CN110556331B - Composite material and manufacturing method of electrostatic chuck using same - Google Patents
Composite material and manufacturing method of electrostatic chuck using same Download PDFInfo
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- CN110556331B CN110556331B CN201910879522.6A CN201910879522A CN110556331B CN 110556331 B CN110556331 B CN 110556331B CN 201910879522 A CN201910879522 A CN 201910879522A CN 110556331 B CN110556331 B CN 110556331B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Abstract
The invention provides a method for manufacturing a composite material, a method for manufacturing an electrostatic chuck and an adhesive material, which can perform better connecting operation when the adhesive material similar to an adhesive film is used for a ceramic material and a metal material. The cover film 25 and the base film 27 are water-soluble, and the adhesive 23 is insoluble in water (or hardly soluble in water). Therefore, in the production of the ceramic side member 31, the cover film 25 of the adhesive film 21 of the vacuum suction table 29 is held, and the base film 27 of the 1 st adhesive layer 23a is removed by dissolving in water, so that the 2 nd main surface a can be exposed.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a composite material and a manufacturing method of an electrostatic chuck using the same.
Background
In the semiconductor manufacturing industry and the like, workpieces such as semiconductor wafers (e.g., silicon wafers) are processed. In order to improve the dry etching precision, it is necessary to fix the position of the semiconductor wafer reliably as a part for manufacturing the fixed semiconductor wafer.
As such an electrostatic chuck, a metal substrate having a cooling function and bonded to a lower surface (bonding surface) of a ceramic substrate with an adhesive such as a resin material interposed therebetween is used.
As a material of the above adhesive, for example, a thermosetting adhesive made of silicone resin is used. When the thermosetting adhesive is used, for example, a thermosetting adhesive having viscosity is applied to the upper surface (adhesive surface) of the metal substrate, and the ceramic substrate is covered with the thermosetting adhesive under pressure and heat to cure the thermosetting adhesive, whereby the ceramic substrate and the metal substrate are bonded to each other.
As a technique for bonding a ceramic substrate and a metal substrate, a technique for disposing an adhesive film P1 between the ceramic substrate and the metal substrate is considered as shown in fig. 7 (a).
As the adhesive film P1, a cover film P3 is provided on one surface of a semi-permanent film adhesive P2, and a base film is provided on the other surface.
With this adhesive film P1, the following can be referred to in bonding a ceramic substrate and a metal substrate.
First, the adhesive film P1 is peeled off from the cover film P3. Similarly, the other adhesive film P1 is peeled from the cover film P3, and the exposed film adhesive P2 is adhered to the metal substrate and peeled from the base film P4. After that, the base films P4 are peeled off and the exposed film adhesives P2 are bonded to each other, and the adhesives are thermally cured to bond the ceramic substrate and the metal substrate.
However, the film adhesive P2 has adhesive properties, and the actual film adhesive P2 is peeled from the cover film P3 without being peeled as shown in fig. 7, and the film adhesive is bonded to the cover film P3 and peeled from the base film P4 as shown in fig. 7 (c).
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a manufacturing method using a composite member and a manufacturing method of an electrostatic chuck, which can perform appropriate work when a ceramic member and a metal member are bonded to each other by using, for example, an adhesive film.
The technical scheme of the invention is as follows:
(1) First, a first cover film layer is covered on the first main surface of the adhesive layer, and a second cover film layer is covered on the second main surface of the adhesive layer.
The manufacturing method of the composite member comprises the steps that the first covering film layer and the second covering film layer are provided, the first covering film layer has a dissolving property, and the adhesive layer cannot be dissolved in a solution or has a property of being difficult to dissolve.
In addition, in the method for manufacturing the composite member, the removing solution on the first covering film layer of the adhesive member is dissolved to expose the first main surface of the adhesive layer, and the adhesive process of the member to be fixed is performed on the exposed first main surface of the adhesive layer.
In this way, at least the first cover film layer has a solution-dissolving property, but the adhesive layer cannot be dissolved in the solution or the first cover film layer solution is removed, so that the first main surface of the adhesive layer can be exposed. Therefore, the first main surface of the adhesive layer is exposed to adhere the fixed member.
That is, the present invention can suppress peeling of a substrate such as a base film by removing the first coverlay solution without peeling from a previous adhesive layer to the first coverlay (e.g., a cover film) to expose the adhesive layer and lifting up the adhesive layer.
Therefore, the composite member can be manufactured more efficiently (for example, in the work of connecting the ceramic substrate and the metal substrate of the electrostatic chuck).
(2) Further, the second cover film layer of the adhesive member is removed to expose the second main surface of the adhesive layer, and the adhesive member is bonded to the second main surface of the adhesive layer.
In addition, the second covering film layer of the adhesive member is removed from the solution, for example, and the second main surface of the adhesive layer is exposed. Therefore, the predetermined member can be adhered to the exposed second main surface of the adhesive layer.
