CN110471221A - 一种均匀混光的高色域直下式背光模组 - Google Patents
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Abstract
本发明公开了一种均匀混光的高色域直下式背光模组,包括金属背板、PCB板组、LED灯珠、透镜、反射片、扩散板、膜片和液晶面板,所述金属背板上固定有PCB板组,且所述PCB板组分别设置有PCB板一和PCB板二,所述反射片设置在金属背板上表面。本发明的有益效果是:采用蓝、绿双芯片搭配红色荧光粉结构上要比R、G、B三色LED简单,工艺上较容易实现。本发明采用对称焊盘将蓝色芯片、绿色芯片固定在其中,一部分蓝光激发红色荧光粉,之后通过芯片发出的蓝光、绿光以及激发荧光粉产生的红光复合得到高色域LED直下式背光源,采用对称焊盘的支架制成的LED灯珠用于直下式背光模组中可以达到均匀混光的效果,同时又可以增加散热,提高LED灯珠的可靠性。
Description
技术领域
本发明涉及一种背光模组,具体为一种均匀混光的高色域直下式背光模组,属于背光模组应用技术领域。
背景技术
LED作为一种新兴固体照明光源,具有体积小、寿命长、可靠性好、节能环保等特点,已在照明和显示领域广泛应用。但随着LED背光技术的迅猛发展,消费者对LED电视高色域等方面的需求日渐增强,要求其颜色更加丰富,层次感更好,色彩还原度更高。目前主流的方法是采用蓝色芯片激发红色和绿色荧光粉,色域最高仅能达到90%-95%。此外还可以采用蓝色芯片、绿色芯片搭配红色荧光粉以及红、绿、蓝三种LED芯片直接混光的方式来进一步提升NTSC的色域值。
现阶段,背光模组可分为侧入式和直下式两种,由于直下式背光源,具有宽视角、光利用效率高、结构简易化等优点,同时相比侧入式背光源,不仅成本低(无需导光板)、可区域调光,降低LED的亮暗度,降低功耗,还可通过区域控制功能,提升画面的动态对比度,此外因其物美价廉的优势,深受广大消费者欢迎。相对侧入式背光模组来说,直下式背光模组中的LED灯条需要在其LED发光芯片外部加装光学透镜,以使LED发光芯片发出的光线能够混合均匀。
现有的直下式背光模组在使用时仍然存在着许多不足之处,在常规的直下式背光模组方案中将蓝色芯片、绿色芯片搭配红色荧光粉的高色域LED灯珠无论是搭配反射式透镜还是折射式透镜均无法达到均匀混光的效果,致使画面呈现红、蓝相间的条纹。
发明内容
本发明的目的就在于为了解决在常规的直下式背光模组方案中将蓝色芯片、绿色芯片搭配红色荧光粉的高色域LED灯珠无论是搭配反射式透镜还是折射式透镜均无法达到均匀混光的效果,致使画面呈现红、蓝相间的条纹的问题,而提出一种均匀混光的高色域直下式背光模组。
本发明的目的可以通过以下技术方案实现:一种均匀混光的高色域直下式背光模组,包括金属背板、PCB板组、LED灯珠、透镜、反射片、扩散板、膜片和液晶面板,所述金属背板上固定有PCB板组,且所述PCB板组上设置有若干个PCB板一和PCB板二,所述PCB板一和PCB板二上均等间距设置有若干个LED灯珠,所述反射片设置在金属背板上表面,且所述反射片上设置有与LED灯珠位置相对应的孔洞,所述LED灯珠位于反射片的孔洞中心,且所述LED灯珠上固定有透镜,且所述金属背板边缘上方依次放置有扩散板、膜片和液晶面板;
其中,所述LED灯珠上设置有支架,所述支架中部设置有白条,且所述支架两侧均设置有对称焊盘,两个对称焊盘中分别固定设置有蓝光晶片和绿光晶片;
其中,所述所述支架上点涂有红色荧光粉。
本发明的进一步技术改进在于:所述PCB板一上的LED灯珠与PCB板二上的LED灯珠两侧设置的蓝色芯片和绿色芯片的位置相反。
本发明的进一步技术改进在于:所述支架材质为SMC材质,且LED灯珠两侧的对称焊盘呈对称设置。
本发明的进一步技术改进在于:所述透镜是反射式透镜,透镜材质为硅胶透镜、PMMA透镜、PC透镜和玻璃透镜。
本发明的进一步技术改进在于:所述PCB板组2的数量为2-20条,且PCB板组的数量为偶数,相邻的两个PCB板组之间的间距为60-120mm。
