CN110424675A - Graphene heat conducting floor and the thermally conductive raised flooring of graphene - Google Patents
Graphene heat conducting floor and the thermally conductive raised flooring of graphene Download PDFInfo
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- CN110424675A CN110424675A CN201910781409.4A CN201910781409A CN110424675A CN 110424675 A CN110424675 A CN 110424675A CN 201910781409 A CN201910781409 A CN 201910781409A CN 110424675 A CN110424675 A CN 110424675A
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- graphene
- graphene heat
- heat conducting
- floor
- panel
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 113
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 111
- 238000009408 flooring Methods 0.000 title claims abstract description 12
- 238000012546 transfer Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000002023 wood Substances 0.000 claims description 6
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000008397 galvanized steel Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 241000272165 Charadriidae Species 0.000 abstract description 3
- 241000264877 Hippospongia communis Species 0.000 description 12
- 206010037660 Pyrexia Diseases 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/024—Sectional false floors, e.g. computer floors
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/024—Sectional false floors, e.g. computer floors
- E04F15/02447—Supporting structures
- E04F15/02458—Framework supporting the panels
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/04—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D2200/00—Heat sources or energy sources
- F24D2200/08—Electric heater
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Central Heating Systems (AREA)
Abstract
The invention belongs to house ornamentation technical field of floor, and in particular to a kind of graphene heat conducting floor, including graphene heat-conductive assembly and panel；Heat transfer face is formed above the graphene heat-conductive assembly, the panel is fixed on the heat transfer face of graphene heat-conductive assembly；The graphene heat-conductive assembly heating power is suitable for conducting heat to panel.A kind of thermally conductive raised flooring of graphene, including multiple brackets and keel, each bracket is respectively fixedly disposed on ground, the single rectangular element being spliced to form by four keel, using above-mentioned graphene heat conducting floor, the graphene heat conducting floor is rectangular configuration, and the single graphene heat conducting floor is mounted on the single rectangular element.By the Stilt layer below floor, facilitate wiring and water pipe, avoids tradition and need the problem of slotting water distributor on bottom surface.
Description
Technical field
The invention belongs to house ornamentation technical field of floor, and in particular to a kind of graphene heat conducting floor and its thermally conductive frame of graphene
Vacant lot plate.
Background technique
With the fast development of graphene industry, people start to increase graphene on floor, so that floor has fever
Function can reduce former ground heater laying in this way and need pre-buried inconvenience；Currently on the market, in order to make floor have graphene hair
Heat function formerly has applicant to apply for patent, such as publication number: 108592152 A of CN, publication date: 2018.09.28, specially
Sharp title are as follows: graphene Electrical heating floor；In this patent, inventor only combines floor and graphene layer, only
It is a scheme in theory stage, is equivalent to and only increases this concept of graphene on floor, actually using
Cheng Zhong, it is to crush easily very much, and the case where graphene heater displacement, waterproofness occur that graphene heater, which lacks protection,
Also bad；As it can be seen that there are more problems for current graphene bottom plate, most important problem is exactly: graphene heater with ground
After plate connection, graphene heater not can be carried out the work of safety and stability；Easy corrupted graphite is trampled for a long time in floor
Alkene heater；Secondly, graphene fever body heat content cannot be uniformly transferred to floor surface.
Secondly, the mounting means of common solid wooden floor board, graphene have also only been continued to use in the installation on current graphene floor
Floor not can be carried out individual floor and replaced after the installation is complete if any damage, there is the inconvenience of maintenance dismounting.
Summary of the invention
The object of the present invention is to provide a kind of graphene heat conducting floor, solve that current graphene floor strength is low, stability
The problem of difference, while it being based on the graphene heat conducting floor, a kind of thermally conductive raised flooring of graphene is provided, to solve current graphene
Inconvenient problem is dismounted after the installation of floor.
