CN110431394A - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN110431394A CN110431394A CN201880017644.8A CN201880017644A CN110431394A CN 110431394 A CN110431394 A CN 110431394A CN 201880017644 A CN201880017644 A CN 201880017644A CN 110431394 A CN110431394 A CN 110431394A
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- shell
- face
- clad
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- terminal board
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
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- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The lower end surface (24TS) of the base end part (24PE) of terminal board (24) in pressure sensor has the upper surface (12TS) relative to shell (12) into the inclined surface of scheduled angle, and the gap being formed between the inclined surface of lower end surface (24TS) and the upper surface (12TS) of shell (12) becomes larger with the inner peripheral surface (12IS (intersection 12EP)) far from shell (12).
Description
Technical field
The present invention relates to pressure sensors.
Background technique
The sensor unit for being built in the semiconductor pressure sensor of liquid blocking type is for example as shown in Patent Document 1, is configured to
Including using lower component as main element: the film for being supported in connector portions and completely cutting off pressure detecting chamber and aftermentioned fluid-tight room
Piece；It is formed in the fluid-tight room of the top of diaphragm and storage as the silicone oil of pressure transmission medium；Configuration in fluid-tight room and via
Diaphragm detects the sensor chip of the pressure oscillation of silicone oil；Support the chip mounting member of sensor chip；Shell is passed through
The seal glass being sealed around chip mounting member in through-hole；And carry out the output signal from sensor chip
Transmission and terminal group from the power supply to sensor chip.
Make terminal group arrange terminal board by resin material for example with polybutylene terephthalate (PBT) (PBT) be mainly at
The ester moulding divided.Terminal board has the blank part of scheduled volume with the multiple holes being inserted into for terminal group and in inside.End
The lower end surface of sub- platform is adhered to the upper surface of shell by silicon systems bonding agent.It is formed as a result, in the upper surface of shell with scheduled
The cricoid adhesive layer of thickness.
The internal circuit of above-mentioned such sensor chip there is the high voltage due to caused by static discharge (ESD) and by
The case where destruction.In above-mentioned sensor unit, such as there are following worries: high voltage caused by static discharge is by from above-mentioned
Connector portions and element body to the path of sensor chip or from outside lead and terminal group to sensor chip
Path and the internal circuit for being applied to sensor chip.As the countermeasure of such case, for example, as shown in Patent Document 1, utilizing
Clad and adhesive layer form the electrostatic protection layer being made of silicon systems bonding agent.That is, in terminal group institute seal glass outstanding
Entire upper surface, the clad being made of silicon systems bonding agent is formed with scheduled thickness.In addition, in the upper surface shape of shell
At there is above-mentioned cricoid adhesive layer.
Electrostatic protection layer is formed by silicon systems bonding agent in this way, thus will not be influenced by the presence or absence of esd protection circuit,
Improve the electrostatic endurance of sensor unit.
Existing technical literature
Patent document
Patent document 1: No. 2015/194105 bulletin of International Publication No.
Patent document 2: No. 3987386 bulletin of patent
Summary of the invention
In the case where the lower end surface of above-mentioned terminal board is adhered to the upper surface of shell by silicon systems bonding agent, according to bonding
The type of agent is heated to scheduled temperature.In this case, in the terminal board shaped by polybutylene terephthalate (PBT), exist
Internal moisture is entered from environmental gas to be gasificated as bubble because of heating and flow out to external worry from terminal board.By
This, flows out to lower end surface and seal glass of the external bubble residence in the terminal board adjacent with the upper surface of shell from terminal board
Upper surface between, when adhesive layer and clad solidify, bubble enters in clad.As a result, the part due to bubble
The relatively thin part of the film thickness of ground formation clad.
In addition, subtle caused by rough surface between the bonding plane of terminal board and the upper surface (glued face) of shell
Air in recess portion is pushed out into clad between the bonding plane of terminal board and the upper surface of shell due to heating.It is tied
Fruit, when adhesive layer and clad solidify, bubble is entered in clad, so forming the film thickness of clad because of the bubble
Relatively thin part.
Therefore, because be formed with multiple bubbles in cured clad, thus be formed locally the film thickness of clad compared with
Thus there is the worry of the electrostatic endurance decline of sensor unit in thin part.
Problem more than considering, the purpose of the present invention is to provide a kind of pressure sensors, in pressure sensor,
In the case where forming electrostatic protection layer by insulating properties bonding agent, it is able to suppress in electrostatic protection layer and forms bubble.
In order to achieve the above purpose, pressure sensor of the invention is characterized in that having: sensor unit, packet
It is defeated to include the sensor chip for detecting pressure and transmitting detection output signal, at least one of signal of the transmission from sensor chip
Out with terminal, shell and cladding output terminal institute the sealing glass outstanding of seal glass comprising supporting output terminal
The clad of the end face of glass；And sensor unit incorporating section, store the end with the bonding plane Nian Jie with the end face of shell
Sub- arrangement part and sensor unit, the bonding plane of terminal arrangement part is with mutual in the end face of the bonding plane and shell
The end slope of the mode relative to the shell in scheduled gap is formed, which gradually becomes with the inner peripheral surface far from shell
Greatly.
Additionally, it is preferred that forming blank part between terminal arrangement part and clad.It is preferred that the bonding of terminal arrangement part
Face is abutted by having in such a way that the end face of bonding plane and shell forms scheduled gap between each other with the inclined surface of shell
Inclined surface.It is preferred that the bonding plane of terminal arrangement part to form scheduled in the end face of bonding plane and shell between each other
The mode of gap has the protrusion abutted with the inclined surface of shell.
