CN110555858A - Method and equipment for detecting position of hot melt adhesive of electric control board - Google Patents
Method and equipment for detecting position of hot melt adhesive of electric control board Download PDFInfo
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
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- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/25—Determination of region of interest [ROI] or a volume of interest [VOI]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/28—Quantising the image, e.g. histogram thresholding for discrimination between background and foreground patterns
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20092—Interactive image processing based on input by user
- G06T2207/20104—Interactive definition of region of interest [ROI]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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- G—PHYSICS
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Abstract
The invention provides a method and a device for detecting the position of a hot melt adhesive of an electric control board, wherein the device comprises the following components: shooting a picture of the electric control board, and acquiring a marked gluing area needing to be coated with hot melt glue; performing edge detection in the gluing area, and performing mathematical expansion corrosion operation; according to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing area; and when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected, otherwise, determining that the hot melt adhesive is not detected and reporting an error. The invention can improve the automation degree and the working efficiency of detecting the position of the hot melt adhesive of the electric control board, and is not easy to generate the problems of missing detection or error detection.
Description
Technical Field
the invention relates to the field of gluing detection, in particular to a method and equipment for detecting the position of a hot melt adhesive of an electric control board.
Background
the electric control board is a circuit board designed to meet the application requirements of most control systems, is the center of automation equipment, and has an application range which is not as wide as that of the circuit board, but is more intelligent and automatic than that of a common circuit board. In brief, the electric control board is a circuit board capable of playing a control role. Along with the development of the current society, more and more intelligent and automatic equipment are provided, and the application of the electric control board is more and more extensive; the automatic production equipment of the manufacturers and the toy remote control automobile for children are all internally provided with the electric control board.
the Hot melt adhesive (Hot Glue) is a plastic adhesive, the physical state of which changes along with the change of temperature within a certain temperature range, and the chemical property of which is unchanged, is nontoxic and tasteless, and belongs to an environment-friendly chemical product. The hot melt adhesive product is solid, is favored because of the advantages of convenient packaging, transportation and storage, no solvent, no pollution, no toxicity, simple production process, high bonding strength, high speed and the like, and is particularly suitable for being used on a continuous production line.
The hot melt adhesive has strong adhesion after being cured and high strength, can meet the adhesion requirements of most electronic products, and is particularly suitable for the adhesion of precise components in the electronic and electrical industry, thereby being widely applied to the connection of components of an electric control board.
at present, the detection of the gluing position of the hot melt adhesive on the electric control board adopts a manual detection method, and human eyes judge whether the condition of wrong gluing or missed gluing exists; the manual detection method has low automation degree and low efficiency, and the subjectivity of detection by human eyes is strong, so that the condition of missed detection or wrong detection is easily generated, which is not beneficial to improving the working efficiency and the automation degree of a factory.
Disclosure of Invention
The invention provides a method for detecting the position of a hot melt adhesive of an electric control board, which is used for solving the problems that the existing method for manually detecting the position of the hot melt adhesive has low automation degree and low efficiency and is easy to generate missed detection or wrong detection.
according to a first aspect of the embodiments of the present invention, there is provided a method for detecting a position of a hot melt adhesive of an electric control board, the method including:
shooting a picture of the electric control board, and acquiring a marked gluing area needing to be coated with hot melt glue;
performing edge detection in the gluing area, and performing mathematical expansion corrosion operation;
according to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing area;
and when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected, otherwise, determining that the hot melt adhesive is not detected and reporting an error.
According to a second aspect of the embodiments of the present invention, there is provided an apparatus for detecting a position of a hot melt adhesive of an electric control board, comprising:
the preprocessing module is used for shooting pictures of the electric control board and acquiring marked gluing areas needing to be coated with hot melt glue;
The execution module is used for carrying out edge detection in the gluing area and carrying out the expansion corrosion operation in a mathematical form;
the position extraction module is used for binarizing the pixel gray level of the gluing area after the expansion corrosion operation according to the preset gray level range of the hot melt adhesive to obtain pixel points corresponding to the hot melt adhesive in the gluing area;
And the judging module is used for determining that the hot melt adhesive is detected when the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, and otherwise, determining that the hot melt adhesive is not detected and reporting an error.
optionally, when the module is used for processing the gluing area, the module is further configured to:
acquiring a marked gluing prohibition area which is not allowed to be coated with the hot melt adhesive;
Performing edge detection in the gluing prohibition area, and performing mathematical expansion corrosion operation;
According to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing prohibition area;
And when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected and reporting an error.
optionally, the gluing prohibition area includes any one or any multiple of the following areas:
the fence-connected plug area, the non-fence plug area and the strip plug area.
