CN110567683A - Thermal test method for lamp - Google Patents

Thermal test method for lamp Download PDF

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Publication number
CN110567683A
CN110567683A CN201910976059.7A CN201910976059A CN110567683A CN 110567683 A CN110567683 A CN 110567683A CN 201910976059 A CN201910976059 A CN 201910976059A CN 110567683 A CN110567683 A CN 110567683A
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China
Prior art keywords
lamp
modified
coupling agent
silane coupling
parts
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CN201910976059.7A
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Chinese (zh)
Inventor
秦泽贵
黄永杰
黄丽军
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Zhejiang Shunxi Commodity Testing Technology Co Ltd
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Zhejiang Shunxi Commodity Testing Technology Co Ltd
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Priority to CN201910976059.7A priority Critical patent/CN110567683A/en
Publication of CN110567683A publication Critical patent/CN110567683A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003—Environmental or reliability tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/44—Testing lamps
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

The invention relates to the technical field of thermal test methods, in particular to a thermal test method for lamps. A method of thermal testing a lamp, the steps comprising: (1) taking out the lamp and wiping the surface of the lamp clean; (2) connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector; (3) and drawing a chart by the digital collector for method verification. The method provides a new way for detecting the thermal performance of the lamp, has the advantages of short time consumption, low cost, simple, convenient, rapid and efficient operation, and has wide application prospect for accurately predicting and verifying the thermal stability of the lamp.

Description

Thermal test method for lamp
Technical Field
The invention belongs to the technical field of thermal test methods, and particularly relates to a thermal test method for a lamp.
Background
With the strong national advocated energy conservation and emission reduction and low carbon environmental protection, the lighting is paid more and more attention due to the technical advantages of the lighting, and the lighting enters the steady promotion period of 'forbidden actions' all over the world at present, so that the lighting product will go the way.
however, price war caused by increasingly intense market competition and homogenization causes the product to be unsmooth, and if the inferior product is left for circulation in the market, the benefit of consumers is damaged, and the continuous development of the lamp industry is influenced by the unsmooth product quality. Therefore, the quality problem is a key factor for restricting the popularization of the lighting products, and the problem of the heat generation of the lamp sample is a common quality problem which needs to be solved urgently.
The lamp system is complex and comprises multidisciplinary cross content such as materials science, optics, mechanics, electronics, computer software and the like. The main components of the luminaire system comprise: electronic components, optical materials, heat dissipation systems, structural materials, and the like. To evaluate the heating performance of the whole lamp system, a proper reliability test project needs to be established for the lamp, and a scientific and reasonable method is used for verification.
disclosure of Invention
in order to solve the above problems, a first aspect of the present invention provides a thermal testing method for a lamp, including the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
As a preferable technical solution, in the step (2), the thermocouple wire is bonded to the part to be tested by an adhesive.
as a preferable technical scheme, the control voltage in the step (2) is 1-1.1 times of the rated voltage of the lamp.
As a preferable technical scheme, in the step (2), the digital collector collects the temperature once every 10s, and the collection time is 1.5-3 h.
As a preferable technical scheme, the adhesive comprises modified epoxy resin, modified filler, a curing agent, an accelerator and an organic solvent.
As a preferable technical scheme, the adhesive comprises, by weight, 20-40 parts of modified epoxy resin, 10-20 parts of modified filler, 15-30 parts of curing agent, 3-6 parts of accelerator and 50-65 parts of organic solvent.
as a preferable technical solution, the modified epoxy resin is a carboxyl rubber modified epoxy resin.
As a preferred technical solution, the carboxyl rubber comprises carboxyl styrene-butadiene rubber.
As a preferable technical scheme, the modified filler is a silane coupling agent modified filler.
As a preferred technical scheme, the curing agent is selected from one or more of polyamine curing agent, phenolic aldehyde curing agent, anhydride curing agent, polythiol curing agent and polyisocyanate curing agent.
Has the advantages that: the method provides a new way for detecting the thermal performance of the lamp, has the advantages of short time consumption, low cost, simple, convenient, rapid and efficient operation, and has wide application prospect for accurately predicting and verifying the thermal stability of the lamp.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1: lamp thermal experimental chart of example 4.
Detailed Description
The technical features of the technical solutions provided by the present invention are further clearly and completely described below with reference to the specific embodiments, and the scope of protection is not limited thereto.
