CN110618505A - Optical receiving end assembly and optical module - Google Patents
Optical receiving end assembly and optical module Download PDFInfo
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- CN110618505A CN110618505A CN201910907477.0A CN201910907477A CN110618505A CN 110618505 A CN110618505 A CN 110618505A CN 201910907477 A CN201910907477 A CN 201910907477A CN 110618505 A CN110618505 A CN 110618505A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
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- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses an optical receiving end component and an optical module, wherein the optical receiving end component comprises a first photoelectric chip set, a first lens set, a wave splitter, a coupler and a receiving optical port which are connected with each other; wherein, the coupler is connected with the light receiving port through an optical fiber. The optical receiving end assembly and the optical module reduce the relative position requirement of the receiving optical port and the transmitting optical port and reduce the manufacturing cost of the optical module.
Description
Technical Field
The invention relates to the field of optical communication, in particular to an optical receiving end assembly and an optical module.
Background
With the increasing transmission capacity of communication lines, especially in data centers and network core nodes, the original optical fiber transmission technology cannot meet the increasing demand of data. Therefore, increasing the transmission rate of a single optical module is a technical problem to be solved. The increase of the ports of the optical module by the wavelength division multiplexing technology is an effective way of increasing the optical information density by times without obviously increasing the space of the optical module, namely, the transmission rate of a single optical module can be greatly improved by increasing the transmitting optical port or the receiving optical port of the optical module. Of course, the increase of the optical port also requires the iterative upgrade of the photoelectric processing chip.
In the optical module, the increase of the optical port means that an external connector interface connected with the optical port can adopt a duplex or multi-connection mode, so that the plugging and unplugging efficiency of a user is improved. For example, an existing eight Small Form-factor Pluggable (OSFP) four-port optical module is a packaging method that increases ports and speeds. It contains 2 transmission light ports, 2 and receives the light port, and standard pair Mini LC jumper wire is adopted to the external connector. The standard duplex Mini LC jumper wire is provided with two connectors with fixed positions, which respectively correspond to a light emitting port and a light receiving port on the optical module. Thus, the requirement on the position of the light port on the light module is high, namely the requirement on the relative positions of the light emitting port and the light receiving port is high. The difficulty in designing and realizing the process of the optical module is correspondingly increased, and the manufacturing cost is increased.
Certainly, in a conventional dual-port high-speed module, such as a 400G dual-Density four-channel Small Pluggable package (QSFP-DD, Quad Small Form-factor plug-Double Density) module, the relative position precision of the transmitting optical port and the receiving optical port is improved, and a duplex jumper wire can be used in a large data center machine room to improve the plugging efficiency. Therefore, the manufacturing cost is also increased.
Disclosure of Invention
In view of this, embodiments of the present invention are expected to provide an optical receiving end assembly and an optical module, which can reduce the relative position requirement between the transmitting optical port and the receiving optical port and reduce the manufacturing cost of the optical module.
In order to achieve the above purpose, the embodiment of the present invention provides the following technical solutions:
in a first aspect, an embodiment of the present invention provides an optical receiving end component, where the optical receiving end component includes a first optoelectronic chip set, a first lens set, a wave splitter, a coupler, and a receiving optical port, which are connected to each other; wherein, the coupler is connected with the light receiving port through an optical fiber.
Preferably, the interface of the receiving optical port connected with the optical fiber and the interface of the coupler connected with the optical fiber face the same direction, and the distance between the extension lines of the two interfaces in the transverse direction is greater than a preset value.
Preferably, the length of the optical fiber between the receiving optical port and the coupler is greater than a preset value.
Preferably, the optical fiber is a single mode fiber or a microbend fiber.
Preferably, the receiving optical port comprises a pin assembly, and the optical fiber is connected to the receiving optical port through the pin assembly.
In a second aspect, embodiments of the present invention provide an optical module, including at least one optical receiving side subassembly of any of the above, at least one optical transmitting side subassembly, and a circuit board; the light receiving end assembly and the light emitting end assembly are both fixed on the circuit board.
Preferably, the light emitting end component comprises a second photoelectric chip set, a second lens group, a wave combiner, an optical path component and a light emitting port which are connected with each other; the receiving light port and the emitting light port are arranged at the same end of the circuit board in the length direction, the first photoelectric chip set, the first lens set, the wave splitter and the coupler are all arranged on a first surface of the circuit board, and the second photoelectric chip set, the second lens set, the wave combiner and the light path component are all arranged on a second surface of the circuit board; the first surface and the second surface are both surfaces parallel to the length direction of the circuit board, and the first surface and the second surface are opposite in orientation.
