CN110615557A - Treatment process of electroless copper plating wastewater - Google Patents

Treatment process of electroless copper plating wastewater Download PDF

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Publication number
CN110615557A
CN110615557A CN201910980924.5A CN201910980924A CN110615557A CN 110615557 A CN110615557 A CN 110615557A CN 201910980924 A CN201910980924 A CN 201910980924A CN 110615557 A CN110615557 A CN 110615557A
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polyacrylamide
copper plating
electroless copper
filtrate
wastewater
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候敬义
彭勇
简捷
赵先辉
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Zhenjiang Heyun Industrial Wastewater Treatment Co Ltd
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Zhenjiang Heyun Industrial Wastewater Treatment Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F9/00Multistage treatment of water, waste water or sewage
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/001Processes for the treatment of water whereby the filtration technique is of importance
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/52Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
    • C02F1/54Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities using organic material
    • C02F1/56Macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/722Oxidation by peroxides
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/16Nature of the water, waste water, sewage or sludge to be treated from metallurgical processes, i.e. from the production, refining or treatment of metals, e.g. galvanic wastes
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2301/00General aspects of water treatment
    • C02F2301/08Multistage treatments, e.g. repetition of the same process step under different conditions
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2305/00Use of specific compounds during water treatment
    • C02F2305/02Specific form of oxidant
    • C02F2305/026Fenton's reagent

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  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Removal Of Specific Substances (AREA)

Abstract

The invention belongs to the technical field of wastewater treatment, and particularly relates to a treatment process of electroless copper plating wastewater, which comprises the following steps: performing synthetic reaction on polyacrylamide, 2-propyl valeraldehyde, formaldehyde and secondary amine, adding carbon disulfide for reaction to obtain modified polyacrylamide dispersion, and performing Fenton treatment after treating copper plating wastewater by using the polyacrylamide dispersion. Wherein, the polyacrylamide dispersion liquid can bring copper ions and EDTA in the wastewater out of the water body simultaneously.

Description

Treatment process of electroless copper plating wastewater
Technical Field
The invention belongs to the technical field of wastewater treatment, and particularly relates to a treatment process of electroless copper plating wastewater.
Background
Chemical copper plating refers to that under the condition of not applying an external current, a reducing agent is utilized to reduce a copper simple substance and deposit the copper simple substance on the surface of a matrix, the chemical copper plating solution is complex in components and mainly comprises a copper salt, a complexing agent and a reducing agent, the copper salt provides copper ions for a plating solution, the reducing agent usually selects formaldehyde for reducing the copper ions into the copper simple substance, the pH value of the plating solution needs to be adjusted to be more than 10 due to the strong reducibility of the formaldehyde under an alkaline condition, in order to prevent the copper ions from forming copper hydroxide and depositing under the alkaline condition, the plating solution needs to be complexed into a water-soluble complex by the complexing agent, and the commonly used complexing agent is sodium ethylene diamine tetracetate (EDTA-2. Along with the progress of the copper plating reaction, the concentration of effective components in the plating solution is gradually reduced to cause the failure of the plating solution, and the failed plating solution is discharged from the plating tank and is the chemical copper plating waste water.
It can be seen that the main pollutants of the electroless copper plating wastewater comprise copper ions, ethylenediaminetetraacetic acid ions and a certain content of COD, the copper ions and the ethylenediaminetetraacetic acid ions are often separated in the existing treatment process, for example, sodium sulfide is adopted to precipitate and separate the copper ions, acid is added into the copper ions to separate out the EDTA in an acidic environment, and then the Fenton reaction is carried out to degrade the COD. This results in longer periods of wastewater treatment; if after the copper ions are precipitated, the Fenton reagent is directly added into the wastewater to react so as to degrade the EDTA and the COD, so that the consumption of the hydrogen peroxide is increased, the EDTA cannot be recycled, and the cost is further increased.