The words "preferred", "more preferred", and the like, in the present invention refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
When a range of values is disclosed herein, the range is considered to be continuous and includes both the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values of the range is included. Further, when multiple range-describing features or characteristics are provided, the ranges may be combined. In other words, unless otherwise indicated, all ranges disclosed herein are to be understood to encompass any and all subranges subsumed therein. For example, a stated range from "1 to 10" should be considered to include any and all subranges between the minimum value of 1 and the maximum value of 10. Exemplary subranges of the range 1 to 10 include, but are not limited to, 1 to 6.1, 3.5 to 7.8, 5.5 to 10, and the like.
in order to solve the above problems, a first aspect of the present invention provides a thermal testing method for a lamp, including the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
Preferably, the thermocouple wire in the step (2) is bonded to the part to be tested by an adhesive.
Preferably, the control voltage in the step (2) is 1-1.1 times of the rated voltage of the lamp.
Preferably, in the step (2), the digital collector collects the temperature once every 10s, and the collection time is 1.5-3 h.
Preferably, the adhesive comprises modified epoxy resin, modified filler, a curing agent, an accelerator and an organic solvent.
preferably, the adhesive comprises, by weight, 20-40 parts of modified epoxy resin, 10-20 parts of modified filler, 15-30 parts of curing agent, 3-6 parts of accelerator and 50-65 parts of organic solvent.
modified epoxy resin
Preferably, the modified epoxy resin is a carboxyl rubber modified epoxy resin.
more preferably, the carboxyl-terminated rubber is selected from one or more of carboxyl-terminated polybutylene rubber, carboxyl-terminated butadiene-acrylonitrile rubber and carboxyl butadiene-styrene rubber.
More preferably, the carboxyl rubber comprises a carboxylated styrene-butadiene rubber.
More preferably, the modified epoxy resin is a carboxylated styrene-butadiene rubber modified epoxy resin, and can be prepared by the following steps: the carboxyl styrene-butadiene rubber and the epoxy resin are mixed and stirred evenly, and the carboxyl styrene-butadiene rubber modified epoxy resin can be obtained after heating and stirring for 3 hours at the temperature of 140 ℃.
more preferably, the mass ratio of the carboxylic styrene-butadiene rubber to the epoxy resin is (2.5-4): 20.
More preferably, the mass ratio of the carboxylated styrene-butadiene rubber to the epoxy resin is 3: 20.
the epoxy resin is epoxy resin LY 1564.
modified filler
Preferably, the filler is a heat conducting filler and is selected from one or more of alumina, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide and graphene.
More preferably, the filler is a modified filler.
More preferably, the modified filler is a silane coupling agent modified filler.
Still further preferably, the modified filler comprises modified graphene and modified alumina.
Still further preferably, the modified filler comprises silane coupling agent modified graphene and silane coupling agent modified alumina.
More preferably, the modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of (0.2-0.5): 1.
more preferably, the silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and is prepared by the following steps: adding graphene oxide into absolute ethyl alcohol, and performing ultrasonic treatment for 1 hour to form a graphene oxide uniform dispersion liquid; adding an epoxy silane coupling agent into 95% ethanol, and performing ultrasonic treatment for 1h to form a uniform dispersion liquid of the epoxy silane coupling agent; adding 10% ammonia water into the graphene oxide uniform dispersion liquid, adjusting the pH value of the dispersion liquid to be about 3, slowly adding the epoxy silane coupling agent uniform dispersion liquid into the graphene oxide uniform dispersion liquid under the stirring condition, carrying out magnetic stirring reaction for 12 hours at 60 ℃, filtering by using filter paper, washing for multiple times by using absolute ethyl alcohol and pure water, and finally drying and grinding to obtain the epoxy silane coupling agent modified graphene.
Preferably, the concentration of the graphene oxide in the absolute ethyl alcohol is 8 g/L; the concentration of the epoxy silane coupling agent in 95% ethanol is 32 g/L; the volume ratio of the graphene oxide uniform dispersion liquid after the ammonia water is added to the epoxy silane coupling agent uniform dispersion liquid is 1: 1.
preferably, the epoxy silane coupling agent may be exemplified by: one or more of gamma-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, gamma-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane.
Most preferably, the epoxysilane coupling agent is gamma-glycidoxypropyltrimethoxysilane.
