CN110453101A - Press from both sides metallic copper crystalline flake graphite enhancing Cu-base composites and its preparation method and application - Google Patents
Press from both sides metallic copper crystalline flake graphite enhancing Cu-base composites and its preparation method and application Download PDFInfo
- Publication number
- CN110453101A CN110453101A CN201910730201.XA CN201910730201A CN110453101A CN 110453101 A CN110453101 A CN 110453101A CN 201910730201 A CN201910730201 A CN 201910730201A CN 110453101 A CN110453101 A CN 110453101A
- Authority
- CN
- China
- Prior art keywords
- flake graphite
- crystalline flake
- copper
- metallic copper
- folder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0005—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
- C22C32/0057—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on B4C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
- C22C32/0063—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on SiC
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0068—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only nitrides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a kind of folder metallic copper crystalline flake graphites to enhance Cu-base composites, by what is be prepared after hot pressed sintering after the copper powder molding of the hard particles of 1~20wt.%, the folder metallic copper crystalline flake graphite of 5~30wt.% and surplus；Wherein, hard particles are selected from SiC particulate, B4C particle, TiC particle, A12O3Particle, SiO2Particle, Si3N4One of particle and AlN particle are a variety of；Pressing from both sides metallic copper crystalline flake graphite is that will be layered crystalline flake graphite to be successively sensitized and activated, and makes one layer of reproducibility colloid in surface and Inter layer adsorption of crystalline flake graphite, and form forming core site；Then using the method for chemical plating obtained from the surface of layering crystalline flake graphite and interlayer plating metal layers of copper.The present invention also provides the preparation method and applications of folder metallic copper crystalline flake graphite enhancing Cu-base composites.Folder metallic copper crystalline flake graphite of the invention enhances Cu-base composites, can be improved the bond strength of crystalline flake graphite and Copper substrate, increases the mechanics and wear resistance of Cu-base composites.
Description
Technical field
The present invention relates to technical field of composite preparation, and in particular to a kind of folder metallic copper crystalline flake graphite enhancing is copper-based multiple
Condensation material, preparation method and application.
Background technique
Cu-base composites are extensive with good machinability, excellent tribological property and good thermal conductivity
Serve as friction material.It is frequently added hard particles in Cu-base composites and plays the role of second-phase strength, hard particles add
Enter can effectively improve the wearability and coefficient of friction of composite material.However, the addition of hard particles, which is be easy to cause, to be caused to wear
The damage on surface, while hard particles are easy to fall off from Copper substrate to cause abrasive wear.It is copper-based multiple in order to overcome the problems, such as this
It is secondary to stablize friction that solid lubricant is usually added in condensation material, and reduces friction by forming lubrication transfer layer in secondary surface
Secondary adhesion contact.In solid lubricant, graphite has excellent lubricity, high thermal conductivity, antidamping and high temperature steady
It is qualitative, therefore graphite is the most common solid lubricant in Cu-base composites.
However, lot of documents reports that weaker interface binding power will cause graphite in process of friction and wear between copper and graphite
It extracts not having its lubricating action from matrix.Graphite surface metallization is a kind of improvements graphite and Copper substrate interface cohesion
Effective way.However, previous used in research to surface metal graphite be mainly ball-type graphite, graphite powder,
Or the lesser graphite of graphite fibre equidimension.And about the text between large scale crystalline flake graphite and copper (diameter > 200 μm) matrix
It offers and is rarely reported.Compared to other type graphites, large scale crystalline flake graphite is with density is low, cheap, specific surface area is small, edge
The advantages that horizontal direction thermal coefficient is high and be used in the friction material to work under the conditions of high-speed overload lotus, such as automobile, high-speed rail
The brake friction materials such as train, windmill and aerospace.In addition, studies have shown that large-size particle surface metalation can not
Interface bond strength is effectively improved as small sized particles surface metalation.
Summary of the invention
In order to improve the boundary strength of crystalline flake graphite and Copper substrate, increase mechanics and the rub resistance abrasion of Cu-base composites
Performance, the present invention provide a kind of folder metallic copper crystalline flake graphite enhancing Cu-base composites and preparation method thereof.
In order to solve the above-mentioned technical problems, the present invention provides a kind of folder metallic copper crystalline flake graphites to enhance copper-based composite wood
Material, by being passed through after the copper powder molding of the hard particles of 1~20wt.%, the folder metallic copper crystalline flake graphite of 5~30wt.% and surplus
It is prepared after hot pressed sintering；
Wherein, the hard particles are selected from SiC particulate, B4C particle, TiC particle, A12O3Particle, SiO2Particle, Si3N4
One or more of grain and AlN particle；
It is described folder metallic copper crystalline flake graphite the preparation method comprises the following steps:
Layering crystalline flake graphite is successively sensitized and is activated, so that the surface of crystalline flake graphite and one layer of Inter layer adsorption
Reproducibility colloid, and forming core site is formed on the reproducibility colloid；And
Using chemical plating method it is described layering crystalline flake graphite surface and interlayer plating metal layers of copper to get arrive the folder
Metallic copper crystalline flake graphite.
Further, the size of the hard particles is 600nm~300 μm, further, the ruler of the hard particles
Very little is 10~20 μm.
Further, the copper powder is selected from atomized copper powder, electrolytic copper powder, cupric oxide powder, red copper powder, bronze powder and brass powder
One or more of.Further, the size of the copper powder is 1~45 μm.
Further, the size of the folder metallic copper crystalline flake graphite is 100~300 μm.