Also, pressure sensor of the invention is characterized in that, sensor unit comprising detection pressure simultaneously transmits detection
The sensor chip of output signal, at least one output terminal for transmitting the signal from sensor chip include that support is defeated
Out with the shell of the seal glass of terminal and cladding output terminal the end face of seal glass outstanding clad；With
And sensor unit incorporating section, store the terminal arrangement part and sensor list with the bonding plane Nian Jie with the end face of shell
The bonding plane of member, terminal arrangement part has by such a way that the end face of bonding plane and shell forms scheduled gap between each other
Standby positioning region.
It is preferred that the part of the outer peripheral surface of terminal arrangement part and the plane being connected towards the glued face with shell also
It is formed with adhesive layer.
The bonding plane of pressure sensor according to the present invention, terminal arrangement part is formed between each other with the end face in shell
End slope of the mode in scheduled gap relative to shell, gap become larger with the inner peripheral surface far from shell, so being detained
It releases in the air of bonding plane to outside, therefore, in the case where forming electrostatic protection layer using insulating properties bonding agent, can press down
System forms bubble in electrostatic protection layer.
Detailed description of the invention
Fig. 1 is the office of the major part of the sensor unit of an example that locally amplification indicates pressure sensor of the invention
Portion's cross-sectional view.
Fig. 2 is the cross-sectional view for indicating the structure of an example of pressure sensor of the invention.
Fig. 3 A is another main portion that locally amplification indicates terminal board used in pressure sensor shown in Fig. 2
The partial sectional view divided.
Fig. 3 B is the top view of terminal board shown in Fig. 3 A.
Fig. 4 A is the other main portions that locally amplification indicates terminal board used in pressure sensor shown in Fig. 2
The partial sectional view divided.
Fig. 4 B is the other main portions that locally amplification indicates terminal board used in pressure sensor shown in Fig. 2
The partial sectional view divided.
Fig. 4 C is the other main portions that locally amplification indicates terminal board used in pressure sensor shown in Fig. 2
The partial sectional view divided.
Specific embodiment
Fig. 2 outlined the structure of an example of pressure sensor of the invention.
In Fig. 2, pressure sensor is configured to include: joint component 30, to detect matching for the fluid of pressure with importing
Pipe connection；Sensor unit incorporating section links and stores aftermentioned sensor unit with the pedestal plate 28 of joint component 30,
And the detection output signal from sensor chip is supplied to scheduled pressure measuring unit.
Metal joint component 30 has the internal screw thread of the external thread part for the interconnecting piece for being screwed into above-mentioned piping in inside
Portion 30fs.Internal thread part 30fs is directed into the connector of aftermentioned pressure chamber 28A with the fluid for supplying the direction shown in the arrow P
The port 30a of component 30 is connected to.The open end of a side of port 30a is towards the pedestal plate 28 for being formed in joint component 30 and passes
Pressure chamber 28A opening between the diaphragm 32 of sensor cell.
The contour part of sensor unit incorporating section is formed by the cylindric waterproof cover 20 as cover member.Waterproof cover 20 exists
Inside has sensor unit and the storage space 20A configured with the sealing material 26 being filled in around sensor unit.
Opening portion 20b is formed in the lower end of the waterproof cover 20 of resin.In the periphery for the opening portion 20b for becoming inside
Stage portion be deposited with joint component 30 pedestal plate 28 peripheral part.
The gas or liquid or refrigeration as fluid are supplied into pressure chamber 28A by the port 30a of joint component 30
Agent.The lower end surface deposition of the shell 12 of sensor unit is in the peripheral part of pedestal plate 28.
The sensor unit of pressure and transmission detection output signal in detection pressure chamber 28A is configured to include with lower component
As main element: cylindric shell 12；The metal diaphragm that the inner peripheral portion of pressure chamber 28A and shell 12 is completely cut off
32；Sensor chip 16 with multiple pressure detecting elements；Via adhesive layer 50, portion supports sensor chip 16 at one end
Metal chip mounting member 18；The input/output terminal subgroup 40ai (i=1~8) being electrically connected with sensor chip 16；With
And input/output terminal subgroup 40ai and oily filling pipe 44 are fixed on to the outer peripheral surface and shell 12 of chip mounting member 18
Seal glass 14 between inner peripheral surface.
Diaphragm 32 is supported on the lower end surface of a side of the shell 12 facing with above-mentioned pressure chamber 28A.Relaying configuration exists
The diaphragm protective cover 34 of the diaphragm 32 of pressure chamber 28A has multiple intercommunicating pore 34a.The periphery of diaphragm protective cover 34 and diaphragm 32
Periphery is by being bonded on the lower end surface of the shell 12 of stainless steel.
It is formed between metal diaphragm 32 and the end face of the sensor chip 16 and seal glass 14 that are faced
In fluid-tight room 13, silicone oil PM or fluorine-containing inert liquid of the pipe 44 filled with such as predetermined amount is used to pass as pressure via oily filling
Pass medium.In addition, the end of one side of oily filling pipe 44 is flattened after oil filling and is closed as shown in double dot dash line.
Silicone oil is, for example, the silicone oil with the dimethyl polysiloxane structure being made of siloxanes key and organic methyl.Fluorine system
Inert fluid is, for example, to have the liquid of perfluocarbon structure and the liquid with hydrofluoroether structure or borontrifluoride chloroethene
The low polymer of alkene is also possible to combine fluorine and chlorine on main chain, and both ends have the structure of fluorine, chlorine.
