CN110428860A - A kind of memory array organization in RFID chip - Google Patents

A kind of memory array organization in RFID chip Download PDF

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Publication number
CN110428860A
CN110428860A CN201910863162.0A CN201910863162A CN110428860A CN 110428860 A CN110428860 A CN 110428860A CN 201910863162 A CN201910863162 A CN 201910863162A CN 110428860 A CN110428860 A CN 110428860A
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China
Prior art keywords
page
array
area
storage
storage array
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Pending
Application number
CN201910863162.0A
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Chinese (zh)
Inventor
韦强
张建伟
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Shanghai Mingsi Microelectronics Co Ltd
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Shanghai Mingsi Microelectronics Co Ltd
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Priority to CN201910863162.0A priority Critical patent/CN110428860A/en
Publication of CN110428860A publication Critical patent/CN110428860A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series

Abstract

In eeprom memory design, speed, power consumption and area are three most basic and most critical design objectives.In the application of RFID, due to the working characteristics of certain RFID, in order to promote service speed, the operation of the memory cell array is taken and is read by page and in the way of page write-in, using a page as basic operation unit, so that can be omitted BSG pipe in EE memory array, thus under conditions of not influencing any working performance, the area of EE memory array module is reduced.

Description

A kind of memory array organization in RFID chip
Technical field
The invention belongs to technical field of integrated circuits, specifically, belong to the design of eeprom memory and RFID chip Field.
Background technique
Now, EEPROM has become RFID tag and very widely used non-volatile of card class chip field is deposited Reservoir, it is used to store identification code or other data, and the capacity of EEPROM can be from 256bit to 2Mbit.It is stored in EEPROM In device design, speed, power consumption and area are three most basic and most critical design objectives.
One typical eeprom circuit includes: digital synchronous logic, row/column decoding circuit, reading circuit, high voltage electricity Pump, read/write switching circuit and clock generator and electric power management circuit, as shown in Figure 1.
In circuit framework shown in Fig. 1:
1) digital synchronous control logic circuit is the control module of EEPROM work, and its main function is reception system hair Instruction out issues more specific operational order to each functional module after resolution system instruction, coordinates to complete read/write behaviour Make;
2) reading circuit is read operation nucleus module, is mainly made of sense amplifier (sense amplifier-SA), According to EE_cell Array framework, if necessary to 8 data of parallel output simultaneously, need using by 8 sensitive amplifications arranged side by side The array (SA_Array) of device composition;
3) row/column decoder is used for address decoding, the selected storage unit for needing to operate.In order to reduce area and delay, The mode that decoder generallys use substep decoding builds circuit;
4) read/write switching circuit is mainly made of level shift circuit and voltage selection module.EE_cell is in read operation Lower operating voltage is needed, and then needs the operating voltage of 15.5V in erasing and programming operation, voltage selection module and electricity The function that translational shifting circuit is realized is exactly to complete power supply switching, according to the difference that reading and writing operate, is provided correctly for EE_cell Operating voltage;
5) basic principle of EE_cell data rewriting is FN tunnelling, needs work in the high voltage electric field for being greater than 15.5V Under.
One of the key problem of EEPROM design is the layout of EE memory array, and directly affect EEPROM is Architecture design of uniting and physical circuit design.Common EE memory array, the operation of memory cell array is taken read by page and In such a way that page is written and byte is read with byte write-in.By taking amount of capacity is the EEPROM of 1K bits as an example, by 1K Bits EE memory is divided into 32 pages, and each page of size is 4 bytes, and each byte is 8 bit, and the read-write of EEPROM is grasped Make to take a byte as operation basic unit.Using this kind of EE_cell layout type storage array (EE_cell Array) such as Shown in 2, by CG, several circuit compositions of SG, BSG, and these types of circuit is formed with the device of high-pressure process, area is very Greatly.Mass storage can be very easily extended to using this kind of framework memory cell array.
Summary of the invention
In the application of RFID, due to the working characteristics of certain RFID, in order to promote service speed, to the storage unit battle array The operation of column is taken by page reading and in the way of page write-in, using a page as basic operation unit, so that EE memory array In can be omitted BSG pipe, thus under conditions of not influencing any working performance, reduce the face of EE memory array module Product.As shown in Figure 3, wherein the wordline WL with storage units all in one page is shorted, not the storage unit of same page identical address Bit line BL is shorted.Wordline WL total 32, number respectively are as follows: WL0, WL1 ..., WL31;Bit line is 32 total, and number is respectively BL0、BL1、…、BL31。
Detailed description of the invention
Fig. 1 is eeprom circuit structural schematic diagram.
Fig. 2 is common EE_cell array junctions composition.
Fig. 3 is the special EE_cell array junctions composition of RFID.
Specific embodiment
Below according to Fig. 2 and Fig. 3, preferred embodiment is illustrated.
As shown in Fig. 2, ordinary construction EE_cell array is made of CG, SG, BSG.
As shown in figure 3, special construction EE_cell array is made of CG, SG in RFID.
We take the operation of the memory cell array and read by page and write by page by taking 1K bits storage array as an example The mode entered, it may be assumed that dividing 1K bits EE_cell is 32 pages, is operation basic unit with a page, and each page of size is 4 bytes, i.e., every 32 storage units form a page.Compared with the EE_cell array of ordinary construction, eliminate 128 by The BSG circuit of high-pressure process device composition, saves compared with many areas.EEPROM with the 1Kbit under SMIC 0.13um technique is Example, ordinary construction EE_cell array area are 1109.6496 square microns, and special construction EE_cell array area is 861.588 square microns, area reduce 248 square microns or so.EE_cell of the special construction EE_cell than ordinary construction Array array saves the area more than 20%, and service speed is improved while greatling save area.
It is discussed in detail although the contents of the present invention have passed through above preferred embodiment, is read in those skilled in the art After having read above content, a variety of modifications and substitutions of the invention all will be apparent.Above description and attached drawing is only It is only to implement example of the invention, but it should be appreciated that the description above is not considered as limitation of the present invention.

