CN110628377A - Preparation method of high-thixotropy UV (ultraviolet) moisture dual-curing adhesive - Google Patents
Preparation method of high-thixotropy UV (ultraviolet) moisture dual-curing adhesive Download PDFInfo
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- CN110628377A CN110628377A CN201910829807.9A CN201910829807A CN110628377A CN 110628377 A CN110628377 A CN 110628377A CN 201910829807 A CN201910829807 A CN 201910829807A CN 110628377 A CN110628377 A CN 110628377A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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Abstract
The invention discloses a preparation method of a high-thixotropy UV moisture dual-curing adhesive, which comprises the following raw materials in parts by weight: and (2) component A: 20-70 parts by weight of one or more polyurethane (methyl) acrylate with isocyanate groups, wherein the weight average molecular weight is between 200 and 30000, the functionality of the isocyanate groups is less than or equal to 3, the functionality of the (methyl) acrylate is less than or equal to 2, and the preferred weight average molecular weight is between 500 and 15000, wherein the isocyanate groups and the (methyl) acrylate groups can be arranged at any position on the polymer molecular chain.
Description
Technical Field
The invention relates to the technical field of dual-curing adhesives, in particular to a preparation method of a high-thixotropy UV moisture dual-curing adhesive.
Background
As electronic products gradually turn to miniaturization, integration, and multi-functionalization, the electronic assembly industry is also developing at a high speed. The requirements for the efficiency of the assembly process, and the safety and reliability of the assembled products in electronic processing are also increasing. The ultraviolet curing adhesive has the remarkable characteristics of good compatibility, high curing speed, high strength, environmental protection and the like, and is widely applied to bonding various joints of electronic and electric appliances or functional sealing. With the continuous expansion of the application field of the ultraviolet curing technology, the ultraviolet curing technology has increasingly obvious effect on products such as mobile phones, televisions, computers, navigators, vehicle-mounted displays and the like. Electronic devices are increasingly used in daily life, so consumers are concerned about the quality and reliability of products.
The traditional UV adhesive product has the problem that shadow region curing cannot be solved, when the light-cured UV glue is designed, the problem that the shadow region curing is realized can be effectively solved by considering that the pressure is too high during glue dispensing, the viscosity of the glue is generally below 10000cps/25C, so that the glue overflow risk is greatly increased during glue use, and the newly developed moisture-cured reaction type polyurethane hot melt adhesive (namely PUR glue) can be used for curing the shadow region through moisture, so that the cured PUR usually has strong adhesive force, but the curing process needs pressure maintaining for about 4 hours, so that the processing efficiency is greatly reduced; meanwhile, in the use process of the glue, a complicated heating process is adopted to melt the product, and the use process is complicated, so that the technical personnel in the field provide a preparation method of the high thixotropic UV moisture dual-curing adhesive to solve the problems in the background technology.
Disclosure of Invention
The invention aims to provide a preparation method of a high-thixotropy UV moisture dual-curing adhesive, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a high-thixotropy UV moisture dual-curing adhesive is composed of the following raw materials in parts by weight: and (2) component A: 20-70 parts by weight of one or more polyurethane (meth) acrylates with isocyanate groups, the weight average molecular weight is between 200 and 30000, wherein the isocyanate group functionality is less than or equal to 3, the (meth) acrylate functionality is less than or equal to 2, preferably the weight average molecular weight is between 500 and 15000, wherein the isocyanate groups and the (meth) acrylate groups can be arranged at any position on the polymer molecular chain;
and (B) component: 10 to 65 parts by weight of one or more (meth) acrylate monomers having a number of C atoms greater than or equal to 6, less than or equal to 30, preferably 15 to 60 parts by weight, a glass transition temperature of the monomers higher than 50C, a functionality less than or equal to 3, preferably a number of C atoms greater than or equal to 8, less than or equal to 20, typical (meth) acrylate monomers being: isobornyl acrylate, isobornyl methacrylate, benzyl acrylate, morpholine acrylate, N-dimethylacrylamide, dicyclopentadienyl acrylate, neopentyl glycol diacrylate, dipropylene glycol diacrylate, tricyclodecane dimethanol diacrylate in combination with one or more of the following;
and (3) component C: 0.2 to 10.0 parts by weight of an organic dehydrating agent, preferably 0.3 to 5.0 parts by weight;
and (3) component D: 0.2 to 8.0 parts by weight of hydrophobic fumed silica, preferably 0.5 to 4.0 parts by weight;
and (3) component E: 0.1 to 2.0 parts by weight of an organic thixotropic agent, preferably 0.2 to 1.0 part by weight;
and (3) component F: 0.5-10 parts by weight of one or more cleavage type photoinitiators, preferably 1.0-8.0 parts by weight, the free radical photopolymerization initiator of the invention being selected from benzil ketals, hydroxyketones, aminoketones, acylphosphine peroxides, and the like;
a component G: 0.001 to 1.0 part by weight of an organotin or organotitanium condensation catalyst, preferably 0.002 to 0.8 part by weight, such as dimethyltin dilaurate, dibutyltin dilaurate, tetra-n-butyl titanate, tetra-isopropyl titanate, and the like.
