CN110473838A - A kind of diode-base and vehicle rectifier diode - Google Patents
A kind of diode-base and vehicle rectifier diode Download PDFInfo
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- CN110473838A CN110473838A CN201910859814.3A CN201910859814A CN110473838A CN 110473838 A CN110473838 A CN 110473838A CN 201910859814 A CN201910859814 A CN 201910859814A CN 110473838 A CN110473838 A CN 110473838A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Rectifiers (AREA)
Abstract
The invention discloses a kind of diode-base and vehicle rectifier diodes.This kind of diode-base, including middle part pedestal, external body, middle part pedestal are used for chip, and middle part pedestal is set to inside outer cover body;This kind of vehicle rectifier diode, including above-mentioned diode-base, chip, lead, chip are set to chip mounting portion, and chip is connected with lead.By the way that diode-base is divided into two parts, two-part material can be selected, suitable material be selected, to optimize from cost and aspect of performance to pedestal;Using the diode of this kind of diode-base when by external force, elder generation is by external body stress and generates deformation, and the pressure for passing to middle part pedestal is reduced by deformation, to reduce the external force that chip receives, reduces the risk of chip stress damage.
Description
Technical field
The present invention relates to diode field, in particular to the pedestal and this kind of diode of a kind of vehicle rectifier diode.
Background technique
Most of chemical energy of fuel oil is converted mechanical energy by vehicular engine, and alternator for vehicle will be part of mechanical
Electric energy can be converted into and be supplied to vehicle electrical system, and since alternating current generator is simple with structure relative to dc generator
Single, small in size, at low cost feature, therefore automobile is all to use alternator generation at present, and the friendship that alternating current generator generates
Galvanic electricity must can just be supplied to electric frequency and other vehicle mounted electrical apparatus by rectification circuit, and rectifier diode is this kind of rectification circuit weight
One of component parts wanted.
Data of China library discloses the patent of an entitled rectifier diode for automobile tube socket, application No. is
CN201520493350.6, applying date 2015-07-09, Publication No. CN204885129U, authorized announcement date 2015-12-
16.This kind of rectifier diode tube socket includes firm banking, base stage, outer jointing jacket, chip protective case, and base stage is located at fixed bottom
Seat bottom surface, base stage bottom surface are equipped with annular convex platform, and firm banking peripheral surface is equipped with axial dentation decorative pattern, outer jointing jacket and chip
Inner room is protected to form reject chute, tube socket material is copper alloy C102, and firm banking upper surface the center point is equipped with a circular groove, core
Piece protective case is located on firm banking surface, and be located at circular groove periphery at, chip protective case cross section be it is upper it is narrow under
Wide is trapezoidal, and outer jointing jacket is set at firm banking excircle, and outer jointing jacket outer surface bottom and firm banking surface are inclination
Ruggedized construction;Disadvantage is that: tube socket is integrally made of copper alloy, at high cost;Integrally-built tube socket, in assembly
The chip that biggish pressure still can be passed to tube socket upper end is easy that chip is made to generate damage.
Summary of the invention
The object of the present invention is to provide a kind of diode-bases using separate structure formula, to reduce production cost.This hair
Another bright purpose is to provide a kind of vehicle rectifier diode using this kind of diode-base, this kind of diode has good
Mechanical property, when can effectively reduce assembly, chip is subject in diode pressure.
In order to realize one object of the present invention, the present invention provides a kind of diode-bases:
A kind of diode-base, including middle part pedestal, external body, the middle part pedestal are used for chip, it is described in
Portion's pedestal is set to inside the outer cover body.
Compared with prior art, the beneficial effect of this kind of diode-base is: by the way that diode-base is divided into two
Point, two-part material can be selected, so as to reduce cost, and when external body stress, external body
Biggish deformation itself occurs, and lesser power is passed into middle part pedestal.
Based on the above technical solution, the present invention can also be improved as follows:
Further: the middle part pedestal includes chip mounting portion, positioning region, and it is described fixed that the chip mounting portion is set to
Position portion one end, the external body offer location hole along axis, and the location hole is through-hole, and the positioning region is installed on described
Location hole.This step the utility model has the advantages that by chip mounting portion chip, middle part pedestal is connect by positioning region with outside body,
Reasonably optimize the structure of middle part pedestal.
