CN110483998A - A kind of preparation method of high dielectric constant and low dielectric loss composite material - Google Patents
A kind of preparation method of high dielectric constant and low dielectric loss composite material Download PDFInfo
- Publication number
- CN110483998A CN110483998A CN201910673975.3A CN201910673975A CN110483998A CN 110483998 A CN110483998 A CN 110483998A CN 201910673975 A CN201910673975 A CN 201910673975A CN 110483998 A CN110483998 A CN 110483998A
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- Prior art keywords
- dielectric
- dielectric loss
- dielectric constant
- particle
- outfield
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000002131 composite material Substances 0.000 title claims description 12
- 230000005684 electric field Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 239000011231 conductive filler Substances 0.000 claims abstract description 8
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 238000012856 packing Methods 0.000 claims abstract description 3
- 238000010008 shearing Methods 0.000 claims abstract 2
- 239000000945 filler Substances 0.000 claims description 7
- 239000003575 carbonaceous material Substances 0.000 claims 1
- 229920002521 macromolecule Polymers 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 8
- 239000003990 capacitor Substances 0.000 abstract description 3
- 229920002595 Dielectric elastomer Polymers 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 6
- 229910002113 barium titanate Inorganic materials 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 3
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- -1 Poly(dimethylsiloxane) Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920013657 polymer matrix composite Polymers 0.000 description 1
- 239000011160 polymer matrix composite Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Organic Insulating Materials (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
The present invention relates to a kind of methods for arranging preparation high-performance dielectric material by outfield auxiliary particle, in order to improve the relative dielectric constant of material, while reduce dielectric loss or maintaining dielectric loss in lower range.The ceramic packing of conductive filler and high dielectric is mixed into polymeric matrix by this method, is acted on auxiliary particle by outfield (such as: electric field, magnetic field, shearing field) and is moved the orientation texture aligned in the base.Wherein, the conductive filler being orientated is formed by a large amount of button capacitors and greatly improves the dielectric constant of material, and the ceramic particle adulterated in orientation texture reduces the dielectric loss of material again.High-performance dielectric material prepared by this method has huge application prospect in fields such as wearable device, dielectric elastomer, supercapacitors.
Description
[technical field]
The present invention relates to this technical field of electronic material, the three-phase for being related specifically to high dielectric constant and low dielectric loss is situated between
The preparation of composite.
[technical background]
With the development of science and technology, high-performance dielectric material is in electronics such as wearable device, dielectric elastomer, supercapacitors
Device industry has great application market and prospect.Since traditional ceramic-like dielectric material density is big, poor in processability, destruction
The defect for the aspects such as intensity is low has been unable to meet demand of the today's society to dielectric material.Therefore compound dielectric material meet the tendency of and
Life, high dielectric filler polymer-based dielectric material, preparation method are simple.However it has been found that, the dielectric filler of one side high-content
Particle although available more satisfactory dielectric properties, but the flexibility that will lead to polymer itself destroy it is serious and high
Amount of filler greatly improves material cost；Another aspect conductive filler polymer and composite material can obtain under lower amount of filler
To high dielectric constant, but the dielectric loss of system can increase with it, and dielectric loss is excessively high, influence the practical application of material
Effect.Research in terms of thering is article once to report outfield orientation for improving conductive filler polymer matrix composite dielectric, but
It is extremely serious and the problems such as result in the increase of dielectric loss to deposit leakage current that the formation of conductive path after orientation occurs.
(GuoY,Chen,Yuwei,Wang, Enmin,et al.Roll-to-Roll Continuous Manufacturing
Multifunctional Nanocomposites by Electric-Field-Assisted“Z”Direction
Alignment of Graphite Flakes in Poly(dimethylsiloxane)[J]. Acs Appl Mater
Interfaces,2017,9(1):919-929.)
[summary of the invention]
[solving the problems, such as]
The purpose of the present invention is to provide a kind of preparation methods of high dielectric constant and low dielectric loss composite material.
The present invention can be achieved through the following technical solutions:
A kind of preparation method of high dielectric constant and low dielectric loss composite material, including several components: conductive filler, ceramics
Filler and polymeric matrix.