As a further scheme of the invention: in addition, an antioxidant is added into the formula according to the requirement so as to improve the stability of the formula; adding a silane coupling agent to improve the adhesion; defoaming agent is added to improve the defoaming capability of the glue and improve the production efficiency; or adding fluorescent indicators or the like to facilitate electronic application identification, or the like.
As a still further scheme of the invention: the adhesive composition was formulated as follows:
55.0 parts EBECRY 4150; 15.0 parts SR506, isobornyl acrylate; 10.0 parts of DMAA, N, N-dimethylacrylamide; 12.0 parts SR833, tricyclodecane dimethanol diacrylate; 1.0 part of Additive TI; 3.0 parts Cab O SilTS 720; 0.4 part of an organic thixotropic agent BYK 411; 0.59 part of Irgacure 819; 3.0 parts of Genocure DEAP, 2, 2-diethoxy-1-hexanone; 0.01Dabco T-12-catalyst, dibutyltin dilaurate.
In addition, the invention also provides a preparation method of the high thixotropic UV moisture dual-curing adhesive, which comprises the following specific steps:
the above components (total 100g) were added in sequence to a plastic bucket having a capacity of 150g, placed in a speedmixertnmixer, and mixed at high speed for 10 minutes at 2500 rpm until the solid was completely dissolved.
Compared with the prior art, the invention has the beneficial effects that:
1. the adhesive is UV moisture dual-cured, the UV curing can quickly form initial bonding strength, and the moisture curing can effectively solve the problem of shadow region curing.
2. The bonding of the adhesive can effectively meet three bonding modes (shown in a schematic diagram below), and the surface dryness of the product after final curing is excellent, so the product can also be used as a coating.
3. Different from the curing and pressure maintaining of the reactive polyurethane hot melt adhesive (the pressure maintaining time is up to 4 hours), the establishment of the initial strength by the UV curing is quicker and more efficient, and the efficiency of electronic assembly is greatly improved.
4. The glue has low viscosity under high shear and large glue touch value, can meet the high-efficiency glue dispensing process, and effectively solves the problem of glue overflow.
5. The adhesive strength of the glue is superior to that of a UV/moisture curing organic silicon system.
6. The glue is a single-component solvent-free product, is environment-friendly and healthy, and is convenient to construct and use by customers.
