CN110580403A - electronic device, method and storage medium for determining working temperature of resistor - Google Patents
electronic device, method and storage medium for determining working temperature of resistor Download PDFInfo
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- CN110580403A CN110580403A CN201910976439.0A CN201910976439A CN110580403A CN 110580403 A CN110580403 A CN 110580403A CN 201910976439 A CN201910976439 A CN 201910976439A CN 110580403 A CN110580403 A CN 110580403A
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- 230000008859 change Effects 0.000 claims abstract description 17
- 238000013507 mapping Methods 0.000 claims abstract description 14
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- 238000012545 processing Methods 0.000 claims description 20
- 238000004088 simulation Methods 0.000 claims description 15
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- 230000017525 heat dissipation Effects 0.000 description 5
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- 238000004458 analytical method Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
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Abstract
the invention discloses an electronic device, a method and a storage medium for determining the working temperature of a resistor, wherein the electronic device, the method and the storage medium comprise a memory and a processor connected with the memory, and the processor realizes the following steps when executing: scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software; importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity; setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part. The invention solves the problems that the train brake resistor in the prior art is influenced by the temperature rise allowance, so that the manufacturing cost is increased and the service life is shortened.
Description
Technical Field
The invention relates to the technical field of resistor devices in rail transit, in particular to an electronic device, a method and a storage medium for determining the working temperature of a resistor.
background
in the prior art, the brake resistor plays an important role in absorbing the redundant energy of train braking and ensuring the train running safety. However, with the continuous improvement of the braking speed and the tonnage of the train, the burning loss problem of the resistor is frequent, and the maintenance frequency is continuously improved, which puts higher requirements on the thermal physical performance design of the resistor. The material specifications of the resistor discs of all parts of the existing resistor are consistent, when voltage is applied, the instantaneous temperature rise of all parts of the resistor discs is consistent, and due to the influence of air flow, different temperature field distributions can be generated in a resistor box when a stable state is achieved. If the temperature rise at the highest temperature is taken as a design criterion, the resistor sheet with relatively low temperature can generate overlarge temperature rise allowance, so that the manufacturing cost is increased; if the temperature rise at the lowest temperature is used as a design criterion, the resistance sheet with relatively high temperature exceeds the maximum temperature of the design, which causes burning loss and affects the service life of the resistor. Therefore, it is necessary to provide a preferable material selection scheme for the existing vehicle-mounted brake resistor according to different working temperatures of all parts.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the present invention is directed to an electronic device, a method and a storage medium for determining an operating temperature of a resistor, and aims to solve the problems of increased manufacturing cost and reduced service life of a train brake resistor due to an influence of a temperature rise margin in the prior art.
In order to achieve the above object, the present invention provides an electronic device, a method and a storage medium for determining an operating temperature of a resistor, wherein the electronic device includes a memory and a processor connected to the memory, the processor is configured to execute a program stored in the memory for determining the operating temperature of the resistor, and when the program is executed by the processor, the following steps are implemented:
s1, modeling:
scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software;
S2, area dividing step:
importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity;
s3, processing step:
Setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part.
In one embodiment, the region dividing step further comprises;
E. gridding the model by using gridding software such as ICEM CFD, and storing igs format files in the resistor entity model;
F. introducing the resistor solid model into software mapped by a grid model, and constructing an outflow computational domain model of the whole resistor by using a link function;
G. The whole resistor model was introduced into the ICEM CFD for grid division, and each resistor was divided into 3610 grid cells, the number of which was 86640.
in one embodiment, the processing steps are only set as the air inlet air speed, the air outlet pressure and the wall surface conditions, and the boundaries of various types are set as follows:
entry boundary conditions:
setting air among the resistance cards as incompressible fluid, so that when the resistance cards are subjected to convective heat transfer numerical simulation, a speed inlet boundary condition is adopted at an inlet, the inlet flow speed is 20m/s, and the temperature of the air is set to be 25 ℃;
exit boundary conditions:
The surface pressure is set to one atmosphere and the fluid temperature and velocity at the outlet are free boundary conditions;
Wall surface conditions:
the wall boundary condition is essentially the outer boundary of the fluid region, and an adiabatic boundary condition is defined at the wall boundary when solving the energy conservation equation.
