CN110577817A - High-flexibility organic silicon adhesive and preparation method thereof - Google Patents
High-flexibility organic silicon adhesive and preparation method thereof Download PDFInfo
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- CN110577817A CN110577817A CN201910856717.9A CN201910856717A CN110577817A CN 110577817 A CN110577817 A CN 110577817A CN 201910856717 A CN201910856717 A CN 201910856717A CN 110577817 A CN110577817 A CN 110577817A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Abstract
The invention belongs to the technical field of high polymer materials, and provides a high-flexibility organic silicon adhesive and a preparation method thereof. The high-flexibility organic silicon adhesive comprises a component A and a component B, wherein the component A comprises 10-15 parts by weight of acrylate compounds, 20-30 parts by weight of vinyl-terminated polysiloxane, 1-2 parts by weight of curing agents and the component B comprises 15-20 parts by weight of epoxy resin compounds, 5-10 parts by weight of flexibilizers and 0.001-0.005 part by weight of platinum catalysts. The acrylate compound reduces the curing rate of the organic silicon adhesive, improves the wettability between the coating material and the adhesive, reduces the surface tension, enables the adhesive coated on the surface of the material to be cured and uniformly distributed, and has good yellow spot resistance. The vinyl-terminated polysiloxane and the epoxy resin are subjected to addition reaction, so that the adhesion performance of the organic silicon adhesive is effectively promoted. The preparation method of the high-flexibility organic silicon adhesive provided by the invention is simple, and the obtained high-flexibility organic silicon adhesive has high flexibility, high adhesive strength and good yellow spot resistance.
Description
Technical Field
The invention belongs to the technical field of high polymer materials, and particularly relates to a high-flexibility organic silicon adhesive and a preparation method thereof.
Background
The organic silicon adhesive is mainly divided into an adhesive taking organic silicon resin as a base material and an adhesive taking silicon rubber as a base material. The former is composed of a three-dimensional structure with a silicon-oxygen bond as a main chain, and can be further condensed into highly crosslinked resin at high temperature; the latter are high molecular weight elastomers with a linear silicon-oxygen bond as the backbone. These two polymers have different crosslinking densities and exhibit different final physical forms and properties. The organic silicon adhesive has the advantages of high and low temperature resistance, corrosion resistance, radiation resistance, excellent electrical insulation, water resistance and the like, and can be bonded with metal, plastic, rubber, glass, ceramic and the like. The adhesive is used as a good adhesive for coating, encapsulating, pouring, bonding and the like of electrical elements.
however, the currently available silicone adhesives generally have the disadvantage of being fragile. The brittleness of the organic silicon adhesive means that after the adhesive is cured, the adhesive layer has poor toughness, is easy to crack and has poor weather resistance, and even has the phenomenon of falling off. Causes of embrittlement include: the polysiloxane has small molecular chain flexibility, and a cross-linked structure is not easy to deform, easy to crack, impact-resistant and poor in fatigue resistance after curing.
Disclosure of Invention
The present invention is made to solve the above problems, and an object of the present invention is to provide a highly flexible silicone adhesive and a method for producing the same.
The invention provides a high-flexibility organic silicon adhesive which has the characteristics that: the component A comprises the following components in parts by weight: 10-15 parts of acrylate compounds, 20-30 parts of vinyl-terminated polysiloxane and a component B, wherein the component B comprises the following components in parts by weight: 15-20 parts of epoxy resin compounds, 5-10 parts of flexibilizers, 0.001-0.005 part of platinum catalysts and 1-2 parts of curing agents.
The high-flexibility silicone adhesive provided by the invention can also have the following characteristics: wherein the acrylate compound is any one of butyl acrylate, alpha-nitropropene ethyl ester, alpha-nitropropene butyl ester, alpha-nitropropene isobutyl ester, alpha-methoxy nitropropene ethyl ester, hydroxypropyl acrylate, methyl methacrylate or urethane acrylate.
