CN110434043B - Substrate with super-hydrophobic/super-low adhesion surface and preparation method thereof - Google Patents

Substrate with super-hydrophobic/super-low adhesion surface and preparation method thereof Download PDF

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CN110434043B
CN110434043B CN201910724219.9A CN201910724219A CN110434043B CN 110434043 B CN110434043 B CN 110434043B CN 201910724219 A CN201910724219 A CN 201910724219A CN 110434043 B CN110434043 B CN 110434043B
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hydrophobic
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CN110434043A (en
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李国强
何旭尧
赖旭伟
杨益
蔡勇
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Southwest University of Science and Technology
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment

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Abstract

The invention discloses a substrate with a super-hydrophobic/super-low adhesion surface.A pit array and a flocculent structure are constructed on the surface of the substrate, and air is filled between the pit array and the flocculent structure on the surface of the substrate; the surface of the matrix is modified by a low surface energy substance, so that the surface of the matrix has super-hydrophobic/super-low adhesion, and the functions of self-cleaning, anti-fog, anti-icing and self-water-driving of the surface of the matrix are realized. The substrate with the super-hydrophobic/super-low adhesion surface and the preparation method thereof have the advantages of simple and controllable manufacturing process and wide applicable material range.

Description

Substrate with super-hydrophobic/super-low adhesion surface and preparation method thereof
Technical Field
The invention relates to a substrate with a super-hydrophobic/super-low adhesion surface and a preparation method thereof, belonging to the technical field of material surface treatment.
Background
By superhydrophobic/ultra-low adhesion surface is meant a substrate surface with a static contact angle greater than 150 ° and a sliding angle less than 10 °. The substrate with the super-hydrophobic/super-low adhesion surface can realize different functions, such as self-cleaning, anti-icing, anti-fog, self-driving water, anti-biological adhesion and the like, and has important application value in many fields.
With the development of processing technology and the progress of composite materials, more and more attention is paid to processing and modifying the surface of a matrix to have super-hydrophobic/ultra-low adhesion properties and obtain corresponding functions. The conventional methods for processing and modifying the micro-nano structure on the surface of the substrate mainly comprise surface spraying, chemical etching and the like. The processing steps of the processing means are complicated, and the controllability is poor; the range of the machinable materials is narrow, and the obtained materials have single function and poor durability; especially for transparent materials, how to realize super-hydrophobic/ultra-low adhesion performance on the basis of ensuring high light transmission performance of the material is difficult to realize.
Disclosure of Invention
The invention aims to: aiming at the problems of complicated and uncontrollable preparation process, poor durability, narrow applicable material range, single function of the prepared surface and the like, the invention provides the substrate with the super-hydrophobic/ultra-low adhesion surface and the preparation method thereof.
The technical scheme adopted by the invention is as follows:
a pit array is constructed on the surface of a substrate, and the surface of the substrate is modified by a low-surface-energy substance, so that the surface of the substrate has super-hydrophobic/super-low adhesion, and the functions of self-cleaning, anti-fog, anti-icing and self-water-expelling of the surface of the substrate are realized.
In the scheme, a pit array is constructed on the surface of the substrate, and pits which are densely and uniformly distributed are formed on the surface of the substrate; modifying the surface of the substrate by a low-surface-energy substance so as to enable the surface of the substrate to have extremely low surface energy; therefore, when the liquid drop is contacted with the surface of the substrate, the relative contact area of the liquid drop and the substrate is reduced due to the air filled between the pit arrays, and the liquid drop is in an ultra-hydrophobic low-adhesion state on the surface of the substrate due to the lower surface energy of the surface of the substrate.
Preferably, the pits are micron-sized circular pits, and are uniformly distributed on the surface of the substrate in a polygonal array, and the uniformly distributed polygonal array enables the surface of the substrate to have uniform roughness.
Preferably, the pit pitch is 18 to 30 μm, and the pit area is 55 to 120 μm2The depth of the pits is 0.5-10 μm.
Preferably, the surface of the substrate is also constructed with a raised flocculent structure.
