CN110536590A - Electronic equipment and conference system - Google Patents
Electronic equipment and conference system Download PDFInfo
- Publication number
- CN110536590A CN110536590A CN201910815281.9A CN201910815281A CN110536590A CN 110536590 A CN110536590 A CN 110536590A CN 201910815281 A CN201910815281 A CN 201910815281A CN 110536590 A CN110536590 A CN 110536590A
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- Prior art keywords
- building brick
- electronic building
- electronic equipment
- electronic
- heat
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- 239000011469 building brick Substances 0.000 claims abstract description 114
- 238000012546 transfer Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 15
- 238000013461 design Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of electronic equipment and conference systems, the electronic equipment has the first electronic building brick and the second electronic building brick, the vibration that first electronic building brick generates in the operating condition can cause gas to flow, the gas of flowing can be distributed by air outlet to the outside of the electronic equipment, second electronic building brick is arranged to be located on first electronic building brick to the gas flow paths of the air outlet, the heat that second electronic building brick generates in the operating condition can be transmitted by the gas of the flowing, to which the heat to be dispersed into the outside of the electronic equipment by the air outlet, the electronic equipment can radiate itself second electronic building brick by having the characteristic of the first electronic building brick work, without fan and the radiating efficiency of second electronic building brick can be improved.
Description
Technical field
This application involves technical field of electronic equipment, more specifically, being related to a kind of electronic equipment and conference system.
Background technique
With the continuous development of science and technology, more and more electronic equipments are widely used in daily life
And in work, huge convenience is brought for daily life and work, it is indispensable to become current people
Important tool.
In general, electronic equipment needs that radiator is arranged, so that heat is dispersed into electronic device exterior faster, to keep away
Exempt from the accumulation of electronic equipment internal heat, so that electronic equipment is in good working temperature environment, with the normal table of guarantee
Work.
Currently, general electronic equipment all carries out active heat removal by built-in fans, but the volume of fan is big, is not easy to electricity
Sub- device miniaturization design, and fan has the influence of rotational noise.
Summary of the invention
In view of this, technical scheme provides a kind of electronic equipment and conference system, the application provides as follows
Technical solution:
A kind of electronic equipment, the electronic equipment include:
First electronic building brick, the vibration that first electronic building brick generates in the operating condition can cause gas to flow,
The gas of flowing can be distributed by air outlet to the outside of the electronic equipment；
Second electronic building brick, second electronic building brick are located at the gas stream of first electronic building brick to the air outlet
On dynamic path, so that the gas of the flowing transmits the heat that second electronic building brick generates in the operating condition；
Wherein, the triggering that first electronic building brick passes through audio data in the operating condition generates vibration.
Preferably, in above-mentioned electronic equipment, there is gas flow channel between first electronics and the air outlet,
Second electronic building brick is located in the gas flow channel.
Preferably, in above-mentioned electronic equipment, first electronic building brick is audio component, and the audio component has master
Dynamic loudspeaker unit；
Wherein, the active speaker unit is encapsulated in the horn chamber body with guide duct；The opening of the guide duct
It is connected to the gas flow channel.
Preferably, in above-mentioned electronic equipment, the audio component includes: active speaker unit and passive radiator；
The active speaker unit is encapsulated in the horn chamber body with guide duct；The opening of the guide duct with it is described
Gas flow channel connection, and/or, the air guide hole of the radiator for no reason at all is connected to the gas flow channel.
Preferably, in above-mentioned electronic equipment, the gas flow channel be connect first electronic building brick with it is described
The pipeline of air outlet；
Or, the gas flow channel is multiple other electricity between first electronic building brick and the air outlet
Sub-component is laid out the channel for the guidance gas flow paths to be formed.
Preferably, in above-mentioned electronic equipment, second electronic building brick include: integrated chip, power amplifier or
CPU processor.
Preferably, in above-mentioned electronic equipment, the electronic equipment has circuit main board, and the circuit main board has first
Surface and opposite second surface；First electronic building brick and second electronic building brick are each attached to the circuit board
First surface；
The installation region that the circuit main board installs second electronic building brick has through-hole, and the is provided in the through-hole
One heat-conductive assembly is used for the heat transfer that generates second electronic building brick to the second surface.
Preferably, in above-mentioned electronic equipment, the second surface fitting is fixed with the second heat-conductive assembly, and described second leads
One end of hot component is located in the region of installation region described in the second surface face, and the other end extends to the outer of the region
Portion, second heat-conductive assembly transfer heat to other regions in the second surface far from the region.