Optionally, the executing module performs edge detection on the gluing area/the gluing prohibition area, and includes:
Carrying out transverse edge detection on the gluing area/the gluing prohibition area to obtain a first edge position, and carrying out longitudinal edge detection to obtain a second edge position;
and weighting the first edge position and the second edge position respectively and then summing to obtain the edge positions.
Optionally, the method further comprises:
for the gluing area, the ratio of the weight of the first edge position to the weight of the second edge position is the length-width ratio of the marked gluing area or the length-width ratio of the picture of the electric control board;
For the gluing prohibition area, the ratio of the first edge position to the second edge position is the length-width ratio of the marked gluing prohibition area, or the length-width ratio of the electric control board picture.
optionally, the execution module performs mathematical expansion corrosion operation on the gluing area/the gluing prohibition area, and includes:
and performing expansion corrosion operation of a mathematical form on the gluing area/the gluing prohibition area by using a mathematical form kernel, wherein the transverse length of the mathematical form kernel is not more than half of the length of the set minimum block area, and the longitudinal length of the mathematical form kernel is not more than half of the width of the set minimum block area.
Optionally, the determining module determines that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, including:
and when determining that pixel points exceeding the preset proportion in pixel points corresponding to the hot melt adhesive are located in the edge obtained by edge detection, determining that the pixel points corresponding to the hot melt adhesive are centrally located in the edge.
According to a third aspect of the embodiments of the present invention, there is provided an apparatus for detecting a position of a hot melt adhesive of an electric control board, comprising: a memory and a processor;
wherein the memory is used for storing programs;
The processor is used for executing the program in the memory and comprises the following steps:
shooting a picture of the electric control board, and acquiring a marked gluing area needing to be coated with hot melt glue;
Performing edge detection in the gluing area, and performing mathematical expansion corrosion operation;
according to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing area;
and when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected, otherwise, determining that the hot melt adhesive is not detected and reporting an error.
Optionally, the method further comprises:
Acquiring a marked gluing prohibition area which is not allowed to be coated with the hot melt adhesive;
performing edge detection in the gluing prohibition area, and performing mathematical expansion corrosion operation;
according to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing prohibition area;
and when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected and reporting an error.
Optionally, the gluing prohibition area includes any one or any multiple of the following areas:
The fence-connected plug area, the non-fence plug area and the strip plug area.
Optionally, the processor performs edge detection on the gluing area/gluing prohibition area, including:
carrying out transverse edge detection on the gluing area/the gluing prohibition area to obtain a first edge position, and carrying out longitudinal edge detection to obtain a second edge position;
and weighting the first edge position and the second edge position respectively and then summing to obtain the edge positions.
optionally, the method further comprises:
for the gluing area, the ratio of the weight of the first edge position to the weight of the second edge position is the length-width ratio of the marked gluing area or the length-width ratio of the picture of the electric control board;
For the gluing prohibition area, the ratio of the first edge position to the second edge position is the length-width ratio of the marked gluing prohibition area, or the length-width ratio of the electric control board picture.
Optionally, the processor performs mathematical expansion etching operation on the gluing area/the gluing prohibition area, including:
and performing expansion corrosion operation of a mathematical form on the gluing area/the gluing prohibition area by using a mathematical form kernel, wherein the transverse length of the mathematical form kernel is not more than half of the length of the set minimum block area, and the longitudinal length of the mathematical form kernel is not more than half of the width of the set minimum block area.
