CN110571255B - Film layer structure, display panel, display device and film layer structure preparation method - Google Patents

Film layer structure, display panel, display device and film layer structure preparation method Download PDF

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Publication number
CN110571255B
CN110571255B CN201910855632.9A CN201910855632A CN110571255B CN 110571255 B CN110571255 B CN 110571255B CN 201910855632 A CN201910855632 A CN 201910855632A CN 110571255 B CN110571255 B CN 110571255B
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pixel
film layer
arc
layer structure
convex
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CN110571255A (en
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李伟丽
刘明星
甘帅燕
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Abstract

The embodiment of the invention provides a film layer structure, a display panel, a display device and a film layer structure preparation method, and solves the problems of uneven thickness and poor film layer uniformity of pixel units borne in the existing film layer structure. The film layer structure comprises a pixel defining layer and a conductive layer which is arranged in a stacked mode with the pixel defining layer, wherein a first surface of the conductive layer comprises a protruding portion, and the first surface is a surface adjacent to the pixel defining layer. According to the film layer structure provided by the embodiment of the invention, the purpose of preparing the pixel unit with uniform thickness and better film layer uniformity based on the surface tension of the ink liquid drop is realized by arranging the convex part on the first surface of the conductive layer adjacent to the pixel limiting layer, so that the film layer uniformity of the pixel unit is improved, and the luminous performance of the film layer structure is ensured.

Description

Film layer structure, display panel, display device and film layer structure preparation method
Technical Field
The invention relates to the technical field of display, in particular to a film structure, a display panel, a display device and a preparation method of the film structure.
Background
The OLED (Organic Light-Emitting Diode) display device occupies an important position in the display technology field by virtue of many advantages of lightness, thinness, high brightness, low power consumption, high definition and the like. At present, in the process of manufacturing the OLED display device, the pixel unit of the OLED display device is generally manufactured based on the inkjet printing technology. Specifically, an ink material is injected into a pixel container using an inkjet printing process to form an ink droplet, which is spread within the pixel container to finally form a pixel unit.
However, in the spreading process of the ink droplet, the evaporation rates of the solvents in the edge area and the central area of the ink droplet are different, so that the thickness of the pixel unit formed after drying is not uniform, and the light emitting performance of the device is affected.
Disclosure of Invention
In view of this, embodiments of the present invention provide a film layer structure, a display panel, a display device, and a method for manufacturing the film layer structure, so as to solve the problems of non-uniform thickness and poor film uniformity of pixel units carried in the existing film layer structure.
In a first aspect, an embodiment of the present invention provides a film layer structure, including a pixel defining layer and a conductive layer disposed to be stacked on the pixel defining layer, a first surface of the conductive layer including a protrusion, wherein the first surface is a surface adjacent to the pixel defining layer.
In an embodiment of the invention, the pixel defining layer includes a pixel through groove, the first surface includes a bearing region corresponding to the pixel through groove, and the protrusion portion is located in the bearing region.
In one embodiment of the present invention, the carrying region includes a central region and an edge region, and the protrusion is located in the central region of the carrying region.
In an embodiment of the present invention, the protruding portion is an arc-shaped protruding portion including a protruding arc surface.
In an embodiment of the invention, an arc distance between the convex arc surface of the arc-shaped convex part and the convex arc surface of the corresponding ink droplet falls within a preset distance range. Preferably, the arc of the arc-shaped convex part is the same as the arc of the convex arc of the corresponding ink droplet.
In an embodiment of the present invention, the number of the pixel through grooves is multiple, and the convex arc surfaces of the arc-shaped convex portions corresponding to at least two pixel through grooves are located on the same extending arc surface.
In an embodiment of the present invention, the bearing region includes a central region and an edge region, the protrusion includes a first sub-protrusion and a second sub-protrusion, the first sub-protrusion is located in the central region, and the second sub-protrusion is located in the edge region.
In a second aspect, an embodiment of the present invention provides a display panel, which includes a substrate base plate and the film layer structure mentioned in any of the above embodiments, provided to the substrate base plate.
In a third aspect, an embodiment of the present invention provides a display apparatus, which includes an electronic device and the display panel mentioned in any of the above embodiments, in signal connection with the electronic device.
In a fourth aspect, an embodiment of the present invention provides a film layer structure manufacturing method, including preparing a conductive layer including a protrusion, where the protrusion is located on a first surface of the conductive layer; a pixel defining layer is prepared on the first surface.