Further, the layering crystalline flake graphite is prepared through following steps:
Natural flake graphite is uniformly mixed with mixed acid, intercalator, is stirred to react 1~2h at 35~40 DEG C；Reaction
After, it will be dry after natural flake graphite washing, filtering, 1~2min is kept the temperature at 300~400 DEG C, obtains described point
Layer crystalline flake graphite.
Further, the size of the natural flake graphite is 100~300 μm.
Further, the mixed acid is mixed by perchloric acid and phosphoric acid, the volume ratio of the two be 3~6:0.5~
1.5；The intercalator is potassium permanganate.
Further, the content ratio of the mixed acid, potassium permanganate and natural flake graphite is (3.5~7.5ml): (0.2
~0.6g): (3~5g).
In the present invention, activation is to allow flake graphite's surface to adsorb one layer of metal Pd, and Pd is a kind of very strong catalysis work
Property metal, during chemical plating metal coating, the coat of metal as center forming core and will be grown up using Pd, thus make chemistry it is plated
Journey is smooth；The absorption of metal Pd is will by Sn (OH) the Cl colloid of the carbon fiber surface absorption after sensitized treatment
Pd2+Reduction gained.Further, the formula of sensitized solution are as follows: SnCl2, 20g/L；The HCl of 37wt%, 40mL/L；Remaining as going
Ionized water；The formula of activated solution are as follows: PdCl2, 0.2g/L；The HCl of 37wt%, 5mL/L；Remaining as deionized water.
Further,
The formula of Electroless Cu Plating solution are as follows: cupric sulfate pentahydrate, 14~18g/L；Disodium ethylene diamine tetraacetate, 20~30g/L；
Sodium potassium tartrate tetrahydrate, 15~25g/L；Formalin, 12~16mL/L；Remaining is deionized water；PH adjusting agent is 50wt.%'s
NaOH solution, adjusting solution ph is 13.5~14；Electroless Cu Plating temperature is 35~45 DEG C.
It further, further include that the folder metal layer crystalline flake graphite that will be obtained after chemical plating cleans in alcoholic solution, is dry
Step.
The present invention also provides a kind of preparation methods of the folder metallic copper crystalline flake graphite enhancing copper-based material, including with
Lower step:
The hard particles, folder metallic copper crystalline flake graphite and copper powder for taking formula ratio, are added the mixing agent of 0.2~0.5wt.%,
It is uniformly mixed, obtains composite powder；By the composite powder cold moudling, the pressure of cold pressing is 450~550MPa, and the dwell time is
30~60s；And the green body after cold moudling is subjected to hot pressed sintering, 380~420 DEG C are first warming up to, 2~2.5h is kept the temperature, makes
Mixing agent is volatilized completely；It is warming up to 880~920 DEG C again, keep the temperature 1~1.5h enhances to get to the folder metallic copper crystalline flake graphite
Copper-based material；Wherein vacuum degree is 10 in furnace-2Pa, pressure are 2~3Mpa, and heating rate is 15~20 DEG C/min.
The present invention also provides application of the folder metallic copper crystalline flake graphite enhancing copper-based material in friction material.
Beneficial effects of the present invention:
Crystalline flake graphite and copper facing crystalline flake graphite, folder metallic copper scale used in the present invention are directly added into compared to traditional
Graphite can greatly improve the bond strength between crystalline flake graphite and Copper substrate, and substantially increase the power of Cu-base composites
And friction and wear behavior.High friction stability is being required, the friction material field of high-wearing feature has broad application prospects.
Detailed description of the invention
Fig. 1 is the SEM shape appearance figure of raw material crystalline flake graphite；
Fig. 2 is the SEM shape appearance figure of layering crystalline flake graphite prepared by embodiment 1；
Fig. 3 is the SEM shape appearance figure of folder metal layer crystalline flake graphite prepared by embodiment 1；
Fig. 4 is folder metal copper layer flake graphite's surface EDS figure prepared by embodiment 1.
Fig. 5 be vacuum heating-press sintering after sample composite material metallograph；
Fig. 6 a and d are the interface cohesion figure and schematic diagram of crystalline flake graphite and copper in the composite material of the preparation of comparative example 1；Fig. 6 b
The interface cohesion figure and schematic diagram of crystalline flake graphite and copper in the composite material prepared with e for comparative example 2；Fig. 6 c and f are embodiment 1
The interface cohesion figure and schematic diagram of crystalline flake graphite and copper in the composite material of preparation.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It more fully understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Embodiment 1
Present embodiment discloses a kind of metallic copper crystalline flake graphites that presss from both sides to enhance the preparation method of Cu-base composites, including following
Step:
(1) under room temperature environment, by 5ml perchloric acid and 1ml phosphoric acid be put into glass beaker be uniformly mixed obtain mixed acid,
0.4g potassium permanganate is added, is slowly stirred, is dissolved in it in mixed acid, being eventually adding 4g crystalline flake graphite and being sufficiently stirred makes it
It is uniformly mixed.Perchloric acid, phosphoric acid will be housed, the glass beaker of potassium permanganate and crystalline flake graphite is placed into the constant temperature that water temperature is 40 DEG C
60min is reacted in water bath, should be stirred continuously during reaction to guarantee that reaction is uniform.After reaction, repeatedly washing, will precipitate
The crystalline flake graphite to get off filters out and the drying at 60 DEG C.Finally obtained crystalline flake graphite is being put into Muffle furnace, by horse
Not furnace rises to 300 DEG C, keeps the temperature 60s.Turn off Muffle furnace power supply, is down to 100 DEG C hereinafter, by crystalline flake graphite from Muffle to in-furnace temperature
It is taken out in furnace furnace, the crystalline flake graphite being layered.Crystalline flake graphite primary morphology is as shown in Figure 1, obtained layering crystalline flake graphite shape
Looks are as shown in Figure 2.
