CN110586945B - Gold powder manufacturing method based on waste gold recovery - Google Patents

Gold powder manufacturing method based on waste gold recovery Download PDF

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CN110586945B
CN110586945B CN201910793502.7A CN201910793502A CN110586945B CN 110586945 B CN110586945 B CN 110586945B CN 201910793502 A CN201910793502 A CN 201910793502A CN 110586945 B CN110586945 B CN 110586945B
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polishing
gold
frame
gold powder
layer
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CN110586945A (en
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韩巧荣
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Suzhou Dongwu Gold New Material Co ltd
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Suzhou Dongwu Gold New Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F2009/001—Making metallic powder or suspensions thereof from scrap particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B22F2009/045—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by other means than ball or jet milling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a gold powder manufacturing method based on waste gold recovery, which belongs to the technical field of gold powder manufacturing, and can realize the manufacturing of gold powder by using a bidirectional grinding device through recovered waste gold or gold fragments, and can realize the grinding of the waste gold fragments in the transverse direction and the vertical direction, thereby accelerating the efficiency of gold powder manufacturing.

Description

Gold powder manufacturing method based on waste gold recovery
Technical Field
The invention relates to the technical field of gold powder manufacturing, in particular to a gold powder manufacturing method based on waste gold recovery.
Background
Gold (Gold) is a simple form of the chemical element Gold (chemical element symbol Au), a soft, golden, corrosion-resistant noble metal. Gold is one of the more rare, precious and highly appreciated metals.
With the improvement of living standard of people, gold jewelry is becoming more and more popular. More and more people like wearing gold jewelry. Gold scraps are generated in the processing process of gold jewelry or gold products, and because gold is very noble, the collection of the gold scraps is very important.
Because the gold piece granule of retrieving is less, and the great gold granule of granule need be smelted into to the reuse, but the whole area of contact with external environment of numerous less gold piece granules is great, therefore when smelting into great gold granule, still need carry out the edulcoration and handle, and the operation is comparatively complicated, all need carry out the processing technology of spraying gold powder on a lot of ornament or the statue of buddha simultaneously, and it is comparatively extravagant to directly use the gold.
Therefore, a gold powder manufacturing method based on waste gold recovery is provided for solving the problems.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a gold powder manufacturing method based on waste gold recovery, which can realize the manufacturing of gold powder by using a bidirectional grinding device through recovered waste gold or gold fragments, can realize the grinding of the waste gold fragments in the transverse direction and the vertical direction simultaneously, thereby accelerating the efficiency of the gold powder manufacturing, and in the process, the multipoint simultaneous ball-milling effect can be carried out on the surfaces of the gold fragments through a point-dividing grinding layer, so that the gold powder manufacturing efficiency is improved, meanwhile, the difficulty of carrying out gold powder collection operation twice on the gold powder adhered on a grinding head can be effectively reduced through the design of an outer smooth layer, on one hand, the working efficiency is improved, and on the other hand, the loss and waste of the gold powder are effectively reduced.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A gold powder manufacturing method based on waste gold recovery comprises the following steps:
s1, firstly, putting the recovered waste gold scraps into a cleaning solution, soaking, cleaning and removing impurities, then washing with clear water and drying in the air;
s2, vibrating, overturning and grinding the gold scraps processed in the S1 through a bidirectional grinding device;
s3, obtaining gold powder after polishing, collecting the gold powder for the first time, controlling an upwarping polishing head of the bidirectional polishing device to stop rotating and vibrating, controlling the upwarping polishing head to be far away from the upper surface of the gold powder, starting the upwarping polishing head again to enable the gold powder adhered to the surface of the upwarping polishing head to fall off, and collecting the gold powder for the second time;
and S4, 3-5min later, taking out the gold powder obtained in the grinding frame for later use.
Can be through the old and useless gold or the gold piece of retrieving, adopt two-way grinding device to realize the preparation of gold powder, can realize transversely polishing old and useless gold piece with vertical while, thereby accelerate the efficiency to the preparation of gold powder, at this in-process, can carry out the effect that the multiple spot consolidated ball-milling simultaneously to the clastic surface of gold through dividing the point wearing course, improve gold powder preparation efficiency, the design through outsourcing smooth layer can effectively reduce the degree of difficulty that carries out twice gold powder collection operation to the gold powder of adhesion on the head of polishing simultaneously, improve work efficiency on the one hand, on the other hand effectively reduces the loss and the waste of gold powder.