(3) Further, the solution of the second cover film layer of the adhesive member is removed by using the solution dissolving property on the second cover film layer, so that the second main surface of the adhesive layer is exposed.
And the second covering film layer has solution dissolving property, and the dissolving solution of the second covering film layer is removed as the first covering film layer.
(4) Further, as the adhesive member, at least a first adhesive member and a second adhesive member are used, the first cover film layer of the adhesive of the first adhesive member is removed, the member for fixing the first main surface of the exposed adhesive layer is bonded, the first cover film layer of the adhesive layer of the second adhesive member is removed, the member for fixing the first main surface of the exposed adhesive layer is bonded, the second cover film layer of the adhesive layer of the first adhesive member is removed, the second main surface of the adhesive is exposed, the second cover film layer of the adhesive layer of the second adhesive member is removed, and the second main surface of the adhesive layer is exposed, thereby performing the adhesion process.
And the covering film layer of the adhesive layer of the first adhesive material is removed to expose the first main surface of the adhesive layer, so that the fixed material can be adhered. In addition, the first covering film layer of the adhesive layer of the second adhesive member is removed to expose the first main surface of the first adhesive layer, so that other predetermined members can be adhered.
In the first adhesive member, the second cover film layer of the adhesive layer is removed to expose the second main surface of the adhesive layer, and the second cover film layer of the adhesive layer is removed to expose the second main surface on the second adhesive main surface. The second main surface of the adhesive layer of the first adhesive member and the second main surface of the adhesive layer of the second adhesive member are bonded to each other, so that the predetermined member (for example, a ceramic substrate) and the other predetermined member (for example, a metal substrate) can be bonded to each other relatively easily.
(5) Further, a holding member of an adhesive member in contact with the second cover film layer is used. Furthermore, the adhesive part between the adhesive part and the holding part is maintained, so that the adhesive part is easier to adhere.
(6) Further, the adhesion portion which is not vacuum sucked is held and maintained. Further, an appropriate holding member is exemplified.
(7) Furthermore, the thickness of the second covering film layer is larger than that of the first covering film layer. And, remove the first cover rete and dissolve, the second cover rete still remains, keeps the use of member, has the advantage of connecting the adhesion member easily.
(8) Further, a method for manufacturing an electrostatic chuck, wherein a ceramic substrate for suction electrode provided with an electrostatic chuck is brought into contact with a metal substrate by using 1 or a plurality of the adhesive members described in the first to seventh aspects.
In the method for manufacturing the electrostatic chuck, the first covering film layer of the adhesive member is removed to expose the first main surface of the adhesive layer, the ceramic substrate or the metal substrate is adhered, the second covering film layer of the adhesive member is removed to expose the second main surface of the adhesive, and the metal substrate and the ceramic substrate are adhered.
And the first main surface of the adhesive layer of the adhesive material is adhered with the ceramic substrate, and the second main surface of the adhesive layer of the adhesive material is adhered with the metal substrate. Or a metal substrate having a first main surface to which an adhesive layer of an adhesive material is bonded, and a ceramic substrate having a second main surface to which an adhesive layer of an adhesive material is bonded.
Therefore, in the manufacturing method of the electrostatic chuck, the electrostatic chuck can be manufactured more easily by using these steps.
(9) Further, the adhesive and the first covering film layer covering the first main surface of the adhesive layer and the second covering film layer covering the second main surface of the adhesive layer are provided with the article related to the adhesive member.
At least the first covering film layer has solution solubility or the first covering film layer with insoluble adhesive dissolves.
Thus, at least the first covering film layer has solution solubility, and the adhesive has solution difficult-to-dissolve property, and the first covering film layer has difficult-to-dissolve property. And removing the first covering film layer solution to dissolve, and exposing the first main surface of the adhesive layer. Thus, the predetermined member can be adhered to the exposed first main surface of the adhesive layer.
That is, in the present invention, as in the conventional case, the first cover film layer (for example, cover film) of the adhesive layer is peeled off, the first cover film layer solution is removed to expose the adhesive layer, and the adhesive layer is lifted up, whereby peeling of a base material such as a base film can be suppressed. And deformation and increase in thickness of the adhesive layer can be suppressed.
Thus, the adhesive member can be used to produce the composite material more efficiently.
(10) Further, the ceramic substrate and the metal substrate disposed on the suction electrode of the electrostatic chuck are bonded to each other by using the adhesive member.
The following is a description of the respective configurations of the present invention:
the predetermined member may be a ceramic substrate, another predetermined member, or a metal substrate, i.e., a surface in the thickness direction of each layer. The covering films of the first covering film layer and the second covering film layer are respectively called a first covering film layer and a second covering film layer. The material of the first cover film layer and the second cover film layer may be dissolved in various solutions such as water and alcohol.
Although the thicknesses of the first covering film layer and the second covering film layer are not limited, if the thickness is 30 μm or less (for example, a film), since the film itself has a self-strength, it takes time to dissolve the film at 200 μm or more, since the film itself is too rigid, and the preferable range is 30 to 200 μm.