A certain amount of two kinds of filler grains are uniformly mixed with the polymeric matrix with mobility.
Mixed liquor is poured into mould therefor, particle is orientated in the base under the regulation of outfield.
Polymeric matrix is solidified or is crosslinked by way of being suitble in orientation process, such as is heating and curing, light radiation
Crosslinking.
[beneficial effect]
Orientation is formed by chain string structure containing a large amount of button capacitor structure, and the presence of the structure greatly improves
The dielectric constant of material.
Orientation is formed by chain string structure doped with the ceramic particle of high dielectric, has been blocked conductive path, has been made material
Dielectric loss reduces.
Flexible dielectric can be prepared according to selected matrix difference.
In conclusion dielectric material prepared by this method has high dielectric constant and low dielectric loss, in electronics
Product scope has broad application prospects.
[Detailed description of the invention]
Figure one is the section SEM of prepared orientation and non-oriented three-phase dielectric composite film.
Figure two is the dielectric constant and dielectric loss comparison diagram of prepared sample.
Figure three is mechanism explanation figure.
[specific embodiment]
The present invention will be further described combined with specific embodiments below.The embodiment is only preferential implementation of the invention
Example, is not intended to restrict the invention, the invention may be variously modified and varied.All within the spirits and principles of the present invention,
Any modification, equivalent substitution, improvement and etc. done should all be included in the protection scope of the present invention.
The present embodiment is using 12000 mesh graphite as conductive filler, and using barium titanate as ceramic packing, matrix is DOW CORNING
184 dimethyl silicone polymers (PDMS), selected outfield are electric field.
Preparing mass content of graphite is 2.5%, graphite/barium titanate that the mass fraction of barium titanate is 5%/PDMS mixing
Liquid carries out 3min stir process using non-intervention type homogenizer to achieve the purpose that uniformly to mix and deviate from bubble.
Sample introduction is had in mold prepared by ITO electro-conductive glass, while ITO electro-conductive glass is also used as upper/lower electrode to connect
It connects electric field equipment and electric field is provided.Electric field equipment is made of arbitrary waveform generator, high-voltage amplifier, oscillograph, and electric field can be any
Adjust waveform, voltage, frequency etc..The present embodiment uses 2000Vp-p/mm, the sinusoidal electrical field of 10Hz.
Mold is placed in thermal station, is begun to warm up after threshold electric field equipment 5min, temperature is set as 90 DEG C, heats 30min.
Electric field equipment is closed, composite membrane is taken out in die sinking.
Non-oriented composite membrane is made without electric field orientation process by solidification is directly heated after sample addition mold.
Scanning electron microscope diagram shown in figure one is measured by the 7500F scanning electron microscope of JEOL company.
It is orientated in embodiment with the dielectric properties of non-oriented composite membrane and is analyzed by Fig. 2 it is found that dielectric constant after graphite orientation
It is 302, but its dielectric loss also rises to 400, can not be used as dielectric material；Barium titanate orientation or graphite/barium titanate/
The non-oriented prepared composite membrane dielectric loss of PDMS is low, but dielectric constant is only 2.2,3.5, can not also be made as dielectric material
With.And by being orientated obtained three-phase dielectric material, when dielectric constant is 73.5, dielectric loss is only 0.19.This is also indicated that
Method described in the invention is effective.Above-described dielectric properties by German Novocontrl company Alpha-
A type wideband dielectric impedance spectrometer measures.
Figure three is the mechanism figure of dielectric properties raising after orientation, is existed in the chain string structure formed after orientation a large amount of miniature
Capacitor arrangement, the presence of this structure can greatly improve the dielectric constant of material, and barium titanate is deposited in chain string structure
It is blocking graphite chain string to be formed by conductive path, the leakage current of system can be reduced, reaching reduces dielectric material loss
Purpose.
Claims (5)
1. a kind of preparation method of high dielectric constant and low dielectric loss composite material, it is characterised in that: by conductive filler and ceramics
Filler is mixed into polymeric matrix, is arranged in the base by outfield auxiliary particle and is obtained being orderly aligned structure.
