CN110597231A - Logic control assembly test bench - Google Patents
Logic control assembly test bench Download PDFInfo
- Publication number
- CN110597231A CN110597231A CN201910912404.0A CN201910912404A CN110597231A CN 110597231 A CN110597231 A CN 110597231A CN 201910912404 A CN201910912404 A CN 201910912404A CN 110597231 A CN110597231 A CN 110597231A
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- 238000012360 testing method Methods 0.000 title claims abstract description 93
- 238000004088 simulation Methods 0.000 claims abstract description 53
- 238000004891 communication Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 241000238631 Hexapoda Species 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
- G05B23/0213—Modular or universal configuration of the monitoring system, e.g. monitoring system having modules that may be combined to build monitoring program; monitoring system that can be applied to legacy systems; adaptable monitoring system; using different communication protocols
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/24—Pc safety
- G05B2219/24065—Real time diagnostics
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention discloses a logic control assembly test bench, which relates to the technical field of logic control assembly test and comprises a test panel and a circuit module; the circuit module comprises a power circuit module, a discrete magnitude input module, a discrete magnitude output module, a sensor signal simulation circuit module, a load simulation circuit module and a communication module; the power supply circuit is externally connected with a 220VAC power supply through an XS1 interface; the discrete magnitude input module, the discrete magnitude output module, the sensor signal simulation circuit module, the load simulation circuit module and the communication module are respectively and electrically connected with the power circuit module; the discrete magnitude input module, the discrete magnitude output module and the communication module are electrically connected with the test panel through XS2 interfaces; the sensor signal simulation circuit module and the load simulation circuit module are electrically connected with the test panel. The logic control assembly test board disclosed by the invention provides a special test board for PN: 7701032 logic controls the test equipment for component performance testing.
Description
Technical Field
The invention relates to the technical field of logic control assembly test equipment, in particular to a logic control assembly test bench.
Background
The existing logic control assembly test is only to simply wire on the socket of the UUT and then externally connect various required signals, and a complete set of test equipment is not provided.
Disclosure of Invention
Aiming at the prior art, the invention provides a logic control assembly test board which is specially used for PN: 7701032 logic controls component performance testing.
The invention is realized by the following technical scheme: the logic control assembly test bench comprises a machine body, a test panel arranged on the machine body and a circuit module arranged in the machine body; the circuit module comprises a power circuit module, a discrete magnitude input module, a discrete magnitude output module, a sensor signal simulation circuit module, a load simulation circuit module and a communication module; the power supply circuit is externally connected with a 220VAC power supply through an XS1 interface; the discrete magnitude input module, the discrete magnitude output module, the sensor signal simulation circuit module, the load simulation circuit module and the communication module are respectively and electrically connected with the power circuit module; the discrete magnitude input module, the discrete magnitude output module and the communication module are electrically connected with the test panel through XS2 interfaces; the sensor signal simulation circuit module and the load simulation circuit module are electrically connected with the test panel.
Further, the sensor signal analog circuit module comprises an US sensor analog circuit and a DP sensor analog circuit; the US sensor analog circuit comprises a first US sensor analog circuit and a second US sensor analog circuit; the first US sensor simulation circuit is electrically connected with the power circuit module through an XS3 interface and is electrically connected with the test panel through an XS3 interface and an XS2 interface; the second US sensor simulation circuit is electrically connected to the power circuit module through an XS2 interface, and is electrically connected to the test panel through an XS4 interface and an XS2 interface.
Further, the first US sensor analog circuit includes a voltage sensor, a first hexapod band switch, a second hexapod band switch, and a five-way voltage input circuit; the five voltage input circuits are mutually connected in parallel and are electrically connected with the power circuit module through a sliding resistor RP1 after being connected in parallel; 5 contact pins of the first six-pin band switch respectively correspond to the five voltage input circuits, and the other contact pin is grounded; the first hexagonal waveband switch is connected to the input end of the voltage sensor; the output end of the voltage sensor is connected with a second six-pin band switch, and the other end of the second six-pin band switch is connected with the test panel; the five voltage input circuits all adjust input voltage through resistors, and input currents of the five voltage input circuits are respectively as follows: 0mA, 4mA, 8mA, 16mA and 20 mA; the second US sensor analog circuit is identical in structure to the first US sensor analog circuit.