本发明的进一步技术改进在于:相邻两个LED灯珠之间的间距为60-95mm。
本发明的进一步技术改进在于:所述透镜4的直径为10-13mm,且透镜的高度为5-10mm。
本发明的进一步技术改进在于:所述蓝色芯片的激发波长为440nm-470nm,所述绿色芯片的激发波长为500nm-545nm,所述红色荧光粉的激发波长为620nm-650nm,且红色荧光粉的材料为氮化物荧光粉、氟化物荧光粉、KSF荧光粉或硅酸盐荧光粉。
本发明的进一步技术改进在于:所述PCB板一和PCB板二的制作方法具体包括以下步骤:
步骤一:蓝色芯片和绿色芯片分别排布在LED灯珠两侧的对称焊盘里,固晶焊线;
步骤二:红色荧光粉与封装胶混合点涂在支架里,烘烤固化;
步骤三:固化好的LED灯珠贴在直下式的PCB板组上,过回流焊后即可得到蓝色芯片、绿色芯片搭配红色荧光粉的PCB板一和PCB板二。
本发明的进一步技术改进在于:该背光模组的工作方法具体包括以下步骤:
S1:采用对称焊盘将蓝色芯片、绿色芯片固定在其中,蓝色芯片与绿色芯片处于对称位置,将蓝光芯片、绿光芯片排布在对称焊盘的支架里并贴于PCB板组上形成PCB板一,再将蓝光芯片和绿光芯片调换位置贴于PCB板组上形成PCB板二,之后将PCB板一和PCB板二相对排布于金属背板上形成直下式背光模组,蓝色芯片和绿色芯片激发的蓝光和红光激发红色荧光粉;
S2:之后通过蓝色芯片、绿色芯片发出的蓝光、绿光以及激发红色荧光粉产生的红光复合得到高色域LED直下式背光源,若干个LED灯珠在PCB板一和PCB板二上等间距分布,PCB板一和PCB板二左右两侧、上下两边以及PCB板一与PCB板二之间均可以进行混光。
与现有技术相比,本发明的有益效果是:
1、采用蓝色芯片、绿色芯片搭配红色荧光粉复合得到的LED直下式背光源,色域高达100%-120%。
2、采用蓝、绿双芯片搭配红色荧光粉结构上要比R、G、B三色LED简单,工艺上较容易实现。
3、本发明采用对称焊盘将蓝色芯片、绿色芯片固定在其中,一部分蓝光激发红色荧光粉,之后通过芯片发出的蓝光、绿光以及激发荧光粉产生的红光复合得到高色域LED直下式背光源,具有较高色域,采用对称焊盘的支架制成的LED灯珠用于直下式背光模组中可以达到均匀混光的效果,同时又可以增加散热,提高LED灯珠的可靠性。
附图说明
为了便于本领域技术人员理解,下面结合附图对本发明作进一步的说明。
图1为本发明整体结构截面图。
图2为本发明PCB板一俯视图。
图3为本发明PCB板二俯视图。
图4为本发明PCB板一上的LED灯珠正视图。
图5为本发明PCB板二上的LED灯珠正视图。
图6为现有的LED灯珠俯视图。
图中:1、金属背板;2、PCB板组;3、LED灯珠;301、支架;302、对称焊盘;4、透镜;5、反射片;6、扩散板;7、膜片;8、液晶屏;21、PCB板一;22、PCB板二;31、蓝色芯片;32、绿色芯片。
具体实施方式
下面将结合实施例对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
请参阅图1-5所示,一种均匀混光的高色域直下式背光模组,包括金属背板1、PCB板组2、LED灯珠3、透镜4、反射片5、扩散板6、膜片7和液晶屏8,金属背板1上固定有PCB板组2,且PCB板组2上设置有若干个PCB板一21和PCB板二22,PCB板一21和PCB板二22上均等间距设置有若干个LED灯珠3,反射片5设置在金属背板1上表面,且反射片5上设置有与LED灯珠3位置相对应的孔洞,LED灯珠3位于反射片5的孔洞中心,且LED灯珠3上固定有透镜4,且金属背板1边缘上方依次放置有扩散板6、膜片7和液晶屏8;
其中,LED灯珠3上设置有支架301,支架中部设置有白条,且支架301两侧均设置有对称焊盘302,两个对称焊盘302中分别固定设置有蓝光晶片31和绿光晶片32;
其中,对称焊盘302下方设置有支架301,支架301上点涂有红色荧光粉。
