CN110565045B - High-surface-precision copper alloy strip and preparation method thereof - Google Patents
High-surface-precision copper alloy strip and preparation method thereof Download PDFInfo
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- CN110565045B CN110565045B CN201910973583.9A CN201910973583A CN110565045B CN 110565045 B CN110565045 B CN 110565045B CN 201910973583 A CN201910973583 A CN 201910973583A CN 110565045 B CN110565045 B CN 110565045B
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 229910001029 Hf alloy Inorganic materials 0.000 claims abstract description 34
- HDLKRBKBZRWMHV-UHFFFAOYSA-N copper hafnium Chemical compound [Cu].[Hf] HDLKRBKBZRWMHV-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000005098 hot rolling Methods 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 229910000449 hafnium oxide Inorganic materials 0.000 claims abstract description 24
- 239000006185 dispersion Substances 0.000 claims abstract description 20
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 20
- 238000005097 cold rolling Methods 0.000 claims abstract description 17
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000005498 polishing Methods 0.000 claims abstract description 16
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001257 hydrogen Substances 0.000 claims abstract description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 18
- 239000001301 oxygen Substances 0.000 claims description 18
- 229910052760 oxygen Inorganic materials 0.000 claims description 18
- 238000000137 annealing Methods 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 7
- 229910052735 hafnium Inorganic materials 0.000 claims description 7
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 244000137852 Petrea volubilis Species 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 14
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011532 electronic conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0081—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for slabs; for billets
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
- C23C8/12—Oxidising using elemental oxygen or ozone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metal Rolling (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a high-surface-precision copper alloy strip, belonging to the technical field of copper alloy strip processing, and the preparation method comprises the following steps: polishing the copper-hafnium alloy plate, and then carrying out micro-oxidation reaction in a mixed atmosphere belt furnace to obtain a surface micro-oxidized copper-hafnium alloy plate; conveying the obtained surface micro-copper hafnium oxide alloy plate into a hydrogen reduction furnace for heating reaction to form a high-hardness nano-hafnium oxide dispersion strengthened copper thin layer on the surface of the plate; and carrying out hot rolling and cold rolling on the obtained nano hafnium oxide dispersion strengthened copper plate to prepare the copper alloy strip with high surface precision. The alloy preparation method provided by the invention is simple to operate, the product yield is high, and the obtained copper alloy strip has strong oxidation resistance.
Description
Technical Field
The invention belongs to the technical field of copper alloy strip processing, and particularly provides a method for preparing a high-surface-precision copper alloy strip by using a copper-hafnium alloy as a raw material.
Background
The copper alloy strip is an important variety in copper processing materials, and is widely applied to various fields of electronics, electricity, communication, instruments and meters, instrument control machinery, medicine, optics, aviation satellites, transportation and the like. Particularly, with the development of modern communication, electronic and semiconductor industries, the demand of the copper strip is increased sharply, and particularly, the market space of the high-precision and high-performance copper strip products is wide.
However, in the process of rolling and processing the copper alloy strip, instability of higher or lower heating temperature occurs, the surface of the copper alloy has serious oxidation problem, and the surface hardness is low, so that the surface quality of the copper alloy strip is reduced in the rolling and processing process, the defective rate is increased, and the economic benefit of an enterprise is seriously affected.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the copper alloy strip with high surface precision and the preparation method thereof.
The technical scheme of the invention is as follows:
a high-surface-precision copper alloy strip is prepared by the following steps:
(1) micro-oxidation of the surface of the plate: heating the copper-hafnium alloy plate in a mixed atmosphere belt furnace to obtain a surface micro-oxidized copper-hafnium alloy plate;
(2) reducing the surface of the plate: conveying the surface micro-copper hafnium oxide alloy plate obtained in the step (1) into a hydrogen reduction furnace for heating reaction, so that a high-hardness nano-hafnium oxide dispersion strengthened copper thin layer is formed on the surface of the plate;
(3) rolling and processing: and (3) carrying out hot rolling and cold rolling on the nano hafnium oxide dispersion strengthened copper plate obtained in the step (2) to prepare the copper alloy strip with high surface precision.
The pretreatment step of the copper hafnium alloy plate in the step (1) comprises the following steps: polishing the copper-hafnium alloy plate by using abrasive paper, and cleaning the copper-hafnium alloy plate by using water for more than three times after polishing; wherein the granularity of the sand paper is 300# -500 #.
