CN110594802B - Temperature sensing structure and method for induction cooker - Google Patents

Temperature sensing structure and method for induction cooker Download PDF

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Publication number
CN110594802B
CN110594802B CN201910814258.8A CN201910814258A CN110594802B CN 110594802 B CN110594802 B CN 110594802B CN 201910814258 A CN201910814258 A CN 201910814258A CN 110594802 B CN110594802 B CN 110594802B
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temperature
temperature probe
probe
heat conduction
cover
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CN110594802A (en
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李鸣
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Jiaxing Guxiang Refrigeration Equipment Co ltd
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Jiaxing Guxiang Refrigeration Equipment Co ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/08Foundations or supports plates; Legs or pillars; Casings; Wheels
    • F24C15/086Adjustable legs or pillars
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00Stoves or ranges heated by electric energy
    • F24C7/08Arrangement or mounting of control or safety devices
    • F24C7/082Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/10Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12Cooking devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The invention relates to the technical field of temperature measurement of induction cookers, which comprises the following technical scheme: the induction cooker temperature sensing structure comprises a cover and a base connected with the cover, wherein the cover comprises a cover body and a black crystal plate arranged at the cover body, a high heat conduction metal sheet is adhered and fixed above the center of the black crystal plate through heat conduction glue, and a heat conduction pad is attached below the center of the black crystal plate; the machine base comprises a machine base shell, a circuit board fixed in the machine base shell, a cooling fan arranged on one side of the circuit board and a coil panel fixed in the machine base shell and positioned above the circuit board. The scheme is novel and ingenious in design and high in temperature measurement accuracy.

Description

Temperature sensing structure and method for induction cooker
Technical Field
The invention relates to the technical field of temperature measurement of induction cookers, in particular to an induction cooker temperature sensing structure and method.
Background
At present, on some commercial heating devices, since the sold goods must meet food sanitation regulations and the service life of the goods is prolonged as much as possible, accurate temperature control becomes a necessary condition, while temperature detection of the traditional electromagnetic heating device is placed at the bottom of the black crystal plate, and the accuracy is insufficient due to uneven bottom of the crystal plate and air flow flowing in the machine.
The traditional induction cooker is very rough in temperature detection, soft rubber heat or soft foaming materials are upwards contacted with the bottom of the black crystal plate against the temperature sensor, so that the contact condition of the cooker and the black crystal plate cannot be controlled, the contact between the uneven bottom of the black crystal plate and the temperature sensor cannot be well ensured, and a fan in the machine shell influences the temperature sensing of the temperature sensor; because the temperature control is not required for the ordinary household, when people eat the pot in a hot pot shop, the fire power is always not adjusted to the proper position;
to solve this problem, there are commercial devices to improve the phenomenon, but other adverse phenomena, such as inaccurate temperature measurement caused by the temperature measurement unit being placed at the corner, or the temperature measurement unit passing through the black crystal plate, although accurate temperature information can be obtained, the strength is insufficient due to the perforation in the middle of the black crystal plate, and the damage is very easy to occur.
Referring to fig. 9, fig. 9 is a design one of a temperature probe in the prior art, the probe protrudes out of a black crystal plate, so that temperature information can be accurately obtained, but the probe can move up and down, which means that a gap is formed between the probe and the black crystal plate, water can infiltrate in, and although the structure is provided with a water guiding design, oil dirt can be blocked in the gap, so that the movable probe is blocked.
Referring to fig. 10, fig. 10 shows a second design of a temperature probe in the prior art, the probe is combined with an elastic body, the elastic body is combined with a black crystal plate again, the probe can move up and down, the whole structure cannot leak water, but the elastic body is kept elastic, the thickness of the elastic body cannot be too large, the thickness of the elastic body is the kitchen ware, daily cleaning is not necessary, and the possibility of breakage of the elastic body in daily cleaning is large.
In addition, in the designs of fig. 9 and 10, the black crystal plate is hollowed, and the black crystal plate is broken under the condition that the periphery of the hole is not sufficiently supported.
Referring to fig. 11, the most common design in the market is that the temperature probe is directly placed under the black crystal plate, so that the temperature probe has no good contact and is interfered by the fan in the machine.
Therefore, there is a need for an improvement in such a structure to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide an induction cooker temperature sensing structure.