Drawings
Fig. 1 is a schematic diagram of the structural bonding of a high thixotropic UV moisture dual-cure adhesive and an electronic component.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the embodiment of the invention, the high-thixotropy UV moisture dual-curing adhesive is prepared from the following raw materials in parts by weight: and (2) component A: 20-70 parts by weight of one or more polyurethane (meth) acrylates with isocyanate groups, the weight average molecular weight is between 200 and 30000, wherein the isocyanate group functionality is less than or equal to 3, the (meth) acrylate functionality is less than or equal to 2, preferably the weight average molecular weight is between 500 and 15000, wherein the isocyanate groups and the (meth) acrylate groups can be arranged at any position on the polymer molecular chain;
and (B) component: 10 to 65 parts by weight of one or more (meth) acrylate monomers having a number of C atoms greater than or equal to 6, less than or equal to 30, preferably 15 to 60 parts by weight, a glass transition temperature of the monomers higher than 50C, a functionality less than or equal to 3, preferably a number of C atoms greater than or equal to 8, less than or equal to 20, typical (meth) acrylate monomers being: isobornyl acrylate, isobornyl methacrylate, benzyl acrylate, morpholine acrylate, N-dimethylacrylamide, dicyclopentadienyl acrylate, neopentyl glycol diacrylate, dipropylene glycol diacrylate, tricyclodecane dimethanol diacrylate in combination with one or more of the following;
and (3) component C: 0.2 to 10.0 parts by weight of an organic dehydrating agent, preferably 0.3 to 5.0 parts by weight;
and (3) component D: 0.2 to 8.0 parts by weight of hydrophobic fumed silica, preferably 0.5 to 4.0 parts by weight;
and (3) component E: 0.1 to 2.0 parts by weight of an organic thixotropic agent, preferably 0.2 to 1.0 part by weight;
and (3) component F: 0.5-10 parts by weight of one or more cleavage type photoinitiators, preferably 1.0-8.0 parts by weight, the free radical photopolymerization initiator of the invention being selected from benzil ketals, hydroxyketones, aminoketones, acylphosphine peroxides, and the like;
a component G: 0.001 to 1.0 part by weight of an organotin or organotitanium condensation catalyst, preferably 0.002 to 0.8 part by weight, such as dimethyltin dilaurate, dibutyltin dilaurate, tetra-n-butyl titanate, tetra-isopropyl titanate, and the like.
Furthermore, an antioxidant is added into the formula according to the requirement to improve the stability of the formula; adding a silane coupling agent to improve the adhesive force defoaming agent so as to improve the defoaming capability of the glue and improve the production efficiency; or adding fluorescent indicators or the like to facilitate electronic application identification, or the like.
Example 1
The adhesive composition was formulated as follows:
55.0 parts EBECRY 4150; 15.0 parts SR506, isobornyl acrylate; 10.0 parts of DMAA, N, N-dimethylacrylamide; 12.0 parts SR833, tricyclodecane dimethanol diacrylate; 1.0 part of Additive TI; 3.0 parts Cab O SilTS 720; 0.4 part of an organic thixotropic agent BYK 411; 0.59 part of Irgacure 819; 3.0 parts of Genocure DEAP, 2, 2-diethoxy-1-hexanone; 0.01Dabco T-12-catalyst, dibutyltin dilaurate.
In addition, the invention also provides a preparation method of the high thixotropic UV moisture dual-curing adhesive, which comprises the following specific steps:
the above components (total 100g) were added in sequence to a plastic bucket having a capacity of 150g, placed in a speedmixertnmixer, and mixed at high speed for 10 minutes at 2500 rpm until the solid was completely dissolved.
Viscosity and thixotropic value testing:
using ASTM D1084, the test temperature was 25 ℃ and the glue thixotropy value was obtained as the ratio of the viscosity at 5rpm and 50rpm (25℃).
And (3) hardness testing:
in a circular aluminum foil tray (diameter about 4cm), glue with a thickness of about 2cm was poured. The sample is put under ultraviolet light for full curing for 60 seconds, wherein a curing light source adopts a metal halogen lamp (model: UVALOC1000) covering 200nm-400nm ultraviolet light wave band, the irradiation energy is about 8000mJ/cm2, and the radiation power is about 130mW/cm 2;
after the glue is UV-cured, the sample is placed in a standard environment 23C and is cured for 72 hours at 50% RH relative humidity, then the hardness is prepared to be measured, during the hardness test, three glue films with the same size and the thickness of 2mm are selected, and the hardness value of 6mm is measured by a hardness meter.
Testing the flowability of the glue:
and (3) filling the prepared glue into a UV (ultraviolet) rubber tube at 25 ℃, and punching a plurality of long rubber strips on a glass plate, wherein the width of each rubber strip is about 2mm, and the thickness of each rubber strip is 1 mm. And marking the positions of the left glue line and the right glue line by using a signal pen, and recording whether the glue flows and overflows after 2min and 5 min.
And (3) testing the glass transition temperature:
UV/moisture cured (72 hours) samples of 25mm diameter and 2mm thickness were prepared using an ARES-G2 rotational rheometer, with a frequency of 1HZ and a temperature rise rate of 3C/min.