The high-flexibility silicone adhesive provided by the invention can also have the following characteristics: wherein the epoxy resin compound is any one of bisphenol F type epoxy resin, polybutadiene resin, tetraphenolethane type epoxy resin, bisphenol A type epoxy resin or o-cresol formaldehyde type polyepoxy resin.
the high-flexibility silicone adhesive provided by the invention can also have the following characteristics: wherein, the toughening agent is hydroxyl-terminated polybutadiene or nano silicon dioxide.
The high-flexibility silicone adhesive provided by the invention can also have the following characteristics: wherein the platinum catalyst is a vinyl siloxane-Pt coordination compound.
the high-flexibility silicone adhesive provided by the invention can also have the following characteristics: wherein the curing agent is any one or more than two of m-phenylenediamine, triethanolamine, spiro amine or N- (3-methyl) -N, N-dimethyl urea.
The invention also provides a preparation method of the high-flexibility organic silicon adhesive, which is characterized by comprising the following steps of: step 1, under the protection of inert gas, adding an acrylate compound, vinyl-terminated polysiloxane and a curing agent into a reaction device, stirring, heating to 50-60 ℃, reacting for 15-20 min under stirring, cooling to room temperature, and filtering to obtain a transparent liquid component A; step 2, under the protection of inert gas, adding an epoxy resin compound, a toughening agent and a platinum catalyst into a reaction device, heating to 40-50 ℃, reacting for 25-35 min, cooling to room temperature, and filtering to obtain a transparent liquid component B; and 3, mixing the component A and the component B, and heating to obtain the high-flexibility organic silicon adhesive, wherein the high-flexibility organic silicon adhesive is any one of the high-flexibility organic silicon adhesives.
In the preparation method of the high-flexibility organic silicon adhesive provided by the invention, the preparation method also has the following characteristics: wherein the heating temperature in the step 3 is 50-80 ℃.
Action and Effect of the invention
According to the high-flexibility organic silicon adhesive provided by the invention, the acrylate compound can reduce the curing rate of the organic silicon adhesive, improve the wettability between the coating material and the adhesive, reduce the surface tension, and enable the organic silicon adhesive coated on the surface of the material to be cured and uniformly distributed, so that the high-flexibility organic silicon adhesive has good yellow spot resistance.
In addition, because the epoxy resin compound has good adhesive property, the epoxy resin compound can perform nucleophilic addition reaction with double bonds in the acrylate compound, and the acrylate compound can be well combined with vinyl-terminated polysiloxane substances to organically connect main components in the high-flexibility organic silicon adhesive together, so that the adhesive strength and the yellow spot resistance of the high-flexibility organic silicon adhesive are enhanced.
In addition, the dosage of the curing agent is only 1-2 parts, so that the prepared high-flexibility organic silicon adhesive is low in hardness and similar to jelly in softness, and the flexibility of the adhesive is guaranteed.
In addition, the dosage of the acrylate compound and the epoxy resin compound also determines the bonding strength and the yellow spot resistance of the high-flexibility organic silicon adhesive, and in order to achieve a better effect, the dosage of the acrylate compound is selected to be 20-25 parts, and the dosage of the epoxy resin compound is selected to be 15-20 parts.
In addition, the catalytic action of the platinum catalyst allows for better reaction of component a with the various species in component B when component a is mixed with component B and heated to form the target product.
According to the preparation method of the high-flexibility organic silicon adhesive, the weighed raw material components are sequentially added into a stirring kettle to be mixed and stirred, so that the component A or the component B can be obtained, and then the component A and the component B are mixed and heated, so that a target product can be obtained. The preparation process is simple, the whole production time is saved, and the production efficiency is greatly improved.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the high-flexibility organic silicon adhesive and the preparation method thereof are specifically described in the following embodiments.
The raw materials used in the examples of the present invention were all purchased from general commercial sources.
In the embodiment of the invention, the preparation method of the high-flexibility organic silicon adhesive comprises the following steps:
step 1, adding an acrylate compound, vinyl-terminated polysiloxane and a curing agent into a reaction device under the protection of inert gas, stirring, heating to 50-60 ℃, reacting for 15-20 min under stirring, cooling to room temperature, and filtering to obtain a transparent liquid component A.
