CN110581920A - Equipment operation mode control method and device - Google Patents
Equipment operation mode control method and device Download PDFInfo
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- CN110581920A CN110581920A CN201910662580.3A CN201910662580A CN110581920A CN 110581920 A CN110581920 A CN 110581920A CN 201910662580 A CN201910662580 A CN 201910662580A CN 110581920 A CN110581920 A CN 110581920A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72448—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions
- H04M1/72454—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions according to context-related or environment-related conditions
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72448—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions
- H04M1/72463—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions to restrict the functionality of the device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
Abstract
The application relates to a method and a device for controlling an equipment operation mode, wherein the method comprises the following steps: acquiring an actual temperature value of a target assembly in the operation process of target equipment; comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result; and controlling the operation mode of the target equipment according to the comparison result. The technical problem that the existing intelligent equipment cannot effectively solve the heat dissipation problem of the equipment in the operation process if the situation is complex is solved in the above mode, and the equipment which controls the operation state effectively dissipates heat so as to prolong the service life of the equipment.
Description
Technical Field
The present application relates to the field of device control, and in particular, to a method and an apparatus for controlling a device operation mode.
Background
with the continuous development of internet technology, the functions of smart phones become more and more powerful, the appearance is more and more novel, and the thickness of mobile phones is also smaller and smaller, however, with the thickness of mobile phones and the like becoming smaller, the demand for heat dissipation of mobile phones is also becoming larger and larger. In the process of designing the smart phone, the heat dissipation condition of the structure and the hardware can be considered in the initial design stage.
However, the structure and hardware pass the heat dissipation standard in the design stage, which can only meet the technical standard in a single scene, and no effective solution is provided at present for effectively solving the problem of heat dissipation under the condition that various complex scenes or products are released.
disclosure of Invention
In order to solve the technical problem or at least partially solve the technical problem, the application provides a method and a device for controlling an operation mode of equipment.
in a first aspect, the present application provides a method for controlling an operation mode of a device, including:
acquiring an actual temperature value of a target assembly in the operation process of target equipment;
Comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
and controlling the operation mode of the target equipment according to the comparison result.
in one embodiment, the target component includes at least one of: CPU, mainboard, casing.
In one embodiment, obtaining an actual temperature value of a target component during operation of a target device includes:
And periodically acquiring the actual temperature value of the target assembly through a temperature sensor arranged on the target assembly.
In one embodiment, comparing the actual temperature value of the target component with a preset temperature threshold to obtain a comparison result includes:
Acquiring a preset upper temperature limit value and a preset lower temperature limit value;
taking the upper temperature limit value and the lower temperature limit value as the temperature threshold value, wherein different target assemblies correspond to different upper temperature limit values and different lower temperature limit values;
And comparing the actual temperature value of the target assembly with the upper temperature limit value and the lower temperature limit value to obtain a comparison result.
In one embodiment, controlling the operation mode of the target device according to the comparison result includes:
Controlling the target equipment to normally operate under the condition that the actual temperature value is not higher than the temperature lower limit value;
Controlling the target equipment to close partial functions under the condition that the actual temperature value is higher than the lower temperature limit value and is not higher than the upper temperature limit value;
And controlling the target equipment to only run part of specific functions under the condition that the actual temperature value is higher than the temperature upper limit value.
In one embodiment, the target device is a smartphone terminal.
in a second aspect, the present application provides an apparatus operation mode control device, including:
The acquisition module is used for acquiring the actual temperature value of the target component in the operation process of the target equipment;
The comparison module is used for comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
And the control module is used for controlling the operation mode of the target equipment according to the comparison result.
In a third aspect, the present application provides an intelligent terminal device, including: the device operation mode control device.
in one embodiment, the target component includes at least one of: CPU, mainboard, casing.
in an embodiment, the obtaining module is specifically configured to periodically obtain an actual temperature value of the target component through a temperature sensor disposed on the target component.
in one embodiment, the comparison module comprises:
The device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring a preset temperature upper limit value and a preset temperature lower limit value;
The generating unit is used for taking the upper temperature limit value and the lower temperature limit value as the temperature threshold value, wherein different target components correspond to different upper temperature limit values and different lower temperature limit values;
and the comparison unit is used for comparing the actual temperature value of the target assembly with the upper temperature limit value and the lower temperature limit value to obtain a comparison result.
in one embodiment, the control module comprises:
The first control unit is used for controlling the target equipment to normally operate under the condition that the actual temperature value is not higher than the temperature lower limit value;
The second control unit is used for controlling the target equipment to close part of functions under the condition that the actual temperature value is higher than the lower temperature limit value and is not higher than the upper temperature limit value;
And the third control unit is used for controlling the target equipment to only run part of specific functions under the condition that the actual temperature value is higher than the temperature upper limit value.