In the scheme, the raised flocculent structure is constructed on the surface of the substrate, so that the roughness of the surface of the substrate can be increased, and the air filling amount of the surface of the substrate can be increased, thereby further reducing the relative contact area between the liquid drop and the surface of the substrate.
Preferably, the flocculent structures are nanoscale flocculent structures and are randomly distributed on the surface of the substrate.
Preferably, the flocculent structure has a length of 50-500nm, a width of 50-200nm, and a height of 50-200 nm.
Preferably, the substrate is made of one of aluminum, titanium, copper, alloy, ordinary glass, quartz glass, silicon wafer, polymethyl methacrylate, and the like.
Preferably, the surface of the substrate is modified with low surface energy by using a fluorosilane solution.
In the scheme, the fluorosilane can effectively reduce the surface energy of the surface of the substrate, so that the surface tension difference between the liquid and the surface of the substrate is larger, the liquid forms a sphere under the action of the surface tension of the liquid, and the static contact angle between the liquid and the surface of the substrate is increased.
Preferably, the fluorosilane solution is a mixed solution of fluorosilane and absolute ethyl alcohol, and the mass ratio of the fluorosilane to the absolute ethyl alcohol is 1:80-1: 40.
In the scheme, the fluorosilane solution with proper concentration can modify the surface of the matrix more uniformly, so that the surface of the matrix surface can be uniform; too high a concentration may result in uneven modification of the surface of the substrate with low surface energy, and too low a concentration may result in poor modification of the surface of the substrate with low surface energy.
Preferably, the fluorosilane is 1H,1H,2H, 2H-perfluorodecyltriethoxysilane.
In the scheme, 1H,1H,2H, 2H-perfluorodecyl triethoxysilane is a modifier with good performance and low surface energy.
The preparation method of the substrate with the super-hydrophobic/super-low adhesion surface comprises the following steps:
step a: cleaning the substrate, and drying after cleaning to obtain a substrate with a clean surface;
step b: constructing a pit array on the surface of a substrate by using laser to obtain the substrate with pits and a flocculent structure distributed on the surface;
step c: cleaning the constructed substrate again, and drying after cleaning;
step d: and c, soaking the matrix obtained in the step c into a low-surface-energy substance solution, taking out and drying to obtain the matrix with the super-hydrophobic/super-low adhesive surface.
In the scheme, the surface of the substrate is cleaned firstly, so that the surface of the substrate is clean, and the super-hydrophobic/super-low adhesion effect of the surface of the substrate is prevented from being influenced by impurities to cause uneven pits when the pits are constructed; and the surface energy of the substrate is ensured to be uniform by carrying out low surface energy treatment after cleaning, so that the phenomenon that the surface energy of the substrate is not uniform due to impurities and the super-hydrophobic/super-low adhesion effect of the surface of the substrate is influenced is avoided.
In the scheme, substances sputtered when the pit array is constructed by the laser in the step b are accumulated on the surface of the substrate so as to form a nano flocculent structure which is randomly distributed.
Preferably, in the step b, the incidence direction of the laser beam of the laser is perpendicular to the surface of the substrate, and the laser beam scans the surface of the substrate in parallel; the diameter of a light spot of the laser is 15-25 mu m, the pulse energy is 10-30mW, the scanning speed is 22-42mm/s, and the distance between scanning lines is 15.6-26 mu m.
Preferably, in step a and step c, the cleaning is ultrasonic cleaning.
Preferably, in the step a and the step c, the drying treatment is drying in a vacuum drying oven at 80-120 ℃ for 8-12 min.
Preferably, in the step d, the soaking is carried out in fluorosilane solution at 60-80 ℃ for 120-180 min; the drying treatment is drying in a vacuum drying oven at 80-120 deg.C for 50-70 min.
In the scheme, the low surface energy modification of the surface of the substrate can be better and faster completed by soaking the substrate in fluorosilane solution at the temperature of 60-80 ℃.