Further: described external body one end offers the first groove, and the other end offers the second groove, the positioning
Hole is located in the first groove and the second groove.This step the utility model has the advantages that the first groove for filling plastic packaging material so that plastic packaging material with
External body connection is closer, and the second groove is for avoiding middle part pedestal from being stressed directly, and when pedestal is pressurized, power is directly applied to
Lesser pressure so that external body absorbs overwhelming majority deformation, and is passed to middle part pedestal by external body.
Further: positioning region periphery one end is provided with the first convex edge, and the other end is provided with the second convex edge, and described
One convex edge is located in first groove, and the end face of first convex edge side is bonded with the slot bottom of first groove, described
The slot bottom of second groove offers third groove, and second convex edge is set in third groove, third convex edge side
End face is bonded with the slot bottom of the third groove.This step the utility model has the advantages that by the first convex edge and the second convex edge further will in
Portion's pedestal is connected to external body, improves the stability that middle part pedestal is connect with external body.
Further: the positioning region is truncated cone-shaped, and the location hole matches with the positioning region shape.This step has
Beneficial effect: by the cooperation of positioning region and the location hole conical surface, the contact surface improved between them is connect, and improves grafting peace
The stability of dress.
Further: the chip mounting portion and first convex edge are located at the same end of the positioning region, and described first
The projection of convex edge towards chip installation end surface is fallen completely in the range of chip installation end surface;The outer cover is external
Surface is provided with multiple tracks detent projection.This step the utility model has the advantages that chip mounting portion and the first convex edge are set to the same end, can be with
The use of plastic packaging material is reduced, the projection of the first convex edge towards chip installation end surface falls completely within chip installation end surface
In range, so that, in plastic packaging, plastic packaging material is to first at the structure type of arrangement straggly between the first convex edge and chip mounting portion
Convex edge and chip mounting portion have better holding power.
Further: middle part pedestal, external body material be different conductive materials.This step the utility model has the advantages that different
Conductive material so that middle part pedestal and external body can be with design requirement reasonably select materials, to reduce cost, improving should
The mechanical property of kind diode-base.
Further: the material of the external body is aluminium, and the material of middle part pedestal is copper.This step the utility model has the advantages that aluminium
It is at low cost, but there is good conductive, heating conduction, so that material of the Practical Aluminium as external body, can reduce this kind
The cost of diode-base, and the plasticity of aluminium tool is strong, and biggish pressure can be taken away in stress to generate deformation, and incite somebody to action
Lesser pressure passes to the middle part pedestal of middle inside.
In order to realize another object of the present invention, the present invention provides a kind of vehicle rectifier diodes:
A kind of vehicle rectifier diode, including the diode-base, it further includes chip, lead, the chip setting
In the chip mounting portion, the chip is connected with the lead.
Compared with prior art, the beneficial effect of this kind of vehicle rectifier diode is: chip is installed on chip installation
Portion is reduced in passing to so that this kind of diode, when by external force, elder generation is by external body stress and generates deformation by deformation
The pressure of portion's pedestal reduces the risk of chip stress damage so that the external force that middle part pedestal passes to chip is small, and due to
Diode-base is at low cost, so that the cost of this kind of vehicle rectifier diode reduces.
Further: it further includes plastic packaging shell, the plastic packaging shell by first groove body, the first convex edge, chip mounting portion,
Chip is wrapped in inside it.Step the utility model has the advantages that plastic packaging shell anti-gray, insulation, so that chip has been obtained further protection.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described.In all the appended drawings, similar element
Or part is generally identified by similar appended drawing reference.In attached drawing, each element or part might not be drawn according to actual ratio.