In order to solve the above-mentioned technical problems, the present invention provides a kind of graphene heat conducting floors, including thermally conductive group of graphene
Part and panel；Heat transfer face is formed above the graphene heat-conductive assembly, the panel is fixed at thermally conductive group of graphene
On the heat transfer face of part；The graphene heat-conductive assembly heating power is suitable for conducting heat to panel.
Further, the graphene heat-conductive assembly includes upper cover and bottom plate, and the upper lid surface forms the heat and passes
Guide face；
It is fixedly connected between the upper cover surrounding and bottom plate surrounding, so as to installation cavity is formed between the upper cover and bottom plate, it is described
Graphene heat carrier is set in installation cavity.
Further, insulating layer is set in the installation cavity, the insulating layer be set to graphene heat carrier and bottom plate it
Between.
Further, honeycomb core is fixedly installed on the heat transfer face of the upper cover, the panel is fixed at honeycomb core
Top.
Further, the upper cover plate surrounding is separately connected the conductive edge strip for conducting static electricity, the conduction edge strip patch
Close the surrounding in bottom plate.
Further, the panel is HPL or PVC or solid wood or solid wood is compound or SPC.
Further, the honeycomb core upper end is Nian Jie with panel bottom surface, the heat transfer of the honeycomb core lower end and upper cover plate
Face bonding.
Further, the upper cover and bottom plate are galvanized steel plain sheet.
The invention has the advantages that
Graphene heat conducting floor provided by the invention, graphene heater is mounted between upper cover and bottom plate, good waterproof performance, simultaneously
And floor can be effectively prevent to trample the service life for influencing graphene heater for a long time；
It, first can be more efficient by thermally conductive group of graphene by the honeycomb core being arranged between graphene heat-conductive assembly and panel
Heat transfer in part is to panel, secondly, the pedal force that can also be subject to panel is evenly distributed to graphene heat-conductive assembly
Upper lid surface improves the thermal conductivity and stability on the floor.
Another aspect, the present invention also provides a kind of thermally conductive raised floorings of graphene, including multiple brackets and keel, respectively
A bracket is respectively fixedly disposed on ground, and each bracket is in rectangular lattice distribution on the ground, and each keel are respectively erected in
On two neighboring bracket, each keel are spliced to form rectangular array；
The single rectangular element being spliced to form by four keel, using above-mentioned graphene heat conducting floor, the graphene is thermally conductive
Floor is rectangular configuration, and the single graphene heat conducting floor is mounted on the single rectangular element.
Further, the bracket includes pedestal, column and loading plate, and the column is fixed on pedestal, institute
It states loading plate to be horizontally disposed with above column, the loading plate upper end is formed for shelving shelving for graphene heat conducting floor end angle
The two sides in area, the lay down area are respectively formed postive stop baffle.
The invention has the advantages that
Graphene heat conducting floor above-mentioned is directly rested on each bracket and keel by the thermally conductive raised flooring of graphene of the invention
On the single rectangular element formed, single graphene heat conducting floor is convenient for disassembly and assembly, convenient by the Stilt layer below floor
Wiring and water pipe avoid tradition and need the problem of slotting water distributor on bottom surface.
Other features and advantages of the present invention will illustrate in the following description, also, partly become from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention are in specification, claims
And specifically noted structure is achieved and obtained in attached drawing.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the explosive view of the thermally conductive honeycomb raised flooring of graphene of the present invention；
Fig. 2 is the perspective view of the thermally conductive honeycomb raised flooring of graphene of the present invention；
Fig. 3 is the schematic diagram of single three keel of support assorted；
Fig. 4 is the schematic diagram that graphene floor is shelved on bracket and keel；
In figure: 1, panel, 2, conductive edge strip, 3, graphene heat-conductive assembly, 31, upper cover, 32, bottom plate, 33, graphene heat carrier,
34, insulating layer, 4, honeycomb core, 5, keel, 6, bracket, 61, loading plate.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention
Technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Embodiment 1
As shown in Fig. 1 Fig. 2, a kind of graphene heat conducting floor, including graphene heat-conductive assembly 3 and panel 1；The graphene is led
Heat transfer face is formed above hot component 3, the panel 1 is fixed on the heat transfer face of graphene heat-conductive assembly 3；The stone
Black 3 heating power of alkene heat-conductive assembly is suitable for conducting heat to panel 1.
