CN110429971A - A kind of miniaturization satellite communication mould group - Google Patents
A kind of miniaturization satellite communication mould group Download PDFInfo
- Publication number
- CN110429971A CN110429971A CN201910704150.3A CN201910704150A CN110429971A CN 110429971 A CN110429971 A CN 110429971A CN 201910704150 A CN201910704150 A CN 201910704150A CN 110429971 A CN110429971 A CN 110429971A
- Authority
- CN
- China
- Prior art keywords
- board
- barricade
- cover plate
- satellite communication
- baseband
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/14—Relay systems
- H04B7/15—Active relay systems
- H04B7/185—Space-based or airborne stations; Stations for satellite systems
- H04B7/1851—Systems using a satellite or space-based relay
- H04B7/18517—Transmission equipment in earth stations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0056—Casings specially adapted for microwave applications
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Astronomy & Astrophysics (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
- Transceivers (AREA)
Abstract
The invention discloses a kind of miniaturization satellite communication mould group, including shell, baseband board and rf board, the shell includes by the upper cover plate, barricade and lower cover plate set gradually from top to bottom, and the barricade separates baseband board and rf board;Connecting cable between the baseband board and rf board has three, is respectively intended to transmit the radiofrequency signal from baseband board to rf board, the radiofrequency signal from rf board to baseband board and the digital signal from rf board to baseband board;Filter, power amplifier, antennal interface and connector are distributed on the rf board.The present invention makes targeted design by own form and baseband board to satellite communication mould group, the specific connection of radio frequency and its set-up mode, it can satisfy the miniaturization satellite communication mould group in the case where communicating requirement, can also ensure that quality and stability under long-term use environment.
Description
Technical field
The invention belongs to communication equipment fields, more particularly, to a kind of miniaturization satellite communication mould group.
Background technique
Satellite communication is briefly exactly to utilize between radio communication station on the earth (including in ground and lower atmosphere layer)
The communication that satellite is then carried out as in.Satellite communication system is made of satellite and earth station two parts.The characteristics of satellite communication
Be: communication range is big;As long as in the range of the electric wave of satellite launch is covered, from can all be communicated between any two o'clock;
Not vulnerable to the influence of Land disaster (high reliablity);As long as setting earth station circuit can be opened and (it is rapid open circuit);Simultaneously
It can be received in many places, can economically realize broadcast, multiple access communication (multiple access feature);Circuit setting is very flexible, can disperse at any time
The telephone traffic excessively concentrated;Same channel can be used for different directions or different sections (multiple access).
Domestic satallite communication mode substantially imitates international satellite communication C frequency range and Ku frequency range, also useful Ka frequency range.It defends
The total developing direction of development trend of star communication is large capacity, high-power, high-speed, broadband, low cost, high emission frequency, more
Transponder, multidrop beam and shaped-beam handle signal etc., the satellite of 21 century is straight using on-board processing technology switching signal
Broadcasting TV (DBS-TV), personal mobile satellite communication, multimedia satellite communication, satellite audio broadcast, satellite network TV etc. will
Can largely it be developed.VSAT (domestic very small aperture terminal earth station) scope of business constantly expands, and is deep into national economy
Every field more shows its economic and social benefit, and the application of L-band minimizes satellite communication equipment more, but also
Bring the serious defect of decaying.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of miniaturization satellite communication mould group,
It meets Miniaturization Design in the case where meeting communicating requirement.
To achieve the above object, according to one aspect of the present invention, a kind of miniaturization satellite communication mould group is provided, it is special
Sign is, including shell, baseband board and rf board, wherein
The shell is integrally in rectangular shape comprising by set gradually from top to bottom upper cover plate, barricade and under
Cover board, the barricade separate baseband board and rf board, tighten up a screw and sequentially pass through the upper cover plate, baseband board and barricade
The upper cover plate, baseband board and barricade are linked together afterwards, and baseband board is located at the upper cover plate and barricade is enclosed
In space, lower cover plate, rf board and barricade are connected to by lower screw after sequentially passing through the lower cover plate, rf board and barricade
Together, and rf board is located in the lower cover plate and barricade enclosed space;
Connecting cable between the baseband board and rf board has three, is respectively intended to transmit from baseband board to rf board
Radiofrequency signal, the radiofrequency signal from rf board to baseband board and the digital signal from rf board to baseband board, wherein being used for transmission
What two cables of radiofrequency signal were all made of is IPXKK RF connecting line, the connection of the cable of a transmission digital signal in addition
Line uses FPC soft arranging wire;
It is provided on the barricade and walks line three-way hole across the barricade convenient for connecting cable;
Filter, power amplifier, antennal interface and connector are distributed on the rf board, antennal interface includes signal
Emission interface and signal receiving interface, connector include double-row needle and MIRCO-USB interface, and the side wall of the barricade is provided with
Two the first notches, so that signal emission interface and signal receiving interface expose to the shell, the side wall setting of the barricade
There is the second notch, the lower cover plate is provided with third notch in the position for corresponding to second notch, so that MIRCO-USB interface
The shell is exposed to, the bottom of the lower cover plate is provided with the 4th notch, so that the double-row needle exposes to the shell.