The first and second coating layers were dissolved in the first and second coating layers to a thickness of 40 μm, and the first and second coating layers were stirred in a sufficient amount (e.g., 800 ml) of a solution in a film having a size of 35mm × 24mm for 3 minutes or less, whereby the films of the first and second coating layers could be observed.
When the thickness of the coating film layer is larger than 40 μm, the evaluation time may be relatively long by scaling the thickness. That is, when the thickness of the covering film layer is 80 μm, the time is 6 minutes or less, and when the thickness is 120 μm, the time is 9 minutes or less.
In addition, the adhesive layer is difficult to dissolve, and when a film having the same size and the same thickness is dissolved in the same solution, it takes a relatively long time to see (compared with the case where the adhesive layer can be dissolved).
In the adhesive layer, a predetermined member (e.g., a ceramic substrate) and another predetermined member (e.g., a metal substrate) are bonded to each other, and a thermosetting adhesive is used as a material of the adhesive.
For example, as described later, a resin material including a silicone resin, a transparent resin, an epoxy resin, or the like, or an adhesive including a metal material may be selected.
The so-called electrode for adsorption is an electrostatic electrode, and as a material, tungsten, molybdenum, or the like is often used.
Drawings
Fig. 1 is a partially broken perspective view of an electrostatic chuck according to example 1.
Fig. 2 is a view illustrating a part of a method for manufacturing the electrostatic chuck according to example 1.
FIG. 3 is a view illustrating a part of the manufacturing method of the electrostatic chuck in example 1 (ceramic side member process)
Fig. 4 is a view illustrating a part of the method of manufacturing the electrostatic chuck according to example 1 (a process for manufacturing a metal side member or the like).
Fig. 5 is a view illustrating a part of a method of manufacturing an electrostatic chuck according to embodiment 2.
Fig. 6 a part of the manufacturing process of the mucous membrane in example 3 is shown in an explanatory view.
Fig. 7 is an explanatory diagram of a conventional technique.
Among them, 1-electrostatic chuck (composite member), 3-semiconductor wafer, 5-ceramic substrate, 5 a-ceramic member, 5-ceramic substrate (predetermined member), 7-metal substrate (other predetermined member), 9-adhesive layer, 11-electrode for suction, 13-heating element, 21-adhesive film (adhesive member), 21 a-adhesive film, 23-adhesive layer, 23 a-first adhesive layer, 23B-second adhesive layer, 25-cover film (first cover film layer), 27-base film (second cover film layer), 29-vacuum suction table, 29 a-vacuum suction table upper surface, 31-ceramic side member, 33-metal side member, A1-first adhesive layer first main surface, A2-first adhesive layer second main surface, B2-second adhesive layer second main surface, P1-adhesive film, P2-adhesive film, P3-cover film, P4-base film.
Detailed Description
Next, a method for manufacturing a composite member, a method for manufacturing an electrostatic chuck, and an embodiment of an adhesive member according to the present invention will be described.
Example 1
Here, as the first embodiment, for example, the semiconductor wafer is held by a suction electrostatic chuck.
1-1, constitution of Electrostatic CHUCK
First, the electrostatic chuck structure according to the first embodiment will be described with reference to fig. 1.
As shown in fig. 1, in the electrostatic chuck 1 of the first embodiment, the semiconductor wafer 3 of the upper workpiece in fig. 1 is held by the suction heating device, and the ceramic substrate 5 and the metal substrate 7 are bonded by the adhesive layer 5.
Here, the electrostatic chuck 1 is a device having a disk shape in a plan view (as viewed from a thickness direction (vertical direction in fig. 1)). The ceramic substrate 5 is a ceramic heater including an electrostatic electrode 11 and a heating element 13, and the metal substrate 7 is attached coaxially with the ceramic substrate 5.
In the electrostatic chuck 1, as shown in the figure, the lift pin hole of the lift pin is inserted, and cooling gas for cooling is supplied to the suction surface side (upper side in fig. 1) where the semiconductor wafer 3 is cooled.
The respective configurations of the electrostatic chuck 1 will be described in detail below.
Ceramic substrate: as shown in FIG. 1, the ceramic substrate 5 has a disk shape with an outer diameter of 310mm × a thickness of 5 mm. Inside, above in fig. 1, an electrostatic electrode 11, a heating element 13, and the like are arranged in this order. In the ceramic substrate 5, as shown in the figure, the electrostatic electrode 11 and the heating element 13 are provided with an internal wiring layer electrically bonded thereto.
The ceramic substrate 5 is formed by integrally stacking a plurality of ceramic layers (not shown), and is an insulator (dielectric) from the ceramic to a portion (ceramic portion) 5 a. The ceramic portion 5a is a ceramic sintered body formed of aluminum having a purity of 92% and 99.8%.