In one embodiment, the boundary conditions of the model are set assuming that the air is an incompressible fluid, the inlet flow rate is set to 20m/s, the inlet temperature is set to 298K, the outlet boundary conditions are set to free boundary conditions, and the wall conditions are set to adiabatic boundaries.
In one embodiment, after the processing step is completed, time is divided equally to select a thermal model of the resistor in each state, thermal change of each part is analyzed to determine a temperature change range, resistance card materials with thermal physical properties suitable for each temperature area are matched, resistance card materials with better thermal physical properties are used in a high-temperature area, and common resistance materials meeting conditions are used in a relatively low-temperature area.
A method of determining an operating temperature of a resistor, the method comprising the steps of:
Modeling:
scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software;
a region dividing step:
Importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity;
The processing steps are as follows:
setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part.
in one embodiment, the region dividing step further comprises;
E. gridding the model by using gridding software such as ICEM CFD, and storing igs format files in the resistor entity model;
F. introducing the resistor solid model into software mapped by a grid model, and constructing an outflow computational domain model of the whole resistor by using a link function;
G. the whole resistor model was introduced into the ICEM CFD for grid division, and each resistor was divided into 3610 grid cells, the number of which was 86640.
In one embodiment, the processing steps are only set as the air inlet air speed, the air outlet pressure and the wall surface conditions, and the boundaries of various types are set as follows:
entry boundary conditions:
setting air among the resistance cards as incompressible fluid, so that when the resistance cards are subjected to convective heat transfer numerical simulation, a speed inlet boundary condition is adopted at an inlet, the inlet flow speed is 20m/s, and the temperature of the air is set to be 25 ℃;
exit boundary conditions:
the surface pressure is set to one atmosphere and the fluid temperature and velocity at the outlet are free boundary conditions;
wall surface conditions:
the wall boundary condition is essentially the outer boundary of the fluid region, and an adiabatic boundary condition is defined at the wall boundary when solving the energy conservation equation.
In one embodiment, after the processing step is completed, time is divided equally to select a thermal model of the resistor in each state, thermal change of each part is analyzed to determine a temperature change range, resistance card materials with thermal physical properties suitable for each temperature area are matched, resistance card materials with better thermal physical properties are used in a high-temperature area, and common resistance materials meeting conditions are used in a relatively low-temperature area.
A computer-readable storage medium having stored thereon a program for determining an operating temperature of a resistor, the program being executable by at least one processor to cause the at least one processor to perform the steps of the programmed method of determining an operating temperature of a resistor.
the invention has the following beneficial effects:
when voltage is applied to the resistive sheets, the ratio of the high-temperature resistance of each resistive sheet to the load limit is approximately the same as the voltage increases. The design of the resistance card is prevented from generating excessive redundancy or deficiency. The whole performance of the resistor can be improved and the maintenance rate can be reduced on the premise of controlling the total cost of the resistor.
drawings
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of the connection of the memory, the processor and the program for determining the operating temperature of the resistor in the electronic device according to the present invention.
FIG. 2 is a schematic diagram of the procedure for determining the operating temperature of the resistor and the connections of the modules according to the present invention.
Fig. 3 is a schematic diagram of the operational flow of the resistor operating temperature program according to the present invention.
fig. 4 is a brake resistance band diagram of the vehicle brake resistor according to the embodiment of the invention.
fig. 5 is a grid division model diagram of the vehicle-mounted brake resistor according to the embodiment of the invention.
Fig. 6 is a heat dissipation simulation model of the vehicle-mounted brake resistor according to the embodiment of the invention.
Fig. 7 (a) to (e) are graphs of temperature simulations of the inside of the resistor at the time when the intake air flow rate is 20m/s and the time is 5s, 10s, 15s, 20s, and 25s, respectively.