Optionally, the determining, by the processor, that pixel points corresponding to the hot melt adhesive are located in a concentrated manner in an edge obtained by edge detection includes:
And when determining that pixel points exceeding the preset proportion in pixel points corresponding to the hot melt adhesive are located in the edge obtained by edge detection, determining that the pixel points corresponding to the hot melt adhesive are centrally located in the edge.
according to a fourth aspect of the embodiments of the present invention, there is provided a chip, where the chip is coupled with a memory in a user equipment, so that the chip invokes program instructions stored in the memory when running, thereby implementing the above aspects of the embodiments of the present application and any method that may be designed according to the aspects.
according to a fifth aspect of the embodiments of the present invention, there is provided a computer-readable storage medium storing program instructions which, when executed on a computer, cause the computer to perform the method of any of the possible designs to which the above aspects and aspects relate.
According to a sixth aspect of the embodiments of the present invention, there is provided a computer program product, which, when run on an electronic device, causes the electronic device to perform a method of implementing the above aspects of the embodiments of the present application and any possible design related to the aspects.
the method and the device for detecting the position of the hot melt adhesive of the electric control board have the following beneficial effects that:
according to the method and the device for detecting the position of the hot melt adhesive of the electric control board, provided by the invention, the automatic detection of the position of the hot melt adhesive is realized under the condition that the color of the hot melt adhesive on the electric control board is similar to the background color of the electric control board by using a machine vision technology, and the problems of low automation degree, low efficiency and easy omission or error detection of the existing manual detection method are solved; the method replaces the existing method for manually detecting the position of the hot melt adhesive, saves the labor cost (1 person) and improves the working efficiency (more 10 percent of detection can be carried out within one hour).
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating a method for detecting a position of a hot melt adhesive of an electrical control board according to an embodiment of the present invention;
fig. 2 is a schematic sectional view of an electric control board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an apparatus for detecting the position of a hot melt adhesive on an electrical control board provided in an embodiment of the present invention;
Fig. 4 is a schematic structural diagram of an apparatus for detecting a position of a hot melt adhesive of an electric control board in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
For convenience of understanding, terms referred to in the embodiments of the present invention are explained below:
1) image Binarization (Image Binarization): setting the gray value of a pixel point on an image to be 0 or 255, namely, displaying an obvious black and white effect on the whole image; the binarization of the image greatly reduces the data volume in the image, thereby highlighting the outline of the target; the binarization of the image is beneficial to further processing of the image, so that the image is simple, the data volume is reduced, and the outline of an interested target can be highlighted.
2) Edge detection: edge refers to the set of pixels whose surrounding pixels change sharply in gray, which is the most fundamental feature of an image; edges exist among objects, backgrounds and regions, so it is the most important basis on which image segmentation depends; the edge detection is to extract the characteristics of discontinuous parts in the image and determine an area according to the closed edge; the edge detection method does not require the image to be divided pixel by pixel, and is therefore more suitable for the division of large images.
3) and (3) corrosion: the operation of finding the local minimum value is carried out, the morphological kernel slides along the image, if the image pixel values of the corresponding area of the morphological kernel are all 1, the pixel value corresponding to the center of the convolution kernel is kept unchanged, otherwise, the pixel value is all 0, so that in the edge area of the image, the area with the part of 0 and the area with the part of 1 are all 0, and the area towards the inside is kept unchanged.
4) Expansion: the local maximum is obtained, the morphological kernel slides along the image, and as long as one of the image pixel values corresponding to the morphological kernel is 1, the whole area becomes 1. The dilation causes the highlight regions in the image to grow gradually.
Example 1
The embodiment of the invention provides a method for detecting the position of a hot melt adhesive of an electric control board, which comprises the following steps of:
step S101, shooting a picture of the electric control board, and acquiring a marked gluing area needing to be coated with hot melt adhesive and a marked gluing prohibition area which is not allowed to be coated with the hot melt adhesive;
establishing an image acquisition system and a light source system, wherein after the electric control board is conveyed to a designated position by a conveyor belt, the light source system polishes the electric control board, the image acquisition system takes a picture of the electric control board to obtain a picture of the electric control board, and the picture of the electric control board is uploaded to a computer;
The light source system adopts a mesoporous light source and polishes the electric control board to be detected;
the image acquisition system adopts a camera, and takes pictures of the electric control board through the camera to obtain pictures of the electric control board and uploads the pictures to the computer;
After the picture of the electric control board is transmitted to the computer, the processor reads the picture of the electric control board, an adhesive printing area and an adhesive printing prohibition area which are marked artificially are obtained, subsequent processing is carried out on the picture of the electric control board, the number of the adhesive printing areas is at least one, the number of the adhesive printing prohibition areas is at least one, whether the hot melt adhesive is missed or mistakenly printed can be detected through detection of the adhesive printing areas, and whether the hot melt adhesive is mistakenly printed can be detected through detection of the adhesive printing prohibition areas.