A metal substrate: the metal substrate 7 is in the shape of a disk having an outer diameter of phi 310mm x 5mm, such as a metal plate made of an aluminum alloy of A6061.
The metal substrate 7 is not shown in the drawing, and is designed to have a circuit (cooling path) through which a cooling fluid (coolant) flows to cool the ceramic substrate 5 (semiconductor wafer 3 described later).
An adhesive layer: the adhesive layer 9 is in the shape of a disk having an outer diameter of 300mm and a thickness of 0.3mm, such as a silicon-based thermosetting adhesive (e.g., KE-1855 manufactured by shin-Etsu chemical industries)
Electrostatic electrode: the electrostatic electrode 11 is formed of a material having a circular shape. When the electrostatic chuck 1 is used, a high DC voltage is applied to the electrostatic electrode 11, and the semiconductor wafer 3 is attracted and fixed at this time. In addition to the electrostatic electrode 11, various well-known configurations may be employed, including unipolar and bipolar electrodes. The electrostatic electrode 11 is made of a conductive material such as W.
A heating body: the heating element 13 is formed of a metal material (W, etc.) by applying a voltage and applying a current.
1-2, method for manufacturing electrostatic chuck
Next, a method of manufacturing the electrostatic chuck 1 (overall manufacturing process) will be described.
(1) As the raw material of the ceramic substrate 5, for example,the main component is Al 2 O 3 、MgO、CaO、SiO 2 ；
(2) Mixing the powders, wet-pulverizing, and dehydrating and drying;
(3) Then, a solvent is added to the powder and mixed to form a slurry.
Next, the aluminum coating layer of each ceramic layer was formed by using the slurry. Further, tungsten is mixed and used with the above-mentioned raw material powder for the aluminum material to form a slurry, which is used as a vacuum plating film.
Then, printing is performed at predetermined positions on the vacuum-deposited film by using the vacuum-deposited film to form the electrostatic electrode 11 and the heating element 13. Then, several coated films were thermally pressed to form a laminated film.
Next, the heat-press laminated film is cut into a predetermined shape (for example, a disk shape). Next, the cut laminate film is fired in a reducing atmosphere at 1400 to 1600 ℃ for 5 hours (for example, 1550 ℃ C.) to obtain an aluminum sintered body.
Then, the aluminum sintered body is subjected to a necessary processing such as a suction surface side through sintering. Further, a metal substrate 7 is manufactured, specifically, a disk-shaped aluminum alloy metal plate is cut to form a metal plate having a predetermined thickness.
Next, a method of adhering the ceramic substrate 5 and the metal substrate 7 using an adhesive film 21 (fig. 2 (a)) described later will be described later.
Thus, the electrostatic chuck 1 is completed.
1-3, adhesive film
Next, the adhesion between the ceramic substrate 5 and the metal substrate 7 will be described using the adhesive film 21.
Composition of adhesive film: as shown in fig. 2 a), the adhesive film 21 is composed of adhesive layers (i.e., the adhesive layer 9 formed by bonding the substrate 5 and the metal substrate 7 after curing) and 23 in a state before curing the adhesive layer 9, a cover film 25 attached to the adhesive layer in the thickness direction (downward in the figure), and a base film 27 attached to the adhesive layer 23 in the thickness direction (downward in the figure).
Also, the adhesive 23 has a weak adhesiveness that adheres the cover film 25 and the base film 27. The cover film 25 is, for example, a water-soluble film having a thickness in the range of 30 to 20 μm (e.g., 100 μm). I.e. disappear after dissolving in water.
Similarly, the base film 27 is, for example, a water-soluble film having a thickness in the range of 30 to 200 μm (e.g., 100 μm). The cover film 25 and the base film 27 are made of PVD film manufactured by AICELLO, a product of japan synthetic chemical industry co.
In addition, the film has extremely high solubility, including alcohols, chloroform, DMSO, DMF, and the like, in addition to water. However, among the above-mentioned membranes, the energy mediator, ketone, lipid, and aromatic carbon oxygen do not dissolve, and examples of the extremely strong solvent does not dissolve include the use of the cover film 25 and base film 27 made of silicone resin or PET instead.
In addition, the adhesive layer 23, as in the above example, is a layer in a state before the silicon based thermosetting adhesive is cured, and has a thickness of 0.3mm. The adhesive layer 23 has a property of being insoluble in water. As the material of the adhesive layer 23, a material that is less soluble in water can be used as compared with the cover film 25 and the base film 27.
Here, various adhesives that can be used for the adhesive layer 23 (adhesive layer 8) will be described. The adhesive can be selected from silicone resin and epoxy resin. In view of high heat resistance, epoxy-based resins are used in relatively large amounts, and soft acrylic resins can be used to relax and absorb thermal stress caused by adhesion of different materials.