Claims (9)

1. a kind of EE storage array in RFID chip characterized by comprising service speed is fast, and area is small.
2. EE storage array as described in claim 1, which is characterized in that it is described in the application of RFID, due to certain The working characteristics of RFID takes the operation of the memory cell array and reads by page and be written by page to promote service speed Mode, using a page as basic operation unit so that can be omitted in EE memory array BSG pipe, do not influencing thus Under conditions of any working performance, the area of EE memory array module is reduced.
3. EE storage array as described in claim 1, which is characterized in that it is described wherein, with storage units all in one page Wordline WL be shorted, not the storage unit of same page identical address bit line BL be shorted.Wordline WL is 32 total, numbers respectively are as follows: WL0,WL1,…,WL31;Bit line total 32, respectively number be BL0, BL1 ..., BL31.
4. EE storage array as described in claim 1, which is characterized in that described as shown in Fig. 2, ordinary construction EE_cell Array is made of CG, SG, BSG.
5. EE storage array as described in claim 1, which is characterized in that described as shown in figure 3, special construction in RFID EE_cell array is made of CG, SG.
6. EE storage array as described in claim 1, which is characterized in that described we by taking 1K bits storage array as an example, The operation of the memory cell array is taken and is read by page and in the way of page write-in, it may be assumed that dividing 1K bits EE_cell is 32 A page is operation basic unit with a page, and each page of size is 4 bytes, i.e., every 32 storage units form a page.
7. EE storage array as described in claim 1, which is characterized in that the EE_cell array phase with ordinary construction Than eliminating 128 BSG circuits being made of high-pressure process device, saving compared with many areas.
8. EE storage array as described in claim 1, which is characterized in that the 1Kbit under the 0.13um technique with SMIC EEPROM for, ordinary construction EE_cell array area be 1109.6496 square microns, special construction EE_cell array surface Product is 861.588 square microns, and area reduces 248 square microns or so.
9. EE storage array as described in claim 1, which is characterized in that the special construction EE_cell compares ordinary construction EE_cellArray array save the area more than 20%, service speed is improved while greatling save area.
CN201910863162.0A 2019-09-12 2019-09-12 A kind of memory array organization in RFID chip Pending CN110428860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910863162.0A CN110428860A (en) 2019-09-12 2019-09-12 A kind of memory array organization in RFID chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910863162.0A CN110428860A (en) 2019-09-12 2019-09-12 A kind of memory array organization in RFID chip

Publications (1)

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CN110428860A true CN110428860A (en) 2019-11-08

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6977408B1 (en) * 2003-06-30 2005-12-20 Lattice Semiconductor Corp. High-performance non-volatile memory device and fabrication process
CN101454842A (en) * 2006-06-01 2009-06-10 密克罗奇普技术公司 A method for programming and erasing an array of nmos eeprom cells that minimize bit disturbances and voltage withstand requirements for the memory array and supporting circuits
CN102339644A (en) * 2011-07-27 2012-02-01 聚辰半导体(上海)有限公司 Memorizer and operating method thereof
CN102354530A (en) * 2011-08-25 2012-02-15 西安电子科技大学 EEPROM reading device used for passive UHF RFID chip

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6977408B1 (en) * 2003-06-30 2005-12-20 Lattice Semiconductor Corp. High-performance non-volatile memory device and fabrication process
CN101454842A (en) * 2006-06-01 2009-06-10 密克罗奇普技术公司 A method for programming and erasing an array of nmos eeprom cells that minimize bit disturbances and voltage withstand requirements for the memory array and supporting circuits
CN102339644A (en) * 2011-07-27 2012-02-01 聚辰半导体(上海)有限公司 Memorizer and operating method thereof
CN102354530A (en) * 2011-08-25 2012-02-15 西安电子科技大学 EEPROM reading device used for passive UHF RFID chip

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Application publication date: 20191108