In a fourth aspect, the present application provides a network device, comprising: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the steps of the above method when executing the computer program.
in a fifth aspect, the present application provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the above method.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
According to the method provided by the embodiment of the application, whether the heat dissipation of the equipment is affected or not is determined by acquiring the real-time temperature data of the specific component in the operation process of the equipment, and under the condition that the heat dissipation of the equipment is affected, partial functions of the equipment are forbidden, so that the equipment is controlled to be gradually cooled. The technical problem that the existing intelligent equipment cannot effectively solve the heat dissipation problem of the equipment in the operation process if the situation is complex is solved in the above mode, and the equipment which controls the operation state effectively dissipates heat so as to prolong the service life of the equipment.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a flowchart of a method for controlling an operation mode of a device according to an embodiment of the present disclosure;
fig. 2 is a control flowchart for controlling heat dissipation of a device according to an embodiment of the present disclosure;
Fig. 3 is a block diagram of a device operation mode control apparatus according to an embodiment of the present disclosure.
Detailed Description
in order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In view of the existing heat dissipation problem for the intelligent device, the heat dissipation problem is generally performed at the hardware design stage of the device, and the heat dissipation can only be performed under specific conditions, and under various complex conditions existing in the process of being put on the market and used by users, if the heat dissipation problem under the complex conditions is solved, in this example, it is considered that whether the heat dissipation problem exists in the device can be determined by monitoring the temperature values of some specific components in real time, and the heat dissipation problem is processed under the condition that the heat dissipation problem exists, so that the technical problem that the service life of the device is influenced due to overheating of the device is avoided.
fig. 1 is a method for controlling an operation mode of a device according to an embodiment of the present application, and as shown in fig. 1, the method may include the following steps:
step 101: acquiring an actual temperature value of a target assembly in the operation process of target equipment;
the real-time temperature values of the components can be used for measuring the current heat dissipation condition of the target equipment, if the real-time temperature values are too high, the problem of equipment heat dissipation can be determined, and if the real-time temperature values are low, the problem of heat dissipation can be determined.
Step 102: comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
In order to determine the heat dissipation problem, a temperature threshold, that is, a preset temperature threshold, may be set, and the obtained actual temperature value, which may also be referred to as a real-time temperature value, is compared with the preset temperature threshold to determine whether the heat dissipation problem exists. In the actual implementation process, the temperature threshold may be an exact temperature value, or may be a temperature range, that is, the temperature threshold includes an upper limit value and a lower limit value, which may be specifically selected according to actual needs, and this application does not limit this.
Step 103: and controlling the operation mode of the target equipment according to the comparison result.
In the above example, whether the heat dissipation of the device is affected is determined by obtaining real-time temperature data of a specific component in the operation process of the device, and under the condition that the heat dissipation of the device is affected, part of functions of the device are disabled, so that the device is controlled to gradually cool. The technical problem that the existing intelligent equipment cannot effectively solve the heat dissipation problem of the equipment in the operation process if the situation is complex is solved in the above mode, and the technical effect of controlling the equipment in the operation state to effectively dissipate heat so as to prolong the service life of the equipment is achieved.
The target component may include, but is not limited to, at least one of: CPU, mainboard, casing. For example, the temperature value of only one component in the CPU, the motherboard, and the housing may be detected to determine whether there is a problem in heat dissipation, two of the determinations may be monitored, or the heat dissipation problem may be determined by centralized judgment of the above three components. The specific method can be selected according to actual needs. However, it should be noted that the above listed target components are only an exemplary description, and other target components may be adopted as judgment objects in practical implementation, and the present application is not limited thereto.
specifically, in step 101, obtaining an actual temperature value of the target component during the operation of the target device may include: and periodically acquiring the actual temperature value of the target assembly through a temperature sensor arranged on the target assembly. That is, a temperature sensor may be disposed on the target assembly, and real-time temperature acquisition may be achieved through the disposed temperature sensor, and in actual implementation, a periodic acquisition mode may be adopted, for example, real-time temperature is acquired every five minutes to perform judgment control once, or real-time temperature is acquired every fifteen minutes or half an hour to perform judgment control once. The specific time interval to be used may be determined according to actual conditions and requirements, and the present application is not particularly limited.
