CN110423001A - A kind of electronic glass and its application - Google Patents
A kind of electronic glass and its application Download PDFInfo
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- CN110423001A CN110423001A CN201910690509.6A CN201910690509A CN110423001A CN 110423001 A CN110423001 A CN 110423001A CN 201910690509 A CN201910690509 A CN 201910690509A CN 110423001 A CN110423001 A CN 110423001A
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- electronic glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Abstract
The invention belongs in glass technology field more particularly to a kind of electronic glass, comprising: SiO267%~74%, Al2O31%~3%, CaO 7%~9%, MgO 3%~6%, Na2O 13%~15%, SO30%-0.3%, K2O 0.5%~3%.The present invention passes through each component of extra fine quality percentage composition, make the electronic glass provided that super-thin electronic glass can not only be made, and the planarization and uniformity having had, thickness difference is small, micro-waviness is small, while the physical opticses performance such as the hardness of electronic glass, modulus of shearing meets application demand.
Description
Technical field
The invention belongs to glass technology field more particularly to a kind of electronic glass and its applications.
Background technique
With the development of current electronic information technology, super-thin electronic glass is widely used in electronic information industry, market pair
Super-thin electronic glass demand increases increasingly, and higher and higher to the quality requirements of the glass.Traditional common soda-lime-silica glass is matched
Fang Jiben can not produce high-grade super-thin electronic glass.
Currently, being still the hot and difficult issue in glass technology field, existing electricity to the research of high-quality super-thin electronic glass
Sub- glass can not often meet the poor small, performances such as micro-waviness is small of ultra-thin, thickness simultaneously, it is also necessary to further research.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic glasses, it is intended to which solving existing electronic glass can not often expire simultaneously
The technical issues of ultra-thin, thickness of foot poor small, performances such as micro-waviness is small.
Another object of the present invention is to provide a kind of applications of electronic glass.
In order to achieve the above-mentioned object of the invention, The technical solution adopted by the invention is as follows:
A kind of electronic glass is the group including following mass percentage in terms of 100% by the gross mass of the electronic glass
Point:
Preferably, in the electronic glass further include:
TiO20.01%~0.03%,
Fe2O30.07%~0.11%.
Preferably, it is the component including following mass percentage in terms of 100% by the gross mass of the electronic glass:
SiO269%~72%, Al2O31.4%~2.5%, CaO 7.2%~8.8%, MgO 3.8%~5.8%, Na2O 13%
~14%, SO30%~0.21%, TiO20.01% and Fe2O30.01%.
Preferably, the electronic glass with a thickness of 0.33~1.1mm.
Preferably, the electronic glass with a thickness of 0.33~0.7mm.
Preferably, the thickness of the electronic glass is very poor is less than or equal to 0.04mm.
Preferably, the micro-waviness of the electronic glass is less than or equal to 0.19 μm/20mm.
Preferably, the transmissivity of the electronic glass is greater than 91%;And/or
The modulus of shearing of the electronic glass is not less than 26.6GPa;Vickers hardness is not less than 5.61GPa.
Preferably, the electronic glass with a thickness of 0.33~1.1mm;Thickness is very poor to be less than or equal to 0.04mm;Microscopic waves
Line degree is less than or equal to 0.19 μm/20mm;Transmissivity is greater than 91%;Modulus of shearing is not less than 26.6GPa;Vickers hardness is not less than
5.61GPa。
Above-mentioned electronic glass is applied to integrated circuit, electric function component or electricity by a kind of application of electronic glass
Sub- touch screen field.
Electronic glass provided by the invention, comprising: SiO267%~74%, Al2O31%~3%, CaO 7%~9%,
MgO 3%~6%, Na2O 13%~15%, SO30%-0.3%, K2O 0.5%~3%, wherein SiO2For electronic glass
Main component, Al2O3, CaO, MgO be electronic glass steady oxide, Na2O、K2O、SO3For the cosolvent of electronic glass.