Fig. 1 is the structural schematic diagram of diode-base;
Fig. 2 be Fig. 1 in along the sectional view of A-A;
Fig. 3 is the three dimensional structure diagram of diode-base;
Fig. 4 is the structural schematic diagram of vehicle rectifier diode;
Fig. 5 is the cross-sectional view in Fig. 4 along B-B;
Fig. 6 is the three dimensional structure diagram of vehicle rectifier diode;
Fig. 7 is temperature (DEG C)-voltage (V) characteristic curve of diode T1 in experimental group one;
Fig. 8 is time (min)-temperature (DEG C) characteristic curve of diode T1 in experimental group one;
Fig. 9 is temperature (DEG C)-voltage (V) characteristic curve of diode T2 in experimental group two;
Figure 10 is time (min)-temperature (DEG C) characteristic curve of diode T2 in experimental group two.
Wherein, 1 middle part pedestal, half column on 101,102 lower half columns, 103 protrusions, 104 first grooves, 105 second is recessed
Slot, 106 third grooves, 107 location holes, 2 outside bodies, 201 chip mounting portions, 202 positioning regions, 203 first convex edges, 204
Two convex edges, 3 chips, 4 leads, 5 plastic packaging shells.
Specific embodiment
It is described in detail below in conjunction with embodiment of the attached drawing to technical solution of the present invention.Following embodiment is only used for
Clearly illustrate technical solution of the present invention, therefore be only used as example, and cannot be used as a limitation and limit protection model of the invention
It encloses.
It should be noted that unless otherwise indicated, technical term or scientific term used in this application should be this hair
The ordinary meaning that bright one of ordinary skill in the art are understood.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply relatively important
Property or implicitly indicate the quantity of indicated technical characteristic.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In this application unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In this application unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Specific embodiment
As shown in Figure 1-3, a kind of diode-base, including middle part pedestal 1, external body 2, middle part pedestal 1 is for installing
Chip 3, middle part pedestal 1 are set to inside external body 2.
As shown in Fig. 2, external body 2 wraps half column 101 and lower half column 102, upper half column 101 and lower half column
102 all cylindrical and upper half columns 101 are located at lower 102 upper end of half column, and upper half column 101 is coaxially set with lower half column 102
It sets, the diameter of upper half column 101 is less than the diameter of lower half column 102, and lower 102 periphery of half column is evenly equipped with the protrusion of multiple tracks dentation
103, it is parallel to each other between protrusion 103 and axis that protrusion 103 is parallel to external body 2, external 2 upper surface of body offers the
One groove 104, the first groove 104 can be located in upper half column 101, or extend in lower half column 102, the first groove 104
Effect be to fill plastic packaging material wherein, external 2 lower end of body offers the second groove 105, the slot bottom of the second groove 105
Third groove 106 is offered, the first groove 104, the second groove 105, third groove 106 all for cylinder and are coaxially set,
Location hole 107 is also provided between first groove 104 and third groove 106, location hole 107 is through-hole, and location hole 107 is externally
The axis of body 2 is arranged and is used to install middle part pedestal 1.
As shown in Fig. 2, middle part pedestal 1 includes chip mounting portion 201, positioning region 202, chip mounting portion 201 is cylindrical,
Chip mounting portion 201 is set to 202 upper end of positioning region, and positioning region 202 is in truncated cone-shaped and is head-up arranged greatly, outside positioning region 202
What shape and location hole 107 matched, and be plugged in location hole 107 in the middle part of positioning region 202,202 periphery of positioning region and location hole
107 peripheries fit closely, and 202 shape of positioning region is also possible to cylindrical or polygon at this, when positioning region 202 is cylindrical
Or when polygon, location hole 107 is also matched shape, and positioning column middle part and the connection relationship of location hole 107 are
Plug connection, and positioning column periphery and the hole wall of location hole 107 fit closely, at this positioning region 202 using truncated cone-shaped be because
It is bonded to each other by inclined-plane, on the one hand can guarantee that positioning region 202 is plugged in the stability of location hole 107, it on the other hand can be with
Increase contact area, to improve the electric conductivity and thermal conductivity between external body 2 and middle part pedestal 1;Outside 202 upper end of positioning region
It is provided with the first convex edge 203 of annular, 203 upper end of the first convex edge and 201 Liancheng of chip mounting portion one, the first convex edge 203 week
Periphery is circle, and 203 outer peripheral diameter of the first convex edge is less than 201 diameter of chip mounting portion, and the first convex edge 203 is located at the first groove
In 104 and its lower end surface is fitted closely with 104 slot bottom of the first groove, and 202 lower end periphery of positioning region is provided with the second convex edge 204,
Second convex edge 204 is located in third groove 106 and end face is fitted closely with 106 slot bottom of third groove thereon.