Preferably, the first photoelectric chip group, the first lens group, the wave splitter and the coupler are all arranged in a first area of a first surface of the circuit board; the second photoelectric chip set, the second lens set, the wave combiner and the light path component are all arranged in a second area of the second surface of the circuit board; the first region and the second region are staggered in the length direction of the circuit board.
Preferably, the optical module further comprises a support member supporting the optical receiving end module and the optical emitting end module, the support member being fixed to the circuit board.
Preferably, the support member includes a stopper groove to restrict the optical fiber.
According to the optical receiving end component and the optical module provided by the embodiment of the invention, the coupler of the optical receiving end component is connected with the receiving optical port through the optical fiber, so that the position of the receiving optical port is not required to be completely fixed, the relative position requirement of the receiving optical port and the transmitting optical port is reduced, and the manufacturing cost of the optical module is reduced.
Other beneficial effects of the embodiments of the present invention will be further described in conjunction with the specific technical solutions in the detailed description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below. It should be understood that the drawings described below are only a part of the drawings of the embodiments of the present invention, and that other drawings may be obtained by those skilled in the art without inventive effort.
Fig. 1 is a first surface schematic diagram of a first implementation of an optical module according to an embodiment of the present invention;
fig. 2 is a first surface schematic diagram of a second implementation of an optical module according to an embodiment of the present invention;
FIG. 3 is a first surface schematic diagram of a third implementation of an optical module according to an embodiment of the invention;
fig. 4 is a first surface schematic diagram of a fourth implementation of an optical module according to an embodiment of the invention;
FIG. 5 is a schematic diagram illustrating a schematic structural diagram of an optical receiving end assembly in an optical module according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a schematic structural diagram of an optical transceiver module according to an embodiment of the present invention;
FIG. 7 is a first schematic diagram illustrating a distribution of an optical receive side subassembly and an optical transmit side subassembly in an optical module according to an embodiment of the present invention;
FIG. 8 is a second schematic diagram illustrating the distribution of optical receive side components and optical transmit side components in an optical module according to an embodiment of the present invention;
FIG. 9 is a third schematic diagram illustrating the distribution of the optical receive side subassembly and the optical transmit side subassembly in an optical module according to an embodiment of the present invention;
FIG. 10 is an exploded view of an optical module including a housing according to an embodiment of the present invention;
fig. 11 is a first schematic diagram illustrating only one receiving optical port and only one emitting optical port in an optical module according to an embodiment of the present invention;
fig. 12 is a second schematic diagram of an optical module including only one receiving optical port and only one emitting optical port according to an embodiment of the present invention.
Detailed Description
It is to be noted that, in the present invention, the terms "comprises", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, so that a method or apparatus including a series of elements includes not only the explicitly recited elements but also other elements not explicitly listed or inherent to the method or apparatus.
The term "coupled", unless otherwise indicated and limited, is to be construed broadly. For example, the two elements may be electrically connected, or may be connected through an intermediate member, directly or indirectly. The specific meaning of the above terms can be understood by those of ordinary skill in the art as appropriate.
If the terms "first \ second \ third" are referred to, they are merely used to distinguish similar objects and do not represent a particular ordering for the objects. It is to be understood that the terms first, second, and third, where permissible, are interchangeable in particular order or sequences.
The embodiment of the invention provides a light receiving end component, which comprises a first photoelectric chip set, a first lens set, a wave splitter (Demultiplexer), a coupler and a receiving optical port, wherein the first photoelectric chip set, the first lens set, the wave splitter (Demultiplexer), the coupler and the receiving optical port are connected with each other; wherein, the coupler is connected with the light receiving port through an optical fiber.
Here, a demultiplexer, also called a demultiplexer or a demultiplexer, is used for separating optical signals of various wavelengths.
According to the optical receiving end component, the coupler of the optical receiving end component is connected with the receiving optical port through the optical fiber, the optical fiber connection is flexible connection, the position of the receiving optical port is not required to be completely fixed, compared with the connection through the optical path component, the requirement on the relative position of the receiving optical port and the transmitting optical port is lowered, and the manufacturing cost of the optical module is lowered.