Further, the DP sensor analog circuit comprises a first quad-band switch, a second quad-band switch, a resistor R19, a resistor R20, and a resistor R21; the first four-pin wave band switch and the second four-pin wave band switch are respectively connected with the test panel through XS 2; the input end of the resistor R19 is electrically connected with the power supply voltage circuit, the other end of the resistor R19 is sequentially connected with the resistor R20 and the resistor R21 in series, and the resistor R21 is grounded; one contact pin of the first four-pin band switch is grounded, the other three contact pins are sequentially connected with the output end of the resistor R19, the output end of the resistor R20 and the output end of the resistor R21, and the voltages input by the three contact pins are 5.5V, 0.5V and 0V respectively; one contact pin of the second four-pin band switch is grounded, and the other three contact pins are connected to the output end of the resistor R21.
Furthermore, the load simulation circuit module comprises three paths of Toilet load simulation circuits connected in parallel, and the Toilet load simulation circuits are respectively externally connected with loads; each Toilet load analog circuit comprises a first resistor, a second resistor and a light-emitting diode; the current is loaded into two ends of the first resistor, the positive end of the first resistor is connected with the test panel through an XS2 interface, and the negative end of the first resistor is externally connected with a load; one end of the second resistor is connected with the test panel through an XS2 interface, and the other end of the second resistor is connected with the light emitting diode and then grounded.
Further, the discrete quantity input module comprises 8 paths of discrete quantity input control switches.
Further, the discrete quantity output module comprises 2 paths of discrete quantity output indicating lamps, namely a WWSP Lamp and a Service Panel INOP Lamp, and the rest indicating lamps on the test board are all power supply indication.
Furthermore, the power circuit module comprises a G1 power chip and a G2 power chip which are respectively externally connected with a 220VAC power supply, an adjustable resistor is connected in parallel on the G1 power chip, and the G1 power chip outputs 20.5-32.2 VDC/5A direct current; the G2 power supply chip outputs 12VDC/1A direct current; the output end of the G1 power supply chip is provided with a voltmeter; the sensor signal analog circuit module is connected with a direct current of 12 VDC/1A; the discrete magnitude input module, the discrete magnitude output module, the load analog circuit module and the communication module are all connected with 20.5-32.2 VDC/5A direct current.
Further, the communication module comprises ARINC429 communication and CAN communication which are respectively electrically connected with the test panel through an XS2 interface.
Compared with the prior art, the invention has the following advantages and beneficial effects:
(1) the logic control assembly test bench provided by the invention provides PN: 7701032 the testing device for the logic control assembly can effectively complete the performance test of the logic control assembly by the staff through testing various control switches on the panel.
(2) The logic control assembly test board provided by the invention adopts two paths of US sensor simulation circuits and one path of DP sensor simulation circuit to simulate output signals of the US sensor and the DP sensor of the UUT, and is also provided with a grounding signal to simulate fault detection of output short circuit of the sensor.
Drawings
FIG. 1 is a schematic structural diagram of a test panel according to the present invention;
FIG. 2 is a circuit diagram of a power circuit module according to the present invention;
FIGS. 3 and 4 are circuit diagrams of the present invention;
FIG. 5 is a first US sensor analog circuit of the present invention;
FIG. 6 is a functional block diagram of the present invention;
wherein: 1-voltage/ampere meter, 2-power control switch, 3-communication interface, 4-discrete quantity input control switch, 5-discrete quantity output indicator lamp, 6-load simulation test interface, 7-sensor signal simulation test interface
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
In the following embodiments, the voltage sensor is a wibo voltage sensor, and different input voltages are selected by the band switch.
The invention is suitable for the performance test of the logic control assembly, and is particularly suitable for PN: 7701032 logic controls the performance testing of the assembly.
When the test board disclosed by the invention is used, the test board can be matched with a three-meter FLUKE45 and an ARINC429 board card for use, wherein the three-meter FLUKE45 can be used for voltage level test of a load analog circuit and a sensor signal analog circuit. When the sensor signal simulation circuit is tested, a red meter pen of the three-meter FLUKE45 is connected with the Current + test hole, a black meter pen is connected with the test hole Current-, and a voltmeter display value V/10 is a mA signal value output by the sensor; when the Load simulation circuit is tested, the meter pen is connected with the test hole Load Current +, the black meter pen is connected with the test hole Load Current-, and the voltmeter display value V/10 is the Load Current A (ampere).