[ main parts/assembly reference numerals ] description
Detailed Description
the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
it should be noted that all the directional indicators (e.g., upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement condition, etc. in a specific state (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
Descriptions in this specification as relating to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to any indicated technical feature or quantity. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral molding; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
in addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Example 1:
Referring to fig. 1 to 7, an electronic device, a method and a storage medium for determining an operating temperature of a resistor, where the electronic device 1 includes a memory 3 and a processor 2 connected to the memory 3, and in this embodiment, the electronic device 1 may include, but is not limited to, the memory 3 and the processor 2. It is noted that fig. 1 only shows the electronic device 1, but it is to be understood that not all of the shown components are required to be implemented, and that more or less components may be implemented instead.
The memory 3 includes at least one type of computer-readable storage medium, which includes a flash memory, a hard disk, a multimedia card, a card-type memory (e.g., SD or DX memory, etc.), a Random Access Memory (RAM), a Static Random Access Memory (SRAM), a Read Only Memory (ROM), an Electrically Erasable Programmable Read Only Memory (EEPROM), a Programmable Read Only Memory (PROM), a magnetic memory, a magnetic disk, an optical disk, and the like. In some embodiments, the storage 3 may be an internal storage unit of the electronic device 1, such as a hard disk or a memory of the electronic device 1. In other embodiments, the memory 3 may also be an external storage device of the electronic apparatus 1, such as a plug-in hard disk provided on the electronic apparatus 1, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like.
Of course, the memory 3 may also comprise both an internal memory unit of the electronic apparatus 1 and an external memory device thereof. In the present embodiment, the memory 3 is generally used for storing an operating system and various application software installed in the electronic device 1, such as a program 4 for determining the operating temperature of the resistor. Further, the memory 3 may also be used to temporarily store various types of data that have been output or are to be output.
The processor 2 may be a Central Processing Unit (CPU), controller, microcontroller, microprocessor, or other data Processing chip in some embodiments. The processor 2 is typically used to control the overall operation of the electronic device 1.
In this embodiment, the processor 2 is used to run program codes stored in the memory 3 or process data, such as a running program 4 that determines the operating temperature of the resistor. The processor 2 is configured to execute a program 4 stored in the memory 3 for determining an operating temperature of the resistor, the program 4 for determining the operating temperature of the resistor when executed by the processor 2 implementing the steps of:
s1, modeling:
scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software;
S2, area dividing step:
importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity;
s3, processing step:
Setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part.
referring to fig. 5, a model is shown being gridded using an ICEM CFD. Storing an igs format file in a resistance card entity model, introducing the igs format file into DM of an asys workbench, constructing an outflow calculation domain model of the whole resistance card by using an enclosure function, and introducing the whole model into ICEM CFD for grid division. Each resistor sheet is divided into 3610 grid cells, and the number of the whole resistor grid cells reaches 86640.
Referring to FIG. 7, the simulation result of heat dissipation of the resistor temperature field distribution at an inlet wind speed of 20m/s is shown. And respectively selecting temperature field distribution patterns at 5s, 10s, 15s, 20s and 25s in a complete temperature rise simulation of the braking process.
From the instantaneous temperature distribution diagram of the resistor at the time of 5s in the graph (a), the temperature of the resistor is obviously lower than the initial set value and the temperature difference of each resistor is not large because the wind speed is large, the braking power in the heating starting section is not large, and the heat carried by the air is larger than the heat generated by the heating of the brake. But the braking power increases rapidly and the temperature increases more rapidly in the first 10s to 15s period.
it can be seen from the graph (d) that the temperature difference of the resistor sheet reaches 300 ℃ at 20 s.
in the graph (e), the temperature difference of the resistor disc reaches 230 ℃ when the vehicle braking is stopped. Because the air at the air inlet is not heated, the heat dissipation effect of the first two resistance units is good, and the temperature is about 330 ℃. And the temperature of the resistor disc at the outlet is nearly 600 ℃ due to higher air temperature of the air outlet and small heat exchange amount.