In one embodiment, the interface of the receiving optical port connected with the optical fiber and the interface of the coupler connected with the optical fiber face the same direction, and the distance between the extension lines of the two interfaces in the transverse direction is greater than a preset value. Therefore, the optical fiber between the two interfaces is bent by a large radian of 180 degrees, so that the acting force or the elastic force of the optical fiber on other devices of the optical receiving end component is small, and the stability and the service life of the optical receiving end component are improved; and the optical fiber is made to be long, so that the production difficulty of the optical fiber assembly can be reduced, and the optical fiber is the preferable mode. The distance between the extension lines of the two interfaces in the transverse direction is larger than a preset value so as to ensure that the turning radian of the optical fiber is large enough. It can be understood that the two interfaces may be oriented oppositely and aligned in the center, so that the two interfaces may be connected linearly, and although the acting force on other devices may be relatively large, the assembly is simple, and the optical fiber 1 can be better prevented from being crushed by the housing of the optical module due to overlapping during the assembly. The problem that the acting force of the optical fiber on other devices is large can be reduced properly by fixing the optical fiber through soft glue, and the details can be seen in the following specific embodiment and fig. 1 and 3. In addition, it is possible to interpose the two interfaces in a manner that they are oriented neither in line nor in opposition, e.g., the two interfaces extend perpendicular, so that there is a 90 degree turn in the optical fiber that also reduces the force of the optical fiber on other components of the optical receiving end assembly, but may increase the difficulty of the circuit board layout.
In one embodiment, the length of the optical fiber between the receiving optical port and the coupler is greater than a preset value. Only if the length is long enough, the two ends of the optical fiber bent by 180 degrees in a large radian, namely the two ends connected to the light receiving port and the coupler, are longer in the length of the straight line segment, so that the acting force of the optical fiber on other devices of the light receiving end assembly is further reduced. The preset value can be determined according to specific situations in actual production.
In one embodiment, the optical fiber is a single mode fiber or a microbend fiber. The loss of the single-mode optical fiber is smaller, and the mode of adopting the connection of the optical path components can be more approximate. Compared with the common optical fiber, the microbend optical fiber has smaller loss in a bending state. It will be appreciated that other types of optical fibres are possible.
In one embodiment, the receiving optical port includes a pin assembly through which the optical fiber is coupled to the receiving optical port. This is preferred to facilitate the connection of the optical fibers.
An embodiment of the present invention further provides an optical module, where the optical module includes any one of the above optical receiving end assemblies, at least one optical transmitting end assembly, and a circuit board; the light receiving end assembly and the light emitting end assembly are both fixed on the circuit board.
Here, the optical module may include a plurality of optical receiving side components and a plurality of optical transmitting side components, so that a transmission rate and a bandwidth of the optical module may be improved. Generally, in the optical module, the optical receiving terminal assemblies and the optical emitting terminal assemblies are arranged in pairs, that is, generally equal in number, but the invention is not limited thereto. The circuit board, in the present embodiment, may be a PCBA, but may also be other circuit boards capable of carrying the optical receive end components and optical transmit end components.
In one embodiment, the light emitting side subassembly includes a second optoelectronic chip set, a second lens set, a Multiplexer (Multiplexer), an optical path subassembly, and a light emitting port, which are connected to each other; the receiving light port and the emitting light port are arranged at the same end of the circuit board in the length direction, the first photoelectric chip set, the first lens set, the wave splitter and the coupler are all arranged on a first surface of the circuit board, and the second photoelectric chip set, the second lens set, the wave combiner and the light path component are all arranged on a second surface of the circuit board; the first surface and the second surface are both surfaces parallel to the length direction of the circuit board, and the first surface and the second surface are opposite in orientation. In this way, it is preferable to use the surface of the circuit board more effectively and reduce the volume of the entire optical module.
Here, the multiplexer is also called a multiplexer, and is configured to combine optical signals (carrying various information) with two or more different wavelengths together and couple the optical signals to the same optical fiber of the optical line for transmission.
In one embodiment, the first optoelectronic chip set, the first lens group, the wave splitter, and the coupler are all disposed at a first region of a first surface of the circuit board; the second photoelectric chip set, the second lens set, the wave combiner and the light path component are all arranged in a second area of the second surface of the circuit board; the first region and the second region are staggered in the length direction of the circuit board. Therefore, the light receiving end assembly and the light emitting end assembly are separated to dissipate heat, so that the heat dissipation effect of the optical module is better, and the method is the preferable mode.