Further, the cleaning solution is a mixed solution of glacial acetic acid and warm boiled water at 40-50 ℃, and the mixing ratio of the glacial acetic acid to the warm boiled water is 1: 5-6, impurities adhered to the gold surface can be effectively removed, so that the gold surface can recover luster.
Further, the operation standard that the upwarp polishing head is far away from the gold powder in S3 is that the upwarp polishing head is located between the top of the gold powder and the frame opening of the embedded polishing frame, and the distance from the upwarp polishing head to the frame opening is between the quarter point and the triple point of the polishing frame, so that the polishing end of the upwarp polishing head is always located in the polishing frame, and meanwhile, the upwarp polishing head is too high in position, and the gold powder adhered to the polishing end of the upwarp polishing head easily scatters to the outside of the polishing frame, resulting in loss and waste of gold powder resources, and the upwarp polishing head is too low in position, and when the internal vibrating motor of the upwarp polishing head vibrates, the gold powder at the bottom of the polishing frame is easily driven to generate certain flying fluctuation, resulting in the gold powder falling outwards.
Further, two-way grinding device includes the support body, the electric putter that carries out the drive by the rotating electrical machines is installed to the support body upper end, upwarp the head of polishing fixed connection in electric putter below, install vibrating motor in the upwarp head of polishing, the frame of polishing inlays and establishes at support body table surface, support body lower extreme fixedly connected with bottom plate, the bottom plate is located under the frame of polishing, during the use, upwarps the head of polishing through electric putter control and moves down and make upwarp the head of polishing end and polish the frame in old and useless gold piece's upper surface contact, then start vibrating motor and rotating electrical machines simultaneously for upwarp the head of polishing and carry out horizontal rotation on one side and polish to old and useless gold piece, carry out vertical vibration on one side and polish, polish to old and useless gold piece simultaneously, thereby accelerate the efficiency to the preparation of gold powder.
Further, upwarp and polish a head lower extreme fixedly connected with and divide the point grinding layer, divide the inside soft location layer and a plurality of pearl of having placed of point grinding layer, soft location level is in a plurality of pearl outsides, and is a plurality of when upwarp and polish the head rotation and polish, through a plurality of pearls of grinding, can carry out the effect of multiple spot while consolidating the ball-milling to the clastic surface of gold, improve the efficiency of polishing on the one hand, on the other hand the pearl is located the inboard not with the gold piece direct contact, effectively avoids gold piece or gold powder to be adhered on the pearl surface, effectively avoids the later stage to polish the work that the gold powder got rid of on the pearl.
Further, upwarp and polish a head lower surface and glue and be equipped with outsourcing smooth layer, outsourcing smooth layer surface edge scribbles and is equipped with glues glutinous layer, and outsourcing smooth layer cladding completely outside the branch point grinds the layer, outsourcing smooth layer lower extreme is provided with careful decomposition matt layer, meticulously decompose the matt layer and lie in under a plurality of pearls, meticulously decompose the roughness that dull layer can effectively increase upwarp and polish a head lower surface, and the coarse degree of depth is no longer than 1mm, effectively guarantees the size and the quality of the gold powder granule that produces, and this degree of depth is effectively avoided simultaneously because the depth is too dark or too shallow leads to the condition of gold powder card in uneven gap, reduces the time that later stage secondary gold powder was collected to improve work efficiency.
Further, the super smooth coating of SLIPS selfreparing all scribbles to be equipped with bottom and inner wall in the frame of polishing for the gold powder of making is difficult for the adhesion at frame inner wall and the interior bottom end of polishing, effectively reduces the degree of difficulty that later stage gold powder was taken out from the frame of polishing, and reduces the gold powder loss and the waste that leads to because of the adhesion in the frame of polishing, and the super smooth coating of SLIPS selfreparing of bottom in the frame of polishing is 1.5-2 times of the inner wall of phase, compare in the inner wall, interior bottom end need bear more pressure that come from upwarp the head of polishing, therefore it scribbles the super smooth coating of SLIPS selfreparing of establishing is thicker, effectively avoid the loss of the smoothness because of wearing and tearing cause.