More preferably, the silane coupling agent modified alumina is aminosilane coupling agent modified alumina, and is prepared by the following steps: and weighing the aminosilane coupling agent, adding the aminosilane coupling agent into deionized water, and adjusting the pH to be about 3 by using glacial acetic acid to obtain hydrolysate of the aminosilane coupling agent. Weighing nano alumina, adding the nano alumina into an ethanol/water mixed solvent (ethanol: water is 1:1, volume ratio), and ultrasonically dispersing for 1h to prepare a nano alumina uniform dispersion liquid; adding hydrolysate of amino silane coupling agent into the nano alumina homogeneous dispersion liquid, heating and refluxing a magnetic stirrer at a constant temperature of 80 ℃ for a certain time, centrifugally separating after the reaction is finished, washing for 3-4 times by using absolute ethyl alcohol, drying for 24 hours in an oven at 80 ℃, and grinding for later use.
preferably, the concentration of the aminosilane coupling agent in deionized water is 0.04 g/mL; the concentration of the nano-alumina in the mixed solvent of ethanol/water is 2.5 g/mL; the volume ratio of the nano alumina uniform dispersion liquid to the hydrolysate of the aminosilane coupling agent is 1: 1; the particle size of the nano alumina is 10-30 nm.
Preferably, the aminosilane coupling agents may be exemplified by: one or more of gamma-aminopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, N-beta (aminoethyl) -gamma-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltriethoxysilane and gamma-aminopropylmethyldiethoxysilane.
most preferably, the aminosilane coupling agent is gamma-aminopropylmethyldiethoxysilane.
Preferably, the weight ratio of the modified filler to the curing agent is 1 (1.2-1.5).
The invention adopts the modified filler, and the modified filler is preferably silane coupling agent modified graphene and silane coupling agent modified alumina, the inventor finds that when the two are adopted for synergistic action, the detected thermal stability result is still kept stable even if the content of the filler is lower, the inventor thinks that when the epoxy silane coupling agent modified graphene and the amino silane coupling agent modified alumina are adopted, the filler particles are mutually contacted and overlapped to form a bridge when the particle size of the nano alumina is 10-30nm, the separation degree in resin wrapping is reduced, thereby forming a heat conduction channel, improving the stability of the test result, and further ensuring the result to be accurate. Further, when the weight ratio of the modified filler to the curing agent is 1 (1.2-1.5), the inventors have unexpectedly found that it is preferable to improve the stability of the test, and that it is possible to improve the intermolecular force and the thermal shock resistance due to the formation of more physical or chemical crosslinking points between the filler particles and the curing agent.
In order to ensure better heat conductivity, when the modified filler and the curing agent are added, the adhesive toughness is insufficient due to excessive crosslinking, on one hand, the content of the filler is controlled to be below 20 parts by weight, on the other hand, the modified epoxy resin is adopted in the invention, and when the carboxyl styrene-butadiene rubber modified epoxy resin is adopted, the thermal shock resistance can be improved due to the existence of aryl groups, and the heat transfer efficiency is improved while the toughness is improved due to the conjugation between the aryl groups and the formation of a part of core-shell structure between the flexible long chain segments.
Curing agent
preferably, the curing agent is selected from one or more of polyamine curing agent, phenolic curing agent, anhydride curing agent, polythiol curing agent and polyisocyanate curing agent.
More preferably, the curing agent comprises an anhydride curing agent.
still further preferably, the acid anhydride curing agent is selected from one or more of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, nadic anhydride.
More preferably, the anhydride curing agent is methylhexahydrophthalic anhydride.
Accelerator
preferably, the accelerator is selected from one or more of dimethyl imidazole, diphenyl imidazole and diethyl tetramethyl imidazole.
More preferably, the accelerator is diethyltetramethylimidazole.
Organic solvent
Preferably, the organic solvent is selected from one or more of toluene, ethyl acetate, butyl acetate, isobutyl acetate, propyl acetate, ethanol, n-butanol, cyclohexanone, xylene, methyl isobutyl ketone, acetone, methyl ethyl ketone, ethylene glycol butyl ether and propylene glycol butyl ether.
More preferably, the organic solvent comprises ethyl acetate, ethanol, ethylene glycol butyl ether.
more preferably, the organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
in a second aspect, the present invention provides a method for preparing the adhesive, comprising the steps of: adding an organic solvent into a reaction kettle, then adding a curing agent and an accelerant to dissolve in the organic solvent, and fully stirring at a low speed of 20-80r/min to uniformly mix the organic solvent and the accelerant; then adding the modified epoxy resin and the modified filler, and fully stirring for 1-3 hours; controlling the temperature in the reaction kettle to be 30-80 ℃, stirring at a high speed of 800-3000 r/min for 6-10h, and stopping stirring to obtain the adhesive.