The technical aim of the invention is realized by the following technical scheme:
the induction cooker temperature sensing structure comprises a cover and a base connected with the cover, and is characterized in that the cover comprises a cover body and a black crystal plate arranged at the cover body, wherein a high heat conduction metal sheet is adhered and fixed above the center of the black crystal plate through heat conduction glue, and a heat conduction pad is attached below the center of the black crystal plate;
the machine base comprises a machine base shell, a circuit board fixed in the machine base shell, a cooling fan arranged on one side of the circuit board and a coil panel fixed in the machine base shell and positioned above the circuit board, a first cavity is arranged below the center of the coil panel, a temperature probe and a compression spring II are arranged in the first cavity, a probe cover plate is fixed on the lower surface of the coil panel and covers the first cavity, the temperature probe extends to the upper side of the coil panel, a rubber heat preservation tube is fixed above the center of the coil panel and positioned on the outer side of the temperature probe, and a second cavity is formed between the rubber heat preservation tube and the temperature probe.
The invention is further provided with: the temperature probe is a hollow cylinder with an opening at the bottom, the temperature sensor is arranged at the top end of the inner part of the temperature probe in a sealing way through epoxy resin, and a disc protrudes out of the temperature probe; the second compression spring is respectively contacted with the disc and the probe cover plate.
The invention is further provided with: the inside still protrusion of frame casing has a plurality of connecting seats, the outside cover of upper end of connecting seat is equipped with compression spring one, the coil panel pass through the bolt-up in the upper end of connecting seat, compression spring one respectively with coil panel and connecting seat contact.
The invention is further provided with: the center of the probe cover plate is provided with a second through hole, and the second through hole is matched with the first through hole; the lower part of the second compression spring is propped against the probe cover plate, the upper part of the second compression spring is supported below the disc of the temperature probe, the temperature probe is propped upwards, the upper part of the temperature probe extends out of the upper part of the first through hole of the coil disc, and a rubber heat preservation pipe is arranged outside the first through hole.
The invention is further provided with: the high heat conduction metal sheet and the heat conduction pad are respectively positioned at the same positions of the upper surface and the lower surface of the black crystal plate.
The invention is further provided with: the high heat conduction metal sheet, the black crystal plate, the heat conduction pad, the temperature probe and the temperature sensor are positioned on the same straight line, and when the machine cover is connected with the machine base, the temperature probe is pressed upwards to the lower part of the heat conduction pad.
The invention is further provided with: the circuit board is electrically connected with the cooling fan, the temperature sensor and the coil panel, and is also connected with a plug through a power line, and the plug is positioned on the outer side of the base.
An induction cooker temperature sensing method comprises the following steps:
1) When the cover is combined with the base from top to bottom, the flexible heat conducting pad is pressed on the top plane of the temperature probe to tightly combine the temperature probe with the heat conducting pad, the temperature probe is pressed to sink, the compression spring II is fed downwards to suspend the lower semi-cylinder of the temperature probe in the first cavity;
2) The rubber heat-insulating pipe outside the upper semi-cylinder of the temperature probe is deformed due to the compression of the black crystal plate, so that a space between the black crystal plate and the coil panel outside the upper semi-cylinder of the temperature probe is completely isolated, and a second cavity is formed;
3) After the cover and the base are combined, the first cavity and the second cavity are communicated through the first through hole of the coil panel and penetrate through to form a space which is not interfered by external air, and the temperature probe is not influenced by the external air in the space;
4) Finally, when the temperature of the pot is detected, the temperature transmission mode is pot, high heat conduction metal sheet, heat conduction glue, black crystal plate, heat conduction pad, temperature probe and temperature sensor, so that temperature signals are acquired, and the acquired information is fed back to a display screen by a circuit board for display.
