CN110633497B - Springback compensation method for variable compensation factor stamping part - Google Patents
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Abstract
The invention discloses a method for compensating rebound of stamping parts by using variable compensation factors, which comprises the following steps: s1, designing and manufacturing a trial mold surface C' based on the product part R; s2, punching by using a test die surface C' to obtain a test die stamping part; s3, reconstructing the molded surface through reverse engineering to obtain a virtual product part R'; s4, obtaining a forming grid molded surface R 'and a simulation rebounding grid molded surface S'; s5, obtaining a compensation grid molded surface C'; s6, calculating a node compensation factor; s7, obtaining a forming grid molded surface R1And simulation resilience grid profile S1(ii) a S8, generating a compensation grid profile C1(ii) a S9 shaping grid based profile R1And compensating the mesh profile C1And globally deforming the test mold surface C' to obtain a CAD digital model of the compensation molded surface of the product part R. The invention calculates the compensation factor by combining numerical simulation and trial stamping for each node of the grid surface, thereby obtaining the compensation profile of the product part, and has the advantages of high compensation precision, short die development period and low cost.
Description
Technical Field
The invention relates to the technical field of sheet stamping forming, in particular to a method for compensating springback of a stamping part by using variable compensation factors.
Background
Springback is a common problem in stamping, especially for bends and shallow drawn parts, it is more severe. The springback not only affects the shape and size precision of the stamping part, but also brings difficulty to the subsequent assembly process. The wide use of high strength steel makes the accuracy problem that the resilience brought more and more serious.
The stamping and forming simulation technology is widely applied to the field of automobiles, but the accuracy of the springback simulation is about 25 percent due to the fact that parameters influencing the numerical simulation are complex. If compensation is carried out according to the rebound simulation result, the obtained compensation profile is not ideal; if compensation is carried out according to the mould test result, the mould test can be carried out for multiple times, and the manufacturing cost and the manufacturing period are increased.
Therefore, how to quickly and accurately compensate the springback in the stamping process becomes a problem which needs to be solved by the technical personnel in the field.
Disclosure of Invention
Aiming at the defects in the prior art, the technical problems to be solved by the invention are as follows: how to quickly and accurately compensate the springback in the stamping forming.
In order to solve the technical problems, the invention adopts the following technical scheme:
a method for compensating rebound of stamping parts by using variable compensation factors comprises the following steps:
s1, designing and manufacturing a trial mold surface C' based on the product part R;
s2, punching by using a test die surface C' to obtain a test die stamping part;
s3, carrying out three-dimensional scanning on the test die stamping part, and reconstructing the molded surface through reverse engineering to obtain a virtual product part R';
s4, performing stamping forming and springback simulation analysis on the virtual product part R ' to obtain a formed grid profile R ' and a simulated springback grid profile S ';
s5, forcibly deforming the grid molded surface R 'onto a test mold surface C' to obtain a compensation grid molded surface C ', wherein nodes on the formed grid molded surface R', the simulation rebounding grid molded surface S 'and the compensation grid molded surface C' are in one-to-one correspondence;
s6, calculating a compensation factor of each node in the forming grid profile R ', the simulation rebounding grid profile S ' and the compensation grid profile C ';
s7, performing stamping forming and springback simulation analysis on the product part R to obtain a forming grid profile R1And simulation resilience grid profile S1；
S8 shaping grid profile R based on compensation factor1And simulation resilience grid profile S1Generating a compensated grid profile C1；
S9 shaping grid based profile R1And compensating the mesh profile C1And globally deforming the test mold surface C' to obtain a CAD digital model of the compensation molded surface of the product part R.
Preferably, between S5 and S6:
and reversely offsetting the compensation grid profile C 'and the simulation rebound grid profile S' by preset thickness.
Preferably, the preset thickness is the thickness of the production part R.