2. conductive filler according to claim 1, it is characterised in that: can be metallic, carbon material, or lead
Electric macromolecule.Its size can be nanoscale or micron order, and shape can fill out for sheet, rodlike, granular most conductions
Material.
3. ceramic packing according to claim 1, it is characterised in that: size nanometer or micron-sized sheet, it is rodlike,
Granular ceramic particle.
4. outfield according to claim 1, including extra electric field, magnetic field, shearing field.
5. basis material according to claim 1, it is characterised in that particle can be made in the fortune for being wherein oriented arrangement
It is dynamic, and can be fixed in the material by orientation texture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910673975.3A CN110483998A (en) | 2019-07-29 | 2019-07-29 | A kind of preparation method of high dielectric constant and low dielectric loss composite material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910673975.3A CN110483998A (en) | 2019-07-29 | 2019-07-29 | A kind of preparation method of high dielectric constant and low dielectric loss composite material |
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| Publication Number | Publication Date |
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| CN110483998A true CN110483998A (en) | 2019-11-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910673975.3A Pending CN110483998A (en) | 2019-07-29 | 2019-07-29 | A kind of preparation method of high dielectric constant and low dielectric loss composite material |
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| CN (1) | CN110483998A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713236A (en) * | 2020-12-29 | 2021-04-27 | 北京工业大学 | Piezoelectric composite material with piezoelectric particles and metal nanorods in cochain arrangement and preparation method thereof |
| CN113416332A (en) * | 2021-06-23 | 2021-09-21 | 青岛科技大学 | Preparation method of high-thermal-conductivity three-phase composite film under assistance of electric field |
| US11930630B2 (en) | 2020-11-26 | 2024-03-12 | Changxin Memory Technologies, Inc. | Dynamic random access memory capacitor and preparation method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103194858A (en) * | 2013-04-23 | 2013-07-10 | 北京化工大学 | Elastomer composite with high dielectric constant and low dielectric loss and preparation method thereof |
| CN109486004A (en) * | 2018-11-06 | 2019-03-19 | 万华化学（宁波）有限公司 | A kind of high dielectric property polypropylene three-phase composite material and its preparation method and application |
| CN109721897A (en) * | 2019-01-22 | 2019-05-07 | 智能容电(北京)科技有限公司 | A kind of high dielectric constant three-phase nanocomposite dielectric and preparation method |
| CN110016723A (en) * | 2019-04-08 | 2019-07-16 | 深圳先进技术研究院 | A kind of dielectric composite material, preparation method and plate capacitor |
-
2019
- 2019-07-29 CN CN201910673975.3A patent/CN110483998A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103194858A (en) * | 2013-04-23 | 2013-07-10 | 北京化工大学 | Elastomer composite with high dielectric constant and low dielectric loss and preparation method thereof |
| CN109486004A (en) * | 2018-11-06 | 2019-03-19 | 万华化学（宁波）有限公司 | A kind of high dielectric property polypropylene three-phase composite material and its preparation method and application |
| CN109721897A (en) * | 2019-01-22 | 2019-05-07 | 智能容电(北京)科技有限公司 | A kind of high dielectric constant three-phase nanocomposite dielectric and preparation method |
| CN110016723A (en) * | 2019-04-08 | 2019-07-16 | 深圳先进技术研究院 | A kind of dielectric composite material, preparation method and plate capacitor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11930630B2 (en) | 2020-11-26 | 2024-03-12 | Changxin Memory Technologies, Inc. | Dynamic random access memory capacitor and preparation method therefor |
| CN112713236A (en) * | 2020-12-29 | 2021-04-27 | 北京工业大学 | Piezoelectric composite material with piezoelectric particles and metal nanorods in cochain arrangement and preparation method thereof |
| CN112713236B (en) * | 2020-12-29 | 2024-02-27 | 北京工业大学 | Piezoelectric composite material with common-chain arrangement of piezoelectric particles and metal nanorods and preparation method |
| CN113416332A (en) * | 2021-06-23 | 2021-09-21 | 青岛科技大学 | Preparation method of high-thermal-conductivity three-phase composite film under assistance of electric field |
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Application publication date: 20191122 |