CN110587140A - Method for processing facial mask base material by using laser - Google Patents
Method for processing facial mask base material by using laser Download PDFInfo
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- CN110587140A CN110587140A CN201910890476.XA CN201910890476A CN110587140A CN 110587140 A CN110587140 A CN 110587140A CN 201910890476 A CN201910890476 A CN 201910890476A CN 110587140 A CN110587140 A CN 110587140A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
Abstract
The invention discloses a method for processing a mask base material by using laser, and relates to the technical field of laser processing. The method comprises the following steps: processing a micro spacing structure on the mask base material by using laser, wherein the adjacent interval of the micro spacing structure is 20-100 mu m; wherein the size of a focusing light spot of the laser is controlled to be 5-30 mu M, the parameters of a laser wave band are 400-800 nm, the roundness requirement of the light spot is more than 85%, the adjustable repetition frequency of the laser is 80-1000 kHz, and the beam quality M is2Less than 1.3. The method utilizes a laser technology, selects proper laser parameters, processes the facial mask base material, and processes a micro spacing structure on the surface of the facial mask base material, thereby not only meeting the threshold value of the action on the material, but also not changing the function of the material and damaging the original structure of the facial mask base material; according to the invention, by using the method of processing the mask base material by using the laser, the obtained mask base material selectively permeates or adsorbs different molecules, so that the effect of the essence can be fully exerted, and the selection range of the base material can be widened.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a method for processing a mask base material by using laser.
Background
With the improvement of the living standard, people pay more attention to the physical health and the maintenance of the appearance. In our daily skin care products, besides well-known moisturizing water, essence and the like, there are also patch type facial masks which are increasingly widely used nowadays. According to different functional liquid components added in the facial mask, different skin care effects can be realized, and the effects of moisturizing, whitening, cleaning, aging resistance and the like are common. According to different mask materials, the surface mount type mask base materials in the market at present are divided into natural fiber non-woven fabrics and synthetic fiber non-woven fabrics, and can be further divided into fruit and vegetable fiber masks, pure cotton fabric masks, crystal type surface films, invisible silk masks and the like. However, different facial masks have advantages and disadvantages due to substrate limitations. For example, the non-woven fabric mask base material is fluffy and soft, has good uniformity of a cotton net, does not generate fiber scraps, is tough and durable, but is thick and not skin-friendly, has poor affinity with the skin, can cause non-fitting, has general air permeability and influences the whole using effect.
The invention utilizes the technology of laser processing the facial mask base material to carry out laser processing on the facial mask base material, so that the preparation of the facial mask is not limited by the selection of the facial mask base material. The surface treatment is carried out on the facial mask base material through the laser, so that the facial mask base material can selectively permeate or adsorb different molecules, the effect of essence can be fully exerted, the selection range of the base material can be widened, and the research and development of the facial mask industry can be further broken through.
Disclosure of Invention
In order to overcome the problems in the prior art, the invention provides a method for processing a facial mask base material by using laser, which utilizes the laser technology to process the facial mask base material so that the facial mask base material selectively permeates or adsorbs different molecules, thus not only allowing a human body to fully absorb essence, but also widening the selection range of the facial mask base material.
According to the invention, the method for processing the mask substrate by using the laser comprises the following steps:
processing a micro spacing structure on the mask base material by using laser, wherein the adjacent interval of the micro spacing structure is 20-100 mu m;
wherein the size of a focusing light spot of the laser is controlled to be 5-30 mu M, the parameters of a laser wave band are 400-800 nm, the roundness of the light spot is required to be more than 85%, the adjustable repetition frequency of the laser is 80-1000 kHz, and the beam quality M is2Less than 1.3.
Preferably, the mask base material comprises a synthetic fiber non-woven fabric and a natural fiber non-woven fabric.
Preferably, when the mask base material is a synthetic fiber non-woven fabric, the pulse width of laser is less than 2ps, the laser wave band parameter is 515-532 nm, and the laser focusing spot size is 10 μm.
Preferably, when the mask base material is a synthetic fiber non-woven fabric, the micro spacing structure comprises micro pores, and the diameter of the micro pores is 15-35 μm.
