CN110480941A - A kind of semiconductor packaging mold injection head and its injection structure - Google Patents
A kind of semiconductor packaging mold injection head and its injection structure Download PDFInfo
- Publication number
- CN110480941A CN110480941A CN201910839636.8A CN201910839636A CN110480941A CN 110480941 A CN110480941 A CN 110480941A CN 201910839636 A CN201910839636 A CN 201910839636A CN 110480941 A CN110480941 A CN 110480941A
- Authority
- CN
- China
- Prior art keywords
- injection
- injection head
- mounting plate
- fixed column
- semiconductor packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 56
- 239000007924 injection Substances 0.000 title claims abstract description 56
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000003032 molecular docking Methods 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 238000012856 packing Methods 0.000 abstract description 11
- 239000003292 glue Substances 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000001035 drying Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1775—Connecting parts, e.g. injection screws, ejectors, to drive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/20—Injection nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/74—Heating or cooling of the injection unit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of semiconductor packaging mold injection heads, comprising: injection head ontology, the rectangle fixed column are installed at the installing port of mold base upper end by the fixed lobe circle of its lower end；The docking male-pipe is bolted in the lower end of the centre bore of rectangle fixed column；The seal sleeve covers in the outside of cylindrical tube, and seal sleeve stretches to the inner cavity of mold base；Cooling mechanism comprising the fan of the mounting plate of cylindrical tube side, the horizontal guide rail plate of mounting plate lower end connection, the fan mounting plate of Mobile base lower end connection and the installation of fan mounting plate side is fixed on by the first screw.Fan work of the present invention enhances the leakproofness connected between injection head ontology and mold base so that liquid-packing glue rapid draing, achievees the purpose that fast packing, prevents liquid entry into the inner cavity of mold base；It is easy to connect between injection-tube and rectangle fixed column, convenient for the disassembly of injection head ontology.
Description
Technical field
The invention belongs to semiconductor packaging mold injection head technical fields, and in particular to a kind of semiconductor packaging mold injection
Head and its injection structure.
Background technique
It is poorly sealed between injection head ontology and mold base after injection head ontology is installed on semiconductor packaging mold, hold
It easily leads to liquid and enters mold base cavity, and inconvenience is installed in the disassembly of injection head ontology, liquid-packing glue cannot fast rapid-curing cutback
It is dry, cause the packaging efficiency to semiconductor bad.For this purpose, it is proposed that a kind of semiconductor packaging mold injection head and its injection knot
Structure.
Summary of the invention
The purpose of the present invention is to provide a kind of semiconductor packaging mold injection head and its injection structures, to solve above-mentioned back
The problem of being proposed in scape technology.
To achieve the above object, the invention provides the following technical scheme: a kind of semiconductor packaging mold injection head, comprising:
Injection head ontology comprising have rectangle fixed column and be connected to the injection-tube of rectangle fixed column lower end, the rectangle
Fixed column is installed at the installing port of mold base upper end by the fixed lobe circle of its lower end；
The injection-tube includes from top to bottom sequentially connected docking male-pipe, cylindrical tube and injection nozzle, the docking
Male-pipe is bolted in the lower end of the centre bore of rectangle fixed column；
Sealing mechanism comprising locating ring and the seal sleeve positioned at locating ring lower end, the locating ring are connected to mold
At the installing port of pedestal upper end, the seal sleeve covers in the outside of cylindrical tube, and seal sleeve stretches to the interior of mold base
Chamber；
Cooling mechanism comprising the mounting plate of cylindrical tube side is fixed on by the first screw, mounting plate lower end connects
The fan mounting plate and fan mounting plate one of the Mobile base, the connection of Mobile base lower end that are slipped on horizontal guide rail plate, horizontal guide rail plate
The fan of side installation.
Preferably, the docking male-pipe, cylindrical tube and injection nozzle are integrally formed, and the injection nozzle is in funnel type.
Preferably, it is also socketed with seal washer on the docking male-pipe, the seal washer is connected to rectangle and fixes
The lower end of the centre bore of column.