The specific operation is as follows: weighing 10-15 parts by weight of acrylate compound, 20-30 parts by weight of vinyl-terminated polysiloxane and 1-2 parts by weight of curing agent, adding into a reaction device under the protection of inert gas, stirring, heating to 50-60 ℃, reacting for 15-20 min under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
The acrylate compound is any one of butyl acrylate, alpha-nitropropene ethyl ester, alpha-nitropropene butyl ester, alpha-nitropropene isobutyl ester, alpha-methoxy nitropropene ethyl ester, hydroxypropyl acrylate, methyl methacrylate or urethane acrylate.
The molecular weight of the vinyl-terminated polysiloxane is 400cps to 2000cps, and the structural formula is as follows:
The curing agent is one or more than two of m-phenylenediamine, triethanolamine, spiro amine or N- (3-methyl) -N, N-dimethyl urea.
And 2, under the protection of inert gas, adding an epoxy resin compound, a toughening agent and a platinum catalyst into a reaction device, heating to 40-50 ℃, reacting for 25-35 min, cooling to room temperature, and filtering to obtain a transparent liquid component B.
the specific operation is as follows: weighing 15-20 parts of epoxy resin compound, 5-10 parts of toughening agent and 0.001-0.005 part of platinum catalyst in parts by weight, adding the epoxy resin compound, the toughening agent and the platinum catalyst into a reaction device under the protection of gas, heating to 40-50 ℃, reacting for 25-35 min, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing inert gas for later use.
The epoxy resin compound is any one of bisphenol F type epoxy resin, polybutadiene resin, tetraphenolethane type epoxy resin, bisphenol A type epoxy resin or o-cresol formaldehyde type polyepoxy resin.
The toughening agent is nano silicon dioxide or hydroxyl-terminated polybutadiene with the thickness of 500cps to 5000 cps. Hydroxyl-terminated polybutadiene of 1000cps is preferred.
The platinum catalyst is a vinyl siloxane-Pt coordination compound.
And 3, mixing the component A and the component B and heating to obtain the high-flexibility organic silicon adhesive.
The specific operation is as follows: and mixing the component A and the component B, stirring for 10-20 min, reducing pressure, defoaming, heating to 50-80 ℃, taking out after 10-20 min, and cooling to room temperature to obtain the high-flexibility organic silicon adhesive.
Based on the principle of similar intermiscibility, the ester group of the acrylate enables the adhesive to be easily stripped and cleaned by green solvents such as dimethyl carbonate, butyl acetate and the like. Coating the prepared high-flexibility organic silicon adhesive on the surface of a glass, PC or PET transparent base material by using a manual or automatic machine, and heating, curing and heating for 10-30 min at 40-80 ℃ to realize the adhesion; the high-flexibility adhesive coated on the surface of the glass, PC or PET transparent substrate can be stripped and cleaned by dimethyl carbonate or butyl acetate.
< example 1>
step 1, weighing 11 parts of butyl acrylate, 25 parts of 400cps vinyl-terminated polysiloxane and 1.1 parts of m-phenylenediamine by weight, adding into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
And 2, weighing 18 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of flexibilizer 500cps hydroxyl-terminated polybutadiene and 0.002 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the materials into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when the high-flexibility organic silicon adhesive is used, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 20 minutes, and cooling to room temperature to obtain the high-flexibility organic silicon adhesive.
< example 2>
Step 1, weighing 14 parts of butyl acrylate serving as an acrylate compound, 28 parts of 600cps vinyl-terminated polysiloxane and 1.01 parts of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
Step 2, weighing 15 parts by weight of epoxy resin compound bisphenol F epoxy resin, 7 parts by weight of flexibilizer 1000cps hydroxyl-terminated polybutadiene and 0.002 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the mixture into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when the high-flexibility organic silicon adhesive is used, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 20 minutes, and cooling to room temperature to obtain the high-flexibility organic silicon adhesive.