Preferably, the compensation factor for each node in the forming mesh profile R ", the simulated bouncing mesh profile S" and the compensation mesh profile C "is calculated based on the following formula:
αi＝ci”/si”
in the formula, alphaiRepresenting the compensation factor of the i-th node, ci"represents the true offset, s, of the ith nodei"represents the simulated springback value, x, of the ith nodeiR”、yiR”And ziR”X, y and z coordinates representing the ith node on the profile R' of the forming grid, xiC”、yiC”And ziC”Respectively representing the x, y and z-axis coordinates of the ith node on the compensation grid profile C ″, xiS”、yiS”And ziS”Respectively representing x, y and z-axis coordinates of the ith node on the simulation springback grid profile S', and t representing the thickness of the product part R.
Preferably, the compensation grid profile C is calculated based on the following formula1To generate a compensated mesh profile C1：
In the formula (I), the compound is shown in the specification,
and
respectively representing the profile R of the forming grid1The x, y and z axis coordinates of the upper i-th node,
and
respectively representing the compensating grid profile C1The x, y and z axis coordinates of the upper i-th node,
and
respectively representing simulated springback grid profiles S1The x, y and z axis coordinates of the ith node.
In summary, the invention discloses a springback compensation method for a stamping part with variable compensation factors, which comprises the following steps: s1, designing and manufacturing a trial mold surface C' based on the product part R; s2, punching by using a test die surface C' to obtain a test die stamping part; s3, carrying out three-dimensional scanning on the test die stamping part, and reconstructing the molded surface through reverse engineering to obtain a virtual product part R'; s4, performing stamping forming and springback simulation analysis on the hypothetical product part R ' to obtain a formed grid profile R ' and a simulated springback grid profile S '; s5, forcibly deforming the grid molded surface R 'onto a test mold surface C' to obtain a compensation grid molded surface C ', wherein nodes on the formed grid molded surface R', the simulation rebounding grid molded surface S 'and the compensation grid molded surface C' are in one-to-one correspondence; s6, calculating a compensation factor of each node in the forming grid profile R ', the simulation rebounding grid profile S ' and the compensation grid profile C '; s7, performing stamping forming and springback simulation analysis on the product part R to obtain a forming grid profile R1And simulation resilience grid profile S1(ii) a S8 shaping grid profile R based on compensation factor1And simulation resilience grid profile S1Generating a compensated grid profile C1(ii) a S9 radicalIn the forming of the grid profile R1And compensating the mesh profile C1And globally deforming the test mold surface C' to obtain a CAD digital model of the compensation molded surface of the product part R. The invention calculates the compensation factor by combining numerical simulation and trial stamping for each node of the grid surface, thereby obtaining the compensation profile of the product part, and has the advantages of high compensation precision, short generation period of the compensation profile and low cost.
Drawings
For purposes of promoting a better understanding of the objects, aspects and advantages of the invention, reference will now be made in detail to the present invention as illustrated in the accompanying drawings, in which:
fig. 1 is a flowchart of a detailed embodiment of a method for compensating for springback of a stamping part by using a variable compensation factor according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, the invention discloses a method for compensating springback of stamping parts by using variable compensation factors, which comprises the following steps:
s1, designing and manufacturing a trial mold surface C' based on the product part R;
s2, punching by using a test die surface C' to obtain a test die stamping part;
s3, carrying out three-dimensional scanning on the test die stamping part, and reconstructing the molded surface through reverse engineering to obtain a virtual product part R';
s4, performing stamping forming and springback simulation analysis on the virtual product part R ' to obtain a formed grid profile R ' and a simulated springback grid profile S ';
and carrying out forming and springback simulation analysis on the product part R 'through CAE software Dynaform to obtain a forming grid molded surface R' and a simulation springback grid molded surface S which correspond to the nodes one to one.