It is being configured between the sensor chip 16 and diaphragm 32 for being formed in the recess portion of end of seal glass 14, and
The lower end surface of seal glass 14 is supported by metal current potential adjustment component 17.Current potential, which adjusts component 17, has such as patent document
It intercommunicating pore as disclosed in 2 and is connect with the terminal of the zero potential for the circuit for being connected to sensor chip 16.
Input/output terminal subgroup 40ai (i=1~8) You Lianggen power supply terminal, an output terminal and five tune
It is whole to be constituted with terminal.The both ends of each terminal are respectively facing the recess portion for being formed in the end of above-mentioned seal glass 14 and aftermentioned
The hole 24b of terminal board 24 is prominent.Two power supply terminals and an output terminal via connection terminal 36 and with each lead 38
Core wire 38a connection.Each lead 38 is connect with scheduled pressure measuring unit.In addition, illustrating only eight butts in Fig. 2
In four butts.It is connected between input/output terminal subgroup 40ai and aftermentioned sensor chip 16 by bonding wire Wi.
Sensor chip 16 has multiple pressure detecting elements, such as is bonded in chip mounting member via adhesive layer 50
18 one end.
The terminal board 24 for arranging input/output terminal subgroup 40ai is with resin material such as polybutylene terephthalate (PBT)
(PBT) it is shaped for main ingredient.Terminal board 24 is with for the input and output terminal group 40ai multiple hole 24b being inserted into and inside
Side has the blank part 24A (referring to Fig.1) of scheduled volume.Blank part 24A with scheduled volume is by cylindric cardinal extremity
The inner peripheral surface 24IS of portion 24PE, the terminal aligning section 24T for linking the base end part practise physiognomy with the upper surface 14UE of seal glass 14
Pair face and seal glass 14 upper surface surround and formed.Inner peripheral surface 24IS is with the base end part 24PE's with terminal board 24
Lower end surface 24TS has scheduled gradient in such a way that scheduled angle is intersected.Above-mentioned terminal aligning section 24T, which has, mutually to be divided
From multiple hole 24b and be formed as one in the mode orthogonal with above-mentioned base end part 24PE.
In the inner peripheral surface facing with the upper surface 14UE of seal glass 14 of terminal aligning section 24T, it is formed with towards close
Seal the cricoid protrusion 24d outstanding of glass 14.The protrusion length of protrusion 24d is set according to viscosity of clad 10b etc..
It is formed with cricoid protrusion 24d in this way, thus when forming clad 10b, a part of coated clad 10b
It is stretched using surface tension and is maintained at the inner peripheral surface for the blank part to form protrusion 24d and terminal board 24, and and seal glass
In narrow space between 14 upper surface 14UE substantially orthogonal inner peripheral surface, therefore clad 10b will not be partial to terminal board
Equably it is coated to a side side in 24 blank part.
The lower end surface 24TS of the base end part 24PE of terminal board 24 as bonding plane has the upper surface relative to shell 12
12TS at scheduled angle inclined surface.Intersect in the end of the upper surface 12TS of shell 12 with inner peripheral surface 12IS the inclined surface
Cricoid intersection 12EP is abutted.
The gap between the inclined surface of lower end surface 24TS and the upper surface 12TS of shell 12 is formed in far from shell 12
Inner peripheral surface 12IS (intersection 12EP) and become larger.The lower end surface 24TS of the base end part 24PE of terminal board 24 is by silicon systems bonding agent
It is adhered to the upper surface 12TS of the shell 12 as glued face.It is formed to have in the upper surface 12TS of shell 12 as a result, and be made a reservation for
Thickness cricoid adhesive layer 10a and adhesive layer 10c.
The cricoid intersection 12EP that the end of the upper surface 12TS of shell 12 is intersected with inner peripheral surface 12IS is formed in than sealing
The position of the upper surface 14UE high of glass 14.
At this point, the ring that the inner peripheral surface 24IS of the lower end surface 24TS and base end part 24PE of the base end part 24PE of terminal board 24 intersects
The position of the intersection 24EP of shape becomes the inner peripheral surface 12IS (intersection 12EP) than shell 12 close to input/output terminal subgroup 40ai's
Position.
In addition, input/output terminal subgroup 40ai seal glass 14 outstanding entire upper surface 14UE, with scheduled
Thickness is formed with the clad 10b being made of silicon systems bonding agent.
As shown in figure 1 locally shown in amplification, the thickness of clad 10b is with far from around input/output terminal subgroup 40ai
And it is become larger compared with the thickness around input/output terminal subgroup 40ai close to the inner peripheral surface 24IS of base end part 24PE.In
The air layer being formed with above clad 10b in empty 24A.
In pressure sensor, being adhered to seal glass 14 and input/output terminal subgroup 40ai etc. in terminal board 24 becomes
In the case where the shell 12 of one, for example, terminal board 24 and shell 12 also without in the state of being fitted in waterproof cover 20 into
Row.When forming above-mentioned adhesive layer 10a and adhesive layer 10c, clad 10b, by the silicon systems adhesive applicating of predetermined amount
After near the upper surface of seal glass 14 and the inner peripheral of shell 12, the lower end surface of the base end part 24PE of terminal board 24
24TS is positioned in the upper surface 12TS of shell 12.The inner peripheral of upper surface coated in seal glass 14 and shell 12 as a result,
A part of neighbouring bonding agent is pressed by the lower end surface 24TS of the base end part 24PE of terminal board 24, is pushed out to the upper of shell 12
The outer peripheral surface of the base end part 24PE of terminal board 24 in the 12TS of end face.Also, terminal board 24 and silicon systems bonding agent pass through with pre-
Fixed temperature heating, to form cured adhesive layer 10a and adhesive layer 10c, clad 10b.By forming adhesive layer
10c, so as to confirm the solid state whether there is or not coating bonding agent and bonding agent.