Preferably, the length of the baseband board is 50mm, and width 35mm, the length of the rf board is 50mm, wide
Degree is 35mm, and the height of the upper surface of the upper cover plate to the lower surface of lower cover plate namely the height of the shell are 12mm, this is outer
The entire length of shell is 52mm, overall width 37mm.
Preferably, the model MMCX-50KWE of the antennal interface.
Preferably, the baseband board be HDI plate and be ten laminates laminated construction, the top and bottom of the baseband board are equal
Component is distributed with.
Preferably, the upper and lower part of the barricade is provided with groove, for accommodating baseband board and rf board
Component.
Preferably, the upper surface of the upper cover plate is provided with label.
Preferably, bga chip is used on the baseband board.
Preferably, the capacitor on the baseband board, resistance and inductance component selection meet encapsulated under performance requirement it is the smallest
Device.
Preferably, the double-row needle uses the contact pin of 1.27mm diameter specifications, and ten root cutting needles of every mining.
Preferably, connector the model RECE.20279.001E, the FPC of the IPXKK RF connecting line both ends connection
The connector model FH26-35S-0.3SHW of soft arranging wire both ends connection.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, can obtain down and show
Beneficial effect: the present invention passes through own form and baseband board to satellite communication mould group, the specific connection of radio frequency and its set-up mode
Targeted design is made, upper cover plate, baseband board, barricade, rf board and lower cover plate can not only be facilitated when executing installation
Assembling, barricade setting can play good shielding action between baseband board and rf board;In addition, also setting on the shield plates
Cable hole has been set, baseband board can also be allowed to connect with rf board by cable to carry out signal;In addition, by outer housing, base
The structure snd size of band plate and rf board make further research and design, can satisfy small-sized in the case where communicating requirement
Change satellite communication mould group, different terminals can be expanded by the satellite communication mould group, and under long-term use environment
It can ensure quality and stability.
Detailed description of the invention
Fig. 1, Fig. 2 are 3 dimensional drawing of the present invention under different perspectives;
Fig. 3 a~Fig. 3 d is main view of the invention, bottom view, top view and left view respectively;
Fig. 4 is decomposition diagram of the invention;
Fig. 5 is main chip operation schematic diagram of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
Referring to each attached drawing, a kind of miniaturization satellite communication mould group, including shell 1, baseband board 2 and rf board 3, wherein institute
It is whole in rectangular shape to state shell 1 comprising by the upper cover plate 11, barricade 12 and lower cover plate set gradually from top to bottom
13, the height of lower surface of the upper surface of the upper cover plate 11 to lower cover plate 13 namely the height of the shell 1 are 12mm, the shell
1 entire length is 52mm, overall width 37mm, in addition, the upper surface of the upper cover plate 11 is provided with label 4, the screen
Shield plate 12 separates baseband board 2 and rf board 3, tightens up a screw after sequentially passing through the upper cover plate 11, baseband board 2 and barricade 12
The upper cover plate 11, baseband board 2 and barricade 12 are linked together, and baseband board 2 is located at the upper cover plate 11 and shielding
In 12 enclosed space of plate, lower screw is sequentially passed through lower cover plate 13, radio frequency after the lower cover plate 13, rf board 3 and barricade 12
Plate 3 and barricade 12 link together, and rf board 3 is located in 12 enclosed space of the lower cover plate 13 and barricade;
It is provided on the barricade 12 and walks line three-way hole across the barricade 12 convenient for connecting cable;The barricade 12
Upper and lower part be provided with groove, for accommodating the component on baseband board 2 and rf board 3;
Filter, power amplifier, antennal interface and connector 33, antennal interface are distributed on the rf board 3 includes
Signal emission interface 31 and signal receiving interface 32, connector 33 include double-row needle 34 and MIRCO-USB interface, the barricade
There are two the first notches for 12 side wall setting, so that signal emission interface 31 and signal receiving interface 32 expose to the shell 1, institute
The side wall for stating barricade 12 is provided with the second notch, and the lower cover plate 13 is provided with third in the position for corresponding to second notch
Notch, so that MIRCO-USB interface exposes to the shell 1, the bottom of the lower cover plate 13 is provided with the 4th notch, so that this pair
Row's needle 34 exposes to the shell 1.Antennal interface model MMCX-50KWE, double-row needle 34 use specification for the contact pin of 1.27mm,
Every socket needle is 10, and MIRCO-USB is located at the side of rf board 3,3 width of rf board × length size for 35mm ×
50mm。
Baseband board 2 of the invention is designed using ten layers of printed board of HDI, by the positive partition capacitance resistor of baseband board 2
Part moves to 2 bottom of baseband board, and chip selects highly integrated bga chip, and capacitance resistance and inductance component selection meet performance requirement
Under, inductance mostly uses 0201 encapsulation, and capacitor mostly uses 0402 encapsulation, and main chip is distributed in 2 top layer of baseband board, bottom component
Predominantly capacitor and inductance, baseband processing chip LC1860, the power supply control chip LC1160, memory chip of core chips use
H9TQ17ABJTMCUR and radio frequency control chip IRIS411 is Integration Design, and size is smaller, makes full use of printed board empty
Between, 2 dimension widths of baseband board × length size is 35mm × 50mm.