S5, forcibly deforming the grid molded surface R 'onto a test mold surface C' to obtain a compensation grid molded surface C ', wherein nodes on the formed grid molded surface R', the simulation rebounding grid molded surface S 'and the compensation grid molded surface C' are in one-to-one correspondence;
the forming grid molded surface R ' is forcibly deformed to the compensation molded surface C ' through CAE software Dynaform so as to be attached, and the compensation grid molded surfaces C ' which correspond to the nodes of the forming grid molded surface one to one can be obtained.
S6, calculating a compensation factor of each node in the forming grid profile R ', the simulation rebounding grid profile S ' and the compensation grid profile C ';
s7, performing stamping forming and springback simulation analysis on the product part R to obtain a forming grid profile R1And simulation resilience grid profile S1；
S8 shaping grid profile R based on compensation factor1And simulation resilience grid profile S1Generating a compensated grid profile C1；
S9 shaping grid based profile R1And compensating the mesh profile C1And globally deforming the test mold surface C' to obtain a CAD digital model of the compensation molded surface of the product part R.
Assuming that the compensation factors of the similar pieces are not changed, the compensation factors of the product parts R and R' are the same, and the node coordinates of the compensation profiles of the product parts R can be calculated. And globally deforming the CAD digifax of the trial model surface C' according to the forming profile node and the compensation profile node coordinate information of the product part R through Thinkdesign software to obtain the CAD digifax of the compensation profile of the product part R.
Compared with the prior art, the scheme of the invention calculates an independent compensation factor for each node, and compared with the springback simulation, the compensation precision is higher; according to the invention, only one test die surface C' and one test die stamping part need to be manufactured, so that compared with a mode of carrying out repeated iterative compensation according to a test die result, the method has the advantages of lower cost and higher efficiency.
In summary, the invention discloses a springback compensation method for a variable compensation factor stamping part, which combines numerical simulation and trial stamping to calculate a compensation factor for each node of a grid surface, thereby obtaining a compensation profile of a product part.
In specific implementation, the steps between S5 and S6 further include:
and reversely offsetting the compensation grid profile C 'and the simulation rebound grid profile S' by preset thickness.
Due to the fact that the forming grid molded surface R ', the simulation resilience grid molded surface S ' and the compensation grid molded surface C ' are crossed in area when being aligned, the calculated resilience amount and the calculated compensation amount are not greatly different in numerical value, but are greatly different in magnitude, and accordingly the situation that the compensation factor is abnormally large occurs. The compensation profile and the rebound profile are thus offset in opposite directions (reverse offset here means offset in a direction away from the forming grid profile R ″), the predetermined thickness preferably being the thickness of the product part R.
In specific implementation, the preset thickness is the thickness of the product part R.
In specific implementation, the compensation factor of each node in the forming grid profile R ', the simulation springback grid profile S ' and the compensation grid profile C ' is calculated based on the following formula:
αi＝ci”/si”
in the formula, alphaiRepresenting the compensation factor of the i-th node, ci"represents the true offset, s, of the ith nodei"represents the simulated springback value, x, of the ith nodeiR”、yiR”And ziR”X, y and z coordinates representing the ith node on the profile R' of the forming grid, xiC”、yiC”And ziC”Respectively representing the x, y and z-axis coordinates of the ith node on the compensation grid profile C ″, xiS”、yiS”And ziS”Respectively representing x, y and z-axis coordinates of the ith node on the simulation springback grid profile S', and t representing the thickness of the product part R.
In the prior art, methods for calculating compensation factors by combining numerical simulation and trial stamping parts exist, so that springback compensation is performed, and good effects are obtained, but a large number of simulations show that the compensation factors applicable to different parts of the same stamping part are different, and in the prior art, the compensation factors of each node are calculated by considering the compensation factors to be the same, so that the mode in the prior art is inaccurate, and errors are caused.
In addition, because the invention calculates for each node separately, if the denominator(s) in the calculation processi") is very small, the compensation factor found will be very large and not reasonable, and after a shift of one thickness several profiles can be staggered, avoiding this unreasonable situation, so that a shift is required when calculating the compensation factor.