Preferably, in above-mentioned electronic equipment, the electronic building brick further includes shell, be provided on the shell it is described go out
Air port；
Second heat-conductive assembly is fixed on the second surface by fixation kit, and the fixation kit is heat conduction material
Material, contacts with the shell.
Present invention also provides a kind of conference system, the conference system includes electronic equipment described in any of the above embodiments.
As can be seen from the above description, in the electronic equipment and conference system that technical scheme provides, have first
Electronic building brick and the second electronic building brick, the vibration that first electronic building brick generates in the operating condition can cause gas stream
Dynamic, the gas of flowing can be distributed by air outlet to the outside of the electronic equipment, and second electronic building brick is arranged and is located at
On first electronic building brick to the gas flow paths of the air outlet, in this way, can be transmitted by the gas of the flowing
The heat that second electronic building brick generates in the operating condition, to the heat is dispersed by the air outlet described
The outside of electronic equipment, the electronic equipment can by have the characteristic of first electronic building brick work itself described the
Two electronic building bricks radiate, and without fan and can improve the radiating efficiency of second electronic building brick.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to required use in embodiment description
Attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only embodiments herein, for this field
For those of ordinary skill, without creative efforts, it can also be obtained according to the attached drawing of offer other attached
Figure.
Fig. 1 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 3 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 4 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 5 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 6 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
As stated in the background art, general electronic equipment all carries out active heat removal, but the volume of fan by built-in fans
Greatly, it is not easy to miniaturization design of electron equipment and low-cost design, and fan (having blade fan) has the shadow of rotational noise
It rings, will affect electronic equipment audio output effect.Although Novel bladeless fan can be to avoid the influence of rotational noise, its valence
Lattice are expensive, can further increase the cost of manufacture of electronic equipment.And the passive radiating mode of conventional heat sink, only pass through heat transfer
It is passively radiated, radiating efficiency is lower, is not able to satisfy the radiating requirements of the electronic building brick more demanding to temperature condition.Its
In, it uses fan to accelerate gas and flows the mode to radiate for active radiating mode, and fan-free design, it is only through heat dissipation
The mode that device or heat conducting pipe radiate is passive heat dissipation, and general active heat removal mode has more relative to passive radiating mode
High radiating efficiency.
To solve the above-mentioned problems, the application is that embodiment provides a kind of electronic equipment and conference system, the application
Electronic equipment described in embodiment has the first electronic building brick and the second electronic building brick, and first electronic building brick is in working condition
The vibration of lower generation can cause gas to flow, and the gas of flowing can be distributed by air outlet to outside the electronic equipment
Portion is arranged second electronic building brick and is located on first electronic building brick to the gas flow paths of the air outlet.
In this way, the heat that second electronic building brick generates in the operating condition can be transmitted by the gas of the flowing
Amount, so that the heat to be dispersed into the outside of the electronic equipment by the air outlet.Master is realized by the gas of flowing
Dynamic heat dissipation, the electronic equipment can realize that fan accelerates gas flowing by having the characteristic of the first electronic building brick work
The effect of active heat removal is carried out, to carry out active heat removal itself second electronic building brick, institute can be improved without fan
The radiating efficiency for stating the second electronic building brick, avoiding to use is had noise problem caused by blade fan and is caused using bladeless fan
High cost problem, structure is simple, low manufacture cost.
In order to make the above objects, features, and advantages of the present application more apparent, with reference to the accompanying drawing and it is specific real
Applying mode, the present application will be further described in detail.
With reference to Fig. 1, Fig. 1 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application, and electronics shown in Fig. 1 is set
Standby 10 include: the first electronic building brick 11 and the second electronic building brick 12.Fig. 1 is towards first electronic building brick 11 and described
The top view of second electronic building brick 12.
The vibration that first electronic building brick 11 generates in the operating condition can cause gas to flow, the gas of flowing
(as shown by the arrows in Figure 1) can be distributed by air outlet 13 to the outside of the electronic equipment 10；Second electronic building brick 12, institute
It states the second electronic building brick 12 to be located on first electronic building brick 11 to the gas flow paths of the air outlet 13, so that described
The gas of flowing transmits the heat that second electronic building brick 12 generates in the operating condition.Wherein, first electronic building brick
11 generate vibration by the triggering of audio data in the operating condition.