According to the film layer structure provided by the embodiment of the invention, the purpose of improving the film layer uniformity of the prepared pixel unit is realized by arranging the convex part on the surface of the conductive layer adjacent to the pixel limiting layer, so that the purpose of improving the display uniformity of the display device is realized.
Drawings
Fig. 1a is a schematic diagram illustrating a first state of a pixel unit prepared based on a conventional film structure.
Fig. 1b is a schematic diagram illustrating a second state of a pixel unit prepared based on a conventional film structure.
Fig. 2 is a schematic structural diagram of a film structure carrying a pixel unit according to an embodiment of the invention.
Fig. 3 is a schematic structural diagram of a film structure carrying a pixel unit according to another embodiment of the invention.
Fig. 4 is a schematic structural diagram of a film structure carrying a pixel unit according to another embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a film structure carrying a pixel unit according to still another embodiment of the invention.
Fig. 6 is a schematic structural diagram of a film structure carrying a pixel unit according to still another embodiment of the invention.
Fig. 7 is a schematic flow chart illustrating a method for manufacturing a film structure according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1a is a schematic diagram illustrating a first state of a pixel unit prepared based on a conventional film structure. Fig. 1b is a schematic diagram illustrating a second state of a pixel unit prepared based on a conventional film structure. Specifically, fig. 1a is a schematic diagram illustrating a state of the pixel unit 3 before drying, and fig. 1b is a schematic diagram illustrating a state of the pixel unit 3 after drying. As shown in fig. 1a and 1b, the conventional film structure includes a conductive layer 1 having a rectangular plate shape and a pixel defining layer 2 stacked on the conductive layer 1. The pixel defining layer 2 includes a pixel through groove 21 penetrating the pixel defining layer 2 in the stacking direction (the vertical direction of the orientation shown in fig. 1a and 1 b), and the first surface (the upper surface of the orientation shown in fig. 1a and 1 b) of the conductive layer 1 includes a carrying region M corresponding to the pixel through groove 21, the carrying region M forming a pixel container capable of accommodating the pixel unit 3 together with the pixel through groove 21.
With continued reference to fig. 1a, since the ink material has liquid properties, after the ink material is injected into the pixel container by the inkjet printing technique, the pixel cell 3 assumes the ink droplet shape shown in fig. 1 a. At this time, the ink material forming the pixel unit 3 is in an undried state. Due to the influence of thickness factors, the solvent volatilization rates of the ink materials are different in the areas with different thicknesses in the drying process of the ink materials. That is, the thickness of the ink material is inversely proportional to the solvent evaporation rate. And due to the influence of liquid balance factors, the solution corresponding to the region with the slower solvent volatilization speed can be transferred to the region with the faster solvent volatilization speed so as to compensate the solvent volatilized from the region with the faster solvent volatilization speed. Therefore, after the ink material dries, the pixel unit 3 will take on a pit shape as shown in fig. 1 b. That is, the thickness of the pixel unit carried in the existing film structure is not uniform, and the uniformity of the film is poor.
Accordingly, the embodiments described below provide a film layer structure, a display panel, a display device, and a method for manufacturing the film layer structure, so as to solve the technical problems shown in fig. 1a and 1 b. The film layer structure provided by the embodiment of the invention comprises a pixel limiting layer and a conductive layer which is arranged in a stacking mode with the pixel limiting layer, wherein a first surface of the conductive layer is provided with a convex part, and the first surface is a surface adjacent to the pixel limiting layer.
It should be noted that, in the film layer structures shown in fig. 1a and 1b and the film layer structures shown in fig. 2 to 6, only one or more pixel containers are shown for convenience of description. It should be understood that, in practical applications, the number of pixel containers included in the film structure may be determined according to practical situations.
Fig. 2 is a schematic structural diagram of a film structure carrying a pixel unit according to an embodiment of the invention. As shown in fig. 2, the film structure provided by the embodiment of the present invention includes a conductive layer 1 and a pixel defining layer 2, which are stacked, wherein a first surface (an upper surface oriented as shown in fig. 2) of the conductive layer 1 is disposed adjacent to the pixel defining layer 2. Specifically, the first surface of the conductive layer 1 includes a bearing region M, and the bearing region M is provided with a convex portion 11. In the embodiment of the present invention, the convex portion 11 is an arc-shaped convex portion having a convex arc surface. The pixel defining layer 2 includes pixel through grooves 21 penetrating the pixel defining layer 2 in the stacking direction (the vertical direction of the orientation as shown in fig. 2), and the protrusions 11 are provided in correspondence with the pixel through grooves 21. That is, the carrying region M of the conductive layer 1 and the pixel through-groove 21 form a pixel container capable of accommodating the pixel unit 3, and the protrusion 11 is located in the pixel container.