The directions of the x axis and the y axis are respectively the length direction and the width direction of the part, and the direction of the z axis is the thickness direction of the part.
In specific implementation, the compensation grid profile C is calculated based on the following formula1To generate a compensated mesh profile C1：
In the formula (I), the compound is shown in the specification,
and
respectively representing the profile R of the forming grid1The x, y and z axis coordinates of the upper i-th node,
and
respectively representing the compensating grid profile C1The x, y and z axis coordinates of the upper i-th node,
and
respectively representing simulated springback grid profiles S1The x, y and z axis coordinates of the ith node.
Because the two similar parts adopt the same compensation factor, the two similar parts need to be in the same state, and the offset is carried out on the imaginary product parts when the compensation factor is solved; the same offset should be made when compensating for the actual product part.
Finally, it is noted that the above-mentioned embodiments illustrate rather than limit the invention, and that, while the invention has been described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (4)
1. A method for compensating springback of stamping parts by using variable compensation factors is characterized by comprising the following steps:
s1, designing and manufacturing a trial mold surface C' based on the product part R;
s2, punching by using a test die surface C' to obtain a test die stamping part;
s3, carrying out three-dimensional scanning on the test die stamping part, and reconstructing the molded surface through reverse engineering to obtain a virtual product part R';
s4, performing stamping forming and springback simulation analysis on the virtual product part R ' to obtain a formed grid profile R ' and a simulated springback grid profile S ';
s5, forcibly deforming the grid molded surface R 'onto a test mold surface C' to obtain a compensation grid molded surface C ', wherein nodes on the formed grid molded surface R', the simulation rebounding grid molded surface S 'and the compensation grid molded surface C' are in one-to-one correspondence;
s6, calculating a compensation factor of each node in the forming grid profile R ', the simulation rebounding grid profile S ' and the compensation grid profile C ';
s7, performing stamping forming and springback simulation analysis on the product part R to obtain a forming grid profile R1And simulation resilience grid profile S1；
S8 shaping grid profile R based on compensation factor1And simulation resilience grid profile S1Generating a compensated grid profile C1；
S9 shaping grid based profile R1And compensating the mesh profile C1Globally deforming the test mold surface C' to obtain a CAD digital model of the compensation molded surface of the product part R;
calculating a compensation factor of each node in the forming grid profile R ', the simulation rebounding grid profile S ' and the compensation grid profile C ' based on the following formula:
αi＝ci”/si”
in the formula, alphaiRepresenting the compensation factor of the i-th node, ci"represents the true offset, s, of the ith nodei"represents the simulated springback value, x, of the ith nodeiR”、yiR”And ziR”X, y and z coordinates representing the ith node on the profile R' of the forming grid, xiC”、yiC”And ziC”Respectively representing the x, y and z-axis coordinates of the ith node on the compensation grid profile C ″, xiS”、yiS”And ziS”Respectively representing x, y and z-axis coordinates of the ith node on the simulation springback grid profile S', and t representing the thickness of the product part R.
2. The method for stamping part springback compensation by using variable compensation factors as claimed in claim 1, wherein between S5 and S6 further comprising:
and reversely offsetting the compensation grid profile C 'and the simulation rebound grid profile S' by preset thickness.
3. The method for punch springback compensation of variable compensation factor according to claim 2, wherein the predetermined thickness is the thickness of the product part R.
4. The method for stamping springback compensation with variable compensation factors according to claim 1, wherein the compensation grid profile C is calculated based on the following formula1To generate a compensated mesh profile C1：
In the formula (I), the compound is shown in the specification,
and
respectively representing the profile R of the forming grid1The x, y and z axis coordinates of the upper i-th node,
and
respectively representing the compensating grid profile C1The x, y and z axis coordinates of the upper i-th node,
and
respectively representing simulated springback grid profiles S1The x, y and z axis coordinates of the ith node.
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