In the temperature comparison, the temperature threshold may include an upper limit value and a lower limit value, that is, comparing the actual temperature value of the target component with a preset temperature threshold to obtain a comparison result, and may include:
s1: acquiring a preset upper temperature limit value and a preset lower temperature limit value;
s2: taking the upper temperature limit value and the lower temperature limit value as the temperature threshold value, wherein different target assemblies correspond to different upper temperature limit values and different lower temperature limit values;
s3: and comparing the actual temperature value of the target assembly with the upper temperature limit value and the lower temperature limit value to obtain a comparison result.
That is, the first component may correspond to an upper temperature limit TS1 lower temperature limit TX1, the second component may correspond to an upper temperature limit TS2 lower temperature limit TX2, and so on. Specific values for the upper temperature limit and the lower temperature limit may be set according to a plurality of tests or experience of a developer.
when the operation mode of the target device is controlled according to the comparison result, the following strategies may be adopted, but are not limited to:
1) Controlling the target equipment to normally operate under the condition that the actual temperature value is not higher than the temperature lower limit value;
2) Controlling the target equipment to close partial functions under the condition that the actual temperature value is higher than the lower temperature limit value and is not higher than the upper temperature limit value;
3) And controlling the target equipment to only run part of specific functions under the condition that the actual temperature value is higher than the temperature upper limit value.
For example, the target device is a smartphone terminal, and if the actual temperatures of all the sensor modules are smaller than the lower threshold value limit value set by each module, all the limiting functions are removed, and the target device is controlled to be in a normal working mode; if the actual temperature of all the sensor modules is larger than the upper limit value of the threshold value set by each module, all the functions except the telephone and the short message are closed, and the target equipment is controlled to be in the limit power-saving working mode; if the current actual temperature of the CPU and the current actual temperature of the mainboard are about to reach the set threshold point (for example, a is 2, namely, the difference is 2 degrees), and the current actual temperature of the shell is less than the set default maximum threshold temperature, the flash lamp function is turned off; and if the current actual temperature of the CPU and the current actual temperature of the mainboard are greater than the set threshold upper limit value, and the current actual temperature of the shell is less than the set threshold upper limit value, closing the functions of the GPS, the WIFI, the hotspot, the flash lamp, the camera and the like.
The target device may be, but not limited to, a smartphone terminal, and may also be other smart devices, for example: tablet computers, PDAs, etc.
the above method is described below with reference to a specific example, however, it should be noted that the specific example is only for better describing the present application and is not to be construed as limiting the present application.
In this example, the temperature sensors near the CPU and on the motherboard are monitored to obtain the temperatures of the CPU and the motherboard, and then the software layer compares the obtained temperature values with the set threshold steps to process different events. The problem of the shell is obtained by monitoring a temperature sensor on the shell of the mobile phone, and then different functions are limited by a software layer through comparing set threshold value steps and different temperature ranges. And when the temperature rises to the set limit value, the power-saving mode is entered, and the user can only use the basic telephone and short message functions.
Through the mode, the problem that the service life of the mobile phone is influenced due to the fact that the temperature rises too fast in the process that a user uses the mobile phone, especially in scenes that the temperature rises too fast when the user plays games, watches videos and the like. Specifically, the intelligent device is controlled to process different transactions and limit part of application functions when the temperature rises to different ranges, so that the purpose of cooling is achieved.
As shown in fig. 2, before the software of the intelligent device is formally released, according to various debugging and testing, a suitable temperature threshold of each module is set, the threshold is equivalent to a condition switch, and each threshold is defined as follows:
DT1_ MAX: an upper limit value of the CPU temperature;
DT1_ MIN: a CPU temperature lower limit value;
DT2_ MAX: the upper limit value of the temperature of the mainboard;
DT2_ MIN: a lower limit value of the temperature of the main board;
DT3_ MAX: an upper shell temperature limit;
DT3_ MIN: a lower shell temperature limit;
after the intelligent device is started to operate, the system automatically starts a system-level background service which is resident and constantly monitors and acquires the actual temperature CT on the sensors of the CPU, the mainboard and the shell at a certain frequency, wherein the CT 1: current actual temperature of CPU, CT 2: the current actual temperature of the motherboard, CT3, the current actual temperature of the enclosure.
when the background service monitors the actual temperatures CT1, CT2, and CT3 of each sensor module, the actual temperatures are compared with the upper limit value and the lower limit value of the temperature threshold values on the CPU, the motherboard, and the enclosure, which may be specifically compared according to the following strategies:
1) If CT1 is smaller than DT1_ MIN, CT2 is smaller than DT2_ MIN, and CT3 is smaller than DT3_ MIN, that is, the actual temperature of all sensor modules is smaller than the threshold lower limit value set by each module, all limiting functions are removed, and the system is in the normal operation mode.