Further, the frame bottom of polishing is soft elasticity material, it is contactless between frame and the bottom plate to polish, and the distance of polishing between frame and the bottom plate is 1/6-1/5 of the whole height of frame of polishing, when upwarping the head of polishing and polishing the gold piece, the frame of polishing takes place deformation and with bottom plate upper surface contact to form the holding power, be convenient for polish and make the gold powder, after polishing a period, the control upwarps the head of polishing and rises, can follow the bottom application of force of soft frame of polishing this moment, thereby reach the inside gold piece effect of upset, and then make the off-the-shelf granule of gold powder more even.
Further, the bottom plate is located the part under the frame of polishing and the cambered surface structure of frame bottom for mutual matching for the frame of polishing can agree with the bottom plate mutually, can be when making the later stage polish the gold piece through upwarp polishing head rotary vibration, can ensure to polish the interior gold piece of frame and the partial homoenergetic atress of upwarp polishing head contact.
Further, the secondary gold powder collection in S3 specifically includes: firstly, taking down the outer coating smooth layer from the upwarp polishing head, adhering the outer coating smooth layer on a working table surface outside a frame opening of the polishing frame through the adhesive layer, then controlling the upwarp polishing head to move downwards to be in contact with the upper surface of the outer coating smooth layer, starting a vibration motor, and taking down the outer coating smooth layer after 3-5 min.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme can be through the old and useless gold or the gold piece of retrieving, adopt two-way grinding device to realize the preparation of gold powder, can realize transversely polishing old and useless gold piece with vertical while, thereby accelerate the efficiency to the preparation of gold powder, at this in-process, can carry out the effect that the multiple spot consolidated ball-milling simultaneously to the clastic surface of gold through dividing the point wearing course, improve gold powder preparation efficiency, the design through the outsourcing smooth layer can effectively reduce the degree of difficulty that carries out twice gold powder collection operation to the gold powder of adhesion on the head of polishing simultaneously, improve work efficiency on the one hand, on the other hand effectively reduces the loss and the waste of gold powder.
(2) The cleaning solution is a mixed solution of glacial acetic acid and warm boiled water of 40-50 ℃, and the mixing ratio of the glacial acetic acid to the warm boiled water is 1: 5-6, impurities adhered to the gold surface can be effectively removed, so that the gold surface recovers luster.
(3) S3 the operating standard that the upwarp polishing head is far away from the gold powder is that the upwarp polishing head is located between the upper part of the gold powder and the frame opening of the embedded polishing frame, the distance between the upwarp polishing head and the frame opening is between the four-minute point and the three-minute point of the polishing frame, the polishing end of the upwarp polishing head is always located in the polishing frame, meanwhile, the upwarp polishing head is too high in position, the gold powder adhered to the polishing end of the upwarp polishing head easily scatters to the outer side of the polishing frame, so that gold powder resources are lost and wasted, the upwarp polishing head is too low in position, and a vibrating motor in the upwarp polishing head easily drives the gold powder at the bottom of the polishing frame to generate certain flying fluctuation when vibrating, so that the gold powder floats outwards.
(4) Two-way grinding device includes the support body, the support body upper end is installed and is carried out driven electric putter by rotating electrical machines, upwarp bistrique fixed connection is in electric putter below, install vibrating motor in the upwarp bistrique, the frame of polishing inlays and establishes at support body table surface, support body lower extreme fixedly connected with bottom plate, the bottom plate is located under the frame of polishing, during the use, upwarp the bistrique through electric putter control and move down and make upwarp bistrique polishing end and the frame in old and useless gold clastic upper surface contact of polishing, then start vibrating motor and rotating electrical machines simultaneously, make upwarp the bistrique polish and carry out the horizontal rotation on one side to old and useless gold clastic, carry out vertical vibration on one side and polish, two-way polish to old and useless gold clastic simultaneously, thereby accelerate the efficiency to the preparation of gold powder.
(5) Upwarp and polish head lower extreme fixedly connected with point and grind the layer, soft location layer and a plurality of pearl are placed to point and grind the inside, soft location level is in a plurality of pearls of grinding outside, a plurality of pearls of grinding contact each other between two liang, when upwarp and polish the head rotation and polish, through a plurality of pearls of grinding, can carry out the effect of multiple spot while consolidating the ball-milling to the clastic surface of gold, improve the efficiency of polishing on the one hand, on the other hand the pearl of grinding is located the inboard not with gold piece direct contact, effectively avoid gold piece or gold powder to be adhered to the pearl surface of grinding, effectively avoid the work that the later stage was got rid of to the gold powder on the pearl of grinding.