In summary, the invention has the following beneficial effects:
1) The bottom of the general cooker is difficult to keep completely flat without thickening, the thickened bottom is not only increased in weight and unfavorable in use, but also increased in cost and is not welcome by families, the uneven bottom of the cooker cannot be ensured to be contacted with a temperature sensor below the contact position of the black crystal plate, a high heat conduction metal sheet is adhered and fixed above the center of the black crystal plate and is highly protruded above the black crystal plate, so that the cooker is placed on an electromagnetic oven, and the first part contacted with the bottom of the cooker is the heat conduction metal sheet, thereby facilitating acquisition of temperature information of the bottom of the cooker;
2) The heat conducting metal sheet is made of soft materials, and the materials in the embodiment are red copper, so that the weight brought by the cooker can be dispersed;
3) The black crystal plate is a high heat conduction material, one surface of the black crystal plate is flat, the black crystal plate is used as a surface material, the other surface of the black crystal plate is not flat, embossing marks are arranged on the other surface of the black crystal plate, and the temperature sensor is in direct contact, so that even if heat conduction silicone grease is arranged, the temperature information is not easy to be completely transmitted; according to the scheme, the flexible heat-conducting rubber pad with high heat conductivity is attached to the bottom surface of the black crystal plate, when the temperature probe is pressed upwards, the gap of the black crystal plate is filled with the flexible rubber pad, so that the heat-conducting metal sheet receives the temperature of the pot bottom, and the temperature sensor is achieved through the black crystal plate, the flexible heat-conducting rubber pad and the temperature probe, and the temperature information is transmitted to the circuit board to the greatest extent;
4) Because of the necessary heat dissipation requirement of the circuit board, the fan in the case can continuously or intermittently run, and the case is filled with non-directional air flow, so that the temperature information received by the temperature sensor has high reliability; the temperature probe is suspended in a cavity formed by the coil panel and the probe cover plate by a spring, and a tubular flexible heat insulation material (namely a rubber heat insulation pipe) surrounds the outside of the temperature probe between the coil panel and the black crystal plate, so that the temperature probe is not influenced by flowing air flow in the shell, and temperature information transmitted by the cooker is accurately transmitted to the circuit board.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic structural view of a cover for showing a metal sheet with high heat conductivity.
Fig. 3 is a schematic diagram of a second structure of the cover for representing the thermal pad.
Fig. 4 is a schematic structural view of the stand.
Fig. 5 is a schematic diagram of a second structure of the stand.
Fig. 6 is a schematic diagram of a third structure of the stand.
Fig. 7 is a schematic installation view of the present invention.
Fig. 8 is an enlarged view of the a face.
Fig. 9 is a design configuration one of a prior art temperature probe.
Fig. 10 is a design structure II of a prior art temperature probe.
Fig. 11 is a temperature sensing structure of an induction cooker according to a conventional art.
Corresponding part names are indicated by numerals and letters in the drawings:
wherein: 10-a cover; 20-a stand; 30-a power line; 101-a cover body of the machine cover; 102-black crystal plate; 103-high heat conduction metal sheets; 104-a thermal pad; 210-a housing of the machine base; 202-a circuit board; 203-a heat dissipation fan; 204-coil disc; 205-a first cavity; 206-a temperature probe; 207-compressing the second spring; 208-probe cover plate; 209-a second cavity; 210-a rubber heat-insulating pipe; 211-connecting seats; 212-compress spring one.
Detailed Description
In order that the manner in which the above-recited features, advantages, objects and advantages of the invention are obtained, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
Referring to fig. 1 to 8, the temperature sensing structure of an induction cooker provided by the invention comprises a cover 10 and a base 20 connected with the cover 10, wherein the cover 10 comprises a cover body 101 and a black crystal plate 102 arranged at the cover body 101, a high heat conduction metal sheet 103 is adhered and fixed above the center of the black crystal plate 102 through heat conduction glue, and a heat conduction pad 104 is attached below the center of the black crystal plate 102;
the stand 20 comprises a stand housing 201, a circuit board 202 fixed in the stand housing 201, a cooling fan 203 arranged on one side of the circuit board 202, and a coil panel 204 fixed in the stand housing 201 and positioned above the circuit board 202, a first cavity 205 is arranged below the center of the coil panel 204, a temperature probe 206 and a second compression spring 207 are arranged in the first cavity 205, a probe cover plate 208 is fixed on the lower surface of the coil panel 204 and covers the first cavity 205, the temperature probe 206 extends to the upper side of the coil panel 204, a rubber heat preservation pipe 210 is fixed above the center of the coil panel 204, the rubber heat preservation pipe 210 is positioned outside the temperature probe 206, and a second cavity 209 is formed between the rubber heat preservation pipe 210 and the temperature probe 206.