Preferably, when the mask base material is a synthetic fiber nonwoven fabric, the laser processing of the micro spacer structure on the mask base material further includes:
in the light path, 1/4 wave plate is adopted to make the light beam become circular polarization and act on each part of the mask base material.
Preferably, the natural fiber non-woven fabric is one of fruit and vegetable fiber non-woven fabrics and pure cotton fiber non-woven fabrics, the pulse width of laser is 800 fs-10 ns, the parameter of the laser wave band is 400-800 nm, and the size of the laser focusing spot is controlled to be 5-30 μm.
Preferably, when the mask base material is a natural fiber non-woven fabric, the micro spacing structure comprises one or more of a grid with a certain depth, a concentric circle, a spiral structure or a pit, and the grid width is 5-30 μm.
Preferably, when the mask base material is a natural fiber non-woven fabric, the depth of the micro-spacer structure is not more than 50% of the thickness of the mask base material.
The method utilizes a laser technology, selects proper laser parameters, processes the facial mask base material, and processes a micro spacing structure on the surface of the facial mask base material, thereby not only meeting the threshold value of the action on the material, but also not changing the function of the material and damaging the original structure of the facial mask base material (such as melting and other phenomena); according to the invention, by using the method of processing the mask base material by using the laser, the obtained mask base material selectively permeates or adsorbs different molecules, so that the effect of the essence can be fully exerted, and the selection range of the base material can be widened.
Through on the facial mask substrate at synthetic fiber non-woven fabrics with laser beam machining play miniature pore structure, modify its surface, can make more gas molecules pass through the facial mask substrate, because miniature pore edge is clear clean simultaneously, more do benefit to passing through of gas molecule like this, pin nutrient composition when improving the air permeability. The surface area of the base material is increased by processing the structures such as grid lines on the mask base material of the natural fiber non-woven fabric by laser, so that the adsorption of essence on the surface of the base material is improved, and the nutrient components are locked.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific examples, which are given as preferred embodiments of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Example 1:
when the mask base material is a synthetic fiber non-woven fabric, the mask base material is a surface mount type mask base material, and the mask base material is manufactured by directly utilizing high polymer slices, short fibers or long fibers to carry out directional or random arrangement to form a fiber web structure and then reinforcing the fiber web structure by adopting methods such as mechanical, thermal bonding or chemical methods. The non-woven fabric mostly adopts polypropylene particles as raw materials, the non-woven fabric belongs to a heat-sensitive material, a selected laser light source can meet the threshold value of the material action and cannot greatly change the function of the material to prevent phenomena such as melting and the like, the ultra-fast laser is adopted to process a mask substrate, the laser pulse width is preset to be 1.9ps, the laser wave band is preset to be 532nm, the size of a focusing light spot is preset to be 10 mu M, the roundness requirement of the light spot is more than 85 percent, the adjustable repetition frequency of the laser is set to be 1000kHz, and the beam quality M is M2Is 1.2.
In the laser path, 1/4 wave plate is adopted to make the light beam become circular polarization, so that the light beam can more uniformly act on each part of the mask base material, and the obtained edge is neat and clean. Meanwhile, because the synthetic fiber non-woven fabric is a polymer material, in the laser processing process, the distance between the laser cutting head or the galvanometer and the surface of the mask base material, namely the workpiece distance, needs to be ensured.
Optionally, if a cutting head is used in the laser processing process, the workpiece distance can be maintained at 0.2mm to 0.5mm, a coaxial blowing mode is adopted, preferably inert gas such as nitrogen, the air pressure of the coaxial blowing is slightly different according to the thickness of the sample and is maintained at 0.1Bar to 3.0Bar, so that the processing edge can be clear and clean, and the purpose of no need of further cleaning treatment is achieved;
alternatively, if a galvanometer is used, the workpiece pitch may be maintained over a larger range, for example 5cm to 50 cm.
Optionally, the facial mask substrate can be fixed through the adsorption platform, and there is the micropore that distributes evenly on the adsorption platform surface, makes the facial mask substrate adsorb on the platform surface through the mode of bleeding to reach the clean purpose in edge.