As shown in fig. 1 to 6, the logic control assembly testing platform includes a testing panel and a circuit module; the circuit module comprises a power circuit module, a discrete magnitude input module, a discrete magnitude output module, a sensor signal simulation circuit module, a load simulation circuit module and a communication module; the power supply circuit is externally connected with a 220VAC power supply through an XS1 interface; the discrete magnitude input module, the discrete magnitude output module, the sensor signal simulation circuit module, the load simulation circuit module and the communication module are respectively and electrically connected with the power circuit module; the discrete magnitude input module, the discrete magnitude output module and the communication module are electrically connected with the test panel through XS2 interfaces; the sensor signal simulation circuit module and the load simulation circuit module are electrically connected with the test panel.
As shown in fig. 1, the test panel includes a voltage/current meter 1, a power control switch 2, a communication interface 3, a discrete quantity input control switch 4, a discrete quantity output indicator lamp 5, a load simulation test interface 6, and a sensor signal simulation test interface 7; the voltage/ammeter 1 and the power control switch 2 are electrically connected with the power circuit module; the communication interface 3 is electrically connected with the communication module; the discrete magnitude input control switch 4 is electrically connected with the discrete magnitude input module; the discrete magnitude output indicator lamp 5 is electrically connected with the discrete magnitude output module, and the load simulation test interface 6 is electrically connected with the load simulation circuit module; the sensor signal simulation test interface 7 is electrically connected with the sensor signal simulation circuit module.
The power supply circuit module comprises a G1 power supply chip and a G2 power supply chip which are respectively externally connected with a 220VAC power supply, an adjustable resistor is connected in parallel on the G1 power supply chip, and the G1 power supply chip outputs 20.5-32.2 VDC/5A direct current; the G2 power supply chip outputs 12VDC/1A direct current; the output end of the G1 power supply chip is provided with a voltmeter; the sensor signal analog circuit module is connected with a direct current of 12 VDC/1A; the discrete magnitude input module, the discrete magnitude output module, the load analog circuit module and the communication module are all connected with 20.5-32.2 VDC/5A direct current. And double-pole double-throw switches are arranged between the interfaces of the G1 power supply chip and the G2 power supply chip and the XS1 to control the switches of the G1 power supply chip and the G2 power supply chip. The adjustable resistor KP2 can be connected between the 220VAC input end and the V + output end of the G1 power supply chip, and the output voltage of the G1 power supply chip can be realized by adjusting the access resistor of the adjustable resistor. The output end of the G1 power supply chip is also provided with a fuse F1, and the passing current of the breakdown fuse is less than 3A, so that the breakdown fuse is used for protecting a piece to be tested. Because the rated current of the logic control assembly in normal operation is not more than 3A, when the current exceeds 3A, the logic control assembly is indicated to have a fault, and the safety device acts to cut off the power supply at the moment.
The voltmeter comprises a voltmeter body, and is characterized in that connection points are further arranged at two ends of the voltmeter body and used for being externally connected with a voltage testing instrument and used for detecting and calibrating the voltmeter of the test board.
The circuit module is also provided with a current calibration circuit; the current calibration circuit comprises an ammeter and a single-pole double-throw switch S2; the input end of the ammeter is connected with the power circuit module through an XS2 interface, and the output end of the ammeter is connected with the single-pole double-throw switch; the two ends of the single-pole double-throw switch are provided with connecting points which can be externally connected with a current testing instrument, and the output end of the single-pole double-throw switch is grounded. The built-in ammeter is detected and calibrated through an external current testing instrument, so that the ammeter can be accurately displayed.
Correspondingly, the test panel is provided with a current calibration interface and a voltage calibration interface which are used for being connected with a current test instrument and a voltage test instrument to realize the calibration of the voltmeter and the ammeter.
The sensor signal analog circuit module comprises an US sensor analog circuit and a DP sensor analog circuit; the US sensor analog circuit comprises a first US sensor analog circuit and a second US sensor analog circuit; the first US sensor simulation circuit is electrically connected with the power circuit module through an XS3 interface and is electrically connected with the test panel through an XS3 interface and an XS2 interface; the second US sensor simulation circuit is electrically connected to the power circuit module through an XS2 interface, and is electrically connected to the test panel through an XS4 interface and an XS2 interface.
The first US sensor analog circuit comprises a voltage sensor, a first six-pin band switch, a second six-pin band switch and a five-path voltage input circuit; the five voltage input circuits are mutually connected in parallel and are electrically connected with the power circuit module through a sliding resistor RP1 after being connected in parallel; 5 contact pins of the first six-pin band switch respectively correspond to the five voltage input circuits, and the other contact pin is grounded; the first hexagonal waveband switch is connected to the input end of the voltage sensor; the output end of the voltage sensor is connected with a second six-pin band switch, and the other end of the second six-pin band switch is connected with the test panel; the five voltage input circuits all adjust input voltage through resistors, and input currents of the five voltage input circuits are respectively as follows: 0mA, 4mA, 8mA, 16mA and 20 mA; the second US sensor analog circuit is identical in structure to the first US sensor analog circuit.