(6) Upwarp and polish a head lower surface and glue and be equipped with outsourcing smooth layer, outsourcing smooth layer surface edge scribbles and is equipped with glues glutinous layer, and outsourcing smooth layer cladding completely outside the branch point mill, outsourcing smooth layer lower extreme is provided with careful decomposition matt layer, careful decomposition matt layer is located under a plurality of beads, meticulous decomposition matt layer can effectively increase the roughness of upwarping and polish a head lower surface, and coarse degree of depth is no longer than 1mm, effectively guarantee the size and the quality of the gold powder granule that produces, this degree of depth is effectively avoided simultaneously because the degree of depth is too dark or too shallow leads to the condition of gold powder card in uneven gap, reduce the time that later stage secondary gold powder was collected, thereby improve work efficiency.
(7) Bottom and inner wall all scribble and are equipped with the super smooth coating of SLIPS selfreparing in the frame of polishing, make the gold powder of producing hardly adhere at frame inner wall and the interior bottom end of polishing, effectively reduce the degree of difficulty that later stage gold powder was taken out from the frame of polishing, and reduce because of the gold powder loss and the waste that the adhesion leads to in the frame of polishing, and the super smooth coating thickness of SLIPS selfreparing of bottom is 1.5-2 times of inner wall of phase in the frame of polishing, compare in the inner wall, interior bottom end need bear more come from the pressure of upwarping polishing head, therefore the super smooth coating of SLIPS selfreparing that it was scribbled is thicker, effectively avoid the loss of the smoothness that causes because of wearing and tearing.
(8) The frame bottom of polishing is soft elasticity material, it is contactless between frame and the bottom plate to polish, and the distance between frame and the bottom plate of polishing is 1/6-1/5 of frame overall height of polishing, when upwarping when polishing head polishes the gold piece, the frame of polishing takes place deformation and with bottom plate upper surface contact, thereby form the holding power, be convenient for polish and make the gold powder, after polishing a period, the control upwarps and polishes the bistrique and rises, can follow the bottom application of force of soft frame of polishing this moment, thereby reach the inside gold piece effect of upset, and then make the off-the-shelf granule of gold powder more even.
(9) The bottom plate is located the cambered surface structure of the part under the frame of polishing and the frame bottom of polishing for mutual matching for the frame of polishing can agree with the bottom plate mutually, can be when making the later stage polish the gold piece through upwarp polishing head rotary vibration, can ensure the partial homoenergetic atress of gold piece and upwarp polishing head contact in the frame of polishing.
(10) The specific operation of secondary gold powder collection in S3 is as follows: firstly, taking the outer coating smooth layer off the upwarping polishing head, sticking the outer coating smooth layer on a working table surface outside a frame opening of the polishing frame through the adhesive layer, then controlling the upwarping polishing head to move downwards to contact with the upper surface of the outer coating smooth layer, starting the vibration motor, and taking off the outer coating smooth layer after 3-5 min.
Drawings
FIG. 1 is a principal flow diagram of the present invention;
FIG. 2 is a schematic structural view of the bi-directional polishing apparatus of the present invention;
FIG. 3 is a schematic structural view of a warp sanding head portion of the present invention;
FIG. 4 is a schematic view of the structure at A in FIG. 3;
fig. 5 is a partial structural schematic view of a base plate in embodiment 2 of the present invention.
The reference numbers in the figures illustrate:
1 support body, 2 electric putter, 3 upwarp polish head, 31 soft positioning layer, 32 grinding beads, 4 frames, 5 bottom plates, 51 stereotype boards, 61 sponge layers, 62 post that undulates.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1, a method for manufacturing gold powder based on waste gold recovery includes the following steps:
s1, firstly, putting the recovered waste gold scraps into a cleaning solution, soaking, cleaning and removing impurities, then washing with clear water and drying in the air;
s2, vibrating, overturning and grinding the gold scraps processed in the S1 through a bidirectional grinding device;
s3, after polishing, obtain the gold powder, then carry out a gold powder collection, control two-way grinding device' S upwarp and polish 3 stall and vibration of head, control upwarp and polish 3 and keep away from the gold powder upper surface, start up the upwarp again and polish 3, make the gold powder of upwarp 3 surface adhesion of polish head drop, later carry out the collection of secondary gold powder again, the concrete operation of secondary gold powder collection is: firstly, taking the outer coating smooth layer from the upwarp polishing head 3, sticking the outer coating smooth layer on a working table surface outside a frame opening of the polishing frame 4 through the adhesive layer, controlling the upwarp polishing head 3 to move downwards to be in contact with the upper surface of the outer coating smooth layer, starting a vibration motor, and taking down the outer coating smooth layer after 3-5 min;
and S4, 3-5min later, taking out the gold powder obtained in the grinding frame 4 for later use.