And (3) testing tensile bonding strength:
dropping the resulting adhesive composition onto a glass sheet (25mm x 40mm x 4mm) at room temperature, controlling the thickness of the glue with a stainless steel wire having a thickness of 100 microns, cross-bonding another glass sheet of the same size together, irradiating the glass sheet/adhesive composition/glass plate sample with an ultraviolet light source (model: UVALOC1000) for a hardness test specimen at an irradiation energy of about 4000mJ/cm2 and an irradiation power of about 130mW/cm2 for about 30 seconds, and curing the sample in a standard environment at 23C, 50% RH for 72 hours;
a sample subjected to an ultraviolet curing test on the cured surface was pulled in the opposite direction to the glass sheet surface by using a universal tensile machine (model: Instron 5540) to conduct a bonding tensile strength test at a tensile speed of 10 mm/min and a load of 1000N, and the bonding strength (unit: MPa) was obtained by dividing the obtained tensile value by the area of the joint of the glass sheet and the glass sheet.
The viscosity of the obtained adhesive composition was 10090mpa.s/25 ℃ (5rpm), 1614mpa.s/25 ℃ (50 rpm); the thixotropic value is: 6.25; hardness after curing: shore D68; surface dryness after glue curing: dry and comfortable without stickiness; testing the flowability of the glue: does not flow for 2 minutes and 5 minutes at 25 ℃; glass transition temperature: 52C; tensile bond strength: 2.2 MPa.
Comparative example 1
In contrast to the examples, the Additive TI was removed and the adhesive composition was formulated as follows:
55.0 parts EBECRY 4150; 15.0 parts SR506, isobornyl acrylate; 10.0 parts of DMAA, N, N-dimethylacrylamide; 12.0 parts SR833, tricyclodecane dimethanol diacrylate; 3.0 parts Cab O Sil TS 720; 0.4 part of an organic thixotropic agent BYK 411; 0.59 part of Irgacure 819; 3.0 parts of Genocure DEAP, 2, 2-diethoxy-1-hexanone; 0.01 part of Dabco T-12-catalyst and dibutyltin dilaurate;
the viscosity of the obtained adhesive composition was 10500mpa.s/25 ℃ (5rpm), 1810mpa.s/25 ℃ (50 rpm); the thixotropic value is: 5.82;
the glue is placed for 2 hours at room temperature, and in the secondary moisture curing engineering after UV curing, more bubbles are generated in the system, which shows that the addition of the water removing agent plays a vital role in dual curing of the adhesive.
Comparative example 2
In contrast to the examples, the organic thixotropic agent BYK 411 was removed and the adhesive composition was formulated as follows in parts by weight:
55.0 parts EBECRY 4150; 15.0 parts SR506, isobornyl acrylate; 10.0 parts of DMAA, N, N-dimethylacrylamide; 12.0 parts SR833, tricyclodecane dimethanol diacrylate; 1.0 part of Additive TI; 3.0 parts Cab O SilTS 720; 0.69 part of Irgacure 819; 3.0 parts of Genocure DEAP, 2, 2-diethoxy-1-hexanone; 0.01 part of Dabco T-12-catalyst and dibutyltin dilaurate;
the viscosity of the obtained adhesive composition was 6100mpa.s/25 ℃ (5rpm), 1750mpa.s/25 ℃ (50 rpm); the thixotropic value is: 3.49;
the thixotropic value of the glue is less than 4.0, and the glue still has a large glue overflow risk in the actual click use process;
testing the flowability of the glue: the problem of drooling occurred after 2 minutes at 25C.