(2) crystalline flake graphite handled by (1) step is put into sensitized solution and is stirred continuously, taken after 15min
Out and spend that Ion Cleaning is clean, and room temperature is dried.Sensitized solution proportion are as follows: SnCl2, 20g/L；The HCl of 37wt%, 40mL/L；
Remaining as deionized water.Crystalline flake graphite after sensitization is put into activated solution and is stirred continuously, taken out after 15min and spend from
Son cleans up, and room temperature is dried.Activated solution proportion are as follows: PdCl2, 0.2g/L；The HCl of 37wt%, 5mL/L；Remaining as go from
Sub- water.
(3) method for using electroless copper, plates metal layer between the flake graphite's surface and graphite linings of layering.By
(1) layering crystalline flake graphite obtained in step is put into constant water bath box, the plating solution needed for electroless copper in water bath.Electroless Cu Plating
Solution formula are as follows: cupric sulfate pentahydrate, 14g/L；Disodium ethylene diamine tetraacetate, 20g/L；Sodium potassium tartrate tetrahydrate, 15g/L；Formalin,
12mL/L remaining be deionized water.Constant water bath box is heated to 35 DEG C, keeps the temperature 10 minutes, the NaOH of 50wt.% is then added
Solution adjusts solution ph to 13.5~14, keeps the temperature 30min and is stirred continuously.Crystalline flake graphite is taken out after having reacted, and is put at once
Enter ultrasonic cleaning in ethanol solution, dried in drying box, obtains folder metallic copper crystalline flake graphite.Obtained folder metallic copper scale
Graphite morphology is as shown in Figure 3.Obtained folder metallic copper flake graphite's surface ingredient is as shown in Figure 4.
(4) mixing: 10g is taken to press from both sides metallic copper crystalline flake graphite, 2g SiO2Particle and 88g electrolytic copper powder are put into mixing tank and obtain
To mixed-powder.The agent of 0.2ml mixing is added in mixing tank.Mixing tank is packed into mixing 4h on three-dimensional oscillating batch mixer, mixing
Machine velocity of rotation is 400r/min, obtains composite powder after mixing is complete.
(5) cold moudling: it is by composite powder loading internal diameterStainless steel mould in, be cold-pressed under hydraulic press
Molding.Cold pressing pressure is 500MPa, dwell time 30s.Molding sample is obtained after cold moudling.
(6) hot pressed sintering: the sample after cold moudling, which is packed into internal diameter, isGraphite jig in, in Vacuum Heat
Hot pressed sintering is carried out in pressure furnace.Vacuum degree is 10 in furnace-2Pa, heating rate is 20 DEG C/min in furnace, is warming up to 400 DEG C of heat preservations
2h, mixing agent can all volatilize from sample.It is continuously heating to 900 DEG C to keep the temperature and pressurize, wherein pressure is 2~3MPa, heat preservation
Time is 1h.After soaking time, power off, unloading pressure, to in-furnace temperature be down to 100 DEG C hereinafter, by hot pressing piece from
It is taken out in vacuum hotpressing stove, removes mold, obtain folder metallic copper crystalline flake graphite enhancing Cu-base composites.It is tried after vacuum heating-press sintering
The metallograph of the composite material of sample is as shown in Figure 5.The interface cohesion situation and interface of crystalline flake graphite and copper are tied in composite material
Schematic diagram is closed as shown in Fig. 6 c and f.
Embodiment 2
Present embodiment discloses a kind of metallic copper crystalline flake graphites that presss from both sides to enhance the preparation method of Cu-base composites, including as follows
Step:
(1) under room temperature environment, by 5ml perchloric acid and 1ml phosphoric acid be put into glass beaker be uniformly mixed obtain mixed acid,
0.4g potassium permanganate is added, is slowly stirred, is dissolved in it in mixed acid, being eventually adding 4g crystalline flake graphite and being sufficiently stirred makes it
It is uniformly mixed.Perchloric acid, phosphoric acid will be housed, the glass beaker of potassium permanganate and crystalline flake graphite is placed into the constant temperature that water temperature is 40 DEG C
60min is reacted in water bath, should be stirred continuously during reaction to guarantee that reaction is uniform.After reaction, repeatedly washing, will precipitate
The crystalline flake graphite to get off filters out and the drying at 60 DEG C.Finally obtained crystalline flake graphite is being put into Muffle furnace, by horse
Not furnace rises to 300 DEG C, keeps the temperature 60s.Turn off Muffle furnace power supply, is down to 100 DEG C hereinafter, by crystalline flake graphite from Muffle to in-furnace temperature
It is taken out in furnace furnace, the crystalline flake graphite being layered.
(2) crystalline flake graphite handled by (1) step is put into sensitized solution and is stirred continuously, taken after 15min
Out and spend that Ion Cleaning is clean, and room temperature is dried.Sensitized solution proportion are as follows: SnCl2, 20g/L；The HCl of 37wt%, 40mL/L；
Remaining as deionized water.Crystalline flake graphite after sensitization is put into activated solution and is stirred continuously, taken out after 15min and spend from
Son cleans up, and room temperature is dried.Activated solution proportion are as follows: PdCl2, 0.2g/L；The HCl of 37wt%, 5mL/L；Remaining as go from
Sub- water.