Specifically, graphene heat-conductive assembly 3 includes upper cover 31 and bottom plate 32,31 surface of upper cover forms the heat and passes
Guide face；It is fixedly connected between 31 surrounding of upper cover and 32 surrounding of bottom plate, so as to form peace between the upper cover 31 and bottom plate 32
It behave affectedly, graphene heat carrier 33 is set in the installation cavity.Upper cover 31 and bottom plate 32 are galvanized steel plain sheet, graphene heat carrier 33
It is arranged in installation cavity, upper cover 31 and bottom plate 32 can prevent the graphene heat carrier 33 inside external pedal force damage, stone
The conducting wire of black alkene heat carrier 33 is stretched out from the junction of upper cover 31 and bottom plate 32, suitable for alloing graphene heat carrier 33 to be powered work
Industry.Sealing blocking is used between conducting wire extension and upper cover 31 and bottom plate 32.
To prevent the heat of graphene heat carrier 33 to be lost from bottom, therefore, insulating layer 34, heat preservation are set in installation cavity
Layer 34 is set between graphene heat carrier 33 and bottom plate 32, which uses poly- plastic insulation board.
For graphene heat-conductive assembly 3 can be made to be transferred to panel 1, therefore, bee is fixedly installed on the heat transfer face of upper cover 31
Nest core 4, the panel 1 are fixed at 4 top of honeycomb core,
Specifically, 4 upper end of honeycomb core is Nian Jie with 1 bottom surface of panel, the heat transfer face of 4 lower end of honeycomb core and 31 plate of upper cover is viscous
It connects.
For the electrostatic generated on floor can be eliminated, therefore, leading for conducting static electricity is separately connected in 31 plate surrounding of upper cover
Electric edge strip 2, the conduction edge strip 2 are fitted in the surrounding of bottom plate 32.
In the present embodiment, panel 1 can select HPL or PVC or solid wood or solid wood is compound or SPC.
The graphene heat conducting floor of the present embodiment, graphene heater is mounted between upper cover 31 and bottom plate 32, waterproof
Property it is good and can effectively prevent floor for a long time trample influence graphene heater service life；By setting in graphene
Honeycomb core 4 between heat-conductive assembly 3 and panel 1, first can the more efficient heat transfer by graphene heat-conductive assembly 3 extremely
Panel 1 mentions secondly, the pedal force that panel 1 is subject to can also be evenly distributed to 31 surface of upper cover of graphene heat-conductive assembly 3
The thermal conductivity and stability on the floor are risen.
Graphene heat carrier 33 can quick heating, heat dissipation uniformly, one minute i.e. heat, after twenty minutes room temperature i.e. reach
Set numerical value.Graphene fever is different from transmission heating effect, does not dry comfortably；Service life is permanent, and it is small that continuous energization is greater than 200,000
When, securely and reliably, economic cost is low, and operating cost saves more than half than air-conditioning.
Embodiment 2
As shown in Fig. 3 Fig. 4, a kind of thermally conductive raised flooring of graphene, including multiple brackets 6 and keel 5, each bracket 6 are distinguished
On the ground, each bracket 6 is distributed in rectangular lattice on the ground, and each keel 5 are respectively erected in two neighboring for fixed setting
On bracket 6, each keel 5 are spliced to form rectangular array.
The single rectangular element being spliced to form by four keel 5, using above-mentioned graphene heat conducting floor, the graphene
Heat conducting floor is rectangular configuration, and the single graphene heat conducting floor is mounted on the single rectangular element.