In one embodiment, the optical module further includes a support member supporting the optical receive end subassembly and the optical transmit end subassembly, the support member being secured to the circuit board.
In one embodiment, the support comprises a retaining groove that retains the optical fiber. In this way, a more robust arrangement of the optical fibers is preferred, which further reduces the forces exerted by the optical fibers on other components of the light receiving end assembly, and also avoids damage to the optical fibers during assembly.
The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Also, the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from these embodiments without inventive step, are within the scope of protection of the present invention.
As shown in fig. 1-4, embodiments of the present invention provide an optical module that includes at least one optical receiving end subassembly 10, at least one optical transmitting end subassembly 20, and a circuit board 30; the optical receiving end assembly 10 and the optical transmitting end assembly 20 are both fixed to the circuit board 30.
As shown in fig. 5, the optical receiving end assembly 10 includes a first optoelectronic chip set 101, a first lens group 102, a splitter 103, a coupler 104, and a receiving optical port 105, which are connected to each other; the coupler 104 and the receiving port 105 are connected by an optical fiber 106.
Wherein the interface orientation of the receiving optical port 105 connecting the optical fiber 106 is consistent with the interface orientation of the coupler 104 connecting the optical fiber 106. In this manner, the manufacturing difficulty of the optical fiber 106 may be reduced, resulting in less force or resiliency of the optical fiber 106 against other components of the optical receiving end assembly 10.
More specifically, the length of the optical fiber 106 between the receiving optical port 105 and the coupler 104 is greater than a preset value. In this way, the forces exerted by the optical fiber 106 on other components of the optical receiving end assembly 10 may be further reduced.
The optical fiber 106 is a single mode optical fiber or a microbend optical fiber. Thus, transmission loss is smaller.
Wherein the receiving optical port 105 includes a pin assembly (not shown), and the optical fiber 106 is connected to the receiving optical port 105 through the pin assembly. In this way, the connection of the optical fiber 106 is facilitated.
As shown in fig. 5, the light emitting end component 20 includes a second optoelectronic chip set 201, a second lens group 202, a combiner 203, an optical path component 204, and a light emitting port 205, which are connected to each other; the receiving light port 105 and the emitting light port 205 are both disposed at the same end of the circuit board 30 in the length direction, the first optoelectronic chip set 101, the first lens group 102, the wave splitter 103 and the coupler 104 are all disposed on a first surface 301 of the circuit board 30, and the second optoelectronic chip set 201, the second lens group 202, the wave combiner 203 and the optical path component 204 are all disposed on a second surface 302 of the circuit board 30. In this way, the volume of the entire optical module can be reduced, see fig. 7 to 9.
Specifically, the first optoelectronic chip set 101, the first lens group 102, the wave splitter 103 and the coupler 104 are all disposed in a first region 303 of a first surface 301 of the circuit board 30; the second optoelectronic chip set 201, the second lens group 202, the combiner 203 and the optical path component 204 are all arranged in a second area 304 of a second surface 302 of the circuit board 30; the first region 303 and the second region 304 are offset in the longitudinal direction of the circuit board 30. As a result, the heat dissipation effect of the optical module is improved, as shown in fig. 7 to 9.
Wherein the optical module further comprises a support member 306 supporting the optical receiving end module 10 and the optical emitting end module 20, and the support member 306 is fixed on the circuit board 30. More specifically, the material of the support 306 may be kovar, tungsten copper, or ceramic. The supporting member 306 may be used alone or in combination, for example, kovar alloy is used to support the light emitting port 205, tungsten copper is used to support the second optoelectronic chip set 201, and ceramic is used to support the first optoelectronic chip set 101. Preferably, kovar alloy is used to support the transmitting light port 205 of the transmitting end module 20, part of the lenses of the second lens group 202, and the combiner 203, tungsten copper is used to support the second optoelectronic chip set 201 of the transmitting end module 20 and part of the lenses of the second lens group 202, and ceramic is used to support the first optoelectronic chip set 101, the receiving light port 105, the wave splitter 103, and the first lens group 102 of the receiving end module 10.
Wherein the support 306 includes a retaining groove (not shown) that retains the optical fiber 106. In this way, the optical fibers 106 are more firmly arranged.
