CN110474139B - Waveguide power distribution and synthesis structure and method of integrated liquid cooling runner - Google Patents
Waveguide power distribution and synthesis structure and method of integrated liquid cooling runner Download PDFInfo
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- CN110474139B CN110474139B CN201910670274.4A CN201910670274A CN110474139B CN 110474139 B CN110474139 B CN 110474139B CN 201910670274 A CN201910670274 A CN 201910670274A CN 110474139 B CN110474139 B CN 110474139B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
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Abstract
The invention discloses a waveguide power distribution and synthesis structure and a method of an integrated liquid cooling flow channel, wherein a circuit part comprises a power distributor, a waveguide turning transition, a solid power amplifier chip and a power synthesizer; the mechanical part comprises a first assembly part, a second assembly part and a third assembly part, wherein the second assembly part is arranged between the first assembly part and the third assembly part, a liquid cooling runner is arranged on the second assembly part, and a radiating fin is arranged in the liquid cooling runner; the first assembly part is provided with a liquid cooling runner inlet and a liquid cooling runner outlet which are communicated with the liquid cooling runner; the third assembly part is provided with a mounting groove for mounting the power divider and the synthesizer; the solid-state power amplifier chip is arranged on the chip mounting position of the first assembly part. The waveguide power distribution and synthesis network provided by the invention has the advantages that through the design of a three-piece cavity structure: 1) the space utilization is high: 2) no external independent heat dissipation device is needed; 3) the assembly complexity is reduced; 4) the expansion can be carried out by two-way, four-way, eight-way and sixteen-way.
Description
Technical Field
The invention relates to a power distribution and synthesis structure and a power distribution and synthesis method applied to a power amplifier, in particular to a power distribution and synthesis network based on a rectangular waveguide.
Background
In the existing electronic devices such as radar and communication, a power amplifier with high power output is needed so as to increase the working distance or enhance the interference capability. Although the traditional vacuum power device such as a traveling wave tube can provide high power output, the traditional vacuum power device has the defects of low reliability, thousands of or tens of thousands of volts of supply voltage and the like. In contrast, although a single chip of the solid-state power amplifier device has low output power, the solid-state power amplifier device has the advantages of high reliability, low operating voltage and the like, and becomes a main development direction of the power amplifier. Therefore, a power synthesis technique for performing equal-amplitude and same-phase on a plurality of solid-state power amplifier chips becomes very important.
In the millimeter wave band, the current typical technology is based on a rectangular waveguide power distribution and synthesis network. The signals are distributed in a multi-path way through a multi-path power distribution network, each path of signal is amplified by a chip and then synthesized through a multi-path power synthesis network, and therefore, the basic architecture of the power divider is 'power divider-amplifying chip-power synthesizer'. For a power amplifier, besides a circuit design, a heat dissipation design is also a crucial part, and a typical technology at present is to add a heat dissipation device, such as an air cooling fin or a liquid cooling flow channel, outside the basic architecture. The above structure is shown in fig. 1, which inevitably increases the volume and weight of the apparatus, and is disadvantageous for improving the integration and miniaturization. The Ka-band broadband high-power amplifier disclosed in patent CN108091970A is a "power divider-amplifier chip-power combiner" architecture, and interfaces of each part are connected by screws, so that there are many assembly links, and the Ka-band broadband high-power amplifier does not include a heat dissipation device and needs to be added externally. An E-band waveguide E-T branch and multi-probe coupling structure power combining amplifier disclosed in patent CN208208950U, described in [0020], needs to be externally mounted with a heat sink or take other heat dissipation measures.
Disclosure of Invention
The invention aims to provide a waveguide power distribution and synthesis structure and a method, which improve the space utilization rate and reduce the volume of equipment under the condition of the same power synthesis scale.
