CN110470881A - Circuit device for current measurement and the power semiconductor assembly with it - Google Patents
Circuit device for current measurement and the power semiconductor assembly with it Download PDFInfo
- Publication number
- CN110470881A CN110470881A CN201910366984.8A CN201910366984A CN110470881A CN 110470881 A CN110470881 A CN 110470881A CN 201910366984 A CN201910366984 A CN 201910366984A CN 110470881 A CN110470881 A CN 110470881A
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- China
- Prior art keywords
- sensor
- power semiconductor
- circuit board
- semiconductor assembly
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000005259 measurement Methods 0.000 title claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 43
- 230000008878 coupling Effects 0.000 claims abstract description 12
- 238000010168 coupling process Methods 0.000 claims abstract description 12
- 238000005859 coupling reaction Methods 0.000 claims abstract description 12
- 238000011010 flushing procedure Methods 0.000 claims 1
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/207—Constructional details independent of the type of device used
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Abstract
The present invention relates to a kind of circuit device for current measurement and the power semiconductor assemblies with it.The circuit device is designed to have: flexible printed circuit board, contact device and two magnetic field sensors, wherein the first magnetic field sensor is disposed on the first sensor part of flexible printed circuit board, the first sensor part is designed to be disposed on the first interarea of the load connecting conductor of power semiconductor assembly, wherein the second magnetic field sensor is disposed on the second sensor part of flexible printed circuit board, the second sensor part is designed to be disposed on second interarea opposite with the first interarea of the load connecting conductor of power semiconductor assembly, and wherein the coupling part of flexible printed circuit board is formed between first sensor part and second sensor part.
Description
Technical field
The present invention describes a kind of in power semiconductor assembly, it is especially useful in some or all of by electric drive
Vehicle in measure the circuit device of electric current, and the power semiconductor assembly with this circuit device.
Background technique
According to the generally known prior art, the current sensor in power semiconductor assembly is implemented as measurement line
Circle, the measuring coil surround load connecting conductor.For this purpose, before assembling load connecting conductor, in manufacture power semiconductor
These measuring coils must be placed on load connecting conductor during component.
About above-mentioned situation, the purpose of the present invention is to propose to a kind of in power semiconductor assembly for current measurement
Circuit device and power semiconductor assembly with the circuit device, wherein circuit device is suitable for being simply mounted load
It connects on conductor, with high measurement accuracy and compact design.
Summary of the invention
According to the present invention, by a kind of circuit device for current measurement, and there is the circuit device by a kind of
Power semiconductor assembly realize the purpose.Also describe preferred embodiment.
Circuit device according to the present invention for the current measurement in power semiconductor assembly is designed to have: flexible
Printed circuit board, contact device and two magnetic field sensors, wherein the first magnetic field sensor is disposed in flexible print circuit
On the first sensor part of plate, which is designed to be disposed in the load connection of power semiconductor assembly
On first interarea of conductor, wherein the second magnetic field sensor is disposed on the second sensor part of flexible printed circuit board,
The second sensor part is designed to be disposed in the opposite with the first interarea of the load connecting conductor of power semiconductor assembly
The second interarea on, and wherein the coupling part of flexible printed circuit board be formed on the first and second sensor portions point it
Between.
Magnetic field sensor can for example be designed to hall effect sensor or magnetoresistive sensor.
Certainly, magnetic field sensor is all connected to the conductive mark of printed circuit board in a manner of circuit compatibility in any case
Line.
Contact device is preferably designed to a part of plug connector arrangement and is directly electrically connected in an electrically conductive way
To flexible printed circuit board or it is designed to a part of flexible printed circuit board itself.
Preferably, the first sensor part of flexible printed circuit board has the position on fixed load connection conductor
The first positioning device set.Alternatively, but be preferably simultaneously, the second sensor part of flexible printed circuit board is advantageous
Ground has the second positioning device of the position on fixed load connection conductor.
Power semiconductor assembly according to the present invention is designed to have: power electronic switching device, load connecting conductor
And the foregoing circuit device for current measurement, wherein first sensor is partially disposed in the first master of load connecting conductor
On face, wherein second sensor is partially disposed on second interarea opposite with the first interarea of load connecting conductor, wherein
The Sensor section of circuit device is mechanically fixed on load connecting conductor and the wherein interconnecting piece of flexible printed circuit board
Divide auxiliary face around load connecting conductor, being disposed between the first and second interareas to extend, and first and second are passed
Sensor part links together.
Term " being disposed on interarea " is understood to mean that direct and indirect arrangement.Directly mean do not have
The arrangement of middle layer or intermediary element.It is meant in addition arrange for example with binder form indirectly as used herein
Middle layer or other intermediary elements especially plastic body or with both the middle layer of binder form and other intermediary elements.