The material of middle part pedestal 1 and external body 2 will using electric conductivity and the excellent material of heating conduction, as copper,
Aluminium, silver etc., in the present embodiment, pedestal 1 material in middle part is copper, and external 2 material of body is aluminium.
As seen in figures 3-6, a kind of vehicle rectifier diode, including above-mentioned diode-base, it further includes chip 3, lead
4, chip 3 is welded in 201 upper end of chip mounting portion by scolding tin, and lead 4 is welded in chip 3, this kind of diode upper end is also set up
There is plastic packaging shell 5,5 lower end of plastic packaging shell is set in the first groove 104, and by the first convex edge 203, chip mounting portion 201, chip 3,
4 lower end of lead is wrapped in wherein, and plastic packaging shell 5 improves the service life of this kind of diode.
In use due to this kind of diode, heat dissipation performance is affected to its job stability, therefore needs to it
Junction temperature is accordingly tested, and experiment is using the diode T1 made by the pedestal of pure red copper one compression moulding as experimental group
One, the diode T2 that the pedestal that the middle part pedestal in the present invention is copper, external body is aluminium is made is as experimental group two, two poles
Pipe T1 is identical as the monnolithic case of diode T2, and experimental procedure is as follows:
Add step 1: first the diode T1 in experimental group one and the diode T2 in experimental group two are respectively put into experiment and are used
In hot tank, and to diode T1 and diode T2 by IM=50mA electric current, by the raising of environment temperature so that diode T1
And diode T2 heating, and diode T1 and diode T2 temperature T (DEG C) and corresponding voltage VFa (V) during this is recorded, it obtains
To temperature (DEG C)-voltage (V) characteristic curve, wherein temperature (DEG C)-voltage (V) characteristic curve of diode T1 as shown in fig. 7,
It is corresponding to calculate diode T1 and diode T2 for temperature (DEG C)-voltage (V) characteristic curve as shown in the figure 9 of diode T2
Average K value, wherein the calculation of corresponding K value is as follows between any two temperatures, K=△ VFa/ △ T, △ T be two not
The difference of equality of temperature angle value, △ VFa are the difference of the corresponding voltage of △ T, first calculate temperature from 80 DEG C -90 DEG C of a K value, then count
Every K value for increasing 10 DEG C is calculated, then all K value averagings are obtained into average K value;
Step 2: the diode T1 in experimental group one and the diode T2 in experimental group two are put into room temperature environment and cold
But to room temperature, electric current of the diode T1 and diode T2 by IT=4.0A is then given, so that diode T1 and diode T2 liter
Temperature simultaneously keeps stable, which continues 20min, and persistently record following numerical value in the process: 2. 1. experimental situation temperature TA is moulded
The environment temperature Ta of five centimeters of distances of casing surroundings is sealed, 3. case temperature TC, 4. the temperature TL of lead and shell intersection lead,
5. junction temperature Tj obtains time (min)-temperature (DEG C) characteristic curve of each numerical value, wherein time (the min)-temperature of diode T1
(DEG C) characteristic curve is spent as shown in figure 8, time (min)-temperature (DEG C) characteristic curve of diode T2 is as shown in Figure 10, wherein tying
Warm Tj be calculated value, calculation is as follows, experiment from Time be 0min-20min during, given in a pulsed fashion every one second
Diode T1 and diode T2 pass to the electric current of ITm=50mA, and obtain corresponding transient voltage value VFb of each second, junction temperature Tj
Calculation formula is Tj=△ VFb/K, and wherein △ VFb is the difference of adjacent two seconds VFb, and K is average K obtained in the first step
Value, obtains the corresponding Tj curve of diode T1 and diode T2 according to the calculation formula, which has computer completion, and
Corresponding coordinate diagram is generated by computer.