Electronic equipment 10 described in the embodiment of the present application can transmit second electronic building brick by the gas of the flowing
12 heats generated in the operating condition, so that the heat is dispersed into the electronic equipment 10 by the air outlet 13
It is external.As it can be seen that the electronic equipment 10 can realize active heat removal, the electronic equipment by the gas of flowing without fan
10 can realize that fan accelerates gas flowing and carries out active heat removal by having the characteristic that first electronic building brick 11 works
Effect can improve the second electronics group without fan to carry out active heat removal itself second electronic building brick 12
The radiating efficiency of part 12, and then avoiding use has noise problem caused by blade fan and use bladeless fan to lead to high cost
Problem, structure is simple, low manufacture cost.
With reference to Fig. 2, Fig. 2 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application, electronics shown in Fig. 2
In equipment 10, there is gas flow channel 14, second electronics between first electronic building brick 11 and the air outlet 13
Component 12 is located in the gas flow channel 14.Second electronic building brick 11 in normal operation, vibration energy
Range is setting, therefore by the way that the gas flow channel 14 is arranged, the space of gas flowing is limited, the part energy can be improved
The utilization rate of amount to improve gas flow rates, and then improves radiating efficiency.Fig. 2 be towards first electronic building brick 11 with
And the top view of second electronic building brick 12.
In electronic equipment 10 described in the embodiment of the present application, first electronic building brick 11 can be audio component, therefore described
First electronic building brick 11 generates vibration by the triggering of audio data in the operating condition, and then gas can be caused to flow.
In a kind of embodiment, the audio component has an active speaker unit, and in the embodiment, audio component is not
Including passive radiator.Wherein, the active speaker unit is encapsulated in the horn chamber body with guide duct；The guide duct
Opening be connected to the gas flow channel.
In another way, the audio component includes: active speaker unit and passive radiator；The active loudspeaking
Device unit is encapsulated in the horn chamber body with guide duct；The opening of the guide duct is connected to the gas flow channel, and/
Or, the air guide hole of the radiator for no reason at all is connected to the gas flow channel.
It is illustrated so that audio component is sound equipment as an example, can be use in electronic equipment 10 described in the embodiment of the present application
The sound equipment of passive radiator or the sound equipment for not using passive radiator.An active is generally comprised using the sound equipment of passive radiator
Loudspeaker unit and a passive radiator (passive unit).Passive unit is usually similar with active speaker unit shape, but
It is no voice coil and drive magnet, only one cone of passive unit, gets along well any voice coil or circuit is connected.Passive radiator quilt
For adjusting bass, the tone color for adjusting speaker entirety is enabled the designer to.Active cell pair of the passive radiator in speaker
Passive sounding is carried out in cabinet under the drive of gas.The frequency of fadings of passive radiator is usually that every octave reduces 18db.
It can thus be designed into carrying out resonance sounding at the submerged depth that loudspeaker bass unit is not achieved, while from bass list
The audible frequency of member is to being not in obvious " out of stock " between the audible frequency of passive radiator, to generate one from high to low
Smooth audio curve.The cone of the cone of bass unit and passive radiator can outwardly or inwardly movement or reversed simultaneously
The combination of movement.Sounding working principle based on the audio component is it is found that audio component energy under audio data driving
It is enough to generate vibration, the cone of sound unit and the cone of passive radiator outwardly or inwardly movement or are reversely transported simultaneously
Dynamic, vibration can drive gas to flow in this way, and the gas of flowing can transmit in guide duct inside it.
In electronic equipment 10 described in the embodiment of the present application, the gas flow channel 14 is to connect first electronic building brick
11 with the pipeline of the air outlet 13.One end of the pipeline connects opening for the output gas outwardly of first electronic building brick 11
Mouthful, the other end connects the air outlet 13, and second electronic building brick 12 is located in the pipeline.In which, the pipeline
It can be plastic conduit.The pipeline is tubular structure, is fixed on first electronic building brick 11 and the second electronics group
On 12 place mounting plane of part, the installation region that side wall corresponds to second electronics has opening, so that second electricity
Sub-component is located in the pipeline.The pipeline can be column structure, including cylinder or prism.