According to the substrate with the super-hydrophobic/ultra-low adhesion surface, the surface of the substrate is provided with the micron-sized pits distributed in a polygonal array and the nano-sized flocculent structures distributed randomly, and the surface of the substrate is modified by the low-surface-energy substance solution, so that the surface of the substrate has extremely low surface energy; therefore, when the liquid drop is contacted with the surface of the substrate, the relative contact area of the liquid drop and the substrate is reduced because a large amount of air is filled between the pit array and the flocculent structure, and the liquid drop is in a super-hydrophobic low-adhesion state on the surface of the substrate because of the lower surface energy of the surface of the substrate.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that: according to the matrix with the super-hydrophobic/ultralow-adhesion surface and the preparation method thereof, the surface of the matrix has super-hydrophobic/ultralow-adhesion performance, so that the functions of anti-icing, anti-fogging, self-water-driving, self-cleaning and the like are realized; when the transparent matrix is prepared by the preparation method provided by the invention, the surface of the transparent matrix has super-hydrophobic/ultra-low adhesion performance while the optical performance of the transparent matrix is ensured. The preparation method disclosed by the invention is simple in preparation steps, accurate and controllable in preparation process, strong in surface durability of the prepared material, wide in applicable substrate range, and especially suitable for preparing the substrate with the super-hydrophobic/ultra-low adhesion surface with optical performance requirements.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of a substrate having a superhydrophobic/ultra-low adhesion surface according to the present invention.
FIG. 2 is a schematic cross-sectional view of a well of a substrate having a superhydrophobic/ultra-low adhesion surface according to the present invention.
FIG. 3 is a schematic diagram of a pit array of a substrate having a superhydrophobic/ultra-low adhesion surface according to the present invention.
FIG. 4 is an electron microscope image of pits and flocculent structures on the surface of a substrate with a super-hydrophobic/super-low adhesion surface according to the present invention.
FIG. 5 is a surface electron micrograph of a substrate having a superhydrophobic/ultra-low adhesion surface according to the present invention.
FIG. 6 is a schematic representation of the surface static contact angle of a substrate having an ultrahydrophobic/ultralow adhesion surface according to the present invention.
FIG. 7 is a schematic representation of the surface roll angle of a substrate having a superhydrophobic/ultra-low adhesion surface of the invention.
FIG. 8 is a schematic diagram of high light transmission for a substrate with a superhydrophobic/ultra-low adhesion surface of the invention.
FIG. 9 is a comparative illustration of the surface self-cleaning function of a substrate having a superhydrophobic/ultra-low adhesion surface of the present invention.
FIG. 10 is a schematic illustration of the surface anti-icing function of a substrate having a superhydrophobic/ultra-low adhesion surface according to the present invention.
The labels in the figure are: 1-substrate, 2-pit, 3-flocculent substance and 4-pit array shape.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Example 1
The substrate with the super-hydrophobic/ultra-low adhesion surface is ordinary glass with the thickness of 2mm, circular pits with a uniformly distributed regular hexagonal array and a random distribution flocculent structure are constructed on the surface of the glass, and the diameter of each pit is 10 micrometers (namely the area of each pit is 78.5 micrometers)2) The maximum depth is 5 mu m, and the pit distance (namely the side length of the regular hexagon array) is 24 mu m; the length of the flocculent structure is 120nm, the width of the flocculent structure is 120nm, and the height of the flocculent structure is 120 nm; the glass surface is modified with low surface energy by using a 1H,1H,2H, 2H-perfluorodecyl triethoxysilane solution, and the 1H,1H,2H, 2H-perfluorodecyl triethoxysilane solution is a mixed solution of 1H,1H,2H, 2H-perfluorodecyl triethoxysilane and absolute ethyl alcohol in a mass ratio of 1: 55.
The preparation method of the substrate with the super-hydrophobic/super-low adhesion surface comprises the following steps:
step a: carrying out ultrasonic cleaning on common glass, and drying the common glass in a vacuum drying oven at 100 ℃ for 10min after cleaning to obtain the common glass with a clean surface;
step b: constructing a regular hexagonal array of circular pits on the surface of the glass by using laser to obtain the glass with the circular pits and a flocculent structure distributed on the surface; the laser beam incidence direction of the laser is vertical to the surface of the glass, and the laser beam scans the surface of the glass in parallel; the diameter of a light spot of the laser is 20 micrometers, the pulse energy is 25mW, the scanning speed is 33mm/s, and the distance between scanning lines is 24 micrometers;
step c: ultrasonically cleaning the constructed glass again, and drying in a vacuum drying oven at 100 ℃ for 10 min;
step d: c, putting the glass obtained in the step c into a fluorosilane solution at 70 ℃ for soaking for 150min, and drying for 60min in a vacuum drying oven at 100 ℃ to obtain the glass with the super-hydrophobic/super-low adhesion surface; the fluorosilane solution is a mixed solution of 1H,1H,2H, 2H-perfluorodecyl triethoxysilane and absolute ethyl alcohol in a mass ratio of 1: 55.