It should be appreciated that the ink droplets possess surface tension due to the liquid nature of the ink material. Specifically, molecules in the liquid are subjected to equal attractive forces in all directions, and the molecules on the surface are subjected to a force in the liquid direction which is larger than a force in the liquid-away direction, so that a spontaneous contraction phenomenon, that is, a surface tension, occurs on the surface of the ink droplet.
In the film layer structure provided by the embodiment of the invention, because the bearing area of the conductive layer is provided with the convex part, compared with the conductive layer without the convex part in the prior art, the convex part in the embodiment of the invention can be well matched with the surface tension of the ink droplet, so that the pixel unit with uniform thickness and better film layer uniformity is prepared by well utilizing the surface tension of the ink droplet, and the effect of improving the display uniformity is realized. In addition, the convex part mentioned in the embodiment of the invention is the arc-shaped convex part with the convex cambered surface, and the ink liquid drop also has the shape of the convex cambered surface based on the liquid characteristics, so the arc-shaped convex part with the convex cambered surface can better match the surface tension of the ink liquid drop, and further the film layer uniformity of the prepared pixel unit can be further improved.
Optionally, the conductive layer 1 is an Indium Tin Oxide (ITO) anode layer.
Preferably, the arc distance between the convex arc of the arc-shaped convex part and the convex arc of the corresponding ink droplet falls within a preset distance range. The preset distance range refers to a distance range which can enable the convex cambered surface of the arc-shaped convex part to be matched with the surface tension of the ink liquid drop, and is further beneficial to improving the film uniformity of the prepared pixel unit.
More preferably, the arc of the arc-shaped convex portion is the same as the arc of the convex arc of the corresponding ink droplet. It should be understood that, when the arc of the arc-shaped protrusion is the same as the arc of the corresponding protrusion of the ink droplet, the direction of the surface tension of the protrusion of the arc-shaped protrusion is the same as the direction of the surface tension of the ink droplet, so that the film uniformity of the prepared pixel unit can be greatly improved.
In practical application scenarios, the film layer structure is generally required to carry different types of pixel units, such as red pixel units, green pixel units, and blue pixel units. However, the microcavity lengths of different types of pixel cells are not uniform, wherein the microcavity length refers to the distance from the vertical direction of the light-emitting point to the upper package face. Therefore, in an embodiment of the present invention, the protrusion height of the arc-shaped protrusion is determined based on the specific type of the pixel unit, so that the film uniformity of the prepared pixel unit can be further improved.
It should be noted that the convex portion 11 may have other shapes, including but not limited to the arc-shaped convex portion including the convex arc surface mentioned in the above embodiments of the present invention. For example, the protrusion 11 may be a stepped protrusion including a convex stepped surface.
Fig. 3 is a schematic structural diagram of a film structure carrying a pixel unit according to another embodiment of the invention. The embodiment of the invention shown in fig. 3 is extended from the embodiment of the invention shown in fig. 2, and the differences between the embodiment shown in fig. 3 and the embodiment shown in fig. 2 will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 3, in the embodiment of the present invention, the carrying region M of the conductive layer 1 includes a central region M1 and an edge region M2, and the protrusion 11 is located at the central region M1.
Note that the center region M1 refers to a non-edge region of the bearing region M. The specific ranges of the central region M1 and the edge region M2 may be set according to actual situations, and this is not limited in the embodiment of the present invention.
In the actual manufacturing process, since the projections 11 are not present at the edge area M2, the ink droplets are gently spread at the edge area M2. Therefore, compared with the embodiment shown in fig. 2, the embodiment of the present invention can effectively prevent the ink material from being accumulated at the edge region M2, that is, the film layer structure provided by the embodiment of the present invention can further improve the film layer uniformity of the prepared pixel unit.
It should be noted that, for convenience of description, the film layer structure mentioned in the above embodiment only shows one pixel through slot 21. However, in the film layer structure mentioned in other embodiments, the pixel defining layer 2 may include a plurality of pixel through grooves 21 arranged in an array, and each pixel through groove 21 corresponds to the protrusion 11.