< example 3>
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 30 parts of 1200cps vinyl-terminated polysiloxane and 1.2 parts of N- (3-methyl) -N, N-dimethyl urea in parts by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
and 2, weighing 15 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 7 parts by weight of hydroxyl-terminated polybutadiene with a flexibilizer of 5000cps and 0.005 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the flexibilizer of 5000cps and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 20 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 4>
Step 1, weighing 10 parts of butyl acrylate serving as an acrylate compound, 20 parts of 2000cps vinyl-terminated polysiloxane, 0.8 part of m-phenylenediamine and 0.7 part of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 15 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 7 parts by weight of flexibilizer end 1000cps hydroxyl polybutadiene and 0.002 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the materials into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 65 ℃, taking out after 20 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 5>
Step 1, weighing 14 parts of butyl acrylate serving as an acrylate compound, 25 parts of vinyl-terminated polysiloxane with the thickness of 800cps, 0.3 part of m-phenylenediamine and 0.8 part of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 20 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of toughening agent nano silicon dioxide and 0.002 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 20 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 6>
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 21 parts of 1200cps vinyl-terminated polysiloxane, 0.4 part of m-phenylenediamine and 0.9 part of spirocyclic amine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
Step 2, weighing 16 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of toughening agent nano silicon dioxide and 0.002 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the materials into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing the inert gas for later use.
and 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 7>
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 23 parts of 980cps vinyl-terminated polysiloxane, 0.2 part of m-phenylenediamine and 1.2 parts of spirocyclic amine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 18 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of toughening agent nano silicon dioxide and 0.005 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 8>
Step 1, weighing 10 parts of butyl acrylate serving as an acrylate compound, 23 parts of 1900cps vinyl-terminated polysiloxane and 1.5 parts of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
and 2, weighing 18 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of toughening agent nano silicon dioxide and 0.003 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 9>
Step 1, weighing 14 parts of butyl acrylate serving as an acrylate compound, 23 parts of vinyl-terminated polysiloxane of 500cps and 1.7 parts of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of toughening agent nano silicon dioxide and 0.005 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing the inert gas for later use.
and 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
< example 10>
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 22 parts of vinyl-terminated polysiloxane with the thickness of 1000cps and 2.0 parts of N- (3-methyl) -N, N-dimethyl urea in parts by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
And 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 5 parts by weight of toughening agent nano silicon dioxide and 0.004 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
comparative example 1 (without toughener)
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 20 parts of vinyl-terminated polysiloxane with the thickness of 1000cps and 1.5 parts of m-phenylenediamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 15 parts by weight of epoxy resin compound bisphenol F type epoxy resin and 0.005 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating the mixture to 45 ℃, reacting the mixture for 30 minutes, cooling the mixture to room temperature, filtering the mixture to obtain a transparent liquid component B, and sealing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
Comparative example 2 (hydroxyl-terminated polybutadiene in an amount of 3 parts)
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 22 parts of vinyl-terminated polysiloxane with the thickness of 800cps and 1.4 parts of m-phenylenediamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 3 parts by weight of flexibilizer 1000cps hydroxyl-terminated polybutadiene and 0.004 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the materials into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
Comparative example 3 (hydroxyl-terminated polybutadiene in an amount of 15 parts)
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 22 parts of 900cps vinyl-terminated polysiloxane and 1.8 parts of N- (3-methyl) -N, N-dimethyl urea in parts by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
And 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 15 parts by weight of flexibilizer 1000cps hydroxyl-terminated polybutadiene and 0.004 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the materials into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
Comparative example 4 (hydroxyl-terminated polybutadiene in an amount of 11 parts)
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 22 parts of 1000cps vinyl-terminated polysiloxane and 1.3 parts of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
and 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 11 parts by weight of flexibilizer 1000cps hydroxyl-terminated polybutadiene and 0.004 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the materials into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
Comparative example 5 (amount of nano-silica: 3 parts)
Step 1, weighing 15 parts of butyl acrylate, 22 parts of 900cps vinyl-terminated polysiloxane and 1.3 parts of triethanolamine, adding into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing and storing the inert gas for later use.