Specifically, bracket 6 includes pedestal, column and loading plate 61, the column is fixed on pedestal, described to hold
Support plate 61 is horizontally disposed with above column, and 61 upper end of loading plate is formed for shelving shelving for graphene heat conducting floor end angle
The two sides in area, the lay down area are respectively formed postive stop baffle.Four postive stop baffles, two neighboring limit are set on each loading plate 61
The lay down area is formed between the baffle of position, graphene heat conducting floor is shelved on above, when needing to unpick and wash, is mentioned directly up
It takes.
In the present embodiment, graphene heat conducting floor directly rests on the bracket 6 and four keel 5 of single rectangular element
On, when single graphene heat conducting floor damages, directly the graphene heat conducting floor of damage can be dismounted
Maintenance.
The thermally conductive raised flooring of the graphene, the Stilt layer that bottom reserves can be avoided with wiring and water distributor when house ornamentation
Ground fluting, meets the demand of the following Decoration Industry.
The each device (component of undeclared specific structure) selected in the application is universal standard part or this field skill
The component that art personnel know, structure and principle are all that this technology personnel can learn by technical manual or pass through routine experiment
Method is known.
In the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " connects " connected "
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected；It can be machine
Tool connection, is also possible to be electrically connected；It can be directly connected, two members can also be can be indirectly connected through an intermediary
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in the present invention with concrete condition
Concrete meaning.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (10)
1. a kind of graphene heat conducting floor, characterized in that including graphene heat-conductive assembly and panel；Thermally conductive group of the graphene
Heat transfer face is formed above part, the panel is fixed on the heat transfer face of graphene heat-conductive assembly；The graphene is led
Hot component heating power is suitable for conducting heat to panel.
2. graphene heat conducting floor according to claim 1, characterized in that the graphene heat-conductive assembly include upper cover and
Bottom plate, the upper lid surface form the heat transfer face；
It is fixedly connected between the upper cover surrounding and bottom plate surrounding, so as to installation cavity is formed between the upper cover and bottom plate, it is described
Graphene heat carrier is set in installation cavity.
3. graphene heat conducting floor according to claim 2, characterized in that insulating layer is set in the installation cavity, it is described
Insulating layer is set between graphene heat carrier and bottom plate.
4. graphene heat conducting floor according to claim 2, characterized in that be fixedly installed on the heat transfer face of the upper cover
Honeycomb core, the panel are fixed above honeycomb core.
5. graphene heat conducting floor according to claim 2, characterized in that the upper cover plate surrounding is separately connected for passing
The conductive edge strip of static conductive, the conduction edge strip are fitted in the surrounding of bottom plate.
6. graphene heat conducting floor according to claim 2, characterized in that the panel is HPL or PVC or solid wood or reality
The compound or SPC of wood.
7. graphene heat conducting floor according to claim 2, characterized in that the honeycomb core upper end and panel bottom surface are viscous
It connects, the honeycomb core lower end is Nian Jie with the heat transfer face of upper cover plate.
8. graphene heat conducting floor according to claim 2, characterized in that the upper cover and bottom plate are galvanized steel plain sheet.
9. a kind of thermally conductive raised flooring of graphene, characterized in that including multiple brackets and keel, fixation is set each bracket respectively
It sets on the ground, each bracket is in rectangular lattice distribution on the ground, and each keel are respectively erected on two neighboring bracket, respectively
A keel are spliced to form rectangular array；
The single rectangular element being spliced to form by four keel is led using graphene described in any one of claim 1-8
Heating floor, the graphene heat conducting floor are rectangular configuration, and the single graphene heat conducting floor is mounted on the single rectangle
On unit.