The mixed atmosphere in the step (1) is at least one mixed gas of a mixed gas of nitrogen and oxygen and a mixed gas of argon and oxygen, and the volume fraction of oxygen in the mixed gas is 0.5-5%.
And (2) installing an oxygen concentration sensor in the belt furnace in the step (1).
The heating temperature in the step (1) is 300-600 ℃, and the heating time is 0.5-2 h.
The mass fraction of hafnium in the copper-hafnium alloy plate in the step (1) is 0.1-0.5%.
In the step (2), the heating temperature is 400-700 ℃, and the heating time is 0.5-2 h.
The hot rolling and the cold rolling in the step (3) comprise the following specific steps: and (3) comprehensively heating the nano hafnium oxide dispersion strengthened copper plate obtained in the step (2) and carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 400-500 ℃ for annealing treatment for 10-30min, then rapidly and uniformly cooling to room temperature, and carrying out cold rolling deformation treatment at room temperature to obtain the copper alloy strip with high surface precision.
The hot rolling conditions are as follows: hot rolling temperature is 300-450 deg.C, hot rolling pressure is 0.5-0.7Mpa, and hot rolling speed is 8-12 m/min; the cold rolling pressure is 1 x 10-3-1×10-1Mpa。
The beneficial technical effects of the invention are as follows:
the invention puts the copper hafnium alloy plate on N2+O2Or argon + O2Heating in a mixed atmosphere belt furnace to form copper oxide and oxidation on the surface of the plateHeating the surface of the composite oxide of hafnium in a hydrogen reduction furnace to form a nano hafnium oxide dispersion strengthened copper thin layer on the surface, wherein the reaction equation is 2CuO + Hf-2 Cu + HfO2And then hot rolling and cold rolling to obtain the copper alloy strip. The thin-layer hafnium oxide dispersion strengthening copper is generated on the surface of the copper-hafnium alloy, the surface hardness is improved, the oxidation resistance of a copper alloy strip is enhanced, the mechanical and physical properties of a base material cannot be influenced, the nano hafnium oxide is different from a precipitation phase, the copper base body has no solid solubility, the copper alloy strip has excellent high-temperature stability and high hardness, the size of formed particles is in a nanometer level, the dispersion strengthening effect is realized through an olorowan mechanism, the dislocation motion and the crystal boundary movement can be effectively hindered at high temperature, the growth of crystal grains is inhibited, and the mechanical properties of the copper material are greatly improved. Meanwhile, the nano hafnium oxide can slow down the diffusion of oxygen in the copper matrix at high temperature, thereby improving the oxidation resistance. And the surface finish and the surface precision of the copper alloy strip can be improved in the rolling process, and the surface roughness reaches 0.1 micron, so that the yield is improved.
According to the invention, the copper hafnium alloy is subjected to polishing pretreatment, the surface of the plate is roughened, the specific surface area is increased as much as possible, the reaction can be accelerated, and the micro-oxidation reaction can be uniformly and stably carried out.
The invention can well control the oxygen content in the system on line by modifying the belt furnace in the micro-oxidation reaction process and installing the oxygen sensor, thereby ensuring the stability of the oxygen content in the reaction process and leading the oxidation reaction to be carried out stably.
According to the invention, finally, hot rolling and cold rolling are sequentially carried out, the advantages of a cold rolling technology are combined, the strength and hardness of the reinforced material are further expanded, and the mechanical property of the material are reinforced by cooperating with the generated thin-layer hafnium oxide dispersion strengthened copper.
Detailed Description
The present invention will be described in detail with reference to examples.
Example 1
The mass fraction of hafnium is 0.1%Uniformly polishing the copper-hafnium alloy plate by using abrasive paper with the granularity of 300#, cleaning the copper-hafnium alloy plate by using water for three times after polishing, and drying the copper-hafnium alloy plate by using cold air; then at O2Volume fraction of 0.5% of N2+O2Heating in a mixed atmosphere belt furnace, monitoring the oxygen content in the system through an oxygen sensor, wherein the heating temperature is 600 ℃, and reacting for 0.5 h. Heating the copper-hafnium alloy plate with the micro-oxidized surface in a hydrogen reduction furnace, wherein the reduction temperature is 400 ℃, and reacting for 2 hours to form a high-hardness nano hafnium oxide dispersion strengthened copper thin layer on the surface of the plate; and (3) comprehensively heating the obtained nano hafnium oxide dispersion strengthened copper plate, carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 400 ℃ for annealing treatment for 10min, then rapidly and uniformly cooling to room temperature, carrying out room temperature cold rolling deformation treatment, and finally preparing the copper alloy strip with high surface precision (surface roughness of 0.4 mu m), wherein the oxidation resistance temperature of the obtained strip is 450 ℃, and the surface hardness is HV 114. As can be seen from table 1, the resulting strip of the present invention has an oxidation resistance temperature that is increased by about 50 ℃ over the strip obtained in comparative example 1.