Processing a micro-pore structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing functional liquid, wherein the processed pore with the diameter of 35 microns can enable gas to pass through the substrate and liquid molecules to not pass through the substrate, so that the air permeability is improved, and simultaneously, the nutrient components of the functional liquid are locked.
Example 2:
the mask base material is a synthetic fiber non-woven fabric, the mask base material is a surface mount type mask base material, and the mask base material is manufactured by directly utilizing high polymer slices, short fibers or filaments to carry out directional or random arrangement to form a fiber web structure and then reinforcing the fiber web structure by adopting methods such as mechanical, thermal bonding or chemical methods. The non-woven fabric mostly adopts polypropylene particles as raw materials, the non-woven fabric belongs to a heat-sensitive material, a selected laser light source can meet the threshold value of the material action and cannot greatly change the function of the material to prevent the phenomena of melting and the like, the ultra-fast laser is adopted to process a mask substrate, the laser pulse width is preset to be 1.5ps, the laser wave band is 515nm, the size of a focusing light spot is preset to be 10 mu m, and the roundness of the light spot needs to beThe laser beam has a repetition frequency of over 85%, an adjustable laser repetition frequency of 80kHz, and a beam mass M2Is 1.2.
In the laser path, 1/4 wave plate is adopted to make the light beam become circular polarization, so that the light beam can more uniformly act on each part of the mask base material, and the obtained edge is neat and clean. Meanwhile, because the synthetic fiber non-woven fabric is a polymer material, in the laser processing process, the distance between the laser cutting head or the galvanometer and the surface of the mask base material, namely the workpiece distance, needs to be ensured.
Optionally, if a cutting head is used in the laser processing process, the workpiece distance can be maintained at 0.2mm to 0.5mm, a coaxial blowing mode is adopted, preferably inert gas such as nitrogen, the air pressure of the coaxial blowing is slightly different according to the thickness of the sample and is maintained at 0.1Bar to 3.0Bar, so that the processing edge can be clear and clean, and the purpose of no need of further cleaning treatment is achieved;
alternatively, if a galvanometer is used, the workpiece pitch may be maintained over a larger range, for example 5cm to 50 cm.
Optionally, the facial mask substrate can be fixed through the adsorption platform, and there is the micropore that distributes evenly on the adsorption platform surface, makes the facial mask substrate adsorb on the platform surface through the mode of bleeding to reach the clean purpose in edge.
Processing a micro-pore structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing functional liquid, wherein the pore with the diameter of 15 microns is processed, and the micro-pore structure with the diameter of 15 microns can enable gas to pass through the substrate and liquid molecules to not pass through the substrate, so that the air permeability is improved, and simultaneously, the nutrient components of the functional liquid are locked.
Example 3:
the mask base material is a synthetic fiber non-woven fabric, the mask base material is a surface mount type mask base material, and the mask base material is manufactured by directly utilizing high polymer slices, short fibers or filaments to carry out directional or random arrangement to form a fiber web structure and then reinforcing the fiber web structure by adopting methods such as mechanical, thermal bonding or chemical methods. The non-woven fabric mostly adopts polypropylene particles as raw materials, and for the non-woven fabric which belongs to a heat sensitive material, the selected laser light source should be bothThe mask substrate can meet the threshold value of material action, the function of the material cannot be greatly changed to prevent phenomena such as melting and the like, the mask substrate is processed by adopting ultrafast laser, the laser pulse width is preset to be 1ps, the laser wave band is 523nm, the size of a focusing light spot is preset to be 10 mu M, the roundness of the light spot is required to be more than 90%, the repetition frequency adjustable by the laser is set to be 500kHz, and the beam quality M is2Is 1.2.
In the laser path, 1/4 wave plate is adopted to make the light beam become circular polarization, so that the light beam can more uniformly act on each part of the mask base material, and the obtained edge is neat and clean. Meanwhile, because the synthetic fiber non-woven fabric is a polymer material, in the laser processing process, the distance between the laser cutting head or the galvanometer and the surface of the mask base material, namely the workpiece distance, needs to be ensured.