By adopting the technical scheme: the high heat conduction metal sheet 103 is made of red copper, and is in direct contact with the bottom of the pan to perform heat transfer, so that the high heat conduction metal sheet 103 is softer and can play a role in good dispersion, and the high heat conduction metal sheet 103 is higher than the black crystal plate 102; the thermal pad 104 attached to the center of the black crystal plate 102 is a thermal conductive flexible body, the thermal pad 104 is a thermal conductive rubber pad, and the thermal pad 104 has certain elasticity, good thermal conductivity and good insulation, and the thermal pad 104 is tightly contacted with the rubber thermal insulation pipe 210 to form a sealed second cavity 209, so that accurate measurement of the temperature sensor is facilitated; the temperature probe 206 is elastically disposed inside the first cavity 205, and the elastic force of the second compression spring 207 can press the temperature probe 206 to make the temperature probe 206 closely contact with the heat conducting pad 104, and at the same time, the contact between the rubber heat insulating tube 210 and the heat conducting pad 104 fills up the gap of the black crystal board 102, thereby improving the temperature detection accuracy.
Referring to fig. 5 to 8, the temperature probe 206 is a hollow cylinder with an opening at the bottom, the temperature sensor is sealed and disposed at the top end of the inside of the temperature probe 206 by epoxy resin, and a disk protrudes from the outside of the temperature probe 206; the disc is located in the first cavity 205, and the second compression spring 207 is in contact with the disc and the probe cover plate 208, respectively.
By adopting the technical scheme: the temperature sensor is located inside the temperature probe 206, and after the cover and the base are installed, the temperature sensor is in direct contact with the heat conducting pad 104, so as to facilitate temperature detection; a disc is protruded from the middle part of the outer part of the temperature probe 206, and the disc moves up and down in the first cavity 205 in a limiting way, so that the temperature probe 206 and a temperature sensor can be contacted with the heat conducting pad 104; the second compression spring 207 is respectively contacted with the disc and the probe cover plate 208, and the upper and lower sides of the second compression spring 207 are acted by elastic force.
As shown in fig. 4 and fig. 5, the housing 201 further includes a plurality of connection seats 211 protruding from the inside, a first compression spring 212 is sleeved on the outer portion of the upper end of the connection seat 211, the coil panel 204 is fastened to the upper end of the connection seat 211 through bolts, and the first compression spring 212 is respectively in contact with the coil panel 204 and the connection seat 211.
By adopting the technical scheme: the connection seat 211 is convenient for installing the coil panel 204, and in the invention, the coil panel 204 is not fixedly installed due to the arrangement of the first compression spring 212, and can move up and down along with the internal environment and the elastic force of the first compression spring 212, so that gaps among the coil panel 204, the rubber heat insulation pipe 210 and the heat conduction pad 104 are more ensured not to occur, and the temperature detection accuracy is improved.
Referring to fig. 4-8, a conical table surface with a downward opening is provided below the center of the coil disc 204, a first through hole is provided in the center of the conical table surface, the probe cover plate 208 is locked and fixed below the conical table surface so as to seal the conical table surface to form the first cavity 205, and a second through hole is provided in the center of the probe cover plate 208, and is adapted to the first through hole; the lower part of the second compression spring 207 is abutted against the probe cover plate 208, the upper part of the second compression spring 207 is supported below the disc of the temperature probe 206, the temperature probe 206 is propped upwards, the upper part of the temperature probe 206 extends out of the upper part of the first through hole of the coil disc 204, and a rubber heat insulation pipe 210 is arranged outside the first through hole; it should be noted that the second through hole at the probe cover 208 is adapted to the outer wall of the temperature probe 206, the bottom of the temperature probe 206 is further provided with a third through hole for a wire to be led out, the temperature sensor is connected to the circuit board 202 through the wire, and at the same time, the contact end surface of the third through hole and the wire is sealed by epoxy resin, so as to ensure the tightness thereof.
By adopting the technical scheme: the center of coil panel 204 has first through-hole, the top of first through-hole is provided with the spacing ring, the spacing ring is annular structure, rubber insulating tube 210 is fixed in this spacing ring and with the inner wall looks butt of spacing ring, the below of first through-hole has the circular cone mesa, and this circular cone mesa is inside cavity, thereby probe apron 208 closure is fixed in the lower extreme of circular cone mesa and is formed first cavity 205, improves the leakproofness of first cavity 205.