(3) method for using electroless copper, plates metal layer between the flake graphite's surface and graphite linings of layering.By
(1) layering crystalline flake graphite obtained in step is put into constant water bath box, the plating solution needed for electroless copper in water bath.Electroless Cu Plating
Solution formula are as follows: cupric sulfate pentahydrate, 16g/L；Disodium ethylene diamine tetraacetate, 25g/L；Sodium potassium tartrate tetrahydrate, 20g/L；Formalin,
13mL/L remaining be deionized water.Constant water bath box is heated to 35 DEG C, keeps the temperature 10 minutes, the NaOH of 50wt.% is then added
Solution adjusts solution ph to 13.5~14, keeps the temperature 30min and is stirred continuously.Crystalline flake graphite is taken out after having reacted, and is put at once
Enter ultrasonic cleaning in ethanol solution, dried in drying box, obtains folder metallic copper crystalline flake graphite.
(4) mixing: 8g is taken to press from both sides metallic copper crystalline flake graphite, 1g SiO2Particle and 91g electrolytic copper powder are put into mixing tank and obtain
Mixed-powder.The agent of 0.2ml mixing is added in mixing tank.Mixing tank is packed into mixing 4h on three-dimensional oscillating batch mixer, batch mixer
Velocity of rotation is 400r/min, obtains composite powder after mixing is complete.
(5) cold moudling: it is by composite powder loading internal diameterStainless steel mould in, be cold-pressed under hydraulic press
Molding.Cold pressing pressure is 500MPa, dwell time 30s.Molding sample is obtained after cold moudling.
(6) hot pressed sintering: the sample after cold moudling, which is packed into internal diameter, isGraphite jig in, in Vacuum Heat
Hot pressed sintering is carried out in pressure furnace.Vacuum degree is 10 in furnace-2Pa, heating rate is 20 DEG C/min in furnace, is warming up to 400 DEG C of heat preservations
2h, mixing agent can all volatilize from sample.It is continuously heating to 900 DEG C to keep the temperature and pressurize, wherein pressure is 2~3MPa, heat preservation
Time is 1h.After soaking time, power off, unloading pressure, to in-furnace temperature be down to 100 DEG C hereinafter, by hot pressing piece from
It is taken out in vacuum hotpressing stove, removes mold, obtain folder metallic copper crystalline flake graphite enhancing Cu-base composites.
Embodiment 3
Present embodiment discloses a kind of metallic copper crystalline flake graphites that presss from both sides to enhance the preparation method of Cu-base composites, including as follows
The step of:
(1) under room temperature environment, by 5ml perchloric acid and 1ml phosphoric acid be put into glass beaker be uniformly mixed obtain mixed acid,
0.4g potassium permanganate is added, is slowly stirred, is dissolved in it in mixed acid, being eventually adding 4g crystalline flake graphite and being sufficiently stirred makes it
It is uniformly mixed.Perchloric acid, phosphoric acid will be housed, the glass beaker of potassium permanganate and crystalline flake graphite is placed into the constant temperature that water temperature is 40 DEG C
60min is reacted in water bath, should be stirred continuously during reaction to guarantee that reaction is uniform.After reaction, repeatedly washing, will precipitate
The crystalline flake graphite to get off filters out and the drying at 60 DEG C.Finally obtained crystalline flake graphite is being put into Muffle furnace, by horse
Not furnace rises to 300 DEG C, keeps the temperature 60s.Turn off Muffle furnace power supply, is down to 100 DEG C hereinafter, by crystalline flake graphite from Muffle to in-furnace temperature
It is taken out in furnace furnace, the crystalline flake graphite being layered.
(2) crystalline flake graphite handled by (1) step is put into sensitized solution and is stirred continuously, taken after 15min
Out and spend that Ion Cleaning is clean, and room temperature is dried.Sensitized solution proportion are as follows: SnCl2, 20g/L；The HCl of 37wt%, 40mL/L；
Remaining as deionized water.Crystalline flake graphite after sensitization is put into activated solution and is stirred continuously, taken out after 15min and spend from
Son cleans up, and room temperature is dried.Activated solution proportion are as follows: PdCl2, 0.2g/L；The HCl of 37wt%, 5mL/L；Remaining as go from
Sub- water.
(3) method for using electroless copper, plates metal layer between the flake graphite's surface and graphite linings of layering.By
(1) layering crystalline flake graphite obtained in step is put into constant water bath box, the plating solution needed for electroless copper in water bath.Electroless Cu Plating
Solution formula are as follows: cupric sulfate pentahydrate, 16g/L；Disodium ethylene diamine tetraacetate, 25g/L；Sodium potassium tartrate tetrahydrate, 20g/L；Formalin,
13mL/L remaining be deionized water.Constant water bath box is heated to 35 DEG C, keeps the temperature 10 minutes, the NaOH of 50wt.% is then added
Solution adjusts solution ph to 13.5~14, keeps the temperature 30min and is stirred continuously.Crystalline flake graphite is taken out after having reacted, and is put at once
Enter ultrasonic cleaning in ethanol solution, dried in drying box, obtains folder metallic copper crystalline flake graphite.
(4) mixing: 9g is taken to press from both sides metallic copper crystalline flake graphite, 2g alumina particle and 89g bronze powder are put into mixing tank and obtain
Mixed-powder.The agent of 0.2ml mixing is added in mixing tank.Mixing tank is packed into mixing 4h on three-dimensional oscillating batch mixer, batch mixer
Velocity of rotation is 400r/min, obtains composite powder after mixing is complete.
(5) cold moudling: it is by composite powder loading internal diameterStainless steel mould in, be cold-pressed under hydraulic press
Molding.Cold pressing pressure is 500MPa, dwell time 30s.Molding sample is obtained after cold moudling.