Disclosure of Invention
In order to solve the technical problems, the invention provides a treatment process of electroless copper plating wastewater, which comprises the following steps:
(1) modification of polyacrylamide
Performing synthetic reaction on polyacrylamide, 2-propyl valeraldehyde, formaldehyde and secondary amine, adding carbon disulfide for reaction to obtain modified polyacrylamide dispersion liquid,
the dosage mass ratio of the polyacrylamide to the 2-propyl valeraldehyde is 1: 0.9 to 1.2 parts by weight,
the dosage mass ratio of the polyacrylamide to the formaldehyde is 1: 0.2 to 0.25 of a nitrogen-containing compound,
the secondary amine is dimethylamine, and the mass ratio of the dosage of the polyacrylamide to the dimethylamine is 1: 0.65 to 0.8 percent of a,
the dosage mass ratio of the polyacrylamide to the carbon disulfide is 1: 1.1 to 1.3;
(2) adding the polyacrylamide dispersion liquid obtained in the step (1) into the wastewater to be treated, fully stirring, standing fully, filtering to obtain a first filtrate,
the volume ratio of the polyacrylamide dispersion liquid to the wastewater to be treated is 1-4: 10;
(3) adding a Fenton reagent into the first filtrate obtained in the step (2), adding alkali into the first filtrate after the Fenton reaction is sufficient, precipitating sufficiently, filtering again to obtain the filtrate, namely the treated copper plating wastewater,
the Fenton reagent is anhydrous ferrous sulfate and hydrogen peroxide,
the alkali is sodium hydroxide or potassium hydroxide.
Copper ions and ethylene diamine tetraacetic acid radical ions, namely EDTA are originally complexed together and dissolved in the wastewater, and the modified polyacrylamide molecule in the scheme has a dithiocarbamic acid structure, so that the copper ions can be captured from a complex of the EDTA and the copper ions to form stable chelation; meanwhile, EDTA which loses copper ions is also obviously embedded into the modified polyacrylamide molecular chain structure, and is removed from the water body along with the filtering of the polyacrylamide which chelates the copper ions. Therefore, the subsequent Fenton reaction only needs to remove the residual COD in the water body.
Drawings
FIG. 1 is a plan view showing the branched molecular chain distribution structure of polyacrylamide modified in step (1) of example 1.
Detailed Description
Example 1
(1) Modification of polyacrylamide
Adding 100 parts by mass of polyacrylamide (300 ten thousand relative to the molecular mass) into 9000 parts by mass of deionized water, stirring to dissolve, adding 360 parts by mass of an ethanol solution of 2-propylvaleraldehyde with a solute mass fraction of 25% and 60 parts by mass of an aqueous formaldehyde solution with a solute mass fraction of 37%, heating to 60 ℃, stirring at a rotating speed of 150r/min for sufficient reaction (2.5 hours), adding 220 parts by mass of an aqueous dimethylamine solution with a solute mass fraction of 30%, continuously keeping the temperature at 60 ℃, and stirring at a rotating speed of 150r/min for sufficient reaction (4.5 hours); naturally cooling to normal temperature (25 ℃, the same below), adding 60 parts by mass of sodium hydroxide and 110 parts by mass of carbon disulfide, stirring for 40 minutes at the rotation speed of 150r/min at the normal temperature, then heating to 53 ℃ and stirring and reacting at the rotation speed of 150r/min for fully (4 hours), and naturally cooling to the normal temperature to obtain the modified polyacrylamide dispersion liquid;
(2) preparing simulated electroless copper plating wastewater: adding 90 parts by mass of anhydrous copper sulfate, 330 parts by mass of disodium ethylene diamine tetraacetate, 10 parts by mass of sodium hydroxide, 30 parts by mass of formaldehyde aqueous solution with solute mass fraction of 37% and 8 parts by mass of A, A' -bipyridine into 10000 parts by mass of deionized water, and fully mixing,
through calculation, the following results are obtained: in the simulated electroless copper plating wastewater, the initial concentration of copper ions is 3590mg/L, the initial concentration of ethylene diamine tetraacetic acid radical ions is 28400mg/L,