The cleaning solution is a mixed solution of glacial acetic acid and warm boiled water of 40-50 ℃, and the mixing ratio of the glacial acetic acid to the warm boiled water is 1: 5-6, impurities adhered to the surface of the gold can be effectively removed, so that the surface of the gold recovers luster, in the operation standard of S3, the upward warping polishing head 3 is far away from the gold powder, namely, the upward warping polishing head 3 is located between the top of the gold powder and a frame opening of the embedded polishing frame 4, the distance between the upward warping polishing head 3 and the frame opening is between a four-point and a three-point of the polishing frame 4, so that the polishing end of the upward warping polishing head 3 is always located in the polishing frame 4, meanwhile, the upward warping polishing head 3 is too high in position, the gold powder adhered to the polishing end of the upward warping polishing head 3 is easily scattered to the outer side of the polishing frame 4, gold powder resources are lost and wasted, the upward warping polishing head 3 is too low in position, and a vibrating motor in the upward warping polishing head 3 is easy to drive the gold powder at the bottom of the polishing frame 4 to generate certain flying fluctuation when the gold powder vibrates, and the gold powder floats outwards.
Please refer to fig. 2, two-way grinding device includes support body 1, support body 1 upper end is installed and is carried out driven electric putter 2 by the rotating electrical machines, upwarp 3 fixed connection of head of polishing in electric putter 2 below, install vibrating motor in upwarp head of polishing 3, frame of polishing 4 inlays and establishes at 1 table surface of support body, 1 lower extreme fixedly connected with bottom plate 5 of support body, bottom plate 5 is located under frame of polishing 4, in using, move down and make upwarp 3 head of polishing in 3 head of polishing of head of polishing and the frame of polishing 4 interior old and useless gold clastic upper surface contact through electric putter 2 control, then start vibrating motor and rotating electrical machines simultaneously, make upwarp 3 head of polishing to useless gold clastic on one side carry out horizontal rotation and polish, carry out vertical vibration on the other side and polish, two-way while is polished to useless gold clastic, thereby accelerate the efficiency to the gold powder preparation.
Referring to fig. 3-4, the lower end of the upwarping polishing head 3 is fixedly connected with a point-dividing polishing layer, a soft positioning layer 31 and a plurality of polishing beads 32 are placed inside the point-dividing polishing layer, the soft positioning layer 31 is located outside the plurality of polishing beads 32, the plurality of polishing beads 32 are in mutual contact, when the upwarping polishing head 3 rotates to polish, the surface of the gold fragments can be subjected to multipoint simultaneous ball milling, on one hand, the polishing efficiency is improved, on the other hand, the polishing beads 32 are located inside and are not in direct contact with the gold fragments, the gold fragments or gold powder are effectively prevented from being adhered to the surface of the polishing beads 32, the later-stage gold powder removal work on the polishing beads 32 is effectively prevented, the lower surface of the upwarping polishing head 3 is adhered with an outer-coated smooth layer, the outer-coated smooth layer is coated at the outer edge of the outer-coated smooth layer, the outer-coated smooth layer is completely coated on the point-dividing polishing layer, the lower end of the smooth layer is provided with a fine decomposition matte layer, meticulous decomposition matte layer is located under a plurality of beads 32, and meticulous decomposition matte layer can effectively increase the roughness of upwarping 3 lower surfaces of grinding head, and the coarse degree of depth is no longer than 1mm, effectively guarantees the size and the quality of the gold powder granule that produces, and this degree of depth effectively avoids simultaneously because the degree of depth is too dark or too shallow leads to the condition of gold powder card in uneven gap, reduces the time that the secondary gold powder of later stage was collected to improve work efficiency.