The working principle of the invention is as follows:
a high thixotropic UV moisture dual-curing adhesive is different from a traditional UV curing adhesive, a reaction type polyurethane hot melt adhesive or a UV/moisture curing organic silicon system, the adhesive is UV moisture dual-curing, the UV curing can quickly form initial bonding strength, the moisture curing can effectively solve the problem of shadow region curing, the bonding of the adhesive can effectively meet three bonding modes, the surface of a product after final curing is excellent, and therefore the product can be used as a coating, and the adhesive is different from the curing pressure maintaining (the pressure maintaining time is as long as 4 hours) of the reaction type polyurethane hot melt adhesive, the establishment of the initial strength by the UV curing is quicker and more efficient, the efficiency of electronic assembly is greatly improved, the viscosity of the glue is low under high shear, the glue touch value is large, the high-efficiency glue dispensing process can be met, the problem of glue overflow is effectively solved, and the bonding strength of the glue is superior to the UV/moisture curing, the glue is a single-component solvent-free product, is environment-friendly and healthy, and is convenient to construct and use by customers.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The high-thixotropy UV moisture dual-curing adhesive is characterized by comprising the following raw materials in parts by weight: and (2) component A: 20-70 parts by weight of one or more polyurethane (meth) acrylates with isocyanate groups, the weight average molecular weight is between 200 and 30000, wherein the isocyanate group functionality is less than or equal to 3, and the (meth) acrylate functionality is less than or equal to 2, wherein the isocyanate groups and the (meth) acrylate groups can be positioned at any position on the polymer molecular chain;
and (B) component: 10-65 parts by weight of one or more (meth) acrylate monomers having a C number of 6 or more and 30 or less, a monomer glass transition temperature of greater than 50C, and a functionality of 3 or less;
and (3) component C: 0.2 to 10.0 parts by weight of an organic dehydrating agent;
and (3) component D: 0.2 to 8.0 parts by weight of hydrophobic fumed silica;
and (3) component E: 0.1 to 2.0 parts by weight of an organic thixotropic agent;
and (3) component F: 0.5-10 parts by weight of one or more cleavage type photoinitiators;
a component G: 0.001 to 1.0 part by weight of an organotin or organotitanium condensation catalyst.
2. A highly thixotropic UV moisture dual cure adhesive according to claim 1 wherein the (meth) acrylate preferably has a weight average molecular weight of 500 to 15000;
the (meth) acrylate monomer is preferably one or a combination of more of isobornyl acrylate, isobornyl methacrylate, benzyl acrylate, morpholine acrylate, N-dimethylacrylamide, dicyclopentadienyl acrylate, neopentyl glycol diacrylate, dipropylene glycol diacrylate, and tricyclodecane dimethanol diacrylate, and the number of C atoms of the (meth) acrylate monomer is preferably 8 or more and 20 or less.
3. The highly thixotropic UV moisture dual-cure adhesive according to claim 1, wherein the cleavage type photoinitiator is preferably 1.0 to 8.0 parts by weight, and the radical photopolymerization initiator is selected from one or more of benzil ketal, hydroxy ketone, amino ketone, and acylphosphine peroxide.
4. The highly thixotropic UV moisture dual cure adhesive of claim 1, wherein the organotin or organotitanium condensation catalyst is preferably 0.002 to 0.8 parts by weight and the organotin or organotitanium condensation catalyst is preferably one or more of dimethyltin dilaurate, dibutyltin dilaurate, tetra-n-butyl titanate, tetraisopropyl titanate.
5. The highly thixotropic UV moisture dual cure adhesive of claim 1 wherein one or more of an antioxidant, a silane coupling agent, an anti-foaming agent, a fluorescent indicator is added to the formulation as needed.
6. The highly thixotropic UV moisture dual cure adhesive of claim 1 wherein the adhesive composition is formulated as follows: 55.0 parts EBECRY 4150; 15.0 parts SR506, isobornyl acrylate; 10.0 parts of DMAA, N, N-dimethylacrylamide; 12.0 parts SR833, tricyclodecane dimethanol diacrylate; 1.0 part of AdditivetI; 3.0 parts Cab O Sil TS 720; 0.4 part of an organic thixotropic agent BYK 411; 0.59 part of Irgacure 819; 3.0 parts of Genocure DEAP, 2, 2-diethoxy-1-hexanone; 0.01Dabco T-12-catalyst, dibutyltin dilaurate.
7. A process for the preparation of the highly thixotropic UV moisture dual cure adhesive according to claims 1 to 6, characterized in that the above-mentioned components (100 g in total) are added in succession to a plastic tub having a capacity of 150g, and a SpeedMixer is placed thereinTMIn the mixer, the dispersion was mixed at 2500 rpm for 10 minutes until the solid was completely dissolved.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112300746A (en) * | 2020-11-18 | 2021-02-02 | 上海汉司实业有限公司 | Preparation method of UV (ultraviolet) moisture dual-curing heat-conducting adhesive |
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| CN112300746A (en) * | 2020-11-18 | 2021-02-02 | 上海汉司实业有限公司 | Preparation method of UV (ultraviolet) moisture dual-curing heat-conducting adhesive |
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Application publication date: 20191231 |