As the silicone resin, a condensation curing type may be used instead of the additional curing type. The condensation curing type may use a curing inhibitor to generate by-products. The additive curing type is a curing inhibitor generated by a nitrogen compound, a phosphorus compound and a sulfur compound, and it is necessary to pay attention to the kind and the detergency of the adhesive material, and a large part of by-products is not adhered.
With the addition of a curable silicone adhesive, the following types of articles can be used. KE-1831, KE-1833, KE-1835-S, KE-1850, KE-1854, KE-1855, KE-1880, KE-1884, KE-1885, IO-SE55, AL-300, KE-1204, KE-1280, KE-1282, KE-1283, 56, KE-1285, KE-1897, KE-109E, KE-106, KE-1014, KE-1056, KE-1057, KE-1061, KE-1062, KE-1011, KE-1012, KE-1013, KE-1J, and KE-1053 (all of the above, shin chemical industry Co., ltd.). JCR6101, JCR6102, JCR6120F, JCR6121, JCR6122, JCR6123, JCR6125, JCR6126, JCR6140, JCR6132N, JCR6106, JCR6107, JCR6108, JCR6109, JCR6110, JCR6134H, SH8501, SE1811, SE1850, SE1815CV, SE1816CV, CY52-211, SE1821, CY52-205, CY52-005, SE1880, 1885, CY52-276, SE1891H, SE174, CY52-248, SE1700, SE1701, SE4450, SE4400, SE4410, SE4420, SE4422 (manufactured by TORAY). TSE3051, TSE3212, TSE322, TSE3221S, TSE322, TSE325, TSE3250, TSE3251-C, TSE325-B, TSE326, TSE3261-G, TSE326M, TSE3280-M, TSE 3281-G, XE13-B3208, TSE3360, TSE3380, TSJ3155, TSJ3195-W, TSJ3185, TSJ3187, TSE3033, TSE3331K, TSE3335, XE14-B5778, and TSJ3175 (manufactured by the JAPAN contract).
The various adhesives described above can be used by applying a liquid adhesive, a cover film 25 of a water-soluble film, or a base film 25, and weakening the semi-cured state after heating. In other words, the B station state may be used. The semi-cured (B-cured) had low fluidity and the thickness was not increased by decomposition during use.
In addition, the raw materials can be blended to adjust the characteristics of the adhesive. An additional curable silicone resin comprising (A) a polyalkyloxyalkylene group having at least a part of at least 2 atoms bonded thereto, (B) a polyalkyloxyalkylene group having an alkenyl group and (C) a polyalkyloxy group having at least two atoms bonded to an oxygen atom, wherein the polyalkyloxy group is formed by a hydrosilylation reaction catalyst.
(C) The component (2) is a component in which an alkenyl group and an atomically bound water atom accelerate a hydrosilylation reaction. The curing process of the hydrogen silane bridge may be said to be hydrogen silane bridge-linking. (B) The amount of the component (A) is sufficient to bridge the component (A). The atom in the atom-bonded alkenyl group (B) in the component (A) is in the range of 0.5 to 10, preferably 0.8 to 1.2.
In the composition, the number of the alkenyl groups 1 bonded to silicon atoms in the component (a) is less than the number of the oxygen atoms bonded to silicon atoms in the component (B), and the composition tends not to form a bridge, while if the number exceeds this range, the heat resistance of the bridge of the composition tends to be low. (C) The amount of the component (A) is in the range of 1 to 1000ppm, preferably 0.1 to 500ppm, in terms of the weight of the platinum metal in the composition.
(C) If the amount of the component(s) is less than the above range, the curing rate of the resulting composition tends to be slow, while if it exceeds the above range, problems such as coloring occur without affecting the curing rate.
The component (D) may be aluminum, silica (wet silica, dry silica, semi-silica), barium carbonate, calcium carbonate, silicon, or nitride as a necessary filler.
Further, the reaction rate of hydrosilylation of the composition is adjusted to improve the stability of a semi-cured or fully cured product, and a reaction inhibitor of the component (E) is blended.
As the reaction inhibitor for inhibiting hydrosilylation, alkynols such as 3-methyl-1-butyn-3-OAR, 3, 5-dimethyl-1-ethan-3-OAR, and iron butanol; 3-methyl-3-butyne-1-, 3, 5-dimethyl-3-hexene and the like; 1,3,5, 7-tetramethyl-1, 3,5, 7-tetravinylcyclo-tetrasiloxane, 1,3,5, 7-tetramethyl-1, 3,5, 7-tetravinylcyclo-tetrasiloxane
The amount of the hydrosilylation inhibitor to be added is 0.00001 to 5% by weight based on the total weight of the component (A) depending on the curing conditions of the composition.
(F) The component (A) is a component having good adhesion to the bridge of the above composition, and silicon element in one molecule is bonded, even if the alkoxy group has at least one siloxane as an adhesion promoter.
The component (D), the component (E) and the component (F) are added to the above composition in an appropriate amount as required.
The manufacturing method of the adhesive film comprises the following steps: the adhesive film 21 can be produced by the following method.