Example 2
In the substrate with the super-hydrophobic/ultra-low adhesion surface of the embodiment, the substrate is a silicon wafer with the thickness of 1mm, square array circular pits with the diameter of 8.4 μm (namely the area of the pits is 55 μm) and random distribution flocculent structures are constructed on the surface of the silicon wafer2) The maximum depth is 0.5 μm, and the pit pitch (namely the side length of the square array) is 18 μm; flocculent structures which are randomly distributed are also constructed on the surface of the silicon chip, the length of each flocculent structure is 50nm, the width of each flocculent structure is 50nm, and the height of each flocculent structure is 50 nm; the surface of the silicon chip is modified by using 1H,1H,2H, 2H-perfluorodecyl triethoxysilane solution with low surface energy, and the 1H,1H,2H, 2H-perfluorodecyl triethoxysilane solution is a mixed solution of 1H,1H,2H, 2H-perfluorodecyl triethoxysilane and absolute ethyl alcohol in a mass ratio of 1: 80.
The preparation method of the substrate with the super-hydrophobic/super-low adhesion surface comprises the following steps:
step a: ultrasonically cleaning a silicon wafer, and drying the cleaned silicon wafer in a vacuum drying oven at 80 ℃ for 12min to obtain a silicon wafer with a clean surface;
step b: constructing a square array of circular pits on the surface of a silicon wafer by using laser to obtain the silicon wafer with the circular pits and a flocculent structure distributed on the surface; the laser beam incidence direction of the laser is vertical to the surface of the silicon wafer, and the laser beam scans the surface of the silicon wafer in parallel; the diameter of a light spot of the laser is 15 micrometers, the pulse energy is 10mW, the scanning speed is 21mm/s, and the distance between scanning lines is 15.6 micrometers;
step c: ultrasonically cleaning the constructed silicon wafer again, and drying in a vacuum drying oven at 80 ℃ for 12 min;
step d: c, soaking the silicon wafer obtained in the step c in a fluorosilane solution at 60 ℃ for 180min, and drying the silicon wafer in a vacuum drying oven at 80 ℃ for 70min to obtain a silicon wafer with an ultra-hydrophobic/ultra-low adhesion surface; the fluorosilane solution is a mixed solution of 1H,1H,2H, 2H-perfluorodecyl triethoxysilane and absolute ethyl alcohol in a mass ratio of 1: 80.
Example 3
The substrate with the super-hydrophobic/ultra-low adhesion surface is an aluminum sheet with the thickness of 2mm, round pits with a uniformly distributed regular hexagonal array and a random distribution flocculent structure are constructed on the surface of the aluminum sheet, and the diameter of each pit is 12.3 mu m (namely the area of each pit is 119 mu m)2) The maximum depth is 10 mu m, and the pit distance (namely the side length of the regular hexagon array) is 30 mu m; the length of the flocculent structure is 200nm, the width of the flocculent structure is 200nm, and the height of the flocculent structure is 200 nm; the surface of the aluminum sheet is modified with low surface energy by using a 1H,1H,2H, 2H-perfluorodecyl triethoxysilane solution, and the 1H,1H,2H, 2H-perfluorodecyl triethoxysilane solution is a mixed solution of 1H,1H,2H, 2H-perfluorodecyl triethoxysilane and absolute ethyl alcohol in a mass ratio of 1: 40.