The DP sensor analog circuit comprises a first four-pin band switch, a second four-pin band switch, a resistor R19, a resistor R20 and a resistor R21; the first four-pin wave band switch and the second four-pin wave band switch are respectively connected with the test panel through XS 2; the input end of the resistor R19 is electrically connected with the power supply voltage circuit, the other end of the resistor R19 is sequentially connected with the resistor R20 and the resistor R21 in series, and the resistor R21 is grounded; one contact pin of the first four-pin band switch is grounded, the other three contact pins are sequentially connected with the output end of the resistor R19, the output end of the resistor R20 and the output end of the resistor R21, and the voltages input by the three contact pins are 5.5V, 0.5V and 0V respectively; one contact pin of the second four-pin band switch is grounded, and the other three contact pins are connected to the output end of the resistor R21.
The load simulation circuit module comprises three paths of Toilet load simulation circuits which are connected in parallel, and the Toilet load simulation circuits are respectively externally connected with loads; each Toilet load analog circuit comprises a first resistor, a second resistor and a light-emitting diode; the current is loaded into two ends of the first resistor, the positive end of the first resistor is connected with the test panel through an XS2 interface, and the negative end of the first resistor is externally connected with a load; one end of the second resistor is connected with the test panel through an XS2 interface, and the other end of the second resistor is connected with the light emitting diode and then grounded.
The discrete quantity input module comprises 8 paths of discrete quantity input control switches.
The discrete quantity output module comprises 8 paths of discrete quantity output indicating lamps.
The interface definition of the test panel is shown in table 1:
TABLE 1
Wherein, the switch description is shown in table 2:
| switch with a switch body | Description of the invention |
| 220VAC | 220VAC power switch |
| LCM | 28VDC power switch of tested piece |
| FCU1～FCU3 | FCU power control switch |
| Current calibration | Calibration switch for external ammeter |
| System area switch | Discrete quantity input control switch |
| US#1/#2Current Select | US sensor analog signal selection switch |
| DP Voltage Select | DP sensor analog signal selection switch |
TABLE 2
The indication lamp is shown in table 3:
| indicator light | Description of the invention |
| POWER regional indicator lamp | Power on indication for various types of power sources |
| 28V Power | Power indication for various sensors |
| 28V Power OUTPUT | Toilet load output indication |
TABLE 3
The test method of the test bench disclosed in the above embodiment is as follows:
s1) preparation before testing
S11): throw the front panel 220VAC switch down. The shop 220VAC power is connected to the test station through a 220VAC power cable.
S12): the front panel 220VAC power switch is thrown up, and the switch is thrown down after the pilot lamp and the gauge head are confirmed to be lighted.
S13): the tested piece is connected to the test bench through the test cable.
S2) testing
The front panel 220VAC power switch was thrown up and then tested according to the test procedures on the CMM manual.
S3) test completion
S31): the front panel 220VAC power switch is thrown off.
S32): all the connecting wires are disconnected, and the equipment is stored according to the regulations.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiments according to the technical spirit of the present invention are included in the scope of the present invention.
Claims (9)
1. The logic control assembly test bench comprises a test panel and a circuit module; the method is characterized in that: the circuit module comprises a power circuit module, a discrete magnitude input module, a discrete magnitude output module, a sensor signal simulation circuit module, a load simulation circuit module and a communication module; the power supply circuit is externally connected with a 220VAC power supply through an XS1 interface; the discrete magnitude input module, the discrete magnitude output module, the sensor signal simulation circuit module, the load simulation circuit module and the communication module are respectively and electrically connected with the power circuit module; the discrete magnitude input module, the discrete magnitude output module and the communication module are electrically connected with the test panel through XS2 interfaces; the sensor signal simulation circuit module and the load simulation circuit module are electrically connected with the test panel.
2. The logic control assembly test bench of claim 1, wherein: the sensor signal analog circuit module comprises an US sensor analog circuit and a DP sensor analog circuit; the US sensor analog circuit comprises a first US sensor analog circuit and a second US sensor analog circuit; the first US sensor simulation circuit is electrically connected with the power circuit module through an XS3 interface and is electrically connected with the test panel through an XS3 interface and an XS2 interface; the second US sensor simulation circuit is electrically connected to the power circuit module through an XS2 interface, and is electrically connected to the test panel through an XS4 interface and an XS2 interface.