Optionally, if a cutting head is used in the laser processing process, the workpiece distance can be maintained at 0.3mm to 0.4mm, a coaxial blowing mode is adopted, preferably inert gas such as nitrogen, the air pressure of the coaxial blowing is slightly different according to the thickness of the sample and is maintained at 0.1Bar to 3.0Bar, so that the processing edge can be clear and clean, and the purpose of no need of further cleaning treatment is achieved;
alternatively, if a galvanometer is used, the workpiece pitch may be maintained over a larger range, for example 5cm to 50 cm.
Optionally, the facial mask substrate can be fixed through the adsorption platform, and there is the micropore that distributes evenly on the adsorption platform surface, makes the facial mask substrate adsorb on the platform surface through the mode of bleeding to reach the clean purpose in edge.
Processing a micro-pore structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing functional liquid, wherein the processed pore with the diameter of 25 micrometers can enable gas to pass through the substrate and liquid molecules to not pass through the substrate, so that the air permeability is improved, and simultaneously, the nutrient components of the functional liquid are locked.
Example 4:
when the mask base material is natural fiber non-woven fabric and the natural fiber non-woven fabric is fruit and vegetable fiber non-woven fabric, the mask base material is a surface-mounted mask base material and the natural fiber non-woven fabric is a natural fiber non-woven fabricIn the cloth-made mask base material, the fruit and vegetable fiber mask base material is a natural fruit and vegetable fiber mask dressing which is prepared by extracting and separating plant fruit fibers by a high-tech means and applying a special pressing process. The natural fiber non-woven fabric is a natural polymer material, the original structure is easy to damage under the high-temperature condition, the selected laser light source can meet the threshold value of the material action, the function of the material cannot be greatly changed, the phenomena of melting and the like are prevented, the ultra-fast laser is adopted to process the mask substrate, the laser pulse width is preset at 800fs, the wave band is controlled at 400nm, the size of a focusing light spot is 5 mu M, the roundness requirement of the light spot is more than 85 percent, the adjustable repetition frequency of the laser can be controlled at 80kHz, and the beam quality M is equal to the beam quality2Is 1.2.
Optionally, in the laser processing process, the movement mode of the laser light spot in the processing process is a filling mode, the filling mode can adopt a zigzag processing mode, the row-by-row processing mode, the head-to-tail processing mode, the left-to-right processing mode and the like, and therefore the processing edge is clear and clean. For example, a focused spot size of 10 μm and a line width of 20 μm, a line-by-line process can be used to achieve high efficiency and high quality processing.
Processing a micro-interval grid line structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing a functional liquid, wherein the micro-interval structure can also be one or more of a concentric circle, a spiral structure or a pit with a certain depth, the line width of the processed grid line structure is 5 mu m, the interval between adjacent grid line structures is 20 mu m, and the depth of the interval structure is not more than 50% of the thickness of the mask substrate so as to maintain the toughness and the strength of the mask substrate. The micro spacing structure can increase the surface area of the mask base material, improve the adsorption of the functional liquid on the surface of the base material and lock the nutrient components.
Example 5:
when the mask base material is a natural fiber non-woven fabric and the natural fiber non-woven fabric is a fruit and vegetable fiber non-woven fabric, the mask base material is a patch type mask base material, the fruit and vegetable fiber mask base material is prepared by extracting and separating plant fruit fibers by adopting a high-tech means and adopting a special pressing processThe natural fruit and vegetable fiber mask dressing. The natural fiber non-woven fabric is a natural polymer material, the original structure is easy to damage under the high-temperature condition, the selected laser light source can meet the threshold value of the material action, the function of the material cannot be greatly changed, the phenomena of melting and the like are prevented, the ultra-fast laser is adopted to process the mask substrate, the laser pulse width is preset at 900fs, the wave band is controlled at 600nm, the size of a focusing light spot is 15 mu M, the roundness requirement of the light spot is more than 90%, the adjustable repetition frequency of the laser can be controlled at 500kHz, and the beam quality M is equal to the beam quality M2Is 1.2.
Optionally, in the laser processing process, the movement mode of the laser light spot in the processing process is a filling mode, the filling mode can adopt a zigzag processing mode, the row-by-row processing mode, the head-to-tail processing mode, the left-to-right processing mode and the like, and therefore the processing edge is clear and clean. For example, the focused spot size is 10 μm, and the line width of the grid line structure is 20 μm, so that the line-by-line processing can be adopted to achieve high-efficiency and high-quality processing.