Example 2
Uniformly polishing a copper-hafnium alloy plate with the mass fraction of hafnium of 0.5% by using abrasive paper with the granularity of 400#, cleaning the copper-hafnium alloy plate with water for four times after polishing, and drying the copper-hafnium alloy plate with cold air; then at O2Volume fraction of 5% of N2+O2Heating in a mixed atmosphere belt furnace, monitoring the oxygen content in the system by an oxygen sensor, wherein the heating temperature is 400 ℃, and reacting for 1 h. Heating the copper-hafnium alloy plate with the micro-oxidized surface in a hydrogen reduction furnace, wherein the reduction temperature is 700 ℃, and reacting for 0.5h to form a high-hardness nano hafnium oxide dispersion strengthened copper thin layer on the surface of the plate; comprehensively heating the obtained nano hafnium oxide dispersion strengthened copper plate, carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 450 ℃ for annealing for 20min, then rapidly and uniformly cooling to room temperature, carrying out cold rolling deformation treatment at room temperature, and finally preparing the copper alloy strip with high surface precision (surface roughness of 0.1 mu m), wherein the oxidation resistance temperature of the obtained strip is 550 ℃, the surface hardness is HV 165, and meanwhile, the oxidation resistance temperature of the obtained strip is improved by about the same as that of the strip obtained in the comparative example 1150℃。
Example 3
Uniformly polishing a copper-hafnium alloy plate with the mass fraction of hafnium of 0.3% by using abrasive paper with the granularity of 450#, cleaning the copper-hafnium alloy plate with water for four times after polishing, and drying the copper-hafnium alloy plate with cold air; then at O2Volume fraction of 2% of N2+O2Heating in a mixed atmosphere belt furnace at 500 ℃ for 1.5 h. Heating the copper-hafnium alloy plate with the micro-oxidized surface in a hydrogen reduction furnace, wherein the reduction temperature is 600 ℃, and reacting for 0.5h to form a high-hardness nano hafnium oxide dispersion strengthened copper thin layer on the surface of the plate; and (2) comprehensively heating the obtained nano hafnium oxide dispersion strengthened copper plate, carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 450 ℃ for annealing for 30min, then rapidly and uniformly cooling to room temperature, carrying out cold rolling deformation treatment at room temperature, and finally preparing the copper alloy strip with surface precision (surface roughness of 0.25 mu m), wherein the oxidation resistance temperature of the obtained strip is 520 ℃, the surface hardness is HV 148, and the oxidation resistance temperature of the obtained strip is increased by about 120 ℃ compared with that of the strip obtained in the comparative example 1.
Example 4
Uniformly polishing a copper-hafnium alloy plate with the mass fraction of hafnium of 0.2% by using abrasive paper with the granularity of 500#, cleaning the copper-hafnium alloy plate with water for five times after polishing, and drying the copper-hafnium alloy plate with cold air; then at O23% volume fraction of N2+O2Heating in a mixed atmosphere belt furnace at 550 ℃ for 2 h. Heating the copper-hafnium alloy plate with the micro-oxidized surface in a hydrogen reduction furnace, wherein the reduction temperature is 650 ℃, and reacting for 1h to form a high-hardness nano-hafnium oxide dispersion strengthened copper thin layer on the surface of the plate; and (2) comprehensively heating the obtained nano hafnium oxide dispersion strengthened copper plate, carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 450 ℃ for annealing for 30min, then rapidly and uniformly cooling to room temperature, carrying out cold rolling deformation treatment at room temperature, and finally preparing the copper alloy strip with high surface precision (surface roughness of 0.3 mu m), wherein the oxidation resistance temperature of the obtained strip is 480 ℃, the surface hardness is HV 126, and the oxidation resistance temperature of the obtained strip is increased by about 80 ℃ compared with that of the strip obtained in the comparative example 1.