2) if CT1 is greater than DT1_ MAX, CT2 is greater than DT2_ MAX, and CT3 is greater than DT3_ MAX, that is, the actual temperature of all sensor modules is greater than the upper limit value of the threshold set by each module, all functions except the telephone and short message are closed, and the system is in the limit power saving mode of operation.
3) if CT1 is greater than DT1_ MAX-a, while CT2 is greater than DT2_ MAX-a, while CT3 is less than DT3_ MAX, i.e., the current actual temperature of the CPU and the current actual temperature of the motherboard are about to reach the set threshold point (e.g., a is 2, i.e., 2 degrees different), the flash function is turned off when the current actual temperature of the enclosure is less than the set default maximum threshold temperature.
4) if the CT1 is greater than DT1_ MAX, the CT2 is greater than DT2_ MAX, and the CT3 is less than DT3_ MAX, that is, the current actual temperature of the CPU and the current actual temperature of the motherboard are greater than the set upper threshold value, and the current actual temperature of the housing is less than the set upper threshold value, the functions of turning off the GPS, turning off the WIFI and the hotspot, turning off the flash, turning off the camera, and the like are performed.
based on the same inventive concept, the embodiment of the present invention further provides a device operation mode control apparatus, as described in the following embodiments. Because the principle of solving the problems of the device operation mode control device is similar to that of the device operation mode control method, the implementation of the device operation mode control device can refer to the implementation of the device operation mode control method, and repeated parts are not described again. As used hereinafter, the term "unit" or "module" may be a combination of software and/or hardware that implements a predetermined function. Although the means described in the embodiments below are preferably implemented in software, an implementation in hardware, or a combination of software and hardware is also possible and contemplated. Fig. 3 is a block diagram of a structure of an apparatus operation mode control device according to an embodiment of the present invention, and as shown in fig. 3, the apparatus operation mode control device may include: an acquisition module 301, a comparison module 302, and a control module 303, the structure of which is described below.
An obtaining module 301, configured to obtain an actual temperature value of a target component in an operating process of a target device;
A comparing module 302, configured to compare the actual temperature value of the target component with a preset temperature threshold to obtain a comparison result;
And the control module 303 is configured to control the operation mode of the target device according to the comparison result.
In one embodiment, the target component may include, but is not limited to, at least one of: CPU, mainboard, casing.
In an embodiment, the obtaining module 301 may be specifically configured to periodically obtain an actual temperature value of the target component through a temperature sensor disposed on the target component.
In one embodiment, the comparing module 302 may include: the device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring a preset temperature upper limit value and a preset temperature lower limit value; the generating unit is used for taking the upper temperature limit value and the lower temperature limit value as the temperature threshold value, wherein different target components correspond to different upper temperature limit values and different lower temperature limit values; and the comparison unit is used for comparing the actual temperature value of the target assembly with the upper temperature limit value and the lower temperature limit value to obtain a comparison result.
In one embodiment, the control module 303 may include: the first control unit is used for controlling the target equipment to normally operate under the condition that the actual temperature value is not higher than the temperature lower limit value; the second control unit is used for controlling the target equipment to close part of functions under the condition that the actual temperature value is higher than the lower temperature limit value and is not higher than the upper temperature limit value; and the third control unit is used for controlling the target equipment to only run part of specific functions under the condition that the actual temperature value is higher than the temperature upper limit value.
An embodiment of the present application further provides a specific implementation manner of an electronic device, which is capable of implementing all steps in the device operation mode control method in the foregoing embodiment, where the electronic device specifically includes the following contents: a processor (processor), a memory (memory), a communication Interface (Communications Interface), and a bus; the processor, the memory and the communication interface complete mutual communication through the bus; the processor is configured to call a computer program in the memory, and when executing the computer program, the processor implements all the steps in the device operation mode control method in the foregoing embodiment, for example, when executing the computer program, the processor implements the following steps:
step 1: acquiring an actual temperature value of a target assembly in the operation process of target equipment;
step 2: comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
and step 3: and controlling the operation mode of the target equipment according to the comparison result.