As noted previously, as the gap being formed between the inclined surface of lower end surface 24TS and the upper surface 12TS of shell 12 with
The mode become larger with the inner peripheral surface 12IS (intersection 12EP) far from shell 12 is formed, therefore arrow shown in Fig. 1
On the direction shown, the air in adhesive layer 10a is easily released into environmental gas by the gap, and adhesive layer
Air in 10c is released in environmental gas.In addition, it is assumed that in the moisture for entering terminal board 24 from environmental gas because adding
Heat and gasify and air is pushed out in clad 10b and such air results from the situation in clad 10b as bubble
Under, bubble will not be trapped in clad 10b, but before clad 10b solidification, bubble is imported into the cavity of surface
In air layer in 24A.Therefore, in the cured situation of clad 10b, the electrostatic endurance decline of sensor unit is not such
Predetermined amount more than bubble enter the worry in the clad 10b having cured.
In addition, being formed in the upper surface 12TS of shell 12 and the entire upper surface of seal glass 14 by adhesive layer
The silicon systems adhesive layer that 10a, clad 10b and adhesive layer 10c are constituted is as electrostatic protection layer.Therefore, in this way by silicon systems
Bonding agent forms electrostatic protection layer, to will not be influenced by the presence or absence of esd protection circuit, the electrostatic for improving sensor unit is resistance to
Power.
In addition, clad 10b is formed in the entire upper surface of seal glass 14, but it is not limited to the example, for example, it is also possible to
With the ring-type at least between the input/output terminal subgroup 40ai of the upper surface of seal glass 14 and the inner peripheral surface 12IS of shell 12
The mode that region CA is formed with clad 10b constitutes electrostatic protection layer.
Above-mentioned silicon systems bonding agent for example preferably has the single component system of the additive type of flexibility.Silicon systems bonding agent is for example
For the bonding agent with low molecular weight polyorganosiloxane key.In addition, silicon systems bonding agent and silicone oil is since phasic property is good, it is therefore assumed that in silicon systems
In bonding agent just in case in the case where being mixed into silicone oil etc., also without the worry of the cementability deterioration of silicon systems bonding agent.
The terminal board 24 as terminal arrangement part outer peripheral surface and with terminal board 24 link and cover above-mentioned end
The outer peripheral surface of the end cap 22 of the open end on the top of the hole 24b and terminal board 24 of sub- aligning section 24T and the inner circumferential of waterproof cover 20
Between face, in addition between the inner peripheral surface of waterproof cover 20 and the outer peripheral surface of shell 12, sealing material 26 is filled with predetermined amount.End
Sub- platform 24 and end cap 22 are configured face to face across the pedestal plate 28 of above-mentioned sensor unit and joint component 30 anti-
In water hull 20.
The upper surface of end cap 22 protrudes upward from the open end of waterproof cover 20.That is, the position of the upper surface of end cap 22
The high position in position as the open end than waterproof cover 20.
In above-mentioned example shown in FIG. 1, the inclined surface of the lower end surface 24TS of terminal board 24 and the upper surface of shell 12
12TS is abutted in the cricoid intersection 12EP that the end of the upper surface 12TS of shell 12 is intersected with inner peripheral surface 12IS, but is not limited to
The example, such as can also be as shown in Figure 3A and 3B, be configured to the 24 ' TS of lower end surface of terminal board 24 ' 24 ' P of positioning region with
12 ' the TS of upper surface of shell 12 ' as glued face is abutted.In addition, in figure 3 a, for in example shown in FIG. 1
The identical constituent element mark same symbol of constituent element simultaneously omits its repeated explanation.
The terminal board 24 ' for arranging input/output terminal subgroup 40ai is with resin material such as polybutylene terephthalate (PBT)
(PBT) it is shaped for main ingredient.Terminal board 24 ' have for the input and output terminal group 40ai 24 ' b of multiple holes being inserted into and
Inside has the 24 ' A of blank part of scheduled volume.24 ' A of blank part with scheduled volume is by cylindric base end part 24 '
24 ' the IS of inner peripheral surface of PE, link upper surface 14UE phase in the 24 ' T of terminal aligning section of 24 ' PE of the base end part with seal glass 14
The upper surface 14UE in the face and seal glass 14 that face is surrounded and is formed.24 ' IS of inner peripheral surface is with the cardinal extremity with terminal board 24 '
24 ' the TS of lower end surface of 24 ' PE of portion has scheduled gradient in such a way that scheduled angle is intersected.Above-mentioned 24 ' T of terminal aligning section
It is formed as one with the 24 ' b of multiple holes being separated from each other and in the mode orthogonal with above-mentioned 24 ' PE of base end part.
The inner peripheral surface facing with the upper surface 14UE of seal glass 14, is formed with towards close in 24 ' T of terminal aligning section
Seal the cricoid 24 ' d of protrusion outstanding of glass 14.The protrusion length of 24 ' d of protrusion is set according to viscosity of clad 10b etc.
It is fixed.Cricoid 24 ' d of protrusion is formed in this way, thus when forming clad 10b, one of coated clad 10b
Point be stretched using surface tension and to be maintained at the inner peripheral surface for the blank part to form 24 ' d of protrusion and terminal board 24 ', and with sealing
In narrow space between the upper surface 14UE of glass 14 substantially orthogonal inner peripheral surface, clad 10b will not be partial to terminal board
Equably it is coated to a side side in 24 ' blank part.