As shown in fig. 2-8, the high heat conductive metal sheet 103 and the heat conductive pad 104 are respectively located at the same position on the upper and lower surfaces of the black crystal board 102; the high heat conductive metal sheet 103, the black crystal plate 102, the heat conductive pad 104, the temperature probe 206 and the temperature sensor are positioned on the same straight line, and when the cover 10 is connected with the base 20, the temperature probe 206 is pressed upwards to the lower part of the heat conductive pad 104.
By adopting the technical scheme: all the parts are on the same straight line, and the temperature transmission direction of the parts is cookware, high heat conduction metal sheets, heat conduction glue, black crystal plates, heat conduction pads, temperature probes and temperature sensors, so that temperature signals can be conveniently collected.
The circuit board 202 is electrically connected with the cooling fan 203, the temperature sensor and the coil panel 204, and the circuit board 202 is further connected with a plug through the power cord 30, and the plug is located at the outer side of the stand 20.
An induction cooker temperature sensing method comprises the following steps:
1) When the cover 10 is combined with the base 20 from top to bottom, the flexible heat conducting pad 104 is pressed on the top plane of the temperature probe 206, so that the temperature probe 206 is tightly combined with the heat conducting pad 104, the temperature probe 206 is pressed to sink, the compression spring II 207 is fed downwards, and the lower semi-cylinder of the temperature probe 206 is suspended in the first cavity 205;
2, the rubber insulating tube 210 outside the upper half cylinder of the temperature probe 206 is also deformed due to the compression of the black crystal plate 102, so that the space between the black crystal plate 102 and the coil panel 204 outside the upper half cylinder of the temperature probe 206 is completely isolated, and a second cavity 209 is formed;
3, after the cover 10 and the base 20 are combined, the first cavity 205 and the second cavity 209 are communicated through the first through hole of the coil disc 204 and penetrate into a space which is not interfered by external air, and the temperature probe 206 is not affected by the external air in the space;
4) Finally, when the temperature of the pot is detected, the temperature transmission mode is pot, high heat conduction metal sheet, heat conduction glue, black crystal plate, heat conduction pad, temperature probe and temperature sensor, so that temperature signals are acquired, and the acquired information is fed back to a display screen by a circuit board for display.
According to the temperature sensing method of the induction cooker, when the temperature is detected, the heat conduction pad 104, the second cavity 209, the first through hole, the first cavity 205 and the probe cover plate 208 form a closed cavity which is not interfered by external air, so that the temperature sensor can detect the temperature without being interfered, the temperature detection accuracy is improved, and the temperature can be reflected to a display screen in real time, thereby being convenient for people to intuitively know the current temperature, and being convenient for people to control the induction cooker to achieve the automatic wanted temperature.
It is noted that the invention also comprises an operation panel, one side of the operation panel is provided with a display screen, and the operation panel and the display screen are connected with the circuit board; in addition, the temperature sensing structure of the induction cooker comprises a circuit board, a temperature sensor, a black crystal board, a power line, an operation panel and a display screen which are all in the prior art, and can be selected by a person skilled in the art according to actual requirements; meanwhile, the electromagnetic oven also comprises a rectifier bridge stack, a filter capacitor, a resonance capacitor, an inductance coil, a thermistor, a power tube, an IC control chip and the like which are all of the prior art.