The size of rf board 3 is designed to that shapes and sizes are consistent with 2 size of baseband board, whole to reduce mould group
Size, the connector 33 that will be communicated with the outside, is placed on rf board 3;Connection electricity between the rf board 3 and baseband board 2
Cable has three, is respectively intended to transmit and believe from baseband board 2 to the radiofrequency signal of rf board 3, from rf board 3 to the radio frequency of baseband board 2
Number and from rf board 3 to the digital signal of baseband board 2, wherein two cables for being used for transmission radiofrequency signal be all made of be
IPXKK RF connecting line (mother is to female high frequency connecting line), cable length is determined according to the space between rf board 3 and baseband board 2
System, length 4cm, and the connector model RECE.20279.001E of the RF connecting line both ends IPXKK connection, in addition one
The connecting line for transmitting the cable of digital signal is powered and is communicated using the FPC soft arranging wire of 0.3mm spacing 35P, FPC soft arranging wire
Length is customized according to the space between rf board 3 and baseband board 2, length 28mm, and the connection of FPC soft arranging wire both ends
Connector 33 (model FH26-35S-0.3SHW) is placed on baseband board 2 and radio frequency by connector model FH26-35S-0.3SHW
The marginal position of plate 3, shortens the length of FPC, and radiofrequency signal is received and dispatched using IPEX;
Signal isolation is carried out using the barricade 12 of metal between rf board 3 and baseband board 2, rule are designed on sheet metal
Lattice are the threaded hole of M1.2, can whole closing lid when, baseband board 2 and rf board 3 is fixed;
The internal voids and baseband board 2 and rf board 3 of shell 1 are consistent, and shell 1 uses composite material, by baseband board 2
It is fixed on inside shell 1 with rf board 3 by the screw crimped and specification is M1.2.
A kind of miniaturization satellite communication mould group of the present invention can be used as component and be directly welded in printed board, and Fig. 5 is main
The workflow of chip, wherein baseband board is equipped with baseband module, and rf board is equipped with radio-frequency module, baseband module and radio frequency mould
Communication module is collectively formed in block, is communicated with external business function module (including sensor, GPS and battery).Radio frequency mould
Block has power amplifier (PA) and low-noise amplifier (LNA), and on radio frequency, power amplifier (PA) is used for the output of signal
Amplification, and the input of low-noise amplifier (LNA) antenna end is amplified.Baseband processing unit uses baseband processing chip
LC1860 is mainly responsible for the transformation of framing, coding, DA, the modulation of data information;By radio frequency control chip IRIS411 by signal
It is sent to rf board 3.Radio-frequency module on rf board 3 is mainly responsible for the frequency conversion (passing through frequency converter) of signal, filtering (passes through filtering
Device) and amplification (passing through power amplifier (PA)), satellite is sent the signal to finally by antennal interface.Low-noise amplifier
(LNA) signal for receiving antennal interface amplifies, then transmits a signal to radio frequency control chip IRIS411, radio frequency control
Coremaking piece IRIS411 after signal processing, will be sent to baseband processing chip LC1860 demodulated, AD conversion, decoding, frame structure
The data of processing are sent to business function module by interface.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of miniaturization satellite communication mould group, which is characterized in that including shell, baseband board and rf board, wherein
The shell is integrally in rectangular shape comprising by the upper cover plate, barricade and lower cover plate set gradually from top to bottom,
The barricade separates baseband board and rf board, and tightening up a screw will after sequentially passing through the upper cover plate, baseband board and barricade
The upper cover plate, baseband board and barricade link together, and baseband board is located at the upper cover plate and barricade enclosed space
Interior, lower screw sequentially passes through and lower cover plate, rf board and barricade is connected to one after the lower cover plate, rf board and barricade
It rises, and rf board is located in the lower cover plate and barricade enclosed space;
Connecting cable between the baseband board and rf board has three, is respectively intended to transmit the radio frequency from baseband board to rf board