The purpose of the invention is realized by the following technical scheme:
a waveguide power distribution and synthesis structure of an integrated liquid cooling flow channel comprises a circuit part and a mechanical part;
the circuit part comprises a power divider, a waveguide turning transition, a solid-state power amplifier chip and a power synthesizer;
the mechanical part comprises a first assembly part, a second assembly part and a third assembly part, wherein the second assembly part is arranged between the first assembly part and the third assembly part, a liquid cooling runner is arranged on the second assembly part, and a radiating fin is arranged in the liquid cooling runner; the first assembly part is provided with a liquid cooling runner inlet and a liquid cooling runner outlet which are communicated with the liquid cooling runner; the third assembly part is provided with a mounting groove for mounting the power divider and the combiner, and the side edge of the third assembly part is provided with an input position and an output position;
the solid-state power amplifier chip is arranged on a chip mounting position of the first assembly part, a first waveguide steering transition hole and a second waveguide steering transition hole are arranged on two sides of the chip mounting position, the waveguide steering transition comprises a first waveguide steering transition section and a second waveguide steering transition section, two ends of the first waveguide steering transition section are respectively connected with the power divider and the first waveguide steering transition output waveguide, two ends of the second waveguide steering transition section are respectively connected with the second waveguide steering transition input waveguide and the power combiner, the first waveguide steering transition output waveguide penetrates out of the first waveguide steering transition hole and then is connected with the solid-state power amplifier chip, and the second waveguide steering transition input waveguide is connected with the solid-state power amplifier chip and penetrates into the second waveguide steering transition hole to be connected with the second waveguide steering transition section.
Preferably, the liquid cooling flow passage is U-shaped, two ends of the liquid cooling flow passage correspond to the liquid cooling flow passage inlet and the liquid cooling flow passage outlet respectively, and the liquid cooling flow passage inlet and the liquid cooling flow passage outlet are arranged on one side of the first assembly.
Preferably, the chip mounting site is disposed in a middle portion of the first assembly.
As the preferred mode, the middle part of first subassembly sets up the mounting panel, sets up chip installation position on the mounting panel, and the mounting panel passes through the fix with screw with first subassembly.
As an optimal mode, after the solid-state power amplifier chip is installed on the installation plate, the top surface of the solid-state power amplifier chip does not exceed the top surface of the first assembly part.
Preferably, the first assembly is provided with a giant groove, a bottom plate of the giant groove is used as a top plate of the liquid flow channel, and the mounting plate is arranged in the giant groove. The structure is mainly used for facilitating heat dissipation, and the heat dissipation effect is enhanced by reducing the thickness of the first assembly, particularly the thickness of the top plate of the liquid flow channel.
Preferably, the inlet and the outlet of the liquid cooling flow passage are both provided with kidney-shaped holes.
Preferably, the first assembly member and the second assembly member are welded to form a whole, and a plurality of rectangular waveguide holes (the first waveguide turning transition hole and the second waveguide turning transition hole) penetrating through the whole of the first assembly member and the second assembly member are machined; the third assembly and the second assembly are assembled together by screws.
As a preferred mode, the power divider branch is set to be an input waveguide and two, four, eight or sixteen output waveguides, the input waveguide branch of the power combiner is consistent with the output waveguide branch of the power divider, and the power combiner is set to be an output waveguide;
and each path of output waveguide of the power divider or each path of input waveguide of the power combiner is correspondingly provided with a first waveguide turning transition section, a first waveguide turning transition output waveguide, a second waveguide turning transition section, a second waveguide turning transition input waveguide and a solid power amplifier chip.
Preferably, the number of the mounting plates is consistent with the number of the branches of the power divider or the number of the branches of the power combiner, and each mounting plate is fixed on the first assembly through a screw; and a first waveguide turning transition hole and a second waveguide turning transition hole are arranged on each mounting plate.
A waveguide power distribution and synthesis method of an integrated liquid cooling channel is characterized in that a signal enters from an input position, passes through a power distributor and then is output from a first waveguide steering transition section to a transition output waveguide through a first waveguide steering transition section, and a chip mounting position between the first waveguide steering transition output waveguide and a second waveguide steering transition input waveguide is used for mounting a solid power amplifier chip; the signal enters a second waveguide turning transition input waveguide after being amplified by the solid-state power amplifier chip, and is output from an output position after passing through a second waveguide turning transition section and the power combiner;
external cooling liquid flows in from the inlet of the liquid cooling runner, takes away the heat of the solid-state power amplifier chip and flows out from the outlet of the liquid cooling runner.