and (2) at 25 ℃, uniformly stirring the polyacrylamide dispersion liquid obtained in the step (1), and then adding the mixture into a stirring tank according to the weight ratio of 4: 10 into the simulated copper plating wastewater (12L of the simulated copper plating wastewater in total) and stirring the mixture for 5 minutes at the rotating speed of 100r/min, standing the mixture for 12 minutes (fully settling), filtering the mixture to obtain a first filtrate,
detecting the concentration of copper ions in the first filtrate to be 69mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of Ethylene Diamine Tetraacetic Acid (EDTA) ions in the first filtrate to be 15180mg/L by using a high performance liquid chromatography;
dispersing a filter cake obtained together with the first filtrate into deionized water, wherein the mass ratio of the filter cake to the deionized water is 1: 100, heating to 75 ℃, stirring for 3 hours at the rotating speed of 200r/min, filtering to obtain filtrate, namely the aqueous solution of the ethylenediaminetetraacetic acid (EDTA) ion, wherein the purpose of heating is to increase the activity of the molecular chain of the EDTA ion and enable the molecular chain to be separated from the constraint of the upper branch chain of the polyacrylamide, thereby realizing the filtration and recovery of the EDTA ion (EDTA),
(3) at 25 ℃, after the pH value of the first filtrate obtained in the step (2) is adjusted to 3.0, ferrous sulfate heptahydrate accounting for 1.9% of the total mass of the first filtrate is added, hydrogen peroxide accounting for 12.4% of the total volume of the first filtrate is injected, the mass concentration of hydrogen peroxide is 27.5%, sodium hydroxide is added after the mixture is fully stirred to fully precipitate, the pH value of the first filtrate is adjusted to 7.5 and is stabilized, the mixture is filtered again, the obtained filtrate is treated copper plating wastewater, and the COD concentration of the filtrate is 35mg/L through detection.
Comparative example 1
On the basis of example 1, during the modification of polyacrylamide, formaldehyde is replaced by equimolar 2-propyl valeraldehyde, and the remaining operations are adapted:
(1) adding 100 parts by mass of polyacrylamide (300 ten thousand relative to the molecular mass) into 9000 parts by mass of deionized water, stirring to dissolve, adding 740 parts by mass of an ethanol solution of 2-propylvaleraldehyde with a solute mass fraction of 25%, heating to 60 ℃, stirring at a rotation speed of 150r/min for sufficient reaction (4 hours), adding 220 parts by mass of a dimethylamine aqueous solution with a solute mass fraction of 30%, continuously keeping the temperature at 60 ℃, and stirring at a rotation speed of 150r/min for sufficient reaction (5 hours); naturally cooling to normal temperature (25 ℃, the same below), adding 60 parts by mass of sodium hydroxide and 110 parts by mass of carbon disulfide, stirring for 40 minutes at the rotation speed of 150r/min at the normal temperature, then heating to 53 ℃ and stirring and reacting at the rotation speed of 150r/min for fully (5 hours), and naturally cooling to the normal temperature to obtain the modified polyacrylamide dispersion liquid;
(2) the same procedure as in example 1 was conducted to simulate the electroless copper plating wastewater,
stirring the polyacrylamide dispersion liquid obtained in the step (1) at 25 ℃, and then adding the mixture into a stirring tank according to the weight ratio of 4.13: 10 is added into the simulated copper plating wastewater and stirred for 5 minutes at the rotating speed of 100r/min, then the mixture is kept stand for 12 minutes (fully settled), filtered to obtain first filtrate,
the concentration of copper ions in the first filtrate was 443mg/L as detected by atomic absorption spectrophotometer, and the concentration of EDTA ions in the first filtrate was 19540mg/L as detected by high performance liquid chromatography.