Processing a micro-interval grid line structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing a functional liquid, wherein the micro-interval structure can also be one or more of a concentric circle, a spiral structure or a pit with a certain depth, the line width of the processed grid line structure is 20 micrometers, the interval between adjacent grid line structures is 50 micrometers, and the depth of the interval structure is not more than 50% of the thickness of the mask substrate so as to maintain the toughness and the strength of the mask substrate. The micro spacing structure can increase the surface area of the mask base material, improve the adsorption of the functional liquid on the surface of the base material and lock the nutrient components.
Example 6:
when the mask base material is a natural fiber non-woven fabric, and the natural fiber non-woven fabric is a fruit and vegetable fiber non-woven fabric, the mask base material is a patch type mask base material, and in the mask base material made of the natural fiber non-woven fabric, the fruit and vegetable fiber mask base material is a natural fruit and vegetable fiber mask dressing which is made by adopting a high-tech means to extract and separate plant fruit fibers and applying a special pressing process. The natural fiber non-woven fabric is a natural polymer material, is easy to damage the original structure under the high temperature condition,the selected laser light source can not only meet the threshold value of the material action, but also can not change the function of the material greatly so as to prevent the phenomena of melting and the like, the ultrafast laser is adopted to process the mask substrate, the laser pulse width is preset at 10ns, the wave band is controlled at 800nm, the size of a focusing spot is controlled at 30 mu M, the roundness of the spot is required to be more than 85 percent, the adjustable repetition frequency of the laser can be controlled at 1000kHz, and the quality M of the light beam is controlled to be more than 85 percent2Is 1.2.
Optionally, in the laser processing process, the movement mode of the laser light spot in the processing process is a filling mode, the filling mode can adopt a zigzag processing mode, the row-by-row processing mode, the head-to-tail processing mode, the left-to-right processing mode and the like, and therefore the processing edge is clear and clean.
Processing a micro-interval grid line structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing a functional liquid, wherein the micro-interval structure can also be one or more of a concentric circle, a spiral structure or a pit with a certain depth, the line width of the processed grid line structure is 30 mu m, the adjacent interval is 100 mu m, and the depth of the interval structure is not more than 50% of the thickness of the mask substrate so as to maintain the toughness and the strength of the mask substrate. The micro spacing structure can increase the surface area of the mask base material, improve the adsorption of the functional liquid on the surface of the base material and lock the nutrient components.
Example 7:
when the mask base material is a natural fiber non-woven fabric, and the natural fiber non-woven fabric is a pure cotton cloth non-woven fabric, the mask base material is a patch-type mask base material, and in the mask base material made of the natural fiber non-woven fabric, the pure cotton cloth mask base material is a mask dressing refined by adopting more than 90% of natural cotton as a raw material. The natural fiber non-woven fabric is a natural polymer material, the original structure is easy to damage under the high-temperature condition, the selected laser light source can meet the threshold value of the material action, the function of the material cannot be greatly changed, the phenomena of melting and the like are prevented, the ultra-fast laser is adopted to process the mask substrate, the laser pulse width is preset at 800fs, the wave band is controlled at 400nm, the size of a focusing light spot is 5 mu m, the roundness requirement of the light spot is more than 85 percent, the adjustable repetition frequency of the laser can be controlled at 80kHz, and the light beam can be controlled at 80kHzMass M2Is 1.2.
Optionally, in the laser processing process, the movement mode of the laser light spot in the processing process is a filling mode, the filling mode can adopt a zigzag processing mode, the row-by-row processing mode, the head-to-tail processing mode, the left-to-right processing mode and the like, and therefore the processing edge is clear and clean. For example, a focused spot size of 10 μm and a line width of 20 μm, a line-by-line process can be used to achieve high efficiency and high quality processing.