First, the adhesive layer 23 material (e.g., silicon-based thermosetting adhesive) in the best state is applied on the base film 27 by an application device such as a ROLL heater to form a coating layer (not shown)
Then, the coating layer is dried to a semi-cured state by heating (for example, 100 ℃) lower than the curing temperature to form the adhesive 23, and then, a cover film 25 is attached to the surface of the semi-cured adhesive layer 23 to preserve and prevent contamination. The cover film 25 is applied before the semi-curing. 20
As described above, the adhesive 23 has semi-cured adhesiveness, and the adhesiveness here is a state in which the cover film 25 and the base film 27 are bonded to the adhesive layer 23.
Thereby completing the adhesive film 21.
1-4, method for adhering ceramic substrate and metal substrate
Next, a method of adhering the ceramic substrate 5 and the metal substrate 7 using the adhesive film 21 will be described.
As shown in fig. 2 b, the adhesive film 21 is fixed to the surface (surface in the thickness direction: upper part 29a in fig. 2) of the vacuum suction table 29, and the base film 27 of the adhesive film 21 is brought into contact with the upper surface 29a of the vacuum suction table 29 to mount the adhesive film 21 on the vacuum suction table 29.
A plurality of through holes (not shown) penetrating in the thickness direction are formed in the vacuum suction table 29, and the pressure is reduced in the other side (lower side in fig. 2) of the through holes, whereby the adhesive film 21 can be fixed to the vacuum suction table 29.
Next, as shown in FIG. 2 (c), water is sprayed onto the cover film 25 as shown above, for example, in a shower. Here the cover film 25
Has water solubility, and gradually dissolves and thins.
Subsequently, the cover film 25 disappears completely in water, as shown in fig. 2 (d). Fig. 2 (d) is also exposed above the first main surface A1 of the adhesive layer 23.
Next, the vacuum suction table 29, the base film 27, and the adhesive layer 23 in the state shown in fig. 2 (d) are mounted on the first main surface A1 of the adhesive layer 23 on the surface of the ceramic substrate 5, contrary to the state shown in fig. 3 (a).
Thus, the ceramic substrate 5 and the adhesive layer 23 are bonded to each other with the adhesive layer 23. Thereafter, as shown in fig. 3 (b), vacuum suction table 29 is removed, and thereby base film 27 is exposed on the same side as the figure.
Next, as shown in FIG. 3 (from) above, the base film 27, as shown above, is applied, such as by shower water. The base film 27 is water-soluble and gradually becomes thinner.
Thereafter, the base film 27 is completely dissolved in water and disappears as shown in the state of fig. 3. In this way, the upper surface adhesive layer 23 (i.e., the first adhesive layer 23 a) of the ceramic substrate 5 is bonded to obtain the ceramic side member 31. In FIG. 3 (d), the 2 nd main surface A2 of the first adhesive layer 23a of the ceramic side member 31 is exposed from above in the same manner as in the figure
On the other hand, the ceramic side member 31 is flipped upside down as shown in fig. 4 from the vacuum suction table 29, the base film 27 and the adhesive layer 23 in the state shown in fig. 2 (d), and the surface adhesive layer 23 of the metal substrate 7 (i.e., the first main surface b of the second adhesive layer 23 b) is mounted.
Thereby, the metal substrate 7 is adhesively bonded to the second adhesive layer 23 and the second adhesive layer 23 b. Thereafter, as shown in fig. 4 (b), vacuum suction table 29 is removed and exposed upward together with base film 27.
Next, as shown in fig. 4 (c), as for the base film 27, the base film 27 is water-soluble and gradually dissolves in water and becomes thinner, like spraying water over the base film 27, like showering.
After that, the base film 27 completely dissolves in water and disappears, as shown in fig. 4 (d). Therefore, the metal side member 33 is obtained by bonding the second adhesive layer 23B on the surface of the metal substrate 7, and in fig. 4 (d), the second main surface B2 of the second adhesive layer 23B of the metal side member 33 is exposed upward in the same drawing.
Next, as shown in fig. 4 (d), the ceramic side member 31 and the metal member 33 are bonded. Specifically, the second principal surface of the first adhesive layer 23a of the ceramic side member is in contact with each other, and the ceramic substrate 5 and the metal substrate 7 are bonded to each other to form the bonding member 35.
Then, the electrostatic chuck 1 is heated to a predetermined temperature (for example, 120 ℃) to adhere the first adhesive 23a and the second adhesive 23b of the curable adhesive to form an adhesive layer 9, and the ceramic substrate 5 and the metal substrate 7 are bonded to each other on the adhesive layer 9 to complete the electrostatic chuck.
1-5, effect
The effects of the first embodiment of the present invention will be explained below.
In the first embodiment of the present invention, the cover film 25 and the base film 27 are soluble in water, and the adhesive layer 23 has a property of being insoluble in water (or poorly soluble in water).