(6) hot pressed sintering: the sample after cold moudling, which is packed into internal diameter, isGraphite jig in, in Vacuum Heat
Hot pressed sintering is carried out in pressure furnace.Vacuum degree is 10 in furnace-2Pa, heating rate is 20 DEG C/min in furnace, is warming up to 400 DEG C of heat preservations
2h, mixing agent can all volatilize from sample.It is continuously heating to 900 DEG C to keep the temperature and pressurize, wherein pressure is 2~3MPa, heat preservation
Time is 1h.After soaking time, power off, unloading pressure, to in-furnace temperature be down to 100 DEG C hereinafter, by hot pressing piece from
It is taken out in vacuum hotpressing stove, removes mold, obtain folder metallic copper crystalline flake graphite enhancing Cu-base composites.
Embodiment 4
Present embodiment discloses a kind of metallic copper crystalline flake graphites that presss from both sides to enhance the preparation method of Cu-base composites, including following
Step:
(1) under room temperature environment, by 5ml perchloric acid and 1ml phosphoric acid be put into glass beaker be uniformly mixed obtain mixed acid,
0.4g potassium permanganate is added, is slowly stirred, is dissolved in it in mixed acid, being eventually adding 4g crystalline flake graphite and being sufficiently stirred makes it
It is uniformly mixed.Perchloric acid, phosphoric acid will be housed, the glass beaker of potassium permanganate and crystalline flake graphite is placed into the constant temperature that water temperature is 40 DEG C
60min is reacted in water bath, should be stirred continuously during reaction to guarantee that reaction is uniform.After reaction, repeatedly washing, will precipitate
The crystalline flake graphite to get off filters out and the drying at 60 DEG C.Finally obtained crystalline flake graphite is being put into Muffle furnace, by horse
Not furnace rises to 300 DEG C, keeps the temperature 60s.Turn off Muffle furnace power supply, is down to 100 DEG C hereinafter, by crystalline flake graphite from Muffle to in-furnace temperature
It is taken out in furnace furnace, the crystalline flake graphite being layered.
(2) crystalline flake graphite handled by (1) step is put into sensitized solution and is stirred continuously, taken after 15min
Out and spend that Ion Cleaning is clean, and room temperature is dried.Sensitized solution proportion are as follows: SnCl2, 20g/L；The HCl of 37wt%, 40mL/L；
Remaining as deionized water.Crystalline flake graphite after sensitization is put into activated solution and is stirred continuously, taken out after 15min and spend from
Son cleans up, and room temperature is dried.Activated solution proportion are as follows: PdCl2, 0.2g/L；The HCl of 37wt%, 5mL/L；Remaining as go from
Sub- water.
(3) method for using electroless copper, plates metal layer between the flake graphite's surface and graphite linings of layering.By
(1) layering crystalline flake graphite obtained in step is put into constant water bath box, the plating solution needed for electroless copper in water bath.Electroless Cu Plating
Solution formula are as follows: cupric sulfate pentahydrate, 16g/L；Disodium ethylene diamine tetraacetate, 25g/L；Sodium potassium tartrate tetrahydrate, 20g/L；Formalin,
13mL/L remaining be deionized water.Constant water bath box is heated to 35 DEG C, keeps the temperature 10 minutes, the NaOH of 50wt.% is then added
Solution adjusts solution ph to 13.5~14, keeps the temperature 30min and is stirred continuously.Crystalline flake graphite is taken out after having reacted, and is put at once
Enter ultrasonic cleaning in ethanol solution, dried in drying box, obtains folder metallic copper crystalline flake graphite.
(4) mixing: 9g is taken to press from both sides metallic copper crystalline flake graphite, 1g silica dioxide granule, 1g alumina particle and 89g electrolytic copper powder
It is put into mixing tank and obtains mixed-powder.The agent of 0.2ml mixing is added in mixing tank.Mixing tank is packed into three-dimensional oscillating batch mixer
Upper mixing 4h, batch mixer velocity of rotation are 400r/min, obtain composite powder after mixing is complete.
(5) cold moudling: it is by composite powder loading internal diameterStainless steel mould in, be cold-pressed under hydraulic press
Molding.Cold pressing pressure is 500MPa, dwell time 30s.Molding sample is obtained after cold moudling.
(6) hot pressed sintering: the sample after cold moudling, which is packed into internal diameter, isGraphite jig in, in Vacuum Heat
Hot pressed sintering is carried out in pressure furnace.Vacuum degree is 10 in furnace-2Pa, heating rate is 20 DEG C/min in furnace, is warming up to 400 DEG C of heat preservations
2h, mixing agent can all volatilize from sample.It is continuously heating to 900 DEG C to keep the temperature and pressurize, wherein pressure is 2~3MPa, heat preservation
Time is 1h.After soaking time, power off, unloading pressure, to in-furnace temperature be down to 100 DEG C hereinafter, by hot pressing piece from
It is taken out in vacuum hotpressing stove, removes mold, obtain folder metallic copper crystalline flake graphite enhancing Cu-base composites.
Comparative example 1
(1) mixing: take 6.6g without the crystalline flake graphite that (1), (2), (3) step are handled in embodiment 1,2g SiO2
Grain and 91.4g electrolytic copper powder, which are put into mixing tank, obtains mixed-powder.The agent of 0.2ml mixing is added in mixing tank.By mixing tank
It is packed into mixing 4h on three-dimensional oscillating batch mixer, batch mixer velocity of rotation is 400r/min, obtains composite powder after mixing is complete.It takes
6.6g is that treated that weight is because 6.6g crystalline flake graphite is by folder metallic copper without the crystalline flake graphite of folder metal Copper treatment
10g。
(2) cold moudling: it is by composite powder loading internal diameterStainless steel mould in, be cold-pressed under hydraulic press
Molding.Cold pressing pressure is 500MPa, dwell time 30s.Molding sample is obtained after cold moudling.