Processing a micro-interval grid line structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing a functional liquid, wherein the micro-interval structure can also be one or more of a concentric circle, a spiral structure or a pit with a certain depth, the line width of the processed grid line structure is 5 mu m, the interval between adjacent grid line structures is 20 mu m, and the depth of the interval structure is not more than 50% of the thickness of the mask substrate so as to maintain the toughness and the strength of the mask substrate. The micro spacing structure can increase the surface area of the mask base material, improve the adsorption of the functional liquid on the surface of the base material and lock the nutrient components.
Example 8:
when the mask base material is a natural fiber non-woven fabric, and the natural fiber non-woven fabric is a pure cotton cloth non-woven fabric, the mask base material is a patch-type mask base material, and in the mask base material made of the natural fiber non-woven fabric, the pure cotton cloth mask base material is a mask dressing refined by adopting more than 90% of natural cotton as a raw material. The natural fiber non-woven fabric is a natural polymer material, the original structure is easy to damage under the high-temperature condition, the selected laser light source can meet the threshold value of the material action, the function of the material cannot be greatly changed, the phenomena of melting and the like are prevented, the ultra-fast laser is adopted to process the mask substrate, the laser pulse width is preset at 900fs, the wave band is controlled at 600nm, the size of a focusing light spot is 15 mu M, the roundness requirement of the light spot is more than 90%, the adjustable repetition frequency of the laser can be controlled at 500kHz, and the beam quality M is equal to the beam quality M2Is 1.2.
Optionally, in the laser processing process, the movement mode of the laser light spot in the processing process is a filling mode, the filling mode can adopt a zigzag processing mode, the row-by-row processing mode, the head-to-tail processing mode, the left-to-right processing mode and the like, and therefore the processing edge is clear and clean. For example, the focused spot size is 10 μm, and the line width of the grid line structure is 20 μm, so that the line-by-line processing can be adopted to achieve high-efficiency and high-quality processing.
Processing a micro-interval grid line structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing a functional liquid, wherein the micro-interval structure can also be one or more of a concentric circle, a spiral structure or a pit with a certain depth, the line width of the processed grid line structure is 20 micrometers, the interval between adjacent grid line structures is 50 micrometers, and the depth of the interval structure is not more than 50% of the thickness of the mask substrate so as to maintain the toughness and the strength of the mask substrate. The micro spacing structure can increase the surface area of the mask base material, improve the adsorption of the functional liquid on the surface of the base material and lock the nutrient components.
Example 9:
when the mask base material is a natural fiber non-woven fabric, and the natural fiber non-woven fabric is a pure cotton cloth non-woven fabric, the mask base material is a patch-type mask base material, and in the mask base material made of the natural fiber non-woven fabric, the pure cotton cloth mask base material is a mask dressing refined by adopting more than 90% of natural cotton as a raw material. The natural fiber non-woven fabric is a natural polymer material, the original structure is easy to damage under the high-temperature condition, the selected laser light source can meet the threshold value of the material action and cannot change the function of the material too much to prevent the phenomena of melting and the like, the ultra-fast laser is adopted to process the mask substrate, the laser pulse width is preset to 10ns, the wave band is controlled to be 800nm, the size of a focusing light spot is controlled to be 30 mu M, the roundness requirement of the light spot is more than 85 percent, the adjustable repetition frequency of the laser can be controlled to be 1000kHz, and the beam quality M is equal to that of the laser beam2Is 1.2.
Optionally, in the laser processing process, the movement mode of the laser light spot in the processing process is a filling mode, the filling mode can adopt a zigzag processing mode, the row-by-row processing mode, the head-to-tail processing mode, the left-to-right processing mode and the like, and therefore the processing edge is clear and clean.
Processing a micro-interval grid line structure on the surface of the mask substrate to obtain the mask substrate, and then soaking the mask substrate into a solution containing a functional liquid, wherein the micro-interval structure can also be one or more of a concentric circle, a spiral structure or a pit with a certain depth, the line width of the processed grid line structure is 30 mu m, the adjacent interval is 100 mu m, and the depth of the interval structure is not more than 50% of the thickness of the mask substrate so as to maintain the toughness and the strength of the mask substrate. The micro spacing structure can increase the surface area of the mask base material, improve the adsorption of the functional liquid on the surface of the base material and lock the nutrient components.
The preferred embodiments of the present invention have been described in detail with reference to the above examples, but the present invention is not limited to the details of the above examples, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are included in the scope of the present invention.