The present invention passes through each component of extra fine quality percentage composition, makes electronic glass provided by the invention that super-thin electronic glass can not only be made
Glass, and the planarization and uniformity having had, thickness difference is small, micro-waviness is small, while the hardness of electronic glass, shearing mould
The physical opticses performances such as amount meet application demand.
Electronic glass provided by the invention is not only able to achieve ultra-slim features, and has the very poor small, microscopic waves of thickness simultaneously
Line degree is small, transmissivity is big and the physical opticses performance such as the modulus of shearing of suitable processed and applied and Vickers hardness, can be applied to collect
At fields such as circuit, electric function component or electronic touch screens.
Specific embodiment
To keep the purpose, technical solution and technical effect of the embodiment of the present invention clearer, in the embodiment of the present invention
Technical solution is clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than complete
The embodiment in portion.In conjunction with the embodiment in the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more this feature.In the description of the present invention, " more
It is a " it is meant that two or more, unless otherwise specifically defined.
The weight of Related Component noted in the disclosure of the embodiment of the present invention not only may refer to the specific of each component
Content can also indicate the proportionate relationship of weight between each component, therefore, as long as according to specification relevant group of the embodiment of the present invention
The content divided is scaled up or is reduced within specification of embodiment of the present invention scope of disclosure.Specifically, the present invention is real
Applying example weight described in the specification can be mass unit well known to the chemical fields such as μ g, mg, g, kg.
The embodiment of the invention provides a kind of electronic glass, it is in terms of 100% by the gross mass of the electronic glass, including with
The component of lower mass percentage:
Electronic glass provided in an embodiment of the present invention, comprising: SiO267%~74%, Al2O31%~3%, CaO 7%
~9%, MgO 3%~6%, Na2O 13%~15%, SO30%-0.3%, K2O 0.5%~3%, wherein SiO2For electricity
The main component of sub- glass, Al2O3, CaO, MgO be electronic glass steady oxide, Na2O、K2O、SO3For helping for electronic glass
Solvent.The embodiment of the present invention passes through each component of extra fine quality percentage composition, make electronic glass provided by the invention not only can
At super-thin electronic glass, and the planarization and uniformity having had, thickness difference is small, micro-waviness is small, while electronic glass
The performances such as hardness, modulus of shearing meet application demand.
Specifically, in electronic glass, mass percentage be 67%~74% SiO2For the main component of electronic glass,
Make electronic glass that there are a series of Optimalities such as transparency, mechanical strength, chemical stability and thermal stability.If SiO2Content is too
It is low, influence the performances such as the transparency, mechanical strength, chemical stability of electronic glass;If SiO2Content is too high, then makes electronic glass
Composition fusing point is too high, and solution viscosity is big, causes to melt difficulty, heat consumption is big.
Specifically, in electronic glass, mass percentage be 1%~3% Al2O3, can be effectively reduced electronic glass
Tendency towards devitrification improves chemical stability and mechanical strength, improves thermal stability.Al2O3The number of content will directly affect electronics glass
Thin technique is drawn in glass molding, and too high levels glass viscosity is big, the fusing of electronic glass composition and clarification is occurred difficult, is increased instead
Tendency towards devitrification is unfavorable for the thickness difference control of super-thin electronic glass, drawing Bao Qiangdu of the too low glass metal of content in hot situation
Not enough, electronic glass performance is equally influenced.
Specifically, in electronic glass, electronic glass combination can be effectively reduced in the CaO that mass percentage is 7%~9%
The high-temperature viscosity of object promotes the fusing and clarification of glass metal, is more advantageous to the super-thin electronic glass that high-quality is made.If CaO contains
It measures excessively high, then will increase the tendency towards devitrification of electronic glass composition, reduce the thermal stability of glass, improve annealing temperature;If CaO
Content is too low, unobvious to the viscosity adjustment effect of electronic glass composition.