More particularly, the present invention provides a temperature sensing structure of an induction cooker, which mainly provides a structural design scheme for improving the accuracy of temperature measurement, and the components included in the induction cooker are not protected by the present invention.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (5)

1. The induction cooker temperature sensing structure comprises a cover (10) and a base (20) connected with the cover (10), and is characterized in that the cover (10) comprises a cover body (101) and a black crystal plate (102) arranged at the cover body (101), a high heat conduction metal sheet (103) is fixed above the center of the black crystal plate (102) through heat conduction glue in an adhesion mode, and a heat conduction pad (104) is attached below the center of the black crystal plate (102);
the base (20) comprises a base shell (201), a circuit board (202) fixed in the base shell (201), a heat radiation fan (203) arranged on one side of the circuit board (202) and a coil disc (204) fixed in the base shell (201) and positioned above the circuit board (202), a first cavity (205) is arranged below the center of the coil disc (204), a temperature probe (206) and a compression spring II (207) are arranged in the first cavity (205), a probe cover plate (208) is fixed on the lower surface of the coil disc (204) and covers the first cavity (205), the temperature probe (206) extends to the upper side of the coil disc (204), a rubber heat preservation tube (210) is fixed above the center of the coil disc (204), the rubber heat preservation tube (210) is positioned outside the temperature probe (206), and a second cavity (209) is formed between the rubber heat preservation tube (210) and the temperature probe (206);
the temperature probe (206) is a hollow cylinder with an opening at the bottom, the temperature sensor is arranged at the top end of the inside of the temperature probe (206) in a sealing way through epoxy resin, and a disc protrudes out of the temperature probe (206); the second compression spring (207) is respectively contacted with the disc and the probe cover plate (208);
a plurality of connecting seats (211) are further protruded inside the base shell (201), a first compression spring (212) is sleeved outside the upper end of the connecting seats (211), the coil panel (204) is fastened to the upper end of the connecting seats (211) through bolts, and the first compression spring (212) is respectively contacted with the coil panel (204) and the connecting seats (211);
a conical table top with a downward opening is arranged below the center of the coil panel (204), a first through hole is formed in the center of the conical table top, the probe cover plate (208) is locked and fixed below the conical table top so as to seal the conical table top to form the first cavity (205), a second through hole is formed in the center of the probe cover plate (208), and the second through hole is matched with the first through hole; the lower part of the second compression spring (207) is propped against the probe cover plate (208), the upper part of the second compression spring (207) is supported below the disc of the temperature probe (206), the temperature probe (206) is propped upwards, the upper part of the temperature probe (206) extends out of the upper part of a first through hole of the coil disc (204), and a rubber heat insulation pipe (210) is arranged outside the first through hole.
2. An induction cooker temperature sensing structure as defined in claim 1, wherein: the high heat conduction metal sheet (103) and the heat conduction pad (104) are respectively positioned at the same positions of the upper surface and the lower surface of the black crystal plate (102).
3. An induction cooker temperature sensing structure as defined in claim 1, wherein: the high heat conduction metal sheet (103), the black crystal plate (102), the heat conduction pad (104), the temperature probe (206) and the temperature sensor are positioned on the same straight line, and when the cover (10) is connected with the base (20), the temperature probe (206) is pressed upwards to the lower part of the heat conduction pad (104).
4. An induction cooker temperature sensing structure as defined in claim 1, wherein: the circuit board (202) is electrically connected with the cooling fan (203), the temperature sensor and the coil panel (204), the circuit board (202) is also connected with a plug through a power line (30), and the plug is positioned on the outer side of the base (20).
5. The method for sensing the temperature of an induction cooker temperature sensing structure according to any one of claims 1 to 4, comprising the steps of:
1) When the cover (10) is combined with the base (20) from top to bottom, the flexible heat conducting pad (104) is pressed on the top plane of the temperature probe (206) to enable the temperature probe (206) to be tightly combined with the heat conducting pad (104), the temperature probe (206) is pressed to sink, the compression spring II (207) is downwards fed to shrink, and the lower semi-cylinder of the temperature probe (206) is suspended in the first cavity (205);
2) The rubber heat preservation pipe (210) outside the upper semi-cylinder of the temperature probe (206) is deformed due to the compression of the black crystal plate (102), so that a space outside the upper semi-cylinder of the temperature probe (206) is completely isolated between the black crystal plate (102) and the coil panel (204), and a second cavity (209) is formed;
3) After the cover (10) and the base (20) are combined, the first cavity (205) and the second cavity (209) are communicated through a first through hole of the coil panel (204) and penetrate into a space which is not interfered by external air, and the temperature probe (206) is not affected by the external air in the space;
4) Finally, when the temperature of the pot is detected, the temperature transmission mode is pot, high heat conduction metal sheet, heat conduction glue, black crystal plate, heat conduction pad, temperature probe and temperature sensor, so that temperature signals are acquired, and the acquired information is fed back to a display screen by a circuit board for display.
CN201910814258.8A 2019-08-30 2019-08-30 Temperature sensing structure and method for induction cooker Active CN110594802B (en)

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CN110594802B true CN110594802B (en) 2024-01-02

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