The inner bottom end and the inner wall of the polishing frame 4 are both coated with the SLIPS self-repairing super-smooth coating, so that the manufactured gold powder is difficult to adhere to the inner wall and the inner bottom end of the polishing frame 4, the difficulty of taking out the later-stage gold powder from the polishing frame 4 is effectively reduced, the gold powder loss and waste caused by adhesion in the polishing frame 4 are reduced, the thickness of the SLIPS self-repairing super-smooth coating at the inner bottom end of the polishing frame 4 is 1.5-2 times that of the later-stage inner wall, and compared with the inner wall, the inner bottom end needs to bear more pressure from the upwarping polishing head 3, so that the SLIPS self-repairing super-smooth coating coated by the polishing frame is thicker, the loss of smoothness caused by abrasion is effectively avoided, the bottom of the polishing frame 4 is made of soft elastic material, the polishing frame 4 is not in contact with the bottom plate 5, and the distance between the polishing frame 4 and the bottom plate 5 is 1/6-1/5 of the whole height of the polishing frame 4, when upwarping head 3 polishes the gold piece, frame 4 takes place deformation and with 5 upper surface contact of bottom plate, thereby form the holding power, be convenient for polish and make the gold powder, after polishing a period, control upwarping head 3 rises, can follow the bottom application of force of soft frame 4 of polishing this moment, thereby reach the inside gold piece effect of upset, and then make the off-the-shelf granule of gold powder more even, the soft elastic material of frame 4 bottom of polishing simultaneously, when upwarping head 3 keeps away from the gold piece, frame 4 resumes deformation polishing, can also produce certain vibrations to the gold piece, and then reach the effect of supplementary gold piece turn-over change position, and then accelerate the effect of gold powder preparation efficiency.
Example 2:
please refer to fig. 5, the bottom plate 5 includes the stock plate 51 and from the stirring layer that fluctuates, from the stirring layer that fluctuates including sponge layer 61 and a plurality of evenly distributed's fluctuation post 62, sponge layer 61 and fluctuation post 62 all with stock plate 51 fixed connection, and sponge layer 61 parcel is in a plurality of fluctuation posts 62 outsides, sponge layer 61 adopts the soft material of elasticity, fluctuation post 62 adopts the stereoplasm material, and fluctuation post 62 upper surface is smooth arc surface, fluctuation post 62 can adopt flexible telescopic rod, also can adopt and have elastic element, leave the gold piece and not produce the moment of pressure to the gold piece at last tilting head 3, the stirring layer that fluctuates of compressing originally when polishing this moment, can upwards bounce, produce the power from bottom to top to the gold piece, it is repeated many times, reach the automatic effect to its inside gold piece vibration stirring, and then improve the effect of polishing.
Can be through the old and useless gold or the gold piece of retrieving, adopt two-way grinding device to realize the preparation of gold powder, can realize transversely polishing old and useless gold piece with vertical while, thereby accelerate the efficiency to the preparation of gold powder, at this in-process, can carry out the effect of multiple spot reinforcing ball-milling simultaneously to the clastic surface of gold through dividing the point wearing course, improve gold powder preparation efficiency, the design through outsourcing smooth layer can effectively reduce the degree of difficulty of carrying out twice gold powder collection operation to the gold powder of adhesion on the head of polishing simultaneously, on the one hand, improve work efficiency, on the other hand effectively reduces the loss and the waste of gold powder.
The above; are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; those skilled in the art can appreciate that the present invention is not limited to the specific embodiments disclosed herein; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.

Claims (7)

1. A gold powder manufacturing method based on waste gold recovery is characterized by comprising the following steps: the method comprises the following steps:
s1, firstly, putting the recovered waste gold scraps into a cleaning solution, soaking, cleaning and removing impurities, then washing with clear water and drying in the air;
s2, vibrating, overturning and grinding the gold scraps processed by the S1 by a bidirectional grinding device;
s3, obtaining gold powder after polishing is finished, then collecting the gold powder for the first time, firstly controlling an upwarping polishing head (3) of a bidirectional polishing device to stop rotating and vibrating, controlling the upwarping polishing head (3) to be far away from the upper surface of the gold powder, starting the upwarping polishing head (3) again to enable the gold powder adhered to the surface of the upwarping polishing head (3) to fall off, then collecting the gold powder for the second time, and realizing the gold powder manufacturing by adopting the bidirectional polishing device, so that the waste gold fragments can be polished in the transverse direction and the vertical direction;
s4, after 3-5min, taking out the gold powder obtained in the grinding frame (4) for later use; the cleaning solution is a mixed solution of glacial acetic acid and warm boiled water at 40-50 ℃, and the mixing ratio of the glacial acetic acid to the warm boiled water is 1: 5-6;
the lower end of the upturned polishing head (3) is fixedly connected with a point grinding layer, a soft positioning layer (31) and a plurality of grinding beads (32) are placed in the point grinding layer, the soft positioning layer (31) is positioned on the outer side of the grinding beads (32), and the grinding beads (32) are in contact with each other;
upwarp and polish head (3) lower surface and glue and be equipped with outsourcing smooth layer, outsourcing smooth layer surface edge scribbles and is equipped with glues glutinous layer, and outsourcing smooth layer cladding completely outside the branch point mill, outsourcing smooth layer lower extreme is provided with meticulous decomposition matt layer, meticulous decomposition matt layer is located under a plurality of pearls of grinding (32).