10. the thermally conductive raised flooring of graphene according to claim 2, characterized in that the bracket include pedestal, column with
And loading plate, the column are fixed on pedestal, the loading plate is horizontally disposed with above column, loading plate upper end shape
At the lay down area for shelving graphene heat conducting floor end angle, the two sides of the lay down area are respectively formed postive stop baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910781409.4A CN110424675A (en) | 2019-08-23 | 2019-08-23 | Graphene heat conducting floor and the thermally conductive raised flooring of graphene |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910781409.4A CN110424675A (en) | 2019-08-23 | 2019-08-23 | Graphene heat conducting floor and the thermally conductive raised flooring of graphene |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110424675A true CN110424675A (en) | 2019-11-08 |
Family
ID=68417252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910781409.4A Withdrawn CN110424675A (en) | 2019-08-23 | 2019-08-23 | Graphene heat conducting floor and the thermally conductive raised flooring of graphene |
Country Status (1)
| Country | Link |
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| CN (1) | CN110424675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486499A (en) * | 2020-03-09 | 2020-08-04 | 江苏宅创新材料有限公司 | Wireless heating device for toilet |
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|---|---|---|---|---|
| JP2006046047A (en) * | 2004-08-06 | 2006-02-16 | Shintoshin Nikkei Kk | Honeycomb core floor member for floor heating |
| CN204212357U (en) * | 2014-11-17 | 2015-03-18 | 马秋平 | A kind of environmental protection composite floor for heating |
| CN104420615A (en) * | 2013-08-27 | 2015-03-18 | 江苏肯帝亚木业有限公司 | Novel formaldehyde-free heating strengthened floor |
| CN105332495A (en) * | 2015-11-18 | 2016-02-17 | 嘉善鸿源蜂窝制品有限公司 | Novel honeycomb electric heating floor |
| CN205372721U (en) * | 2016-01-29 | 2016-07-06 | 王勇 | Heat energy conversion efficient floor that generates heat |
| CN207962825U (en) * | 2018-03-01 | 2018-10-12 | 保定市融博新能源科技有限公司 | A kind of secondary heated structure of Electrical heating floor |
| CN208718296U (en) * | 2018-08-03 | 2019-04-09 | 江苏尚珩达科技有限公司 | A kind of graphene conductive PVC floor |
| CN210659099U (en) * | 2019-08-23 | 2020-06-02 | 常州朗逊防静电地板有限公司 | Graphene heat conduction floor and graphene heat conduction overhead floor |
| CN216109524U (en) * | 2021-08-03 | 2022-03-22 | 美述家智能家居有限公司 | Graphene floor heating floor |
-
2019
- 2019-08-23 CN CN201910781409.4A patent/CN110424675A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006046047A (en) * | 2004-08-06 | 2006-02-16 | Shintoshin Nikkei Kk | Honeycomb core floor member for floor heating |
| CN104420615A (en) * | 2013-08-27 | 2015-03-18 | 江苏肯帝亚木业有限公司 | Novel formaldehyde-free heating strengthened floor |
| CN204212357U (en) * | 2014-11-17 | 2015-03-18 | 马秋平 | A kind of environmental protection composite floor for heating |
| CN105332495A (en) * | 2015-11-18 | 2016-02-17 | 嘉善鸿源蜂窝制品有限公司 | Novel honeycomb electric heating floor |
| CN205372721U (en) * | 2016-01-29 | 2016-07-06 | 王勇 | Heat energy conversion efficient floor that generates heat |
| CN207962825U (en) * | 2018-03-01 | 2018-10-12 | 保定市融博新能源科技有限公司 | A kind of secondary heated structure of Electrical heating floor |
| CN208718296U (en) * | 2018-08-03 | 2019-04-09 | 江苏尚珩达科技有限公司 | A kind of graphene conductive PVC floor |
| CN210659099U (en) * | 2019-08-23 | 2020-06-02 | 常州朗逊防静电地板有限公司 | Graphene heat conduction floor and graphene heat conduction overhead floor |
| CN216109524U (en) * | 2021-08-03 | 2022-03-22 | 美述家智能家居有限公司 | Graphene floor heating floor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486499A (en) * | 2020-03-09 | 2020-08-04 | 江苏宅创新材料有限公司 | Wireless heating device for toilet |
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Application publication date: 20191108 |
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| WW01 | Invention patent application withdrawn after publication |