PCB板一21上的LED灯珠3与PCB板二22上的LED灯珠3两侧设置的蓝色芯片31和绿色芯片32的位置相反使该背光模组混光更加均匀,且采用对称焊盘的支架制成的LED灯珠用于直下式背光模组中可以达到均匀混光的效果,同时又可以增加散热,提高LED灯珠的可靠性。
支架301材质为SMC材质,采用SMC材质,耐温性提高,LED灯珠的可靠性会提高,且LED灯珠3两侧的对称焊盘302呈对称设置。
透镜4是反射式透镜,透镜4材质为硅胶透镜、PMMA透镜、PC透镜和玻璃透镜。
PCB板组2的数量为2-20条,且PCB板组2的数量为偶数,相邻的两个PCB板组2之间的间距为60-120mm,本发明将晶片位置放反,两根PCB板相对设置来做的,所以要做偶数。
相邻两个LED灯珠3之间的间距为60-95mm。
透镜4的直径为10-13mm,且透镜4的高度为5-10mm。
蓝色芯片31的激发波长为440nm-470nm,绿色芯片32的激发波长为500nm-545nm,红色荧光粉的激发波长为620nm-650nm,且红色荧光粉的材料为氮化物荧光粉、氟化物荧光粉、KSF荧光粉或硅酸盐荧光粉。
PCB板一21和PCB板二22的制作方法具体包括以下步骤:
步骤一:蓝色芯片31和绿色芯片32分别排布在LED灯珠3两侧的对称焊盘302里,固晶焊线;
步骤二:红色荧光粉与封装胶混合点涂在支架301里,烘烤固化;
步骤三:固化好的LED灯珠3贴在直下式的PCB板组2上,过回流焊后即可得到蓝色芯片31、绿色芯片32搭配红色荧光粉的PCB板一21和PCB板二22。
请参阅图6所示的现有的LED灯珠的支架里,蓝光芯片和绿光芯片分别发光,且焊盘位置不对称,当贴于PCB板组上时,导致画面蓝光和绿光芯片不能均匀的混光。
该背光模组的工作方法具体包括以下步骤:
S1:采用对称焊盘302将蓝色芯片31、绿色芯片32固定在其中,蓝色芯片31与绿色芯片32处于对称位置,将蓝光芯片31、绿光芯片32排布在对称焊盘302的支架301里并贴于PCB板组2上形成PCB板一21,再将蓝光芯片31和绿光芯片32调换位置贴于PCB板组2上形成PCB板二22,之后将PCB板一21和PCB板二22相对排布于金属背板1上形成直下式背光模组,蓝色芯片31和绿色芯片32激发的蓝光和红光激发红色荧光粉;
S2:之后通过蓝色芯片31、绿色芯片32发出的蓝光、绿光以及激发红色荧光粉产生的红光复合得到高色域LED直下式背光源,若干个LED灯珠3在PCB板一21和PCB板二22上等间距分布,PCB板一21和PCB板二22左右两侧、上下两边以及PCB板一21与PCB板二22之间均可以进行混光,如图2-3所示,在灯条的左右两侧、上下两边以及灯条之间均可以进行混光,最终既可以提升NTSC的色域值100%-120%,又可以均匀混光,且采用直下式背光模组,相比其他高色域方案还可以降低成本。
以上公开的本发明优选实施例只是用于帮助阐述本发明。优选实施例并没有详尽叙述所有的细节,也不限制该发明仅为的具体实施方式。显然,根据本说明书的内容,可作很多的修改和变化。本说明书选取并具体描述这些实施例,是为了更好地解释本发明的原理和实际应用,从而使所属技术领域技术人员能很好地理解和利用本发明。本发明仅受权利要求书及其全部范围和等效物的限制。
Claims (10)
1.一种均匀混光的高色域直下式背光模组,其特征在于:包括金属背板(1)、PCB板组(2)、LED灯珠(3)、透镜(4)、反射片(5)、扩散板(6)、膜片(7)和液晶面板(8),所述金属背板(1)上固定有PCB板组(2),且所述PCB板组(2)上设置有若干个PCB板一(21)和PCB板二(22),所述PCB板一(21)和PCB板二(22)上均等间距设置有若干个LED灯珠(3),所述反射片(5)设置在金属背板(1)上表面,且所述反射片(5)上设置有与LED灯珠(3)位置相对应的孔洞,所述LED灯珠(3)位于反射片(5)的孔洞中心,且所述LED灯珠(3)上固定有透镜(4),且所述金属背板(1)边缘上方依次放置有扩散板(6)、膜片(7)和液晶面板(8);