(3) hot pressed sintering: the sample after cold moudling, which is packed into internal diameter, isGraphite jig in, in Vacuum Heat
Hot pressed sintering is carried out in pressure furnace.Vacuum degree is 10 in furnace-2Pa, heating rate is 20 DEG C/min in furnace, is warming up to 400 DEG C of heat preservations
2h, mixing agent can all volatilize from sample.It is continuously heating to 900 DEG C to keep the temperature and pressurize, wherein pressure is 2~3MPa, heat preservation
Time is 1h.After soaking time, power off, unloading pressure, to in-furnace temperature be down to 100 DEG C hereinafter, by hot pressing piece from
It is taken out in vacuum hotpressing stove, removes mold, obtain crystalline flake graphite enhancing Cu-base composites.Crystalline flake graphite and copper in composite material
Interface cohesion situation and interface cohesion schematic diagram are as shown in Fig. 6 a and d.
Comparative example 2
(1) it takes the crystalline flake graphite handled without (1) step in embodiment 1 to be put into sensitized solution and is stirred continuously,
It is taken out after 15min and spends that Ion Cleaning is clean, and room temperature is dried.Sensitized solution proportion are as follows: SnCl2, 20g/L；37wt%'s
HCl, 40mL/L；Remaining as deionized water.Crystalline flake graphite after sensitization is put into activated solution and is stirred continuously, after 15min
It takes out and spends that Ion Cleaning is clean, and room temperature is dried.Activated solution proportion are as follows: PdCl2, 0.2g/L；The HCl of 37wt%, 5mL/
L；Remaining as deionized water.
(2) method for using electroless copper plates metal layer in the flake graphite's surface by the processing of (1) step.By
(1) layering crystalline flake graphite obtained in step is put into constant water bath box, the plating solution needed for electroless copper in water bath.Electroless Cu Plating
Solution formula are as follows: cupric sulfate pentahydrate, 16g/L；Disodium ethylene diamine tetraacetate, 25g/L；Sodium potassium tartrate tetrahydrate, 20g/L；Formalin,
13mL/L remaining be deionized water.Constant water bath box is heated to 35 DEG C, keeps the temperature 10 minutes, the NaOH of 50wt.% is then added
Solution adjusts solution ph to 13.5~14, keeps the temperature 30min and is stirred continuously.Crystalline flake graphite is taken out after having reacted, and is put at once
Enter ultrasonic cleaning in ethanol solution, dried in drying box, obtains copper coating crystalline flake graphite.
(3) 9.2g copper coating crystalline flake graphite, 2g SiO mixing: are taken2Particle and 91.4g electrolytic copper powder are put into mixing tank
Obtain mixed-powder.The agent of 0.2ml mixing is added in mixing tank.Mixing tank is packed into mixing 4h on three-dimensional oscillating batch mixer, is mixed
Material machine velocity of rotation is 400r/min, obtains composite powder after mixing is complete.9.2g copper coating crystalline flake graphite is taken, is because of 6.6g
Weight is 9.2g after flake graphite's surface copper facing, and 6.6g crystalline flake graphite is 10g by folder metallic copper treated weight.
(4) cold moudling: it is by composite powder loading internal diameterStainless steel mould in, be cold-pressed under hydraulic press
Molding.Cold pressing pressure is 500MPa, dwell time 30s.Molding sample is obtained after cold moudling.
(5) hot pressed sintering: the sample after cold moudling, which is packed into internal diameter, isGraphite jig in, in Vacuum Heat
Hot pressed sintering is carried out in pressure furnace.Vacuum degree is 10 in furnace-2Pa, heating rate is 20 DEG C/min in furnace, is warming up to 400 DEG C of heat preservations
2h, mixing agent can all volatilize from sample.It is continuously heating to 900 DEG C to keep the temperature and pressurize, wherein pressure is 2~3MPa, heat preservation
Time is 1h.After soaking time, power off, unloading pressure, to in-furnace temperature be down to 100 DEG C hereinafter, by hot pressing piece from
It is taken out in vacuum hotpressing stove, removes mold, obtain copper coating crystalline flake graphite enhancing Cu-base composites.Scale stone in composite material
The interface cohesion situation and interface cohesion schematic diagram of Mo Yutong is as shown in Fig. 6 b and e.
To above-described embodiment 1, the relative density of Cu-base composites prepared by comparative example 1 and comparative example 2, Brinell hardness,
Compressive strength, coefficient of friction and wear rate are tested, and result is as shown in table 1 below.As can be seen from Table 1, metallic copper is pressed from both sides
Crystalline flake graphite, which enhances Cu-base composites, has highest relative density, Brinell hardness, compressive strength and coefficient of friction, has simultaneously
There is minimum wear rate.
1 embodiment 1 of table, the test result of the Cu-base composites of comparative example 1-2 preparation
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (10)
1. a kind of folder metallic copper crystalline flake graphite enhances Cu-base composites, which is characterized in that by the hard particles of 1~20wt%, 5
It is prepared after the folder metallic copper crystalline flake graphite of~30wt% and the copper powder molding of surplus through hot pressed sintering；
Wherein, the hard particles are selected from SiC particulate, B4C particle, TiC particle, A12O3Particle, SiO2Particle, Si3N4Particle and
One or more of AlN particle；
It is described folder metallic copper crystalline flake graphite the preparation method comprises the following steps:
Layering crystalline flake graphite is successively sensitized and is activated, so that the surface of crystalline flake graphite and one layer of Inter layer adsorption reduction
Property colloid, and on the reproducibility colloid formed forming core site；And
Using chemical plating method it is described layering crystalline flake graphite surface and interlayer plating metal layers of copper to get arrive the folder metal
Copper crystalline flake graphite.