By Fig. 8 and Figure 10 it is found that the junction temperature of diode T1 is stablized at 147 DEG C or so, the junction temperature of diode T2 is stablized 149
DEG C or so, and the design of general vehicle rectifier diode uses temperature at 150 DEG C, therefore diode T2 can satisfy requirement.
It is reduced using the external body 2 of middle part pedestal 1 and aluminum made of copper relative to whole diode-base made of copper
Production cost, and the separate form of middle part pedestal 1 and external body 2, so that two poles as made from this kind of diode-base
For pipe in assembly and use process, external body 2 can reduce the pressure for being transferred to middle part pedestal 1 by self-deformation, from
And the external force that chip 3 is subject to is reduced, a possibility that chip 3 damages is reduced, this kind vehicle rectifier diode is improved
Service life.
In specification of the invention, numerous specific details are set forth.It is to be appreciated, however, that the embodiment of the present invention can be with
It practices without these specific details.In some instances, well known method, structure and skill is not been shown in detail
Art, so as not to obscure the understanding of this specification.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme should all cover within the scope of the claims and the description of the invention.
Claims (10)
1. a kind of diode-base, it is characterised in that: including middle part pedestal, external body, the middle part pedestal is for installing core
Piece, the middle part pedestal are set to inside the outer cover body.
2. diode-base according to claim 1, it is characterised in that: the middle part pedestal includes chip mounting portion, determines
Position portion, the chip mounting portion are set to described positioning region one end, and the external body offers location hole along axis, described fixed
Position hole is through-hole, and the positioning region is installed on the location hole.
3. diode-base according to claim 2, it is characterised in that: it is recessed that described external body one end offers first
Slot, the other end offer the second groove, and the location hole is located in the first groove and the second groove.
4. diode-base according to claim 3, it is characterised in that: it is convex that positioning region periphery one end is provided with first
Edge, the other end are provided with the second convex edge, and first convex edge is located in first groove, the end face of first convex edge side
It is bonded with the slot bottom of first groove, the slot bottom of second groove offers third groove, and second convex edge is set to
In third groove, the end face of third convex edge side is bonded with the slot bottom of the third groove.
5. diode-base according to claim 4, it is characterised in that: the positioning region is truncated cone-shaped, the location hole
Match with the positioning region shape.
6. diode-base according to claim 5, it is characterised in that: the chip mounting portion and first convex edge position
In the same end of the positioning region, the projection of first convex edge towards chip installation end surface falls completely within chip installation
In the range of end surface;The outer cover external surface is provided with multiple tracks detent projection.
7. -6 any diode-base according to claim 1, it is characterised in that: the material of middle part pedestal, external body
For different conductive materials.
8. diode-base according to claim 7, it is characterised in that: the material of the external body is aluminium, middle part seat
The material of body is copper.
9. a kind of vehicle rectifier diode, it is characterised in that: diode-base a method as claimed in any one of claims 1-8 is used, it
It further include chip, lead, the chip is set to the chip mounting portion, and the chip is connected with the lead.
10. vehicle rectifier diode according to claim 9, it is characterised in that: it further includes plastic packaging shell, the plastic packaging shell
First groove body, the first convex edge, chip mounting portion, chip are wrapped in inside it.
Priority Applications (1)
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CN201910859814.3A CN110473838A (en) | 2019-09-11 | 2019-09-11 | A kind of diode-base and vehicle rectifier diode |
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CN201910859814.3A CN110473838A (en) | 2019-09-11 | 2019-09-11 | A kind of diode-base and vehicle rectifier diode |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022041519A1 (en) * | 2020-08-28 | 2022-03-03 | 江苏英达富电子科技有限公司 | Vehicular rectifier diode base and vehicular rectifier diode |
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2019
- 2019-09-11 CN CN201910859814.3A patent/CN110473838A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022041519A1 (en) * | 2020-08-28 | 2022-03-03 | 江苏英达富电子科技有限公司 | Vehicular rectifier diode base and vehicular rectifier diode |
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Application publication date: 20191119 |
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