Comparative example 1
Uniformly polishing a copper-aluminum alloy plate with the aluminum content of 0.1% by using abrasive paper with the granularity of 300#, cleaning the plate by using water for three times after polishing, and drying the plate by using cold air; then at O2Volume fraction of 0.5% of N2+O2Heating in a mixed atmosphere belt furnace, monitoring the oxygen content in the system through an oxygen sensor, wherein the heating temperature is 600 ℃, and reacting for 0.5 h. Heating the copper-aluminum alloy plate with the surface micro-oxidized in a hydrogen reduction furnace, wherein the reduction temperature is 400 ℃, reacting for 2h to form a nano-alumina dispersion strengthened copper thin layer on the surface of the plate, comprehensively heating the obtained nano-alumina dispersion strengthened copper plate, carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 400 ℃ for annealing treatment for 10min, then rapidly and uniformly cooling to room temperature, carrying out cold rolling deformation treatment at room temperature, and finally preparing the high-surface-precision copper alloy strip, wherein the oxidation resistance temperature of the obtained strip is 400 ℃, and the surface hardness is HV 103.
The comparison of the properties of the copper alloy strip with high surface precision prepared in example 1 and the copper alloy strip prepared in comparative example 1 is shown in table 1.
TABLE 1
Note: HV is a Vickers hardness which is a common international method of expressing hardness.
Claims (3)
1. The preparation method of the copper alloy strip with high surface precision is characterized by comprising the following steps:
(1) micro-oxidation of the surface of the plate: heating the copper-hafnium alloy plate in a mixed atmosphere belt furnace to obtain a surface micro-oxidized copper-hafnium alloy plate; the heating temperature is 300-600 ℃, and the heating time is 0.5-2 h; the mass fraction of hafnium in the copper-hafnium alloy plate is 0.1-0.5%;
(2) reducing the surface of the plate: conveying the surface micro-copper hafnium oxide alloy plate obtained in the step (1) into a hydrogen reduction furnace for heating reaction, so that a high-hardness nano-hafnium oxide dispersion strengthened copper thin layer is formed on the surface of the plate; the heating temperature is 400-700 ℃, and the heating time is 0.5-2 h;
(3) rolling and processing: carrying out hot rolling and cold rolling processing on the nano hafnium oxide dispersion strengthened copper plate obtained in the step (2) to prepare a high-surface-precision copper alloy strip;
the hot rolling and the cold rolling specifically comprise the following steps: comprehensively heating the nano hafnium oxide dispersion strengthened copper plate obtained in the step (2) and carrying out hot rolling, after the hot rolling is finished, putting the obtained plate into an annealing furnace at 400-500 ℃ for annealing treatment for 10-30min, then rapidly and uniformly cooling to room temperature, and carrying out cold rolling deformation treatment at room temperature to obtain the copper alloy strip with high surface precision; the hot rolling conditions are as follows: the hot rolling temperature is 300-450 ℃, the hot rolling pressure is 0.5-0.7MPa, and the hot rolling speed is 8-12 m/min; the cold rolling pressure is 1 x 10-3-1×10-1MPa；
The pretreatment step of the copper hafnium alloy plate in the step (1) comprises the following steps: polishing the copper-hafnium alloy plate by using abrasive paper, and cleaning the copper-hafnium alloy plate by using water for more than three times after polishing; wherein the granularity of the sand paper is 300# -500 #.
2. The copper alloy strip according to claim 1, wherein the mixed atmosphere in step (1) is at least one of a mixed gas of nitrogen and oxygen, and a mixed gas of argon and oxygen, and the volume fraction of oxygen in the mixed gas is 0.5-5%.
3. The copper alloy strip according to claim 1, wherein an oxygen concentration sensor is installed in the belt furnace in step (1).
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| US5551970A (en) * | 1993-08-17 | 1996-09-03 | Otd Products L.L.C. | Dispersion strengthened copper |
| CN1276984C (en) * | 2003-12-09 | 2006-09-27 | 中国科学院金属研究所 | Frame material for copper leading wire intensified by dispersed alumina |
| CN101121974B (en) * | 2007-09-19 | 2014-04-30 | 洛阳理工学院 | High-strength high-conduction strengthened dispersion copper alloy and preparation method thereof |
| CN101956094B (en) * | 2010-10-15 | 2011-11-30 | 哈尔滨工业大学深圳研究生院 | Preparation method of high-strength and high-conductivity dispersion-strengthened alloy |
| CN102660696A (en) * | 2012-05-14 | 2012-09-12 | 南昌大学 | Dispersion strengthening copper-based composite material and preparation method thereof |
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