Therefore, when the ceramic side member 31 is manufactured, the adhesive sheet 21 and the cover film 25 are removed in water while holding the vacuum suction table 29, and the first main surface A1 of the first adhesive 23a is exposed.
In addition, the water-soluble adhesive film 21 of the vacuum suction table 29 is held by the cover film 25, and the water-soluble adhesive film is removed to expose the first main surface B2 of the second adhesive layer 23B, in the same manner as the second main surface a2 is exposed by removing the water-soluble adhesive film from the base film 27 of the first adhesive layer 23 a.
Then, the base film 27 of the second adhesive layer 23B is removed from the water-soluble portion to expose the second main surface B2. Then, the second main surface A2 of the first adhesive layer 23a of the ceramic side member 31 is brought into contact with the second main surface B2 of the second adhesive layer 23B of the metal member 22, and the ceramic substrate 5 and the metal substrate 7 are bonded to each other, whereby the adhesive member 35 can be produced.
Then, the temperature is locked by heating, and the adhesive layer 9 is formed by thermosetting, and the ceramic substrate 5 and the metal substrate 7 are bonded to each other, thereby obtaining the electrostatic chuck 1.
As described above, in the first embodiment of the present invention, the release of the base film 27 can be suppressed by removing the cover film 25 dissolved in the solution to expose the adhesive layer 23 and lifting up the adhesive layer 23, as in the case of the release from the front adhesive layer cover film 25. Also, deformation and increase in thickness of the adhesive layer 23 can be suppressed.
Therefore, the electrostatic chuck 1 can be manufactured more efficiently with a significant effect. In addition, in the embodiment of the present invention, 2 adhesive layers 23 are used to adhere the ceramic substrate 5 and the metal substrate 7, which has the effect of high adhesion reliability.
In the case where the adhesive 23 is a silicon-based hydrophobic material, even if the base film 27 is removed from the cover film 25 by washing with water, the surface of the adhesive 23 can be exposed without being affected by the adhesive portion (adhesive layer 23).
Example 2
Next, a second embodiment will be described. The first embodiment is briefly and easily explained in the same manner. The same type of structure is used in the first embodiment.
In the second embodiment of the present invention, as the adhesive, an adhesive layer is used. Specifically, as shown in fig. 5 (a), a ceramic substrate 5 and an adhesive layer 23 are bonded to the surface of the metal substrate 7 to form a ceramic side member 31.
That is, the surface adhesive layer 23 of the metal substrate 7 is not designed, and the metal substrate 7 and the ceramic side member 31 are bonded to each other with one layer of the adhesive 23 of the ceramic side member 31. Thus, adhesive member 35 of fig. 5 is obtained, and adhesive layer 23 is cured by heat adhesion to integrally adhere ceramic substrate 5 of adhesive layer 9, thereby completing electrostatic chuck 1.
In the second embodiment of the present invention, the same effects as in the first embodiment are obtained.
Example 3
The third embodiment will be described below, and the same contents as those of the first embodiment will be omitted or simplified. And, the same type will be named after the first embodiment.
In the third embodiment of the present invention, the thickness of the base film is large. Specifically, as shown in fig. 6 (a), the adhesive film 21 is formed by stacking the base film 27, the adhesive 23 and the cover film 25, and then peeling the base film 27 to a thickness, and the cover film 25 is peeled to a thickness (i.e., to be thicker).
For example, the thickness of the base film 27 is made larger than the thickness of the cover film 25 by 2 times or more. After the base film 27 is peeled (set off) to a thickness and the cover film 25 is removed with water, the base film 27 can be left as shown in fig. 6 (b).
Therefore, as in the first embodiment, the adhesive film 21a can be easily obtained by removing the cover film 25 using the vacuum suction table 29. That is, since the base film 27 is left after the cover film 25 is removed, this state can be more easily carried or connected.
In the third embodiment, the same effects as those of the first embodiment are obtained.
Example 4 (other embodiments)
The present invention is not limited to the above embodiments, and various energy states can be implemented outside the scope of the present invention.
(1) For example, as the adhesive part (layer part) of the adhesive film, not only in a semi-cured state, but also a liquid adhesive can be spread.
(2) Further, instead of the vacuum suction table, a tape having an adhesive member may be used.
The adhesive tape herein can be reduced in adhesiveness by ultraviolet irradiation. When this tape is used, the adhesive film (for example, an adhesive film using a ceramic side member and a metal side member) is irradiated with ultraviolet rays after a step of bonding (for example, adhesion) a metal substrate, which is a ceramic substrate, to the tape, and the tape is removed by reducing the adhesiveness.
Further, as the tape for reducing the viscosity by ultraviolet irradiation, for example, a UV curable tape AD will series manufactured by great east electromechanics, a DC3000UV series manufactured by IKKOZU corporation, and SP series, UC series, and FC series of a tape for semiconductor manufactured by giga electrical machinery may be used.