2. The method for manufacturing gold powder based on waste gold recovery according to claim 1, characterized in that: the operation standard that the upward warping polishing head (3) is far away from the gold powder in S3 is that the upward warping polishing head (3) is located between the upper portion of the gold powder and the frame opening of the embedded polishing frame (4), and the distance between the upward warping polishing head (3) and the frame opening is between the quartile point and the trisection point of the polishing frame (4).
3. The method for manufacturing gold powder based on waste gold recovery according to claim 1, characterized by comprising the following steps: two-way grinding device includes support body (1), support body (1) upper end is installed and is carried out driven electric putter (2) by the rotating electrical machines, upwarp polishing head (3) fixed connection in electric putter (2) below, upwarp and install vibrating motor in polishing head (3), frame (4) of polishing inlays and establishes at support body (1) table surface, support body (1) lower extreme fixedly connected with bottom plate (5), bottom plate (5) are located under frame (4) of polishing.
4. The method for manufacturing gold powder based on waste gold recovery according to claim 1, characterized by comprising the following steps: and SLIPS self-repairing super-smooth coatings are coated on the inner bottom end and the inner wall of the polishing frame (4), and the thickness of the SLIPS self-repairing super-smooth coating at the inner bottom end of the polishing frame (4) is 1.5-2 times that of the inner wall.
5. The method for manufacturing gold powder based on waste gold recovery according to claim 1, characterized in that: the bottom of the polishing frame (4) is made of soft elastic materials, the polishing frame (4) is not in contact with the bottom plate (5), and the distance between the polishing frame (4) and the bottom plate (5) is 1/6-1/5 of the overall height of the polishing frame (4).
6. The method for manufacturing gold powder based on waste gold recovery according to claim 5, characterized in that: the part of the bottom plate (5) right below the polishing frame (4) and the bottom of the polishing frame (4) are of arc surface structures matched with each other.
7. The method for manufacturing gold powder based on waste gold recovery according to claim 1, characterized in that: the specific operation of secondary gold powder collection in the S3 is as follows: firstly, taking the outer coating smooth layer off the upwarp polishing head (3), sticking the outer coating smooth layer on a working table surface outside a frame opening of the polishing frame (4) through the adhesive layer, then controlling the upwarp polishing head (3) to move downwards to contact with the upper surface of the outer coating smooth layer, starting the vibration motor, and taking off the outer coating smooth layer after 3-5 min.
CN201910793502.7A 2019-08-27 2019-08-27 Gold powder manufacturing method based on waste gold recovery Active CN110586945B (en)

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CN108436671A (en) * 2018-04-12 2018-08-24 广州市品卓装饰材料有限公司 A kind of grinding device and its application method of the hardware production with waste recovery
CN208250389U (en) * 2018-04-10 2018-12-18 深圳市中雷设计有限公司 A kind of recyclable device for gold refinement processing
CN109396656A (en) * 2018-10-29 2019-03-01 东莞润如智能科技有限公司 It is a kind of can comprehensive polishing facilitate collect waste material intelligent engraving etching machines
CN110029242A (en) * 2019-04-22 2019-07-19 深圳市信达祥珠宝发展有限公司 A kind of production technology of 5G gold

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206447912U (en) * 2016-12-27 2017-08-29 昆山市惠盛实业有限公司 A kind of copper powder polishing retracting device for waste and old copper sheet
CN108145564A (en) * 2017-12-27 2018-06-12 重庆精高金属结构制造有限公司 A kind of dedusting metal grinding device
CN208250389U (en) * 2018-04-10 2018-12-18 深圳市中雷设计有限公司 A kind of recyclable device for gold refinement processing
CN108436671A (en) * 2018-04-12 2018-08-24 广州市品卓装饰材料有限公司 A kind of grinding device and its application method of the hardware production with waste recovery
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