3. The logic control assembly test bench of claim 2, wherein: the first US sensor analog circuit comprises a voltage sensor, a first six-pin band switch, a second six-pin band switch and a five-path voltage input circuit; the five voltage input circuits are mutually connected in parallel and are electrically connected with the power circuit module through a sliding resistor RP1 after being connected in parallel; 5 contact pins of the first six-pin band switch respectively correspond to the five voltage input circuits, and the other contact pin is grounded; the first hexagonal waveband switch is connected to the input end of the voltage sensor; the output end of the voltage sensor is connected with a second six-pin band switch, and the other end of the second six-pin band switch is connected with the test panel; the five voltage input circuits all adjust input voltage through resistors, and input currents of the five voltage input circuits are respectively as follows: 0mA, 4mA, 8mA, 16mA and 20 mA; the second US sensor analog circuit is identical in structure to the first US sensor analog circuit.
4. The logic control assembly test bench of claim 3 wherein: the DP sensor analog circuit comprises a first four-pin band switch, a second four-pin band switch, a resistor R19, a resistor R20 and a resistor R21; the first four-pin wave band switch and the second four-pin wave band switch are respectively connected with the test panel through XS 2; the input end of the resistor R19 is electrically connected with the power supply voltage circuit, the other end of the resistor R19 is sequentially connected with the resistor R20 and the resistor R21 in series, and the resistor R21 is grounded; one contact pin of the first four-pin band switch is grounded, the other three contact pins are sequentially connected with the output end of the resistor R19, the output end of the resistor R20 and the output end of the resistor R21, and the voltages input by the three contact pins are 5.5V, 0.5V and 0V respectively; one contact pin of the second four-pin band switch is grounded, and the other three contact pins are connected to the output end of the resistor R21.
5. The logic control assembly test bench of claim 1, wherein: the load simulation circuit module comprises three paths of Toilet load simulation circuits which are connected in parallel, and the Toilet load simulation circuits are respectively externally connected with loads; each Toilet load analog circuit comprises a first resistor, a second resistor and a light-emitting diode; the current is loaded into two ends of the first resistor, the positive end of the first resistor is connected with the test panel through an XS2 interface, and the negative end of the first resistor is externally connected with a load; one end of the second resistor is connected with the test panel through an XS2 interface, and the other end of the second resistor is connected with the light emitting diode and then grounded.
6. The logic control assembly test bench of claim 1, wherein: the discrete quantity input module comprises 8 paths of discrete quantity input control switches.
7. The logic control assembly test bench of claim 1, wherein: the discrete quantity output module comprises 2 paths of discrete quantity output indicating lamps.
8. The logic control assembly test bench of claim 1 ~ 7, wherein the power supply circuit module comprises a G1 power supply chip and a G2 power supply chip respectively externally connected with a 220VAC power supply, an adjustable resistor is connected in parallel with the G1 power supply chip, the G1 power supply chip outputs 20.5 ~ 32.2.2 VDC/5A direct current, the G2 power supply chip outputs 12VDC/1A direct current, a voltmeter is arranged at the output end of the G1 power supply chip, the sensor signal simulation circuit module is connected with 12VDC/1A direct current, and the discrete quantity input module, the discrete quantity output module, the load simulation circuit module and the communication module are connected with 20.5 ~ 32.2.2 VDC/5A direct current.
9. The logic control assembly testing stand of claim 1 ~ 7, wherein the communication module includes ARINC429 communication and CAN communication electrically connected to the testing panel via XS2 interface, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910912404.0A CN110597231A (en) | 2019-09-25 | 2019-09-25 | Logic control assembly test bench |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910912404.0A CN110597231A (en) | 2019-09-25 | 2019-09-25 | Logic control assembly test bench |
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| Publication Number | Publication Date |
|---|---|
| CN110597231A true CN110597231A (en) | 2019-12-20 |
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|---|---|---|---|
| CN201910912404.0A Pending CN110597231A (en) | 2019-09-25 | 2019-09-25 | Logic control assembly test bench |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462743A (en) * | 2020-11-30 | 2021-03-09 | 贵州航天风华实业有限公司 | Intelligent distribution box controller test system |
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| CN112462743A (en) * | 2020-11-30 | 2021-03-09 | 贵州航天风华实业有限公司 | Intelligent distribution box controller test system |
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