Comparative example 2
On the basis of example 1, the dosage of 2-propyl valeraldehyde is halved in the modification process of polyacrylamide, the reduced 2-propyl valeraldehyde is replaced by equal molar formaldehyde, and the other operations are modified adaptively:
(1) adding 100 parts by mass of polyacrylamide (300 ten thousand relative to the molecular mass) into 9000 parts by mass of deionized water, stirring to dissolve, adding 180 parts by mass of an ethanol solution of 2-propylvaleraldehyde with a solute mass fraction of 25% and 89 parts by mass of an aqueous formaldehyde solution with a solute mass fraction of 37%, heating to 60 ℃, stirring at a rotating speed of 150r/min for sufficient reaction (2.5 hours), adding 220 parts by mass of an aqueous dimethylamine solution with a solute mass fraction of 30%, continuously keeping the temperature at 60 ℃, and stirring at a rotating speed of 150r/min for sufficient reaction (4.5 hours); naturally cooling to normal temperature (25 ℃, the same below), adding 60 parts by mass of sodium hydroxide and 110 parts by mass of carbon disulfide, stirring for 40 minutes at the rotation speed of 150r/min at the normal temperature, then heating to 53 ℃ and stirring and reacting at the rotation speed of 150r/min for fully (4 hours), and naturally cooling to the normal temperature to obtain the modified polyacrylamide dispersion liquid;
(2) the same procedure as in example 1 was conducted to simulate the electroless copper plating wastewater,
stirring the polyacrylamide dispersion liquid obtained in the step (1) at 25 ℃, and then adding the mixture into a reactor according to the proportion of 3.94: 10 is added into the simulated copper plating wastewater and stirred for 5 minutes at the rotating speed of 100r/min, then the mixture is kept stand for 12 minutes (fully settled), filtered to obtain first filtrate,
detecting the concentration of copper ions in the first filtrate to be 52mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of ethylene diamine tetraacetic acid radical ions in the first filtrate to be 19160mg/L by using a high performance liquid chromatography.
Comparative example 3
Simulating the copper ions in the electroless copper plating wastewater, and the rest of the process is the same as the process in example 1:
(1) modification of polyacrylamide
The same as example 1;
(2) preparing simulated electroless copper plating wastewater: adding 330 parts by mass of sodium ethylene diamine tetracetate, 60 parts by mass of sodium hydroxide, 100 parts by mass of formaldehyde aqueous solution with solute mass fraction of 37% and 8 parts by mass of A, A' -bipyridine into 10000 parts by mass of deionized water, fully mixing,
and (2) at 25 ℃, uniformly stirring the polyacrylamide dispersion liquid obtained in the step (1), and then adding the mixture into a stirring tank according to the weight ratio of 4: 9.9, stirring at a rotating speed of 100r/min for 5 minutes, standing for 12 minutes, and detecting the concentration of the ethylene diamine tetraacetic acid ions in the dispersion system to be 18210mg/L by using a high performance liquid chromatography.
Comparative example 4
On the basis of example 1, during the modification of polyacrylamide, 2-propyl valeraldehyde is replaced by equimolar n-valeraldehyde, and the rest of the operations are adapted:
(1) adding 100 parts by mass of polyacrylamide (300 ten thousand relative to the molecular mass) into 9000 parts by mass of deionized water, stirring to dissolve, adding 500 parts by mass of an ethanol solution of n-valeraldehyde with a solute mass fraction of 25%, heating to 60 ℃, stirring at a rotating speed of 150r/min for sufficient reaction (4 hours), adding 220 parts by mass of a dimethylamine aqueous solution with a solute mass fraction of 30%, continuously keeping the temperature at 60 ℃, and stirring at a rotating speed of 150r/min for sufficient reaction (5 hours); naturally cooling to normal temperature (25 ℃, the same below), adding 60 parts by mass of sodium hydroxide and 110 parts by mass of carbon disulfide, stirring for 40 minutes at the rotation speed of 150r/min at the normal temperature, then heating to 53 ℃ and stirring and reacting at the rotation speed of 150r/min for fully (5 hours), and naturally cooling to the normal temperature to obtain the modified polyacrylamide dispersion liquid;
(2) the same procedure as in example 1 was conducted to simulate the electroless copper plating wastewater,
stirring the polyacrylamide dispersion liquid obtained in the step (1) at 25 ℃, and then adding the mixture into a stirring tank according to the weight ratio of 3.9: 10 is added into the simulated copper plating wastewater and stirred for 5 minutes at the rotating speed of 100r/min, then the mixture is kept stand for 12 minutes (fully settled), filtered to obtain first filtrate,
detecting the concentration of copper ions in the first filtrate to be 58mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of ethylene diamine tetraacetic acid ions in the first filtrate to be 19460mg/L by using a high performance liquid chromatography.