Advantageously, the Sensor section of circuit device is mechanically fixed on load connecting conductor by clamping device.
The clamping device can be designed to have: two stirrup shape parts, connect two spring sections of these stirrup shape parts with
And locking device.
Particularly advantageously, the peg-shaped portions of locking device have also been formed simultaneously the Part III of positioning device.
It is further preferred that clamping device tool is there are two pressure elements, each of described two pressure elements are all pressed in
On the shell of first and second magnetic field sensors.
It is further advantageous that clamping device has third positioning device, the third positioning device is bonded on flexible printing
In associated first and/or second positioning device of circuit board.These first and second positioning devices are respectively formed as recessed
Portion and third positioning device are formed pin, and the pin passes through the first and second positioning devices of flush alignment each other.
Be self-evident that, it is of the invention it is not necessarily excluding, either with circuit structure or with power semiconductor group
The various embodiments that part is used in combination can be implemented either individually or in any combination to realize and improve.In particular, not departing from this
Features described above and it feature those of is mentioned below can not only be used in specific combination in the case where the range of invention, also can
It is enough used in other combinations or is used alone.
Detailed description of the invention
It is of the invention be explained further, Advantageous details and feature are derived from this hair that Fig. 1 is schematically shown into Fig. 7
Bright exemplary embodiment is described below, or the relevant portion from the description.
Fig. 1 shows circuit device according to the present invention.
Fig. 2 and Fig. 3 show the details of the different views of the first design of power semiconductor assembly according to the present invention.
Fig. 4 and Fig. 5 shows the details of the second design of power semiconductor assembly according to the present invention.
Fig. 6 and Fig. 7 shows other details of the second design of power semiconductor assembly according to the present invention.
Specific embodiment
Fig. 1 shows circuit device 1 according to the present invention.What is be shown here is flexible printed circuit board 2, wherein printing in property
One in the main side of printed circuit board 2 is upper with multiple conductive traces 200.It is connected to the power pack of flexible printed circuit board 2
20 be first sensor part 24, is disposed with the first magnetic field sensor 4 and the first magnetic field on first sensor part 24
Sensor 4 is conductively electrically connected to the specified conductive trace of flexible printed circuit board 2 in a manner of circuit compatibility.
Be connected to the first sensor part 24 of flexible printed circuit board 2 is coupling part 22, flexible print circuit
The second sensor part 26 of plate 2 is connected to coupling part 22.Second magnetic field sensor 6 is disposed in the second sensor part
On 26 and the second magnetic field sensor 6 is conductively electrically connected to the associated of flexible printed circuit board 2 in a manner of circuit compatibility
Conductive trace.
According to the present invention, coupling part 22 is configured to and is designed to make two Sensor sections 24,26 can
It is arranged to back-to-back to a certain extent, but is separated from each other.This is definitely described here.
By the design of flexible printed circuit board 2, even if load connecting conductor 7 has been installed within power semiconductor
In component, circuit device 1 can also be arranged relative to load connecting conductor 7.
It is special Fig. 2 and Fig. 3 show the details of the different views of the first design of power semiconductor assembly according to the present invention
It is not the power semiconductor modular of encapsulation.Illustrated herein are the circuit device 1 according to Fig. 1, circuit device 1 connects relative to load
Connect the arrangement of conductor 7.
Herein, the first sensor part 24 of flexible printed circuit board 2 is positioned in the first interarea of load connecting conductor 7
In 74 a part.Herein, the second sensor part 26 of flexible printed circuit board 2 is positioned in the of load connecting conductor 7
In a part of two interareas 76.Therefore two magnetic field sensors 4,6 are positioned at opposite each other in the marginal range of component.By
In this arrangement of two magnetic field sensors 4,6, therefore it can easily and efficiently compensate and flow through load connecting conductor 7
The mistake measurement of electric current.
First sensor part 24 is connected to the second biography in this way by the coupling part 22 of flexible printed circuit board 2
Sensor part 26: that is, coupling part 22 is made just to cover exact one in two auxiliary faces 72 of load connecting conductor 7
A part is still not carried against above it again.
The contact device 3 of circuit device 1 is also shown in Fig. 2, and herein, contact device 3 is designed to plug and therefore quilt
Be formed as a part of connector arrangement.The plug is disposed in the power pack 20 of flexible printed circuit board 2.Principle
On, it can be deformed herein using all deformations especially standard technique of contact device.This plug connector arrangement is by magnetic field
Sensor is connected to the control unit of higher level, partly leads for evaluating and assessing sensor signal and be also used for driving power
Body component.
Fig. 3 also shows the second positioning device 286 of circuit device 1.Second positioning device 286 is designed to flexible printing
Circular, continuous recess portion of the circuit board 2 in the region of second sensor part 26.First positioning device of circuit device 1
284 be arranged such that here the first positioning device 284 and associated second positioning device, 286 flush alignment (compared with figure
7), the first positioning device 284 is also designed as circle of the flexible printed circuit board 2 in the region of first sensor part 24
, continuous recess portion.