In this embodiment, the gluing area refers to a plurality of locations of the hot melt adhesive on one electrical control board, and the location of the hot melt adhesive on most of the electrical control boards is more than one, as shown in fig. 2, which is a schematic block diagram of an area of an electrical control board provided in this embodiment of the present application. In the figure, the position 1, the position 2, the position 3 and the position 4 are four hot melt adhesive positions on the electric control board, and the four positions are artificially marked as gluing areas when area blocking is carried out; the area 1, the area 2 and the area 3 are three areas which are forbidden to glue on the electric control board, and can be named as a fence-connected plug column area, a fence-free plug column area and a long plug column area according to the characteristics of components, and the three areas are artificially marked as the forbidden glue areas when the areas are partitioned; the other unmarked areas in the figure are irrelevant areas, and the areas do not influence the detection of the position of the hot melt adhesive on the electric control board and do not carry out any treatment on the hot melt adhesive.
the glue-hitting prohibition area comprises any one or any multiple areas of a fence plug-in column area, a fence-free plug-in column area and a strip plug-in column area. The area blocks are mainly divided into two categories of gluing areas and gluing forbidden areas, wherein the area with the fence and the pin, the area without the fence and the long pin are all subdivided into the gluing forbidden areas; the extraction of the hot melt adhesive is mainly used for determining whether each area meets the standard, namely the hot melt adhesive is bound to be applied to the adhesive applying area and the hot melt adhesive is forbidden to be applied to the adhesive applying area by mistake.
Step S102, performing edge detection in the gluing area and the gluing prohibition area, and performing mathematical expansion corrosion operation;
The set of pixels between adjacent regions in the image constitutes the edge of the image. An image edge may be understood as a collection of pixels in an image that have a sharp change in gray level. The change of the image gray scale can be reflected by the gradient of the image gray scale distribution, so that the edge detection operator can be obtained by using a local image differential technology. Commonly used edge detection algorithms include Roberts crossover operator, Sobel operator, Prewitt operator, Laplace operator, Canny operator, etc.
the edge detection algorithm is mainly based on the first-order and second-order derivatives of the image intensity, firstly filtering is carried out when edge detection is carried out, a filter is used for improving the performance of a related edge detector, then edge enhancement is carried out by calculating the gradient amplitude, points with obvious changes of neighborhood (or local) intensity values can be highlighted, and then the edge points are judged according to a set gradient amplitude threshold value to obtain the regional edge.
the edge detection algorithms are all existing algorithms, the existing algorithms can be adopted as the edge detection algorithms in the embodiment, and the existing modes can be adopted for specific implementation, which is not described in detail herein.
Respectively carrying out transverse edge detection on the gluing area and the gluing prohibition area by the existing method to obtain a first edge position, and carrying out longitudinal edge detection on the gluing area and the gluing prohibition area to obtain a second edge position;
Performing transverse edge detection on the smooth image by using a transverse edge detection mask to obtain a transverse edge image; utilizing a longitudinal edge detection mask to carry out longitudinal edge detection on the smooth image to obtain a longitudinal edge image; combining the transverse edge map and the longitudinal edge map to obtain an edge detection map;
the positions of the pixel points in the transverse line edge graph are first edge positions, and the positions of the pixel points in the longitudinal edge graph are second edge positions.