Preferably, the fixed lobe circle is installed at the installing port of mold base upper end by the second screw, and described
Two screws are through fixed lobe circle and are bolted in locating ring.
Preferably, the Mobile base is slidably connected on horizontal guide rail plate by the sliding opening in the middle part of it, on the Mobile base
End middle part is also bolted with screw rod, is connected with handwheel at the top of the screw rod.
Preferably, the middle part of the fan mounting plate is equipped with square aperture, is mounted on square aperture on the outside of the fan
Outside, the center position of the square aperture and the lower end position of injection nozzle are concordant.
In addition, to achieve the goals above, the present invention also provides a kind of injection structures, die-filling including the semiconductor package
Has injection head.
Technical effect and advantage of the invention: fan work, so that liquid-packing glue rapid draing, reaches fast packing
Purpose in this way can be along horizontal guide rail since Mobile base is slidably connected on horizontal guide rail plate by the sliding opening in the middle part of it
Plate slides Mobile base, and then adjusts the distance between fan and injection nozzle, and it is quick-drying to liquid-packing glue to adjust fan
Effect；
By hand wheel rotating screw rod, so that screw lower end resists horizontal guide rail plate, the positioning of Mobile base is fixed in completion, into
And complete the fixation to the position of fan；
It is connected to by locating ring at the installing port of mold base upper end, seal sleeve covers in the outside of cylindrical tube, and close
Big envelope cylinder, which stretches to the inner cavity of mold base and docks, is also socketed with seal washer on male-pipe, and seal washer is connected to rectangle
The setting of the lower end of the centre bore of fixed column enhances the leakproofness connected between injection head ontology and mold base, avoids liquid
Body enters the inner cavity of mold base；
Since injection-tube includes from top to bottom sequentially connected docking male-pipe, cylindrical tube and injection nozzle, outer spiral shell is docked
Line pipe is bolted in the lower end of the centre bore of rectangle fixed column, so that it is easy to connect between injection-tube and rectangle fixed column, convenient for note
Penetrate the disassembly of an ontology.
Detailed description of the invention
Fig. 1 is that rectangle fixed column of the invention, injection-tube, sealing mechanism and the decomposition texture of cooling mechanism combination installation show
It is intended to；
Fig. 2 is schematic cross-sectional view of the invention.
In figure: 1 rectangle fixed column, 2 centre bores, 3 second screws, 4 fixed lobe circles, 5 seal washers, 6 docking external screw threads
Pipe, 7 cylindrical tubes, 8 injection nozzles, 9 locating rings, 10 seal sleeves, 11 mounting plates, 12 first screws, 13 horizontal guide rail plates, 14 fans
Mounting plate, 15 fans, 16 Mobile bases, 17 sliding openings, 18 handwheels, 19 screw rods, 20 mold bases.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figs. 1-2, a kind of semiconductor packaging mold injection head, comprising:
Injection head ontology comprising have rectangle fixed column 1 and be connected to the injection-tube of 1 lower end of rectangle fixed column, the square
Shape fixed column 1 is installed at the installing port of 20 upper end of mold base by the fixed lobe circle 4 of its lower end；
The injection-tube includes from top to bottom sequentially connected docking male-pipe 6, cylindrical tube 7 and injection nozzle 8, described right
Connect the lower end that male-pipe 6 is bolted in the centre bore 2 of rectangle fixed column 1；
Sealing mechanism comprising locating ring 9 and the seal sleeve 10 positioned at 9 lower end of locating ring, the locating ring 9 are connected to
At the installing port of 20 upper end of mold base, outside of 10 sets of the seal sleeve in cylindrical tube 7, and seal sleeve 10 stretches to mould
Has the inner cavity of pedestal 20；
Cooling mechanism comprising mounting plate 11,11 lower end of mounting plate of 7 side of cylindrical tube are fixed on by the first screw 12
The fan mounting plate of the Mobile base 16, the connection of 16 lower end of Mobile base that are slipped on the horizontal guide rail plate 13 of connection, horizontal guide rail plate 13
14 and 14 side of fan mounting plate installation fan 15.