According to the simulation analysis of the temperature field of the resistor, the temperature difference of the resistance unit at the air inlet and the air outlet is large when the resistance unit works, the resistance unit material close to the air outlet needs higher heat resistance, and the material Ni30Cr20 is selected to have high temperature resistance in thermophysical property, so that the resistance is reduced under the influence of high temperature. The resistance material near the air inlet can be made of SUS304 common heat-resistant alloy.
the invention solves the problem of local burning loss of the resistor disc under the existing train brake resistor structure, can control the cost, can prolong the service life of the whole resistor and avoids the influence on the use of the whole equipment due to local burning loss.
example 2:
Referring to fig. 5, preferably, the region dividing step further includes;
E. Gridding the model by using gridding software such as ICEM CFD, and storing igs format files in the resistor entity model;
F. introducing the resistor solid model into software mapped by a grid model, and constructing an outflow computational domain model of the whole resistor by using a link function;
G. the whole resistor model was introduced into the ICEM CFD for grid division, and each resistor was divided into 3610 grid cells, the number of which was 86640.
Example 3:
referring to fig. 7, preferably, the processing steps are set only at the inlet air speed, the outlet pressure and the wall surface conditions, and the boundaries of each type are set as follows:
entry boundary conditions:
setting air among the resistance cards as incompressible fluid, so that when the resistance cards are subjected to convective heat transfer numerical simulation, a speed inlet boundary condition is adopted at an inlet, the inlet flow speed is 20m/s, and the temperature of the air is set to be 25 ℃;
exit boundary conditions:
the surface pressure is set to one atmosphere and the fluid temperature and velocity at the outlet are free boundary conditions;
Wall surface conditions:
the wall boundary condition is essentially the outer boundary of the fluid region, and an adiabatic boundary condition is defined at the wall boundary when solving the energy conservation equation.
Referring to fig. 6 and 7, preferably, the boundary conditions of the model are set assuming that air is an incompressible fluid, the inlet flow rate is set to 20m/s, the inlet temperature is set to 298K, the outlet boundary conditions are set to free boundary conditions, and the wall surface conditions are set to adiabatic boundaries.
Preferably, after the processing step is completed, the thermal model of the resistor in each state is selected by equally dividing time, the thermal change of each part is analyzed to determine the temperature change range, the resistance card material with the thermal physical property suitable for each temperature area is matched, the resistance card material with the better thermal physical property is used in the high temperature area, and the common resistance material meeting the condition is used in the relatively low temperature area.
a method of determining an operating temperature of a resistor, the method comprising the steps of:
modeling:
Scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software;
a region dividing step:
Importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity;
the processing steps are as follows:
Setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part.
Preferably, the region dividing step further comprises;
E. gridding the model by using gridding software such as ICEM CFD, and storing igs format files in the resistor entity model;
F. Introducing the resistor solid model into software mapped by a grid model, and constructing an outflow computational domain model of the whole resistor by using a link function;
G. the whole resistor model was introduced into the ICEM CFD for grid division, and each resistor was divided into 3610 grid cells, the number of which was 86640.
preferably, the processing steps are only set with air inlet air speed, air outlet pressure and wall surface conditions, and the various types of boundaries are set as follows:
Entry boundary conditions:
setting air among the resistance cards as incompressible fluid, so that when the resistance cards are subjected to convective heat transfer numerical simulation, a speed inlet boundary condition is adopted at an inlet, the inlet flow speed is 20m/s, and the temperature of the air is set to be 25 ℃;
exit boundary conditions:
The surface pressure is set to one atmosphere and the fluid temperature and velocity at the outlet are free boundary conditions;
wall surface conditions:
the wall boundary condition is essentially the outer boundary of the fluid region, and an adiabatic boundary condition is defined at the wall boundary when solving the energy conservation equation.