Specifically, the components in the optical receiving end module 10 are fixed on the supporting member 306 by the following methods: the first photoelectric chip set 101 is fixed through structural adhesive, the wave splitter 103, the coupler 104 and the first lens set 102 are fixed through structural adhesive or ultraviolet light curing adhesive, and the light receiving port 105 is fixed through laser welding or structural adhesive. The components in the light emitting end module 20 are secured to the support 306 by: the second photoelectric chip group 201 is fixed through structural adhesive, the wave combiner 203 is fixed through structural adhesive or ultraviolet light curing adhesive of the light path component 204, the second lens group 202 is fixed through ultraviolet light curing adhesive, and the light emitting port 205 is fixed through laser welding or structural adhesive.
Wherein, the wave separator 103 and the wave combiner 203 can both use one of the following schemes:
1) the Z-block is matched with a film filter (TFF);
2) arrayed Waveguide Grating (AWG);
3) a Polarizing Beam Splitter (PBS).
The two may be the same or different. For example, the splitter 103 uses a Z-block to fit TFF, the combiner 203 uses an AWG; or the wave separator 103 uses AWG and the wave combiner 203 uses PBS; can be combined at will.
The first lens group 102 and the second lens group 202 have functions of, but not limited to, light path convergence, collimation, light path turning, and isolator.
The coupler 104 may be a collimator or a Fiber Array (FA) capillary.
As shown in fig. 10, the optical module further includes a housing. The housing includes a base plate 401, a bottom cover plate 402, and a top cover plate 403.
To further understand the features and technical contents of the embodiments of the present invention, the following describes the transmission process of the optical signal in the embodiments of the present invention:
1) external optical signals enter from the receiving port 105 of the optical receiving end module 10, enter the coupler 104 through the optical fiber 106, and then are separated by the splitter 103, and are transmitted to the plurality of channels of the first optoelectronic chip set 101 through the plurality of lenses of the first lens group 102, and are converted into electrical signals through the first optoelectronic chip set 101.
2) The internal electrical signal is converted into a plurality of optical signals by the second optoelectronic chipset 201 of the optical transmission terminal assembly 20, and is transmitted to the plurality of lenses of the second lens group 202 through a plurality of channels, and is transmitted to the combiner 203 through the second lens group 202, and the plurality of optical signals are combined together by the combiner 203, and are transmitted to the transmission optical port 205 of the optical transmission terminal assembly 20 through the optical path assembly 204, and are transmitted to the outside through the transmission optical port 205.
Further, in the embodiment of the present invention, the arrangement of the optical fiber 106 between the coupler 104 and the light receiving port 105 may be divided into two embodiments. According to the specific implementation of the demultiplexer 103 of the optical receiving end module 10, two implementations may be adopted, and four implementations may be combined (for example only, not all). Specifically, the four embodiments include:
in a first embodiment, as shown in fig. 1, the optical fiber 106 between the coupler 104 and the receiving optical port 105 is a straight line connection, and the specific embodiment of the wave splitter 103 of the optical receiving end module 10 is a Z-block matched TFF.
In a second embodiment, as shown in fig. 2, the optical fiber 106 between the coupler 104 and the receiving optical port 105 is a curved connection, and the specific embodiment of the wave splitter 103 of the optical receiving end module 10 is a Z-block matched TFF. The curve connection here may be: the interface orientation of the receiving port 105 connecting the optical fiber 106 coincides with the interface orientation of the coupler 104 connecting the optical fiber 106.
In a third embodiment, as shown in fig. 3, the optical fiber 106 between the coupler 104 and the receiving optical port 105 is a straight line connection, and the specific embodiment of the wave splitter 103 of the optical receiving end subassembly 10 is AWG.
In a fourth embodiment, as shown in fig. 4, the optical fiber 106 between the coupler 104 and the receiving optical port 105 is a curved connection, and the specific embodiment of the wave splitter 103 of the optical receiving end subassembly 10 is AWG.
In the first and third embodiments, the optical fiber 106 between the coupler 104 and the light receiving port 105 is linearly connected, so that the assembly is simple, and the optical fiber 106 can be prevented from being crushed by the housing of the optical module due to overlapping during the assembly. To reduce the force of the optical fiber 106 on other components in the optical receiving end assembly 10, the optical fiber 106 may be secured by soft glue. In addition, the force of the optical fiber 106 on other components in the optical receiving end assembly 10 may be further reduced by securing the optical fiber 106 in a retaining groove.
