiment, the area of the first magnetic electrode layer and the second magnetic electrode layer is between 1 square micrometer and 1 square millimeter.
In the embodiment, the magnetic electrode layer is additionally arranged on the anode or the cathode of the light-emitting diode chip, so that the light-emitting diode has magnetism with matched characteristics, and the light-emitting diodes of three colors of the color diode display can be simultaneously assembled only by manufacturing the circuit substrate with a proper distance according to requirements and enabling the wrongly-adsorbed device to be separated and adsorbed again, thereby improving the mass transfer efficiency.
Example two
As shown in fig. 2, in the present embodiment, a light emitting diode display 6 is provided, and the light emitting diode display 6 is a monochrome display.
The light emitting diode display 6 of the present embodiment includes a circuit substrate 7 and a plurality of light emitting diodes. The plurality of light emitting diodes of the present embodiment include a first light emitting diode 8 and a second light emitting diode 9. Each light emitting diode comprises a light emitting diode chip and a patterned first magnetic electrode layer, wherein the first magnetic electrode layer is an anode and/or a cathode of the light emitting diode chip.
Specifically, the first light emitting diode 8 includes a red diode chip 81 and a seventh electrode pattern 82, and the second light emitting diode 9 includes a green diode chip 91 and an eighth electrode pattern 92. In the present embodiment, the seventh electrode pattern 82 is exemplarily square, and the eighth electrode pattern 92 is cross-shaped. Alternatively, the light emitting diode may be: the first light emitting diode comprises a green light emitting diode chip, and the second light emitting diode comprises a blue light emitting diode chip; or the first light emitting diode comprises a green light emitting diode chip and the second light emitting diode comprises a red light emitting diode chip; or the first light emitting diode comprises a blue light emitting diode chip, and the second light emitting diode comprises a red light emitting diode chip; or the first light emitting diode comprises a blue light emitting diode chip and the second light emitting diode comprises a green light emitting diode chip; or the first light emitting diode comprises a red light emitting diode chip and the second light emitting diode comprises a blue light emitting diode chip.
The circuit substrate 7 includes a plurality of patterned second magnetic electrode layers arranged in a matrix, and the second magnetic electrode layers are used for being connected with a plurality of light emitting diodes in an adsorption manner.
Specifically, what is used to attach the first light emitting diode 8 is the ninth electrode pattern 71, and what is used to attach the tenth electrode pattern 72 of the second light emitting diode 9. In the present embodiment, the ninth electrode pattern 71 is square, and the tenth electrode pattern 72 is cross-shaped.
The first magnetic electrode layer is disposed at the bottom of the led chip, and is attracted to the second magnetic electrode layer on the circuit substrate 7 during mass transfer. In the present embodiment, the seventh electrode pattern 82 and the ninth electrode pattern 71 of the first light emitting diode 8 are both square, and have similar shapes, so that the magnetic attraction is larger, and the first light emitting diode 8 can be adsorbed on the ninth electrode pattern 71; similarly, the eighth electrode pattern 92 and the tenth electrode pattern 72 of the second light emitting diode 9 are both cross-shaped, so that the second light emitting diode 9 is adsorbed on the tenth electrode pattern 72.
In the embodiment, the magnetic electrode layer is added on the anode or the cathode of the light-emitting diode chip, so that the light-emitting diode has magnetism with matched characteristics, and only the circuit substrate with a proper distance needs to be manufactured as required, so that the wrongly-adsorbed device can be separated and re-adsorbed, the assembly of the monochrome diode display is realized, and the mass transfer efficiency is improved.
EXAMPLE III
The present embodiment provides a plurality of electrode patterns of the first magnetic electrode layer and the second magnetic electrode layer for the case where at least two kinds of diode chips are assembled at the same time. Through designing different electrode patterns, make two kinds at least colour devices can match simultaneously, need not to divide and shift many times, simultaneously through designing special electrode pattern, make the difference between the electrode pattern great, the contact ratio is little to reach higher matching precision, promote the efficiency and the yield of equipment process greatly.
In the assembling process of the present embodiment, the following assembling conditions are included: the red light diode chip and the blue light diode chip are assembled at the same time, and the blue light diode chip and the green light diode chip are assembled at the same time; assembling the red light diode chip and the green light diode chip simultaneously; or the red light diode chip, the blue light diode chip and the green light diode chip are assembled at the same time. In the present embodiment, a color led display is taken as an example to describe electrode patterns selected when three chips, i.e., a red led chip, a blue led chip and a green led chip, are assembled simultaneously.