The present invention will now be described in detail by way of examples, and the starting materials used are commercially available unless otherwise specified.
Examples
Example 1
Embodiment 1 provides a thermal testing method for a lamp, including the steps of:
(1) taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) and drawing a chart by the digital collector for method verification.
The thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
The control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
The adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
The modified epoxy resin is carboxyl styrene-butadiene rubber modified epoxy resin and can be prepared by the following steps: mixing the carboxylated styrene-butadiene rubber and the epoxy resin, uniformly stirring, heating and stirring at 140 ℃ for 3 hours to obtain the carboxylated styrene-butadiene rubber modified epoxy resin; the mass ratio of the carboxylic styrene-butadiene rubber to the epoxy resin is 3: 20.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
the silane coupling agent modified graphene is epoxy silane coupling agent modified graphene and is prepared by the following steps: adding graphene oxide into absolute ethyl alcohol, and performing ultrasonic treatment for 1 hour to form a graphene oxide uniform dispersion liquid; adding an epoxy silane coupling agent into 95% ethanol, and performing ultrasonic treatment for 1h to form a uniform dispersion liquid of the epoxy silane coupling agent; adding 10% ammonia water into the graphene oxide uniform dispersion liquid, adjusting the pH value of the dispersion liquid to be about 3, slowly adding the epoxy silane coupling agent uniform dispersion liquid into the graphene oxide uniform dispersion liquid under the stirring condition, carrying out magnetic stirring reaction for 12 hours at 60 ℃, filtering by using filter paper, washing by using absolute ethyl alcohol and pure water for multiple times, and finally drying and grinding to obtain epoxy silane coupling agent modified graphene;
wherein the concentration of the graphene oxide in the absolute ethyl alcohol is 8 g/L; the concentration of the epoxy silane coupling agent in 95% ethanol is 32 g/L; the volume ratio of the graphene oxide uniform dispersion liquid after the ammonia water is added to the epoxy silane coupling agent uniform dispersion liquid is 1: 1; the epoxy silane coupling agent is gamma-glycidyl ether oxypropyl trimethoxy silane.
the silane coupling agent modified alumina is amino silane coupling agent modified alumina and is prepared by the following steps: and weighing the aminosilane coupling agent, adding the aminosilane coupling agent into deionized water, and adjusting the pH to be about 3 by using glacial acetic acid to obtain hydrolysate of the aminosilane coupling agent. Weighing nano alumina, adding the nano alumina into an ethanol/water mixed solvent (ethanol: water is 1:1, volume ratio), and ultrasonically dispersing for 1h to prepare a nano alumina uniform dispersion liquid; adding hydrolysate of amino silane coupling agent into the nano alumina uniform dispersion liquid, heating and refluxing a magnetic stirrer at constant temperature of 80 ℃ for a certain time, centrifugally separating after the reaction is finished, washing for 3-4 times by using absolute ethyl alcohol, drying for 24 hours in an oven at 80 ℃, and grinding for later use;
Wherein the concentration of the aminosilane coupling agent in deionized water is 0.04 g/mL; the concentration of the nano-alumina in the mixed solvent of ethanol/water is 2.5 g/mL; the volume ratio of the nano alumina uniform dispersion liquid to the hydrolysate of the aminosilane coupling agent is 1: 1; the particle size of the nano alumina is 30 nm; the amino silane coupling agent is gamma-aminopropyl methyl diethoxy silane.
The curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
example 2
Embodiment 2 provides a thermal test method for a lamp, including the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
The thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
the control voltage in the step (2) is 1 time of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 3 h;
The adhesive comprises 20 parts of modified epoxy resin, 10 parts of modified filler, 15 parts of curing agent, 3 parts of accelerant and 50 parts of organic solvent.
The modified epoxy resin is a carboxylated styrene-butadiene rubber modified epoxy resin, and the steps are the same as those in example 1, except that the mass ratio of the carboxylated styrene-butadiene rubber to the epoxy resin is 2.5: 20.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.2: 1;
The silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
the silane coupling agent modified alumina is amino silane coupling agent modified alumina, and the steps are the same as those of the example 1, except that the particle size of the nano alumina is 30 nm;
The curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
the organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
Example 3
Embodiment 3 provides a thermal testing method for a lamp, comprising the steps of:
(1) taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
The thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
The control voltage in the step (2) is 1.1 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
the adhesive comprises 40 parts of modified epoxy resin, 20 parts of modified filler, 30 parts of curing agent, 6 parts of accelerator and 65 parts of organic solvent.