The process of combining the transverse edge map and the longitudinal edge map to obtain the edge detection map comprises the following steps: and assigning the pixel value of each pixel point in the edge detection graph as the sum of the pixel value of the pixel point position corresponding to the transverse edge graph and the pixel value of the pixel point position corresponding to the longitudinal edge graph after weighting, namely, respectively weighting and summing the corresponding first edge position and the second edge position to obtain the edge position.
when the weights of the first edge position and the second edge position are set, as an alternative embodiment, the weight coefficients may be set according to the aspect ratio according to each divided region:
aiming at the weight setting of the gluing area, because the edge is complex and the shape of the hot melt adhesive is not fixed, when the first edge position and the second edge position are weighted respectively and then summed so as to combine the two edges, the weight of the first edge position and the weight of the second edge position are both set to be 0.5;
And aiming at the weight setting of the gluing prohibition region, setting is mainly carried out according to the length-width ratio of the picture of the electric control board, namely the ratio of the weight of the first edge position to the weight of the second edge position is the length-width ratio of the picture of the electric control board. For example: an overall aspect ratio of the electrical control board picture is 300:200, and then the weight of the first edge position and the weight of the second edge position of the at least one non-glue area are respectively 0.6 and 0.4.
As another alternative, the weighting coefficients may be set according to the aspect ratio of the electric control board picture: namely, the ratio of the weight of the first edge position to the weight of the second edge position of the gluing area and the gluing forbidding area is the length-width ratio of the picture of the electric control board.
after the edge weight values of the gluing area and the gluing prohibition area are set, performing mathematical expansion corrosion operation on the gluing area and the gluing prohibition area.
when the expansion corrosion operation is carried out, firstly, a morphological kernel of the operation is defined, which can be in any shape and size and has a separately defined reference point, namely an anchor point; usually the morphological kernel is a square or a circle with reference points.
In this embodiment, it is necessary to limit the size of the mathematical kernel whose lateral length is not more than half of the length of the set minimum block region and whose longitudinal length is not more than half of the width of the set minimum block region, so that the gray level assimilation phenomenon due to the excessive expansion can be prevented.
after the size of the kernel of the mathematical form is determined, the expansion operation is carried out on the gluing area and the gluing prohibition area by using the kernel of the mathematical form: the morphological kernel defines that the center is an anchor point, the maximum pixel value of the area covered by the anchor point and the area forbidden to glue is calculated to replace the pixel value of the anchor point, and at the moment, the highlight areas of the area to glue and the area forbidden to glue are gradually increased. And continuing to perform the corrosion operation after the expansion operation is finished: the morphological kernel defines that the center is an anchor point, the minimum pixel value of the anchor point is replaced by the minimum pixel value of the area which covers the lower gluing area and the area which is forbidden to glue, and the highlight areas of the gluing area and the area which is forbidden to glue are gradually reduced.
because the colors of the hot melt adhesive and the electric control plate are similar and the edges are complex, the gray similar areas can be concentrated and the difference can be amplified through the expansion corrosion operation, so that the contrast ratio of the gluing area and the background color is increased, and the extraction of the position of the hot melt adhesive is facilitated.
the specific implementation of the above-described dilation-erosion operation in this embodiment may be implemented in a conventional manner, and will not be described in detail here.
Step S103, binarizing the pixel gray levels of the glue-applying area and the glue-applying-forbidden area after the expansion corrosion operation according to the preset gray level range of the hot melt glue to obtain pixel points corresponding to the hot melt glue in the glue-applying area;
The binarization operation is a process of setting the gray value of the pixel points on the picture to be 0 (black) or 255 (white), that is, the whole picture is obviously black and white. The binarization of the image greatly reduces the data volume in the image, thereby highlighting the contour of the target.
in the electric control board picture after expansion corrosion, the gluing area is dark, namely the gray value of a pixel point in the gluing area is close to 0, the gray value of the pixel point in the gray range is set to 0 according to the preset gray range of the hot melt adhesive, the gray value of the pixel point outside the gray range is set to 255, and therefore a binary electric control board picture is obtained, wherein the pixel point with the gray value of 0 is the pixel point corresponding to the hot melt adhesive in the gluing area.
The specific implementation of the binarization operation in this embodiment may adopt an existing manner, and is not described in detail here.
and step S104, determining that the hot melt adhesive is detected when determining that pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection aiming at the adhesive applying area, and otherwise, determining that the hot melt adhesive is not detected and reporting an error.
and presetting a proportion as a standard for judging whether pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection. And when the pixel points exceeding the preset proportion are positioned in the edge obtained by the edge detection in the pixel points corresponding to the hot melt adhesive, the pixel points corresponding to the hot melt adhesive are considered to be positioned in the edge in a centralized manner.