The led display of this embodiment has a plurality of leds, each led includes a led chip and a patterned first magnetic electrode layer, and the first magnetic electrode layer is an anode and/or a cathode of the led chip.
The plurality of light emitting diodes includes a first light emitting diode, a second light emitting diode, and a third light emitting diode. Each light emitting diode comprises a light emitting diode chip and a patterned first magnetic electrode layer, in particular, the first light emitting diode comprises a red light emitting diode chip and a first electrode pattern, the second light emitting diode comprises a green light emitting diode chip and a second electrode pattern, and the third light emitting diode comprises a blue light emitting diode chip and a third electrode pattern.
The electrode pattern may include at least two of a solid circle, a solid rectangle, and a solid triangle. Illustratively, in the manufacturing process of the color light emitting diode display of the present embodiment, the first electrode pattern, the second electrode pattern, and the third electrode pattern are solid circles, solid rectangles, and solid triangles, including but not limited to the following combinations: the first electrode pattern can be a solid circle, the second electrode pattern can be a solid square, and the third electrode pattern can be a solid triangle; or the first electrode pattern is a solid square, the second electrode pattern is a solid circle, and the third electrode pattern is a solid triangle; or the first electrode pattern is a solid triangle, the second electrode pattern is a solid square, the first electrode pattern is a solid circle, etc. The combination of the first electrode pattern, the second electrode pattern, and the third electrode pattern described below may be changed in combination pattern in the above manner.
Illustratively, as shown in fig. 3, the first electrode pattern is a solid circle, the second electrode pattern is a solid square, and the third electrode pattern is a solid triangle.
The electrode pattern may further include: at least two of a rectangular ring shape, a circular ring shape, a triangular ring shape and a cross shape. In the manufacturing process of the color led display of the present embodiment, for example, as shown in fig. 4, the first electrode pattern is a rectangular ring, the second electrode pattern is a triangular ring, and the third electrode pattern is a circular ring.
Wherein, at least two kinds of electrode patterns are different, which can include but not limited to the following cases: the same pattern is gradually zoomed to form different electrode patterns, the three patterns are different from each other, the annular bandwidth of the annular pattern is different, and the like.
As shown in fig. 5, the first electrode pattern, the second electrode pattern and the third electrode pattern are different electrode patterns formed by gradually scaling the same pattern, and illustratively, the first electrode pattern is a rectangular ring shape having an outer side length of e1, the second electrode pattern is a rectangular ring shape having an outer side length of e2, and the third electrode pattern is a rectangular ring shape having an outer side length of e 3. Illustratively, e1 is 10 microns, e2 is 8 microns, and e3 is 5 microns.
When the ring width is constant and the square rings with the side lengths e1 and e2 of the gradual scaling are overlapped with each other, as shown in fig. 6, the overlapping degree reaches 50%, similarly, the overlapping degree of the triangular ring of the gradual scaling reaches 66.7%, and the overlapping degree of the circular ring is 25%.
As shown in fig. 7, the outer ring diameters of the ring patterns are all d, the ring widths are different, the first electrode pattern is a circular ring with a ring width of d1, the second electrode pattern is a circular ring with a ring width of d2, and the third electrode pattern is a circular ring with a ring width of d 3.
During the assembly process, the circuit board will be erroneously attached due to the excessively high contact ratio, which affects the yield. Therefore, preferably, the electrode patterns in this embodiment are selected from three circular ring type patterns with the same bandwidth and different sizes, so as to achieve lower overlap ratio of different electrode patterns, and to achieve the best assembly effect.
In the present embodiment, the rectangular ring shape of the electrode pattern includes: a rectangular ring shape with continuous side length and/or a rectangular ring shape with side length broken from the middle point. The triangular ring shape includes: a triangular ring with continuous sides and/or a triangular ring with sides broken from the midpoint. The cruciform pattern may further include: the cross is formed by intersecting two line segments with certain width; and/or four crosses which are formed by inward right angles and parallel right-angle sides of the L-shaped pattern with a certain width. The ring shape includes: the side length of the continuous circular ring d5 and/or the center of the circular ring is used as the center, and the circular ring is in a centrosymmetric broken circular ring shape.