The modified epoxy resin is a carboxylated styrene-butadiene rubber modified epoxy resin, and the steps are the same as those in example 1, except that the mass ratio of the carboxylated styrene-butadiene rubber to the epoxy resin is 4: 20.
the modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.5: 1;
The silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
The silane coupling agent modified alumina is amino silane coupling agent modified alumina, and the steps are the same as those of the example 1, except that the particle size of the nano alumina is 10 nm;
the curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
the organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
example 4
Embodiment 4 provides a thermal testing method for a lamp, including the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
The thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
The control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
the adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
the modified epoxy resin is carboxyl styrene butadiene rubber modified epoxy resin, and the steps are the same as example 1.
the modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
the silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
The silane coupling agent modified alumina is amino silane coupling agent modified alumina, and the steps are the same as those in example 1, except that the particle size of the nano alumina is 20 nm.
the curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
Example 5
Embodiment 5 provides a thermal testing method for a lamp, comprising the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
The thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
the control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
the digital collector in the step (2) collects the temperature once every 10s for 2 h;
The adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
the modified epoxy resin is carboxyl styrene butadiene rubber modified epoxy resin, and the steps are the same as example 1.
The modified filler is silane coupling agent modified alumina;
The procedure of the silane coupling agent-modified alumina is the same as that of example 1, except that the silane coupling agent-modified alumina is aminosilane coupling agent-modified alumina.
the curing agent is methylhexahydrophthalic anhydride.
the accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
example 6
Embodiment 6 provides a thermal testing method for a lamp, comprising the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
the thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
The control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
the adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
the modified epoxy resin is carboxyl styrene butadiene rubber modified epoxy resin, and the steps are the same as example 1.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 0.1;
The silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
the procedure of the silane coupling agent-modified alumina is the same as that of example 1, except that the silane coupling agent-modified alumina is aminosilane coupling agent-modified alumina.
The curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
the organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
example 7
Embodiment 7 provides a thermal testing method for a lamp, including the steps of:
(1) taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
the thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
the control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
the adhesive comprises 30 parts of modified epoxy resin, 1 part of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
The modified epoxy resin is carboxyl styrene butadiene rubber modified epoxy resin, and the steps are the same as example 1.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
The silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
The procedure of the silane coupling agent-modified alumina is the same as that of example 1, except that the silane coupling agent-modified alumina is aminosilane coupling agent-modified alumina.
The curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
Example 8
Embodiment 8 provides a thermal testing method for a luminaire, comprising the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
the thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
The control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
the adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 2 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
the modified epoxy resin is carboxyl styrene butadiene rubber modified epoxy resin, and the steps are the same as example 1.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
The silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
the procedure of the silane coupling agent-modified alumina is the same as that of example 1, except that the silane coupling agent-modified alumina is aminosilane coupling agent-modified alumina.
The curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
example 9
embodiment 9 provides a thermal testing method for a luminaire, comprising the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) Connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
the thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
the control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
The adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
The modified epoxy resin is a carboxylated styrene-butadiene rubber modified epoxy resin, and the steps are the same as those in example 1, except that the mass ratio of the carboxylated styrene-butadiene rubber to the epoxy resin is 0.1: 20.
the modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
the silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
the procedure of the silane coupling agent-modified alumina is the same as that of example 1, except that the silane coupling agent-modified alumina is aminosilane coupling agent-modified alumina.
The curing agent is methylhexahydrophthalic anhydride.
The accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
Example 10
embodiment 10 provides a thermal testing method for a luminaire, comprising the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
The thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
The control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
The digital collector in the step (2) collects the temperature once every 10s for 2 h;
the adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
The modified epoxy resin is carboxyl nitrile rubber modified epoxy resin, and the steps are the same as those of example 1, except that the mass ratio of the carboxyl nitrile rubber to the epoxy resin is 3: 20.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
The silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
the procedure of the silane coupling agent-modified alumina is the same as that of example 1, except that the silane coupling agent-modified alumina is aminosilane coupling agent-modified alumina.