With reference to Fig. 3, Fig. 3 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application, electronics shown in Fig. 3
In equipment 10, the gas flow channel 14 is its multiple between first electronic building brick 11 and the air outlet 13
The channel for the guidance gas flow paths that his layout of electronic building brick 15 is formed.Fig. 3 be towards first electronic building brick 11 and
The top view of second electronic building brick 12.
In mode shown in Fig. 3, if being located at other electronics described in adjacent two in described 14 the same side of gas flow channel
There is gap between component 15, insulation colloid can be filled up completely in the gap；If first electronic building brick 11 with
There is gap between other adjacent described electronic building bricks 15, insulation colloid can be filled up completely in the gap；If had
There is gap between the shell of the air outlet 13 and other adjacent described electronic building bricks 15.The insulation colloid can be silicon
Glue.By filling the insulation colloid in the gap, on the one hand, the mounting stability of corresponding electronic module can be improved,
On the other hand, gas can also be avoided to realize high efficiency and heat radiation from the gap leakage to guarantee the utilization rate of flowing gas.
Electronic equipment 10 shown in Fig. 3 further includes passage cover plate, and the passage cover plate is not shown in Fig. 3, which covers
The gas flow channel 14 is covered, to form the channel design of sealing, gas leakage is avoided, to guarantee the utilization of flowing gas
Rate realizes high efficiency and heat radiation.
In electronic equipment 10 described in the embodiment of the present application, second electronic building brick 12 includes: that integrated chip or power are put
Big device or CPU processor etc..These devices radiate at work it is more and more demanding to temperature parameter, if heat dissipation not
It is good, it will its performance is largely effected on, is radiated by technical scheme to it, its radiating efficiency can be greatly improved,
Guarantee its good working performance.
Based on any mode of Fig. 1-Fig. 3, electronic equipment 10 described in the embodiment of the present application can also be as shown in Figure 4.Fig. 4 is
Perpendicular to first electronic building brick 11 and the sectional drawing of second electronic building brick 12.
With reference to Fig. 4, Fig. 4 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application, electronics shown in Fig. 4
Equipment 10 has circuit main board 21, and the circuit main board 21 has first surface and opposite second surface；First electricity
Sub-component 11 and second electronic building brick 12 are each attached to the first surface of the circuit board 21.The circuit main board 21 is pacified
The installation region for filling second electronic building brick 12 has through-hole 22, be provided in the through-hole the first heat-conductive assembly 23 for will
The heat transfer that second electronic building brick 12 generates is to the second surface, to be radiated by the circuit main board 21,
Improve the rate of heat dispation of second electronic building brick 12.The circuit main board 21 can be pcb board.
Wherein, first heat-conductive assembly 23 is Heat Conduction Material, such as can be graphite, graphene or metal heat conduction material
Material.First heat-conductive assembly 23 can pass through the heat transfer that heat exchange pattern generates second electronic building brick 12 to institute
State second surface.
Mode based on shown in Fig. 4, electronic equipment 10 described in the embodiment of the present application can also be as shown in Figure 5.Fig. 5 be perpendicular to
The sectional drawing of first electronic building brick 11 and second electronic building brick 12.
With reference to Fig. 5, Fig. 5 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application, electronics shown in Fig. 5
In equipment 10, the second surface fitting is fixed with the second heat-conductive assembly 24, and one end of second heat-conductive assembly 24 is located at institute
In the region for stating installation region described in second surface face, the other end extends to the outside in the region, and described second thermally conductive group
Part 24 transfers heat to other regions in the second surface far from the region, so that heat is rapidly directed away from described second
Electronic building brick 12, to guarantee the radiating efficiency of second electronic building brick 12.
Optionally, second electronic building brick 12 can be heat conducting pipe.In second heat-conductive assembly 24 and described second
Further include thermally conductive sheet between surface, the thermally conductive sheet is not shown in Fig. 5.The thermally conductive sheet can increase thermal contact conductance area, use
In conducting the heat for being transmitted to the second surface quickly to second heat-conductive assembly 24, to improve radiating efficiency.
Based on mode shown in Fig. 4 and Fig. 5, electronic equipment 10 described in the embodiment of the present application can also be as shown in Figure 6.Fig. 6 is
Perpendicular to first electronic building brick 11 and the sectional drawing of second electronic building brick 12.