And 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 3 parts by weight of toughening agent nano silicon dioxide and 0.004 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
Comparative example 6 (Nano-silica in 20 parts)
Step 1, weighing 15 parts of butyl acrylate serving as an acrylate compound, 22 parts of 1500cps vinyl-terminated polysiloxane and 1.3 parts of triethanolamine by weight, adding the mixture into a reaction device under the protection of inert gas, stirring, heating to 50 ℃, reacting for 20 minutes under stirring, cooling to room temperature, filtering to obtain a transparent liquid component A, and sealing the inert gas for later use.
And 2, weighing 19 parts by weight of epoxy resin compound bisphenol F type epoxy resin, 20 parts by weight of toughening agent nano silicon dioxide and 0.004 part by weight of platinum catalyst vinyl siloxane-Pt coordination compound, adding the epoxy resin compound bisphenol F type epoxy resin, the toughening agent nano silicon dioxide and the platinum catalyst vinyl siloxane-Pt coordination compound into a reaction device under the protection of inert gas, heating to 45 ℃, reacting for 30 minutes, cooling to room temperature, filtering to obtain a transparent liquid component B, and sealing and storing the inert gas for later use.
And 3, when in use, mixing the component A and the component B, adding the mixture into a reaction bottle, stirring for 15 minutes, decompressing and exhausting for 15 minutes, exhausting bubbles in a reaction system, heating to 55 ℃, taking out after 15 minutes, and cooling to room temperature to obtain the high-flexibility organic silica gel adhesive.
Effects and effects of the embodiments
The high-flexibility silicone adhesives prepared in the above examples and comparative examples were subjected to performance tests.
1. Measurement of light transmittance and refractive index
taking a colorless transparent liquid obtained by mixing the component A and the component B in each embodiment example, after removing bubbles by decompression, respectively adding a small amount of the colorless transparent liquid into a quartz dish, heating to 60 ℃, taking out after 20 minutes, cooling to room temperature for solidification, and testing the light transmittance, wherein the adopted instrument is a DRTG-81 split type light transmittance tester.
Taking a colorless transparent liquid obtained by mixing the component A and the component B in each embodiment example, after removing bubbles by decompression, coating a small amount of the colorless transparent liquid on a glass plate with the length of 20cm, the width of 10cm and the thickness of 3 mm respectively, wherein the thickness of the coated organic silicon adhesive is 0.5mm, heating to 60 ℃, taking out after 20 minutes, cooling to room temperature for curing, and testing the refractive index, wherein the adopted instrument is a DR-M4 multi-wavelength Abbe refractometer (the wavelength is 589 nm).
The light transmittance and the refractive index are measured at room temperature of 25 ℃, and the test results are shown in the following table 1:
TABLE 1 determination of light transmittance and refractive index of cured organosilicon adhesive
2. Testing of extreme cold and hot cycles:
Taking a PC panel, sealing the edge of the PC panel by using a molding adhesive to prepare a transparent panel with the frame height of 1mm, then uniformly coating the organic silicon adhesive prepared in each embodiment on the PC panel, wherein the coating thickness is 1mm, horizontally placing the PC panel until a heating platform is heated to 120 ℃, curing the PC panel for 30 minutes, taking out the PC panel, and cooling the PC panel to room temperature. Another 100-inch panel was then bonded to the coated panel, pressed firmly, and placed in a cold and hot cycle box set at a temperature ranging from-50 to 150 ℃ for 10 cycles every 24 hours, and the clear panel was examined for the presence of bubbles and yellow spots.
TABLE 2 Performance testing of cured Silicone Adhesives
3. Ultraviolet light irradiation test:
And (3) mixing the component A and the component B in each example to obtain transparent liquid, decompressing to remove bubbles, weighing a small amount of the transparent liquid into a quartz dish, heating to 120 ℃ for curing for 20 minutes, taking out, cooling to room temperature, and irradiating under an ultraviolet lamp of 185nm respectively. And testing whether bubbles appear and whether shedding appears every 1 day, wherein the testing period is 6 days.