The invention has the beneficial effects that:
from the above technical solutions, it can be seen that the waveguide power distribution and synthesis network provided by the present invention is designed by using a three-piece cavity structure (a first assembly, a second assembly, and a third assembly), and has the following advantages:
1) the space utilization is high: the multi-path power distributor, the multi-path power combiner and the waveguide turning transition part structure are processed and formed on the same cavity with the liquid cooling runner inlet and outlet, the liquid cooling runner and the radiating fin, and the cavity space formed by the first assembly part, the second assembly part and the third assembly part is fully utilized in the three-dimensional direction;
2) no external separate heat sink is required: because the liquid cooling flow channel is integrated in the three-piece type cavity structure, the millimeter wave power amplifier is designed by using the invention, and a separate heat dissipation flow channel device is not required to be added outside;
3) reduce the assembly complexity: the three-piece cavity structure design reduces multiple physical interconnections among the multi-path power divider, the multi-path power combiner and the waveguide turning transition, and avoids the introduction of assembly errors;
4) and (3) expandable: by reasonably cutting or increasing the lengths of the power divider, the power synthesizer and the liquid cooling runner, the design method provided by the invention can expand the synthesis network in two ways, four ways, eight ways and sixteen ways, thereby meeting the power synthesis requirements of different scales.
Drawings
FIG. 1 is a prior art schematic block diagram;
FIG. 2 is a functional block diagram of the present invention;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is a three-piece exploded view of the structure shown in FIG. 3;
FIG. 5 is a front view of the second assembly;
FIG. 6 is a rear view of the second assembly;
FIG. 7 is a cross-sectional view of the second assembly;
in the figure, 1-input position, 2-liquid cooling runner inlet, 3-liquid cooling runner outlet, 4-first waveguide turning transition output waveguide, 5-second waveguide turning transition input waveguide, 6-output position, 7-first assembly, 8-second assembly, 9-third assembly, 10-radiating fin, 11-eight power distributor, 12-first waveguide turning transition section, 13-second waveguide turning transition section, 14-eight power combiner and 15-chip mounting position.
Detailed Description
The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following.
As shown in fig. 1, in the prior art, waveguide power distribution and synthesis need to rely on an external heat dissipation structure to affect the volume of the whole product or structure, so that, in order to achieve the effects of good heat dissipation effect and small volume of the finished product, a waveguide power distribution and synthesis structure integrating liquid cooling channels is designed, including a circuit part and a mechanical part;
as shown in fig. 2, the circuit part includes a power divider, a waveguide turning transition, a solid state power amplifier chip and a power combiner;
as shown in fig. 3-7, the mechanical part includes a first assembly 7, a second assembly 8 and a third assembly 9, the second assembly 8 is disposed between the first assembly 7 and the third assembly 9, wherein the second assembly 8 is provided with a liquid cooling flow channel, and a heat dissipation fin 10 is mounted in the liquid cooling flow channel; the first assembly member 7 is provided with a liquid cooling runner inlet 2 and a liquid cooling runner outlet 3 which are communicated with the liquid cooling runner; the third assembly part 9 is provided with a mounting groove for mounting the power divider and the combiner, and the side edge of the third assembly part 9 is provided with an input position 1 and an output position 6;
the solid-state power amplifier chip is arranged on a chip mounting position 15 of the first assembly part 7, a first waveguide turning transition hole and a second waveguide turning transition hole are arranged on two sides of the chip mounting position 15, the waveguide turning transition comprises a first waveguide turning transition section 12 and a second waveguide turning transition section 13, two ends of the first waveguide turning transition section 12 are respectively connected with a power divider and a first waveguide turning transition output waveguide 4, two ends of the second waveguide turning transition section 13 are respectively connected with a second waveguide turning transition input waveguide 5 and a power combiner, the first waveguide turning transition output waveguide 4 penetrates out of the first waveguide turning transition hole and then is connected with the solid-state power amplifier chip, and the second waveguide turning transition input waveguide 5 is connected with the solid-state power amplifier chip and penetrates into the second waveguide turning transition hole to be connected with the second waveguide turning transition section 13. The first waveguide turning transition section 12 and the second waveguide turning transition section 13 turn the waveguides from parallel to perpendicular, so as to avoid interference with the liquid cooling flow channel. In one embodiment, the physical dimensions of the second assembly 8, the liquid cooling channels and the heat dissipating fins 10 may be adjusted to meet the circuit characteristics and heat dissipation characteristics, depending on the heat dissipation requirements and the power combining scale requirements. The terms "first" and "second" are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In a preferred embodiment, the liquid cooling flow passage is formed in a U shape, two end portions of the liquid cooling flow passage correspond to the liquid cooling flow passage inlet 2 and the liquid cooling flow passage outlet 3, respectively, and the liquid cooling flow passage inlet 2 and the liquid cooling flow passage outlet 3 are disposed at one side of the first assembly 7. The arrangement can ensure that the outlet and the inlet are arranged on one side of the product, and is convenient to operate and shrink in volume.