The preparation method of the substrate with the super-hydrophobic/super-low adhesion surface comprises the following steps:
step a: ultrasonically cleaning an aluminum sheet, and drying the cleaned aluminum sheet in a vacuum drying oven at 120 ℃ for 8min to obtain the aluminum sheet with a clean surface;
step b: constructing a regular hexagonal array of circular pits on an aluminum sheet by using laser to obtain the aluminum sheet with the circular pits and a flocculent structure distributed on the surface; the laser beam incidence direction of the laser is vertical to the surface of the aluminum sheet, and the laser beam scans the surface of the aluminum sheet in parallel; the diameter of a light spot of the laser is 25 micrometers, the pulse energy is 30mW, the scanning speed is 26mm/s, and the distance between scanning lines is 20 micrometers;
step c: ultrasonically cleaning the constructed aluminum sheet again, and drying in a vacuum drying oven at 120 ℃ for 8min after cleaning;
step d: c, placing the aluminum sheet obtained in the step c into a fluorosilane solution at the temperature of 80 ℃ for soaking for 120min, and drying in a vacuum drying oven at the temperature of 120 ℃ for 50min to obtain the aluminum sheet with the super-hydrophobic/super-low adhesion surface; the fluorosilane solution is a mixed solution of 1H,1H,2H, 2H-perfluorodecyl triethoxysilane and absolute ethyl alcohol in a mass ratio of 1: 40.
Comparative example 1
A substrate is made of common glass with a thickness of 2mm, and uniformly distributed regular hexagonal arrays of circular pits with a diameter of 10 μm (i.e. the area of the pits is 78.5 μm) and randomly distributed flocculent structures are formed on the surface of the glass2) The maximum depth is 5 mu m, and the pit distance (namely the side length of the regular hexagon array) is 24 mu m; the flocculent structure has a length of 120nm, a width of 120nm and a height of 120 nm.
The preparation method of the matrix comprises the following steps:
step a: carrying out ultrasonic cleaning on common glass, and drying the common glass in a vacuum drying oven at 100 ℃ for 10min after cleaning to obtain the common glass with a clean surface;
step b: constructing a regular hexagonal array of circular pits on the surface of the glass by using laser to obtain the glass with the circular pits distributed on the surface; the laser beam incidence direction of the laser is vertical to the surface of the glass, and the laser beam scans the surface of the glass in parallel; the pulse energy of the laser is 25mW, the scanning speed is 30mm/s, and the scanning line spacing is 24 μm;
step c: and ultrasonically cleaning the constructed glass again, and drying in a vacuum drying oven at 100 ℃ for 10min after cleaning.
This comparative example differs from example 1 in that the matrix was not subjected to low surface energy modification by a fluorosilane solution.
Comparative example 2
Based on example 1, this comparative example differs from example 1 in that the pit pitch of the glass surface is 50 μm.
Comparative example 3
Based on example 1, this comparative example differs from example 1 in that the pit diameter of the glass surface was 30 μm (i.e., the pit area was 707 μm)2)。
Comparative example 4
Based on example 1, this comparative example differs from example 1 in that the maximum depth of the pits on the glass surface was 20 μm.
Aiming at the above examples and comparative examples, the substrates with super-hydrophobic/super-low adhesion surfaces can be obtained in examples 1-3, and the functions of self-cleaning, anti-fog, anti-icing and self-water-driving of the substrate surfaces are realized; comparative examples 1 to 4 all had superhydrophobic/ultralow adhesive properties when different, and the substrate surface had no functions of self-cleaning, anti-fogging, anti-icing and self-water-expelling.
FIG. 4 is an electron micrograph of pits and a flocculent structure on the surface of example 1.
FIG. 5 is a SEM image of the dimple array of the surface of example 1.
FIG. 6 is a schematic diagram of the surface static contact angle of example 1 after the preparation is completed for 32 days and the functional test is performed 16 times, and the surface static contact angle is 163.789 degrees, namely the surface of the substrate has super-hydrophobic property.
FIG. 7 is a schematic diagram showing the rolling angle of the surface of example 1 after 32 days of preparation and 16 functional tests, wherein the rolling angle is 2 degrees, that is, the surface of the substrate has ultra-low adhesion property.