Calculating the proportion of pixel points positioned in the detected edge in pixel points with the gray value of 0 in the picture of the electric control board, and if the value of the proportion is greater than the value of a preset proportion, determining that the pixel points corresponding to the hot melt adhesive are concentratedly positioned in the edge, namely the hot melt adhesive is detected in the adhesive applying area; otherwise, the hot melt adhesive is not detected in the adhesive applying area and an error is reported.
and S105, determining that the hot melt adhesive is detected and reporting an error when determining that pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection aiming at the area where the adhesive beating is forbidden.
And presetting a proportion as a standard for judging whether pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection. And when the pixel points exceeding the preset proportion are positioned in the edge obtained by the edge detection in the pixel points corresponding to the hot melt adhesive, the pixel points corresponding to the hot melt adhesive are considered to be positioned in the edge in a centralized manner.
calculating the proportion of pixel points located in the detected edge in pixel points with the gray value of 0 in the picture of the electric control board, and if the value of the proportion is larger than the value of the preset proportion, determining that the pixel points corresponding to the hot melt adhesive are centrally located in the edge, namely forbidding the detection of the hot melt adhesive in the gluing area, and at the moment, reporting an error; otherwise, the position of the hot melt adhesive is not detected in the gluing prohibition area, and no error is reported.
Example 2
the method for detecting the position of the hot melt adhesive of the electric control board in the invention is explained above, and the equipment for detecting the position of the hot melt adhesive of the electric control board is explained below.
Referring to fig. 3, an embodiment of the present invention provides an apparatus for detecting a position of a hot melt adhesive on an electrical control board, including:
the preprocessing module 301 is used for shooting a picture of the electric control board and acquiring a marked gluing area needing to be coated with hot melt glue;
an execution module 302, configured to perform edge detection in the glue applying region and perform mathematical expansion corrosion operation;
the position extraction module 303 is configured to binarize the pixel grayscale of the glue area after the expansion etching operation according to a preset grayscale range of the hot melt adhesive, so as to obtain pixel points corresponding to the hot melt adhesive in the glue area;
the determining module 304 is configured to determine that the hot melt adhesive is detected when it is determined that the pixel points corresponding to the hot melt adhesive are located in the edge obtained by the edge detection in a concentrated manner, and otherwise, determine that the hot melt adhesive is not detected and report an error.
Optionally, when the module is used for processing the gluing area, the module is further configured to:
Acquiring a marked gluing prohibition area which is not allowed to be coated with the hot melt adhesive;
Performing edge detection in the gluing prohibition area, and performing mathematical expansion corrosion operation;
According to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing prohibition area;
And when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected and reporting an error.
optionally, the gluing prohibition area includes any one or any multiple of the following areas:
The fence-connected plug area, the non-fence plug area and the strip plug area.
Optionally, the executing module performs edge detection on the gluing area/the gluing prohibition area, and includes:
Carrying out transverse edge detection on the gluing area/the gluing prohibition area to obtain a first edge position, and carrying out longitudinal edge detection to obtain a second edge position;
and weighting the first edge position and the second edge position respectively and then summing to obtain the edge positions.
Optionally, for the glue area, the ratio of the weight of the first edge position to the weight of the second edge position is the length-width ratio of the marked glue area, or the length-width ratio of the picture of the electronic control board;
For the gluing prohibition area, the ratio of the first edge position to the second edge position is the length-width ratio of the marked gluing prohibition area, or the length-width ratio of the electric control board picture.
optionally, the execution module performs mathematical expansion corrosion operation on the gluing area/the gluing prohibition area, and includes:
And performing expansion corrosion operation of a mathematical form on the gluing area/the gluing prohibition area by using a mathematical form kernel, wherein the transverse length of the mathematical form kernel is not more than half of the length of the set minimum block area, and the longitudinal length of the mathematical form kernel is not more than half of the width of the set minimum block area.
optionally, the determining module determines that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, including:
and when determining that pixel points exceeding the preset proportion in pixel points corresponding to the hot melt adhesive are located in the edge obtained by edge detection, determining that the pixel points corresponding to the hot melt adhesive are centrally located in the edge.