Specifically, in electronic glass, the MgO that mass percentage is 3%~6%, being used cooperatively with calcium oxide can be into one
Step reduces the viscosity of electronic glass composition, promotes the fusing and clarification of glass metal.It is more advantageous to the ultra-thin electricity that high-quality is made
Sub- glass.If content of MgO is excessively high, or diopside crystallization occurs, annealing temperature is improved, reduces glass to the stability of water.
Specifically, in electronic glass, mass percentage be 13%~15% Na2O, mass percentage is 0.5%
~3% K2The SO that O and mass percentage are 0%~0.3%3, it is the good cosolvent of electronic glass composition, it can
The viscosity of glass metal is effectively reduced, promotes the fusing and clarification of glass metal, and substantially reduces the tendency towards devitrification of glass.Wherein, matter
Measure the K that percentage composition is 0.5%~3%2O can be also used for change glass in forming area and shakeout polishing performance, makes glass
Liquid is more advantageous to electronic glass and draws thin molding needs, is conducive to improve glass surface micro-waviness.
As a preferred embodiment, in the electronic glass further include: TiO20.01%~0.03%, Fe2O30.07%~
0.11%.Electronic glass of the embodiment of the present invention rationally controls wherein TiO2And Fe2O3Content, if Fe in electronic glass2O3Contain
It measures excessively high, then can reduce transparency, ultraviolet-transmitting performance, diathermancy and the mechanical strength of glass, cause electric word glass combination
Object melts clarification suffering, and brings adverse effect to the melted product of glass.TiO2It can be improved the refraction of glass and absorb ultraviolet
Line ability enhances the coloration of iron oxide in glass composition, influences the property such as transparency of glass if too high levels
Energy.Therefore electronic glass of the embodiment of the present invention is by TiO2And Fe2O3Content control in reasonable range, make electronic glass not
But the characteristics that have that ultra-thin, planarization is good etc., and there is excellent transparency, refracting power, ultraviolet-transmitting performance, diathermanous simultaneously
Performance and mechanical strength etc..
Embodiment more preferably is including following mass percentage in terms of 100% by the gross mass of the electronic glass
Component: SiO269%~72%, Al2O31.4%~2.5%, CaO 7.2%~8.8%, MgO 3.8%~5.8%,
Na2O 13%~14%, SO30%~0.21%, TiO20.01% and Fe2O30.01%.Electronic glass of the embodiment of the present invention
The mass percentage of each composition obtains that ultra-thin, thickness is poor small in feedstock composition, and micro-waviness is small, and mechanical strength etc.
The electronic glass of good physical performance.
As a preferred embodiment, the electronic glass with a thickness of 0.33~1.1mm.Electronic glass of the embodiment of the present invention
With a thickness of the super-thin electronic glass of 0.33~1.1mm, the screen basement membrane of the electronic products such as mobile phone, computer can be applied to, using neck
Domain is extensive, and practical value is high.
Embodiment more preferably, the electronic glass with a thickness of 0.33~0.7mm.Electronic glass of the embodiment of the present invention
Thinner thickness can be achieved, application value is higher.
As a preferred embodiment, the thickness of the electronic glass is very poor is less than or equal to 0.04mm.The embodiment of the present invention provides
Electronic glass thickness it is very poor be not more than 0.04mm, thickness is very poor very small, illustrates electronics glass provided in an embodiment of the present invention
Glass surface is very smooth, and planarization is good, and the thickness uniformity is good.
As a preferred embodiment, the micro-waviness of the electronic glass is less than or equal to 0.19 μm/20mm.The present invention is implemented
The micro-waviness for the electronic glass that example provides is not more than 0.19 μm/20mm, illustrates electronic glass provided in an embodiment of the present invention
Surface wave is small, and planarization is good, and application value is high.
In some embodiments, the thickness of the electronic glass is very poor is less than or equal to 0.04mm;The electronic glass it is micro-
It sees percent ripple and is less than or equal to 0.19 μm/20mm.
As a preferred embodiment, the transmissivity of the electronic glass is greater than 91%.Electronics glass provided in an embodiment of the present invention
Glass transmissivity is greater than 91%, and translucency is good, and application scenarios are extensive.