Specifically, the docking male-pipe 6, cylindrical tube 7 and injection nozzle 8 are integrally formed, the injection nozzle 8 is in funnel
Type.
Specifically, being also socketed with seal washer 5 on the docking male-pipe 6, it is solid that the seal washer 5 is connected to rectangle
The lower end of the centre bore 2 of fixed column 1.
Specifically, the fixed lobe circle 4 is installed at the installing port of 20 upper end of mold base by the second screw 3, institute
The second screw 3 is stated through fixed lobe circle 4 and is bolted in locating ring 9.
Specifically, the Mobile base 16 is slidably connected on horizontal guide rail plate 13 by the sliding opening 17 in the middle part of it, the shifting
Dynamic 16 upper center of seat is also bolted with screw rod 19, and the top of the screw rod 19 is connected with handwheel 18.
Specifically, the middle part of the fan mounting plate 14 is equipped with square aperture, the outside of the fan 15 is mounted on rectangular
The center position in the outside of opening, the square aperture is concordant with the lower end position of injection nozzle 8.
In addition, to achieve the goals above, the present invention also provides a kind of injection structures, die-filling including the semiconductor package
Has injection head.
Specifically, in use, liquid-packing glue is injected into centre bore 2 via the upper end of rectangle fixed column 1, then
Liquid-packing glue is in the case where the air pressure in centre bore 2 pushes, via cylindrical tube 7 and the outflow of injection nozzle 8 to semiconductor packaging mold
It is sealed encapsulation；
Fan 15 works, so that liquid-packing glue rapid draing, achievees the purpose that fast packing, since Mobile base 16 is logical
The sliding opening 17 crossed in the middle part of it is slidably connected on horizontal guide rail plate 13, can slide Mobile base along horizontal guide rail plate 13 in this way
16, and then the distance between fan 15 and injection nozzle 8 are adjusted, fan 15 is adjusted to the quick-drying effect of liquid-packing glue；
By 18 rotary screw rod 19 of handwheel, so that 19 lower end of screw rod resists horizontal guide rail plate 13, complete to Mobile base 16
Positioning is fixed, and then completes the fixation to the position of fan 15；
It is connected to by locating ring 9 at the installing port of 20 upper end of mold base, 10 sets of seal sleeve in the outer of cylindrical tube 7
Side, and seal sleeve 10 stretches to the inner cavity of mold base 20 and docks and is also socketed with seal washer 5 on male-pipe 6, seals
Washer 5 is connected to the setting of the lower end of the centre bore 2 of rectangle fixed column 1, enhances between injection head ontology and mold base 20
The leakproofness of connection prevents liquid entry into the inner cavity of mold base 20；
Since injection-tube includes that from top to bottom sequentially connected docking male-pipe 6, cylindrical tube 7 and injection nozzle 8, docking are outer
Screwed pipe 6 is bolted in the lower end of the centre bore 2 of rectangle fixed column 1, so that it is easy to connect between injection-tube and rectangle fixed column 1,
Convenient for the disassembly of injection head ontology.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (7)
1. a kind of semiconductor packaging mold injection head characterized by comprising
Injection head ontology comprising have rectangle fixed column (1) and be connected to the injection-tube of rectangle fixed column (1) lower end, the square
Shape fixed column (1) is installed at the installing port of mold base (20) upper end by the fixed lobe circle (4) of its lower end；
The injection-tube includes from top to bottom sequentially connected docking male-pipe (6), cylindrical tube (7) and injection nozzle (8), described
Docking male-pipe (6) is bolted in the lower end of the centre bore (2) of rectangle fixed column (1)；
Sealing mechanism comprising locating ring (9) and the seal sleeve (10) for being located at locating ring (9) lower end, locating ring (9) card
It connects at the installing port of mold base (20) upper end, the seal sleeve (10) covers in the outside of cylindrical tube (7), and seal sleeve
(10) inner cavity of mold base (20) is stretched to；
Cooling mechanism comprising the mounting plate (11), mounting plate (11) of cylindrical tube (7) side are fixed on by the first screw (12)
The horizontal guide rail plate (13) of lower end connection, the Mobile base (16) slipped on horizontal guide rail plate (13), the connection of Mobile base (16) lower end
Fan mounting plate (14) and fan mounting plate (14) side installation fan (15).