Before simulation solving, the solving method and parameters of the solver need to be set. Convergence residual is set to 1e-5. In CFX, 1e-5Can be obtained industriallythe integrated quantity value of (2). And setting air flowing time and resistor disc electrifying time to be 25s in the simulation process. Setting the number of iteration steps to 100 in CFX converges the calculation result.
preferably, after the processing step is completed, the thermal model of the resistor in each state is selected by equally dividing time, the thermal change of each part is analyzed to determine the temperature change range, the resistance card material with the thermal physical property suitable for each temperature area is matched, the resistance card material with the better thermal physical property is used in the high temperature area, and the common resistance material meeting the condition is used in the relatively low temperature area.
a computer readable storage medium having stored thereon a program 4 for determining an operating temperature of a resistor, the program 4 for determining an operating temperature of a resistor being executable by at least one processor 2 to cause the at least one processor 2 to perform the steps of the method of program 4 for determining an operating temperature of a resistor.
The working principle of the invention is as follows:
The resistor determines the working temperature change range of each part of the resistor through the heat dissipation simulation analysis of the resistor body, the heat dissipation simulation is numerically solved through three-dimensional modeling, hexahedron gridding division and boundary conditions of a set model, and finally a resistor disc material with the appropriate thermophysical property is selected according to the temperature change range of each part.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. an electronic device, comprising a memory, and a processor coupled to the memory, the processor configured to execute a program stored on the memory that determines an operating temperature of a resistor, the program when executed by the processor implementing the steps of:
S1, modeling:
Scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software;
s2, area dividing step:
Importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity;
S3, processing step:
Setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part.
2. The electronic device of claim 1, wherein the region dividing step further comprises:
E. gridding the model by using gridding software such as ICEM CFD, and storing igs format files in the resistor entity model;
F. introducing the resistor solid model into software mapped by the grid model, and constructing an outflow computational domain model of the whole resistor by using a link function;
G. the whole resistor model was introduced into the ICEM CFD for grid division, and each resistor was divided into 3610 grid cells, the number of which was 86640.
3. the electronic device for determining the operating temperature of a resistor according to claim 1, wherein the processing step sets only the inlet wind speed, the outlet pressure and the wall conditions, and the boundaries of the types are set as follows:
Entry boundary conditions:
setting air among the resistance cards as incompressible fluid, so that when the resistance cards are subjected to convective heat transfer numerical simulation, a speed inlet boundary condition is adopted at an inlet, the inlet flow speed is 20m/s, and the temperature of the air is set to be 25 ℃;
Exit boundary conditions:
The surface pressure is set to one atmosphere and the fluid temperature and velocity at the outlet are free boundary conditions;
wall surface conditions:
The wall boundary condition is essentially the outer boundary of the fluid region, and an adiabatic boundary condition is defined at the wall boundary when solving the energy conservation equation.
4. the electronic device for determining the operating temperature of a resistor according to claim 3, wherein the boundary conditions of the model are set assuming that air is an incompressible fluid, an inlet flow rate of 20m/s and an inlet temperature of 298K, an outlet boundary condition is set as a free boundary condition, and a wall condition is set as an adiabatic boundary.
5. the electronic device for determining the operating temperature of the resistor as claimed in claim 1, wherein the processing step is performed by equally dividing time to select the thermal model of the resistor in each state, analyzing the thermal variation of each part to determine the temperature variation range, matching the resistor sheet material with thermal physical properties suitable for each temperature area, using the resistor sheet material with better thermal physical properties in the high temperature area, and using the common resistor material meeting the conditions in the relatively low temperature area.
6. A method of determining an operating temperature of a resistor, the method comprising the steps of:
modeling:
Scanning and saving the outer surface of the body of the solid resistor into an editable model format through modeling scanning software;
a region dividing step:
Importing the scanned editable resistor model file into model mapping software, carrying out hexahedron mesh area division on a resistor main body and a curved surface fluid area by using model mapping, establishing a model corresponding to the entity one by one in a topological space, carrying out mesh division on the model, and automatically mapping the model to a geometric entity;
the processing steps are as follows:
setting boundary conditions of the model to carry out numerical solution, and finally selecting a resistance card material with the thermal physical property suitable for the boundary conditions according to the temperature change range of each part.