The first electrode pattern, the second electrode pattern, and the third electrode pattern may be combined by selecting any of the above-described patterns, and exemplarily, as shown in fig. 8, the first electrode pattern is a rectangular ring shape having a continuous side length, the second electrode pattern is a rectangular ring shape having a side length broken from a midpoint, and the third electrode pattern is a triangular ring shape having a continuous side length; as shown in fig. 9, the first electrode pattern is a triangular ring shape whose side length is broken from the middle point, the second electrode pattern is a cross shape whose side length is broken from the side length, and the third electrode pattern is a cross shape formed by four "L" shaped patterns with a certain width, which are arranged in a right angle inward and a right angle side in parallel.
As shown in fig. 11, the first electrode pattern is cross-shaped, the second electrode pattern is circular, and the third electrode pattern is a triangular ring with sides broken from a midpoint.
In the assembling process, because the circular ring type electrode patterns are symmetrical, the inclined light-emitting diode and the circuit substrate can also generate strong enough adsorption force, so that the light-emitting diode is adsorbed on the circuit substrate and can rotate at a certain angle. Therefore, in another alternative embodiment, patterns are added to the circular ring type electrode patterns to perform the function of orienting the circular ring type electrode patterns so as to control the orientation adsorption arrangement of the assembly process. In this step, two ways of adding patterns are included, but not limited to: any position of the circular ring is provided with a convex random pattern; and/or any pattern is arranged at the four corners of the square on the surfaces of the first magnetic electrode layer and the second magnetic electrode layer. The pattern added is not limited to the pattern shown in the figure, but may be any pattern that can make the circular ring type play a role in orientation.
As shown in fig. 10, the first electrode pattern is cross-shaped, the second electrode pattern is circular ring having a protruding arbitrary pattern at an arbitrary position of the circular ring, and the third electrode pattern is triangular ring having a side length broken from a middle point.
As shown in fig. 11, the first electrode pattern is cross-shaped, the second electrode pattern is circular with four additional small symmetrical squares, and the third electrode pattern is triangular ring with side length broken from the middle point.
When the difference between the electrode patterns is larger, the contact ratio is lower, the red light-emitting diode green light-emitting diode and the blue light-emitting diode can be better distinguished, and the assembly yield is improved.
This embodiment makes the difference between the electrode pattern great through designing special electrode pattern, and the coincidence degree is little to reach higher matching precision, promote the efficiency and the yield of equipment process simultaneously greatly.
The product can execute the method provided by any embodiment of the invention, and has corresponding functional modules and beneficial effects of the execution method.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A light emitting diode display, comprising:
the LED comprises a plurality of LEDs, wherein each LED comprises an LED chip and a patterned first magnetic electrode layer, and the first magnetic electrode layer is the anode and/or the cathode of the LED chip;
the circuit substrate is used for driving a plurality of light emitting diodes and comprises a plurality of patterned second magnetic electrode layers which are arranged in a matrix mode, and the second magnetic electrode layers are used for being connected with the light emitting diodes in an adsorption mode.
2. The light-emitting diode display defined in claim 1, wherein the electrode patterns of the first magnetic electrode layer and the second magnetic electrode layer are the same, and the first magnetic electrode layer and the second magnetic electrode layer comprise at least two different electrode patterns.
3. The light-emitting diode display defined in claim 1 wherein the first and second magnetic electrode layers have an area of between 1 square micron and 1 square millimeter.
4. The light-emitting diode display defined in claim 2, wherein the electrode pattern comprises: at least two of a solid circle, a solid rectangle, and a solid triangle.
5. The light-emitting diode display defined in claim 2, wherein the electrode pattern comprises: at least two of a rectangular ring shape, a circular ring shape, a triangular ring shape and a cross shape.
6. The light-emitting diode display according to claim 5, wherein the rectangular ring shape includes: a rectangular ring shape with continuous side length and/or a rectangular ring shape with side length broken from the middle point.
7. The LED display according to claim 5, wherein said triangular ring comprises: a triangular ring with continuous sides and/or a triangular ring with sides broken from the midpoint.
8. The LED display according to claim 5, wherein the circular ring shape comprises: the side length is continuous and/or the fracture circular ring shape is centrosymmetric by taking the circle center of the circular ring as the center.
9. The led display according to claim 8, wherein the circular ring shape further comprises:
any position of the circular ring is provided with a convex random pattern; and/or
And any pattern is arranged at the four corners of the square on the surfaces of the first magnetic electrode layer and the second magnetic electrode layer.
10. The light-emitting diode display defined in claim 5, wherein the cross shape comprises: the cross is formed by intersecting two line segments with certain width; and/or
Four L-shaped patterns with certain width are arranged in a cross shape formed by right-angle inward and right-angle sides in parallel.
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