With reference to Fig. 6, Fig. 6 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application, electronics shown in Fig. 5
Further include shell 31 in equipment 10, the air outlet 13 is provided on the shell 31；Second heat-conductive assembly 24 passes through solid
Determine component 32 and be fixed on the second surface, the fixation kit 32 is Heat Conduction Material, is contacted with the shell 31.The fixation
Component 32 such as can be able to be fixed screw with metal parts.The fixation kit 32 is also used to exist 21 fixing end of circuit main board
On the shell 31.If second heat-conductive assembly 24 is heat conducting pipe, can be set on the heat conducting pipe extending direction, in institute
The two sides for stating heat conducting pipe at least have a fixation kit 32 respectively, and second heat-conductive assembly 24 is passed through fixed group
Part 32 is fixed on the second surface.
Based on mode shown in Fig. 1-Fig. 6, electronic equipment 10 described in the embodiment of the present application can also be as shown in Figure 7.
With reference to Fig. 7, Fig. 7 is the structural schematic diagram of another electronic equipment provided by the embodiments of the present application, electronics shown in Fig. 7
In equipment 10, first electronic building brick 11 has guide duct 41 (region shown in dashed path in Fig. 7), the first electronics group
When part 11 works, gas is enabled to transmit in guide duct 41, the flowing gas (arrow in such as Fig. 7 exported by light pipe 41
Shown in head) it can be used for radiating to the second electronic building brick 12.As above-mentioned, flowing gas can be flowed logical by above-mentioned gas
Road is transmitted to air outlet.
Optionally, it in order to accelerate the radiating efficiency of the second electronic building brick 12, is also set on the surface of second electronic component
It is equipped with cooling fin 42, flowing gas can accelerate cooling fin surrounding air flowing velocity, so that heat is along gas flowing side
To air outlet is transferred to, it is dispersed into the outside of electronic equipment 10.
In mode shown in Fig. 7, first electronic building brick 11 can be audio component, microphone module (in figure with
Speaker example).Fig. 7 is only a kind of schematic diagram of concrete application mode, does not show that other assemblies structure, other assemblies knot
Structure can illustrate that details are not described herein with reference to mode shown in Fig. 1-Fig. 6.
It as can be seen from the above description, not only can be by having described in electronic equipment provided by the embodiments of the present application
The characteristic of one electronic building brick 11 work realizes that fan accelerates the effect that gas flowing carries out active heat removal, can also be existed by setting
Second heat-conductive assembly 24 of the second surface is passively radiated, and dissipating for second electronic building brick 12 is substantially increased
The thermal efficiency.
Based on above-mentioned electronic equipment embodiment, a kind of also very high conference system of another embodiment of the application, the meeting
System includes electronic equipment described in any mode of above-described embodiment.The conference system is video conferencing system, system
Building can be same as the prior art, including MCU multipoint controller (videoconference server), conference room terminal, PC desktop type
Several parts such as terminal, telephone access gateway (PSTNGateway), gateway (Gatekeeper).Its any one can be with sound
The integrated part of frequency component includes the electronic equipment, which mentions it is not necessary that active heat removal both individually may be implemented using fan
The radiating efficiency of second electronic building brick in the high part.
Each embodiment in this specification is using progressive or parallel or parallel describe by the way of progressive combine, each
What embodiment stressed is the difference from other embodiments, and the same or similar parts in each embodiment refer to each other
.For the conference system disclosed in the embodiment, since it is corresponding with electronic equipment disclosed in embodiment, so description
It is fairly simple, related place illustrates referring to electronic equipment corresponding part.
It should also be noted that, herein, relational terms such as first and second and the like are used merely to one
Entity or operation are distinguished with another entity or operation, without necessarily requiring or implying between these entities or operation
There are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to contain
Lid non-exclusive inclusion, so that article or equipment including a series of elements not only include those elements, but also
It including other elements that are not explicitly listed, or further include for this article or the intrinsic element of equipment.Do not having
In the case where more limitations, the element that is limited by sentence "including a ...", it is not excluded that in the article including above-mentioned element
Or there is also other identical elements in equipment.
The foregoing description of the disclosed embodiments makes professional and technical personnel in the field can be realized or use the application.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the application.Therefore, the application
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of electronic equipment, the electronic equipment include:
First electronic building brick, the vibration that first electronic building brick generates in the operating condition can cause gas to flow, flowing
Gas can be distributed by air outlet to the outside of the electronic equipment；
Second electronic building brick, the gas that second electronic building brick is located at first electronic building brick to the air outlet flow road
On diameter, so that the gas of the flowing transmits the heat that second electronic building brick generates in the operating condition；
Wherein, the triggering that first electronic building brick passes through audio data in the operating condition generates vibration.