TABLE 3 UV resistance test of cured Silicone adhesives
The comparative test examples of the above properties show that: in comparative example 1, when the ingredient toughening agent was absent from the silicone adhesive raw material, the cured silicone adhesive was gradually bubbled from the original full-lamination to a colorless state to a yellow spot state. Under the irradiation of an ultraviolet lamp with the wavelength of 185nm, the cured organic silicon adhesive is completely attached from the original state until bubbles slowly appear, and the cured organic silicon adhesive is colorless until yellow spots appear. Therefore, in the high-flexibility organic silica gel adhesive provided by the invention, the vinyl-terminated polysiloxane and the epoxy resin compound have indispensable functions. The acrylic ester compound can reduce the curing rate of the organic silicon adhesive, improve the wettability between the coating material and the adhesive, reduce the surface tension, and enable the organic silicon adhesive coated on the surface of the material to be cured and uniformly distributed, thereby having good yellow spot resistance. In addition, because the epoxy resin compound has good adhesive property, the epoxy resin compound can generate nucleophilic addition reaction with double bonds in the acrylate compound, and the acrylate compound can be well combined with vinyl-terminated polysiloxane substances to organically connect main components in the high-flexibility organic silicon adhesive together, so that the adhesive strength and the yellow spot resistance of the high-flexibility organic silicon adhesive are enhanced. As can be seen from comparative examples 2, 3, 5 and 6, the use amounts of the acrylate compounds and the epoxy resin compounds also determine the bonding strength and the yellow spot resistance of the high-flexibility organic silicon adhesive, wherein the use amount of the acrylate compounds is selected from the range of 20-25 parts, and the use amount of the epoxy resin compounds is selected from the range of 15-20 parts.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
Claims (8)
1. A high-flexibility organic silicon adhesive is characterized by comprising:
The component A comprises the following components in parts by weight:
10-15 parts of acrylic ester compounds,
20-30 parts of vinyl-terminated polysiloxane,
1-2 parts of a curing agent,
And a component B, which comprises the following components in parts by weight:
15 to 20 parts of epoxy resin compound,
5-10 parts of a toughening agent,
0.001 to 0.005 part of platinum catalyst.
2. The highly flexible silicone adhesive according to claim 1, characterized in that:
Wherein the acrylate compound is any one of butyl acrylate, alpha-nitropropene ethyl ester, alpha-nitropropene butyl ester, alpha-nitropropene isobutyl ester, alpha-methoxy nitropropene ethyl ester, hydroxypropyl acrylate, methyl methacrylate or urethane acrylate.
3. The highly flexible silicone adhesive according to claim 1, characterized in that:
Wherein the epoxy resin compound is any one of bisphenol F type epoxy resin, polybutadiene resin, tetraphenolethane type epoxy resin, bisphenol A type epoxy resin or o-cresol formaldehyde type polyepoxy resin.
4. the highly flexible silicone adhesive according to claim 1, characterized in that:
Wherein, the toughening agent is hydroxyl-terminated polybutadiene or nano silicon dioxide.
5. The highly flexible silicone adhesive according to claim 1, characterized in that:
Wherein the platinum catalyst is a vinyl siloxane-Pt coordination compound.
6. The highly flexible silicone adhesive according to claim 1, characterized in that:
Wherein the curing agent is any one or more than two of m-phenylenediamine, triethanolamine, spiro amine or N- (3-methyl) -N, N-dimethyl urea.
7. The preparation method of the high-flexibility organic silicon adhesive is characterized by comprising the following steps of:
Step 1, under the protection of inert gas, adding an acrylate compound, vinyl-terminated polysiloxane and a curing agent into a reaction device, stirring, heating to 50-60 ℃, reacting for 15-20 min under stirring, cooling to room temperature, and filtering to obtain a transparent liquid component A;
step 2, under the protection of inert gas, adding an epoxy resin compound, a toughening agent and a platinum catalyst into a reaction device, heating to 40-50 ℃, reacting for 25-35 min, cooling to room temperature, and filtering to obtain a transparent liquid component B;
Step 3, mixing the component A and the component B and heating to obtain the high-flexibility organic silicon adhesive,
The high-flexibility silicone adhesive is the high-flexibility silicone adhesive disclosed by any one of claims 1-6.
8. The preparation method of the highly flexible silicone adhesive according to claim 7, characterized in that:
wherein the heating temperature in the step 3 is 50-80 ℃.
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