2. folder metallic copper crystalline flake graphite enhances Cu-base composites as described in claim 1, which is characterized in that the copper powder choosing
From one or more of atomized copper powder, electrolytic copper powder, cupric oxide powder, red copper powder, bronze powder and brass powder.
3. folder metallic copper crystalline flake graphite enhances Cu-base composites as described in claim 1, which is characterized in that the folder metal
The size of copper crystalline flake graphite is 100~300 μm.
4. folder metallic copper crystalline flake graphite enhances Cu-base composites as described in claim 1, which is characterized in that the layering squama
Piece graphite is prepared through following steps:
Natural flake graphite is uniformly mixed with mixed acid, intercalator, is stirred to react 1~2h at 30~40 DEG C；Reaction terminates
Afterwards, will be dry after natural flake graphite washing, filtering, 1~2min is kept the temperature at 300~400 DEG C to get the layering is arrived
Crystalline flake graphite.
5. folder metallic copper crystalline flake graphite enhances Cu-base composites as claimed in claim 4, which is characterized in that the mixed acid
It is mixed by perchloric acid and phosphoric acid, the volume ratio of the two is 3~6:0.5~1.5；The intercalator is potassium permanganate.
6. folder metallic copper crystalline flake graphite enhances Cu-base composites as claimed in claim 5, which is characterized in that the mixing
The content ratio of acid, potassium permanganate and natural flake graphite is (3.5~7.5ml): (0.2~0.6g): (3~5g).
7. folder metallic copper crystalline flake graphite enhances Cu-base composites as described in claim 1, which is characterized in that sensitized solution
Formula are as follows: SnCl2, 20~30g/L；The HCl of 37wt.%, 30~50mL/L；Remaining as deionized water；
The formula of activated solution are as follows: PdCl2, 0.1~0.3g/L；The HCl of 37wt.%, 3~6mL/L；Remaining as deionized water.
8. folder metallic copper crystalline flake graphite enhances Cu-base composites as described in claim 1, which is characterized in that
The formula of Electroless Cu Plating solution are as follows: cupric sulfate pentahydrate, 14~18g/L；Disodium ethylene diamine tetraacetate, 20~30g/L；Winestone
Sour potassium sodium, 15~25g/L；Formalin, 12~16mL/L；Remaining is deionized water；PH adjusting agent is that the NaOH of 50wt.% is molten
Liquid, adjusting solution ph is 13.5~14；Electroless Cu Plating temperature is 30~45 DEG C.
9. the preparation method of described in any item folder metallic copper crystalline flake graphite enhancing copper-based materials according to claim 1~8, special
Sign is, comprising the following steps:
The hard particles, folder metallic copper crystalline flake graphite and copper powder for taking formula ratio, are added the mixing agent of 0.2~0.5wt.%, mixing
Uniformly, composite powder is obtained；
By the composite powder cold moudling, the pressure of cold pressing is 450~550MPa, and the dwell time is 30~60s；And it will be cold
Green body after molded carries out hot pressed sintering, is first warming up to 380~420 DEG C, keeps the temperature 2~2.5h, mixing agent is made to volatilize completely；Again
880~920 DEG C are warming up to, keeping the temperature 1~1.5h to get to the folder metallic copper crystalline flake graphite enhances copper-based material；Wherein in furnace
Vacuum degree is 10-2Pa, pressure are 2~3Mpa, and heating rate is 15~20 DEG C/min.
10. folder metallic copper crystalline flake graphite according to any one of claims 1 to 8 enhances copper-based material answering in friction material
With.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910730201.XA CN110453101B (en) | 2019-08-08 | 2019-08-08 | Metal-copper-flake-sandwiched graphite reinforced copper-based composite material and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910730201.XA CN110453101B (en) | 2019-08-08 | 2019-08-08 | Metal-copper-flake-sandwiched graphite reinforced copper-based composite material and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110453101A true CN110453101A (en) | 2019-11-15 |
| CN110453101B CN110453101B (en) | 2020-09-01 |
Family
ID=68485428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910730201.XA Active CN110453101B (en) | 2019-08-08 | 2019-08-08 | Metal-copper-flake-sandwiched graphite reinforced copper-based composite material and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110453101B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111876627A (en) * | 2020-08-05 | 2020-11-03 | 福建臻璟新材料科技有限公司 | Composite material containing aluminum nitride powder and preparation method thereof |
| CN113073217A (en) * | 2021-03-10 | 2021-07-06 | 宁波金田铜业(集团)股份有限公司 | Grain refiner and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100207055A1 (en) * | 2007-10-18 | 2010-08-19 | Shimane Prefectural Government | Metal-graphite composite material having high thermal conductivity and production method therefor |
| CN101982552A (en) * | 2010-10-21 | 2011-03-02 | 哈尔滨工业大学 | Copper coated graphite and nano-silicon carbide mixed reinforced copper-based composite material and preparation method thereof |
| CN103924119A (en) * | 2014-04-23 | 2014-07-16 | 北京科技大学 | Ultrahigh heat conduction graphite flake/copper composite material and preparation method thereof |
| CN106521230A (en) * | 2016-12-06 | 2017-03-22 | 湖南科技大学 | Graphite flake/copper composite material used for vertical directional heat dissipation, and preparation method thereof |
| JP2019026884A (en) * | 2017-07-28 | 2019-02-21 | 昭和電工株式会社 | Metal-carbon particle composite |