As a preferred embodiment, the modulus of shearing of the electronic glass is not less than 26.6GPa;Vickers hardness is not less than
5.61GPa.Electronic glass provided in an embodiment of the present invention not only has a ultra-thin characteristic, and have preferable cutting performance and
The mechanical performances such as Vickers hardness, conducive to the application processing of electronic glass.
In some embodiments, the transmissivity of the electronic glass is greater than 91%;The modulus of shearing of the electronic glass is not
Lower than 26.6GPa;Vickers hardness is not less than 5.61GPa.
Embodiment more preferably, the electronic glass with a thickness of 0.33~1.1mm;Thickness is very poor to be less than or equal to
0.04mm;Micro-waviness is less than or equal to 0.19 μm/20mm;Transmissivity is greater than 91%;Modulus of shearing is not less than 26.6GPa;Dimension
Family name's hardness is not less than 5.61GPa.Electronic glass provided in an embodiment of the present invention is not only able to achieve ultra-slim features, and has simultaneously
Have thickness it is very poor it is small, micro-waviness is small, transmissivity is big and the modulus of shearing of suitable processed and applied and Vickers hardness etc. are excellent
Performance is suitble to industrial applications.
The preparation of electronic glass provided in an embodiment of the present invention can pass through: obtain the SiO of formula ratio2、Al2O3、CaO、
MgO、Na2O、SO3、TiO2And Fe2O3Equal raw material components, investment electronic glass kiln is molten after investment mixing machine carries out mixed processing
System;Then glass metal is drawn into the super-thin electronic glass of 0.33-1.1mm by equipment such as molten tin bath and edge machines.
Correspondingly, the embodiment of the invention also provides a kind of applications of electronic glass, and above-mentioned electronic glass is applied to
Integrated circuit, electric function component or electronic touch screen field.
Electronic glass provided in an embodiment of the present invention is not only able to achieve ultra-slim features, and have simultaneously thickness it is very poor it is small,
Micro-waviness is small, transmissivity is big and the physical opticses performance such as the modulus of shearing of suitable processed and applied and Vickers hardness, can answer
For fields such as integrated circuit, electric function component or electronic touch screens.
To make, the above-mentioned implementation detail of the present invention and operation can be clearly readily appreciated by one skilled in the art and the present invention is real
The progress performance for applying an electronic glass significantly embodies, and illustrates above-mentioned technical proposal below by way of multiple embodiments.
Embodiment 1
The embodiment of the present invention provide five kinds of electronic glasses 1.~5., by the gross mass of electronic glass be 100% in terms of, wrap respectively
Include the component of following table 1 mass percentage:
Table 1
Further, in order to verify the progressive of electronic glass of the embodiment of the present invention, the present invention is by electronics glass in embodiment 1
Glass 1.~5. raw material components be respectively prepared respectively by same process conditions with a thickness of 0.33mm, 0.55mm, 0.7mm and 1.1mm
Electronic glass, poor to the thickness of glass respectively, micro-waviness, transmissivity, density, softening point, strain point, modulus of shearing and
The parameters such as Vickers hardness are tested, described in test result is as follows table 2~6:
2 electronic glass of table is 1.
1.1mm electronic glass sample is taken to carry out physical optics performance, test result are as follows: density 2.475g/cm2;Strain point:
860℃;Softening point: 570 DEG C;Poisson's ratio: 0.22;Shearing factor modulus: 26.6GPa;Vickers hardness: 5.61GPa;Transmitance:
> 91%.
3 electronic glass of table is 2.
1.1mm electronic glass sample is taken to carry out physical optics performance, test result are as follows: density 2.470g/cm2;Strain point:
859℃;Softening point: 568 DEG C;Poisson's ratio: 0.22;Shearing factor: 26.6GPa;Vickers hardness: 5.61GPa;Transmitance: >
91%.
4 electronic glass of table is 3.