As shown in Figure 3B, the 24 ' TS of lower end surface as the 24 ' PE of base end part of the terminal board 24 ' of bonding plane is attached in outer peripheral edge
Nearly four positions have 24 ' P of positioning region with 90 ° of intervals.Generally rectangular 24 ' P of positioning region have scheduled height and with it is outer
12 ' the TS of upper surface of shell 12 ' is abutted.In positioning region, 24 ' P is mutual as a result, and in the upper of 24 ' TS of lower end surface and shell 12 '
Scheduled gap is formed between 12 ' TS of end face.
The part of close inner peripheral in the 12 ' TS of upper surface of cylindric shell 12 ', is formed with as glued face
The 12 ' C of inclined surface with scheduled gradient.As a result, in the 24 ' TS of lower end surface of 24 ' PE of the base end part of terminal board 24 ' and inclination
Gap is also formed between 12 ' C of face.12 ' the EP of cricoid intersection that the end of 12 ' C of inclined surface is intersected with 12 ' IS of inner peripheral surface is formed
In the position of the upper surface 14UE high than seal glass 14.
At this point, 24 ' IS the phase of inner peripheral surface of the 24 ' TS of lower end surface and 24 ' PE of base end part of the 24 ' PE of base end part of terminal board 24 '
24 ' the EP of cricoid intersection handed over is located at the position in surface of the 12 ' IS of inner peripheral surface (12 ' EP of intersection) than shell 12 ' more
Close to the position of input/output terminal subgroup 40ai.
24 ' the TS of lower end surface of the 24 ' PE of base end part of terminal board 24 ' is adhered to the upper surface of shell 12 ' by silicon systems bonding agent
12′TS.The cricoid adhesive layer 10a and bonding with scheduled thickness are formed in 12 ' TS of the upper surface of shell 12 ' as a result,
Layer 10c.
In addition, input/output terminal subgroup 40ai seal glass 14 outstanding entire upper surface 14UE, with scheduled
Thickness is formed with the clad 10b being made of silicon systems bonding agent.
The thickness of clad 10b is with far from around input/output terminal subgroup 40ai and in 24 ' PE of base end part
24 ' IS of circumferential surface and become larger compared with the thickness around input/output terminal subgroup 40ai.It is formed in the top of clad 10b
There is the air layer in 24 ' A of cavity.
As described above, the gap being formed between 24 ' TS of lower end surface and the 12 ' TS of upper surface of shell 12 ' is formed in positioning
Between 24 ' P of portion, therefore on the direction shown in the arrow shown in Fig. 3 A, the air in adhesive layer 10a passes through the gap
It is easily released into environmental gas, and the air in adhesive layer 10c is released into environmental gas.In addition, it is assumed that from ring
The moisture that terminal board 24 ' is entered in the gas of border gasifies due to heating and air is pushed out in clad 10b and as sky
In the case that gas results from clad 10b as bubble, bubble will not be trapped in clad 10b, but in clad
Before 10b solidification, bubble is imported into the air layer in the 24 ' A of cavity of surface.Therefore, the case where clad 10b solidifies
Under, the bubble that the electrostatic endurance of sensor unit does not decline such predetermined amount or more enters the clad 10b having cured
Interior worry.
The entire upper surface of 12 ' TS and seal glass 14 in the upper surface of shell 12 ' are formed with by adhesive layer 10a, packet
The silicon systems adhesive layer that coating 10b and adhesive layer 10c is constituted is as electrostatic protection layer.Therefore, in this way by silicon systems bonding agent
It forms electrostatic protection layer and improves the electrostatic endurance of sensor unit to will not be influenced by the presence or absence of esd protection circuit.
Also, in the example shown in Fig. 3 A, be configured to 24 ' TS of lower end surface in the 24 ' PE of base end part of terminal board 24 ' with
It is also formed with gap between 12 ' C of inclined surface, but is not limited to the example, such as can also be as shown in Figure 4 A, is configured to terminal board 44
The second inclined-plane 44S2 of lower end surface 44TS of base end part abutted with the 12 ' C of inclined surface of the shell 12 ' as glued face.This
Outside, in Figure 4 A, same symbol is marked for constituent element identical with the constituent element in example shown in Fig. 3 A, and omits it
Repeated explanation.
In Figure 4 A, the terminal board 44 for arranging input/output terminal subgroup 40ai is with resin material such as poly terephthalic acid
Butanediol ester (PBT) shapes for main ingredient.Terminal board 44 has the multiple holes being inserted into for input and output terminal group 40ai
44b and inside have scheduled volume blank part 44A.Blank part 44A with scheduled volume is by cylindric cardinal extremity
The inner peripheral surface 44IS of portion 44PE, link upper surface 14UE in the terminal aligning section 44T of base end part 44PE with seal glass 14
The upper surface in facing face and seal glass 14 surrounds and is formed.Inner peripheral surface 44IS is with the base end part with terminal board 44
The lower end surface 44TS of 44PE has scheduled gradient in such a way that scheduled angle is intersected.Above-mentioned terminal aligning section 44T has
It multiple hole 44b for being separated from each other and is formed as one in the mode orthogonal with above-mentioned base end part 44PE.
The inner peripheral surface facing with the upper surface 14UE of seal glass 14 in terminal aligning section 44T, is formed with direction
The cricoid protrusion 44d outstanding of seal glass 14.The protrusion length of protrusion 44d is set according to viscosity of clad 10b etc.