Fig. 4 is a schematic structural diagram of a film structure carrying a pixel unit according to another embodiment of the present invention. The embodiment of the invention shown in fig. 4 is extended from the embodiment of the invention shown in fig. 2, and the differences between the embodiment shown in fig. 4 and the embodiment shown in fig. 2 will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 4, in the film structure according to the embodiment of the invention, the number of the pixel through grooves 21 is four, each pixel through groove 21 corresponds to one protruding portion 11, and the protruding portion 11 is an arc-shaped protruding portion. In addition, every two adjacent pixel through grooves 21 form a pixel group, and in the same pixel group, the convex arc surfaces of the convex portions 11 corresponding to the two adjacent pixel through grooves 21 are located on the same extending arc surface.
It should be noted that three, four, or even more adjacent pixel through grooves 21 may also be defined to form a pixel group, and in the same pixel group, the convex arc surfaces of the protruding portions 11 corresponding to all the pixel through grooves 21 are defined to be the same extended arc surface, which is not described in detail in the embodiment of the present invention.
When the convex arc surfaces of the convex parts 11 corresponding to at least two adjacent pixel through grooves 21 are limited to the same extending arc surface, ink materials are easy to accumulate at the corners between the convex parts 11 at the low-lying positions and the pixel limiting layers 2, and the film uniformity of the prepared pixel units is further damaged. Based on this, the embodiment of the invention controls the spraying condition of the ink material by controlling the ink-jet time and the ink-jet speed, thereby ensuring the film uniformity of the prepared pixel unit. It should be understood that the specific ink-jet time and ink-jet speed can be set according to actual conditions, and the detailed description of the embodiments of the present invention is omitted.
According to the film layer structure provided by the embodiment of the invention, the purpose of improving the film layer uniformity of the prepared pixel unit is realized and the preparation difficulty of the pixel unit is reduced by limiting the convex arc surfaces of the convex parts corresponding to the at least two pixel through grooves to be positioned on the same extension arc surface. For example, compared with the embodiment shown in fig. 2, the film layer structure mentioned in the embodiment of the present invention flattens the included angle between the pixel defining layer and the protrusion, thereby effectively reducing the probability of poor film layer uniformity of the pixel unit caused by the ink material being accumulated at the included angle.
Fig. 5 is a schematic structural diagram of a film structure carrying a pixel unit according to still another embodiment of the invention. The embodiment of the invention shown in fig. 5 is extended from the embodiment of the invention shown in fig. 4, and the differences between the embodiment shown in fig. 5 and the embodiment shown in fig. 4 will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 5, in the film layer structure according to the embodiment of the present invention, the pixel defining layer 2 includes four rows of pixel through grooves 21, each pixel through groove 21 corresponds to one protruding portion 11, and the protruding portion 11 is an arc-shaped protruding portion including a protruding arc surface. The convex arc surfaces of all the convex parts 11 corresponding to all the pixel through grooves 21 in the four rows of pixel through grooves 21 are located on the same extending arc surface.
Compared with the embodiment shown in fig. 4, in the embodiment of the invention, by limiting the manner that the convex arc surfaces of the convex parts corresponding to all the pixel through grooves included in the four rows of pixel through grooves are located on the same extending arc surface, not only is the purpose of improving the film uniformity of the prepared pixel unit realized, but also the preparation difficulty and complexity of the film structure are greatly simplified.
Fig. 6 is a schematic structural diagram of a film structure carrying a pixel unit according to still another embodiment of the invention. The embodiment of the invention shown in fig. 6 is extended from the embodiment of the invention shown in fig. 3, and the differences between the embodiment shown in fig. 6 and the embodiment shown in fig. 3 will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 6, in the film layer structure according to the embodiment of the present invention, the protrusion 11 includes a first sub-protrusion 111 and a second sub-protrusion 112, wherein the first sub-protrusion 111 is located in the central region M1, and the second sub-protrusion 112 is located in the edge region M2. Specifically, the first sub protrusion 111 and the second sub protrusion 112 are both arc-shaped protrusions including convex arc surfaces, and the protrusion height of the first sub protrusion 111 is greater than the protrusion height of the second sub protrusion 112.
According to the film layer structure provided by the embodiment of the invention, the control difficulty of the ink material in the edge area is reduced by respectively arranging the convex parts with different convex heights in the central area and the edge area, so that the aim of further improving the film layer uniformity of the prepared pixel unit is fulfilled.