1.1mm electronic glass sample is taken to carry out physical optics performance, test result are as follows: density 2.472g/cm2;Strain point:
863℃;Softening point: 569 DEG C;Poisson's ratio: 0.22;Shearing factor: 26.5GPa;Vickers hardness: 5.62GPa;Transmitance: >
91%.
5 electronic glass of table is 4.
1.1mm electronic glass sample is taken to carry out physical optics performance, test result are as follows: density 2.48g/cm2;Strain point:
865℃;Softening point: 573 DEG C;Poisson's ratio: 0.22;Shearing factor: 26.7GPa;Vickers hardness: 5.65GPa;Transmitance: >
91%.
6 electronic glass of table is 5.
1.1mm electronic glass sample is taken to carry out physical optics performance, test result are as follows: density 2.477g/cm2;Strain point:
858℃;Softening point: 571 DEG C;Poisson's ratio: 0.22;Shearing factor: 26.5GPa;Vickers hardness: 5.62GPa;Transmitance: >
91%.
By above-mentioned test result it is found that electronic glass provided in an embodiment of the present invention 1.~5., be not only able to achieve ultrathin special
Property, and have that thickness is very poor small simultaneously, thickness is very poor≤0.04mm, micro-waviness is small, micro-waviness≤0.19 μm/
20mm, transmissivity is big, the strain point of the characteristics such as transmitance > 91% and suitable processed and applied, softening point, Poisson's ratio, shearing
The physical opticses performance such as modulus, Vickers hardness can be applied to the neck such as integrated circuit, electric function component or electronic touch screen
Domain.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of electronic glass, which is characterized in that by the gross mass of the electronic glass be including following quality hundred in terms of 100%
Divide the component of content:
2. electronic glass as described in claim 1, which is characterized in that in the electronic glass further include:
TiO20.01%~0.03%,
Fe2O30.07%~0.11%.
3. electronic glass as claimed in claim 2, which is characterized in that by the gross mass of the electronic glass be 100% in terms of, packet
Include the component of following mass percentage: SiO269%~72%, Al2O31.4%~2.5%, CaO 7.2%~8.8%,
MgO 3.8%~5.8%, Na2O 13%~14%, SO30%~0.21%, TiO20.01% and Fe2O30.01%.
4. the electronic glass as described in claims 1 to 3 is any, which is characterized in that the electronic glass with a thickness of 0.33~
1.1mm。
5. the electronic glass as described in claim 4 is any, which is characterized in that the electronic glass with a thickness of 0.33~
0.7mm。
6. claims 1 to 3,5 it is any as described in electronic glass, which is characterized in that the thickness of the electronic glass is very poor small
In equal to 0.04mm.
7. claims 1 to 3,5 it is any as described in electronic glass, which is characterized in that the micro-waviness of the electronic glass
Less than or equal to 0.19 μm/20mm.
8. claims 1 to 3,5 it is any as described in electronic glass, which is characterized in that the transmissivity of the electronic glass is greater than
91%;And/or
The modulus of shearing of the electronic glass is not less than 26.6GPa;Vickers hardness is not less than 5.61GPa.
9. claims 1 to 3,5 it is any as described in electronic glass, which is characterized in that the electronic glass with a thickness of 0.33
~1.1mm;Thickness is very poor to be less than or equal to 0.04mm;Micro-waviness is less than or equal to 0.19 μm/20mm;Transmissivity is greater than 91%;
Modulus of shearing is not less than 26.6GPa;Vickers hardness is not less than 5.61GPa.
10. a kind of application of electronic glass, which is characterized in that the electronic glass as described in claim 1~9 is any to be applied to
Integrated circuit, electric function component or electronic touch screen field.
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CN201910690509.6A CN110423001A (en) | 2019-07-29 | 2019-07-29 | A kind of electronic glass and its application |
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CN201910690509.6A CN110423001A (en) | 2019-07-29 | 2019-07-29 | A kind of electronic glass and its application |
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ID=68413021
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