In a preferred embodiment, the chip mounting site 15 is arranged in the middle of the first assembly 7, which on the one hand facilitates handling and on the other hand makes full use of space.
In a preferred embodiment, a mounting plate is arranged in the middle of the first assembly 7, a chip mounting position 15 is arranged on the mounting plate, the mounting plate and the first assembly 7 are fixed through screws, and the mounting plate is arranged for replacement and maintenance. And modular assembly is adopted, so that the product standard can be executed, and the product quality can be ensured.
In a preferred embodiment, after the solid-state power amplifier chip is mounted on the mounting plate, the top surface of the solid-state power amplifier chip does not exceed the top surface of the first assembly member 7, and the solid-state power amplifier chip and the transition waveguide are protected by being arranged relative to the solid-state power amplifier chip which is too high.
In a preferred embodiment, a macro-groove is provided on the first assembly 7, the bottom plate of the macro-groove serves as the top plate of the fluid channel, and the mounting plate is disposed in the macro-groove. This structure is mainly for the convenience of heat dissipation, through the thickness of attenuate first subassembly 7, especially flow channel roof thickness, plays the radiating effect of reinforcing. The design principle of the giant groove is as follows: (1) ensuring the structural strength of the entire first assembly 7; (2) and reserving positions of a liquid cooling flow passage inlet 2 and a liquid cooling flow passage outlet 3. Based on the two principles, the area of the giant groove is enlarged as much as possible.
In a preferred embodiment, the inlet 2 and the outlet 3 are provided as kidney-shaped holes, which facilitate the opening of the holes, and in addition, the kidney-shaped holes facilitate the installation and injection of the cooling liquid.
In a preferred embodiment, the first assembly member 7 and the second assembly member 8 are welded to form a whole, a plurality of rectangular waveguide holes (the first waveguide turning transition hole and the second waveguide turning transition hole) penetrating through the whole of the first assembly member 7 and the second assembly member 8 are machined, and the liquid cooling flow channel forms a closed channel which enters and exits after welding; the third assembly 9 is assembled with said second assembly 8 by means of screws. And one surface of the third assembly 9 is machined with a mounting groove to be used as a mounting position of the multi-path power divider and the multi-path power combiner. Preferably, a groove matched with the mounting groove is also arranged at the bottom of the second assembly part 8, so that the space can be saved as much as possible, and the alignment assembly is convenient.
In a preferred embodiment, the first, second and third assemblies 7, 8, 9 are connected by screws which are passed through the third and second assemblies 9, 8 in that order and finally fixed to the first assembly 7, the heads of the screws finally being fixed in recesses provided in the third assembly 9.
In a preferred embodiment, the power divider branch is configured as an input waveguide and two, four, eight or sixteen output waveguides, the input waveguide branch of the power combiner is consistent with the output waveguide branch of the power divider, and the power combiner is configured as an output waveguide;
and each path of output waveguide of the power divider or each path of input waveguide of the power combiner is correspondingly provided with a first waveguide turning transition section 12, a first waveguide turning transition output waveguide 4, a second waveguide turning transition section 13, a second waveguide turning transition input waveguide 5 and a solid power amplifier chip.