其中,所述LED灯珠(3)上设置有支架(301),所述支架中部设置有白条,且所述支架(301)两侧均设置有对称焊盘(302),两个对称焊盘(302)中分别固定设置有蓝光晶片(31)和绿光晶片(32);
其中,所述对称焊盘(302)下方设置有支架(301),所述支架(301)上点涂有红色荧光粉。
2.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述PCB板一(21)上的LED灯珠(3)与PCB板二(22)上的LED灯珠(3)两侧设置的蓝色芯片(31)和绿色芯片(32)的位置相反。
3.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述支架(301)材质为SMC材质,且LED灯珠(3)两侧的对称焊盘(302)呈对称设置。
4.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述透镜(4)是反射式透镜,透镜(4)材质为硅胶透镜、PMMA透镜、PC透镜和玻璃透镜。
5.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述PCB板组(2)的数量为2-20条,且PCB板组(2)的数量为偶数,相邻的两个PCB板组(2)之间的间距为60-120mm。
6.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,相邻两个LED灯珠(3)之间的间距为60-95mm。
7.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述透镜(4)的直径为10-13mm,且透镜(4)的高度为5-10mm。
8.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述蓝色芯片(31)的激发波长为440nm-470nm,所述绿色芯片(32)的激发波长为500nm-545nm,所述红色荧光粉的激发波长为620nm-650nm,且红色荧光粉的材料为氮化物荧光粉、氟化物荧光粉、KSF荧光粉或硅酸盐荧光粉。
9.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,所述PCB板一(21)和PCB板二(22)的制作方法具体包括以下步骤:
步骤一:蓝色芯片(31)和绿色芯片(32)分别排布在LED灯珠(3)两侧的对称焊盘(302)里,固晶焊线;
步骤二:红色荧光粉与封装胶混合点涂在支架(301)里,烘烤固化;
步骤三:固化好的LED灯珠(3)贴在直下式的PCB板组(2)上,过回流焊后即可得到蓝色芯片(31)、绿色芯片(32)搭配红色荧光粉的PCB板一(21)和PCB板二(22)。
10.根据权利要求1所述的一种均匀混光的高色域直下式背光模组,其特征在于,该背光模组的工作方法具体包括以下步骤:
S1:采用对称焊盘(302)将蓝色芯片(31)、绿色芯片(32)固定在其中,蓝色芯片(31)与绿色芯片(32)处于对称位置,将蓝光芯片(31)、绿光芯片(32)排布在对称焊盘(302)的支架(301)里并贴于PCB板组(2)上形成PCB板一(21),再将蓝光芯片(31)和绿光芯片(32)调换位置贴于PCB板组(2)上形成PCB板二(22),之后将PCB板一(21)和PCB板二(22)相对排布于金属背板(1)上形成直下式背光模组,蓝色芯片(31)和绿色芯片(32)激发的蓝光和红光激发红色荧光粉;
S2:之后通过蓝色芯片(31)、绿色芯片(32)发出的蓝光、绿光以及激发红色荧光粉产生的红光复合得到高色域LED直下式背光源,若干个LED灯珠(3)在PCB板一(21)和PCB板二(22)上等间距分布,PCB板一(21)和PCB板二(22)左右两侧、上下两边以及PCB板一(21)与PCB板二(22)之间均可以进行混光。
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