Further, as shown in fig. 11 and 12, the optical module may have only one receiving optical port 105 and only one transmitting optical port 205, that is, the optical receiving side subassembly 10 and the optical transmitting side subassembly 20 each have only one optical port. In the case where the optical receiving end module 10 and the optical transmitting end module 20 each have only one optical port, if the external connector interface is in duplex, the coupler 104 and the receiving optical port 105 of the optical receiving end module 10 can be connected by an optical fiber. In this way, the requirement on the relative position of the light emitting port 205 and the light receiving port 105 can be reduced, and the manufacturing cost of the optical module can be reduced.
Further, if the optical module has more optical ports than the above embodiments, the coupler 104 and the receiving optical port 105 of the optical receiving end module 10 are connected by optical fibers, so that the manufacturing cost of the optical module can be reduced.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents, improvements, etc. that are within the spirit and principle of the present invention should be included in the present invention.
Claims (10)
1. An optical receiving end component is characterized in that the optical receiving end component comprises a first photoelectric chip set, a first lens set, a wave splitter, a coupler and a receiving optical port which are connected with each other; wherein, the coupler is connected with the light receiving port through an optical fiber.
2. The optical receiving end assembly of claim 1, wherein the interface of the receiving optical port connected to the optical fiber and the interface of the coupler connected to the optical fiber face in the same direction, and the distance between the extension lines of the two interfaces in the transverse direction is greater than a preset value.
3. The optical receiving end assembly of claim 2, wherein the length of the optical fiber between the receiving optical port and the coupler is greater than a preset value.
4. The optical receiving end assembly of claim 3, wherein the optical fiber is a single mode optical fiber or a microbend optical fiber.
5. An optical receiving end assembly according to any one of claims 1 to 4, wherein the receiving optical port comprises a pin assembly, and the optical fiber is connected to the receiving optical port through the pin assembly.
6. A light module comprising at least one light receiving side subassembly as claimed in any one of claims 1 to 5, at least one light emitting side subassembly and a circuit board; the light receiving end assembly and the light emitting end assembly are both fixed on the circuit board.
7. The optical module of claim 6, wherein the optical transmit side subassembly comprises a second optoelectronic chip set, a second lens set, a combiner, an optical path subassembly, and an optical transmit port, which are connected to each other; the receiving light port and the emitting light port are arranged at the same end of the circuit board in the length direction, the first photoelectric chip set, the first lens set, the wave splitter and the coupler are all arranged on a first surface of the circuit board, and the second photoelectric chip set, the second lens set, the wave combiner and the light path component are all arranged on a second surface of the circuit board; the first surface and the second surface are both surfaces parallel to the length direction of the circuit board, and the first surface and the second surface are opposite in orientation.
8. The optical module of claim 7, wherein the first group of electro-optic groups, the first group of lenses, the splitter, and the coupler are all disposed at a first region of a first surface of the circuit board; the second photoelectric chip set, the second lens set, the wave combiner and the light path component are all arranged in a second area of the second surface of the circuit board; the first region and the second region are staggered in the length direction of the circuit board.
9. The optical module of claim 8, further comprising a support member supporting the optical receive end subassembly and the optical transmit end subassembly, the support member being secured to the circuit board.
10. The optical module of claim 9, wherein the support includes a retaining groove that retains the optical fiber.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910907477.0A CN110618505A (en) | 2019-09-24 | 2019-09-24 | Optical receiving end assembly and optical module |
| PCT/CN2019/124121 WO2021056835A1 (en) | 2019-09-24 | 2019-12-09 | Light reception end assembly and optical module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910907477.0A CN110618505A (en) | 2019-09-24 | 2019-09-24 | Optical receiving end assembly and optical module |
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| CN110618505A true CN110618505A (en) | 2019-12-27 |
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| WO (1) | WO2021056835A1 (en) |
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|---|---|---|---|---|
| CN111722331A (en) * | 2020-06-28 | 2020-09-29 | 武汉英飞光创科技有限公司 | Optical module and manufacturing method thereof |
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| CN111722331A (en) * | 2020-06-28 | 2020-09-29 | 武汉英飞光创科技有限公司 | Optical module and manufacturing method thereof |
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| WO2021056835A1 (en) | 2021-04-01 |
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