The curing agent is methylhexahydrophthalic anhydride.
the accelerant is diethyl tetramethyl imidazole.
the organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
Example 11
embodiment 11 provides a thermal testing method for a luminaire, comprising the steps of:
(1) taking out the lamp and wiping the surface of the lamp clean;
(2) connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) and drawing a chart by the digital collector for method verification.
the thermocouple wire in the step (2) is bonded on the part to be tested through an adhesive;
the control voltage in the step (2) is 1.06 times of the rated voltage of the lamp;
the digital collector in the step (2) collects the temperature once every 10s for 2 h;
The adhesive comprises 30 parts of modified epoxy resin, 15 parts of modified filler, 22 parts of curing agent, 5 parts of accelerator and 60 parts of organic solvent.
The modified epoxy resin is carboxyl styrene butadiene rubber modified epoxy resin, and the steps are the same as example 1.
The modified filler is silane coupling agent modified graphene and silane coupling agent modified alumina according to the weight ratio of 0.3: 1;
the silane coupling agent modified graphene is epoxy silane coupling agent modified graphene, and the steps are the same as those in example 1.
the silane coupling agent modified alumina is amino silane coupling agent modified alumina, and the steps are the same as those of example 1, except that the particle size of the nano alumina is 150 nm.
The curing agent is methylhexahydrophthalic anhydride.
the accelerant is diethyl tetramethyl imidazole.
The organic solvent is a mixed solvent obtained by compounding ethyl acetate, ethanol and butyl cellosolve according to the volume ratio of 5:2: 1.
Evaluation of Performance
1. Temperature stability: the installation surfaces of the lamps (H37-10W, 85-265V and 50/60Hz) are respectively carried out according to the method of the embodimentthermal test, observing and recording the temperature of 0h, 1h, 1.5h and 2h, and respectively recording the temperature of 0h, 1h, 1.5h and 2h as T0、T1、T1.5、T2calculating A1, A2 and A3 values; the ambient temperature is 25.5 +/-0.1 ℃ and A1 is T1.5—T1，A2＝T2—T1.5，A3＝T2—T1。
2. The test results of the test conducted on the parts of the lamps (H37-10W, 85-265V, 50/60Hz) according to the method of example 4 are shown in the figure.
TABLE 1

Claims (10)

1. A method of thermal testing a lamp, comprising the steps of:
(1) Taking out the lamp and wiping the surface of the lamp clean;
(2) connecting a thermocouple wire on a digital collector to a part to be tested of the lamp, lighting the lamp to control voltage to enable the lamp to start working, and collecting data by using the digital collector;
(3) And drawing a chart by the digital collector for method verification.
2. The thermal testing method according to claim 1, wherein the thermocouple wire in the step (2) is bonded to the site to be tested by an adhesive.
3. The thermal testing method of claim 1, wherein the control voltage in step (2) is 1-1.1 times the rated voltage of the lamp.
4. the thermal test method according to claim 1, wherein the digital collector in the step (2) collects the temperature once every 10s for 1.5-3 h.
5. The thermal testing method of claim 2, wherein the adhesive comprises a modified epoxy resin, a modified filler, a curing agent, an accelerator, and an organic solvent.
6. the thermal test method according to claim 5, wherein the adhesive comprises 20-40 parts by weight of modified epoxy resin, 10-20 parts by weight of modified filler, 15-30 parts by weight of curing agent, 3-6 parts by weight of accelerator and 50-65 parts by weight of organic solvent.
7. The thermal test method according to claim 5 or 6, wherein the modified epoxy resin is a carboxyl rubber-modified epoxy resin.
8. The thermal test method of claim 5 or 6, wherein the carboxyl rubber comprises a carboxylated styrene-butadiene rubber.
9. A thermal test method according to claim 5 or 6, characterized in that the modified filler is a silane coupling agent modified filler.
10. The thermal test method of claim 5 or 6, wherein the curing agent is selected from one or more of polyamine curing agents, phenolic curing agents, anhydride curing agents, polythiol curing agents, polyisocyanate curing agents.
CN201910976059.7A 2019-10-15 2019-10-15 Thermal test method for lamp Pending CN110567683A (en)

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CN101699240A (en) * 2009-10-30 2010-04-28 中山大学 Device and method for testing radiation performance of semiconductor lighting product
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CN101935435A (en) * 2009-07-03 2011-01-05 中国石油化工股份有限公司 Toughened epoxy resin composition and preparation method thereof
CN101699240A (en) * 2009-10-30 2010-04-28 中山大学 Device and method for testing radiation performance of semiconductor lighting product
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