A waveguide power distribution and synthesis method of an integrated liquid cooling channel is characterized in that a signal enters from an input position 1, passes through a power distributor and is output from a first waveguide turning transition section 12 to a transition output waveguide 4, and a chip mounting position between the first waveguide turning transition output waveguide 4 and a second waveguide turning transition input waveguide 5 is used for mounting a solid-state power amplifier chip; the signal enters the second waveguide turning transition input waveguide 5 after being amplified by the solid-state power amplifier chip, and is output from an output position after passing through the second waveguide turning transition section 13 and the power combiner;
external cooling liquid flows in from the liquid cooling runner inlet 2, takes away the heat of the solid-state power amplifier chip, and flows out from the liquid cooling runner outlet 3.
As shown in fig. 2-7, an eight-way power divider 11 and an eight-way power combiner 14 are provided, signals enter from an input position 1, and are output from eight first waveguide turning transition output waveguides 4 after eight-way power distribution, and eight chip mounting positions between the first waveguide turning transition output waveguide 4 and the second waveguide turning transition input waveguide 5 can be used for mounting a solid state power amplifier chip. The eight paths of signals enter the second waveguide after being amplified by the solid-state power amplifier chip to turn to the transition input waveguide 5, and are output from the output position 6 after being synthesized by the eight paths of power. External cooling liquid flows in from the liquid cooling runner inlet 2, takes away the heat of the solid-state power amplifier chip, and flows out from the liquid cooling runner outlet 3.
In a preferred embodiment, the number of the mounting plates is the same as the number of the power divider branches or the number of the power combiner branches, and each mounting plate is fixed on the first assembly 7 by screws; and a first waveguide turning transition hole and a second waveguide turning transition hole are arranged on each mounting plate.
In summary, the waveguide power distribution and synthesis structure and method of the integrated liquid cooling channel of the invention integrates the liquid cooling channel and the eight power distribution and synthesis devices on two sides of the same cavity or the same assembly, and reasonably arranges to avoid interference, and adopts a three-piece cavity structure to reasonably assemble, so as to obtain the closed liquid cooling channel and the complete eight power distribution and synthesis devices. Meanwhile, by using the design method, the number of synthetic paths is easy to expand, and the processing method is not changed.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, it should be noted that any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a waveguide power distribution and synthesis structure of integrated liquid cooling runner which characterized in that: comprises a circuit part and a mechanical part;
the circuit part comprises a power divider, a waveguide turning transition, a solid-state power amplifier chip and a power synthesizer;
the mechanical part comprises a first assembly part, a second assembly part and a third assembly part, wherein the second assembly part is arranged between the first assembly part and the third assembly part, a liquid cooling runner is arranged on the second assembly part, and a radiating fin is arranged in the liquid cooling runner; the first assembly part is provided with a liquid cooling runner inlet and a liquid cooling runner outlet which are communicated with the liquid cooling runner; the third assembly part is provided with a mounting groove for mounting the power divider and the synthesizer, and the side edge of the third assembly part is provided with a signal input position and a signal output position;
the solid-state power amplifier chip is arranged on a chip mounting position of the first assembly part, a first waveguide steering transition hole and a second waveguide steering transition hole are arranged on two sides of the chip mounting position, the waveguide steering transition comprises a first waveguide steering transition section and a second waveguide steering transition section, two ends of the first waveguide steering transition section are respectively connected with the power divider and the first waveguide steering transition output waveguide, two ends of the second waveguide steering transition section are respectively connected with the second waveguide steering transition input waveguide and the power combiner, the first waveguide steering transition output waveguide penetrates out of the first waveguide steering transition hole and then is connected with the solid-state power amplifier chip, and the second waveguide steering transition input waveguide is connected with the solid-state power amplifier chip and penetrates into the second waveguide steering transition hole to be connected with the second waveguide steering transition section.
2. The integrated liquid cooled runner waveguide power distribution and combining structure of claim 1, further comprising: the liquid cooling runner is U-shaped, two ends of the liquid cooling runner respectively correspond to the liquid cooling runner inlet and the liquid cooling runner outlet, and the liquid cooling runner inlet and the liquid cooling runner outlet are arranged on one side of the first assembly.
3. The integrated liquid cooled runner waveguide power distribution and combining structure of claim 1, further comprising: the chip mounting position is arranged in the middle of the first assembly.
4. The integrated liquid cooled runner waveguide power splitting and combining structure of claim 3, further comprising: the middle part of the first assembly part is provided with a mounting plate, a chip mounting position is arranged on the mounting plate, and the mounting plate and the first assembly part are fixed through screws.