In the scheme, 2-propylvaleraldehyde, formaldehyde and carbon disulfide are sequentially connected to a linear polyacrylamide molecular chain, the carbon disulfide is introduced to react to generate dithiocarbamic acid groups to chelate copper ions, the whole modified polyacrylamide can obviously combine the ethylenediaminetetraacetic acid ions in the wastewater while chelating the copper ions, and the ethylenediaminetetraacetic acid ions are filteredThe ions are carried out, and the recycling of the part of the EDTA ions is also facilitated. In this regard, the applicant believes that this is because ethylenediaminetetraacetic acid ions are relatively stably intercalated between two adjacent 2-propylvaleraldehydes on the modified polyacrylamide molecular chain. Through specific calculation, the following results are obtained: example 1, 2-Propylpentanal with the repeating unit-CH in Polyacrylamide2—CH(CONH2) The molar ratio of-is about 1:2, although the choice of the N position of 2-propylvaleraldehyde is not clearly regular during the reaction, it is probable that there will be some degree of "almost two-CH groups on the polyacrylamide macromolecular chain between two adjacent 2-propylvaleraldehyde molecules2—CH(CONH2) -unit "(as indicated by the dashed box in FIG. 1), and the space between the two 2-propylpentanals is just suitable for the intercalation of EDTA ions,
when the dosage of the 2-propylvaleraldehyde in the comparative example 1 and the comparative example 2 is obviously changed, the distribution condition of the 2-propylvaleraldehyde connected to the long polyacrylamide chain is also changed, so that the quantity of the spaces formed by two adjacent grafted 2-propylvaleraldehydes and suitable for the intercalation of the ethylene diamine tetraacetic acid ions is obviously reduced, the quantity of the modified polyacrylamide combined with and carrying out the ethylene diamine tetraacetic acid ions is also reduced,
in comparative example 3, the same modified polyacrylamide is used to treat wastewater without heavy metal ions, and the effect is obviously inferior to that of example 1 in the case of purifying EDTA ions only, which should be because in the process of abstracting copper ions in EDTA copper complex by dithiocarbamic acid groups on the modified polyacrylamide macromolecules in example 1, the polyacrylamide macromolecules can be further close to the EDTA copper complex, that is, close to the EDTA ions which lose copper ions, so that the EDTA ions are embedded into the corresponding spaces on the modified polyacrylamide molecular chains, and it can be seen that the effect of "approaching" is still more obvious to the embedding behavior of the EDTA ions,
therefore, in the actual process of treating the wastewater, under the condition of sufficient modified polyacrylamide, firstly, heavy metal ions are added into the wastewater to complex the free ethylene diamine tetraacetic acid ions, and then, the wastewater is treated by the modified polyacrylamide, so that more ethylene diamine tetraacetic acid ions are brought to the macromolecular chains of the modified polyacrylamide and are embedded.
Example 2
The method is characterized in that the wastewater discharged by a chemical copper plating factory is treated, and the water quality condition before the wastewater treatment is as follows: pH value of 12.5, copper ion concentration of 0.56g/L, and ethylenediaminetetraacetic acid radical ion concentration of 14.5g/L, CODCr7630mg/L (excluding EDTA radical ion), 26.75mg/L nickel ion,
firstly, anhydrous copper sulfate is added into 15 tons of wastewater discharged from the chemical copper plating factory, and the mixture is stirred and dispersed fully until the concentration of copper ions in the wastewater reaches 3.2g/L, and then the modified polyacrylamide dispersion liquid prepared in the step (1) of the example 1 is stirred uniformly and then is mixed according to the proportion of 1: adding 1.4 mass-to-volume ratio (g: ml) into the wastewater specially added with anhydrous copper sulfate, stirring at 100r/min for 10 minutes, standing for 20 minutes (settling fully), filtering to obtain a first filtrate,
detecting the concentration of copper ions in the first filtrate to be 0.1mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of Ethylene Diamine Tetraacetic Acid (EDTA) ions in the first filtrate to be 960mg/L by using a high performance liquid chromatography;
dispersing a filter cake obtained together with the first filtrate into deionized water, wherein the mass ratio of the filter cake to the deionized water is 1: 100, heating to 75 ℃, stirring for 3 hours at the rotating speed of 200r/min, filtering, adding acid into the obtained filtrate to adjust the pH value to 1.0, stirring for 25 minutes at the rotating speed of 50r/min, filtering out precipitated substances, drying, and weighing to obtain: per m3The purity of disodium ethylenediaminetetraacetate in the precipitate (after adding anhydrous copper sulfate exclusively) was calculated to be 95.7%, and the recovery rate of disodium ethylenediaminetetraacetate was calculated to be about 71.5% (obtained by 6322g × 2.4 ÷ 1.4 × 95.7% ÷ 1000 ÷ 14.5 g/L).