Furthermore, the various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention. The invention is not described separately for all possible combinations in order to avoid unnecessary repetition.
Claims (8)
1. A method of processing a mask substrate using a laser, the method comprising the steps of:
processing a micro spacing structure on the mask base material by using laser, wherein the adjacent interval of the micro spacing structure is 20-100 mu m;
wherein the size of a focusing light spot of the laser is controlled to be 5-30 mu M, the parameters of a laser wave band are 400-800 nm, the roundness requirement of the light spot is more than 85%, the adjustable repetition frequency of the laser is 80-1000 kHz, and the beam quality M is2Less than 1.3.
2. The method of processing a mask substrate using a laser as claimed in claim 1, wherein the mask substrate comprises a synthetic fiber nonwoven fabric, a natural fiber nonwoven fabric.
3. The method for processing the mask substrate by using the laser as claimed in claim 2, wherein when the mask substrate is a synthetic fiber non-woven fabric, the pulse width of the laser is less than 2ps, the laser band parameter is 515-532 nm, and the laser focusing spot size is 10 μm.
4. The method for processing a mask substrate using a laser according to claim 3, wherein the micro spacer structure comprises micro pores, and the diameter of the micro pores is 15 to 35 μm.
5. The method of using a laser to process a mask substrate according to claim 4, wherein said laser processing a micro spacer structure on the mask substrate further comprises:
in the light path, 1/4 wave plate is adopted to make the light beam become circular polarization and act on each part of the mask base material.
6. The method for processing the mask base material by using the laser as claimed in claim 2, wherein the natural fiber non-woven fabric is one of a fruit and vegetable fiber non-woven fabric and a pure cotton fiber non-woven fabric, the pulse width of the laser is 800 fs-10 ns, the parameter of the laser band is 400-800 nm, and the size of the laser focusing spot is controlled to be 5-30 μm.
7. The method for processing a mask substrate using a laser according to claim 6, wherein the micro-spacer structure comprises one or more of a grid, a concentric circle, a spiral structure or a pit with a certain depth, and the width of the grid is 5 to 30 μm.
8. The method of processing a mask substrate using a laser as claimed in claim 7, wherein the depth of the micro spacer structure is not more than 50% of the thickness of the mask substrate itself.
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| EP1281394A2 (en) * | 2001-08-02 | 2003-02-05 | Marlene Dauven | Processes for cosmetics |
| CN103054732A (en) * | 2013-01-06 | 2013-04-24 | 李文飞 | Vegetable and fruit mask machine |
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| CN109077937A (en) * | 2018-07-31 | 2018-12-25 | 刘经校 | A kind of long-acting slow-release facial mask and preparation method thereof |
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| CN208680781U (en) * | 2018-07-25 | 2019-04-02 | 广州依侬化妆品有限公司 | Molding machine is used in a kind of production of hyaluronic acid face mask |
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| EP1281394A2 (en) * | 2001-08-02 | 2003-02-05 | Marlene Dauven | Processes for cosmetics |
| CN103054732A (en) * | 2013-01-06 | 2013-04-24 | 李文飞 | Vegetable and fruit mask machine |
| CN205626532U (en) * | 2016-04-07 | 2016-10-12 | 上海悦目化妆品有限公司 | Mask |
| CN106074208A (en) * | 2016-07-05 | 2016-11-09 | 佛山市南海清秀化妆品有限公司 | Sensitive skin adaptive type facial film and preparation method thereof |
| CN107374983A (en) * | 2017-07-05 | 2017-11-24 | 北京化工大学 | A kind of composite fibre facial mask rich in collagen and preparation method thereof |
| CN208660133U (en) * | 2018-04-17 | 2019-03-29 | 尚亚利 | A kind of grid type wet face-applying film |
| CN208680781U (en) * | 2018-07-25 | 2019-04-02 | 广州依侬化妆品有限公司 | Molding machine is used in a kind of production of hyaluronic acid face mask |
| CN109077937A (en) * | 2018-07-31 | 2018-12-25 | 刘经校 | A kind of long-acting slow-release facial mask and preparation method thereof |
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Application publication date: 20191220 |