FIG. 8 is a schematic diagram of high surface transmittance of example 1, and it can be seen that the original optical properties of the matrix are not changed after the superhydrophobic/ultralow adhesive surface treatment.
FIG. 9 is a schematic diagram showing the self-cleaning function of the surface of example 1, wherein the left side shows the untreated substrate and the right side shows the substrate with the superhydrophobic/ultra-low adhesion surface treatment, it can be seen that the surface of the substrate with the superhydrophobic/ultra-low adhesion surface treatment has self-cleaning property compared to the untreated substrate surface.
FIG. 10 is a schematic view of the anti-icing function of the surface of example 1, in which the upper row is a schematic view of ordinary glass, the lower row is a schematic view of glass with an ultra-hydrophobic/ultra-low adhesion surface, the first column is a schematic view of an initial state, the second column is a schematic view of the onset of icing, and the third column is a schematic view of complete icing (ordinary glass surface beads begin to ice for 51 seconds, complete icing for 73 seconds; glass surface beads with an ultra-hydrophobic/ultra-low adhesion surface begin to ice for 2817 seconds, complete icing for 3440 seconds); compared with the untreated matrix surface, the matrix surface treated by the super-hydrophobic/super-low adhesion surface has greatly delayed icing time in the same environment, and has excellent anti-icing function.
In conclusion, by adopting the substrate with the super-hydrophobic/ultralow-adhesion surface and the preparation method thereof, the surface of the substrate has super-hydrophobic/ultralow-adhesion performance, so that the functions of anti-icing, anti-fogging, self-water-driving, self-cleaning and the like are realized; when the transparent matrix is prepared by the preparation method provided by the invention, the surface of the transparent matrix has super-hydrophobic/ultra-low adhesion performance while the optical performance of the transparent matrix is ensured. The preparation method disclosed by the invention is simple in preparation steps, accurate and controllable in preparation process, strong in surface durability of the prepared material, wide in applicable substrate range, and especially suitable for preparing the substrate with the super-hydrophobic/ultra-low adhesion surface with optical performance requirements.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.

Claims (5)

1. A substrate having a superhydrophobic/ultralow adhesion surface, comprising: a pit array is constructed on the surface of a base body, a raised flocculent structure is also constructed on the surface of the base body, the flocculent structure is constructed by laser, and the surface of the base body is modified by a low surface energy substance, so that the surface of the base body has super-hydrophobic/super-low adhesion, and the functions of self-cleaning, anti-fog, anti-icing and self-water-driving of the surface of the base body are realized;
the pits are micron-sized circular pits and are uniformly distributed in a regular hexagonal array on the surface of the substrate;
the distance between the pits is 18-30 μm, and the area of the pits is 55-120 μm2The depth of the pit is 0.5-10 μm;
the flocculent structures are nanoscale flocculent structures and are randomly distributed on the surface of the substrate;
the flocculent structure has a length of 50-500nm, a width of 50-200nm and a height of 50-200 nm.
2. The substrate having a superhydrophobic/ultralow adhesion surface of claim 1, wherein: and the surface of the matrix is modified by using fluorosilane solution with low surface energy.
3. The substrate having a superhydrophobic/ultralow adhesion surface of claim 2, wherein: the fluorosilane solution is a mixed solution of fluorosilane and absolute ethyl alcohol, and the mass ratio of the fluorosilane to the absolute ethyl alcohol is 1:80-1: 40.
4. The substrate having a superhydrophobic/ultralow adhesion surface of claim 3, wherein: the fluorosilane is 1H,1H,2H, 2H-perfluorodecyl triethoxysilane.
5. Method for the preparation of a substrate with a superhydrophobic/ultralow adhesion surface according to any of the claims from 1 to 4, characterized in that: the method comprises the following steps:
step a: cleaning the substrate, and drying after cleaning to obtain a substrate with a clean surface;
step b: constructing a pit array on the surface of a substrate by using laser to obtain the substrate with pits and a flocculent structure distributed on the surface;
step c: cleaning the constructed substrate again, and drying after cleaning;
step d: and c, soaking the matrix obtained in the step c into a low-surface-energy substance solution, taking out and drying to obtain the matrix with the super-hydrophobic/super-low adhesive surface.
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