Referring to fig. 4, another embodiment of the apparatus for detecting a position of a hot melt adhesive of an electric control board in an embodiment of the present application includes:
A processor 401, a memory 402, a transceiver 409, and a bus system 411;
Wherein the memory is used for storing programs;
The processor is used for executing the program in the memory and comprises the following steps:
shooting a picture of the electric control board, and acquiring a marked gluing area needing to be coated with hot melt glue;
Performing edge detection in the gluing area, and performing mathematical expansion corrosion operation;
According to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing area;
And when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected, otherwise, determining that the hot melt adhesive is not detected and reporting an error.
Optionally, the method further comprises:
Acquiring a marked gluing prohibition area which is not allowed to be coated with the hot melt adhesive;
Performing edge detection in the gluing prohibition area, and performing mathematical expansion corrosion operation;
According to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing prohibition area;
and when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected and reporting an error.
Fig. 4 is a schematic structural diagram of an apparatus for detecting a position of a hot melt adhesive on an electronic control board according to an embodiment of the present invention, where the apparatus 400 may have a relatively large difference due to different configurations or performances, and may include one or more processors (CPU) 401 (e.g., one or more processors) and a memory 402, and one or more storage media 403 (e.g., one or more mass storage devices) for storing applications 404 or data 406. Memory 402 and storage medium 403 may be, among other things, transient storage or persistent storage. The program stored in the storage medium 403 may include one or more modules (not shown), and each module may include a series of instruction operations in the information processing apparatus. Further, the processor 401 may be configured to communicate with the storage medium 403 to execute a series of instruction operations in the storage medium 403 on the device 400.
the apparatus 400 may also include one or more power supplies 410, one or more wired or wireless network interfaces 407, one or more input-output interfaces 408, and/or one or more operating systems 405, such as Windows Server, Mac OS X, Unix, Linux, FreeBSD, etc.
Optionally, the gluing prohibition area includes any one or any multiple of the following areas:
the fence-connected plug area, the non-fence plug area and the strip plug area.
Optionally, the processor performs edge detection on the gluing area/gluing prohibition area, including:
Carrying out transverse edge detection on the gluing area/the gluing prohibition area to obtain a first edge position, and carrying out longitudinal edge detection to obtain a second edge position;
And weighting the first edge position and the second edge position respectively and then summing to obtain the edge positions.
optionally, the method further comprises:
for the gluing area, the ratio of the weight of the first edge position to the weight of the second edge position is the length-width ratio of the marked gluing area or the length-width ratio of the picture of the electric control board;
For the gluing prohibition area, the ratio of the first edge position to the second edge position is the length-width ratio of the marked gluing prohibition area, or the length-width ratio of the electric control board picture.
optionally, the processor performs mathematical expansion etching operation on the gluing area/the gluing prohibition area, including:
and performing expansion corrosion operation of a mathematical form on the gluing area/the gluing prohibition area by using a mathematical form kernel, wherein the transverse length of the mathematical form kernel is not more than half of the length of the set minimum block area, and the longitudinal length of the mathematical form kernel is not more than half of the width of the set minimum block area.
Optionally, the determining, by the processor, that pixel points corresponding to the hot melt adhesive are located in a concentrated manner in an edge obtained by edge detection includes:
And when determining that pixel points exceeding the preset proportion in pixel points corresponding to the hot melt adhesive are located in the edge obtained by edge detection, determining that the pixel points corresponding to the hot melt adhesive are centrally located in the edge. Embodiments of the present invention further provide a computer-readable storage medium, which includes instructions, when the computer-readable storage medium is executed on a computer, cause the computer to execute the method for detecting the position of the hot melt adhesive of the electronic control board provided in the above embodiments.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described apparatuses and modules may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is merely a logical division, and in actual implementation, there may be other divisions, for example, multiple modules or components may be combined or integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present application may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may be stored in a computer readable storage medium.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product.