At 25 ℃, after the pH value of the first filtrate obtained in example 2 is adjusted to 3.0, ferrous sulfate heptahydrate accounting for 1.3% of the total mass of the first filtrate is added, hydrogen peroxide accounting for 5.6% of the total volume of the first filtrate is injected with 27.5% of the mass concentration of hydrogen peroxide, and after sufficient stirring, sodium hydroxide is added to fully precipitate, and meanwhile, the pH value of the first filtrate is adjusted to 7.5 and stabilized, and then filtering is performed again, the obtained filtrate is treated copper plating wastewater, and the COD concentration of the filtrate is 63mg/L by detection.
Comparative example 5
The modified polyacrylamide dispersion prepared in step (1) of comparative example 1 was used to treat wastewater discharged from an electroless copper plating plant in example 2:
firstly, adding anhydrous copper sulfate into the wastewater discharged from a chemical copper plating plant, stirring and dispersing the anhydrous copper sulfate fully until the concentration of copper ions in the wastewater reaches 3.2g/L, stirring the modified polyacrylamide dispersion liquid prepared in the step (1) of the comparative example 1 uniformly, and then adding the modified polyacrylamide dispersion liquid into the wastewater at a temperature of 25 ℃ according to the weight ratio of 1.03: adding 1.4 mass-to-volume ratio (g: ml) into the wastewater specially added with anhydrous copper sulfate, stirring at 100r/min for 10 minutes, standing for 20 minutes (settling fully), filtering to obtain a first filtrate,
detecting the concentration of copper ions in the first filtrate to be 0.1mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of ethylene diamine tetraacetic acid ions in the first filtrate to be 5750mg/L by using a high performance liquid chromatography.
Comparative example 6
The modified polyacrylamide dispersion prepared in step (1) of comparative example 2 was used to treat wastewater discharged from an electroless copper plating plant in example 2:
firstly, adding anhydrous copper sulfate into the wastewater discharged from a chemical copper plating plant, stirring and dispersing the anhydrous copper sulfate fully until the concentration of copper ions in the wastewater reaches 3.2g/L, stirring the modified polyacrylamide dispersion liquid prepared in the step (1) of the comparative example 2 uniformly, and then adding the modified polyacrylamide dispersion liquid into the wastewater at a temperature of 25 ℃ according to the weight ratio of 0.985: adding 1.4 mass-to-volume ratio (g: ml) into the wastewater specially added with anhydrous copper sulfate, stirring at 100r/min for 10 minutes, standing for 20 minutes (settling fully), filtering to obtain a first filtrate,
detecting the concentration of copper ions in the first filtrate to be 0.1mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of ethylene diamine tetraacetic acid ions in the first filtrate to be 5360mg/L by using a high performance liquid chromatography.