| CN109676130A (en) * | 2019-01-24 | 2019-04-26 | 西安交通大学 | A kind of preparation method of the modified copper-base graphite wearable hydraulic plunger pump cylinder body of copper |
-
2019
- 2019-08-08 CN CN201910730201.XA patent/CN110453101B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100207055A1 (en) * | 2007-10-18 | 2010-08-19 | Shimane Prefectural Government | Metal-graphite composite material having high thermal conductivity and production method therefor |
| CN101982552A (en) * | 2010-10-21 | 2011-03-02 | 哈尔滨工业大学 | Copper coated graphite and nano-silicon carbide mixed reinforced copper-based composite material and preparation method thereof |
| CN103924119A (en) * | 2014-04-23 | 2014-07-16 | 北京科技大学 | Ultrahigh heat conduction graphite flake/copper composite material and preparation method thereof |
| CN106521230A (en) * | 2016-12-06 | 2017-03-22 | 湖南科技大学 | Graphite flake/copper composite material used for vertical directional heat dissipation, and preparation method thereof |
| JP2019026884A (en) * | 2017-07-28 | 2019-02-21 | 昭和電工株式会社 | Metal-carbon particle composite |
| CN109676130A (en) * | 2019-01-24 | 2019-04-26 | 西安交通大学 | A kind of preparation method of the modified copper-base graphite wearable hydraulic plunger pump cylinder body of copper |
Non-Patent Citations (2)
| Title |
|---|
| QIAN LIU ET AL.: "Effects of morphological characteristics of graphite fillers on the thermal conductivity of the graphite/copper composites fabricated by vacuum hot pressing sintering", 《VACUUM》 * |
| QIAN LIU ET AL.: "Thermophysical properties and microstructure of graphite flake/copper composites processed by electroless copper coating", 《JOURNAL OF ALLOYS AND COMPOUNDS》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111876627A (en) * | 2020-08-05 | 2020-11-03 | 福建臻璟新材料科技有限公司 | Composite material containing aluminum nitride powder and preparation method thereof |
| CN113073217A (en) * | 2021-03-10 | 2021-07-06 | 宁波金田铜业(集团)股份有限公司 | Grain refiner and application thereof |
| CN113073217B (en) * | 2021-03-10 | 2022-06-03 | 宁波金田铜业(集团)股份有限公司 | Grain refiner and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110453101B (en) | 2020-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101962760B (en) | Method for performing electroless nickel plating on surface of aluminum nitride ceramic | |
| CN101982552B (en) | Preparation method of copper coated graphite and nano-silicon carbide mixed reinforced copper-based composite material | |
| CN110453101A (en) | Press from both sides metallic copper crystalline flake graphite enhancing Cu-base composites and its preparation method and application | |
| CN104388847A (en) | Carbon fiber reinforced copper-based composite material and preparation method thereof | |
| CN108930006A (en) | A kind of copper facing chopped carbon fiber enhancing copper/graphite composite material and preparation method thereof | |
| CN108893637A (en) | A kind of preparation method of copper-tungsten doped graphene | |
| CN102925731A (en) | Powder metallurgy preparation method for improving performance of copper alloy graphite composite material | |
| CN114507510B (en) | Copper foam-graphene-expanded graphite-graphite composite heat dissipation material and preparation method thereof | |
| CN109680227A (en) | A kind of preparation method of the aluminum-based boron carbide neutron shielding material of fibre reinforced | |
| CN106544656B (en) | Modified carbon fiber and its preparation and application of the one kind containing Ni-P-SiC (titanium diboride) composite deposite | |
| CN114393524B (en) | High-hardness brazing diamond grinding wheel and machining process thereof | |
| CN104018019A (en) | ZrB2/Cu composite material preparation method | |
| CN106334787B (en) | A kind of gradient graphite/aluminium base surface layer self-lubricating composite and preparation method | |
| CN101591741A (en) | A kind of is the ceramic matric composite and the metal phase adding method thereof of metallographic phase with the copper alloy | |
| CN109676126A (en) | A kind of preparation method of copper-base graphite wear-resistant engine bearing shell | |
| CN109807331B (en) | Preparation method of copper-based graphite self-lubricating turnout slide plate | |
| CN112063880A (en) | Copper-based powder metallurgy pantograph sliding plate material for monorail car and preparation method thereof | |
| CN107739869A (en) | Nanoporous carbon/carbon-copper composite material and preparation method thereof | |
| CN114833338B (en) | Electroless plating NiMo modified TiB 2 TiC particle reinforced high manganese steel base composite material and preparation method thereof | |
| CN107671279B (en) | Tungsten copper silver carbon system composite material and preparation method | |
| CN114032411B (en) | C/Cu composite material pantograph slide plate and preparation method thereof | |
| CN109400030A (en) | High temperature resistant geo-polymer based composites and preparation method thereof for brake block | |
| CN109750283A (en) | A kind of process of SMC material chemical plating nickel-phosphorus alloy on surface | |
| CN113816652A (en) | Fiber-reinforced thermosetting polyimide-based composite friction material and preparation method thereof | |
| CN113355670A (en) | Amorphous composite coating and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ran Xu Inventor after: Zou Haohao Inventor after: Zhu Weiwei Inventor after: War Si Qi Inventor before: Zou Haohao Inventor before: Ran Xu Inventor before: Zhu Weiwei Inventor before: War Si Qi |