Fig. 4 and Fig. 5 shows the details of the second design of power semiconductor assembly according to the present invention, i.e. clamping device 8.
Fig. 4 shows clamping device in the on-state, and Fig. 5 shows the clamping device under closure, i.e. lock state.
Clamping device 8 has the first stirrup shape, U-shaped part 84, and the first stirrup shape, U-shaped part 84 pass through two bullets
Spring part 82 is connected to the second stirrup shape, U-shaped part 86.In addition, clamping device 8 has locking device 88, locking device 88
Two snap fits being disposed on the second stirrup shape part 86 are designed to, each of them is with peg-shaped portions 880
Associated two adjacency sections 882, each of two adjacency sections 882 are all the first stirrups with respective snap fit
The part of shape part 84.
The peg-shaped portions 880 of snap fit are used as third positioning device simultaneously, compare Fig. 6 and Fig. 7.
Moreover, clamping device 8 have the pressure elements 840 stretched out from the middle section of respective stirrup shape part 84,86,
860, it is designed to be pressed on each autocorrelative magnetic field sensor and fixes its position thus relative to load circuit conductor 7,
See Fig. 6 and 7.
Fig. 6 and Fig. 7 shows other details of the second design of power semiconductor assembly according to the present invention.It is this to have
The power semiconductor assembly of power electronic switching can be designed specifically to that there is the power of multiple power semiconductor components partly to lead
Body component, the power semiconductor assembly are disposed on substrate in a manner of circuit compatibility and are electrically connected with following components conductive
It connects: the connecting element of directed outwards, especially load connecting conductor and shell.
Herein, a load connecting conductor 7 of power semiconductor assembly, and one load connecting conductor are only shown
7 be only local.Load connecting conductor 7 has the first interarea 74 and second interarea 76 opposite with the first interarea 74.The two
Interarea 74,76 is connected via auxiliary face 72 respectively.In addition, load connecting conductor 7 has unilateral limiting unit (that is, opening from auxiliary face herein
Begin) 700, so that circuit device 1 occupies in power semiconductor assembly most jointly with the clamping device 8 for circuit device 1
Small quantity space.
As described in Fig. 1, the first magnetic field sensor 4 herein is disposed in the flexible printing of circuit device 1
On the first sensor part 24 of circuit board 2.The first sensor part 24 is disposed in the first master of load connecting conductor 7 again
In a part in face 74.
As described in Fig. 1, the second magnetic field sensor 6 herein is disposed in the flexible printing of circuit device 1
On the second sensor part 26 of circuit board 2.The second sensor part 26 is disposed in the second master of load connecting conductor 7 again
In a part in face 76.
First sensor part 24 is connected to second sensor part using the coupling part 22 of flexible printed circuit board 2
26, which is disposed in the limiting unit 700 of load connecting conductor 7 and thus surrounds load connection and lead
The auxiliary face 72 of body 7.
For the position of fixed magnetic field sensor 4,6, the respective associated Sensor section 24 of compliant conductive trace 2,
26 have positioning device 284,286.The first positioning device 284 for belonging to first sensor part 24 is designed to circular recess simultaneously
And with 286 flush alignment of the second positioning device for belonging to second sensor part 26 that is similarly designed as circular recess.First
It is disposed in the second positioning device 284,286 in the region opposite with auxiliary face 72 in the auxiliary face of load connecting conductor 7, in auxiliary face
The coupling part 22 of flexible printed circuit board 2 is disposed on 72.
As described in figures 4 and 5, clamping device 8 passes through the associated sensor positioned at flexible printed circuit board 2
Stirrup shape part 84,86 on part 24,26, and the spring section 82 of encirclement coupling part 22 consolidate magnetic field sensor 4,6
It is scheduled on the appropriate position of magnetic field sensor 4,6.
In addition, the peg-shaped portions 880 of locking device 88 are determined across associated the first and second of Sensor section 24,26
Position device 284,286 is prominent.Therefore, meanwhile, the peg-shaped portions 880 of locking device 88 also form third positioning device.
Therefore the peg-shaped portions 880 of locking device 88 form a part of snap fit, the part is bonded on neighbour
In socket part 882, adjacency section 882 is a part of the first stirrup shape part 84 of clamping device 8 herein.
Moreover, the clamping device 8 described in figures 4 and 5 has pressure elements 840,860, in clamping device 8 by cloth
In the state of set and closure, pressure elements 840,860 is pressed on the shell of magnetic field sensor 4,6, and there is thus also provided
Being mechanically fixed for Sensor section 24,26.