It is fixed.Cricoid protrusion 44d is formed in this way, thus when being formed with clad 10b, the one of coated clad 10b
Part is stretched using surface tension and is maintained at the inner peripheral surface for the blank part to form protrusion 44d and terminal board 44, and with sealing
In narrow space between the upper surface 14UE of glass 14 substantially orthogonal inner peripheral surface, therefore clad 10b will not relatively be held
Equably it is coated to a side side in the blank part of sub- platform 44.
The lower end surface 44TS of the base end part 44PE of terminal board 44 as bonding plane includes the upper end relative to shell 12 '
12 ' TS of face at scheduled angle the first inclined-plane 44S1；And the second inclined-plane 44S2 being connected with the first inclined-plane 44S1.Second tiltedly
Face 44S2 is relative to the upper end that the angle initialization of the 12 ' TS of upper surface of shell 12 ' is than the first inclined-plane 44S1 relative to shell 12 '
The angle of 12 ' TS of face is big.
At this point, the ring that the inner peripheral surface 44IS of the lower end surface 44TS and base end part 44PE of the base end part 44PE of terminal board 44 intersects
The intersection 44EP of shape is located closer to input positioned at the 12 ' IS's of inner peripheral surface (12 ' EP of intersection) than shell 12 ' in surface
The position of output end subgroup 40ai.
The lower end surface 44TS of the base end part 44PE of terminal board 44 is adhered to the shell as glued face by silicon systems bonding agent
12 ' 12 ' TS of upper surface.The cricoid adhesive layer with scheduled thickness is formed in 12 ' TS of the upper surface of shell 12 ' as a result,
10a and adhesive layer 10c.
In addition, input/output terminal subgroup 40ai seal glass 14 outstanding entire upper surface 14UE, with scheduled
Thickness is formed with the clad 10b being made of silicon systems bonding agent.
The thickness of clad 10b is with far from the inner circumferential around input/output terminal subgroup 40ai and close to base end part 44PE
Face 44IS and become larger compared with the thickness around input/output terminal subgroup 40ai.It is formed with above clad 10b
Air layer in empty 44A.
As described above, base end part of a part of the bonding agent of the upper surface coated in seal glass 14 by terminal board 44
The lower end surface 44TS of 44PE is pressed, and is pushed out to the outer of the base end part 44PE of the terminal board 44 in the 12 ' TS of upper surface of shell 12 '
Circumferential surface, therefore the air in adhesive layer 10a is easily released into environmental gas by the gap, and in adhesive layer 10c
Air released into environmental gas.In addition, it is assumed that in the moisture for entering terminal board 44 from environmental gas due to heating gas
Change and air is pushed out in clad 10b and in the case that such air results from clad 10b as bubble, gas
Bubble will not be trapped in clad 10b, but before clad 10b solidification, bubble is imported into the empty 44A of surface
Air layer in.Therefore, in the cured situation of clad 10b, the electrostatic endurance decline of sensor unit is not such pre-
Bubble more than quantitative enters the worry in the clad 10b having cured.
In addition, being configured to the second inclined-plane of the lower end surface 44TS of the base end part of terminal board 44 in the example shown in Fig. 4 A
44S2 is abutted with the 12 ' C of inclined surface of the shell 12 ' as glued face, but and be limited to the example, for example, it is also possible to such as Fig. 4 B institute
Show, is configured to the inclined inside ora terminalis 54P of the lower end surface 54TS of the base end part 54PE of terminal board 54 and as glued face
12 ' the C of inclined surface of shell 12 ' is abutted.In addition, in figure 4b, for identical with Fig. 4 A constituent element in the illustrated example
Constituent element mark same symbol simultaneously omits its repeated explanation.
In figure 4b, the terminal board 54 for arranging input/output terminal subgroup 40ai is with resin material such as poly terephthalic acid
Butanediol ester (PBT) shapes for main ingredient.Terminal board 54 has the multiple holes being inserted into for input and output terminal group 40ai
54b and inside have scheduled volume blank part 54A.Blank part 54A with scheduled volume is by cylindric cardinal extremity
The inner peripheral surface 54IS of portion 54PE, link upper surface 14UE in the terminal aligning section 54T of base end part 54PE with seal glass 14
The upper surface in facing face and seal glass 14 surrounds and is formed.Inner peripheral surface 54IS is with the base end part with terminal board 54
The lower end surface 54TS of 54PE has scheduled gradient in such a way that scheduled angle is intersected.Above-mentioned terminal aligning section 54T has
It multiple hole 54b for being separated from each other and is formed as one in the mode orthogonal with above-mentioned base end part 54PE.
The base end part 54PE of terminal board 54 includes substantially flat relative to the 12 ' TS of upper surface of the shell 12 ' as bonding plane
Capable lower end surface 54TS；And it is connected with lower end surface 54TS and the inside ora terminalis relative to lower end surface 54TS at scheduled angle
54P。
At this point, the inside ora terminalis 54P being connected with the lower end surface 54TS of base end part 54PE and base end part 54PE of terminal board 54
Inner peripheral surface 54IS intersection cricoid intersection 54EP position be located at shell 12 ' 12 ' IS of inner peripheral surface (12 ' EP of intersection) place
Near the position of surface.
The lower end surface 54TS of the base end part 54PE of terminal board 54 is adhered to the upper surface 12 ' of shell 12 ' by silicon systems bonding agent
TS.Cricoid adhesive layer 10a and adhesive layer 10c with scheduled thickness are formed in the upper surface 12 ' of shell 12 ' as a result,
TS。
In addition, input/output terminal subgroup 40ai seal glass 14 outstanding upper surface 14UE, with scheduled thickness
It is formed with the clad 10b being made of silicon systems bonding agent.