In an embodiment of the present invention, a display panel is also provided. The display panel comprises a substrate base plate and a film layer structure arranged on the substrate base plate, wherein the film layer structure can be the film layer structure mentioned in any embodiment.
In an embodiment of the present invention, a display device is also provided. The display device includes an electronic device and a display panel in signal connection with the electronic device, wherein the electronic device may include an electronic device such as a sensor and a controller, and the display panel may be the display panel including the film structure mentioned in the above embodiments. It should be understood that the display device includes, but is not limited to, a mobile phone, a tablet computer, a notebook, etc.
Fig. 7 is a schematic flow chart illustrating a method for manufacturing a film structure according to an embodiment of the invention. As shown in fig. 7, a method for preparing a film structure according to an embodiment of the present invention includes the following steps.
Step S10: preparing a conductive layer including a protrusion, wherein the protrusion is located on a first surface of the conductive layer.
Step S20: a pixel defining layer is prepared on the first surface.
In practical application, a conductive layer including a protrusion is first prepared, wherein the protrusion is located on the first surface of the conductive layer, and then a pixel defining layer is prepared on the first surface of the conductive layer.
According to the film layer structure preparation method provided by the embodiment of the invention, the purpose of improving the film layer uniformity of the prepared pixel unit is realized by preparing the conductive layer comprising the convex part and then preparing the pixel limiting layer on the surface of the conductive layer provided with the convex part, so that the purpose of improving the display uniformity of the display device is realized.
Preferably, in an embodiment of the present invention, the step of preparing the pixel defining layer on the first surface (i.e., step S20) includes: preparing a pixel defining substrate on a first surface; and a pixel through groove penetrating through the pixel limiting substrate is arranged in the region of the pixel limiting substrate corresponding to the bulge part so as to form a pixel limiting layer. It should be noted that, in the embodiment of the present invention, since the pixel through groove and the protrusion are correspondingly disposed, the influence capability of the protrusion on the surface tension of the pixel unit accommodated in the pixel through groove can be better controlled, and thus, the film uniformity of the prepared pixel unit can be better improved.
Optionally, a method for preparing a film structure provided by another embodiment of the present invention includes: a planarization layer including a protrusion portion is prepared on a base substrate, then a conductive layer is prepared on the planarization layer, and finally a pixel defining layer is prepared. Wherein the planarization layer including the protrusion may be prepared based on an exposure process of an organic glue.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and the like that are within the spirit and principle of the present invention are included in the present invention.

Claims (8)

1. A film layer structure, comprising:
a pixel defining layer including pixel through slots; and
the conductive layer is stacked with the pixel limiting layer, and a first surface of the conductive layer comprises a convex part, wherein the first surface is a surface adjacent to the pixel limiting layer, and the convex part is an arc-shaped convex part comprising a convex arc surface;
the number of the pixel through grooves is multiple, and the protruding arc surfaces of the arc-shaped protruding parts corresponding to at least two of the pixel through grooves are located on the same extending arc surface.
2. The film layer structure of claim 1, wherein the first surface comprises a carrying region corresponding to the pixel through trench, and the protrusion is located in the carrying region.
3. The film layer structure of claim 2, wherein the carrier region comprises a central region and an edge region, and the raised portion is located in the central region of the carrier region.
4. The film layer structure of claim 1, wherein an arc distance between the convex arc surface of the arc-shaped convex portion and a convex arc surface of a corresponding ink droplet falls within a preset distance range, and preferably, the convex arc surface of the arc-shaped convex portion and the convex arc surface of the corresponding ink droplet have the same radian.
5. The film layer structure of claim 2, wherein the carrier region comprises a central region and an edge region, and the protrusion comprises a first sub-protrusion and a second sub-protrusion, the first sub-protrusion being located in the central region, and the second sub-protrusion being located in the edge region.
6. A display panel, comprising:
a substrate base plate; and
the film layer structure of any one of claims 1 to 5 provided to the substrate base plate.
7. A display device, comprising:
an electronic device; and
the display panel of claim 6 in signal connection with the electronics.
8. A method for preparing a film layer structure, comprising:
preparing a conductive layer comprising a convex part, wherein the convex part is positioned on the first surface of the conductive layer and is an arc-shaped convex part comprising a convex arc surface; and
preparing a pixel limiting layer on the first surface, wherein the pixel limiting layer comprises a plurality of pixel through grooves, and the convex arc surfaces of the arc-shaped convex parts corresponding to at least two pixel through grooves are located on the same extension arc surface.
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