Signal, the radiofrequency signal from rf board to baseband board and the digital signal from rf board to baseband board, wherein being used for transmission radio frequency
What two cables of signal were all made of is IPXKK RF connecting line, and the connecting line of the cable of a transmission digital signal in addition is adopted
With FPC soft arranging wire;
It is provided on the barricade and walks line three-way hole across the barricade convenient for connecting cable;
Filter, power amplifier, antennal interface and connector are distributed on the rf board, antennal interface includes signal transmitting
Interface and signal receiving interface, connector include double-row needle and MIRCO-USB interface, and there are two the side wall settings of the barricade
First notch, so that signal emission interface and signal receiving interface expose to the shell, the side wall of the barricade is provided with
Two notches, the lower cover plate is provided with third notch in the position for corresponding to second notch, so that MIRCO-USB interface is exposed
In the shell, the bottom of the lower cover plate is provided with the 4th notch, so that the double-row needle exposes to the shell.
2. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the length of the baseband board
For 50mm, width 35mm, the length of the rf board is 50mm, width 35mm, the upper surface of the upper cover plate to lower cover
The height of the lower surface of plate namely the height of the shell are 12mm, and the entire length of the shell is 52mm, overall width 37mm.
3. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the model of the antennal interface
For MMCX-50KWE.
4. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the baseband board is HDI plate
And it is the laminated construction of ten laminates, is distributed with component at the top and bottom of the baseband board.
5. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the top of the barricade and
Lower part is provided with groove, for accommodating the component on baseband board and rf board.
6. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the upper surface of the upper cover plate
It is provided with label.
7. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that used on the baseband board
Bga chip.
8. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the electricity on the baseband board
Hold, resistance and inductance component are selected to meet and encapsulates the smallest device under performance requirement.
9. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the double-row needle uses
The contact pin of 1.27mm diameter specifications, and ten root cutting needles of every mining.
10. a kind of miniaturization satellite communication mould group according to claim 1, which is characterized in that the IPXKK RF connection
The connector model RECE.20279.001E of line both ends connection, the connector model FH26- of FPC soft arranging wire both ends connection
35S-0.3SHW。
Priority Applications (1)
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CN201910704150.3A CN110429971A (en) | 2019-07-31 | 2019-07-31 | A kind of miniaturization satellite communication mould group |
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CN201910704150.3A CN110429971A (en) | 2019-07-31 | 2019-07-31 | A kind of miniaturization satellite communication mould group |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113676201A (en) * | 2021-08-24 | 2021-11-19 | 中信科移动通信技术股份有限公司 | Multimode signal microdistribution system |
CN113890590A (en) * | 2021-10-12 | 2022-01-04 | 北京微纳星空科技有限公司 | Satellite-borne data transmission transmitting device, system and intelligent terminal |
CN114204956A (en) * | 2021-12-08 | 2022-03-18 | 江苏屹信航天科技有限公司 | Miniaturized multifrequency section communication all-in-one |
CN114363940A (en) * | 2020-09-27 | 2022-04-15 | 广州慧睿思通科技股份有限公司 | Radio monitoring system |
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CN109216938A (en) * | 2018-10-17 | 2019-01-15 | 成都瑞迪威科技有限公司 | A kind of low section miniaturization phased array antenna |
CN208939930U (en) * | 2018-09-30 | 2019-06-04 | 成都控端科技有限公司 | Broadband receiver radio frequency front-end device |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN114363940A (en) * | 2020-09-27 | 2022-04-15 | 广州慧睿思通科技股份有限公司 | Radio monitoring system |
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CN113890590A (en) * | 2021-10-12 | 2022-01-04 | 北京微纳星空科技有限公司 | Satellite-borne data transmission transmitting device, system and intelligent terminal |
CN114204956A (en) * | 2021-12-08 | 2022-03-18 | 江苏屹信航天科技有限公司 | Miniaturized multifrequency section communication all-in-one |
CN114204956B (en) * | 2021-12-08 | 2023-06-16 | 江苏屹信航天科技有限公司 | Miniaturized multifrequency section communication all-in-one |
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