The thickness of clad 10b is with far from the inner circumferential around input/output terminal subgroup 40ai and close to base end part 54PE
Face 54IS and become larger compared with the thickness around input/output terminal subgroup 40ai.It is formed with above clad 10b
Air layer in empty 54A.
As described above, base end part of a part of the bonding agent of the upper surface coated in seal glass 14 by terminal board 54
The lower end surface 54TS of 54PE is pressed, and is pushed out to the outer of the base end part 54PE of the terminal board 54 in the 12 ' TS of upper surface of shell 12 '
Circumferential surface, therefore the air in adhesive layer 10a is easily released into environmental gas by the gap, and in adhesive layer 10c
Air released into environmental gas.In addition, it is assumed that in the moisture for entering terminal board 54 from environmental gas due to heating gas
Change and air is pushed out in clad 10b and in the case that such air results from clad 10b as bubble, gas
Bubble will not be trapped in clad 10b, but before clad 10b solidification, bubble is imported into the empty 54A of surface
Air layer in.Therefore, in the cured situation of clad 10b, the electrostatic endurance decline of sensor unit is not such pre-
Bubble more than quantitative enters the worry in the clad 10b having cured.
In the example shown in Fig. 4 B, it is configured to the inclined inside of the lower end surface 54TS of the base end part 54PE of terminal board 54
Ora terminalis 54P is abutted with the 12 ' C of inclined surface of the shell 12 ' as glued face, but also can replace it, for example, such as Fig. 4 C institute
Show, be configured to the lower end surface 64TS of the base end part 64PE of terminal board 64 end formed protrusion 64P with as glued
12 ' the C of inclined surface of the shell 12 ' in face is abutted.In addition, in figure 4 c, for Fig. 4 B constituent element phase in the illustrated example
Same constituent element mark same symbol simultaneously omits its repeated explanation.
The terminal board 64 for arranging input/output terminal subgroup 40ai is with resin material such as polybutylene terephthalate (PBT)
(PBT) it is shaped for main ingredient.Terminal board 64 is with for the input and output terminal group 40ai multiple hole 64b being inserted into and inside
Side has the blank part 64A of scheduled volume.Blank part 64A with scheduled volume is by cylindric base end part 64PE
Circumferential surface 64IS, link face facing with the upper surface 14UE of seal glass 14 in the terminal aligning section 64T of base end part 64PE,
And the upper surface 14UE of seal glass 14 is surrounded and is formed.Inner peripheral surface 64IS is with the lower end of the base end part 64PE with terminal board 64
Face 64TS has scheduled gradient in such a way that scheduled angle is intersected.Above-mentioned terminal aligning section 64T, which has, to be separated from each other
It multiple hole 64b and is formed as one in the mode orthogonal with above-mentioned base end part 64PE.
The base end part 64PE of terminal board 64 includes substantially flat relative to the 12 ' TS of upper surface of the shell 12 ' as bonding plane
Capable lower end surface 64TS；And it is connected with lower end surface 64TS and dashes forward relative to the end of lower end surface 64TS towards 12 ' TS of upper surface
Protrusion 64P out.
At this point, the protrusion 64P being connected with the lower end surface 64TS of base end part 64PE and base end part 64PE of terminal board 64
The position of the cricoid intersection 64EP of inner peripheral surface 64IS intersection is located at being in for 12 ' IS of inner peripheral surface (12 ' EP of intersection) of shell 12 '
Near the position of surface.
The lower end surface 64TS of the base end part 64PE of terminal board 64 is adhered to the upper surface 12 ' of shell 12 ' by silicon systems bonding agent
TS.The cricoid adhesive layer with scheduled thickness is formed in 12 ' TS of the upper surface of the shell 12 ' as glued face as a result,
10a and adhesive layer 10c.
In addition, input/output terminal subgroup 40ai seal glass 14 outstanding upper surface 14UE, with scheduled thickness
It is formed with the clad 10b being made of silicon systems bonding agent.
The thickness of clad 10b is with far from the inner circumferential around input/output terminal subgroup 40ai and close to base end part 64PE
Face 64IS and become larger compared with the thickness around input/output terminal subgroup 40ai.It is formed with above clad 10b
Air layer in empty 64A.
As described above, base end part of a part of the bonding agent of the upper surface coated in seal glass 14 by terminal board 64
The lower end surface 64TS of 64PE is pressed, and is pushed out to the outer of the base end part 64PE of the terminal board 64 in the 12 ' TS of upper surface of shell 12 '
Circumferential surface, therefore the air in adhesive layer 10a is easily released into environmental gas by the gap, and in adhesive layer 10c
Air released into environmental gas.In addition, it is assumed that in the moisture for entering terminal board 64 from environmental gas due to heating gas
Change and air is pushed out in clad 10b and in the case that such air results from clad 10b as bubble, gas
Bubble will not be trapped in clad 10b, but before clad 10b solidification, bubble is imported into the empty 64A of surface
Air layer in.Therefore, in the cured situation of clad 10b, the electrostatic endurance decline of sensor unit is not such pre-
Bubble more than quantitative enters the worry in the clad 10b having cured.
In the above description, the relative positional relationship of the constituent element of an example of the above-mentioned pressure sensor of composition is indicated
" upper and lower " concept and Fig. 1, Fig. 2, Fig. 3 A, Fig. 3 B and Fig. 4 A~Fig. 4 C shown in indicate the opposite position of each component
The " upper and lower " corresponding of relationship is set, actual setting in an example of pressure sensor, in use, the composition of pressure sensor is wanted
The relative positional relationship of element is not limited to the concept of such " upper and lower ".