Claims (11)
1. a kind of circuit device (1) for the current measurement in power semiconductor assembly, the circuit device (1) include soft
Property printed circuit board (2), contact device (3) and two magnetic field sensors (4,6),
Wherein first magnetic field sensor (4) is disposed in the first sensor part of the flexible printed circuit board (2)
(24) on, the first sensor part (24) is designed to be disposed in the load connecting conductor of the power semiconductor assembly
(7) on the first interarea (74),
Wherein second magnetic field sensor (6) is disposed in the second sensor part of the flexible printed circuit board (2)
(26) on, the second sensor part (26) is designed to be disposed in the load connecting conductor of the power semiconductor assembly
(7), on opposite with first interarea the second interarea (76), and
Wherein the coupling part (22) of the flexible printed circuit board (2) is formed on the first sensor part (24) and institute
It states between second sensor part (26).
2. circuit device according to claim 1, wherein
Contact device (3) is designed to a part of connector arrangement and by direct conduction is connected to the flexibility
Printed circuit board (2), or it is designed to a part of the flexible printed circuit board (2) itself.
3. circuit device according to any one of the preceding claims, wherein
The first sensor part (24) of the flexible printed circuit board (2) has for fixing the load connecting conductor (7)
On position the first positioning device (284).
4. circuit device according to claim 1 or 2, wherein
The second sensor part (26) of the flexible printed circuit board (2) has for fixing the load connecting conductor (7)
On position the second positioning device (286).
5. a kind of power semiconductor assembly, the power semiconductor assembly includes power electronic switching device, load connecting conductor
(7) and the circuit device (1) according to any one of the preceding claims for current measurement, wherein described first passes
Sensor part (24) is disposed on the first interarea (74) of the load connecting conductor (7), wherein the second sensor portion
(26) are divided to be disposed on the load connecting conductor (7), opposite with first interarea the second interarea (76), wherein institute
The Sensor section (24,26) for stating circuit device (1) is by preference mechanically anchored on the load connecting conductor (7) and wherein institute
State the coupling parts (22) of flexible printed circuit board (2) around the load connecting conductor (7), be disposed in first interarea
(74) auxiliary face (72) between second interarea (76) extends, and by the first sensor part (24) and described the
Two Sensor sections (26) link together.
6. power semiconductor assembly according to claim 5, wherein
The Sensor section (24,26) of the circuit device (1) is by preference mechanically anchored the load by clamping device (8) and connects
It connects on conductor (7).
7. power semiconductor assembly according to claim 6, wherein
The clamping device (8) is formed with: two stirrup shape parts (84,86), connection stirrup shape part (84,
86) two spring sections (82) and locking device (88).
8. power semiconductor assembly according to claim 6 or 7, wherein
The clamping device (8) has third positioning device (880), and the third positioning device (880) is bonded on the flexibility
In associated first positioning device (284) of printed circuit board (2) and/or the second positioning device (286).
9. power semiconductor assembly according to claim 8, wherein
First positioning device (284) and second positioning device (286) are always formed as recess portion and the third
Positioning device (880) is formed pin, and the pin passes through first positioning device (284) being aligned with flushing each other and described
Second positioning device (286).
10. power semiconductor assembly according to claim 8, wherein
The peg-shaped portions of the locking device (88) form the third positioning device (880).
11. power semiconductor assembly according to claim 6 or 7, wherein
Clamping device (8) tool there are two pressure elements (840,860), always press by described two pressure elements (840,860)
On the shell of first magnetic field sensor (4) and second magnetic field sensor (6).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018111216.5 | 2018-05-09 | ||
| DE102018111216.5A DE102018111216B3 (en) | 2018-05-09 | 2018-05-09 | Circuit arrangement for current measurement in a power semiconductor group and power semiconductor module hereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110470881A true CN110470881A (en) | 2019-11-19 |
Family
ID=68052981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910366984.8A Pending CN110470881A (en) | 2018-05-09 | 2019-05-07 | Circuit device for current measurement and the power semiconductor assembly with it |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110470881A (en) |
| DE (1) | DE102018111216B3 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111505479A (en) * | 2020-03-12 | 2020-08-07 | 中国计量科学研究院 | Low-temperature superconducting chip packaging testing device |
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- 2019-05-07 CN CN201910366984.8A patent/CN110470881A/en active Pending
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| US20180172739A1 (en) * | 2016-12-20 | 2018-06-21 | Infineon Technologies Ag | Current sensing |
| JP2022101015A (en) * | 2020-12-24 | 2022-07-06 | 株式会社オートネットワーク技術研究所 | Current detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111505479A (en) * | 2020-03-12 | 2020-08-07 | 中国计量科学研究院 | Low-temperature superconducting chip packaging testing device |
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| DE102018111216B3 (en) | 2019-10-17 |
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