2. a kind of semiconductor packaging mold injection head according to claim 1, it is characterised in that: the docking male-pipe
(6), cylindrical tube (7) and injection nozzle (8) are integrally formed, and the injection nozzle (8) is in funnel type.
3. a kind of semiconductor packaging mold injection head according to claim 1, it is characterised in that: the docking male-pipe
(6) it is also socketed on seal washer (5), the seal washer (5) is connected to the lower end of the centre bore (2) of rectangle fixed column (1).
4. a kind of semiconductor packaging mold injection head according to claim 1, it is characterised in that: the fixed lobe circle
(4) it is installed at the installing port of mold base (20) upper end by the second screw (3), second screw (3) is convex through fixation
Looping (4) is simultaneously bolted in locating ring (9).
5. a kind of semiconductor packaging mold injection head according to claim 1, it is characterised in that: the Mobile base (16) is logical
The sliding opening (17) crossed in the middle part of it is slidably connected on horizontal guide rail plate (13), and Mobile base (16) upper center is also bolted with silk
Bar (19) is connected with handwheel (18) at the top of the screw rod (19).
6. a kind of semiconductor packaging mold injection head according to claim 1, it is characterised in that: the fan mounting plate
(14) middle part is equipped with square aperture, and the outside of square aperture is mounted on the outside of the fan (15), the square aperture
Center position is concordant with the lower end position of injection nozzle (8).
7. a kind of injection structure, which is characterized in that including the semiconductor packaging mold as described in any one of claim 1-6
Injection head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910839636.8A CN110480941A (en) | 2019-09-06 | 2019-09-06 | A kind of semiconductor packaging mold injection head and its injection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910839636.8A CN110480941A (en) | 2019-09-06 | 2019-09-06 | A kind of semiconductor packaging mold injection head and its injection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110480941A true CN110480941A (en) | 2019-11-22 |
Family
ID=68556832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910839636.8A Pending CN110480941A (en) | 2019-09-06 | 2019-09-06 | A kind of semiconductor packaging mold injection head and its injection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110480941A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112060480A (en) * | 2020-07-14 | 2020-12-11 | 马鞍山久特新材料科技有限公司 | Polyurethane casting machine with functions of liquid guiding and self-sealing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171076A (en) * | 1994-12-23 | 1998-01-21 | 阿莫科公司 | Improved process for making preforms useful for encapsulating semiconductors |
| CN104921281A (en) * | 2015-07-07 | 2015-09-23 | 上海电机学院 | 3D food printer |
| CN207367936U (en) * | 2017-11-13 | 2018-05-15 | 铜陵元一精工机械有限公司 | A kind of semiconductor packaging mold replacement type injection head structure |
-
2019
- 2019-09-06 CN CN201910839636.8A patent/CN110480941A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171076A (en) * | 1994-12-23 | 1998-01-21 | 阿莫科公司 | Improved process for making preforms useful for encapsulating semiconductors |
| CN104921281A (en) * | 2015-07-07 | 2015-09-23 | 上海电机学院 | 3D food printer |
| CN207367936U (en) * | 2017-11-13 | 2018-05-15 | 铜陵元一精工机械有限公司 | A kind of semiconductor packaging mold replacement type injection head structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112060480A (en) * | 2020-07-14 | 2020-12-11 | 马鞍山久特新材料科技有限公司 | Polyurethane casting machine with functions of liquid guiding and self-sealing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191122 |
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| RJ01 | Rejection of invention patent application after publication |