7. The method of determining an operating temperature of a resistor of claim 6, wherein the zone dividing step further comprises;
E. gridding the model by using gridding software such as ICEM CFD, and storing igs format files in the resistor entity model;
F. introducing the resistor solid model into software mapped by a grid model, and constructing an outflow computational domain model of the whole resistor by using a link function;
G. The whole resistor model was introduced into the ICEM CFD for grid division, and each resistor was divided into 3610 grid cells, the number of which was 86640.
8. the method of claim 6, wherein the processing step sets only inlet wind speed, outlet pressure, and wall conditions, and the type of boundary is set as follows:
entry boundary conditions:
Setting air among the resistance cards as incompressible fluid, so that when the resistance cards are subjected to convective heat transfer numerical simulation, a speed inlet boundary condition is adopted at an inlet, the inlet flow speed is 20m/s, and the temperature of the air is set to be 25 ℃;
exit boundary conditions:
the surface pressure is set to one atmosphere and the fluid temperature and velocity at the outlet are free boundary conditions;
wall surface conditions:
the wall boundary condition is essentially the outer boundary of the fluid region, and an adiabatic boundary condition is defined at the wall boundary when solving the energy conservation equation.
9. The method for determining the operating temperature of the resistor as claimed in claim 6, wherein the processing step is performed by equally dividing time to select the thermal model of the resistor in each state, analyzing the thermal variation of each part to determine the temperature variation range, matching the resistor sheet material with the thermal physical property suitable for each temperature area, using the resistor sheet material with the better thermal physical property in the high temperature area, and using the common resistor material meeting the condition in the relatively low temperature area.
10. a computer-readable storage medium, having stored thereon a program for determining an operating temperature of a resistor, the program being executable by at least one processor for causing the at least one processor to carry out the steps of the programmed method for determining an operating temperature of a resistor as claimed in any one of claims 6-9.
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| CN104217061A (en) * | 2014-07-08 | 2014-12-17 | 国家电网公司 | Temperature field simulation design method for low-voltage distribution cabinet |
| CN104537190A (en) * | 2015-01-21 | 2015-04-22 | 深圳市富临特科技有限公司 | Vehicle-mounted brake resistor for railway vehicles and simulation design method and structure optimization method of vehicle-mounted brake resistor |
| CN204463122U (en) * | 2015-01-21 | 2015-07-08 | 深圳市富临特科技有限公司 | Optimizing structure of the vehicle-mounted braking resistor of rail vehicle |
| CN106055387A (en) * | 2016-06-22 | 2016-10-26 | 华南理工大学 | Radial temperature simulation method for steel-cored aluminum strand based on ANSYS APDL (ANSYS Parametric Design Language) and ANSYS CFX |
| US20170103151A1 (en) * | 2015-10-10 | 2017-04-13 | John Michael Snider, SR. | Methods for constructing surfaces for optimizing fluid flow |
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2019
- 2019-10-14 CN CN201910976439.0A patent/CN110580403B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104217061A (en) * | 2014-07-08 | 2014-12-17 | 国家电网公司 | Temperature field simulation design method for low-voltage distribution cabinet |
| CN104537190A (en) * | 2015-01-21 | 2015-04-22 | 深圳市富临特科技有限公司 | Vehicle-mounted brake resistor for railway vehicles and simulation design method and structure optimization method of vehicle-mounted brake resistor |
| CN204463122U (en) * | 2015-01-21 | 2015-07-08 | 深圳市富临特科技有限公司 | Optimizing structure of the vehicle-mounted braking resistor of rail vehicle |
| US20170103151A1 (en) * | 2015-10-10 | 2017-04-13 | John Michael Snider, SR. | Methods for constructing surfaces for optimizing fluid flow |
| CN106055387A (en) * | 2016-06-22 | 2016-10-26 | 华南理工大学 | Radial temperature simulation method for steel-cored aluminum strand based on ANSYS APDL (ANSYS Parametric Design Language) and ANSYS CFX |
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