In the above example, as insulating properties bonding agent, silicon systems bonding agent is illustrated, but the present invention and unlimited
In silicon systems bonding agent, the bonding agent for generating bubble when for solidifying in adhesive layer can also obtain same effect.
Claims (6)
1. a kind of pressure sensor, which is characterized in that have:
Sensor unit comprising detection pressure simultaneously transmits the sensor chip of detection output signal, transmission from sensor core
In at least one output terminal of the signal of piece, the shell of seal glass comprising supporting the output terminal and cladding
State output terminal the end face of seal glass outstanding clad；And
Sensor unit incorporating section, storing has the terminal arrangement part of the bonding plane Nian Jie with the end face of above-mentioned shell and upper
Sensor unit is stated,
The bonding plane of the terminal arrangement part to form scheduled in the end face of the bonding plane and above-mentioned shell between each other
End slope of the mode of gap relative to the shell, the gap become larger with the inner peripheral surface far from above-mentioned shell.
2. pressure sensor according to claim 1, which is characterized in that
Blank part is formed between above-mentioned terminal arrangement part and above-mentioned clad.
3. pressure sensor according to claim 1, which is characterized in that
The bonding plane of above-mentioned terminal arrangement part is scheduled to be formed between each other in the end face of the bonding plane and above-mentioned shell
The mode in gap has the inclined surface abutted with the glued face of the shell.
4. pressure sensor according to claim 1, which is characterized in that
The bonding plane of above-mentioned terminal arrangement part is scheduled to be formed between each other in the end face of the bonding plane and above-mentioned shell
The mode in gap has the protrusion abutted with the glued face of the shell.
5. a kind of pressure sensor, which is characterized in that have:
Sensor unit comprising detection pressure simultaneously transmits the sensor chip of detection output signal, transmission from sensor core
In at least one output terminal of the signal of piece, the shell of seal glass comprising supporting the output terminal and cladding
State output terminal the end face of seal glass outstanding clad；And
Sensor unit incorporating section, storing has the terminal arrangement part of the bonding plane Nian Jie with the end face of above-mentioned shell and upper
Sensor unit is stated,
The bonding plane of above-mentioned terminal arrangement part is scheduled to be formed between each other in the end face of the bonding plane and above-mentioned shell
The mode in gap has positioning region.
6. pressure sensor according to claim 1 or 5, which is characterized in that
The part of the outer peripheral surface of above-mentioned terminal arrangement part and the plane being connected towards the glued face with above-mentioned shell also
It is formed with adhesive layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-053215 | 2017-03-17 | ||
| JP2017053215A JP6568129B2 (en) | 2017-03-17 | 2017-03-17 | Pressure sensor |
| PCT/JP2018/007168 WO2018168437A1 (en) | 2017-03-17 | 2018-02-27 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110431394A true CN110431394A (en) | 2019-11-08 |
Family
ID=63523620
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880017644.8A Pending CN110431394A (en) | 2017-03-17 | 2018-02-27 | Pressure sensor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6568129B2 (en) |
| CN (1) | CN110431394A (en) |
| WO (1) | WO2018168437A1 (en) |
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| CN201740623U (en) * | 2010-06-21 | 2011-02-09 | 东南大学 | Micromechanical air pressure sensor chip encapsulating structure |
| JP2014190755A (en) * | 2013-03-26 | 2014-10-06 | Asahi Kasei Medical Co Ltd | Pressure chamber |
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| WO2015194105A1 (en) * | 2014-06-17 | 2015-12-23 | 株式会社鷺宮製作所 | Sensor unit and pressure detection device containing same |
| CN105333989A (en) * | 2014-06-12 | 2016-02-17 | 国家核电技术有限公司 | Pressure guiding device for measuring micro differential pressure of liquid medium in pipeline |
| JP2016205877A (en) * | 2015-04-17 | 2016-12-08 | Smc株式会社 | Pressure detector |
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| US4928376A (en) * | 1989-07-31 | 1990-05-29 | Motorola Inc. | Method for filling a cavity, such as a sensor cavity, with an incompressible fluid |
| JP3427523B2 (en) * | 1994-11-30 | 2003-07-22 | 株式会社デンソー | Package structure |
| JP3476696B2 (en) * | 1999-01-19 | 2003-12-10 | 株式会社東海理化電機製作所 | Adhesive structure of adherend |
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2017
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2018
- 2018-02-27 CN CN201880017644.8A patent/CN110431394A/en active Pending
- 2018-02-27 WO PCT/JP2018/007168 patent/WO2018168437A1/en active Application Filing
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| CN201740623U (en) * | 2010-06-21 | 2011-02-09 | 东南大学 | Micromechanical air pressure sensor chip encapsulating structure |
| JP2014190755A (en) * | 2013-03-26 | 2014-10-06 | Asahi Kasei Medical Co Ltd | Pressure chamber |
| CN105333989A (en) * | 2014-06-12 | 2016-02-17 | 国家核电技术有限公司 | Pressure guiding device for measuring micro differential pressure of liquid medium in pipeline |
| WO2015194105A1 (en) * | 2014-06-17 | 2015-12-23 | 株式会社鷺宮製作所 | Sensor unit and pressure detection device containing same |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2018168437A1 (en) | 2018-09-20 |
| JP2018155623A (en) | 2018-10-04 |
| JP6568129B2 (en) | 2019-08-28 |
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