Comparative example 7
The modified polyacrylamide dispersion prepared in step (1) of comparative example 4 was used to treat the wastewater discharged from the electroless copper plating plant of example 2:
firstly, anhydrous copper sulfate is added into the wastewater discharged from a chemical copper plating factory, and is stirred and dispersed fully until the concentration of copper ions in the wastewater reaches 3.2g/L, and then the modified polyacrylamide dispersion liquid prepared in the step (1) of the comparative example 4 is stirred uniformly and is added at 25 ℃ according to the weight ratio of 0.975: adding 1.4 mass-to-volume ratio (g: ml) into the wastewater specially added with anhydrous copper sulfate, stirring at 100r/min for 10 minutes, standing for 20 minutes (settling fully), filtering to obtain a first filtrate,
detecting the concentration of copper ions in the first filtrate to be 0.1mg/L by using an atomic absorption spectrophotometer, and detecting the concentration of ethylene diamine tetraacetic acid ions in the first filtrate to be 5400mg/L by using a high performance liquid chromatography.

Claims (9)

1. A treatment process of electroless copper plating wastewater is characterized in that: the process comprises the following steps of,
(1) modification of polyacrylamide
Carrying out synthetic reaction on polyacrylamide, 2-propyl valeraldehyde, formaldehyde and secondary amine, and then adding carbon disulfide for reaction to obtain a modified polyacrylamide dispersion liquid;
(2) adding the polyacrylamide dispersion liquid obtained in the step (1) into wastewater to be treated, fully stirring, standing fully, and filtering to obtain a first filtrate;
(3) and (3) adding a Fenton reagent into the first filtrate obtained in the step (2), adding alkali into the first filtrate after the Fenton reaction is sufficient, precipitating sufficiently, and filtering again to obtain the filtrate, namely the treated copper plating wastewater.
2. The process for treating electroless copper plating wastewater according to claim 1, characterized in that: in the step (1), the dosage mass ratio of the polyacrylamide to the 2-propyl valeraldehyde is 1: 0.9 to 1.2.
3. The process for treating electroless copper plating wastewater according to claim 1, characterized in that: in the step (1), the dosage mass ratio of polyacrylamide to formaldehyde is 1: 0.2 to 0.25.
4. The process for treating electroless copper plating wastewater according to claim 1, characterized in that: the secondary amine in the step (1) is dimethylamine.
5. The process for treating electroless copper plating wastewater as defined in claim 4, wherein: in the step (1), the dosage mass ratio of polyacrylamide to dimethylamine is 1: 0.65 to 0.8.
6. The process for treating electroless copper plating wastewater according to claim 1, characterized in that: in the step (1), the dosage mass ratio of the polyacrylamide to the carbon disulfide is 1: 1.1 to 1.3.
7. The process for treating electroless copper plating wastewater according to claim 1, characterized in that: in the step (2), the volume ratio of the polyacrylamide dispersion liquid to the wastewater to be treated is 1-4: 10.
8. the process for treating electroless copper plating wastewater according to claim 1, characterized in that: the Fenton reagent in the step (3) is anhydrous ferrous sulfate and hydrogen peroxide.
9. The process for treating electroless copper plating wastewater according to claim 1, characterized in that: the alkali in the step (3) is sodium hydroxide or potassium hydroxide.
CN201910980924.5A 2019-10-16 2019-10-16 Treatment process of electroless copper plating wastewater Pending CN110615557A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114892009A (en) * 2022-05-26 2022-08-12 广东飞南资源利用股份有限公司 Copper-containing material and application thereof, black copper anode plate and preparation method thereof

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CN109761401A (en) * 2019-03-12 2019-05-17 江苏中电创新环境科技有限公司 A kind for the treatment of process of the strong complexing heavy metal waste water of EDTA class

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JPS54156345A (en) * 1978-05-31 1979-12-10 Hitachi Plant Eng & Constr Co Ltd Purification of metal plating waste water
CN105668752A (en) * 2016-04-19 2016-06-15 兰州交通大学 Preparing method for sulfhydrylation polyacrylamide heavy metal flocculant
CN105753128A (en) * 2016-04-19 2016-07-13 兰州交通大学 Polyacrylamide heavy metal flocculating agent and method for preparing same
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CN114892009B (en) * 2022-05-26 2023-10-20 广东飞南资源利用股份有限公司 Copper-containing material and application thereof, black copper anode plate and preparation method thereof

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