As can be seen from the above description, in the embodiment of the present application, it is determined whether the heat dissipation of the device is affected by obtaining the real-time temperature data of the specific component in the operation process of the device, and under the condition that it is determined that the heat dissipation of the device is affected, part of the functions of the device are disabled, so that the device is controlled to gradually cool down. The technical problem that the existing intelligent equipment cannot effectively solve the heat dissipation problem of the equipment in the operation process if the situation is complex is solved in the above mode, and the technical effect of controlling the equipment in the operation state to effectively dissipate heat so as to prolong the service life of the equipment is achieved.
An embodiment of the present application further provides a computer-readable storage medium capable of implementing all the steps in the device operation mode control method in the foregoing embodiment, where the computer-readable storage medium stores a computer program, and the computer program implements all the steps in the device operation mode control method in the foregoing embodiment when executed by a processor, for example, the processor implements the following steps when executing the computer program:
Step 1: acquiring an actual temperature value of a target assembly in the operation process of target equipment;
Step 2: comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
And step 3: and controlling the operation mode of the target equipment according to the comparison result.
as can be seen from the above description, in the embodiment of the present application, it is determined whether the heat dissipation of the device is affected by obtaining the real-time temperature data of the specific component in the operation process of the device, and under the condition that it is determined that the heat dissipation of the device is affected, part of the functions of the device are disabled, so that the device is controlled to gradually cool down. The technical problem that the existing intelligent equipment cannot effectively solve the heat dissipation problem of the equipment in the operation process if the situation is complex is solved in the above mode, and the technical effect of controlling the equipment in the operation state to effectively dissipate heat so as to prolong the service life of the equipment is achieved.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the hardware + program class embodiment, since it is substantially similar to the method embodiment, the description is simple, and the relevant points can be referred to the partial description of the method embodiment.
The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.
Although the present application provides method steps as described in an embodiment or flowchart, additional or fewer steps may be included based on conventional or non-inventive efforts. The order of steps recited in the embodiments is merely one manner of performing the steps in a multitude of orders and does not represent the only order of execution. When an actual apparatus or client product executes, it may execute sequentially or in parallel (e.g., in the context of parallel processors or multi-threaded processing) according to the embodiments or methods shown in the figures.
the systems, devices, modules or units illustrated in the above embodiments may be implemented by a computer chip or an entity, or by a product with certain functions. One typical implementation device is a computer. In particular, the computer may be, for example, a personal computer, a laptop computer, a vehicle-mounted human-computer interaction device, a cellular telephone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.
although embodiments of the present description provide method steps as described in embodiments or flowcharts, more or fewer steps may be included based on conventional or non-inventive means. The order of steps recited in the embodiments is merely one manner of performing the steps in a multitude of orders and does not represent the only order of execution. When an actual apparatus or end product executes, it may execute sequentially or in parallel (e.g., parallel processors or multi-threaded environments, or even distributed data processing environments) according to the method shown in the embodiment or the figures. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the presence of additional identical or equivalent elements in a process, method, article, or apparatus that comprises the recited elements is not excluded.
for convenience of description, the above devices are described as being divided into various modules by functions, and are described separately. Of course, in implementing the embodiments of the present description, the functions of each module may be implemented in one or more software and/or hardware, or a module implementing the same function may be implemented by a combination of multiple sub-modules or sub-units, and the like. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
Those skilled in the art will also appreciate that, in addition to implementing the controller as pure computer readable program code, the same functionality can be implemented by logically programming method steps such that the controller is in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers and the like. Such a controller may therefore be considered as a hardware component, and the means included therein for performing the various functions may also be considered as a structure within the hardware component. Or even means for performing the functions may be regarded as being both a software module for performing the method and a structure within a hardware component.
the present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
these computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
the memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.
Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
as will be appreciated by one skilled in the art, embodiments of the present description may be provided as a method, system, or computer program product. Accordingly, embodiments of the present description may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present description may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and so forth) having computer-usable program code embodied therein.
The embodiments of this specification may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The described embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including memory storage devices.
the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment. In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the specification. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only an example of the embodiments of the present disclosure, and is not intended to limit the embodiments of the present disclosure. Various modifications and variations to the embodiments described herein will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiments of the present specification should be included in the scope of the claims of the embodiments of the present specification.
Claims (14)
1. An apparatus operation mode control method, characterized by comprising:
Acquiring an actual temperature value of a target assembly in the operation process of target equipment;
comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
and controlling the operation mode of the target equipment according to the comparison result.
2. The method of claim 1, wherein the target component comprises at least one of: CPU, mainboard, casing.
3. the method of claim 1, wherein obtaining the actual temperature value of the target component during the operation of the target device comprises:
And periodically acquiring the actual temperature value of the target assembly through a temperature sensor arranged on the target assembly.