5. The integrated liquid cooled runner waveguide power splitting and combining structure of claim 4, wherein: after the solid-state power amplifier chip is installed on the installation plate, the top surface of the solid-state power amplifier chip does not exceed the top surface of the first assembly part.
6. The integrated liquid cooled runner waveguide power splitting and combining structure of claim 4, wherein: the first assembly component is provided with a giant groove, the bottom plate of the giant groove is used as the top plate of the liquid flow channel, and the mounting plate is arranged in the giant groove.
7. The integrated liquid-cooled runner waveguide power splitting and combining structure as claimed in any one of claims 1 to 6, wherein: the inlet and the outlet of the liquid cooling flow passage are both arranged to be waist-shaped holes.
8. The integrated liquid-cooled runner waveguide power splitting and combining structure as claimed in any one of claims 1 to 6, wherein: welding the first assembly and the second assembly to form a whole, and machining a plurality of rectangular waveguide holes penetrating through the whole of the first assembly and the second assembly; the third assembly and the second assembly are assembled together by screws.
9. The integrated liquid-cooled runner waveguide power splitting and combining structure as claimed in any one of claims 1 to 6, wherein: the power divider branch is set into one input waveguide and two, four, eight or sixteen output waveguides, the input waveguide branch of the power synthesizer is consistent with the output waveguide branch of the power divider, and the power synthesizer is set into one output waveguide;
and each path of output waveguide of the power divider or each path of input waveguide of the power combiner is correspondingly provided with a first waveguide turning transition section, a first waveguide turning transition output waveguide, a second waveguide turning transition section, a second waveguide turning transition input waveguide and a solid power amplifier chip.
10. A method for waveguide power distribution and synthesis based on the integrated liquid cooling flow channel of claim 1, characterized by: a signal enters from an input position, passes through a power divider, and is output from a first waveguide steering transition section to a transition output waveguide through a first waveguide steering transition section, and a chip mounting position between the first waveguide steering transition output waveguide and a second waveguide steering transition input waveguide is used for mounting a solid-state power amplifier chip; the signal enters a second waveguide turning transition input waveguide after being amplified by the solid-state power amplifier chip, and is output from an output position after passing through a second waveguide turning transition section and the power combiner;
external cooling liquid flows in from the inlet of the liquid cooling runner, takes away the heat of the solid-state power amplifier chip and flows out from the outlet of the liquid cooling runner.
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| CN104134842A (en) * | 2014-07-16 | 2014-11-05 | 中国电子科技集团公司第四十一研究所 | Millimeter-wave multi-channel space waveguide power distribution synthesizer and method |
| JP2015023464A (en) * | 2013-07-19 | 2015-02-02 | 株式会社フジクラ | Power distributor/combiner |
| CN107248607A (en) * | 2017-06-27 | 2017-10-13 | 成都旭思特科技有限公司 | Microwave power distributor with moistureproof and waterproof function |
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| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| US9113549B2 (en) * | 2011-12-01 | 2015-08-18 | Triquint Semiconductor, Inc. | Enclosure for a multi-channel modulator driver |
| CN107230815B (en) * | 2017-05-27 | 2020-07-07 | 电子科技大学 | Design method of broadband high-average-power dielectric microwave window with cooling layer |
| CN107611545B (en) * | 2017-08-24 | 2020-08-28 | 中国电子科技集团公司第四十一研究所 | Roundabout type broadband efficient multi-path space power synthesis network |
| CN108879052A (en) * | 2018-07-03 | 2018-11-23 | 安徽帮创智能科技有限公司 | A kind of liquid waveguide adjustable attenuator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015023464A (en) * | 2013-07-19 | 2015-02-02 | 株式会社フジクラ | Power distributor/combiner |
| CN104134842A (en) * | 2014-07-16 | 2014-11-05 | 中国电子科技集团公司第四十一研究所 | Millimeter-wave multi-channel space waveguide power distribution synthesizer and method |
| CN107248607A (en) * | 2017-06-27 | 2017-10-13 | 成都旭思特科技有限公司 | Microwave power distributor with moistureproof and waterproof function |
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