The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, from one website site, computer, server, or data center to another website site, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that a computer can store or a data storage device, such as a server, a data center, etc., that is integrated with one or more available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk (SSD)), among others.
the technical solutions provided by the present application are introduced in detail, and the present application applies specific examples to explain the principles and embodiments of the present application, and the descriptions of the above examples are only used to help understand the method and the core ideas of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
as will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
the present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
these computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
it will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A method for detecting the position of a hot melt adhesive of an electric control board is characterized by comprising the following steps:
Shooting a picture of the electric control board, and acquiring a marked gluing area needing to be coated with hot melt glue;
Performing edge detection in the gluing area, and performing mathematical expansion corrosion operation;
according to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing area;
And when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected, otherwise, determining that the hot melt adhesive is not detected and reporting an error.
2. the method of claim 1, further comprising:
acquiring a marked gluing prohibition area which is not allowed to be coated with the hot melt adhesive;
performing edge detection in the gluing prohibition area, and performing mathematical expansion corrosion operation;
according to a preset gray scale range of the hot melt adhesive, carrying out binarization on the gray scale of the pixels of the gluing area after the expansion corrosion operation to obtain pixel points corresponding to the hot melt adhesive in the gluing prohibition area;
and when determining that the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, determining that the hot melt adhesive is detected and reporting an error.
3. The method of claim 1, wherein the no-glue areas comprise any one or more of:
The fence-connected plug area, the non-fence plug area and the strip plug area.
4. The method according to claim 1 or 2, wherein performing edge detection on the gluing area/gluing-inhibited area comprises:
Carrying out transverse edge detection on the gluing area/the gluing prohibition area to obtain a first edge position, and carrying out longitudinal edge detection to obtain a second edge position;
and weighting the first edge position and the second edge position respectively and then summing to obtain the edge positions.
5. the method of claim 4,
for the gluing area, the ratio of the weight of the first edge position to the weight of the second edge position is the length-width ratio of the marked gluing area or the length-width ratio of the picture of the electric control board;
For the gluing prohibition area, the ratio of the first edge position to the second edge position is the length-width ratio of the marked gluing prohibition area, or the length-width ratio of the electric control board picture.
6. method according to claim 1 or 2, characterized in that the mathematical-form dilation-erosion operation of the rubberized/rubberized areas comprises:
and performing expansion corrosion operation of a mathematical form on the gluing area/the gluing prohibition area by using a mathematical form kernel, wherein the transverse length of the mathematical form kernel is not more than half of the length of the set minimum block area, and the longitudinal length of the mathematical form kernel is not more than half of the width of the set minimum block area.
7. The method according to claim 1 or 2, wherein determining that the pixel points corresponding to the hot melt adhesive are concentrated within the edge obtained by the edge detection comprises:
and when determining that pixel points exceeding the preset proportion in pixel points corresponding to the hot melt adhesive are located in the edge obtained by edge detection, determining that the pixel points corresponding to the hot melt adhesive are centrally located in the edge.
8. An equipment for detecting the position of hot melt adhesive of an electric control board is characterized by comprising: a memory and a processor;
wherein the memory is used for storing programs;
The processor is used for executing the program in the memory to realize the steps of the method for detecting the position of the hot melt adhesive of the electric control board according to any one of claims 1 to 7.
9. An equipment for detecting the position of hot melt adhesive of an electric control board is characterized by comprising:
the preprocessing module is used for shooting pictures of the electric control board and acquiring marked gluing areas needing to be coated with hot melt glue;
the execution module is used for carrying out edge detection in the gluing area and carrying out the expansion corrosion operation in a mathematical form;
the position extraction module is used for binarizing the pixel gray level of the gluing area after the expansion corrosion operation according to the preset gray level range of the hot melt adhesive to obtain pixel points corresponding to the hot melt adhesive in the gluing area;
and the judging module is used for determining that the hot melt adhesive is detected when the pixel points corresponding to the hot melt adhesive are concentrated in the edge obtained by the edge detection, and otherwise, determining that the hot melt adhesive is not detected and reporting an error.
10. a computer program medium, on which a computer program is stored, characterized in that the program, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 7.
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Application publication date: 20191210 |