4. The method of claim 1, wherein comparing the actual temperature value of the target component with a preset temperature threshold value to obtain a comparison result comprises:
acquiring a preset upper temperature limit value and a preset lower temperature limit value;
taking the upper temperature limit value and the lower temperature limit value as the temperature threshold value, wherein different target assemblies correspond to different upper temperature limit values and different lower temperature limit values;
And comparing the actual temperature value of the target assembly with the upper temperature limit value and the lower temperature limit value to obtain a comparison result.
5. the method of claim 4, wherein controlling the operation mode of the target device based on the comparison comprises:
controlling the target equipment to normally operate under the condition that the actual temperature value is not higher than the temperature lower limit value;
controlling the target equipment to close partial functions under the condition that the actual temperature value is higher than the lower temperature limit value and is not higher than the upper temperature limit value;
And controlling the target equipment to only run part of specific functions under the condition that the actual temperature value is higher than the temperature upper limit value.
6. the method according to any one of claims 1 to 5, wherein the target device is a smartphone terminal.
7. An apparatus operation mode control device, characterized by comprising:
the acquisition module is used for acquiring the actual temperature value of the target component in the operation process of the target equipment;
the comparison module is used for comparing the actual temperature value of the target assembly with a preset temperature threshold value to obtain a comparison result;
And the control module is used for controlling the operation mode of the target equipment according to the comparison result.
8. The apparatus of claim 7, wherein the target component comprises at least one of: CPU, mainboard, casing.
9. The device according to claim 7, wherein the obtaining module is specifically configured to periodically obtain the actual temperature value of the target component through a temperature sensor provided on the target component.
10. the apparatus of claim 7, wherein the comparison module comprises:
The device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring a preset temperature upper limit value and a preset temperature lower limit value;
the generating unit is used for taking the upper temperature limit value and the lower temperature limit value as the temperature threshold value, wherein different target components correspond to different upper temperature limit values and different lower temperature limit values;
and the comparison unit is used for comparing the actual temperature value of the target assembly with the upper temperature limit value and the lower temperature limit value to obtain a comparison result.
11. the apparatus of claim 10, wherein the control module comprises:
the first control unit is used for controlling the target equipment to normally operate under the condition that the actual temperature value is not higher than the temperature lower limit value;
The second control unit is used for controlling the target equipment to close part of functions under the condition that the actual temperature value is higher than the lower temperature limit value and is not higher than the upper temperature limit value;
And the third control unit is used for controlling the target equipment to only run part of specific functions under the condition that the actual temperature value is higher than the temperature upper limit value.
12. An intelligent terminal device comprising: an apparatus operation mode control device as claimed in any one of claims 7 to 11.
13. a network device, comprising: memory, processor and computer program stored on the memory and executable on the processor, characterized in that the processor implements the steps of the method according to any of claims 1 to 6 when executing the computer program.
14. a non-transitory computer readable storage medium, having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the method of any of claims 1 to 6.
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| CN201910662580.3A CN110581920A (en) | 2019-07-22 | 2019-07-22 | Equipment operation mode control method and device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114879823A (en) * | 2022-03-24 | 2022-08-09 | 深圳市广通远驰科技有限公司 | Configuration method and device of temperature protection strategy, electronic equipment and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012065127A (en) * | 2010-09-16 | 2012-03-29 | Rohm Co Ltd | Portable apparatus |
| CN103593032A (en) * | 2013-11-20 | 2014-02-19 | 上海斐讯数据通信技术有限公司 | Electronic device and control method thereof |
| CN106357933A (en) * | 2016-11-11 | 2017-01-25 | 上海与德信息技术有限公司 | Mobile phone temperature regulating method and device |
-
2019
- 2019-07-22 CN CN201910662580.3A patent/CN110581920A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012065127A (en) * | 2010-09-16 | 2012-03-29 | Rohm Co Ltd | Portable apparatus |
| CN103593032A (en) * | 2013-11-20 | 2014-02-19 | 上海斐讯数据通信技术有限公司 | Electronic device and control method thereof |
| CN106357933A (en) * | 2016-11-11 | 2017-01-25 | 上海与德信息技术有限公司 | Mobile phone temperature regulating method and device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114879823A (en) * | 2022-03-24 | 2022-08-09 | 深圳市广通远驰科技有限公司 | Configuration method and device of temperature protection strategy, electronic equipment and storage medium |
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