2. electronic equipment according to claim 1 has gas flowing logical between first electronics and the air outlet
Road, second electronic building brick are located in the gas flow channel.
3. electronic equipment according to claim 2, first electronic building brick is audio component, and the audio component has
Active speaker unit；
Wherein, the active speaker unit is encapsulated in the horn chamber body with guide duct；The opening of the guide duct and institute
State gas flow channel connection.
4. electronic equipment according to claim 2, the audio component includes: active speaker unit and passive radiation
Device；
The active speaker unit is encapsulated in the horn chamber body with guide duct；The opening of the guide duct and the gas
Flow channel connection, and/or, the air guide hole of the radiator for no reason at all is connected to the gas flow channel.
5. electronic equipment according to claim 2, the gas flow channel is connection first electronic building brick and institute
State the pipeline of air outlet；
Or, the gas flow channel is multiple other electronics groups between first electronic building brick and the air outlet
Part is laid out the channel for the guidance gas flow paths to be formed.
6. electronic equipment according to claim 1, second electronic building brick include: integrated chip, power amplifier or
Person's CPU processor.
7. electronic equipment according to claim 1-6, the electronic equipment has circuit main board, the circuit master
Plate has first surface and opposite second surface；First electronic building brick and second electronic building brick are each attached to
The first surface of the circuit board；
The installation region that the circuit main board installs second electronic building brick has through-hole, is provided with first in the through-hole and leads
Hot component is used for the heat transfer that generates second electronic building brick to the second surface.
8. electronic equipment according to claim 7, the second surface, which is bonded, is fixed with the second heat-conductive assembly, and described second
One end of heat-conductive assembly is located in the region of installation region described in the second surface face, and the other end extends to the region
Outside, second heat-conductive assembly transfer heat to other regions in the second surface far from the region.
9. electronic equipment according to claim 8, the electronic building brick further includes shell, is provided on the shell described
Air outlet；
Second heat-conductive assembly is fixed on the second surface by fixation kit, and the fixation kit is Heat Conduction Material, with
The shell contact.
10. a kind of conference system, the conference system includes such as the described in any item electronic equipments of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910815281.9A CN110536590A (en) | 2019-08-30 | 2019-08-30 | Electronic equipment and conference system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910815281.9A CN110536590A (en) | 2019-08-30 | 2019-08-30 | Electronic equipment and conference system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110536590A true CN110536590A (en) | 2019-12-03 |
Family
ID=68665559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910815281.9A Pending CN110536590A (en) | 2019-08-30 | 2019-08-30 | Electronic equipment and conference system |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102055003A (en) * | 2009-10-30 | 2011-05-11 | 财团法人工业技术研究院 | Battery pack with thermal conducting adhesives |
| CN203012620U (en) * | 2013-01-08 | 2013-06-19 | 浪潮集团有限公司 | Easy-heat-dissipation computer motherboard |
| US20130213730A1 (en) * | 2012-02-17 | 2013-08-22 | Roman N. Litovsky | Acoustic ports aligned to create free convective airflow |
| CN205847489U (en) * | 2016-07-25 | 2016-12-28 | 广东欧珀移动通信有限公司 | A kind of audio amplifier |
| CN109257868A (en) * | 2018-09-30 | 2019-01-22 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN110139538A (en) * | 2019-05-17 | 2019-08-16 | 深圳市锐尔觅移动通信有限公司 | Electronic equipment and its control method |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055003A (en) * | 2009-10-30 | 2011-05-11 | 财团法人工业技术研究院 | Battery pack with thermal conducting adhesives |
| US20130213730A1 (en) * | 2012-02-17 | 2013-08-22 | Roman N. Litovsky | Acoustic ports aligned to create free convective airflow |
| CN203012620U (en) * | 2013-01-08 | 2013-06-19 | 浪潮集团有限公司 | Easy-heat-dissipation computer motherboard |
| CN205847489U (en) * | 2016-07-25 | 2016-12-28 | 广东欧珀移动通信有限公司 | A kind of audio amplifier |
| CN109257868A (en) * | 2018-09-30 | 2019-01-22 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN110139538A (en) * | 2019-05-17 | 2019-08-16 | 深圳市锐尔觅移动通信有限公司 | Electronic equipment and its control method |
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Application publication date: 20191203 |