(3) As the base film, an object which is dissolved in a solution can be removed, and an object which is not dissolved in a solution can be used. At this time, the removal is performed by a method other than the solution. Such as a method of peeling the base film.
(4) As the materials of the ceramic substrate, the metal substrate, and the adhesive layer, various materials can be used while satisfying the conditions of the present invention.
(5) As the ceramic material, alumina, aluminum nitride, or silicon oxide can be used for the ceramic substrate (plate-like member) having ceramic as a main component (50% by mass or more).
(6) A metal substrate, a metal or a substrate made of an alloy, and as a material of the metal substrate, a metal such as copper, aluminum, iron, nickel, or the like, or an alloy of these metals.
(7) The present invention can be used in CVD and susceptor processes.
(8) Further, the configurations of the respective embodiments may be appropriately combined.
Claims (6)
1. A method for manufacturing an electrostatic chuck, characterized in that a first cover film layer covered with a first main surface of an adhesive layer, a second cover film layer covered with a second main surface of the adhesive layer, and a composite member is manufactured by using the adhesive member, wherein at least the first cover film layer is insoluble in a solution according to solubility of the adhesive layer in the solution, and the adhesive layer is exposed on the first main surface;
the second cover film layer having a property of dissolving in a solution, and removing the second cover film layer of the adhesive member to expose the adhesive layer to a second main surface, the exposed second main surface of the adhesive layer having a material different from that of the second cover film layer;
the adhesive material consists of an adhesive layer, a first covering film layer covered by the first main surface of the adhesive layer and a second covering film layer covered by the second main surface of the adhesive layer;
the method for manufacturing an electrostatic chuck, in which a ceramic substrate for an adsorption electrode of the electrostatic chuck is provided to be connected to a metal substrate, according to the adhesive layer, specifically includes:
dissolving and removing the first covering film layer of the adhesive member, adhering the ceramic substrate or the metal substrate to the first main surface, removing the second covering film layer of the adhesive member, and adhering the metal substrate or the ceramic substrate to the second main surface of the exposed adhesive layer.
2. The method of claim 1, wherein at least a first adhesive member and a second adhesive member are used as the adhesive members, and the first cover film layer of the first adhesive member is removed to expose the exposed adhesive layer in the step of connecting the members; removing the first covering film layer of the second adhesive member to expose the exposed adhesive layer in the connection process of the predetermined member; removing the second cover film layer of the adhesive layer of the first adhesive member to expose the second main surface of the adhesive layer; removing the second cover film layer of the adhesive layer of the second adhesive member to expose the second main surface of the adhesive layer;
the fixed material is a ceramic substrate or a metal substrate.
3. A method according to claim 2, wherein the holding material contacts the second overlying film layer.
4. The method of claim 3, wherein the holding member is a vacuum suction holding member or an adhesive member.
5. The method of claim 4, wherein the thickness of the second cover film layer is greater than the thickness of the first cover film layer.
6. The method of claim 5, wherein at least the first cover film layer of the first and second cover film layers has a dissolving property, and the adhesive layer has a property of being insoluble in the solution and hardly being miscible with the first cover film layer.
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| CN201910879522.6A CN110556331B (en) | 2019-09-19 | 2019-09-19 | Composite material and manufacturing method of electrostatic chuck using same |
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| CN201910879522.6A CN110556331B (en) | 2019-09-19 | 2019-09-19 | Composite material and manufacturing method of electrostatic chuck using same |
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Citations (4)
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|---|---|---|---|---|
| JP2002249739A (en) * | 2001-02-26 | 2002-09-06 | Tokyo Magnetic Printing Co Ltd | Antifouling film and antifouling body |
| TW200906615A (en) * | 2007-02-23 | 2009-02-16 | Teijin Dupont Films Japan Co Ltd | Pressure-sensitive adhesive film for protecting surface |
| CN106457811A (en) * | 2014-06-18 | 2017-02-22 | 东丽株式会社 | Laminate and production method therefor |
| JP2019137832A (en) * | 2018-02-13 | 2019-08-22 | 日東電工株式会社 | Pressure-sensitive adhesive sheet and laminate of pressure-sensitive adhesive sheet |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016056469A1 (en) * | 2014-10-06 | 2016-04-14 | 日東電工株式会社 | Masking sheet for chemical processing |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002249739A (en) * | 2001-02-26 | 2002-09-06 | Tokyo Magnetic Printing Co Ltd | Antifouling film and antifouling body |
| TW200906615A (en) * | 2007-02-23 | 2009-02-16 | Teijin Dupont Films Japan Co Ltd | Pressure-sensitive adhesive film for protecting surface |
| CN106457811A (en) * | 2014-06-18 | 2017-02-22 | 东丽株式会社 | Laminate and production method therefor |
| JP2019137832A (en) * | 2018-02-13 | 2019-08-22 | 日東電工株式会社 | Pressure-sensitive adhesive sheet and laminate of pressure-sensitive adhesive sheet |
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